CN104968841A - Masking film support for plating, and masking film using same - Google Patents
Masking film support for plating, and masking film using same Download PDFInfo
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- CN104968841A CN104968841A CN201380065494.5A CN201380065494A CN104968841A CN 104968841 A CN104968841 A CN 104968841A CN 201380065494 A CN201380065494 A CN 201380065494A CN 104968841 A CN104968841 A CN 104968841A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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Abstract
Provided are a masking film and masking film support for plating that have the ability to adjust well to circuit patterns, and that exhibit superior thermal dimensional stability, high plating formation precision, and superior punch workability. The masking film support is obtained by adding a clay mineral, which serves as an inorganic filler, to a polybutylene terephthalate film, and the masking film support has a tensile modulus of 700-5000MPa at a temperature of 23 DEG C. An adhesive layer is provided to one surface of the masking film support. The content of the clay mineral is 10-40 mass parts relative to 100 mass parts of a resin component included in the polybutylene terephthalate film.
Description
Technical field
The present invention relates to a kind of in the manufacturing processed of circuit board, the plating screened film support used when carrying out parcel plating process and screened film, more specifically, relate to a kind of on the privileged site of the such as splicing ear such as flexible printed circuit substrate, the plating screened film support used when optionally carrying out electroplating processes and screened film.
Background technology
On dielectric substrate materials, optionally by the conductive layer lamination that tackiness agent will be made up of Copper Foil etc., then by carrying out etch processes etc. to the conductive layer of this laminate, forming circuit pattern, thus making circuit board.Avoid oxidation or wearing and tearing to reduce resistance or protection circuit surface, or in order to the object such as decorate, partly can form electrolytic coating.
Form the method for electrolytic coating in the circuit pattern upper part of circuit board, specifiable method, such as, have the not masking part at screened film, and the electrolytic coating part being about to be formed circuit pattern carries out the method for punch die.This operation carries out punching press at room temperature stamping machine.In order to not form electrolytic coating in electroless plating part, on the circuit pattern of circuit board, after attaching the screened film be stamped out, by carrying out metallide or electroless plating, form electrolytic coating as required.
But, on the surface of the circuit board attaching screened film (printed circuit board (PCB), flexible printed circuit board etc.), there is the complex unevenness on its of the circuit pattern formed in advance.For this reason, screened film closely will follow that this is concavo-convex, so need to prevent electroplate liquid from immersing masked segment (hereinafter referred to as " tracing ability to circuit pattern " or " tracing ability ").When the binding property of screened film is low, the immersion of electroplate liquid can be caused, plating precise decreasing and be called the reason of fault etc.
In order to solve this problem, patent documentation 1 proposes a kind of screened film, and it is provided with bonding coat on the screened film support be made up of polyimide or polyester with opening.
In addition, patent documentation 2 it is also proposed a kind of screened film (patent documentation 2), and it has the binder layer be made up of specific propylene copolymers.This screened film has the performance that excellent resistance to electroplate liquid immerses, and the separability after plating is good, and the stain resistance of electroless plating part and discoloration-resistant are also excellent.Describe as the base material (screened film support) with binder layer in patent documentation 2, can use such as: polyester, polymeric amide, single type (homo-polypropylene) or with a kind in the olefin polymer such as acronal, ethylene propylene copolymer of ethene composition be copolymerization composition the acronal such as block type, random, graft type, low density or high-density or linea low density, extremely-low density, or use various plastic films of more than two kinds etc.And disclose, when using plastic film as base material, can mix such as: the weighting agents such as carbon black, calcium oxide, oxydase, silicon-dioxide, zinc oxide, titanium oxide.
But the screened film that the screened film support employing the resin material of patent documentation 1 and 2 obtains, the tracing ability of its circuit pattern is not also very good.In addition, the dimensional stability (hereinafter referred to as " thermal dimensional stability (dimensional stability to heating) ") of above-mentioned screened film to heat is lower, can thermal distortion be there is to during circuit pattern lamination, under treatment temp required when carrying out electroplating processes, the problem of masking part dislocation can be produced.And, also have the immersion of electroplate liquid, a problem that the bounding force of bonding coat can not be supported the dimensional change of screened film support and peel off.Therefore, because screened film supports that body has thermal dimensional stability, plating forms precision and reduces, thus not preferred.
For overcoming the defect of above-mentioned screened film, by polybutylene terephthalate (English name polybutyleneterephthalate; Being called for short PBT) the screened film support that the forms screened film (patent documentation 3) that is provided with bonding coat is suggested.This screened film has good the most casual to circuit pattern, and is the thing of the excellence that thermal dimensional stability is also higher.But above-mentioned screened film, when punch die processibility, can produce the problem that screened film support is stretched.Therefore, while having good tracing ability to circuit pattern, the screened film that can also carry out punch die processibility accurately is extremely expected.
Prior art document
Patent documentation
Patent documentation 1: JP 62-24391 publication (claims forms part of patent)
Patent documentation 2: JP 2003-213485 publication (claim 1, claim 2)
Patent documentation 3: JP 2008-300441 publication (claim 1)
Summary of the invention
The problem that the present invention will solve
Therefore, the object of the present invention is to provide a kind of plating screened film support and screened film, it has good tracing ability to circuit pattern, thermal dimensional stability is excellent, plating precision is high and punch die excellent in workability.
Solve the method for problem
The present inventor is through inquiring into keen determination, found that, make containing specific mineral filler in polybutylene terephthalate, tensile elasticity value during near room temperature is set as the plating screened film support of preset value, use this plating screened film support can solve above-mentioned problem, thus complete the present invention.
Namely, plating screened film support of the present invention, it is the plating screened film support be made up of the polybutylene terephthalate film containing mineral filler, it is characterized in that, described mineral filler is clay mineral, and the tensile elasticity response rate of screened film support 23 DEG C time is at more than 700MPa below 5000MPa.The content of preferably clay mineral, relative to resinous principle 100 mass parts contained in above-mentioned polybutylene terephthalate film, more than 10 mass parts below 40 mass parts.
In addition, the Mohs' hardness of preferably clay mineral is below 3.
In addition, preferably clay mineral are at least a kind that selects from talcum, kaolinite, agalmatolite, mica.
In addition, preferred plating screened film support of the present invention, the thickness of its support more than 4 μm less than 125 μm, the median size of above-mentioned clay mineral more than 2 μm less than 10 μm.
And then, preferred plating screened film support of the present invention, its tensile elasticity response rate 90 DEG C time at more than 100MPa below 1000MPa, the longitudinal direction after 85 DEG C of heating 30 minutes and the percent thermal shrinkage of transverse direction below 1%, longitudinally and the difference of horizontal percent thermal shrinkage below 1%.
In addition, plating screened film support of the present invention, is characterized in that, has bonding coat in the wherein one side of above-mentioned plating screened film support.
Invention effect
According to plating screened film support of the present invention, can provide a kind of plating screened film, it has the good tracing ability of circuit pattern, thermal dimensional stability is excellent, plating precision is high and punch die excellent in workability.
Embodiment
Plating screened film support of the present invention is in polybutylene terephthalate, makes the thing containing specific mineral filler.Below the embodiment of plating screened film support of the present invention and plating screened film is described.
The manufacture method of the polybutylene terephthalate resin combination that plating screened film support of the present invention uses, can enumerate: the method making BDO and terephthalic acid polycondensation; Make the method for the lower alkyl esters polycondensation of BDO and terephthalic acid.The polybutylene terephthalate resin combination that the present invention can use any one method to obtain.
Polybutylene terephthalate resin of the present invention can also be the multipolymer of multipolymer or modification, as long as in the scope not affecting effect of the present invention, other resin combination can also be added, such as: terephthaldehyde's acetoacetic ester, poly-naphthalic acid, polycarbonate, triacetyl cellulose, polyimide, polymeric amide, polyethersulfone, polyetherimide, aromatic poly amide, polysulfones, vinylformic acid, polyvinyl chloride, fluoro-resin etc.
Plating screened film support of the present invention, is characterized in that, containing clay mineral as mineral filler.Clay mineral has the structure that lepidiod particle is stratiform configuration.By in the plating of polybutylene terephthalate resin-made with in screened film support, add such clay mineral, can operatively increase its rigidity.And, by the tensile elasticity rate of screened film support 23 DEG C time is set to more than 700MPa below 5000MPa, can significantly improve punch die processibility.The present invention, because can increase the rigidity of support by adding a small amount of mineral filler, so while the tracing ability to circuit pattern of maintenance polybutylene terephthalate excellence, can also improve its punch die processibility.
Herein, the aspect ratio of the clay mineral added in screened film support preferably 3 ~ 70, more preferably 5 ~ 50, further preferably 7 ~ 20.The aspect ratio of clay mineral refers to the length on long limit and the ratio (long edge lengths/thickness) of thickness, by screened film support surface and the cross section modes such as scanning electronic microscope (SEM) observation, calculates.By being arranged in above-mentioned scope by the aspect ratio of clay mineral, more effectively can improve the rigidity of screened film support, and improve punch die characteristic further.In addition, by being set in above-mentioned scope by the aspect ratio of platy clay mineral, thermal dimensional stability described later can be improved further.
The volume occupation rate of the clay mineral occupied in screened film support, the thickness because of screened film support is different and different, can not one in general, but preferably 2 volume % ~ 20 volume %, more preferably 4 volume % ~ 15 volume %, most preferably 5 volume % ~ 10 volume %.Containing the volume occupation rate of the clay mineral occupied in screened film support, by screened film support surface and the cross section modes such as scanning electronic microscope (SEM) observation, calculate.In the present invention, owing to employing clay mineral, a small amount of interpolation can improve punch die processibility and thermal dimensional stability.And, by the volume occupation rate of clay mineral is set in above-mentioned scope, while the tracing ability of screened film support can being maintained to greatest extent, can also significantly improve punch die characteristic and thermal dimensional stability.
In addition, with the addition of the plating screened film support of the present invention of clay mineral, compare with the support adding other mineral filler, be difficult to become fragile, therefore screened film be not easy to break when circuit pattern is peeled off.And make the clay mineral of dispersion in the present invention, the particle alignment layered of its scale shape, surface-area is large, therefore more improves thermal dimensional stability than containing during other mineral filler.Particularly, the plating screened film support of the present invention containing clay mineral, it is longitudinally more impartial with the percent thermal shrinkage of transverse direction, has the effect that the support containing other mineral filler does not have.Accordingly, plating screened film support of the present invention, when being used as plating screened film, does not need the laminating direction selecting this screened film on circuit pattern, and in any direction laminating can both carry out high-precision electroplating processes.
Acquired excellent effect of the present invention is like this that the structure of adding the mineral fillers such as spherical particle, acicular particles and random shape particle does not have.
As above-mentioned clay mineral, can enumerate: talcum, kaolinite, pyrophyllite, mica, montmorillonite (montmorillonite), smectite (Smectite), sericite, illite, glauzcocerinite, chlorite, zeolite, vermiculite, limonite, saponite, dickite, nakrite, boehmite, xonotlite, rhombspar, calcite, sepiolite, wollastonite, wherein the preferred clay mineral of Mohs' hardness below 3.When Mohs' hardness is below 3, the decline of blade life during punch die, can be suppressed.Particularly the handlability of talcum, kaolinite, pyrophyllite, mica is good, and cost is low.Based on this viewpoint, at least one is preferably used to be selected from above-mentioned clay mineral.
The content of the clay mineral contained in plating screened film support of the present invention, relative to resinous principle 100 mass parts contained in above-mentioned polybutylene terephthalate film, lower limit is more than 10 mass parts, further preferably more than 15 mass parts; The upper limit is below 40 mass parts, further preferably below 30 mass parts.By the content of clay mineral is set in more than 10 mass parts, its thermal dimensional stability of the support obtained is excellent, plating precision is high and punch die excellent in workability.In addition, by the content of clay mineral is set in below 40 mass parts, then it is good to the tracing ability of circuit pattern for the support obtained.
The size of this kind of clay mineral, different because of the thickness of plating screened film support of the present invention, cannot treat different things as the same, but as lower limit, median size more than 2 μm, preferably more than 4 μm further, as the upper limit below 10 μm, preferably less than 8 μm further.When median size is more than 2 μm, its thermal dimensional stability is more excellent, thus plating precision is higher, and punch die processibility is more excellent.When median size is below 10 μm, there is the better tracing ability to circuit pattern.In addition, said median size is herein the median particle diameter D50 (L) recorded by laser diffractometry according to JIS R1629.
Such plating screened film support, makes containing above-mentioned clay mineral in above-mentioned polybutylene terephthalate, is to be made by the tensionless winkler foundation processing such as T modulus method or inflation method or uniaxial extension or biaxial stretch-formed processing etc.During by tensionless winkler foundation processing and fabricating, the support to the more excellent tracing ability of circuit pattern can be obtained, and by stretch process, the support that thermal dimensional stability is more excellent can be obtained.
Preferably carry out plasma treatment, Corona discharge Treatment, flame treating, ozonize, uviolizing process, electron beam irradiation process, radiotreatment, acid treatment, alkaline purification, Chemical treatment, sandblasting, embossing process at least wherein 1 face of this plating screened film support, be convenient to the easily adhesion process such as coating of bonding coat then.When treated side arranges bonding coat as described later, the adhesiveproperties with bonding coat can be improved through so processing.In addition, be provided with the reverse face of bonding coat at screened film support with above-mentioned, as required, the surface treatments etc. such as antistatic treatment, lift-off processing, hidden process, embossing process can be carried out.
Above-mentioned screened film support, within the envelop of function not damaging plating screened film support of the present invention, the various additives such as other resin, tensio-active agent, pigment, lubricant, tinting material, static inhibitor, fire retardant, antiseptic-germicide, anti-mycotic agent, UV light absorber, photostabilizer, antioxidant, levelling agent, flow control agent, defoamer can also be added.
This plating thickness of screened film support, from the angle of to the tracing ability of circuit pattern and punch die processibility, lower limit is 4 μm, is preferably more than 8 μm, preferably more than 12 μm further; The upper limit is less than 125 μm, preferably less than 75 μm, preferably less than 50 μm further.When thickness is more than 4 μm, its punch die processibility and thermal dimensional stability excellence, and then treatability is also good.When thickness is below 125 μm, it is good to the tracing ability of circuit pattern.
The tensile elasticity response rate of plating screened film support of the present invention 23 DEG C time is at more than 700MPa, below 5000MPa.By being defined in above-mentioned scope by tensile elasticity response rate when 23 DEG C, excellent punch die processibility and tracing ability can be realized.In addition, preferably 90 DEG C time tensile elasticity response rate at more than 100MPa, below 1000MPa; The percent thermal shrinkage of the vertical and horizontal of 85 DEG C of heating after 30 minutes is below 1%, and the difference of the percent thermal shrinkage of vertical and horizontal is below 1%.
By the tensile elasticity response rate of plating screened film support of the present invention 23 DEG C time is set in more than 900MPa, more excellent to punch die processibility during electroplating processes portion punch die.In addition, be set in below 4500MPa by tensile elasticity response rate when 23 DEG C, it is more excellent to the tracing ability of circuit pattern.In addition, tensile elasticity response rate when 90 DEG C is at more than 100MPa, and preferred more than 300MPa, can obtain better thermal dimensional stability.In addition, tensile elasticity response rate when 90 DEG C at below 1000MPa, preferred below 800MPa, more excellent to the tracing ability of circuit pattern.And, 85 DEG C of heating percent thermal shrinkages of vertical and horizontal after 30 minutes below 1%, preferably less than 0.6%, the screened film support that thermal dimensional stability is higher can be obtained, and the screened film support that plating precision is more excellent.In addition, the difference of the percent thermal shrinkage of the vertical and horizontal of 85 DEG C of heating after 30 minutes, below 1%, just need not select the laminating direction of this screened film support on circuit pattern, and any direction laminating can carry out the electroplating processes of fine.
Plating screened film of the present invention, at wherein 1 of above-mentioned plating screened film support, has bonding coat.As the tackiness agent forming bonding coat, can enumerate: acryloid cement, silicone adhesive agent, urethane adhesive, Polyester tackiness agent, polyethers tackiness agent, polyamide-based pressure sensitive adhesive, fluorine class tackiness agent and rubber adhesive, any a kind or two or more wherein can be used.In addition, the tackiness agent with antistatic property can also be used.Wherein, from the viewpoint of weathering resistance and thermotolerance, more preferably acrylic resin.
In the middle of acrylic resin, can use to there is the vinyl monomer of alkyl for main component, the various vinyl monomers with functional group be carried out the thing of copolymerization.The vinyl monomer with alkyl can be containing 1 to 18 carbon atom (methyl) acrylate, such as: (methyl) ethyl propenoate, (methyl) isopropyl acrylate, (methyl) lauryl acrylate, (methyl) butyl acrylate, (methyl) Ethyl acrylate, (methyl) Octyl acrylate, (methyl) acrylate, dodecyl (methyl) stearyl acrylate ester, (methyl) acrylate etc.In addition, as the vinyl monomer with functional group, can enumerate: the vinyl monomer with hydroxyl, the vinyl monomer with carboxyl, have amide group vinyl monomer, there is amino vinyl monomer, there is the vinyl monomer of alkoxyl group, there is the vinyl monomer etc. of Oxyranyle.
Herein, as the vinyl monomer with hydroxyl, 2-hydroxyethyl (methyl) acrylate can be enumerated.2-hydroxypropyl (methyl) acrylate.2-hydroxyl butyl (methyl) acrylate etc.In addition, as the vinyl monomer with carboxyl, can enumerate: vinylformic acid, methacrylic acid, methylene-succinic acid, toxilic acid, fumaric acid etc.In addition, as the vinyl monomer with amide group, can enumerate: two (methyl) acrylamides of (methyl) acrylamide, N-methylol (methyl) acrylamide, N-methoxymethyl (methyl) acrylamide, N, N'-dimethylene etc.In addition, as having amino vinyl monomer, can enumerate: dimethyl aminoethyl (methyl) ethyl propenoate, (methyl) acrylate etc.In addition, as the vinyl monomer with alkoxyl group, can enumerate: methoxy ethyl (methyl) acrylate, ethoxyethyl group (methyl) acrylate, butoxyethyl group (methyl) acrylate, Phenoxyethyl (methyl) acrylate etc.In addition, as the vinyl monomer with Oxyranyle, can enumerate: glycol ether (methyl) acrylate, methoxyl group glycol ether (methyl) acrylate, methoxy poly (ethylene glycol) (methyl) acrylate etc.In addition, if necessary, can also with the monomer copolymerizations such as vinylbenzene, chloro-styrene, alpha-methyl styrene, Vinyl toluene, vinylchlorid, vinyl acetate.
In these acrylic resins, can be as required, add tackifier, such as: rosin, Da Ma, polymerized rosin, partial hydrogenation rosin, rosin ester, polyterpene resin, terpene modified thing, petroleum resin, cyclopentadiene resin, phenol resin, styrene resin, xylene resin, indene resin etc., and tenderizer, filler.
In addition, when using the acrylic resin containing hydroxyl or carboxyl, preferably use polyepoxides and polyisocyanate compounds as linking agent.As polyepoxides, can enumerate: Sorbitol Powder polyglycidyl ether, Polyglycerine polyglycidyl ether, tetramethylolmethane polyglycidyl ether, two propanetriol-diglycidyl-ether, triglycidyl group-three (2-hydroxyethyl) isocyanuric acid ester, glycerine polyglycidyl ether, TriMethylolPropane(TMP) polyglycidyl ether, Resorcinol glycidyl ether, neopentylglycol diglycidyl ether, 1, 6-hexanediol diglycidyl ether, bis-phenol-S-diglycidyl ether, ethylene glycol diglycidylether, polyethyleneglycol diglycidylether, propylene glycol diglycidylether etc.As polyisocyanate compounds, can enumerate: tolylene diisocyanate, 2,4-toluene diisocyanate dimer, naphthylene-1，5-diisocyanate, adjacent tolylene diisocyanate, diphenylmethanediisocyanate, triphenylmethane triisocyanate, three-(p-isocyanato) thiophosphatephosphorothioates, poly-polyphenylene di-isocyanate, hexamethylene diisocyanate, trimethylammonium vulcabond, isophorone diisocyanate, trimethylammonium vulcabond etc.
In addition, in this bonding coat, in the scope of function not damaging plating screened film support of the present invention, also the various additive such as other resin and tensio-active agent, pigment, lubricant, tinting material, static inhibitor, fire retardant, antiseptic-germicide, anti-mycotic agent, UV light absorber, photostabilizer, antioxidant, levelling agent, flow control agent, defoamer can be contained.
As the method forming bonding coat, by above-mentioned tackiness agent and the optionally linking agent added and additive, be dissolved or dispersed in diluting soln, make coating fluid, by this coating fluid according to existing known methods such as stick coating methods, in plating coating on screened film support, drying, optionally by being solidified to form.In addition, also coating fluid first can be coated on barrier film, fit with plating screened film support again after drying and formed.The thickness of bonding coat, because of the concavo-convex degree of depth and shape etc. of circuit pattern, cannot treat different things as the same, but lower limit is more than 5 μm, preferably more than 8 μm, the upper limit is less than 50 μm, preferably less than 30 μm.When the thickness of bonding coat is more than 5 μm, the immersion etc. of electroplate liquid can be prevented, simultaneously also abundant to the tracing ability of circuit pattern, when the thickness of bonding coat is below 50 μm, operability and productivity can be improved.
Plating screened film of the present invention, from the viewpoint of operability, preferably arranges barrier film in the face with bonding coat.As this barrier film, be not particularly limited, paper using, synthetic paper, lamination polyethylene paper, plastic film etc. can be made.As plastic film, can enumerate: the various synthetic resin films that polyethylene terephthalate, polycarbonate, polypropylene, polyethylene, poly-naphthalic acid, polystyrene, polyarylester, triacetyl cellulose, polymeric amide, polyimide, polyvinyl chloride, vinylidene chloride-vinyl chloride copolymer, (methyl) acrylate resin, fluoro-resin etc. are formed.
Above-mentioned barrier film, in order to improve the separability with bonding coat, with on the contact surface of bonding coat, painting polyethylene wax or siloxane release agent, carry out demoulding process, such as, the resin layer containing matting agent is set at interlayer, sandblasting delustring process is carried out to interlayer surface or embossing process is carried out to interlayer self.
Embodiment
Below, based on embodiment, the present invention is described in more detail.In addition, " part ", " % " in the present embodiment is all benchmark without being prescriptive with quality.
[the plating screened film support of embodiment 1 ~ 5, comparative example 1]
Mineral filler shown in polybutylene terephthalate and table 1 is carried out melt mixing, use T model extrusion film forming apparatus, formed by extrusion molding, obtain the plating screened film support (embodiment 1 ~ 5, comparative example 1) that total thickness is 25 μm.In addition, the inorganic filler content of Arbitrary Samples, relative to resinous principle 100 mass parts contained in polybutylene terephthalate film, is 25 mass parts.Same below, the content of mineral filler in table represents the content relative to resinous principle 100 mass parts contained in polybutylene terephthalate film.In addition, in table, the meaning of PBT is polybutylene terephthalate.
In addition, the talcum used in embodiment 1 to be long-width ratio be 10 talcum.And, the volume occupation rate of screened film support overall volume CLAY MINERALS AND THEIR SIGNIFICANCE, embodiment 1 is 9.7 volume %, embodiment 2 is 10.1 volume %, embodiment 3 is 9.3 volume %, embodiment 4 is 9.3 volume %, embodiment 5 is 7.5 volume %, comparative example 1 is 13.1 volume %.
[the plating screened film support of comparative example 2]
Except not mixing mineral filler, other is identical with embodiment, obtains the plating screened film support recorded in the comparative example 2 of table 1.
[the plating screened film support of reference example 1 ~ 3]
Use tensionless winkler foundation polypropylene screen (25 μm, too pavilion FB: two village chemistry commercial firm), as the plating screened film support of the reference example 1 of table 1.
In addition, biaxial-stretched polypropylene films (25 μm, ALPHAN (trade(brand)name) SSD-101: the special paper commercial firm of prince) is used, as the plating screened film support of the reference example 2 of table 1.
In addition, biaxial stretch-formed polybutylene terephthalate second diester film (12 μm, ダ イ ヤ ホ イ Le (trade(brand)name) H-500: resin commercial firm of Mitsubishi) is used, as the plating screened film support of the reference example 3 of table 1.In addition, the CPP in table 1 be meant to tensionless winkler foundation polypropylene screen, OPP be meant to biaxial-stretched polypropylene films, PET be meant to biaxial stretch-formed polybutylene terephthalate second diester film.
[the plating screened film support of embodiment 6 ~ 10]
Use talcum as mineral filler, outside the amount (content of mineral filler) recorded according to table 2 is added, other is identical with embodiment 1, obtains the plating screened film support of embodiment 6 ~ 10.
And the volume occupation rate of screened film support overall volume CLAY MINERALS AND THEIR SIGNIFICANCE, embodiment 6 is 2.3 volume %, embodiment 7 is 4.4 volume %, embodiment 8 is 7.4 volume %, embodiment 9 is 13.9 volume %, embodiment 10 is 15.1 volume %.
[the plating screened film support of embodiment 11 ~ 13]
As mineral filler, outside the talcum of the size (median size) using table 3 to record, other is identical with embodiment 1, obtains the plating screened film support of embodiment 11 ~ 13.
Then, the screened film support of the plating with regard to embodiment, comparative example and reference example, measures tensile elasticity response rate when its 23 DEG C and 90 DEG C, and longitudinal direction after 30 minutes of 85 DEG C of heating and the percent thermal shrinkage of transverse direction.Measurement result is as shown in table 1, table 2 and table 3.
(1) 23 DEG C and 90 DEG C time tensile elasticity response rate
Plating with regard to embodiment, comparative example and reference example screened film support, based on JIS K7127:1999, use traction test instrument (テ Application シ ロ Application (trade(brand)name) UTM-5T:ORIENTEC commercial firm), measure tensile elasticity response rate when 23 DEG C and 90 DEG C.In addition, test film: 100mm, distance is held: 50mm, width: 10mm, examination pulling speed: 300mm/ divides.
(2) percent thermal shrinkage
With JIS C2318 for benchmark, by the plating of embodiment, comparative example and reference example screened film support, at vertical and horizontal, cut into the size of wide 20mm, long 250mm respectively, peel off barrier film as test film.At the middle body of this test film, about punctuate on the range mark of 200mm, then this test film being placed horizontally at temperature is in the thermostatic bath of 85 DEG C, heat after 30 minutes and take out, after room temperature places 30 minutes, use vernier callipers (electronic digital indicator: MITUTOYO commercial firm system), measure the distance between punctuate, according to formulae discovery below.
Percent thermal shrinkage (%)={ length before (length after the length-heating before heating between punctuate between punctuate)/heating between punctuate } × 100
In addition, the MD that table 1 ~ table 3 is recorded refers to longitudinal direction, and TD refers to transverse direction.
[plating screened film]
Then, the bonding coat coating fluid according to lower surface compositions is applied to paper barrier film (70g/m by stick coating method
2kraft paper two sides stacked through polyethylene, wherein one side carry out siloxane treated), after drying, fit to embodiment 1 ~ 3, the plating of comparative example 1,2 and reference example 1 ~ 3 wherein one side of screened film support, 40 times solidifications form the bonding coat that thickness is 10 μm on the 7th, make embodiment 1 ~ 3, the plating screened film of comparative example 1,2 and reference example 1 ~ 3.
(acrylic adhesives A)
The acrylic copolymer of weight-average molecular weight 300,000, second-order transition temperature-10 DEG C.As formation monomer, containing butyl acrylate, methyl acrylate, vinylformic acid, vinyl acetate and methacrylic acid 2-hydroxyethyl, it forms mass ratio is 40:15:37:8.The hydroxyl value of this acrylic copolymer is 35mgKOH/g.
(isocyanate crosslinking B)
The linking agent of isocyanates, its constituent is tolylene diisocyanate TMP (TriMethylolPropane(TMP)) add-on type, is 18% containing NCO.
Formula (solids content (40%) > of < binder layer coating solution
Then, the plating screened film of Evaluation operation example, comparative example and reference example is carried out according to evaluation method below, to tracing ability, thermal dimensional stability, the punch die processibility of circuit pattern.Evaluation result as shown in Table 1 to Table 3.
(3) tracing ability
By the plating screened film of embodiment, comparative example and reference example, use laminating machine (LAMIC-1:SOMAR commercial firm), the Heating temperature of laminating roll is 100 DEG C, cylinder pressure is 500kPa, transmission (thermo-compressed) speed 1 m/min, being highly on the circuit board of concavo-convex pattern of 30 μm having, crimping.Use microscope (VHX-1000:Keyence commercial firm), under 30 times, observe the ladder difference tracing ability of plating screened film now, and evaluate.During evaluation, be labeled as ◎ by not almost being mixed into bubble in plating screened film; The inner side of masked segment finds bubble, but does not have bubble and close contact mark zero at end face; Find that there is stage difference to float, be labeled as △; End face have float be labeled as ×.
(4) thermal dimensional stability
Screened film adhesive substrates after being evaluated by above-mentioned (3) tracing ability soaks 30 minutes in the warm water of 85 DEG C, the shielding precision of the plating screened film of Evaluation operation example, comparative example and reference example.During evaluation, the contraction of vertical and horizontal is all discontented with 100 μm, does not find the immersion of liquid, is labeled as ◎; One of vertical or horizontal is contracted in more than 100 μm, does not find the immersion of liquid, is labeled as zero; One of vertical or horizontal is contracted in more than 100 μm, finds that the liquid having in end 1mm discontented immerses, is labeled as △; One of vertical or horizontal is contracted in more than 100 μm, finds that the liquid having more than 1mm in end immerses, or screened film is peeled off, and is labeled as ×.In addition, the size of test film is 200mm × 200mm.
(5) punch die processibility
By the plating screened film of embodiment, comparative example and reference example, with the die set (2 hole punch die UB-85:Carl affairs device commercial firm) that diameter is 2.9mm, from support side perforating, observe under using above-mentioned 30 times same, microscope, measure by the middle of the area of punch die part, support prolongs the area of protuberance, and area ratio discontented 5% is labeled as ◎; More than 5% discontented 10% is labeled as zero; More than 10% is labeled as △; Have residue be labeled as ×.
(6) life-span of blade
As above-mentioned (5) mold processibility evaluation is same, to the plating screened film of embodiment, comparative example and reference example, carry out 3000 times and hit punch die, and evaluate.During evaluation and the punch die state of hitting for the 1st time compare, it is outstanding that area is constant is labeled as zero; Outstanding area increase is labeled as △; To hit for 3000 times just to need before punch dies complete to exchange being labeled as of blade ×.
Claims (9)
1. a screened film support is used in plating, is the plating screened film support be made up of the polybutylene terephthalate film containing mineral filler, it is characterized in that,
Described mineral filler is clay mineral, and
The tensile elasticity response rate of described screened film support 23 DEG C time is at more than 700MPa below 5000MPa.
2. screened film support is used in plating as claimed in claim 1, it is characterized in that,
The content of described clay mineral, relative to resinous principle 100 mass parts contained in above-mentioned polybutylene terephthalate film, more than 10 mass parts below 40 mass parts.
3. screened film support is used in plating as claimed in claim 1 or 2, it is characterized in that,
The Mohs' hardness of described clay mineral is below 3.
4. the screened film support of the plating as described in claims 1 to 3 any one, is characterized in that,
Described clay mineral is at least a kind that selects from talcum, kaolinite, agalmatolite, mica.
5. the screened film support of the plating as described in Claims 1 to 4 any one, is characterized in that,
The thickness of described plating screened film support more than 4 μm less than 125 μm,
The median size of described clay mineral more than 2 μm less than 10 μm.
6. screened film support is used in plating as claimed in any one of claims 1 to 5, wherein, it is characterized in that,
The tensile elasticity response rate of described plating screened film support 90 DEG C time is at more than 100MPa below 1000MPa.
7. the screened film support of the plating as described in claim 1 ~ 6 any one, is characterized in that,
Longitudinal direction after described plating screened film support 85 DEG C heating 30 minutes and the percent thermal shrinkage of transverse direction are all below 1%.
8. the screened film support of the plating as described in claim 1 ~ 7 any one, is characterized in that,
The difference of the longitudinal direction after described plating screened film support 85 DEG C heating 30 minutes and horizontal percent thermal shrinkage is below 1%.
9. a plating screened film, is characterized in that,
In the wherein one side of the plating as described in claim 1 ~ 8 any one with screened film support, there is bonding coat.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-278457 | 2012-12-20 | ||
| JP2012278457 | 2012-12-20 | ||
| PCT/JP2013/084138 WO2014098195A1 (en) | 2012-12-20 | 2013-12-19 | Masking film support for plating, and masking film using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104968841A true CN104968841A (en) | 2015-10-07 |
| CN104968841B CN104968841B (en) | 2018-05-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380065494.5A Active CN104968841B (en) | 2012-12-20 | 2013-12-19 | Plating is with screened film support and uses its screened film |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6318091B2 (en) |
| CN (1) | CN104968841B (en) |
| HK (1) | HK1213027A1 (en) |
| WO (1) | WO2014098195A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015227486A (en) * | 2014-05-30 | 2015-12-17 | ソマール株式会社 | Masking film support for plating and masking film using the same |
| JP6418871B2 (en) * | 2014-09-26 | 2018-11-07 | ソマール株式会社 | Masking film for plating |
| JP6165943B1 (en) * | 2016-08-11 | 2017-07-19 | 株式会社フジクラ | Resist composition |
| JPWO2018203537A1 (en) * | 2017-05-02 | 2020-03-12 | 積水化学工業株式会社 | Shock absorbing sheet and double-sided adhesive sheet |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11302611A (en) * | 1998-04-17 | 1999-11-02 | Hitachi Chem Co Ltd | Pressure-sensitive adhesive film for plating mask |
| JP2004002592A (en) * | 2001-06-29 | 2004-01-08 | Sekisui Chem Co Ltd | Sheet |
| CN101690430A (en) * | 2007-05-29 | 2010-03-31 | 日本美克特隆股份有限公司 | Method for plating wiring board, and wiring board |
| JP2012082267A (en) * | 2010-10-07 | 2012-04-26 | Okura Ind Co Ltd | Masking film supporting base |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003049136A (en) * | 2001-04-23 | 2003-02-21 | Sekisui Chem Co Ltd | Masking tape |
| JP5582726B2 (en) * | 2008-06-05 | 2014-09-03 | 日東電工株式会社 | Protective sheet and its use |
-
2013
- 2013-12-19 CN CN201380065494.5A patent/CN104968841B/en active Active
- 2013-12-19 WO PCT/JP2013/084138 patent/WO2014098195A1/en active Application Filing
- 2013-12-19 JP JP2014553213A patent/JP6318091B2/en active Active
-
2016
- 2016-01-29 HK HK16101021.3A patent/HK1213027A1/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11302611A (en) * | 1998-04-17 | 1999-11-02 | Hitachi Chem Co Ltd | Pressure-sensitive adhesive film for plating mask |
| JP2004002592A (en) * | 2001-06-29 | 2004-01-08 | Sekisui Chem Co Ltd | Sheet |
| CN101690430A (en) * | 2007-05-29 | 2010-03-31 | 日本美克特隆股份有限公司 | Method for plating wiring board, and wiring board |
| JP2012082267A (en) * | 2010-10-07 | 2012-04-26 | Okura Ind Co Ltd | Masking film supporting base |
Non-Patent Citations (1)
| Title |
|---|
| 韦良强等: "超声对PBT/滑石粉复合材料加工和力学性能的影响", 《2010年全国高分子材料科学与工程研讨会》 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104968841B (en) | 2018-05-18 |
| JP6318091B2 (en) | 2018-04-25 |
| WO2014098195A1 (en) | 2014-06-26 |
| HK1213027A1 (en) | 2016-06-24 |
| JPWO2014098195A1 (en) | 2017-01-12 |
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