CN104968146A

CN104968146A - Circuit board with chip resistor devices

Info

Publication number: CN104968146A
Application number: CN201510372220.1A
Authority: CN
Inventors: 沈春蓝
Original assignee: Chongqing Xiaolan Electric Appliance Co Ltd
Current assignee: Chongqing Xiaolan Electric Appliance Co Ltd
Priority date: 2015-06-30
Filing date: 2015-06-30
Publication date: 2015-10-07

Abstract

The invention discloses a circuit board with chip resistor devices. The circuit board and a number of chip resistor devices which are electrically connected with the circuit board are comprised. A copper foil is arranged in a non-routing area of the circuit board. Two copper foils are laid on the back of the circuit board. A polyurethane hot melt glue deformation resistance layer is adhered between two copper foils. Each chip resistor device comprises a substrate body and a number of chip resistors which are formed on the substrate body with spacing. Each substrate body comprises a base face adjacent to the circuit board, and a top face opposite to the base face, and a side which connects the base face and the top face. Each chip resistor comprises an electrode group made of a conductive material and a resistor layer with a predetermined resistance value. Each electrode group comprises a base face formed on a substrate body and first and second contact electrodes which are spaced apart. The circuit board with the chip resistor devices can be prevented from collision and is not easy to deformation.

Description

With the circuit board of chip resistor

Technical field

The invention relates to a kind of circuit board, refer to a kind of circuit board with chip resistor especially.

Background technology

As shown in Figure 1, be the generalized section of the existing circuit board with chip resistor, comprise the chip resistor 2 (only showing 1 in Fig. 1) that a circuit board 1 and plural number and described circuit board 1 are electrically connected.

Each chip resistor 2 described comprises one and is made up of insulating material, and generally becomes microscler substrate body 21 and plural number and compartment of terrain to be formed at the plate resistor 22 of described substrate body 21.

With aforesaid plate resistor 22; first and second extension electrode 226,227 of described plate resistor 22 usually can be made to be damaged because of collision; cause the open circuit of described electrode group 221, circuit cannot be communicated with through described resistive layer 222, causes described plate resistor 22 to lose due effect.

Although there is manufacturer to propose to add electrode group 221 described in last layer protective coating enhanced protection on described electrode group 221 surface at present, but easily because collision causes the damage of first and second extension electrode 226,227 described, cannot deal with problems veritably.

And ultrathin circuit board ubiquity holds yielding problem.

Summary of the invention

Problem to be solved by this invention provide a kind of can collision free and the on-deformable circuit board with chip resistor.

For solving the problems of the technologies described above, the present invention, with the circuit board of chip resistor, comprises a circuit board and the plural chip resistor be electrically connected with described circuit board;

Non-routing region place on described circuit board is provided with Copper Foil, and the back side of circuit board is equipped with two-layer Copper Foil, is stained with the resistance to deformation layer of one deck by polyurethane hot melt between two-layer Copper Foil;

Each chip resistor comprises the plate resistor that a substrate body and plural compartment of terrain are formed at described substrate body;

Described substrate body has the basal plane, of a contiguous described circuit board in contrast to the end face of described basal plane, and the side that connects described basal plane and described end face;

Each plate resistor has an electrode group be made up of conductive material and by the resistive layer with predetermined resistance;

Described electrode group has the basal plane and be spaced one first and second contact electrode that are formed at described substrate body;

Described resistive layer respectively corresponding described electrode group be arranged at described basal plane and with corresponding described in first and second contact electrode be electrically connected, and described plate resistor is electrically connected by first and second contact electrode described with described circuit board.

By two-layer Copper Foil and one deck resistance to deformation glue, achieve the three-layer protection to wiring board, effectively prevent the distortion of circuit board.

Because each plate resistor described utilizes described first, two contact electrodes are electrically connected with described circuit board, therefore, during start, the electric current produced from described circuit board only must utilize described first, the loop that two contact electrodes and resistive layer are formed gets final product conducting, be different from and existingly must utilize first, two back electrode blocks, first, two extension electrodes, and the complete loops that resistive layer is formed can conducting, therefore avoid existing actually in the described chip resistor that waits is assembled in the process of described circuit board, usually can make first of described plate resistor because of collision, two extension electrodes are damaged, make the open circuit of described electrode group, cause circuit cannot be communicated with through described resistive layer, described chip resistor is caused to lose the problem of due function.

Effect of the present invention is: the compound mode proposing a kind of chip resistor and circuit board, simplifies current circuit, and the damage providing a kind of not reason to collide to cause and affect the circuit board with chip resistor of the conducting state of electrode.

Accompanying drawing explanation

The cut-away view of the existing circuit board with chip resistor of Fig. 1;

Fig. 2 is the partial perspective view of the present invention with the first embodiment of the circuit board of chip resistor;

Fig. 3 is the cut-away view of the thin portion structure of the first embodiment of the present invention.

Embodiment

See Fig. 2, Fig. 3, and Fig. 3 is along the cut away view after Fig. 2 III-III cutting, the present invention, with the circuit board of chip resistor, comprises the chip resistor 4 (only showing 1 chip resistor in Fig. 2 and Fig. 3) that a circuit board 3 and plural number and described circuit board 3 are electrically connected.Non-routing region place on described circuit board is provided with Copper Foil, and the back side of circuit board is equipped with two-layer Copper Foil, is stained with the resistance to deformation layer of one deck by polyurethane hot melt between two-layer Copper Foil;

Each chip resistor 4 described comprises without exception in microscler substrate body 41, and plural compartment of terrain is formed at the plate resistor 42 of described substrate body 41.

Described substrate body 41 is made up of insulating material such as aluminium oxide, has the end face 412 of basal plane 411, in contrast to described basal plane 411 of a contiguous described circuit board, and the side 413 of the described basal plane 411 of a connection and described end face 412.

Each plate resistor 42 described has the insulating protective layer 423 that resistive layer 422, that an electrode group be made up of electric conducting material 421, is made up of the electric conducting material with predetermined resistance is covered in described resistive layer 422 surface, and the protective coating 424 that is covered in described electrode group 421 surface.

Wherein, described electrode group 421 has the basal plane 411 and be spaced one first and second contact electrode 425,426 that are formed at described substrate body 41 respectively, and respectively from first and second side electrode 427,428 that first and second contact electrode 425,426 described extends via described side 413.

Described resistive layer 422 is by the electric conducting material with specific resistance, and such as ruthenium, copper, silver, palladium or its constituent formed, be formed at described basal plane 411 and the relative dual-side of described resistive layer 422 respectively cover by first and second contact electrode 425,426 described and cover.

The materials such as described insulating protective layer 423 selectable from glass or resin, are covered in described resistive layer 422 surface, in order to protect described resistive layer 422 and to assist in order to keep the stable of resistance.

Described protective coating 424 is made up of the metal material such as nickel or tin, is covered in described electrode group 421 surface, in order to protect first and second contact electrode 425,426 described and first and second side electrode 427,428 described.

To achieve the above object, described plate resistor 42 is first after the basal plane 411 of described substrate body 41 forms described resistive layer 422, basal plane 411 again in described substrate body 41 forms described first, two contact electrodes 425, 426, and by described first, two contact electrodes 425, 426 respectively lid cover two relative ora terminalis of described resistive layer 422, then, formed from described first again, two contact electrodes 425, 426 extend to first of described side 413, two side faces electrode 427, 428, finally cover described insulating protective layer 423 in described resistive layer 422 outer surface again, and cover described protective coating 424 at the outer surface of described electrode group 421, and control to make the level height of described protective coating 424 be greater than the level height of described insulating protective layer 423, described circuit board 3 can be avoided with described first, two contact electrodes 425, be subject to described resistive layer 422 and the obstruct of described insulating protective layer 423 during 426 electrical connection and cause the inconvenience be electrically connected.

Aforementioned described each plate resistor 42 be utilize first and second contact electrode 425,426 described respectively with the weld pad 1 such as described in described circuit board 3, and obtain the structure of a kind of described resistive layer 422 near described circuit board 3.

Because chip resistor of the present invention utilizes described resistive layer 422 to be formed at same surface with first and second contact electrode 425,426 described, and first and second side electrode 427,428 described is utilized to increase the then steadiness of first and second contact electrode 425,426 described and described substrate body 41.When described chip resistor start, the electric current produced from described circuit board 3 only must utilize described first contact electrode 425, resistive layer 422, and second the loop that forms of contact electrode 426 get final product conducting, therefore, no matter described first, two side faces electrode 427, whether 428 damage in use or encapsulation process or rupture, all can not affect the start of described chip resistor 4, be different from and existingly must utilize described first, two back electrode blocks 224, 225, first, two extension electrodes 226, 227, and complete loops ability conducting (see Fig. 1) that resistive layer 222 is formed, therefore avoid existing actually in waiting in the process of chip resistor assembling or test by described, the problem of open circuit usually can be caused because of collision, therefore the yield of described chip resistor can significantly be promoted.

Above are only embodiments of the invention, when not limiting scope of the invention process with this, the simple equivalence namely generally done according to the present patent application the scope of the claims and patent specification content changes and modifies, and all still remains within the scope of the patent.

Claims

1., with the circuit board of chip resistor, comprise a circuit board and the plural chip resistor be electrically connected with described circuit board; Non-routing region place on described circuit board is provided with Copper Foil, and the back side of circuit board is equipped with two-layer Copper Foil, is stained with the resistance to deformation layer of one deck by polyurethane hot melt between two-layer Copper Foil; Each chip resistor comprises the plate resistor that a substrate body and plural compartment of terrain are formed at described substrate body;

2. the circuit board with chip resister according to claim 1, is characterized in that: the height of first and second contact electrode described is greater than the height of described resistive layer.

3. the circuit board with chip resistor according to claim 1, is characterized in that: each plate resistor described also has the insulating protective layer that one deck covers resistive layer.