CN104968472A - Polishing device, method for applying polishing pad, and method for replacing polishing pad - Google Patents
Polishing device, method for applying polishing pad, and method for replacing polishing pad Download PDFInfo
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- CN104968472A CN104968472A CN201480000553.5A CN201480000553A CN104968472A CN 104968472 A CN104968472 A CN 104968472A CN 201480000553 A CN201480000553 A CN 201480000553A CN 104968472 A CN104968472 A CN 104968472A
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- Prior art keywords
- grinding pad
- grinding
- pad
- described grinding
- attaching
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
- B24B45/006—Quick mount and release means for disc-like wheels, e.g. on power tools
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49718—Repairing
- Y10T29/49721—Repairing with disassembling
- Y10T29/4973—Replacing of defective part
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Abstract
The present invention facilitates replacement of polishing pads and inhibits the polishing table from suffering a thermal damage. This polishing device (100) is equipped with a polishing table (110) having a receiving surface (110a) to which a polishing pad (108) for polishing a substrate (102) is to be applied. The polishing device (100) is further equipped with a silicone layer (111) formed on the receiving surface (110a) of the polishing table (110) and interposed between the polishing table (110) and the polishing pad (108). By interposing the silicone layer (111), the polishing pad (108) can be easily applied and stripped off. Since the application of the silicone layer (111) to the polishing table (110) is conducted through a heat treatment at a relatively low temperature, it is possible to inhibit the polishing table (110) from suffering a thermal damage caused by the heat treatment.
Description
Technical field
The present invention relates to a kind of lapping device, the attaching method of grinding pad and the replacing options of grinding pad.
Background technology
In recent years, in order to grind the surface of the substrates such as semiconductor wafer, but use lapping device.Lapping device is, the grinding table be pasted with for the grinding pad of grinding base plate is rotated, and is pressed on grinding pad by the substrate kept by apical ring, grind thus to the surface of substrate.
In this lapping device, using grinding pad as running stores, regularly carry out the replacing of grinding pad.The replacing of grinding pad is generally undertaken by the hand of operator.
Be attached to by grinding pad in the attaching operation on grinding table, the back side is that the grinding pad of bonding plane is attached on grinding table by operator's hand.Grinding pad, owing to being attached to a certain degree powerful bonding force to make the grinding pad when grinding base plate offset on grinding table, therefore, in the stripping process peeled off by grinding pad from grinding table, be difficult to grinding pad to be peeled off, strip operation can spended time.
In addition, in attaching step, when entering air and produce air trapping between grinding pad and grinding table, the nonferromagnetic substance overview of substrate can likely be had influence on.This point, when grinding pad strongly adherent is on grinding table, is just difficult to re-use once be peeled off by grinding pad.Therefore, the occasion of air trapping between grinding pad and grinding table, sometimes peeled off by this grinding pad and again stick new grinding pad, economical aspect is undesirable.
To this, in the prior art, there will be a known so a kind of technology: between grinding table and the bonding plane of grinding pad, accompany fluorine-type resin layer.Thereby, it is possible to easily the grinding pad be attached on grinding table is peeled off from grinding table.
In addition, grinding pad is generally attached on grinding table owing to being cut into the shape identical with the attaching face of grinding table, therefore, by grinding pad from the stripping process that grinding table is peeled off, not used for starting the termination of peeling off grinding pad.Therefore, there is the problem of the spended time when peeling off grinding pad.
To this, in the prior art, there will be a known so a kind of technology: part grinding pad being cut into grinding pad is exposed to the outside of grinding table, this exposed portion is carried out the stripping of grinding pad as termination.In addition, also there will be a known so a kind of technology: with coiled fixture, grinding pad is peeled off, make the stripping Labor-saving of grinding pad thus.
Patent document 1: Japanese Patent Laid-Open 2008-238375 publication
Patent document 2: Japanese Patent Laid-Open 2007-20339 publication
Patent document 3: Japanese Patent Laid-Open 10-217148 publication
But conventional art does not consider following situation: heat treatment when being attached on grinding table by grinding pad likely causes produce fire damage on grinding table.
That is, conventional art is a kind of technology be clipped in by fluorine-type resin layer between grinding table and the bonding plane of grinding pad, but can expect to be coated on grinding table by fluorine-type resin, must heat-treat by such as 300 DEG C ~ 400 DEG C this higher temperature.
To this, grinding table can be formed by various material, but forms the occasion of grinding table in the material lower with heat resisting temperatures such as such as resins, and grinding table is likely because produce the fire damage of distortion etc. for the heat treatment being coated with fluorine-type resin.
Summary of the invention
Invent problem to be solved
Therefore, the object of the invention is to, realize the attaching method of a kind of lapping device and grinding pad, easily can carry out the replacement operation of grinding pad, and grinding table can be suppressed to produce fire damage.
In addition, conventional art reckons without the replacing of high-precision grinding pad, suppresses the impact on substrate nonferromagnetic substance.
That is, be previously formed in the termination of exposing from grinding table in the conventional art on grinding pad, this end portion is distinguished point and likely affects nonferromagnetic substance.
In addition, using coiled fixture to peel off the conventional art of grinding pad even if having employed, finally also must having the termination for starting to peel off grinding pad, likely can damage or make the surface fracture of grinding table when reeling.
In addition, in grinding, owing to sticking to grinding table on adhesion to a certain degree by grinding pad in order to make grinding pad can not peel off from grinding table, therefore need very large power when peeling off grinding pad.
On the other hand, grinding pad being attached to the attaching operation on grinding table, is generally be attached on grinding table with the grinding pad that the back side is bonding plane by hand.Here, in attaching operation, between grinding table surface and the grinding pad back side, produce air trapping sometimes.In this occasion, even if be also difficult to deflate with flattening-out from the face side pressing of grinding pad, this grinding pad must be peeled off discarded, again attach new grinding pad.In addition, whether produce the confirmation of air trapping, rely on the sense of touch or visual of hand, therefore be difficult to judge that whether attaching state is good accurately.
Therefore, the object of the invention is the replacing realizing a kind of high-precision grinding pad, suppress the impact on substrate nonferromagnetic substance.
In addition, the object of the invention is to, suppress the impact on substrate nonferromagnetic substance, and make the strip operation Labor-saving of grinding pad.
For solving the means of problem
The lapping device of the present application is made in view of above-mentioned purpose, is characterized in, has: grinding table, and this grinding table has the attaching face attached for the grinding pad of grinding base plate; And layer of silicone, this layer of silicone is located on the attaching face of described grinding table, and is clipped between described grinding table and described grinding pad.
In addition, described layer of silicone, can comprise the bonding agent containing silicone resin be coated on described attaching face or the adhesive sheet containing silicone resin be attached on described attaching face.
In addition, described layer of silicone, can comprise the resinae coating be blended in by pottery in silicone be coated on described attaching face.
In addition, described grinding table, can comprise at least one in carborundum, stainless steel, resin and aluminium oxide and be formed.
In addition, also can have the bonding agent of grinding pad, the bonding agent of this grinding pad is clipped between described layer of silicone and described grinding pad.
In addition, control part, pressurize or reduce pressure in the back side of this control part to the grinding pad be attached on described grinding table, the back side of described grinding pad is the face of the opposition side of the abradant surface of described grinding pad, described control part, in the stripping process peeling off described grinding pad from described grinding table, pressurizeed in the back side of described grinding pad, or pressurizeed or reduced pressure in the back side of described grinding pad described grinding pad being attached in the attaching operation on described grinding table.
In addition, also push part can be had, this push part by described grinding pad from the stripping process that described grinding table is peeled off, the back side of described grinding pad is pushed, the back side of described grinding pad is the face of the opposition side of the abradant surface of described grinding pad, described push part has: piston, and this piston is located in the hole in the attaching face of the described grinding pad of the attaching being formed at described grinding table; And driver part, this driver part, in described stripping process, can drive described piston to the direction at the back side of the described grinding pad of pushing.
In addition, the attaching method of the grinding pad of the present application is characterized in, the described attaching face of grinding table with attaching face is provided with layer of silicone, described attaching face attaches the grinding pad being used for grinding base plate, the layer of silicone be located on described attaching face is heat-treated, described grinding pad is attached to and has carried out in described heat treated layer of silicone.
In addition, the replacing options of the grinding pad of the present application, be characterized in, the attaching method of the grinding pad of claim 8 or by described grinding pad from the method that described grinding table is peeled off, by described grinding pad from the stripping process that described grinding table is peeled off, pressurizeed in the back side of the grinding pad be attached on described grinding table, or pressurize to the back side of described grinding pad or reduce pressure being attached to by described grinding pad in the attaching operation on described grinding table, the back side of described grinding pad is the face of the opposition side of the abradant surface of described grinding pad.
In addition, can in the stripping process of described grinding pad, to the direction driven plunger at the back side of the described grinding pad of pushing, described piston is located in the hole in the attaching face of the described grinding pad of the attaching being formed at described grinding table.
The effect of invention
Adopt the present invention, easily can carry out the replacement operation of grinding pad, and grinding table can be suppressed to produce fire damage.
In addition, adopt the present invention, can realize the replacing of high-precision grinding pad, this replacing inhibits the impact on substrate nonferromagnetic substance.
Adopt the present invention, the impact on substrate nonferromagnetic substance can be suppressed, and the strip operation Labor-saving of grinding pad can be made.
Accompanying drawing explanation
Fig. 1 is the integrally-built diagram that pattern represents the lapping device of the 1st embodiment.
Fig. 2 is the diagram of the coherent condition representing grinding pad and grinding table.
Fig. 3 is the diagram representing the attaching operation of grinding pad and the handling process of grinding step.
Fig. 4 is the integrally-built diagram that pattern represents the lapping device of the 2nd embodiment.
Fig. 5 is the diagram that pattern represents grinding table periphery detailed construction.
Fig. 6 is the diagram of spread geometry one example representing the multiple holes be formed on grinding table.
Fig. 7 is the diagram of the handling process of the stripping process representing grinding pad.
Fig. 8 is the diagram that pattern represents the state of the stripping process of grinding pad.
Fig. 9 is the diagram of the handling process of the attaching operation representing grinding pad.
Figure 10 is the state diagram that pattern represents the attaching operation of grinding pad.
Figure 11 is the integrally-built diagram that pattern represents lapping device.
Figure 12 is the diagram that pattern represents the lapping device of the 3rd embodiment.
Figure 13 is the diagram of the detailed construction representing push part.
Figure 14 is the diagram of another example representing push part.
Figure 15 is the diagram that pattern represents the state of the stripping process of grinding pad.
Figure 16 is the diagram that pattern represents the lapping device of the 4th embodiment.
Figure 17 is the diagram that pattern represents the lapping device of the 5th embodiment.
Symbol description
100 lapping devices
102 substrates
108 grinding pads
108a abradant surface
The 108b back side
109 bonding planes
110 grinding tables
110a attaches face
111 layer of silicone
1100 lapping devices
1102 substrates
1107 air trappings
1108 grinding pads
1108a abradant surface
The 1108b back side
1109 terminations
1110 grinding tables
1110a attaches face
1110b attaches the face of the opposition side in face
1111 holes
1130 guidance panels
1140 control parts
1152 compressed-air lines
1154 vacuum pipelines
1159 circulation roads
1160 Revolving joints
1170 rotary type connectors
1182 pressure sensors
2100 lapping devices
2102 substrates
2108 grinding pads
The 2108b back side
2110 grinding tables
2110a attaches face
The 2110b back side
2111 holes
2152 compressed-air lines
2158-1,158-2 valve
2200 push part
2210 pistons
2210a bearing surface
2220 driver parts
2240 stop components
2240-a cylindrical portion
2240-b flange part
2250 backing plate parts
2260 working cylinders
2260a the 1st connected entrance
2260b the 2nd connected entrance
2262 the 1st spaces
2264 the 2nd spaces
2270 partition members
280 attaching parts
Detailed description of the invention
< the 1st embodiment >
Below, according to Figure of description, the lapping device of the 1st embodiment of the present invention and the replacing options of grinding pad are described.Embodiment below, is described CMP (cmp: ChemicalMechanical Polishing) lapping device as an example, but is not limited to this.
Fig. 1 is the integrally-built diagram that pattern represents the lapping device of the 1st embodiment.As shown in Figure 1, lapping device 100 has: grinding table 110, and the upper surface of this grinding table 110 can install the grinding pad 108 for the substrates such as grinding semiconductor chip 102; 1st motor the 112,1st motor, 112 pairs of grinding tables 110 carry out rotary actuation; Apical ring 116, this apical ring 116 can keep substrate 102; And the 2nd motor the 118,2nd motor 118 pairs of apical rings 116 carry out rotary actuation.
In addition, lapping device 100 has: stock line 120, and the grinding mill liquid containing grinding-material is supplied on the upper surface of grinding pad 108 by this stock line 120; And dressing tool unit 124, this dressing tool unit 124 has the dressing tool dish 122 grinding pad 108 being repaired to (file processing finishing).
When grinding base plate 102, the grinding mill liquid containing grinding-material is supplied to the upper surface of grinding pad 108 from stock line 120, carries out rotary actuation by the 1st motor 112 pairs of grinding tables 110.Then, under the state that the rotating shaft making apical ring 116 around the rotating shaft eccentric with grinding table 110 rotates, by the substrate 102 kept by apical ring 116 by being pressed on grinding pad 108.Thus, substrate 102 is polished pad 108 and grinds and planarized.
Then, the coherent condition of grinding pad 108 and grinding table 110 is described.Fig. 2 is the diagram of the coherent condition representing grinding pad and grinding table.As shown in Figure 2, in the present embodiment, on the back side 108b of the opposition side of the abradant surface 108a of grinding pad 108, the bonding plane 109 of the bonding agent containing grinding pad is formed.In addition, the attaching face 110a attached with grinding pad 108 in grinding table 110 is provided with layer of silicone 111.In other words, layer of silicone 111 is clipped between grinding table 110 and grinding pad 108, and bonding plane 109 is clipped between layer of silicone 111 and grinding pad 108.
Layer of silicone 111 can comprise the bonding agent containing silicone resin be coated on the attaching face 110a of grinding table 110.In this occasion, the bonding agent containing silicone resin, various methods such as available brushing, roller coat, injection application and atomized spray painting and being coated on the attaching face 110a of grinding table 110.
In addition, layer of silicone 111 also can comprise the adhesive sheet containing silicone resin be attached on the attaching face 110a of grinding table 110.
In addition, layer of silicone 111 can comprise pottery (such as ceramic powders) is blended in resinae coating in silicone, and this resinae coatings is on the attaching face 110a of grinding table 110.In this occasion, be mixed with the resinae coating of pottery in silicone, various methods such as available brushing, roller coat, injection application and atomized spray painting and being coated on the attaching face 110a of grinding table 110.By being blended in silicone by pottery, thus the hardness of layer of silicone 111 can be improved, improving the durability of layer of silicone 111.
In addition, grinding table 110 can comprise at least one in the materials such as carborundum (SiC), stainless steel (SUS), resin and aluminium oxide and be formed.
Then, the attaching operation of the grinding pad of present embodiment and grinding step are described.Fig. 3 is the diagram representing the attaching operation of grinding pad and the handling process of grinding step.Fig. 3 uses the occasion of silicone resin bonding agent to be described for the form of example to layer of silicone 111.
As shown in Figure 3, the surface (attaching face 110a) upper (step S101) that first silicone bonding agent is coated on grinding table 110 by operation is attached.Then, attach operation to heat-treat (step S102) the silicone bonding agent be coated on grinding table 110.This heat treatment, such as, be concentrated grinding table 110 and silicone bonding agent and apply the process of such as about 150 DEG C ~ about about 200 DEG C heats.Utilize this heat treatment, silicone bonding agent is just coated on the attaching face 110a of grinding table 110 well.
Then, attach on silicone bonding agent that grinding pad 108 attaches after heat treatment by operation (step S103).In addition, the back side 108b of grinding pad 108 is coated with bonding plane 109 in advance, in step s 103, the bonding plane 109 of grinding pad 108 is attached on silicone bonding agent.Thus, the attaching operation of grinding pad 108 is completed.
Then, grinding step makes grinding table 110 rotate by rotation the 1st motor 112 (step S104).Then, grinding step makes apical ring 116 rotate by rotation the 2nd motor 118 (step S105).
Then, the substrate 102 kept by apical ring 116 by being pressed on the abradant surface 108a of grinding pad 108, and to grind (step S106) the surface of substrate 102 by grinding step.Then, grinding step judges whether the grinding of substrate 102 terminates (step S107).The judgement whether grinding of substrate 102 terminates, can carry out according to the change of the such as torque current of the 1st motor 112 or the 2nd motor 118.
When grinding step judges that the grinding of substrate 102 does not terminate (no in step S107), then repeat milled processed until judge that grinding terminates.On the other hand, when grinding step judges that the grinding of substrate 102 terminates (being in step S107), then end process.
Above, adopt present embodiment, easily can carry out the replacement operation of grinding pad 108, and grinding table 110 can be suppressed to produce fire damage.
That is, present embodiment accompanies layer of silicone 111 between the attaching face 110a and grinding pad 108 (or bonding agent 109) of grinding table 110.Thus, for the direction orthogonal with attaching face 110a, grinding pad 108 (bonding agent 109) dies down for the cementability of grinding table 110.
Therefore, in the stripping process of such as grinding pad 108, when peeling off grinding pad 108 in the direction orthogonal with attaching face 110a, just can easily peel off grinding pad 108.In addition, by accompanying together with grinding table 110 is attached to grinding pad 108 by layer of silicone 111 ground, thus guarantee that the bonding force on the shear direction (direction along attaching face 110a) of grinding pad 108 is powerful.Its result, in the grinding of substrate 102, can suppress grinding pad 108 peel off or misplace.
In addition, in the attaching operation of grinding pad 108, even if produce air trapping between grinding table 110 and grinding pad 108, owing to can easily this grinding pad 108 be peeled off, therefore, can easily peel off grinding pad 108 for the time being and again again attach.
In addition, adopt present embodiment, owing to using layer of silicone 111, therefore, grinding table 110 can be suppressed to produce the fire damages such as distortion because of the heat treatment of layer of silicone 111.
That is, as comparative example, when fluorine-type resin layer is clipped in the occasion between grinding table and grinding pad, can expects in order to fluorine-type resin is coated on grinding table, and must heat-treat fluorine-type resin by such as 300 DEG C ~ 400 DEG C this higher temperature.When heat-treating by this higher temperature, forming the occasion of grinding table in the material lower with heat resisting temperatures such as such as resins, likely producing the fire damages such as the distortion of grinding table.
To this, adopt present embodiment, owing to being clipped between grinding table 110 and grinding pad 108 by layer of silicone 111, therefore, can heat-treat with such as about 150 DEG C ~ about 200 DEG C this lower temperature, this heat treatment is used for layer of silicone 111 to be coated on grinding table 110.Therefore, even form the occasion of grinding table 110 by the material that the heat resisting temperatures such as such as resin are lower, grinding table 110 also can be suppressed to produce the fire damages such as distortion because of heat treatment.In addition, adopt present embodiment, even heat-treat layer of silicone 111 by about 150 DEG C ~ about 200 DEG C this lower temperature, also can obtain and the peel strength (stripping easness) of by such as 300 DEG C ~ 400 DEG C this higher temperature, fluorine-type resin being heat-treated to identical grinding pad 108.
In addition, because layer of silicone 111 is excellent in drug resistance and heat resistance, therefore, the temperature also can tackling grinding table 110 from the temperature rising of the grinding mill liquid of stock line 120 supply and grinding in grinding rises.
In addition, the flatness of grinding table 110, although the milled processed performance that can have influence on substrate 102, this point, because layer of silicone 111 comparatively can be coated with such as about 10 ± 5 μm by unfertile land, therefore, can guarantee the flatness of grinding table 110.
In addition, in use, by pottery, the resinae coating be blended in silicone forms the occasion of layer of silicone 111, and by pottery being blended in the hardness that can improve layer of silicone 111 in silicone, its result, can improve the durability of layer of silicone 111.
< the 2nd embodiment >
Below, according to Figure of description, the lapping device of the 2nd embodiment of the present application and the replacing options of grinding pad are described.Embodiment below, as an example to CMP (cmp: ChemicalMechanical Polishing)) lapping device is described, but is not limited thereto.In addition, the lapping device of the 2nd embodiment and the replacing options of grinding pad, can combine with the above-mentioned lapping device of the 1st embodiment and the replacing options of grinding pad and implement.
Fig. 4 is the integrally-built diagram that pattern represents the lapping device of the 2nd embodiment.As shown in Figure 4, lapping device 1100 has: grinding table 1110, and the upper surface of this grinding table 1110 can install the grinding pad 1108 for the substrates such as grinding semiconductor chip 1102; 1st motor the 1112,1st motor, 1112 pairs of grinding tables 1110 carry out rotary actuation; Apical ring 1116, this apical ring 1116 can keep substrate 1102; And the 2nd motor the 1118,2nd motor 1118 pairs of apical rings 1116 carry out rotary actuation.
In addition, lapping device 1100 has: stock line 1120; Grinding mill liquid containing grinding-material is supplied on the upper surface of grinding pad 1108 by this stock line 1120; And dressing tool unit 1124, this dressing tool unit 1124 has the dressing tool dish 1122 grinding pad 1108 being repaired to (file processing finishing).
In addition, lapping device 1100 has: guidance panel 1130, this guidance panel 1130 for input about the replacing of grinding pad 1108 various operational order or export the various information of the replacing about grinding pad 1108; And control part 1140, this control part 1140 controls each part of lapping device 1100.Control part 1140 is the controllers pressurizeing for the back side of the opposition side of the abradant surface to the grinding pad 1108 be attached on grinding table 1110 or reduce pressure.Control part 1140 pressurizes to the back side of grinding pad 1108 in the stripping process peeling off grinding pad 1108 from grinding table 1110.In addition, control part 1140 pressurizes to the back side of grinding pad 1108 or reduces pressure being attached to by grinding pad 1108 in the attaching operation on grinding table 1110.For the concrete control mode of control part 1140 in rear statement.
In addition, lapping device 1100 has: Revolving joint 1160, and this Revolving joint 1160 is for the compressed-air line 1152 of fluid in lapping device 1100 and come in and go out between vacuum pipeline 1154 and grinding table 1110; And rotary type connector 1170, this rotary type connector 1170 for carrying out input/output signal between control part 1140 and grinding table 1110.Compressed-air line 1152 and vacuum pipeline 1154 are respectively equipped with pressure regulator 1156-1,1156-2 and each pipeline are carried out to pressurizing valve 1158-1, the absorption valve 1158-2 of opening and closing.Pressure regulator 1156-1 is that pressure regulator 1156-2 will be inhaled into the air-pressure controlling precedent of vacuum pipeline 1154 as the hand regulator of high pressure, low pressure etc. by the air-pressure controlling precedent injected by compressed-air line 1152 as the electropneumatic regulators of high pressure, low pressure etc.In addition, pressure regulator 1156-1 is not limited to electropneumatic regulators.In addition, pressure regulator 1156-2 is not limited to hand regulator.
When substrate 1102 is ground, the grinding mill liquid containing grinding-material is supplied to the upper surface of grinding pad 1108 from stock line 1120, utilizes the 1st motor 1112 pairs of grinding tables 1110 to carry out rotary actuation.Then, under the state making apical ring 1116 rotate around the rotating shaft with grinding table 1110 rotating shaft eccentric, by the substrate 1102 kept by apical ring 1116 by being pressed on grinding pad 1108.Thus, substrate 1102 is polished pad 1108 and grinds and planarized.
Fig. 5 is the diagram that pattern represents the detailed construction of grinding table periphery.As shown in Figure 5, grinding table 1110 is formed with multiple hole 1111, this hole 1111 is through is pasted with the attaching face 1110a of grinding pad 1108 and the face 1110b of the opposition side of attaching face 1110a.Hole 1111 is examples for the communication channel be communicated with the outside of grinding table 1110 by the back side 1108b of the opposition side of the abradant surface 1108a of grinding pad 1108.Communication channel is not limited to hole, is the structure be communicated with the outside of grinding table 1110 by the back side 1108b of grinding pad 1108.
In addition, as shown in Figure 5, the air (fluid) supplied by compressed-air line 1152, is opened, adsorbs the occasion of valve 1158-2 closedown, be injected into be formed in multiple holes 1111 of grinding table 1110 by communication channel 1159 at pressurizing valve 1158-1.On the other hand, in the occasion that pressurizing valve 1158-1 closedown, absorption valve 1158-open, air is absorbed into vacuum pipeline 1154 from multiple hole 1111 by circulation road 1159.
Control part 1140, in stripping process, pressurizes to the back side 1108b of grinding pad 1108 by fluid (air) is injected into the back side 1108b of grinding pad 1108 through hole 1111.In addition, control part 1140 is in attaching operation, by fluid (air) is injected into the back side 1108b of grinding pad 1108 through hole 1111, the back side 1108b of grinding pad 1108 is pressurizeed, or by fluid is absorbed from the back side 1108b of grinding pad 1108 through hole 1111, the back side 1108b (1108b side, the back side) of grinding pad 1108 is reduced pressure.In addition, the so-called back side 1108b to grinding pad 1108 reduces pressure, and is to reduce the pressure be applied on the 1108b of the back side.
On each circulation road 1159 that multiple hole 1111 and compressed-air line 1152 and vacuum pipeline 1154 are coupled together, be respectively equipped with pressure sensor 1182 and each circulation road 1159 carried out to the magnetic valve 1184 of opening and closing.The pressure detected by each pressure sensor 1182, is transfused to control part 1140 by rotary type connector 1170.In addition, each magnetic valve 1184 carries out opening and closing according to the control signal inputted through rotary type connector 1170 from control part 1140.
Below, the spread geometry in the multiple holes 1111 being formed at grinding table 1110 is described.Fig. 6 is the diagram of spread geometry one example representing the multiple holes being formed at grinding table.As shown in Fig. 6 (a), on grinding table 1110, multiple hole 1111 can be arranged in vortex shape from grinding table center to grinding table peripheral part.In addition, as shown in Fig. 6 (b), on grinding table 1110, multiple hole 1111 can be arranged in concentric circles.In addition, as shown in Fig. 6 (c), on grinding table 1110, multiple hole 1111 can be arranged in clathrate.
In addition, there is bonding agent at the backsize of grinding pad 1108, thus, grinding pad 1108 is attached on grinding table 1110.Herein, as shown in Fig. 6 (b), implement by the periphery in the hole 1111 to grinding table 1110 coating (non-adhesive agent) not attaching bonding agent, thus bonding agent can not be hindered the confining force of grinding pad 1108 thus can easily peel off grinding pad 1108.
Then, the stripping process of grinding pad 1108 is described.Fig. 7 is the diagram of the handling process of the stripping process representing grinding pad.Fig. 8 is the diagram that pattern represents the state of the stripping process of grinding pad.
As shown in Figure 7, in the stripping process of grinding pad 1108, first, the instruction of " pressurization " for peeling off grinding pad 1108 is sent from guidance panel.So Vavle switching signal is outputted to pressurizing valve 1158-1, absorption valve 1158-2 by control part 1140.Thus, pressurizing valve 1158-1, absorption valve 1158-2 are switched to " pressurization " pattern.Specifically, state that pressurizing valve 1158-1 is in " opening ", absorption valve 1158-2 is in "Off" state.
Control part 1140 couples of pressure regulator 1156-1 carry out pressure setting.Specifically, pressure regulator 1156-1 is set as " high pressure ".Herein, so-called high pressure is the pressure that grinding pad 1108 is stripped or is easily stripped.
Then, control part 1140 pairs of magnetic valves carry out open and close controlling.Such as, the order that control part 1140 the is programmed and multiple magnetic valves 1184 corresponding with multiple hole 1111 are set as " opening " state.
Specifically, control part 1140 is as shown in Fig. 8 (a), first, magnetic valve 1184 corresponding with the hole 1111 (the 1st hole 1111a in such as Fig. 6 (b)) of the circumference of grinding table 1110 in multiple magnetic valve 1184 is set as " opening " state.Thus, the magnetic valve 1184 of air via open mode is injected the back side 1108b of grinding pad 1108 and pressurizes to it by control part 1140.Its result, the circumference of grinding pad 1108 is stripped or easily peels off, and easily can make the termination 1109 for peeling off grinding pad 1108.
Under state in the hole 1111 of the circumference by air Injection grinding table 1110, be located at the pressure sensor 1182 on the circulation road 1159 after injecting air, the pressure this circulation road 1159 being namely injected with to the hole 1111 of air is measured.Control part 1140 according to the pressure measured by pressure sensor 1182, and judges the attaching state of grinding pad 1108.
Specifically, the pressure measured by pressure sensor 1182 if detect is lower than the threshold pressure preset, then control part 1140 is judged to be that the grinding pad 1108 of this part is stripped.That is, when injection air under the state be not stripped at grinding pad 1108, the pressure in hole 1111 just rises, and when grinding pad 1108 is peeled off, then air is released, pressure drop.If control part 1140 is judged as that grinding pad 1108 is stripped, then magnetic valve 1184 corresponding for the hole 1111 with pressure drop is set as "Off" state.
Like this, by pressurizeing in the hole 1111 of air Injection grinding table 1110 circumference to the back side of grinding pad 1108, thus as shown in Fig. 8 (b), operator can catch termination 1109 and peel off grinding pad 1108.
After having made termination 1109, grinding pad 1108 is peeled off by available hand, but in this example, is described further to the occasion of up-stripping grinding pad 1108.Occasion in implementation program, the magnetic valve 1184 corresponding to other holes 1111 (such as Fig. 6 (b) the 2nd hole 1111b) adjacent with the hole 1111 (the 1st hole 1111a of such as Fig. 6 (b)) injecting air is at first opened and injects air by control part 1140.
Like this, as shown in Fig. 8 (c), by the pressurization to grinding pad 1108 back side 1108b caused by air Injection, thus grinding pad 1108 is stripped, or is easily stripped, and therefore, grinding pad 1108 can easily be peeled off by operator.
For other holes 1111 being injected with air, also in the same manner as described above the pressure in hole 1111 is measured, if detect pressure drop, then the magnetic valve 1184 corresponding with this hole 1111 cuts out, more also identical process is carried out to other adjacent holes 1111.As shown in Fig. 8 (d), (e), by the pressurization of the strip operation and adjacent holes 1111 that repeatedly carry out grinding pad 1108, thus can easily peel off grinding pad 1108.In addition, control part 1140 such as can inject air from the hole 1111 of grinding state 1110 circumference to adjacent hole 1111 successively.In addition, as additive method, also can to porosely inject air, and from detecting that the magnetic valve corresponding with this hole is closed in the hole of pressure drop successively with identical pressure.
Peeling off whole grinding pads 1108 when completing, just being sent the instruction of the stripping " end " of grinding pad by guidance panel 1130.So control part 1140 determining program terminates, and Vavle switching signal is outputted to pressurizing valve 1158-1.Thus, pressurizing valve 1158-1 becomes "Off" state, and the stripping process of grinding pad 1108 terminates.
Below, the attaching operation of grinding pad 1108 is described.Fig. 9 is the diagram of the handling process of the attaching operation representing grinding pad.Figure 10 is the diagram that pattern represents the state of the attaching operation of grinding pad.
First, carry out attaching by operator to grinding pad 1108 to operate.It is the operation be attached to successively by the bonding plane at grinding pad 1108 back side by the hand of operator as shown in Figure 10 (a) on grinding table 1110.
The attaching of grinding pad 1108 sends the instruction of " absorption " of grinding pad 1108 after operating and terminating from guidance panel 1130.Like this, Vavle switching signal is outputted to pressurizing valve 1158-1, absorption valve 1158-2 by control part 1140.Thus, pressurizing valve 1158-1, absorption valve 1158-2 are switched to " absorption " pattern.Specifically, pressurizing valve 1158-1 is in "Off" state, and absorption valve 1158-2 is in " opening " state.
Then, control part 1140 pairs of magnetic valves carry out open and close controlling.Specifically, the whole magnetic valves 1184 corresponding with multiple hole 1111 are set as " opening " state by control part 1140.Thus, all well 1111 being formed at grinding table 1110 absorbs air.
Its result, as shown in Figure 10 (b), if when carrying out attaching operation to grinding pad 1108, even if produce air trapping 1107 between the back side 1108b and the attaching face 1110a of grinding table 1110 of grinding pad 1108, also, as shown in Figure 10 (c), can air be absorbed from this air trapping 1107 thus air trapping 1107 be removed.In addition, here showing the example absorbing air from all well 1111, but be not limited thereto.Such as, at least one hole 1111 corresponding with the position producing air trapping 1107 also can be made to absorb air.
After the absorption of air trapping 1107 terminates, the whole magnetic valves 1184 corresponding with multiple hole 1111 are set as "Off" state by control part 1140 for the time being.Then, Vavle switching signal outputs to and absorbs valve 1158-2 by control part 1140.Thus, adsorb valve 1158-2 and be switched to " pressurization " pattern.Specifically, adsorb valve 1158-2 and become "Off" state.
Then, control part 1140 couples of pressure regulator 1156-1 carry out pressure setting.Specifically, pressure regulator 1156-1 is set to " low pressure " state.Herein, so-called low pressure is that grinding pad 1108 is unstripped or be not easy the pressure of extent of exfoliation.Why being set to " low pressure " by pressure regulator 1156-1, is can peel off or easily peel off because of the grinding pad 1108 normally attached at high pressure conditions.
Then, Vavle switching signal is outputted to pressurizing valve 1158-1 by control part 1140.Thus, pressurizing valve 1158-1 is switched to " pressurization " pattern.Specifically, pressurizing valve 1158-1 becomes " opening " state.
Then, the whole magnetic valves 1184 corresponding with multiple hole 1111 are set as " opening " state by control part 1140.Thus, as shown in Figure 10 (d), from the back side 1108b injection air of all well 1111 to grinding pad 1108 being formed at grinding table 1110.
Under the state being injected with air in all well 1111 of grinding table 1110, the pressure that pressure sensor 1182 convection channel 1159 be located on circulation road 1159 is namely injected with the hole 1111 of air is measured.Control part 1140, according to the pressure measured by pressure sensor 1182, judges the attaching state of grinding pad 1108.
Specifically, if control part 1140 detects that the pressure measured by pressure sensor 1182 is lower than the threshold pressure preset, if or check out that the pressure rise time measured is greater than the threshold time preset, then judge that a part of grinding pad 1108 is stripped or produces air trapping etc., the attaching state of grinding pad is abnormal.
That is, when grinding pad 1108 is peeled off, even if inject air, pressure does not also rise, and when generation air trapping 1107, then, compared with not producing the state of air trapping 1107, pressure increase institute's time spent is elongated.Control part 1140 is judging that the attaching state of grinding pad 1108 is abnormal occasion, and the attaching just showing grinding pad 1108 on guidance panel 1130 is the meaning of "abnormal".
On the other hand, judge that the attaching state of grinding pad 1108 is normal occasion at control part 1140, then the attaching showing grinding pad 1108 on guidance panel 1130 is the meaning of " normally ".Further, the whole magnetic valves 1184 corresponding with multiple hole 1111 are set as "Off" state by control part 1140.
Thus, if be pasted with abnormal occasion at grinding pad 1108, this situation can be noticed immediately by the commitment after attaching operation.
In addition, in the present embodiment, owing to being respectively equipped with pressure sensor 1182 to all multiple holes 1111, therefore, when the attaching state of grinding pad 1108 has abnormal, can determine which position creates exception.But pressure sensor 1182 can not be arrange respectively each hole 1111, and adjustable proper number, such as a pressure sensor 1182 is arranged to two holes 1111, or a pressure sensor 1182 etc. is arranged to four holes 1111.In addition, also can a pressure sensor 1182 be set for whole holes 1111.In addition, in the present embodiment, although exemplified with the example of the attaching state by judging grinding pad 1108 in multiple holes 1111 whole for air Injection, be not limited thereto, also air can be injected to judge the attaching state of the grinding pad 1108 at this position at least one hole 1111.In addition, in the present embodiment, although exemplified with multiple holes 1111 example that is connected with each hole 1111 of through grinding state 1110 and circulation road 1195 respectively, but be not limited to this, such as, also multiple hole 1111 can be concentrated in grinding table 1110 and be one and make its opening in the rear side of grinding table 1110, it is connected with a circulation road 1195.
Then, when being sent attaching " end " instruction of grinding pad by guidance panel 1130, Vavle switching signal is outputted to pressurizing valve 1158-1 by control part 1140.Thus, pressurizing valve 1158-1 becomes "Off" state, and the attaching operation of grinding pad 1108 terminates.
As mentioned above, adopt present embodiment, in the stripping process of grinding pad 1108, owing to pressurizeing to the back side 1108b of grinding pad 1108, therefore, the nonferromagnetic substance of substrate can not be affected, and can easily peel off grinding pad 1108.In addition, adopt present embodiment, in the attaching operation of grinding pad 1108, owing to reducing pressure to the back side 1108b of grinding pad 1108, therefore, even if produce air trapping 1107 on grinding pad 1108, also this air trapping 1107 of Absorbable rod and being removed.In addition, adopt present embodiment, in the attaching operation of grinding pad 1108, by pressurizeing to the back side 1108b of grinding pad 1108, monitoring pressure rise time and distribution, thus the attaching state such as floating, stripping of grinding pad 1108 can be judged.Its result, adopts present embodiment, can realize the replacing of high-precision grinding pad 1108, and the replacing of this grinding pad 1108 suppresses the impact on substrate nonferromagnetic substance.
< 3rd ~ 5 embodiment >
Below, according to Figure of description, the lapping device of 3rd ~ 5 embodiments of the present application and the stripping means of grinding pad are described.Embodiment below, as an example to CMP (cmp: ChemicalMechanical Polishing)) lapping device is described, but is not limited to this.In addition, the lapping device of 3rd ~ 5 embodiments and the stripping means of grinding pad, can combine with the above-mentioned lapping device of the 1st embodiment and the replacing options of grinding pad and implement.
< the 3rd embodiment >
Figure 11 is the integrally-built diagram that pattern represents lapping device.As shown in figure 11, lapping device 2100 has: grinding table 2110, and the upper surface of this grinding table 2110 can install the grinding pad 2108 for the substrates such as grinding semiconductor chip 2102; 1st motor the 2112,1st motor, 2112 pairs of grinding tables 2110 carry out rotary actuation; Apical ring 2116, this apical ring 2116 can keep substrate 2102; And the 2nd motor the 2118,2nd motor 2118 pairs of apical rings 2116 carry out rotary actuation.
In addition, lapping device 2100 has: stock line 2120, and the grinding mill liquid containing grinding-material is supplied on the upper surface of grinding pad 2108 by this stock line 2120; And dressing tool unit 2124, this dressing tool unit 2124 has the dressing tool dish 2122 grinding pad 2108 being repaired to (file processing finishing).
In addition, lapping device 2100 has: guidance panel 2130, and this guidance panel 2130 is for the various operational order inputted about peeling off grinding pad 2108 and the various information exported about stripping grinding pad 2108; And control part 2140, this control part 2140 controls each parts of lapping device 2100.
Control part 2140 be for by grinding pad 2108 from the stripping process that grinding table 2110 is peeled off, to the controller that the back side 2108b of the opposition side of grinding pad 2108 abradant surface be attached on grinding table 2110 pushes.
In addition, lapping device 2100 has the Revolving joint 2160,2170 for carrying out coming in and going out between the compressed-air line 2152 of fluid in lapping device 2100 and push part described later 2200.Compressed-air line 2152 branches into compressed-air line 2152-1,2152-2 of dual system.Compressed-air line 2152-1,2152-2 are connected with Revolving joint 2160,2170 respectively.Compressed-air line 2152 is provided with pressure regulator 2156.Compressed-air line 2152-1,2152-2 are respectively equipped with valve 2158-1,2158-2 of pipeline being carried out to opening and closing.Pressure regulator 2156 is as the electropneumatic regulators of high pressure, low pressure etc. by the air-pressure controlling precedent injected from compressed-air line 2152.In addition, pressure regulator 2156 is not limited to electropneumatic regulators.
When grinding base plate 2102, the grinding mill liquid containing grinding-material is supplied to the upper surface of grinding pad 2108 from stock line 2120, carries out rotary actuation by the 1st motor 2112 pairs of grinding tables 2110.Then, under the state that apical ring 2116 is rotated around the rotating shaft with grinding table 2110 rotating shaft eccentric, by the substrate 2102 kept by apical ring 2116 by being pressed on grinding pad 2108.Thus, substrate 2102 is polished pad 2108 and grinds and planarized.
Figure 12 is the diagram that pattern represents the lapping device of the 3rd embodiment.Figure 13 is the diagram of the detailed construction representing push part.As shown in Figure 12 and Figure 13, the attaching face 2110a attaching grinding pad 2108 at grinding table 2110 forms porose 2111.Specifically, grinding table 2110 is formed with the hole (communication channel) 2111 be communicated with the face (being the back side 2110b of grinding table 2110 in the present embodiment) attached beyond the 2110a of face by the attaching face 2110a attaching grinding pad 2108.
In addition, be provided with push part 2200 in the rear side of grinding table 2110, grinding pad 2108 is pushing the back side 2108b of the opposition side of the abradant surface of grinding pad 2108 by this push part 2200 from the stripping process that grinding table 2110 is peeled off.
Push part 2200 has: be located at the piston 2210 in hole 2111 and driver part 2220, and this driver part 2220 can to the direction driven plunger 2210 of the back side 2108b of pushing grinding pad 2108 in stripping process.Driver part 2220 is accommodated in framework 2230, and framework 2230 is arranged on the rear side of grinding table 2110.Piston 2210 has when stripping process the pressing surface 2210a that the back side 2108b of grinding pad 2108 pushes.
In addition, push part 2200 has stop component 2240, when piston 2210 is mobile to the direction (piston 2210 leaves the direction of the back side 2108b of grinding pad 2108) of the back side 2110b towards grinding table 2110, the movement of stop component 2240 limited piston 2210.Specifically, stop component 2240 has: the flange part 2240-b that cylindrical portion 2240-a and the square end portion from cylindrical portion 2240-a stretch out outward.
In addition, push part 2200 has the backing plate parts 2250 adjusted the position of stop component 2240, under the state that the movement of piston 2210 is stopped parts 2240 restriction, backing plate parts 2250 make the attaching face 2110a of the pressing surface 2210a of piston 2210 and grinding table 2110 be in same.
Specifically, backing plate parts 2250 are formed as discoideus, are formed porose in the central authorities of plectane.The opposing party end of the cylindrical portion 2240-a of stop component 2240 is via the hole of backing plate parts 2250 in patchhole 2111, and flange part 2240-b utilizes screw 242 to be fixed on the back side 2110b of grinding table 2110 via backing plate parts 2250, stop component 2240 is arranged on grinding table 2110 thus.
When piston 2210 moves to the direction of the back side 2110b towards grinding table 2110, piston 2210 is by the opposing party's end abutment with cylindrical portion 2240-a thus be mobilely limited.Push part 2200 by the thickness of spacer plate member 2250, thus under the state that can be stopped parts 2240 restriction in the movement of piston 2210, makes the attaching face 2110a of the pressing surface 2210a of piston 2210 and grinding table 2110 be in same.
Driver part 2220 has: working cylinder 2260, and this working cylinder 2260 is formed can the 1st and the 2nd connected entrance 2260a, 2260b of inflow and outflow fluid (air etc.); And partition member 2270.Partition member 2270 is the parts being separated out the 1st space 2262 and the 2nd space 2264, and the 1st space 2262 is communicated with the 1st connected entrance 2260a in working cylinder 2260, and the 2nd space 2264 is communicated with the 2nd connected entrance 2260b in working cylinder 2260.In addition, driver part 2220 has the attaching parts 2280 partition member 2270 and piston 2210 coupled together.
Driver part 2220 comprises fluid operating cylinder, and this fluid operating cylinder utilizes fluid-phase for the inflow and outflow of the 1st and the 2nd connected entrance 2260a, 2260b, piston 2210 to be driven to it to direction that is close with the back side 2108b of grinding pad 2108, that be separated.But driver part 2220 is not limited to fluid operating cylinder, as long as can drive to the direction of the back side 2108b of pushing grinding pad 2108 piston in stripping process.In addition, in the present embodiment, although exemplified with example lapping device 2100 being arranged to a push part 2200, be not limited to this, multiple push part 2200 also can be set.
In addition, in Figure 12,13, although be located at the example of the outside of grinding table 2110 exemplified with working cylinder 2260, be not limited to this.Figure 14 is the diagram of another example representing push part.As shown in figure 14, working cylinder 2260 also can be formed by the part in the hole 2111 being formed at grinding table 2110.Like this, due in the rear side mounting frame 2230 of grinding table 2110, therefore, push part 2200 can need not be formed compactly.
In addition, as shown in figure 12, compressed-air line 2152-1,2152-2 are connected with the 1st and the 2nd connected entrance 2260a, 2260b respectively by Revolving joint 2160,2170.On compressed-air line 2152-1, be provided with the speed control valve 2182 for adjusting speed when piston 2210 rises.In addition, on compressed-air line 2152-2, be provided with the speed control valve 2184 for adjusting speed when piston 2210 declines and the speed control valve 2186 for preventing piston 2210 from flying out suddenly from grinding table.
Then, the action of the push part 2200 in the stripping process of grinding pad 2108 is described.Figure 15 is the diagram that pattern represents the stripping process state of grinding pad.The diagram of the state of the push part 2200 when the upper figure of Figure 15 is the usual use representing non-peel-away operation, figure below of Figure 15 is the diagram of the state of the push part 2200 represented in stripping process.
When usually using, as shown in the upper figure of Figure 15, by making the compressed air line 2152-1 of air flow into from the 1st connected entrance 2260a, thus piston 2210 is pressurizeed downwards.Specifically, state that valve 2158-1 is controlled to by control part 2140 " opening (air feed) ", is controlled to " closing (exhaust) " state by valve 2158-2.Thus, because partition member 2270 is pushed down below, therefore, piston 2210 links with the action of partition member 2270 and is also pushed down below.The piston 2210 being pushed down below forms the state abutted with stop component 2240.
On the other hand, in stripping process, as shown in figure below of Figure 15, by making the compressed air line 2152-2 of air flow into from the 1st communication port 2260, thus piston 2210 is pressurizeed upward.Specifically, state that valve 2158-1 is controlled to by control part 2140 " closing (exhaust) ", is controlled to " opening (air feed) " state by valve 2158-2.Thus, because partition member 2270 is pushed top, therefore, piston 2210 links with the action of partition member 2270 and is also pushed top.The back side 2108b being pushed piston 2210 pairs of grinding pads 2108 of top pushes thus peels off grinding pad 2108.
Adopt present embodiment, the impact of the nonferromagnetic substance on substrate 2102 can be suppressed, and the strip operation Labor-saving of grinding pad 2108 can be made.That is, adopt present embodiment, then as shown in figure below of Figure 15, due to the strip operation utilizing the pushing force of piston 2210 to carry out assisted milling pad 2108, therefore, can easily grinding pad 2108 be peeled off.In addition, in the present embodiment, the termination of exposing from grinding table need not be pre-formed or use takeup type fixture to be peeled off by grinding pad on grinding pad.Its result, can suppress the impact of the nonferromagnetic substance on substrate 2102, and can make the strip operation Labor-saving of grinding pad 2108.
< the 4th embodiment >
Then, the lapping device of the 4th embodiment is described.Figure 16 is the diagram that pattern represents the lapping device of the 4th embodiment.The difference of the 4th embodiment and the 3rd embodiment is, will be used for the control signal of control valve 2158-1,2158-2 opening and closing, is input to valve 2158-1,2158-2 by rotary type connector.For the part identical with the 3rd embodiment, omit the description.
As shown in figure 16, compressed-air line 2152 is transfused to Revolving joint 2160, after Revolving joint 2160, branches into compressed-air line 2152-1,2152-2 of dual system.Compressed-air line 2152-1,2152-2 arrange valve 2158-1,2158-2 respectively that pipeline is carried out to opening and closing.
On the other hand, transmit the control signal pipeline 2192 of the control signal of the opening and closing being used for control valve 2158-1,2158-2, be transfused to rotary type connector 2190, and be connected with valve 2158-1,2158-2 by rotary type connector 2190.
When usually using lapping device 2100, state that valve 2158-1 is controlled to by control part 2140 " opening (air feed) ", is controlled to " closing (exhaust) " state by valve 2158-2.Thus, because partition member 2270 is pushed down below, therefore, piston 2210 links with the action of partition member 2270 and is also pushed down below.The piston 2210 being pushed down below forms the state abutted with stop component 2240.
On the other hand, in stripping process, state that valve 2158-1 is controlled to by control part 2140 " closing (exhaust) ", is controlled to " opening (air feed) " state by valve 2158-2.Thus, because partition member 2270 is pushed top, therefore, piston 2210 links with the action of partition member 2270 and is also pushed top.The back side 2108b being pushed piston 2210 pairs of grinding pads 2108 of top pushes thus peels off grinding pad 2108.
Adopt present embodiment, identical with the 3rd embodiment, the impact of the nonferromagnetic substance on substrate 2102 can be suppressed, and the strip operation Labor-saving of grinding pad 2108 can be made.That is, adopt the 4th embodiment, when stripping process, due to the strip operation utilizing the pushing force of piston 2210 to carry out assisted milling pad 2108, therefore, can easily grinding pad 2108 be peeled off.In addition, in the present embodiment, the termination of exposing from grinding table need not be pre-formed or use takeup type fixture to be peeled off by grinding pad on grinding pad.Its result, can suppress the impact of the nonferromagnetic substance on substrate 2102, and can make the strip operation Labor-saving of grinding pad 2108.
< the 5th embodiment >
Then, the lapping device of the 5th embodiment is described.Figure 17 is the diagram that pattern represents the lapping device of the 5th embodiment.At every turn 5th embodiment and the 3rd and the 4th embodiment difference carry out stripping process, all uses at the upper grinding pad stripping fixture of installing of lapping device 2100 (push part 2200).For the part that the 3rd and the 4th embodiment is identical, omit the description.
As shown in figure 17, grinding pad stripping fixture 2300 has: the compressed air connecting interface 2302 be connected with the compressed-air actuated supply source being located at lapping device 2100 outside; And to compressed-air line 2304-1,2304-2 that the compressed air supplied by compressed air connecting interface 2302 is carried.
Compressed-air line 2304-1 is provided with: to compressed-air line 2304-1 carry out opening and closing valve 2306 and for rising to piston 2210 time the speed control valve 2312 that adjusts of speed.In addition, compressed-air line 2304-2 is provided with: to compressed-air line 2304-2 carry out opening and closing valve 2308, for declining to piston 2210 time the speed control valve 2314 that adjusts of speed and speed control valve 2316 for preventing piston 2210 from flying out suddenly from grinding table.
In addition, on working cylinder 2260, be connected with the fixture connecting interface 2322 be communicated with the 1st space 2262 and the fixture connecting interface 2324 be communicated with the 2nd space 2264.When carrying out stripping process to grinding pad 2108, by the operation of operator, the grinding pad stripping compressed-air line 2304-1 of fixture 2300 is connected with fixture connecting interface 2322, and compressed-air line 2304-2 is connected with fixture connecting interface 2324.
When usually using lapping device 2100, valve 2306 is controlled to " opening " state by control part 2140, and valve 2308 is controlled to "Off" state.Thus, because partition member 2270 is pushed down below, therefore, piston 2210 links with the action of partition member 2270 and is also pushed down below.The piston 2210 being pushed down below forms the state abutted with stop component 2240.
On the other hand, in stripping process, valve 2306 is controlled to "Off" state by control part 2140, valve 2308 is controlled to " opening " state.Thus, because partition member 2270 is pushed top, therefore, piston 2210 links with the action of partition member 2270 and is also pushed top.The back side 2108b being pushed piston 2210 pairs of grinding pads 2108 of top pushes thus peels off grinding pad 2108.
Adopt present embodiment, identical with the 3rd embodiment, the impact of the nonferromagnetic substance on substrate 2102 can be suppressed, and the strip operation Labor-saving of grinding pad 2108 can be made.That is, adopt the 5th embodiment, when stripping process, due to the strip operation utilizing the pushing force of piston 2210 to carry out assisted milling pad 2108, therefore, can easily grinding pad 2108 be peeled off.In addition, in the present embodiment, the termination of exposing from grinding table need not be pre-formed or use takeup type fixture to be peeled off by grinding pad on grinding pad.Its result, can suppress the impact on substrate 2102 nonferromagnetic substance, and can make the strip operation Labor-saving of grinding pad 2108.
Claims (10)
1. a lapping device, is characterized in that, has:
Grinding table, this grinding table has the attaching face attached for the grinding pad of grinding base plate; And
Layer of silicone, this layer of silicone is located on the attaching face of described grinding table, and is clipped between described grinding table and described grinding pad.
2. lapping device as claimed in claim 1, is characterized in that, described layer of silicone comprises the bonding agent containing silicone resin be coated on described attaching face or the adhesive sheet containing silicone resin be attached on described attaching face.
3. lapping device as claimed in claim 1 or 2, it is characterized in that, described layer of silicone comprises the resinae coating be blended in by pottery in silicone be coated on described attaching face.
4. lapping device as claimed any one in claims 1 to 3, it is characterized in that, described grinding table comprises at least one in carborundum, stainless steel, resin and aluminium oxide and is formed.
5. the lapping device according to any one of Claims 1-4, is characterized in that, also has the bonding agent of grinding pad, and the bonding agent of this grinding pad is clipped between described layer of silicone and described grinding pad.
6. the lapping device according to any one of claim 1 to 5, it is characterized in that also having control part, pressurizes or reduces pressure in the back side of this control part to the grinding pad be attached on described grinding table, the back side of described grinding pad is the face of the opposition side of the abradant surface of described grinding pad
Described control part, in the stripping process peeling off described grinding pad from described grinding table, pressurizeed in the back side of described grinding pad, or pressurizeed or reduced pressure in the back side of described grinding pad described grinding pad being attached in the attaching operation on described grinding table.
7. the lapping device according to any one of claim 1 to 6, it is characterized in that, also there is push part, this push part by described grinding pad from the stripping process that described grinding table is peeled off, the back side of described grinding pad is pushed, the back side of described grinding pad is the face of the opposition side of the abradant surface of described grinding pad
Described push part has:
Piston, this piston is located in the hole in the attaching face of the described grinding pad of the attaching being formed at described grinding table; And
Driver part, this driver part, in described stripping process, can drive described piston to the direction at the back side of the described grinding pad of pushing.
8. an attaching method for grinding pad, is characterized in that, the described attaching face of grinding table with attaching face is provided with layer of silicone, and described attaching face attaches the grinding pad being used for grinding base plate,
The layer of silicone be located on described attaching face is heat-treated,
Described grinding pad is attached to and has carried out in described heat treated layer of silicone.
9. a replacing options for grinding pad, is characterized in that, the attaching method of the grinding pad of claim 8 or by described grinding pad from the method that described grinding table is peeled off,
By described grinding pad from the stripping process that described grinding table is peeled off, pressurizeed in the back side of the grinding pad be attached on described grinding table, or pressurize to the back side of described grinding pad or reduce pressure being attached to by described grinding pad in the attaching operation on described grinding table, the back side of described grinding pad is the face of the opposition side of the abradant surface of described grinding pad.
10. the replacing options of grinding pad as claimed in claim 9, is characterized in that,
In the stripping process of described grinding pad, to the direction driven plunger at the back side of the described grinding pad of pushing, described piston is located in the hole in the attaching face of the described grinding pad of the attaching being formed at described grinding table.
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013016876A JP2014147985A (en) | 2013-01-31 | 2013-01-31 | Grinding device, and method of replacing grinding pad |
| JP2013-016876 | 2013-01-31 | ||
| JP2013-024425 | 2013-02-12 | ||
| JP2013024425 | 2013-02-12 | ||
| JP2013-091617 | 2013-04-24 | ||
| JP2013091617A JP2014176950A (en) | 2013-02-12 | 2013-04-24 | Polishing device and polishing pad bonding method |
| JP2013172189A JP2015039743A (en) | 2013-08-22 | 2013-08-22 | Polishing device, and polishing pad peeling method |
| JP2013-172189 | 2013-08-22 | ||
| PCT/JP2014/051905 WO2014119598A1 (en) | 2013-01-31 | 2014-01-29 | Polishing device, method for applying polishing pad, and method for replacing polishing pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104968472A true CN104968472A (en) | 2015-10-07 |
Family
ID=52113191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480000553.5A Pending CN104968472A (en) | 2013-01-31 | 2014-01-29 | Polishing device, method for applying polishing pad, and method for replacing polishing pad |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20150118944A1 (en) |
| KR (1) | KR20150114382A (en) |
| CN (1) | CN104968472A (en) |
| TW (1) | TWI607499B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106078493A (en) * | 2016-06-23 | 2016-11-09 | 上海汉虹精密机械有限公司 | The method of ceramic disk grinding wheel twin grinding processing sapphire wafer |
| CN111032283A (en) * | 2017-08-21 | 2020-04-17 | 株式会社荏原制作所 | Substrate polishing apparatus and polishing liquid discharge method for substrate polishing apparatus |
| CN112476228A (en) * | 2019-08-23 | 2021-03-12 | 台湾积体电路制造股份有限公司 | Method for operating chemical mechanical planarization tool |
| CN113382824A (en) * | 2019-03-20 | 2021-09-10 | 丸石产业株式会社 | Polishing apparatus platen, polishing apparatus, and polishing method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6259366B2 (en) * | 2014-07-09 | 2018-01-10 | 株式会社荏原製作所 | Polishing equipment |
| JP6585445B2 (en) * | 2015-09-28 | 2019-10-02 | 株式会社荏原製作所 | Polishing method |
| JP6883475B2 (en) | 2017-06-06 | 2021-06-09 | 株式会社荏原製作所 | Polishing table and polishing equipment equipped with it |
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| CN106078493A (en) * | 2016-06-23 | 2016-11-09 | 上海汉虹精密机械有限公司 | The method of ceramic disk grinding wheel twin grinding processing sapphire wafer |
| CN111032283A (en) * | 2017-08-21 | 2020-04-17 | 株式会社荏原制作所 | Substrate polishing apparatus and polishing liquid discharge method for substrate polishing apparatus |
| KR20200043396A (en) * | 2017-08-21 | 2020-04-27 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate polishing apparatus and method for discharging polishing liquid from substrate polishing apparatus |
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| CN112476228A (en) * | 2019-08-23 | 2021-03-12 | 台湾积体电路制造股份有限公司 | Method for operating chemical mechanical planarization tool |
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| US11712778B2 (en) | 2019-08-23 | 2023-08-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chemical mechanical planarization tool |
Also Published As
| Publication number | Publication date |
|---|---|
| US20150118944A1 (en) | 2015-04-30 |
| TWI607499B (en) | 2017-12-01 |
| KR20150114382A (en) | 2015-10-12 |
| TW201436939A (en) | 2014-10-01 |
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