CN104978556B - Fingerprint identification device and electronic device comprising it - Google Patents

Fingerprint identification device and electronic device comprising it Download PDF

Info

Publication number
CN104978556B
CN104978556B CN201410138486.5A CN201410138486A CN104978556B CN 104978556 B CN104978556 B CN 104978556B CN 201410138486 A CN201410138486 A CN 201410138486A CN 104978556 B CN104978556 B CN 104978556B
Authority
CN
China
Prior art keywords
channel
substrate
fingerprint identification
hypothallus
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201410138486.5A
Other languages
Chinese (zh)
Other versions
CN104978556A (en
Inventor
张晟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ofilm Microelectronics Technology Co ltd
Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
OFilm Group Co Ltd
Jiangxi OMS Microelectronics Co Ltd
Original Assignee
Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
Nanchang OFilm Biometric Identification Technology Co Ltd
Shenzhen OFilm Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanchang OFilm Tech Co Ltd, Suzhou OFilm Tech Co Ltd, Nanchang OFilm Biometric Identification Technology Co Ltd, Shenzhen OFilm Tech Co Ltd filed Critical Nanchang OFilm Tech Co Ltd
Priority to CN201410138486.5A priority Critical patent/CN104978556B/en
Publication of CN104978556A publication Critical patent/CN104978556A/en
Application granted granted Critical
Publication of CN104978556B publication Critical patent/CN104978556B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Image Input (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

The present invention provides a kind of fingerprint identification device and include its electronic device.The fingerprint identification device includes fingerprint input module and fingerprint identification module;Wherein, the fingerprint identification module includes: dielectric layer, and the dielectric layer includes latticed groove, and conductive material is filled in the latticed groove;And, a plurality of driving channel and a plurality of sense channel, the a plurality of driving channel and a plurality of sense channel are respectively accommodated in the latticed groove and are set in the Different Plane of the dielectric layer, the driving channel is extended along one-dimensional square, the sense channel is extended along the two-dimensional directional intersected with the one-dimensional square, and the driving channel is separated by the dielectric layer with the sense channel and intersects to form multiple recognition units.

Description

Fingerprint identification device and electronic device comprising it
Technical field
The present invention relates to fingerprint identification technology more particularly to a kind of fingerprint identification device and include its electronic device.
Background technique
In recent years, with the development of memory technology, electronic equipment such as mobile phone, computer etc. is stored with the weight such as a large amount of personal information Data is wanted, safety becomes even more important.The password to its electronic equipment is mostly realized using forms such as password, figures at present Protection, i.e. user are set by pre-entering the password of number, letter and combinations thereof, or by inputting specific figure to electronics It is standby, to set personal identification number protection;When using electronic equipment, input these passwords or figure again, electronic equipment by with The legitimacy of user identity is identified in the comparison of preset password or figure, thereby protects the privacy of user.
However, user need to remember the password of setting for cipher modes such as password, figures, in addition, in public, also There are the danger of password leakage;And be to improve safety, the complexity for increasing password and figure is generally required, this is undoubtedly further Increase user memory difficulty, cause it is safe with it is easy-to-use between conflict.
The rough lines of finger surface skin is made of ridge line figure, fingerprint recognition be using fingerprint uniqueness and The characteristics of stability, realizes identification, and fingerprint is remembered without user, and easy to carry.Current fingerprint recognition mode master There are characteristics of image identification, laser feature identification and sliding capacitance sensing.Characteristics of image identification and laser feature identification are sharp respectively Signature analysis is carried out with visible light and laser approach by the information extraction of fingerprint ridge line and using algorithm, identifies Different Individual;Two kinds Method is required to the space structure that such as CCD probe, laser generator are more complex, is unsuitable for lightening application.Conventional slip Capacitance sensor is common in laptop, incudes Surface scan finger print information by finger slide sensor.Fingerprint recognition speed It is better than the above two with space simplification degree, but is equally unsuitable for that market is huge, requires highly integrated, flexible, light-transmissive not Carry out consumer electronics field.
And the structure of the capacitive fingerprint sensing device in currently available technology is silicon substrate structure, driving electrodes and sensing Electrode is ITO structure, i.e., is directly coated on substrate conductive material and forms conductive pattern, so that conductive material usage amount Greatly, it and is prone to wear;In addition, conductive material used in the prior art is tin indium oxide, the indium in tin indium oxide is rare gold Belong to and expensive.
Summary of the invention
In view of this, a kind of the present invention provides structures simple, fingerprint recognition fingerprint identification device with high accuracy.
Additional aspect and advantage of the invention will be set forth in part in the description, and partly will be from description It is apparent from, or can practice through the invention and acquistion.
One aspect of the present invention provides a kind of fingerprint identification device, including fingerprint input module and fingerprint identification module, It is characterized in that, the fingerprint identification module includes: dielectric layer, and the dielectric layer includes latticed groove, described latticed Conductive material is filled in groove;And a plurality of driving channel and a plurality of sense channel, a plurality of driving channel and described more Sense channel is respectively accommodated in the latticed groove, and is set in the Different Plane of the dielectric layer, the drive Dynamic channel is extended along one-dimensional square, and the sense channel extends along the two-dimensional directional intersected with the one-dimensional square Setting, the driving channel is separated by the dielectric layer with the sense channel and intersects to form multiple recognition units;Its In, the width of every driving channel and every sense channel is no more than 100 μm.
In one embodiment, between adjacent driven channel and the distance between neighboring sensing channels are no more than 100 μm.
In another embodiment, the dielectric layer is single substrate;The driving channel and the sense channel point On the different surfaces of the substrate.
In further embodiment, the dielectric layer be stepped construction, including be sequentially stacked the first hypothallus, substrate With the second hypothallus;The driving channel and the sense channel are divided into first hypothallus far from the substrate side The surface of surface and second hypothallus far from the substrate side.
In further embodiment, the dielectric layer be stepped construction, including be sequentially stacked hypothallus, substrate;Institute Stating driving channel and the sense channel, to be divided into surface and the substrate of the hypothallus far from the substrate side close The surface of the hypothallus side.
In further embodiment, the dielectric layer be stepped construction, including be sequentially stacked the first hypothallus, second Hypothallus and substrate;The driving channel and the sense channel are divided into first hypothallus far from the second hypothallus side The surface of surface and second hypothallus far from the substrate side.
In further embodiment, the dielectric layer be stepped construction, including be sequentially stacked the first substrate, bonding coat With the second substrate;The driving channel and the sense channel are divided into first substrate far from second substrate side Surface and the surface of second substrate far from first substrate side.
In further embodiment, the dielectric layer be stepped construction, including be sequentially stacked the first hypothallus, first Substrate, bonding coat, the second substrate and the second hypothallus;The driving channel and the sense channel are divided into first matrix Surface and the second hypothallus surface far from second substrate side of the layer far from the first substrate side.
In further embodiment, the fingerprint identification module further includes a plurality of leads, driving channel described in each and Sense channel described in each is electrically connected the lead.
In further embodiment, a plurality of leads is latticed groove structure, or leads for the latticed of protrusion Electric wire or conductive line segment.
In further embodiment, the mesh shape of the latticed groove is regular grid or random grid.
Another aspect of the present invention provides a kind of electronic equipment, including any of the above-described kind of fingerprint identification device.
Fingerprint identification device provided in an embodiment of the present invention uses the metal mesh structure of groove-like, and conductive material is filled In groove, that is, the anti-scratch ability of anti-scratch of fingerprint identification device can be improved by saving conductive material again;And the conduction material filled Material is mainly metallic silver etc., cheap, reduce manufacturing cost.In addition, the fingerprint identification device is in fingerprint identification module Latticed groove is opened up on dielectric layer, and channel and sense channel is driven to be respectively accommodated in the net for being located at different sides on dielectric layer In trellis groove, drive the maximum width of channel and sense channel no more than 100 μm, and between adjacent driven channel or phase The distance between adjacent sense channel is not more than 100 μm, ensure that when finger is placed in fingerprint input module, while can have and to the greatest extent may be used Recognition unit more than energy improves the accuracy and precision of fingerprint recognition to sense the crestal line of fingerprint;In addition, finger print information is not necessarily to User memory, it is easy to carry, solve electronic equipments safety and it is easy-to-use between contradiction.
Detailed description of the invention
Its example embodiment is described in detail by referring to accompanying drawing, above and other feature of the invention and advantage will become It is more obvious.
Fig. 1 is the cross-sectional view of fingerprint identification device provided in an embodiment of the present invention;
Fig. 2A and Fig. 2 B is respectively the floor map and cross section signal of the fingerprint identification module in the embodiment of the present invention Figure;
Fig. 3 A and Fig. 3 B are respectively the floor map in the driving channel and sense channel in the embodiment of the present invention;
Fig. 4 is another floor map of the fingerprint identification module in the embodiment of the present invention;
Fig. 5 is the top view of fingerprint identification device shown in FIG. 1;
Fig. 6 is the cross-sectional view of the fingerprint identification module in the embodiment of the present invention one;
Fig. 7 A and Fig. 7 B are the cross-sectional view of the fingerprint identification module of the different embodiments in the embodiment of the present invention two;
Fig. 8 is the cross-sectional view of the fingerprint identification module in the embodiment of the present invention three;
Fig. 9 A and Fig. 9 B are the cross-sectional view of the fingerprint identification module of the different embodiments in the embodiment of the present invention four;
Figure 10 is the cross-sectional view of the fingerprint identification module in the embodiment of the present invention five;
Figure 11 is the cross-sectional view of the fingerprint identification module in the embodiment of the present invention six;
Figure 12 A to Figure 12 D is the mesh shape signal of the latticed groove of the fingerprint identification module in the embodiment of the present invention Figure.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes Formula is implemented, and is not understood as limited to embodiment set forth herein;On the contrary, thesing embodiments are provided so that the present invention will Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.In the figure in order to clear It is clear, exaggerate the thickness of region and layer.Identical appended drawing reference indicates same or similar structure in figure, thus will omission pair Their repeated description.
Described feature, structure or characteristic can be incorporated in one or more embodiments in any suitable manner In.In the following description, many details are provided to provide and fully understand to embodiments of the present invention.However, One of ordinary skill in the art would recognize that without one or more in the specific detail, or using other methods, group Member, material etc. can also practice technical solution of the present invention.In other cases, it is not shown in detail or describes known features, material Material operates to avoid the fuzzy present invention.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ", " right side " and similar statement are for illustrative purposes only.Term " and or " used herein includes one or more phases Any and all combinations of the listed item of pass.
Fig. 1 is the cross-sectional view of fingerprint identification device provided in an embodiment of the present invention.As shown in Figure 1, the present invention is real It applies the fingerprint identification device 10 in example, including fingerprint input module 11 and fingerprint identification module 13, fingerprint input module 11 and refers to Line identification module 13 is bonded by bonding coat 12.
Fingerprint input module 11 is the panel inputted for fingerprint.The material of fingerprint input module 11 can be transparent or non- The non-conducting materials such as transparent plastics or glass.Specifically fingerprint input module 11 is PMMA in the present embodiment, with a thickness of 1.0~ 1.5mm.The shape of fingerprint input module 11, which can according to need, to be set, and can be square, other shapes such as rectangle, circle The shape of shape, the input panel 11 that Fig. 5 is provided is square.
Bonding coat 12 is transparent optical cement, such as OCA optical cement or transparent UV glue.OCA light is used in specific the present embodiment Glue, 25 μm of thickness, to reduce the thickness of single unit system.
Please also refer to Fig. 2A, Fig. 2 B to Fig. 4.Fig. 2A and Fig. 2 B is respectively the fingerprint identification module in the embodiment of the present invention Floor map and cross-sectional view.Fig. 3 A and Fig. 3 B are respectively driving channel and sense channel in the embodiment of the present invention Floor map.Fig. 4 is another floor map of the fingerprint identification module in the embodiment of the present invention.As shown in Figure 2 B, refer to Line identification module 13 includes dielectric layer 100 and driving channel 14 and sense channel 15.Dielectric layer 100 includes latticed groove 131.Driving channel 14 and sense channel 15 are contained in latticed groove 131.Conduction material is filled in latticed groove 131 Material, such as silver, copper, gold, aluminium metal or a combination thereof.
To cooperate exterior I C circuit, driving channel 14 and sense channel 15 are designed as different conductive patterns, such as Fig. 2A Shown in strip or diamond shape as shown in Figure 4, or other figures, invention is not limited thereto.
For finger when contacting with fingerprint identification device, actual range different manifestations are the capacitor generated at convex ridge and at trench Value is different, and its magnitude is in pico farad (pF) rank, thus there is also differences for the current signal of its transmission, by these faint electric currents Signal difference handles chip by IC and amplifies, and is judged at the convex ridge of fingerprint and at trench with this.As shown in Figure 2 A, driving is logical Road 14 is extended along one-dimensional square, and sense channel 15 is extended along the second direction intersected with one-dimensional square, the One-dimensional square is X-direction, and two-dimensional directional is Y direction.In Fig. 4, one-dimensional square is Y-axis, and two-dimensional directional is X-axis, And one-dimensional square and two-dimensional directional are vertical.Driving channel 14 and sense channel 15 are separated by dielectric layer 100, and vertical Intersect to form multiple recognition units 180 (circle in figure is only to enclose the position for showing recognition unit, does not have other meanings).Respectively Recognition unit 180 detects the current signal in this recognition unit, and these current signals are sent to IC processing chip, according to electricity The difference for flowing signal, detects the position of convex ridge and trench, to sketch the contours of the lines train of thought of finger, then by with prestore The identification, it can be achieved that user identity is compared in the fingerprint of storage.
Since width is substantially between 150-300 μm at people's fingerprint convex ridge width and trench, in the present invention, driving is logical Road and the maximum width of sense channel are not more than 100 μm, i.e., as sensing in width L1 and Fig. 3 B for driving channel in Fig. 3 A is logical The width L2 in road is no more than 100 μm, it is ensured that can sense when the quantity of crestal line or trench in single recognition unit not Greater than 1, to guarantee that same detection coordinate can only correspond to the position of a crestal line or a trench;And adjacent driven channel The distance between the distance between S1 and neighboring sensing channels S2 no more than 100 μm.Referring to Fig. 2A and Fig. 2 B, when When hand 18 is placed on fingerprint input module 13, the distance between adjacent driven channel and neighboring sensing channels are respectively less than 100 μm, i.e., The distance between each adjacent recognition unit 180 guarantees can have 2-5 recognition unit to induce not simultaneously in this way less than 100 μm Reflect the mould of convex ridge or trench position to determine the position of ridge line perhaps trench compared to original individual unit with capacitance signal Formula can accurately sense the input signal of fingerprint, improve the accuracy and sensitivity of fingerprint identification device.
For conductive pattern as shown in Figure 4, it is preferred that the maximum width of the driving channel 14 and sense channel 15 is little In 100 μm, driving the maximum width of channel 14 and sense channel 15 is the cornerwise length L3 of diamond shape, adjacent driven interchannel or Maximum distance between person's neighboring sensing channels is the distance between argyle design interconnecting piece S3 no more than 100 μm.
Fig. 5 is the top view of fingerprint identification device shown in FIG. 1.As shown in figure 5, fingerprint identification device 10 further includes lead Group 16, lead wire set 16 are connected to external IC processing chip (not shown), and fingerprint identification device 10 receives fingerprint input signal, and Fingerprint input signal is sent to exterior I C by lead wire set 16 and handles chip.
Driving channel 14 perhaps sense channel 15 be connected by respective lead with lead wire set 16 each driving channel 14 or Each sense channel 15 driving lead corresponding with one perhaps sense lead electrical connection adjacent driven channel 14 or adjacent sensing It insulate between channel 15.Shown between adjacent driven channel 14 or neighboring sensing channels 15 as shown in Fig. 2A perhaps Fig. 4 with blank It insulate out.In other embodiments, it can also be filled with driving channel 14 or the identical grid of sense channel 15, i.e. the grid Perhaps the grid lines disconnection of sense channel 15 or the grid lines of the grid are the net being disconnected from each other for grid lines and driving channel 14 Ruling.
Fingerprint identification device 10 provided by the invention can be arranged at the structure or shell of electronic equipment or other equipment In, it is such as set in the key of mobile phone or tablet computer, for locking or unlocking electronic equipment.At this point, fingerprint identification device 10 Positioned at the invisible area of equipment, then its dielectric layer 100 can be nontransparent insulating materials.In addition, fingerprint identification device 10 can also be configured at the visible area of electronic equipment etc., i.e., be used cooperatively with the display unit of electronic equipment, be used for electronic equipment Authentication in system operation, such as bank account safety verification, then its dielectric layer 100 is transparent insulating materials.
In some embodiments, fingerprint identification module has different structures, is described in detail below.
Embodiment one
Fig. 6 is the cross-sectional view of the fingerprint identification module in the embodiment of the present invention one.As shown in fig. 6, fingerprint recognition Module 13 includes dielectric layer 100 and driving channel 14 and sense channel 15.In the present embodiment, dielectric layer 100 is single One substrate.Substrate 100 includes first surface and the second surface that is oppositely arranged with first surface, in first surface and second surface Latticed groove 131 is offered respectively.Driving channel 14 and sense channel 15 are contained in latticed groove 131.To guarantee to refer to The precision of line identification, in the present embodiment, it is preferred that the maximum width of driving channel 14 and sense channel 15 is 50 μm;It is adjacent Driving the maximum distance between channel 14 or between neighboring sensing channels 15 is 10 μm.
As shown in fig. 6, filling conductive material in latticed groove 131, designed through conductive pattern, in dielectric layer 100 First surface and second surface on be respectively formed driving channel 14 and sense channel 15, to cooperate exterior I C circuit.Such as Fig. 3 A Shown, driving channel 14 is designed to horizontally disposed strip;As shown in Figure 3B, sense channel 15 is designed to vertically disposed Strip is separated with driving channel 14 by dielectric layer 100 and vertical.
Above-mentioned fingerprint identification module 13 further includes lead electrode 17.As shown in fig. 6, the edge-of dielectric layer 100 is invisible Latticed groove 132 is offered in region, lead electrode 17 is contained in latticed groove 132.Lead electrode 17 respectively with finger The driving channel 14 of line identification module 13 and sense channel 15 are electrically connected, and are connected with lead wire set 16.Meanwhile lead electrode 17 can By silk-screen printing or inkjet printing, to form the latticed conductor wire of protrusion or conductive line segment on 100 surface of dielectric layer.It is convex The minimum widith for playing latticed conductor wire or conductive line segment can be 10 μm~200 μm, highly can be 5 μm~10 μm.
The width of latticed groove 131 and latticed groove 132 is 0.2 μm~5 μm, and depth is 2 μm~6 μm, and depth It is greater than 1 with the ratio of width.The mesh shape of latticed groove 131 is regularly or irregularly grid, such as Figure 12 A to figure Shown in 12D, the mesh shape of latticed groove 131 can be regular hexagon, square, diamond shape, rectangle, parallelogram, song Any one in side quadrangle or random grid.It is corresponding, drive the mesh shape of channel 14 and sense channel 15 that can be Regular hexagon, square, diamond shape, rectangle, parallelogram, curvilinear boundary quadrilateral or random grid shape.
In addition, in the present embodiment, the thickness of dielectric layer is less than 200 μm in order to reduce the integral thickness of device.
Embodiment two
Fig. 7 A and Fig. 7 B are the cross-sectional view of the fingerprint identification module of the different embodiments in the embodiment of the present invention two. In the present embodiment, fingerprint identification module 23 includes dielectric layer 200 and driving channel 24 and sense channel 25.Dielectric layer 200 be stepped construction, and dielectric layer 200 includes the first hypothallus 211, substrate 210 and the second hypothallus being sequentially stacked 221, surface and second hypothallus 221 surface far from substrate 210 side of first hypothallus 211 far from 210 side of substrate Latticed groove 231 is offered, drives channel 24 and sense channel 25 to be contained in latticed groove 231, through conductive pattern Design, in surface of first hypothallus 211 far from 210 side of substrate and the second table of the hypothallus 221 far from 210 side of substrate Face is respectively formed driving channel 24 and sense channel 25, and driving the pattern of channel 24 and sense channel 25 can be strip, such as schemes Shown in 2A, or diamond shape, as shown in Figure 4, or other patterns;For the precision for guaranteeing fingerprint recognition, channel is driven 24 and the maximum width of sense channel 25 be not more than 100 μm, between adjacent driven channel 24 or between neighboring sensing channels 25 Maximum distance be not more than 100 μm, in the present embodiment, it is preferred that driving channel 24 and the maximum width of sense channel 25 are 60 μm, the maximum distance between adjacent driven channel 24 or between neighboring sensing channels 25 is 20 μm.
Above-mentioned fingerprint identification module 23 further includes lead electrode 27.As shown in Figure 7 A, the first hypothallus 211 and the second matrix Latticed groove 232 is offered in edge-invisible area of layer 221, lead electrode 27 is contained in latticed groove 232. Lead electrode 27 is electrically connected with driving channel 24 and sense channel 25 respectively, and is connected with lead wire set 16 as shown in Figure 5.Such as figure Shown in 7B, lead electrode 27 can also be by silk-screen printing or inkjet printing, in the first hypothallus 211 or the second hypothallus 221 The latticed conductor wire of protrusion or conductive line segment are formed on surface.The minimum widith of the latticed conductor wire of protrusion or conductive line segment can be with It is 10 μm~200 μm, highly can is 5 μm~10 μm.
The other structures of fingerprint identification device described in the present embodiment are similar with structure described in embodiment one, herein It repeats no more.
Embodiment three
Fig. 8 is the cross-sectional view of the fingerprint identification module in the embodiment of the present invention three.In the present embodiment, fingerprint is known Other module 33 includes dielectric layer 300 and identification layer.Dielectric layer 300 is stepped construction, including 310 He of substrate being sequentially stacked Hypothallus 311.Identification layer includes driving channel 34 and sense channel 35, a side surface of the hypothallus 311 far from substrate 310 and Substrate 310 offers latticed groove 331 respectively on the surface of 311 side of hypothallus, and identification layer is contained in latticed recessed In slot 331, designed through conductive pattern, surface of the hypothallus 311 far from 310 side of substrate and in substrate 310 close to matrix Driving channel 34 and sense channel 35 are respectively formed on the surface of 311 side of layer.Drive the pattern in channel 34 and sense channel 35 It can be strip as shown in Figure 2 A, or diamond shape as shown in Figure 4, or other patterns.To guarantee that fingerprint is known Other precision drives the maximum width of channel 34 and sense channel 35 to be not more than 100 μm, between adjacent driven channel 34 or phase Maximum distance between adjacent sense channel 35 is not more than 100 μm.In the present embodiment, it is preferred that driving channel 34 and sensing are logical The maximum width in road 35 is 70 μm, and the maximum distance between adjacent driven channel 34 or between adjacent driven channel 35 is 30 μ m。
Above-mentioned fingerprint identification module 33 further includes lead electrode 37.As shown in figure 8, the side of hypothallus 311 and substrate 310 Latticed groove 332 is offered in edge-invisible area, lead electrode 37 is contained in latticed groove 332.Lead electrode 37 It is electrically connected with driving channel 34 and sense channel 35, and is connected with lead wire set 16 as shown in Figure 5 respectively.In addition, lead electrode 37 can also be by silk-screen printing or inkjet printing, to form the latticed conduction of protrusion on 310 surface of hypothallus 311 or substrate Line or conductive line segment (not shown).The minimum widith of the latticed conductor wire of protrusion or conductive line segment can be 10 μm~200 μ M highly can be 5 μm~10 μm.
The other structures of fingerprint identification device described in the present embodiment are similar with structure described in embodiment one, herein It repeats no more.
Example IV
Fig. 9 A and Fig. 9 B are the cross-sectional view of the fingerprint identification module of the different embodiments in the embodiment of the present invention four. In the present embodiment, fingerprint identification module 43 includes dielectric layer 400 and identification layer.Dielectric layer 400 is stepped construction, including Substrate 410, the second hypothallus 421 and the first hypothallus 411 being sequentially stacked, identification layer include driving channel 44 and sense channel 45, on a side surface and the second surface of the hypothallus 421 far from 410 side of substrate of first hypothallus 411 far from substrate 410 Latticed groove 431 is offered respectively, and identification layer is contained in latticed groove 431.It is designed through conductive pattern, in the first matrix It is respectively formed on 411 surface far from 410 side of substrate of layer and on the second surface of the hypothallus 421 far from 410 side of substrate Channel 44 and sense channel 45 are driven, driving the pattern of channel 44 and sense channel 45 can be strip as shown in Figure 2 A, It can be diamond shape as shown in Figure 4, or other patterns.For the precision for guaranteeing fingerprint recognition, channel 44 and sensing are driven The maximum width in channel 45 is not more than 100 μm, between adjacent driven channel 44 or between neighboring sensing channels 45 it is maximum away from From being not more than 100 μm, in the present embodiment, it is preferred that the maximum width of driving channel 44 and sense channel 45 is 80 μm, adjacent Driving the maximum distance between channel 44 or between adjacent driven channel 45 is 40 μm.
Above-mentioned fingerprint identification module 43 further includes lead electrode 47.As shown in Figure 9 A, the first hypothallus 411 and the second matrix Latticed groove 432 is offered in 421 edge-invisible area far from substrate 410 of layer, lead electrode 47 is contained in latticed In groove 432.Lead electrode 47 respectively with driving channel 44 and sense channel 45 be electrically connected, and with lead wire set as shown in Figure 5 16 are connected.In addition, as shown in Figure 9 B, lead electrode 47 can be by silk-screen printing or inkjet printing, in 411 He of the first hypothallus Second hypothallus 421 is far from being respectively formed the latticed conductor wire of protrusion or conductive line segment 47 on 410 surface of substrate.Protrusion is latticed The minimum widith of conductor wire or conductive line segment can be 10 μm~200 μm, highly can be 5 μm~10 μm.
Embodiment five
Figure 10 is the cross-sectional view of the fingerprint identification module in the embodiment of the present invention five.In the present embodiment, fingerprint Identification module 53 includes dielectric layer 500 and identification layer.Dielectric layer 500 is stepped construction, including the first base being sequentially stacked Bottom 510, bonding coat (oblique line portion is had in figure) and the second substrate 520.Identification layer includes driving channel 54 and sense channel 55. First substrate 510 opens up respectively on a side surface and the second surface of the substrate 520 far from bonding coat side far from bonding coat There is latticed groove 531, identification layer is contained in latticed groove 531.It is designed through conductive pattern, it is separate in the first substrate 510 Driving channel 54 and sensing are respectively formed on the surface of bonding coat side and on surface of second substrate far from bonding coat side Channel 55.The pattern for driving channel 54 and sense channel 55 can be strip as shown in Figure 2 A, or as shown in Figure 4 Diamond shape, or other patterns.For the precision for guaranteeing fingerprint recognition, the maximum width of channel 54 and sense channel 55 is driven not Greater than 100 μm, the maximum distance between adjacent driven channel 54 or between neighboring sensing channels 55 is not more than 100 μm, at this In embodiment, it is preferred that the maximum width of driving channel 54 and sense channel 55 is 40 μm, between adjacent driven channel 54 or Maximum distance between adjacent driven channel 55 is 10 μm.
Above-mentioned fingerprint identification module 53 further includes lead electrode 57.As shown in Figure 10, the first substrate 510 and the second substrate Latticed groove 532 is offered respectively in 520 edge-invisible areas far from bonding coat, and lead electrode 57 is contained in grid In shape groove 532, as shown in Figure 10.Lead electrode 57 respectively with driving channel 54 and sense channel 55 be electrically connected, and with such as Fig. 5 Shown in lead wire set 16 be connected.In addition, lead electrode 57 can also be by silk-screen printing or inkjet printing, in the first substrate 510 and second substrate 520 far from forming the latticed conductor wire of protrusion or conductive line segment (not shown) on the surface of bonding coat. The minimum widith of the latticed conductor wire of protrusion or conductive line segment can be 10 μm~200 μm, highly can be 5 μm~10 μm.
The other structures of fingerprint identification device described in the present embodiment are similar with structure described in embodiment one, herein It repeats no more.
Embodiment six
Figure 11 is the cross-sectional view of the fingerprint identification module in the embodiment of the present invention six.In the present embodiment, fingerprint Identification module 63 includes dielectric layer 600 and identification layer.Dielectric layer 600 is stepped construction, including the first base being sequentially stacked Matter layer 611, the first substrate 610, bonding coat (oblique line portion is had in figure), the second substrate 620 and the second hypothallus 621.Identification Layer includes driving channel 64 and sense channel 65, a side surface and second base of first hypothallus 611 far from the first substrate 610 Matter layer 621 offers latticed groove 631 respectively on the surface far from 620 side of the second substrate, identification layer is contained in latticed It in groove 631, is designed through conductive pattern, on the first surface of the hypothallus 611 far from 610 side of the first substrate and the second base Matter layer 621 is respectively formed driving channel 64 and sense channel 65 on the surface far from 620 side of the second substrate;Drive 64 He of channel The pattern of sense channel 65 can be strip as shown in Figure 2 A, or diamond shape as shown in Figure 4, or other figures Case.For the precision for guaranteeing fingerprint recognition, the maximum width of channel 64 and sense channel 65 is driven to be not more than 100 μm, adjacent driven Maximum distance between channel 64 or between neighboring sensing channels 65 is not more than 100 μm.In the present embodiment, it is preferred that drive The maximum width of dynamic channel 64 and sense channel 65 is 45 μm, between adjacent driven channel 64 or between adjacent driven channel 65 Maximum distance be 15 μm.
Above-mentioned fingerprint identification module 63 further includes lead electrode 67.As shown in figure 11, lead electrode 67 can pass through screen printing Brush or inkjet printing, in the first hypothallus 611 and the second hypothallus 621 far from the first substrate 610 and far from the second substrate 620 Surface on form the latticed conductor wire of protrusion or conductive line segment 67.The minimum widith of the latticed conductor wire of protrusion or conductive line segment It can be 10 μm~200 μm, highly can be 5 μm~10 μm.In addition it is also possible in the first hypothallus 611 far from the first substrate 610 edge and the second hypothallus 621 open up latticed recessed respectively in edge-invisible area far from the second substrate 620 Slot, lead electrode 67 are contained in (not shown) in latticed groove.Lead electrode 67 respectively with driving channel 64 and sensing Channel 65 is electrically connected, and is connected with lead wire set 16 as shown in Figure 5.
The other structures of fingerprint identification device described in the present embodiment are similar with structure described in embodiment one, herein It repeats no more.
Fingerprint identification device provided in an embodiment of the present invention uses the metal mesh structure of groove-like, and conductive material is filled In groove, that is, the anti-scratch ability of anti-scratch of fingerprint identification device can be improved by saving conductive material again;And the conduction filled Material is mainly metallic silver etc., cheap, reduce manufacturing cost.In addition, the fingerprint identification device is in fingerprint identification module Dielectric layer on open up latticed groove, drive channel and sense channel to be respectively accommodated on dielectric layer positioned at different sides In latticed groove, drive the maximum width of channel and sense channel no more than 100 μm, and between adjacent driven channel or The distance between neighboring sensing channels are not more than 100 μm, ensure that when finger is placed in fingerprint input module, while can have to the greatest extent May more than recognition unit to sense the crestal line of fingerprint, improve the accuracy and precision of fingerprint recognition;In addition, finger print information without Need user to remember, it is easy to carry, solve electronic equipments safety and it is easy-to-use between contradiction.
It is particularly shown and described exemplary embodiments of the present invention above.It should be understood that the present invention is not limited to institute Disclosed embodiment, on the contrary, it is intended to cover comprising various modifications within the scope of the appended claims and equivalent set It changes.

Claims (12)

1. a kind of fingerprint identification device, including fingerprint input module and fingerprint identification module, which is characterized in that the fingerprint recognition Module includes:
Dielectric layer, the dielectric layer include latticed groove, and conductive material is filled in the latticed groove;And
A plurality of driving channel and a plurality of sense channel, a plurality of driving channel and a plurality of sense channel are respectively accommodated in institute It states in latticed groove, and is set in the Different Plane of the dielectric layer, the driving channel extends along one-dimensional square Setting, the sense channel are extended along the two-dimensional directional intersected with the one-dimensional square, the driving channel and institute Sense channel is stated to separate by the dielectric layer and intersect to form multiple recognition units;
Wherein, the width of every driving channel and every sense channel is no more than 100 μm, the latticed groove Width be 0.2 μm~5 μm, depth be 2 μm~6 μm, and the ratio of depth and width be greater than 1.
2. fingerprint identification device according to claim 1, which is characterized in that between adjacent driven channel and adjacent sensing is logical The distance between road is no more than 100 μm.
3. fingerprint identification device according to claim 1, which is characterized in that the dielectric layer is single substrate;It is described Driving channel and the sense channel are divided on the different surfaces of the substrate.
4. fingerprint identification device according to claim 1, which is characterized in that the dielectric layer is stepped construction, including The first hypothallus, substrate and the second hypothallus being sequentially stacked;The driving channel and the sense channel are divided into described Surface and second hypothallus surface far from the substrate side of one hypothallus far from the substrate side.
5. fingerprint identification device according to claim 1, which is characterized in that the dielectric layer is stepped construction, including The hypothallus that is sequentially stacked, substrate;The driving channel and the sense channel are divided into the hypothallus far from the substrate The surface of the surface of side and the substrate close to the hypothallus side.
6. fingerprint identification device according to claim 1, which is characterized in that the dielectric layer is stepped construction, including The first hypothallus, the second hypothallus and the substrate being sequentially stacked;The driving channel and the sense channel are divided into described Surface and second hypothallus surface far from the substrate side of one hypothallus far from the second hypothallus side.
7. fingerprint identification device according to claim 1, which is characterized in that the dielectric layer is stepped construction, including The first substrate, bonding coat and the second substrate being sequentially stacked;The driving channel and the sense channel are divided into described first Surface and the second substrate surface far from first substrate side of the substrate far from second substrate side.
8. fingerprint identification device according to claim 1, which is characterized in that the dielectric layer is stepped construction, including The first hypothallus, the first substrate, bonding coat, the second substrate and the second hypothallus being sequentially stacked;The driving channel and described Sense channel is divided into surface and second hypothallus of first hypothallus far from the first substrate side far from described The surface of two substrate sides.
9. fingerprint identification device according to claim 1, which is characterized in that the fingerprint identification module further includes a plurality of draws Line, sense channel described in driving channel and each described in each are electrically connected the lead.
10. fingerprint identification device according to claim 9, which is characterized in that a plurality of leads is latticed groove Structure, or latticed conductor wire or conductive line segment for protrusion.
11. fingerprint identification device according to claim 1, which is characterized in that the mesh shape of the latticed groove is Regular grid or random grid.
12. a kind of electronic device, which is characterized in that including the described in any item fingerprint identification devices of claim 1-11.
CN201410138486.5A 2014-04-08 2014-04-08 Fingerprint identification device and electronic device comprising it Expired - Fee Related CN104978556B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410138486.5A CN104978556B (en) 2014-04-08 2014-04-08 Fingerprint identification device and electronic device comprising it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410138486.5A CN104978556B (en) 2014-04-08 2014-04-08 Fingerprint identification device and electronic device comprising it

Publications (2)

Publication Number Publication Date
CN104978556A CN104978556A (en) 2015-10-14
CN104978556B true CN104978556B (en) 2019-05-10

Family

ID=54275045

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410138486.5A Expired - Fee Related CN104978556B (en) 2014-04-08 2014-04-08 Fingerprint identification device and electronic device comprising it

Country Status (1)

Country Link
CN (1) CN104978556B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103218095A (en) * 2013-03-25 2013-07-24 南昌欧菲光科技有限公司 Single-layer multipoint capacitive touch screen
CN103425374A (en) * 2013-07-31 2013-12-04 南昌欧菲光科技有限公司 Touch screen body structure, touch display screen and touch key-press device
CN103530609A (en) * 2013-10-11 2014-01-22 北京京东方光电科技有限公司 Fingerprint identification element, display screen and display device
CN104246671A (en) * 2012-04-23 2014-12-24 三星电子株式会社 Touch panel and method of manufacturing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104246671A (en) * 2012-04-23 2014-12-24 三星电子株式会社 Touch panel and method of manufacturing the same
CN103218095A (en) * 2013-03-25 2013-07-24 南昌欧菲光科技有限公司 Single-layer multipoint capacitive touch screen
CN103425374A (en) * 2013-07-31 2013-12-04 南昌欧菲光科技有限公司 Touch screen body structure, touch display screen and touch key-press device
CN103530609A (en) * 2013-10-11 2014-01-22 北京京东方光电科技有限公司 Fingerprint identification element, display screen and display device

Also Published As

Publication number Publication date
CN104978556A (en) 2015-10-14

Similar Documents

Publication Publication Date Title
CN104077573B (en) Fingerprint Identification sensor, fingerprint recognition detection components and terminal device
CN104881196A (en) Substrate and display screen
CN103927468B (en) A kind of fingerprint identification module and display device
CN104699320A (en) Array substrate, color-film substrate and touch display device
CN103778410A (en) Capacitive biometric feature recognition sensor
WO2016115780A1 (en) Fingerprint recognition device and touch apparatus
CN203838717U (en) Capacitive biological feature identifying sensor
CN104700084A (en) Fingerprint recognition device, touch screen with same and terminal device
CN104021371A (en) Electronic equipment
CN105068605A (en) Cover plate and electronic device
CN104063696A (en) Fingerprint identification detection assembly and terminal device containing same
CN203759719U (en) Fingerprint identification device and electronic device comprising same
CN104978555B (en) Fingerprint identification device
JP3197809U (en) Touch panel with fingerprint identification function
CN203773561U (en) Fingerprint identification device and electronic device with same
CN104077574B (en) Push type fingerprint Identification sensor and electronic device
CN104077575B (en) Push type fingerprint Identification sensor and electronic device
CN105631442A (en) Fingerprint identification device and electronic device comprising same
CN104978556B (en) Fingerprint identification device and electronic device comprising it
US20160188033A1 (en) Touch panel with fingerprint recognition
CN203759717U (en) Fingerprint identification device
CN104063695A (en) Press type fingerprint identification sensor and electronic device
CN204203929U (en) The contact panel of tool identification of fingerprint
CN104091154B (en) Fingerprint Identification sensor, integrated package and terminal device
CN104978552A (en) Fingerprint recognition device and electronic equipment comprising fingerprint recognition device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi

Patentee after: Jiangxi OMS Microelectronics Co.,Ltd.

Patentee after: Nanchang OFilm Tech. Co.,Ltd.

Patentee after: Ophiguang Group Co.,Ltd.

Patentee after: SUZHOU OFILM TECH Co.,Ltd.

Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi

Patentee before: OFilm Microelectronics Technology Co.,Ltd.

Patentee before: Nanchang OFilm Tech. Co.,Ltd.

Patentee before: OFilm Tech Co.,Ltd.

Patentee before: SUZHOU OFILM TECH Co.,Ltd.

Address after: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi

Patentee after: OFilm Microelectronics Technology Co.,Ltd.

Patentee after: Nanchang OFilm Tech. Co.,Ltd.

Patentee after: OFilm Tech Co.,Ltd.

Patentee after: SUZHOU OFILM TECH Co.,Ltd.

Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi

Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd.

Patentee before: Nanchang OFilm Tech. Co.,Ltd.

Patentee before: Shenzhen OFilm Tech Co.,Ltd.

Patentee before: SUZHOU OFILM TECH Co.,Ltd.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20210729

Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province

Patentee after: Jiangxi OMS Microelectronics Co.,Ltd.

Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi

Patentee before: Jiangxi OMS Microelectronics Co.,Ltd.

Patentee before: Nanchang OFilm Tech. Co.,Ltd.

Patentee before: Ophiguang Group Co.,Ltd.

Patentee before: SUZHOU OFILM TECH Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190510