CN104968833B - 公共沉积平台、处理站及其操作方法 - Google Patents

公共沉积平台、处理站及其操作方法 Download PDF

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Publication number
CN104968833B
CN104968833B CN201480006962.6A CN201480006962A CN104968833B CN 104968833 B CN104968833 B CN 104968833B CN 201480006962 A CN201480006962 A CN 201480006962A CN 104968833 B CN104968833 B CN 104968833B
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CN
China
Prior art keywords
gas
electrode
separation
substrate
processing gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480006962.6A
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English (en)
Chinese (zh)
Other versions
CN104968833A (zh
Inventor
N·莫里森
J·M·迭戈兹-坎波
H·兰格拉夫
T·斯托利
S·海恩
F·里斯
W·布施贝克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of CN104968833A publication Critical patent/CN104968833A/zh
Application granted granted Critical
Publication of CN104968833B publication Critical patent/CN104968833B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45517—Confinement of gases to vicinity of substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45519—Inert gas curtains
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/3277—Continuous moving of continuous material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
CN201480006962.6A 2013-01-31 2014-01-22 公共沉积平台、处理站及其操作方法 Expired - Fee Related CN104968833B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13153498.4 2013-01-31
EP13153498.4A EP2762609B1 (en) 2013-01-31 2013-01-31 Apparatus and method for depositing at least two layers on a substrate
PCT/EP2014/051259 WO2014118062A1 (en) 2013-01-31 2014-01-22 Common deposition platform, processing station and method of operation thereof

Publications (2)

Publication Number Publication Date
CN104968833A CN104968833A (zh) 2015-10-07
CN104968833B true CN104968833B (zh) 2019-09-24

Family

ID=47747376

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480006962.6A Expired - Fee Related CN104968833B (zh) 2013-01-31 2014-01-22 公共沉积平台、处理站及其操作方法

Country Status (7)

Country Link
US (2) US9873945B2 (enExample)
EP (1) EP2762609B1 (enExample)
JP (2) JP6385960B2 (enExample)
KR (1) KR102219696B1 (enExample)
CN (1) CN104968833B (enExample)
TW (1) TWI620828B (enExample)
WO (1) WO2014118062A1 (enExample)

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CN104040023B (zh) * 2012-01-16 2016-04-13 株式会社爱发科 成膜装置
EP2762609B1 (en) * 2013-01-31 2019-04-17 Applied Materials, Inc. Apparatus and method for depositing at least two layers on a substrate
EP2762607B1 (en) * 2013-01-31 2018-07-25 Applied Materials, Inc. Deposition source with adjustable electrode
EP2762608B1 (en) * 2013-01-31 2019-10-02 Applied Materials, Inc. Gas separation by adjustable separation wall
WO2015110154A1 (en) * 2014-01-22 2015-07-30 Applied Materials, Inc. Roller for spreading of a flexible substrate, apparatus for processing a flexible substrate and method of operating thereof
FR3035122B1 (fr) * 2015-04-20 2017-04-28 Coating Plasma Ind Procede de traitement de surface d'un film en mouvement et installation pour la mise en oeuvre de ce procede
CN109402600B (zh) * 2018-11-07 2020-11-27 无锡泓瑞航天科技有限公司 一种氧含量梯度变化的硅氧烷薄膜
CN112368413B (zh) * 2019-03-12 2022-04-29 株式会社爱发科 真空蒸镀装置
US11732345B2 (en) * 2020-06-04 2023-08-22 Applied Materials, Inc. Vapor deposition apparatus and method for coating a substrate in a vacuum chamber
US11905589B2 (en) * 2020-08-20 2024-02-20 Applied Materials, Inc. Material deposition apparatus having at least one heating assembly and method for pre- and/or post-heating a substrate
US12374678B2 (en) * 2020-12-03 2025-07-29 Elevated Materials Us Llc Lithium metal surface modification using carbonate passivation
CN114807887B (zh) * 2021-01-27 2025-11-04 中国建材国际工程集团有限公司 具有处理腔室的系统和用于操作此类系统的方法

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US4461239A (en) * 1982-07-30 1984-07-24 Energy Conversion Devices, Inc. Reduced capacitance electrode assembly
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GB8408023D0 (en) * 1984-03-28 1984-05-10 Gen Eng Radcliffe Ltd Vacuum coating apparatus
JP2932602B2 (ja) * 1990-04-27 1999-08-09 松下電器産業株式会社 薄膜製造装置
JP3357315B2 (ja) * 1999-04-26 2002-12-16 積水化学工業株式会社 放電プラズマ処理装置
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US6821563B2 (en) * 2002-10-02 2004-11-23 Applied Materials, Inc. Gas distribution system for cyclical layer deposition
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Also Published As

Publication number Publication date
US20140212600A1 (en) 2014-07-31
KR20150114527A (ko) 2015-10-12
EP2762609B1 (en) 2019-04-17
TWI620828B (zh) 2018-04-11
KR102219696B1 (ko) 2021-02-23
JP2016514196A (ja) 2016-05-19
CN104968833A (zh) 2015-10-07
WO2014118062A1 (en) 2014-08-07
JP2019007084A (ja) 2019-01-17
US20180100236A1 (en) 2018-04-12
JP6706650B2 (ja) 2020-06-10
JP6385960B2 (ja) 2018-09-05
TW201439351A (zh) 2014-10-16
EP2762609A1 (en) 2014-08-06
US9873945B2 (en) 2018-01-23

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Granted publication date: 20190924

Termination date: 20220122