CN104967548A - Free topology type power supply apolar two-wire system communication bus m-bus - Google Patents

Free topology type power supply apolar two-wire system communication bus m-bus Download PDF

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CN104967548A
CN104967548A CN201410713463.2A CN201410713463A CN104967548A CN 104967548 A CN104967548 A CN 104967548A CN 201410713463 A CN201410713463 A CN 201410713463A CN 104967548 A CN104967548 A CN 104967548A
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resistance
pin
power supply
optocoupler
electric capacity
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CN104967548B (en
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李健
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Hefei Ikona Energy Co ltd
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Hefei Yi Kenai Softcom Ltd
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Abstract

The invention discloses a free topology type power supply apolar two-wire system communication bus m-bus. The free topology type power supply apolar two-wire system communication bus m-bus comprises an SM100B chip realization master station circuit and an SM001B chip realization slave station circuit. The free topology type power supply apolar two-wire system communication bus m-bus is reasonable in design and simple in structure, multiplexes the bus in terms of power supply and communication, is apolar, can realize free topology, can prolong the life of a light source, improves the work environment, enhances the work efficiency, realizes multiple illumination effects, and is convenient to maintain and manage and quite high in economic rate of return.

Description

Free topology type can be powered electrodeless two-wire system communication bus-m-bus bus
Technical field
The present invention relates to a kind of m-bus bus protocol, particularly relate to one specifically and be mainly used in the field apparatuss such as intelligent building, fire protection warning, security protection, Smart Home more, widespread free topology type of counting and can power electrodeless two-wire system communication bus-m-bus bus.
Background technology
Along with the progress of society, people propose higher requirement, intelligent lighting to comfortable and energy-conservation, and intelligent parasols controls will obtain applying more and more widely.Meanwhile, the requirement of user to the system integration and maintenance upgrade is more and more stricter and specialized, standardized product progressively embodies its comprehensive advantage, there is EIB/KNX the application of intelligent lighting field is more, the buses such as 485, EIB/KNX can mount at most 64 equipment, communication distance is no more than 1000m, can not non-polar wiring, and 485 modes power to down the equipment of connecing, equipment needs to solve powerup issue separately, 485 bus communications generally should not adopt star, tree-like, the networking structures such as annular, often adopt hand in hand, and m-bus bus is one can power, nonpolarity, two-wire system communication mechanism, can free topology, there is communication apparatus capacity large, communication speed is high, simplicity of design, wiring is convenient, the features such as antijamming capability is strong, intelligent building can be applied in, fire protection warning, security protection, the scenes such as Smart Home.
Summary of the invention
The object of this invention is to provide free topology type can to power electrodeless two-wire system communication bus-m-bus bus, reasonable in design, structure is simple, power supply and communication multiplex bus and nonpolarity, can free topology, the life-span of light source can be extended, improve operational environment, increase work efficiency, realize multiple illuminating effect, management maintenance is convenient, has higher economic rate of return.
In order to solve the problem existing for background technology, the present invention by the following technical solutions:
Free topology type can be powered electrodeless two-wire system communication bus-m-bus bus, includes that SM100B chip realizes main website circuit, SM001B chip realizes slave station circuit.
Described SM100B chip realizes main website circuit and comprises integrated chip (U1), 1st pin of described integrated chip (U1) is connected with one end of resistance (R2), resistance (R2) other end is connected with optocoupler (Q4) one end, optocoupler (Q4) one end is connected with one end of resistance (R4), and be connected to output (J1), resistance (R4) other end is connected to power supply VCC_MCU, optocoupler (Q4) two other port is connected respectively to power supply+5V and power supply ground, 15th pin of integrated chip (U1) is connected with one end of resistance (R3) and one end of optocoupler (Q1) respectively, resistance (R3) other end is connected with power supply+5V, optocoupler (Q1) other end is connected with one end of resistance (R1), the other end of resistance (R1) is connected with power supply VCC_MCU, optocoupler (Q1) other end is connected with the 2nd pin of output (J1), optocoupler (Q1) other end is connected to GNDZx power supply ground, 16th pin of integrated chip (U1) is connected with one end of optocoupler (Q2) and one end of optocoupler (Q3) respectively, optocoupler (Q2) other end respectively with one end of resistance (R5), one end of electric capacity (C1), the other end of optocoupler (Q3) and one end of resistance (R6) connect, resistance (R5) other end is connected to power supply VCC_MCU, the other end of electric capacity (C1) is connected with one end of resistance (R23), the other end of resistance (R23) and the other end of resistance (R6) are connected respectively to power supply ground, the other end and the other end of optocoupler (Q3) of optocoupler (Q2) are interconnected and are connected with the 5th pin of output port (J1) afterwards, 2nd pin of integrated chip (U1) is connected with one end of optocoupler (Q6) and one end of optocoupler (Q5) respectively, optocoupler (Q6) other end respectively with one end of resistance (R18), one end of electric capacity (C2), the other end of optocoupler (Q5) and one end of resistance (R19) connect, the other end of resistance (R18) is connected with power supply+5V, electric capacity (C2) is connected with one end of resistance (R17), the other end of resistance (R17) and the other end of resistance (R19) are connected with power supply ground GNDZx respectively, the other end of optocoupler (Q6) is connected with the other end of optocoupler (Q5) and is connected with the 4th pin of output (J1) afterwards, the other end of optocoupler (Q6) is connected with power supply VCC_MCU, the other end of optocoupler (Q5) is connected with power supply ground, 3rd pin of integrated chip (U1) is connected with one end of resistance (R20), be connected with one end of electric capacity (C4) after 6th pin of integrated chip (U1) is connected with the 5th pin, and be connected with power supply+5V, 4th pin of integrated chip (U1) is connected with power supply ground GNDZx, the other end of electric capacity (C4) is connected with power supply ground GNDZx, 7th pin of integrated chip (U1) is connected with one end of resistance (R10), the other end of resistance (R10) is connected with power supply ground GNDZx, 8th pin of integrated chip (U1) is connected with one end of resistance (R8), 9th pin of integrated chip (U1) is connected with one end of electric capacity (C5) and one end of diode (VD1) respectively, the other end of electric capacity (C5) is connected with power supply ground GNDZx, 11st pin of integrated chip (U1) is connected with one end of resistance (R9), 13rd pin of integrated chip (U1) is connected with one end of resistance (R7), 10th pin of integrated chip (U1) is connected with one end of electric capacity (C3), 12nd pin of integrated chip (U1) respectively with one end of fuse (F1), one end of electric capacity (C3), one end of resistance (R11), one end of resistance (R12), one end of resistance (R13), one end of resistance (R14), positive pole one end of diode (VD3) and electric capacity (E1) connects, the other end of fuse (F1) is connected with+24V power supply, power supply ground, the negative pole one end GNDZx of electric capacity (E1) connects, one end of diode (VD2) respectively with one end of inductance (L1), the other end of resistance (R7), the other end of resistance (R11), the other end of resistance (R12), the other end of resistance (R13) and the other end of resistance (R14) connect, one end of metal-oxide-semiconductor (VT2) is connected with the other end of resistance (R9), the other end of metal-oxide-semiconductor (VT2) is connected with the other end of inductance (L1) and the other end of diode (VD2) respectively, the other end of metal-oxide-semiconductor (VT2) respectively with the other end of resistance (R8), the other end of diode (VD1), one end of metal-oxide-semiconductor (VT1), one end of diode (VD4), one end of Transient Suppression Diode (VD5) and one end of common mode inductance (L2) connect, the other end of metal-oxide-semiconductor (VT1) is connected with the other end of resistance (R20), metal-oxide-semiconductor (VT1) other end is connected with one end of resistance (R21) and one end of resistance (R22) respectively, the other end of resistance (R21) respectively with the other end of resistance (R22), the other end of diode (VD4), the other end of Transient Suppression Diode (VD5) and the other end of common mode inductance (L2) connect, 1st pin of output port (J1) connects power supply ground.
Described SM001B chip realizes slave station circuit and comprises integrated chip (U2), 2nd pin of integrated chip (U2) respectively with one end of diode (VD6), one end of diode (VD7) is connected with one end of diode (VD12), the other end of diode (VD7) respectively with one end of diode (VD11), one end of electric capacity (C17), one end of diode (VD8), one end of Transient Suppression Diode (VP1) and the other end of common mode inductance (L2) connect, the other end of diode (VD6) respectively with one end of diode (VD10), one end of electric capacity (C6), one end of diode (VD9) and one end of resistance (R15) connect, Transient Suppression Diode (VP1) other end is connected with the other end of resistance (R15) and the other end of common mode inductance (L2) respectively, the other end of diode (VD8) respectively with the other end of diode (VD9), one end of resistance (R25) and one end of resistance (R24) connect, the other end of resistance (R25) is connected with the other end of resistance (R24) and the positive terminal of electric capacity (E3) respectively, the negative pole end of electric capacity (E3) is connected with power supply ground, the other end of electric capacity (C6), the other end of electric capacity (C7), the other end of diode (VD10) and the other end of diode (VD11) respectively with power supply be connected, the other end of diode (VD12) is connected with resistance (R16), 3rd pin of integrated chip (U2) is connected with power supply ground, 5th pin of integrated chip (U2) is connected with the 6th pin of integrated chip (U2) and one end of electric capacity (C8) respectively, 8th pin of integrated chip (U2) respectively with the other end of resistance (R16), the positive terminal of electric capacity (E2) and one end of electric capacity (C9) connect, the other end of electric capacity (C8), the negative pole end of electric capacity (E2) and the other end of electric capacity (C9) respectively with power supply be connected, 4th pin of integrated chip (U2) is connected with the 1st pin of output (J2), 7th pin of integrated chip (U2) is connected with the 2nd pin of output port (J2), 3rd pin of output (J2) is connected with power supply ground.
Free topology type can power electrodeless two-wire system communication bus-m-bus bus comprise bus-powered circuit, bus not power supply circuits, bus-powered slave station communication isolation circuit, bus do not power slave station communication isolation circuit and realize main website circuit by described SM100B chip, SM001B chip realize slave station circuit for realize bus-powered, bus is not powered, bus-powered slave station communication isolation, bus do not power slave station communication isolation features.
Described bus-powered circuit comprises integrated chip (U1), 1st pin of described integrated chip (U1) is connected with one end of resistance (R2), resistance (R2) other end is connected with optocoupler (Q4) one end, optocoupler (Q4) one end is connected with one end of resistance (R4), and be connected to output (J1), resistance (R4) other end is connected to power supply VCC_MCU, optocoupler (Q4) two other port is connected respectively to power supply+5V and power supply ground, 15th pin of integrated chip (U1) is connected with one end of resistance (R3) and one end of optocoupler (Q1) respectively, resistance (R3) other end is connected with power supply+5V, optocoupler (Q1) other end is connected with one end of resistance (R1), the other end of resistance (R1) is connected with power supply VCC_MCU, optocoupler (Q1) other end is connected with the 2nd pin of output (J1), optocoupler (Q1) other end is connected to GNDZx power supply ground, 16th pin of integrated chip (U1) is connected with one end of optocoupler (Q2) and one end of optocoupler (Q3) respectively, optocoupler (Q2) other end respectively with one end of resistance (R5), one end of electric capacity (C1), the other end of optocoupler (Q3) and one end of resistance (R6) connect, resistance (R5) other end is connected to power supply VCC_MCU, the other end of electric capacity (C1) is connected with one end of resistance (R23), the other end of resistance (R23) and the other end of resistance (R6) are connected respectively to power supply ground, the other end and the other end of optocoupler (Q3) of optocoupler (Q2) are interconnected and are connected with the 5th pin of output port (J1) afterwards, 2nd pin of integrated chip (U1) is connected with one end of optocoupler (Q6) and one end of optocoupler (Q5) respectively, optocoupler (Q6) other end respectively with one end of resistance (R18), one end of electric capacity (C2), the other end of optocoupler (Q5) and one end of resistance (R19) connect, the other end of resistance (R18) is connected with power supply+5V, electric capacity (C2) is connected with one end of resistance (R17), the other end of resistance (R17) and the other end of resistance (R19) are connected with power supply ground GNDZx respectively, the other end of optocoupler (Q6) is connected with the other end of optocoupler (Q5) and is connected with the 4th pin of output (J1) afterwards, the other end of optocoupler (Q6) is connected with power supply VCC_MCU, the other end of optocoupler (Q5) is connected with power supply ground, 3rd pin of integrated chip (U1) is connected with one end of resistance (R20), be connected with one end of electric capacity (C4) after 6th pin of integrated chip (U1) is connected with the 5th pin, and be connected with power supply+5V, 4th pin of integrated chip (U1) is connected with power supply ground GNDZx, the other end of electric capacity (C4) is connected with power supply ground GNDZx, 7th pin of integrated chip (U1) is connected with one end of resistance (R10), the other end of resistance (R10) is connected with power supply ground GNDZx, 8th pin of integrated chip (U1) is connected with one end of resistance (R8), 9th pin of integrated chip (U1) is connected with one end of electric capacity (C5) and one end of diode (VD1) respectively, the other end of electric capacity (C5) is connected with power supply ground GNDZx, 11st pin of integrated chip (U1) is connected with one end of resistance (R9), 13rd pin of integrated chip (U1) is connected with one end of resistance (R7), 10th pin of integrated chip (U1) is connected with one end of electric capacity (C3), 12nd pin of integrated chip (U1) respectively with one end of fuse (F1), one end of electric capacity (C3), one end of resistance (R11), one end of resistance (R12), one end of resistance (R13), one end of resistance (R14), positive pole one end of diode (VD3) and electric capacity (E1) connects, the other end of fuse (F1) is connected with+24V power supply, power supply ground, the negative pole one end GNDZx of electric capacity (E1) connects, one end of diode (VD2) respectively with one end of inductance (L1), the other end of resistance (R7), the other end of resistance (R11), the other end of resistance (R12), the other end of resistance (R13) and the other end of resistance (R14) connect, one end of metal-oxide-semiconductor (VT2) is connected with the other end of resistance (R9), the other end of metal-oxide-semiconductor (VT2) is connected with the other end of inductance (L1) and the other end of diode (VD2) respectively, the other end of metal-oxide-semiconductor (VT2) respectively with the other end of resistance (R8), the other end of diode (VD1), one end of metal-oxide-semiconductor (VT1), one end of diode (VD4), one end of Transient Suppression Diode (VD5) and one end of common mode inductance (L2) connect, the other end of metal-oxide-semiconductor (VT1) is connected with the other end of resistance (R20), metal-oxide-semiconductor (VT1) other end is connected with one end of resistance (R21) and one end of resistance (R22) respectively, the other end of resistance (R21) respectively with the other end of resistance (R22), the other end of diode (VD4), the other end of Transient Suppression Diode (VD5) and the other end of common mode inductance (L2) connect, 1st pin of output port (J1) connects power supply ground, 2nd pin of integrated chip (U2) respectively with one end of diode (VD6), one end of diode (VD7) is connected with one end of diode (VD12), the other end of diode (VD7) respectively with one end of diode (VD11), one end of electric capacity (C17), one end of diode (VD8), one end of Transient Suppression Diode (VP1) and the other end of common mode inductance (L2) connect, the other end of diode (VD6) respectively with one end of diode (VD10), one end of electric capacity (C6), one end of diode (VD9) and one end of resistance (R15) connect, Transient Suppression Diode (VP1) other end is connected with the other end of resistance (R15) and the other end of common mode inductance (L2) respectively, the other end of diode (VD8) respectively with the other end of diode (VD9), one end of resistance (R25) and one end of resistance (R24) connect, the other end of resistance (R25) is connected with the other end of resistance (R24) and the positive terminal of electric capacity (E3) respectively, the negative pole end of electric capacity (E3) is connected with power supply ground, the other end of electric capacity (C6), the other end of electric capacity (C7), the other end of diode (VD10) and the other end of diode (VD11) respectively with power supply be connected, the other end of diode (VD12) is connected with resistance (R16), 3rd pin of integrated chip (U2) is connected with power supply ground, 5th pin of integrated chip (U2) is connected with the 6th pin of integrated chip (U2) and one end of electric capacity (C8) respectively, 8th pin of integrated chip (U2) respectively with the other end of resistance (R16), the positive terminal of electric capacity (E2) and one end of electric capacity (C9) connect, the other end of electric capacity (C8), the negative pole end of electric capacity (E2) and the other end of electric capacity (C9) respectively with power supply be connected, 4th pin of integrated chip (U2) is connected with the 1st pin of output (J2), 7th pin of integrated chip (U2) is connected with the 2nd pin of output port (J2), 3rd pin of output (J2) is connected with power supply ground.
Described bus not power supply circuits includes integrated chip (U1), 1st pin of described integrated chip (U1) is connected with one end of resistance (R2), resistance (R2) other end is connected with optocoupler (Q4) one end, optocoupler (Q4) one end is connected with one end of resistance (R4), and be connected to output (J1), resistance (R4) other end is connected to power supply VCC_MCU, optocoupler (Q4) two other port is connected respectively to power supply+5V and power supply ground, 15th pin of integrated chip (U1) is connected with one end of resistance (R3) and one end of optocoupler (Q1) respectively, resistance (R3) other end is connected with power supply+5V, optocoupler (Q1) other end is connected with one end of resistance (R1), the other end of resistance (R1) is connected with power supply VCC_MCU, optocoupler (Q1) other end is connected with the 2nd pin of output (J1), optocoupler (Q1) other end is connected to GNDZx power supply ground, 16th pin of integrated chip (U1) is connected with one end of optocoupler (Q2) and one end of optocoupler (Q3) respectively, optocoupler (Q2) other end respectively with one end of resistance (R5), one end of electric capacity (C1), the other end of optocoupler (Q3) and one end of resistance (R6) connect, resistance (R5) other end is connected to power supply VCC_MCU, the other end of electric capacity (C1) is connected with one end of resistance (R23), the other end of resistance (R23) and the other end of resistance (R6) are connected respectively to power supply ground, the other end and the other end of optocoupler (Q3) of optocoupler (Q2) are interconnected and are connected with the 5th pin of output port (J1) afterwards, 2nd pin of integrated chip (U1) is connected with one end of optocoupler (Q6) and one end of optocoupler (Q5) respectively, optocoupler (Q6) other end respectively with one end of resistance (R18), one end of electric capacity (C2), the other end of optocoupler (Q5) and one end of resistance (R19) connect, the other end of resistance (R18) is connected with power supply+5V, electric capacity (C2) is connected with one end of resistance (R17), the other end of resistance (R17) and the other end of resistance (R19) are connected with power supply ground GNDZx respectively, the other end of optocoupler (Q6) is connected with the other end of optocoupler (Q5) and is connected with the 4th pin of output (J1) afterwards, the other end of optocoupler (Q6) is connected with power supply VCC_MCU, the other end of optocoupler (Q5) is connected with power supply ground, 3rd pin of integrated chip (U1) is connected with one end of resistance (R20), be connected with one end of electric capacity (C4) after 6th pin of integrated chip (U1) is connected with the 5th pin, and be connected with power supply+5V, 4th pin of integrated chip (U1) is connected with power supply ground GNDZx, the other end of electric capacity (C4) is connected with power supply ground GNDZx, 7th pin of integrated chip (U1) is connected with one end of resistance (R10), the other end of resistance (R10) is connected with power supply ground GNDZx, 8th pin of integrated chip (U1) is connected with one end of resistance (R8), 9th pin of integrated chip (U1) is connected with one end of electric capacity (C5) and one end of diode (VD1) respectively, the other end of electric capacity (C5) is connected with power supply ground GNDZx, 11st pin of integrated chip (U1) is connected with one end of resistance (R9), 13rd pin of integrated chip (U1) is connected with one end of resistance (R7), 10th pin of integrated chip (U1) is connected with one end of electric capacity (C3), 12nd pin of integrated chip (U1) respectively with one end of fuse (F1), one end of electric capacity (C3), one end of resistance (R11), one end of resistance (R12), one end of resistance (R13), one end of resistance (R14), positive pole one end of diode (VD3) and electric capacity (E1) connects, the other end of fuse (F1) is connected with+24V power supply, power supply ground, the negative pole one end GNDZx of electric capacity (E1) connects, one end of diode (VD2) respectively with one end of inductance (L1), the other end of resistance (R7), the other end of resistance (R11), the other end of resistance (R12), the other end of resistance (R13) and the other end of resistance (R14) connect, one end of metal-oxide-semiconductor (VT2) is connected with the other end of resistance (R9), the other end of metal-oxide-semiconductor (VT2) is connected with the other end of inductance (L1) and the other end of diode (VD2) respectively, the other end of metal-oxide-semiconductor (VT2) respectively with the other end of resistance (R8), the other end of diode (VD1), one end of metal-oxide-semiconductor (VT1), one end of diode (VD4), one end of Transient Suppression Diode (VD5) and one end of common mode inductance (L2) connect, the other end of metal-oxide-semiconductor (VT1) is connected with the other end of resistance (R20), metal-oxide-semiconductor (VT1) other end is connected with one end of resistance (R21) and one end of resistance (R22) respectively, the other end of resistance (R21) respectively with the other end of resistance (R22), the other end of diode (VD4), the other end of Transient Suppression Diode (VD5) and the other end of common mode inductance (L2) connect, 1st pin of output port (J1) connects power supply ground, 2nd pin of integrated chip (U2) respectively with one end of diode (VD6), one end of diode (VD7) is connected with one end of diode (VD12), the other end of diode (VD7) respectively with one end of diode (VD11), one end of electric capacity (C17), one end of Transient Suppression Diode (VP1) and the other end of common mode inductance (L2) connect, the other end of diode (VD6) respectively with one end of diode (VD10), one end of electric capacity (C6) and one end of resistance (R15) connect, Transient Suppression Diode (VP1) other end is connected with the other end of resistance (R15) and the other end of common mode inductance (L2) respectively, the other end of diode (VD10) and the other end of diode (VD11) respectively with power supply be connected, the other end of diode (VD12) is connected with resistance (R16), 3rd pin of integrated chip (U2) is connected with power supply ground, 5th pin of integrated chip (U2) is connected with the 6th pin of integrated chip (U2) and one end of electric capacity (C8) respectively, 8th pin of integrated chip (U2) respectively with the other end of resistance (R16), the positive terminal of electric capacity (E2) and one end of electric capacity (C9) connect, the other end of electric capacity (C8), the negative pole end of electric capacity (E2) and the other end of electric capacity (C9) respectively with power supply be connected, 4th pin of integrated chip (U2) is connected with the 1st pin of output (J2), 7th pin of integrated chip (U2) is connected with the 2nd pin of output port (J2), 3rd pin of output (J2) is connected with power supply ground.
Described bus-powered slave station communication isolation circuit comprises integrated chip (U1), 1st pin of described integrated chip (U1) is connected with one end of resistance (R2), resistance (R2) other end is connected with optocoupler (Q4) one end, optocoupler (Q4) one end is connected with one end of resistance (R4), and be connected to output (J1), resistance (R4) other end is connected to power supply VCC_MCU, optocoupler (Q4) two other port is connected respectively to power supply+5V and power supply ground, 15th pin of integrated chip (U1) is connected with one end of resistance (R3) and one end of optocoupler (Q1) respectively, resistance (R3) other end is connected with power supply+5V, optocoupler (Q1) other end is connected with one end of resistance (R1), the other end of resistance (R1) is connected with power supply VCC_MCU, optocoupler (Q1) other end is connected with the 2nd pin of output (J1), optocoupler (Q1) other end is connected to GNDZx power supply ground, 16th pin of integrated chip (U1) is connected with one end of optocoupler (Q2) and one end of optocoupler (Q3) respectively, optocoupler (Q2) other end respectively with one end of resistance (R5), one end of electric capacity (C1), the other end of optocoupler (Q3) and one end of resistance (R6) connect, resistance (R5) other end is connected to power supply VCC_MCU, the other end of electric capacity (C1) is connected with one end of resistance (R23), the other end of resistance (R23) and the other end of resistance (R6) are connected respectively to power supply ground, the other end and the other end of optocoupler (Q3) of optocoupler (Q2) are interconnected and are connected with the 5th pin of output port (J1) afterwards, 2nd pin of integrated chip (U1) is connected with one end of optocoupler (Q6) and one end of optocoupler (Q5) respectively, optocoupler (Q6) other end respectively with one end of resistance (R18), one end of electric capacity (C2), the other end of optocoupler (Q5) and one end of resistance (R19) connect, the other end of resistance (R18) is connected with power supply+5V, electric capacity (C2) is connected with one end of resistance (R17), the other end of resistance (R17) and the other end of resistance (R19) are connected with power supply ground GNDZx respectively, the other end of optocoupler (Q6) is connected with the other end of optocoupler (Q5) and is connected with the 4th pin of output (J1) afterwards, the other end of optocoupler (Q6) is connected with power supply VCC_MCU, the other end of optocoupler (Q5) is connected with power supply ground, 3rd pin of integrated chip (U1) is connected with one end of resistance (R20), be connected with one end of electric capacity (C4) after 6th pin of integrated chip (U1) is connected with the 5th pin, and be connected with power supply+5V, 4th pin of integrated chip (U1) is connected with power supply ground GNDZx, the other end of electric capacity (C4) is connected with power supply ground GNDZx, 7th pin of integrated chip (U1) is connected with one end of resistance (R10), the other end of resistance (R10) is connected with power supply ground GNDZx, 8th pin of integrated chip (U1) is connected with one end of resistance (R8), 9th pin of integrated chip (U1) is connected with one end of electric capacity (C5) and one end of diode (VD1) respectively, the other end of electric capacity (C5) is connected with power supply ground GNDZx, 11st pin of integrated chip (U1) is connected with one end of resistance (R9), 13rd pin of integrated chip (U1) is connected with one end of resistance (R7), 10th pin of integrated chip (U1) is connected with one end of electric capacity (C3), 12nd pin of integrated chip (U1) respectively with one end of fuse (F1), one end of electric capacity (C3), one end of resistance (R11), one end of resistance (R12), one end of resistance (R13), one end of resistance (R14), positive pole one end of diode (VD3) and electric capacity (E1) connects, the other end of fuse (F1) is connected with+24V power supply, power supply ground, the negative pole one end GNDZx of electric capacity (E1) connects, one end of diode (VD2) respectively with one end of inductance (L1), the other end of resistance (R7), the other end of resistance (R11), the other end of resistance (R12), the other end of resistance (R13) and the other end of resistance (R14) connect, one end of metal-oxide-semiconductor (VT2) is connected with the other end of resistance (R9), the other end of metal-oxide-semiconductor (VT2) is connected with the other end of inductance (L1) and the other end of diode (VD2) respectively, the other end of metal-oxide-semiconductor (VT2) respectively with the other end of resistance (R8), the other end of diode (VD1), one end of metal-oxide-semiconductor (VT1), one end of diode (VD4), one end of Transient Suppression Diode (VD5) and one end of common mode inductance (L2) connect, the other end of metal-oxide-semiconductor (VT1) is connected with the other end of resistance (R20), metal-oxide-semiconductor (VT1) other end is connected with one end of resistance (R21) and one end of resistance (R22) respectively, the other end of resistance (R21) respectively with the other end of resistance (R22), the other end of diode (VD4), the other end of Transient Suppression Diode (VD5) and the other end of common mode inductance (L2) connect, 1st pin of output port (J1) connects power supply ground, 2nd pin of integrated chip (U2) respectively with one end of diode (VD6), one end of diode (VD7) is connected with one end of diode (VD12), the other end of diode (VD7) respectively with one end of diode (VD11), one end of electric capacity (C17), one end of diode (VD8), one end of Transient Suppression Diode (VP1) and the other end of common mode inductance (L2) connect, the other end of diode (VD6) respectively with one end of diode (VD10), one end of electric capacity (C6), one end of diode (VD9) and one end of resistance (R15) connect, Transient Suppression Diode (VP1) is connected with the other end of resistance (R15) and the other end of common mode inductance (L2) respectively, the other end of diode (VD8) respectively with the other end of diode (VD9), one end of resistance (R25) and one end of resistance (R24) connect, the other end of resistance (R25) is connected with the other end of resistance (R24) and the positive terminal of electric capacity (E3) respectively, the negative pole end of electric capacity (E3) is connected with power supply ground GNDYx, the other end of electric capacity (C6), the other end of electric capacity (C7), the other end of diode (VD10) and the other end of diode (VD11) are connected with power supply ground GNDYx respectively, the other end of diode (VD12) is connected with resistance (R16), 3rd pin of integrated chip (U2) is connected with power supply ground GNDYx, 5th pin of integrated chip (U2) is connected with the 6th pin of integrated chip (U2) and one end of electric capacity (C8) respectively, 8th pin of integrated chip (U2) respectively with the other end of resistance (R16), the positive terminal of electric capacity (E2) and one end of electric capacity (C9) connect, the other end of electric capacity (C8), the negative pole end of electric capacity (E2) and the other end of electric capacity (C9) are connected with power supply ground GNDYx respectively, 4th pin of integrated chip (U2) is connected respectively with to one end of optocoupler (Q10) and one end of optocoupler (Q9), the other end of optocoupler (Q10) respectively with one end of resistance (R26), one end of electric capacity (C11), the other end of optocoupler (Q9) and one end of resistance (R27) connect, the other end of optocoupler (Q10) is connected with power supply+5V, optocoupler (Q9) other end is connected with power supply ground GNDYx, the other end of resistance (R26) is connected with power supply+3.3V, one end of resistance (R29) is connected with the other end of electric capacity (C11), the other end of resistance (R29) is connected with power supply respectively with the other end of resistance (R27), the other end of optocoupler (Q9) is connected with the other end of optocoupler (Q10) and the 1st pin of output (J2) respectively, 7th pin of integrated chip (U2) is connected respectively with to one end of optocoupler (Q7) and one end of optocoupler (Q8), the other end of optocoupler (Q7) respectively with one end of resistance (R31), one end of electric capacity (C10), the other end of optocoupler (Q8) and one end of resistance (R28) connect, the other end of optocoupler (Q7) is connected with power supply+3.3V, optocoupler (Q8) other end is connected with power supply ground, the other end of resistance (R31) is connected with power supply+5V, one end of resistance (R30) is connected with the other end of electric capacity (C10), the other end of resistance (R30) and the other end of resistance (R28) are connected with power supply ground GNDYx respectively, the other end of optocoupler (Q7) is connected with the other end of optocoupler (Q8) and the 2nd pin of output (J2) respectively, 3rd pin of output (J2) is connected with power supply ground.
Described bus slave station communication isolation circuit of not powering comprises integrated chip (U1), 1st pin of described integrated chip (U1) is connected with one end of resistance (R2), resistance (R2) other end is connected with optocoupler (Q4) one end, optocoupler (Q4) one end is connected with one end of resistance (R4), and be connected to output (J1), resistance (R4) other end is connected to power supply VCC_MCU, optocoupler (Q4) two other port is connected respectively to power supply+5V and power supply ground, 15th pin of integrated chip (U1) is connected with one end of resistance (R3) and one end of optocoupler (Q1) respectively, resistance (R3) other end is connected with power supply+5V, optocoupler (Q1) other end is connected with one end of resistance (R1), the other end of resistance (R1) is connected with power supply VCC_MCU, optocoupler (Q1) other end is connected with the 2nd pin of output (J1), optocoupler (Q1) other end is connected to GNDZx power supply ground, 16th pin of integrated chip (U1) is connected with one end of optocoupler (Q2) and one end of optocoupler (Q3) respectively, optocoupler (Q2) other end respectively with one end of resistance (R5), one end of electric capacity (C1), the other end of optocoupler (Q3) and one end of resistance (R6) connect, resistance (R5) other end is connected to power supply VCC_MCU, the other end of electric capacity (C1) is connected with one end of resistance (R23), the other end of resistance (R23) and the other end of resistance (R6) are connected respectively to power supply ground, the other end and the other end of optocoupler (Q3) of optocoupler (Q2) are interconnected and are connected with the 5th pin of output port (J1) afterwards, 2nd pin of integrated chip (U1) is connected with one end of optocoupler (Q6) and one end of optocoupler (Q5) respectively, optocoupler (Q6) other end respectively with one end of resistance (R18), one end of electric capacity (C2), the other end of optocoupler (Q5) and one end of resistance (R19) connect, the other end of resistance (R18) is connected with power supply+5V, electric capacity (C2) is connected with one end of resistance (R17), the other end of resistance (R17) and the other end of resistance (R19) are connected with power supply ground GNDZx respectively, the other end of optocoupler (Q6) is connected with the other end of optocoupler (Q5) and is connected with the 4th pin of output (J1) afterwards, the other end of optocoupler (Q6) is connected with power supply VCC_MCU, the other end of optocoupler (Q5) is connected with power supply ground, 3rd pin of integrated chip (U1) is connected with one end of resistance (R20), be connected with one end of electric capacity (C4) after 6th pin of integrated chip (U1) is connected with the 5th pin, and be connected with power supply+5V, 4th pin of integrated chip (U1) is connected with power supply ground GNDZx, the other end of electric capacity (C4) is connected with power supply ground GNDZx, 7th pin of integrated chip (U1) is connected with one end of resistance (R10), the other end of resistance (R10) is connected with power supply ground GNDZx, 8th pin of integrated chip (U1) is connected with one end of resistance (R8), 9th pin of integrated chip (U1) is connected with one end of electric capacity (C5) and one end of diode (VD1) respectively, the other end of electric capacity (C5) is connected with power supply ground GNDZx, 11st pin of integrated chip (U1) is connected with one end of resistance (R9), 13rd pin of integrated chip (U1) is connected with one end of resistance (R7), 10th pin of integrated chip (U1) is connected with one end of electric capacity (C3), 12nd pin of integrated chip (U1) respectively with one end of fuse (F1), one end of electric capacity (C3), one end of resistance (R11), one end of resistance (R12), one end of resistance (R13), one end of resistance (R14), positive pole one end of diode (VD3) and electric capacity (E1) connects, the other end of fuse (F1) is connected with+24V power supply, power supply ground, the negative pole one end GNDZx of electric capacity (E1) connects, one end of diode (VD2) respectively with one end of inductance (L1), the other end of resistance (R7), the other end of resistance (R11), the other end of resistance (R12), the other end of resistance (R13) and the other end of resistance (R14) connect, one end of metal-oxide-semiconductor (VT2) is connected with the other end of resistance (R9), the other end of metal-oxide-semiconductor (VT2) is connected with the other end of inductance (L1) and the other end of diode (VD2) respectively, the other end of metal-oxide-semiconductor (VT2) respectively with the other end of resistance (R8), the other end of diode (VD1), one end of metal-oxide-semiconductor (VT1), one end of diode (VD4), one end of Transient Suppression Diode (VD5) and one end of common mode inductance (L2) connect, the other end of metal-oxide-semiconductor (VT1) is connected with the other end of resistance (R20), metal-oxide-semiconductor (VT1) other end is connected with one end of resistance (R21) and one end of resistance (R22) respectively, the other end of resistance (R21) respectively with the other end of resistance (R22), the other end of diode (VD4), the other end of Transient Suppression Diode (VD5) and the other end of common mode inductance (L2) connect, 1st pin of output port (J1) connects power supply ground, 2nd pin of integrated chip (U2) respectively with one end of diode (VD6), one end of diode (VD7) is connected with one end of diode (VD12), the other end of diode (VD7) respectively with one end of diode (VD11), one end of electric capacity (C17), one end of Transient Suppression Diode (VP1) and the other end of common mode inductance (L2) connect, the other end of diode (VD6) respectively with one end of diode (VD10), one end of electric capacity (C6) and one end of resistance (R15) connect, Transient Suppression Diode (VP1) is connected with the other end of resistance (R15) and the other end of common mode inductance (L2) respectively, the other end of diode (VD10) and the other end of diode (VD11) respectively with power supply be connected, the other end of diode (VD12) is connected with resistance (R16), 3rd pin of integrated chip (U2) is connected with power supply ground, 5th pin of integrated chip (U2) is connected with the 6th pin of integrated chip (U2) and one end of electric capacity (C8) respectively, 8th pin of integrated chip (U2) respectively with the other end of resistance (R16), the positive terminal of electric capacity (E2) and one end of electric capacity (C9) connect, the other end of electric capacity (C8), the negative pole end of electric capacity (E2) and the other end of electric capacity (C9) respectively with power supply be connected, 4th pin of integrated chip (U2) is connected respectively with to one end of optocoupler (Q10) and one end of optocoupler (Q9), the other end of optocoupler (Q10) respectively with one end of resistance (R24), one end of electric capacity (C11), the other end of optocoupler (Q9) and one end of resistance (R25) connect, the other end of optocoupler (Q10) is connected with power supply+5V, optocoupler (Q9) other end is connected with power supply ground GNDYx, the other end of resistance (R24) is connected with power supply+3.3V, one end of resistance (R27) is connected with the other end of electric capacity (C11), the other end of resistance (R25) is connected with power supply respectively with the other end of resistance (R27), the other end of optocoupler (Q10) is connected with the other end of optocoupler (Q9) and the 1st pin of output (J2) respectively, 7th pin of integrated chip (U2) is connected respectively with to one end of optocoupler (Q7) and one end of optocoupler (Q8), the other end of optocoupler (Q7) respectively with one end of resistance (R29), one end of electric capacity (C10), the other end of optocoupler (Q8) and one end of resistance (R26) connect, the other end of optocoupler (Q7) is connected with power supply+3.3V, optocoupler (Q8) other end is connected with power supply ground, the other end of resistance (R29) is connected with power supply+5V, one end of resistance (R28) is connected with the other end of electric capacity (C10), the other end of resistance (R26) and the other end of resistance (R28) are connected with power supply ground GNDYx respectively, the other end of optocoupler (Q7) is connected with the other end of optocoupler (Q8) and the 2nd pin of output (J2) respectively, 3rd pin of output (J2) is connected with power supply ground.
M-bus bus disclosed by the invention is that one can be powered, nonpolarity, two-wire system communication mechanism, can free topology, and have communication apparatus capacity large, communication speed is high, simplicity of design, and wiring is convenient, the features such as antijamming capability is strong.Employing Distributed Control protocols of can powering can ensure in 252 equipment network situations, and arbitrary device events calls time is less than 100mS, and multipoint unit reports simultaneously and extracts one by one, can not produce network conflict.Described SM100B chip realizes main website, has following functions feature: quiescent dissipation representative value is less than 1mA; Operating voltage range is wide: 12V ~ 36V; Carry inner voltage stabilizing to export :+5V, 10mA; The full width voltage demodulation of descending receipts code, up signaling electric current loop modulation, antijamming capability is strong; 252 node devices can be mounted at most; Communication distance 1200m, uplink communication speed can reach 19200bps, and downgoing communication speed can reach 9600; Adopt half duplex communication.Described SM001B chip realizes slave station, has following functions: quiescent dissipation representative value is less than 100uA; Operating voltage range is wide: 7V ~ 36V; Carry inner optional voltage stabilizing to export :+5V or+3.3V; Up signaling electric current loop modulation, the full width voltage demodulation of descending receipts code, antijamming capability is strong; Communication distance 1200m, uplink communication speed can reach 19200bps, and downgoing communication speed can reach 9600; Adopt half pair and attack communication.
Beneficial effect of the present invention: the present invention is reasonable in design, structure is simple, power supply and communication multiplex bus and nonpolarity, can free topology, the life-span of light source can be extended, improve operational environment, increase work efficiency, realize multiple illuminating effect, management maintenance is convenient, has higher economic rate of return.
Accompanying drawing explanation
Fig. 1 is circuit connection diagram of the present invention;
Fig. 2 is that SM100B chip of the present invention realizes main website circuit diagram;
Fig. 3 is that SM001B chip of the present invention realizes slave station circuit diagram;
Fig. 4 is the bus-powered circuit diagram of the present invention;
Fig. 5 is bus of the present invention not power supply circuits schematic diagram;
Fig. 6 is the present invention's bus-powered slave station communication isolation circuit schematic diagram;
Fig. 7 is that bus of the present invention is not powered slave station communication isolation circuit schematic diagram.
Embodiment
As shown in the figure, free topology type can be powered electrodeless two-wire system communication bus-m-bus bus, includes that SM100B chip realizes main website circuit 1, SM001B chip realizes slave station circuit 2.
Described SM100B chip realizes main website circuit 1 and comprises integrated chip (U1), 1st pin of described integrated chip (U1) is connected with one end of resistance (R2), resistance (R2) other end is connected with optocoupler (Q4) one end, optocoupler (Q4) one end is connected with one end of resistance (R4), and be connected to output (J1), resistance (R4) other end is connected to power supply VCC_MCU, optocoupler (Q4) two other port is connected respectively to power supply+5V and power supply ground, 15th pin of integrated chip (U1) is connected with one end of resistance (R3) and one end of optocoupler (Q1) respectively, resistance (R3) other end is connected with power supply+5V, optocoupler (Q1) other end is connected with one end of resistance (R1), the other end of resistance (R1) is connected with power supply VCC_MCU, optocoupler (Q1) other end is connected with the 2nd pin of output (J1), optocoupler (Q1) other end is connected to GNDZx power supply ground, 16th pin of integrated chip (U1) is connected with one end of optocoupler (Q2) and one end of optocoupler (Q3) respectively, optocoupler (Q2) other end respectively with one end of resistance (R5), one end of electric capacity (C1), the other end of optocoupler (Q3) and one end of resistance (R6) connect, resistance (R5) other end is connected to power supply VCC_MCU, the other end of electric capacity (C1) is connected with one end of resistance (R23), the other end of resistance (R23) and the other end of resistance (R6) are connected respectively to power supply ground, the other end and the other end of optocoupler (Q3) of optocoupler (Q2) are interconnected and are connected with the 5th pin of output port (J1) afterwards, 2nd pin of integrated chip (U1) is connected with one end of optocoupler (Q6) and one end of optocoupler (Q5) respectively, optocoupler (Q6) other end respectively with one end of resistance (R18), one end of electric capacity (C2), the other end of optocoupler (Q5) and one end of resistance (R19) connect, the other end of resistance (R18) is connected with power supply+5V, electric capacity (C2) is connected with one end of resistance (R17), the other end of resistance (R17) and the other end of resistance (R19) are connected with power supply ground GNDZx respectively, the other end of optocoupler (Q6) is connected with the other end of optocoupler (Q5) and is connected with the 4th pin of output (J1) afterwards, the other end of optocoupler (Q6) is connected with power supply VCC_MCU, the other end of optocoupler (Q5) is connected with power supply ground, 3rd pin of integrated chip (U1) is connected with one end of resistance (R20), be connected with one end of electric capacity (C4) after 6th pin of integrated chip (U1) is connected with the 5th pin, and be connected with power supply+5V, 4th pin of integrated chip (U1) is connected with power supply ground GNDZx, the other end of electric capacity (C4) is connected with power supply ground GNDZx, 7th pin of integrated chip (U1) is connected with one end of resistance (R10), the other end of resistance (R10) is connected with power supply ground GNDZx, 8th pin of integrated chip (U1) is connected with one end of resistance (R8), 9th pin of integrated chip (U1) is connected with one end of electric capacity (C5) and one end of diode (VD1) respectively, the other end of electric capacity (C5) is connected with power supply ground GNDZx, 11st pin of integrated chip (U1) is connected with one end of resistance (R9), 13rd pin of integrated chip (U1) is connected with one end of resistance (R7), 10th pin of integrated chip (U1) is connected with one end of electric capacity (C3), 12nd pin of integrated chip (U1) respectively with one end of fuse (F1), one end of electric capacity (C3), one end of resistance (R11), one end of resistance (R12), one end of resistance (R13), one end of resistance (R14), positive pole one end of diode (VD3) and electric capacity (E1) connects, the other end of fuse (F1) is connected with+24V power supply, power supply ground, the negative pole one end GNDZx of electric capacity (E1) connects, one end of diode (VD2) respectively with one end of inductance (L1), the other end of resistance (R7), the other end of resistance (R11), the other end of resistance (R12), the other end of resistance (R13) and the other end of resistance (R14) connect, one end of metal-oxide-semiconductor (VT2) is connected with the other end of resistance (R9), the other end of metal-oxide-semiconductor (VT2) is connected with the other end of inductance (L1) and the other end of diode (VD2) respectively, the other end of metal-oxide-semiconductor (VT2) respectively with the other end of resistance (R8), the other end of diode (VD1), one end of metal-oxide-semiconductor (VT1), one end of diode (VD4), one end of Transient Suppression Diode (VD5) and one end of common mode inductance (L2) connect, the other end of metal-oxide-semiconductor (VT1) is connected with the other end of resistance (R20), metal-oxide-semiconductor (VT1) other end is connected with one end of resistance (R21) and one end of resistance (R22) respectively, the other end of resistance (R21) respectively with the other end of resistance (R22), the other end of diode (VD4), the other end of Transient Suppression Diode (VD5) and the other end of common mode inductance (L2) connect, 1st pin of output port (J1) connects power supply ground.
Bus signals receiving circuit is inputted by REVIN pin, TTL signal is exported through optical coupling isolation circuit to main website MCU by RXD pin after demodulation, bus transtation mission circuit completes asynchronous signalling function, the TTL signal of MCU inputs chip by TXD pin after optical coupling isolation circuit, and bus forms modulation signal.When TXD sends high level, VT1 is driven to export high level in bus by BUSH; When TXD sends low level, drive VT2 output low level in bus by BUSL.Resistance R11 and R16 is mainly used for protecting and drives pin damage SM100B when the interelectrode capacitance by metal-oxide-semiconductor during level saltus step in bus is coupled to.
When traffic rate reaches more than 9.6Kbps, common single photoelectric coupled circuit is difficult to satisfy the demands due to the restriction of response time and power consumption, high speed photo coupling cost compare is high, for saving cost, the optical coupling isolation circuit of TXD and RXD all adopts two optocoupler composition, utilize the discharge and recharge effect of electric capacity C1, C3 to respond rapidly when the hopping edge of level, this circuit can realize low-power consumption and unification at a high speed.
The effect of resistance R12 and R13 mainly contains two: be when TC100B transfers transmission low level to by high level under normal circumstances, provide the loop of releasing to the interelectrode capacitance of bus; Load equipment in bus under abnormal conditions due to the shorted diode of rectifier bridge and reverse-filling damage, for bus drop-down time the big current that pours in down a chimney current limliting is provided.In abnormal cases, between drop-down low period, current-limiting resistance R12, R13 and VT2 have lasting electric current herein, during fabric swatch, need consider that large area is dispelled the heat.
RB is connected in series 120K biasing resistor for internal current source, requires resistance precision ± 1%.
VD4, mainly when bus short circuit, when bus level is by high step-down, provides continuous current circuit; VD3 has during large electric current and voltage in bus to provide bleed-off circuit; VD5, to inductance L 1 afterflow, prevents the existence due to the induced electromotive force of inductance from causing cannot closing VT1 when current-limiting protection.
Described SM001B chip realizes slave station circuit 2 and comprises integrated chip (U2), 2nd pin of integrated chip (U2) respectively with one end of diode (VD6), one end of diode (VD7) is connected with one end of diode (VD12), the other end of diode (VD7) respectively with one end of diode (VD11), one end of electric capacity (C17), one end of diode (VD8), one end of Transient Suppression Diode (VP1) and the other end of common mode inductance (L2) connect, the other end of diode (VD6) respectively with one end of diode (VD10), one end of electric capacity (C6), one end of diode (VD9) and one end of resistance (R15) connect, Transient Suppression Diode (VP1) other end is connected with the other end of resistance (R15) and the other end of common mode inductance (L2) respectively, the other end of diode (VD8) respectively with the other end of diode (VD9), one end of resistance (R25) and one end of resistance (R24) connect, the other end of resistance (R25) is connected with the other end of resistance (R24) and the positive terminal of electric capacity (E3) respectively, the negative pole end of electric capacity (E3) is connected with power supply ground, the other end of electric capacity (C6), the other end of electric capacity (C7), the other end of diode (VD10) and the other end of diode (VD11) respectively with power supply be connected, the other end of diode (VD12) is connected with resistance (R16), 3rd pin of integrated chip (U2) is connected with power supply ground, 5th pin of integrated chip (U2) is connected with the 6th pin of integrated chip (U2) and one end of electric capacity (C8) respectively, 8th pin of integrated chip (U2) respectively with the other end of resistance (R16), the positive terminal of electric capacity (E2) and one end of electric capacity (C9) connect, the other end of electric capacity (C8), the negative pole end of electric capacity (E2) and the other end of electric capacity (C9) respectively with power supply be connected, 4th pin of integrated chip (U2) is connected with the 1st pin of output (J2), 7th pin of integrated chip (U2) is connected with the 2nd pin of output port (J2), 3rd pin of output (J2) is connected with power supply ground.

Claims (8)

1. free topology type can be powered electrodeless two-wire system communication bus-m-bus bus, it is characterized in that: include that SM100B chip realizes main website circuit, SM001B chip realizes slave station circuit.
2. free topology type according to claim 1 can be powered electrodeless two-wire system communication bus-m-bus bus, it is characterized in that: described SM100B chip realizes main website circuit and comprises integrated chip (U1), 1st pin of described integrated chip (U1) is connected with one end of resistance (R2), resistance (R2) other end is connected with optocoupler (Q4) one end, optocoupler (Q4) one end is connected with one end of resistance (R4), and be connected to output (J1), resistance (R4) other end is connected to power supply VCC_MCU, optocoupler (Q4) two other port is connected respectively to power supply+5V and power supply ground, 15th pin of integrated chip (U1) is connected with one end of resistance (R3) and one end of optocoupler (Q1) respectively, resistance (R3) other end is connected with power supply+5V, optocoupler (Q1) other end is connected with one end of resistance (R1), the other end of resistance (R1) is connected with power supply VCC_MCU, optocoupler (Q1) other end is connected with the 2nd pin of output (J1), optocoupler (Q1) other end is connected to GNDZx power supply ground, 16th pin of integrated chip (U1) is connected with one end of optocoupler (Q2) and one end of optocoupler (Q3) respectively, optocoupler (Q2) other end respectively with one end of resistance (R5), one end of electric capacity (C1), the other end of optocoupler (Q3) and one end of resistance (R6) connect, resistance (R5) other end is connected to power supply VCC_MCU, the other end of electric capacity (C1) is connected with one end of resistance (R23), the other end of resistance (R23) and the other end of resistance (R6) are connected respectively to power supply ground, the other end and the other end of optocoupler (Q3) of optocoupler (Q2) are interconnected and are connected with the 5th pin of output port (J1) afterwards, 2nd pin of integrated chip (U1) is connected with one end of optocoupler (Q6) and one end of optocoupler (Q5) respectively, optocoupler (Q6) other end respectively with one end of resistance (R18), one end of electric capacity (C2), the other end of optocoupler (Q5) and one end of resistance (R19) connect, the other end of resistance (R18) is connected with power supply+5V, electric capacity (C2) is connected with one end of resistance (R17), the other end of resistance (R17) and the other end of resistance (R19) are connected with power supply ground GNDZx respectively, the other end of optocoupler (Q6) is connected with the other end of optocoupler (Q5) and is connected with the 4th pin of output (J1) afterwards, the other end of optocoupler (Q6) is connected with power supply VCC_MCU, the other end of optocoupler (Q5) is connected with power supply ground, 3rd pin of integrated chip (U1) is connected with one end of resistance (R20), be connected with one end of electric capacity (C4) after 6th pin of integrated chip (U1) is connected with the 5th pin, and be connected with power supply+5V, 4th pin of integrated chip (U1) is connected with power supply ground GNDZx, the other end of electric capacity (C4) is connected with power supply ground GNDZx, 7th pin of integrated chip (U1) is connected with one end of resistance (R10), the other end of resistance (R10) is connected with power supply ground GNDZx, 8th pin of integrated chip (U1) is connected with one end of resistance (R8), 9th pin of integrated chip (U1) is connected with one end of electric capacity (C5) and one end of diode (VD1) respectively, the other end of electric capacity (C5) is connected with power supply ground GNDZx, 11st pin of integrated chip (U1) is connected with one end of resistance (R9), 13rd pin of integrated chip (U1) is connected with one end of resistance (R7), 10th pin of integrated chip (U1) is connected with one end of electric capacity (C3), 12nd pin of integrated chip (U1) respectively with one end of fuse (F1), one end of electric capacity (C3), one end of resistance (R11), one end of resistance (R12), one end of resistance (R13), one end of resistance (R14), positive pole one end of diode (VD3) and electric capacity (E1) connects, the other end of fuse (F1) is connected with+24V power supply, power supply ground, the negative pole one end GNDZx of electric capacity (E1) connects, one end of diode (VD2) respectively with one end of inductance (L1), the other end of resistance (R7), the other end of resistance (R11), the other end of resistance (R12), the other end of resistance (R13) and the other end of resistance (R14) connect, one end of metal-oxide-semiconductor (VT2) is connected with the other end of resistance (R9), the other end of metal-oxide-semiconductor (VT2) is connected with the other end of inductance (L1) and the other end of diode (VD2) respectively, the other end of metal-oxide-semiconductor (VT2) respectively with the other end of resistance (R8), the other end of diode (VD1), one end of metal-oxide-semiconductor (VT1), one end of diode (VD4), one end of Transient Suppression Diode (VD5) and one end of common mode inductance (L2) connect, the other end of metal-oxide-semiconductor (VT1) is connected with the other end of resistance (R20), metal-oxide-semiconductor (VT1) other end is connected with one end of resistance (R21) and one end of resistance (R22) respectively, the other end of resistance (R21) respectively with the other end of resistance (R22), the other end of diode (VD4), the other end of Transient Suppression Diode (VD5) and the other end of common mode inductance (L2) connect, 1st pin of output port (J1) connects power supply ground.
3. free topology type according to claim 1 can be powered electrodeless two-wire system communication bus-m-bus bus, it is characterized in that: described SM001B chip realizes slave station circuit and comprises integrated chip (U2), 2nd pin of integrated chip (U2) respectively with one end of diode (VD6), one end of diode (VD7) is connected with one end of diode (VD12), the other end of diode (VD7) respectively with one end of diode (VD11), one end of electric capacity (C17), one end of diode (VD8), one end of Transient Suppression Diode (VP1) and the other end of common mode inductance (L2) connect, the other end of diode (VD6) respectively with one end of diode (VD10), one end of electric capacity (C6), one end of diode (VD9) and one end of resistance (R15) connect, Transient Suppression Diode (VP1) other end is connected with the other end of resistance (R15) and the other end of common mode inductance (L2) respectively, the other end of diode (VD8) respectively with the other end of diode (VD9), one end of resistance (R25) and one end of resistance (R24) connect, the other end of resistance (R25) is connected with the other end of resistance (R24) and the positive terminal of electric capacity (E3) respectively, the negative pole end of electric capacity (E3) is connected with power supply ground, the other end of electric capacity (C6), the other end of electric capacity (C7), the other end of diode (VD10) and the other end of diode (VD11) respectively with power supply be connected, the other end of diode (VD12) is connected with resistance (R16), 3rd pin of integrated chip (U2) is connected with power supply ground, 5th pin of integrated chip (U2) is connected with the 6th pin of integrated chip (U2) and one end of electric capacity (C8) respectively, 8th pin of integrated chip (U2) respectively with the other end of resistance (R16), the positive terminal of electric capacity (E2) and one end of electric capacity (C9) connect, the other end of electric capacity (C8), the negative pole end of electric capacity (E2) and the other end of electric capacity (C9) respectively with power supply be connected, 4th pin of integrated chip (U2) is connected with the 1st pin of output (J2), 7th pin of integrated chip (U2) is connected with the 2nd pin of output port (J2), 3rd pin of output (J2) is connected with power supply ground.
4. free topology type according to claim 1 can be powered electrodeless two-wire system communication bus-m-bus bus, it is characterized in that: free topology type can power electrodeless two-wire system communication bus-m-bus bus comprise bus-powered circuit, bus not power supply circuits, bus-powered slave station communication isolation circuit, bus do not power slave station communication isolation circuit and realize main website circuit by described SM100B chip, SM001B chip realize slave station circuit for realize bus-powered, bus is not powered, bus-powered slave station communication isolation, bus do not power slave station communication isolation features.
5. free topology type according to claim 4 can be powered electrodeless two-wire system communication bus-m-bus bus, it is characterized in that: described bus-powered circuit comprises integrated chip (U1), 1st pin of described integrated chip (U1) is connected with one end of resistance (R2), resistance (R2) other end is connected with optocoupler (Q4) one end, optocoupler (Q4) one end is connected with one end of resistance (R4), and be connected to output (J1), resistance (R4) other end is connected to power supply VCC_MCU, optocoupler (Q4) two other port is connected respectively to power supply+5V and power supply ground, 15th pin of integrated chip (U1) is connected with one end of resistance (R3) and one end of optocoupler (Q1) respectively, resistance (R3) other end is connected with power supply+5V, optocoupler (Q1) other end is connected with one end of resistance (R1), the other end of resistance (R1) is connected with power supply VCC_MCU, optocoupler (Q1) other end is connected with the 2nd pin of output (J1), optocoupler (Q1) other end is connected to GNDZx power supply ground, 16th pin of integrated chip (U1) is connected with one end of optocoupler (Q2) and one end of optocoupler (Q3) respectively, optocoupler (Q2) other end respectively with one end of resistance (R5), one end of electric capacity (C1), the other end of optocoupler (Q3) and one end of resistance (R6) connect, resistance (R5) other end is connected to power supply VCC_MCU, the other end of electric capacity (C1) is connected with one end of resistance (R23), the other end of resistance (R23) and the other end of resistance (R6) are connected respectively to power supply ground, the other end and the other end of optocoupler (Q3) of optocoupler (Q2) are interconnected and are connected with the 5th pin of output port (J1) afterwards, 2nd pin of integrated chip (U1) is connected with one end of optocoupler (Q6) and one end of optocoupler (Q5) respectively, optocoupler (Q6) other end respectively with one end of resistance (R18), one end of electric capacity (C2), the other end of optocoupler (Q5) and one end of resistance (R19) connect, the other end of resistance (R18) is connected with power supply+5V, electric capacity (C2) is connected with one end of resistance (R17), the other end of resistance (R17) and the other end of resistance (R19) are connected with power supply ground GNDZx respectively, the other end of optocoupler (Q6) is connected with the other end of optocoupler (Q5) and is connected with the 4th pin of output (J1) afterwards, the other end of optocoupler (Q6) is connected with power supply VCC_MCU, the other end of optocoupler (Q5) is connected with power supply ground, 3rd pin of integrated chip (U1) is connected with one end of resistance (R20), be connected with one end of electric capacity (C4) after 6th pin of integrated chip (U1) is connected with the 5th pin, and be connected with power supply+5V, 4th pin of integrated chip (U1) is connected with power supply ground GNDZx, the other end of electric capacity (C4) is connected with power supply ground GNDZx, 7th pin of integrated chip (U1) is connected with one end of resistance (R10), the other end of resistance (R10) is connected with power supply ground GNDZx, 8th pin of integrated chip (U1) is connected with one end of resistance (R8), 9th pin of integrated chip (U1) is connected with one end of electric capacity (C5) and one end of diode (VD1) respectively, the other end of electric capacity (C5) is connected with power supply ground GNDZx, 11st pin of integrated chip (U1) is connected with one end of resistance (R9), 13rd pin of integrated chip (U1) is connected with one end of resistance (R7), 10th pin of integrated chip (U1) is connected with one end of electric capacity (C3), 12nd pin of integrated chip (U1) respectively with one end of fuse (F1), one end of electric capacity (C3), one end of resistance (R11), one end of resistance (R12), one end of resistance (R13), one end of resistance (R14), positive pole one end of diode (VD3) and electric capacity (E1) connects, the other end of fuse (F1) is connected with+24V power supply, power supply ground, the negative pole one end GNDZx of electric capacity (E1) connects, one end of diode (VD2) respectively with one end of inductance (L1), the other end of resistance (R7), the other end of resistance (R11), the other end of resistance (R12), the other end of resistance (R13) and the other end of resistance (R14) connect, one end of metal-oxide-semiconductor (VT2) is connected with the other end of resistance (R9), the other end of metal-oxide-semiconductor (VT2) is connected with the other end of inductance (L1) and the other end of diode (VD2) respectively, the other end of metal-oxide-semiconductor (VT2) respectively with the other end of resistance (R8), the other end of diode (VD1), one end of metal-oxide-semiconductor (VT1), one end of diode (VD4), one end of Transient Suppression Diode (VD5) and one end of common mode inductance (L2) connect, the other end of metal-oxide-semiconductor (VT1) is connected with the other end of resistance (R20), metal-oxide-semiconductor (VT1) other end is connected with one end of resistance (R21) and one end of resistance (R22) respectively, the other end of resistance (R21) respectively with the other end of resistance (R22), the other end of diode (VD4), the other end of Transient Suppression Diode (VD5) and the other end of common mode inductance (L2) connect, 1st pin of output port (J1) connects power supply ground, 2nd pin of integrated chip (U2) respectively with one end of diode (VD6), one end of diode (VD7) is connected with one end of diode (VD12), the other end of diode (VD7) respectively with one end of diode (VD11), one end of electric capacity (C17), one end of diode (VD8), one end of Transient Suppression Diode (VP1) and the other end of common mode inductance (L2) connect, the other end of diode (VD6) respectively with one end of diode (VD10), one end of electric capacity (C6), one end of diode (VD9) and one end of resistance (R15) connect, Transient Suppression Diode (VP1) other end is connected with the other end of resistance (R15) and the other end of common mode inductance (L2) respectively, the other end of diode (VD8) respectively with the other end of diode (VD9), one end of resistance (R25) and one end of resistance (R24) connect, the other end of resistance (R25) is connected with the other end of resistance (R24) and the positive terminal of electric capacity (E3) respectively, the negative pole end of electric capacity (E3) is connected with power supply ground, the other end of electric capacity (C6), the other end of electric capacity (C7), the other end of diode (VD10) and the other end of diode (VD11) respectively with power supply be connected, the other end of diode (VD12) is connected with resistance (R16), 3rd pin of integrated chip (U2) is connected with power supply ground, 5th pin of integrated chip (U2) is connected with the 6th pin of integrated chip (U2) and one end of electric capacity (C8) respectively, 8th pin of integrated chip (U2) respectively with the other end of resistance (R16), the positive terminal of electric capacity (E2) and one end of electric capacity (C9) connect, the other end of electric capacity (C8), the negative pole end of electric capacity (E2) and the other end of electric capacity (C9) respectively with power supply be connected, 4th pin of integrated chip (U2) is connected with the 1st pin of output (J2), 7th pin of integrated chip (U2) is connected with the 2nd pin of output port (J2), 3rd pin of output (J2) is connected with power supply ground.
6. free topology type according to claim 4 can be powered electrodeless two-wire system communication bus-m-bus bus, it is characterized in that: described bus not power supply circuits includes integrated chip (U1), 1st pin of described integrated chip (U1) is connected with one end of resistance (R2), resistance (R2) other end is connected with optocoupler (Q4) one end, optocoupler (Q4) one end is connected with one end of resistance (R4), and be connected to output (J1), resistance (R4) other end is connected to power supply VCC_MCU, optocoupler (Q4) two other port is connected respectively to power supply+5V and power supply ground, 15th pin of integrated chip (U1) is connected with one end of resistance (R3) and one end of optocoupler (Q1) respectively, resistance (R3) other end is connected with power supply+5V, optocoupler (Q1) other end is connected with one end of resistance (R1), the other end of resistance (R1) is connected with power supply VCC_MCU, optocoupler (Q1) other end is connected with the 2nd pin of output (J1), optocoupler (Q1) other end is connected to GNDZx power supply ground, 16th pin of integrated chip (U1) is connected with one end of optocoupler (Q2) and one end of optocoupler (Q3) respectively, optocoupler (Q2) other end respectively with one end of resistance (R5), one end of electric capacity (C1), the other end of optocoupler (Q3) and one end of resistance (R6) connect, resistance (R5) other end is connected to power supply VCC_MCU, the other end of electric capacity (C1) is connected with one end of resistance (R23), the other end of resistance (R23) and the other end of resistance (R6) are connected respectively to power supply ground, the other end and the other end of optocoupler (Q3) of optocoupler (Q2) are interconnected and are connected with the 5th pin of output port (J1) afterwards, 2nd pin of integrated chip (U1) is connected with one end of optocoupler (Q6) and one end of optocoupler (Q5) respectively, optocoupler (Q6) other end respectively with one end of resistance (R18), one end of electric capacity (C2), the other end of optocoupler (Q5) and one end of resistance (R19) connect, the other end of resistance (R18) is connected with power supply+5V, electric capacity (C2) is connected with one end of resistance (R17), the other end of resistance (R17) and the other end of resistance (R19) are connected with power supply ground GNDZx respectively, the other end of optocoupler (Q6) is connected with the other end of optocoupler (Q5) and is connected with the 4th pin of output (J1) afterwards, the other end of optocoupler (Q6) is connected with power supply VCC_MCU, the other end of optocoupler (Q5) is connected with power supply ground, 3rd pin of integrated chip (U1) is connected with one end of resistance (R20), be connected with one end of electric capacity (C4) after 6th pin of integrated chip (U1) is connected with the 5th pin, and be connected with power supply+5V, 4th pin of integrated chip (U1) is connected with power supply ground GNDZx, the other end of electric capacity (C4) is connected with power supply ground GNDZx, 7th pin of integrated chip (U1) is connected with one end of resistance (R10), the other end of resistance (R10) is connected with power supply ground GNDZx, 8th pin of integrated chip (U1) is connected with one end of resistance (R8), 9th pin of integrated chip (U1) is connected with one end of electric capacity (C5) and one end of diode (VD1) respectively, the other end of electric capacity (C5) is connected with power supply ground GNDZx, 11st pin of integrated chip (U1) is connected with one end of resistance (R9), 13rd pin of integrated chip (U1) is connected with one end of resistance (R7), 10th pin of integrated chip (U1) is connected with one end of electric capacity (C3), 12nd pin of integrated chip (U1) respectively with one end of fuse (F1), one end of electric capacity (C3), one end of resistance (R11), one end of resistance (R12), one end of resistance (R13), one end of resistance (R14), positive pole one end of diode (VD3) and electric capacity (E1) connects, the other end of fuse (F1) is connected with+24V power supply, power supply ground, the negative pole one end GNDZx of electric capacity (E1) connects, one end of diode (VD2) respectively with one end of inductance (L1), the other end of resistance (R7), the other end of resistance (R11), the other end of resistance (R12), the other end of resistance (R13) and the other end of resistance (R14) connect, one end of metal-oxide-semiconductor (VT2) is connected with the other end of resistance (R9), the other end of metal-oxide-semiconductor (VT2) is connected with the other end of inductance (L1) and the other end of diode (VD2) respectively, the other end of metal-oxide-semiconductor (VT2) respectively with the other end of resistance (R8), the other end of diode (VD1), one end of metal-oxide-semiconductor (VT1), one end of diode (VD4), one end of Transient Suppression Diode (VD5) and one end of common mode inductance (L2) connect, the other end of metal-oxide-semiconductor (VT1) is connected with the other end of resistance (R20), metal-oxide-semiconductor (VT1) other end is connected with one end of resistance (R21) and one end of resistance (R22) respectively, the other end of resistance (R21) respectively with the other end of resistance (R22), the other end of diode (VD4), the other end of Transient Suppression Diode (VD5) and the other end of common mode inductance (L2) connect, 1st pin of output port (J1) connects power supply ground, 2nd pin of integrated chip (U2) respectively with one end of diode (VD6), one end of diode (VD7) is connected with one end of diode (VD12), the other end of diode (VD7) respectively with one end of diode (VD11), one end of electric capacity (C17), one end of Transient Suppression Diode (VP1) and the other end of common mode inductance (L2) connect, the other end of diode (VD6) respectively with one end of diode (VD10), one end of electric capacity (C6) and one end of resistance (R15) connect, Transient Suppression Diode (VP1) other end is connected with the other end of resistance (R15) and the other end of common mode inductance (L2) respectively, the other end of diode (VD10) and the other end of diode (VD11) respectively with power supply be connected, the other end of diode (VD12) is connected with resistance (R16), 3rd pin of integrated chip (U2) is connected with power supply ground, 5th pin of integrated chip (U2) is connected with the 6th pin of integrated chip (U2) and one end of electric capacity (C8) respectively, 8th pin of integrated chip (U2) respectively with the other end of resistance (R16), the positive terminal of electric capacity (E2) and one end of electric capacity (C9) connect, the other end of electric capacity (C8), the negative pole end of electric capacity (E2) and the other end of electric capacity (C9) respectively with power supply be connected, 4th pin of integrated chip (U2) is connected with the 1st pin of output (J2), 7th pin of integrated chip (U2) is connected with the 2nd pin of output port (J2), 3rd pin of output (J2) is connected with power supply ground.
7. free topology type according to claim 4 can be powered electrodeless two-wire system communication bus-m-bus bus, it is characterized in that: described bus-powered slave station communication isolation circuit comprises integrated chip (U1), 1st pin of described integrated chip (U1) is connected with one end of resistance (R2), resistance (R2) other end is connected with optocoupler (Q4) one end, optocoupler (Q4) one end is connected with one end of resistance (R4), and be connected to output (J1), resistance (R4) other end is connected to power supply VCC_MCU, optocoupler (Q4) two other port is connected respectively to power supply+5V and power supply ground, 15th pin of integrated chip (U1) is connected with one end of resistance (R3) and one end of optocoupler (Q1) respectively, resistance (R3) other end is connected with power supply+5V, optocoupler (Q1) other end is connected with one end of resistance (R1), the other end of resistance (R1) is connected with power supply VCC_MCU, optocoupler (Q1) other end is connected with the 2nd pin of output (J1), optocoupler (Q1) other end is connected to GNDZx power supply ground, 16th pin of integrated chip (U1) is connected with one end of optocoupler (Q2) and one end of optocoupler (Q3) respectively, optocoupler (Q2) other end respectively with one end of resistance (R5), one end of electric capacity (C1), the other end of optocoupler (Q3) and one end of resistance (R6) connect, resistance (R5) other end is connected to power supply VCC_MCU, the other end of electric capacity (C1) is connected with one end of resistance (R23), the other end of resistance (R23) and the other end of resistance (R6) are connected respectively to power supply ground, the other end and the other end of optocoupler (Q3) of optocoupler (Q2) are interconnected and are connected with the 5th pin of output port (J1) afterwards, 2nd pin of integrated chip (U1) is connected with one end of optocoupler (Q6) and one end of optocoupler (Q5) respectively, optocoupler (Q6) other end respectively with one end of resistance (R18), one end of electric capacity (C2), the other end of optocoupler (Q5) and one end of resistance (R19) connect, the other end of resistance (R18) is connected with power supply+5V, electric capacity (C2) is connected with one end of resistance (R17), the other end of resistance (R17) and the other end of resistance (R19) are connected with power supply ground GNDZx respectively, the other end of optocoupler (Q6) is connected with the other end of optocoupler (Q5) and is connected with the 4th pin of output (J1) afterwards, the other end of optocoupler (Q6) is connected with power supply VCC_MCU, the other end of optocoupler (Q5) is connected with power supply ground, 3rd pin of integrated chip (U1) is connected with one end of resistance (R20), be connected with one end of electric capacity (C4) after 6th pin of integrated chip (U1) is connected with the 5th pin, and be connected with power supply+5V, 4th pin of integrated chip (U1) is connected with power supply ground GNDZx, the other end of electric capacity (C4) is connected with power supply ground GNDZx, 7th pin of integrated chip (U1) is connected with one end of resistance (R10), the other end of resistance (R10) is connected with power supply ground GNDZx, 8th pin of integrated chip (U1) is connected with one end of resistance (R8), 9th pin of integrated chip (U1) is connected with one end of electric capacity (C5) and one end of diode (VD1) respectively, the other end of electric capacity (C5) is connected with power supply ground GNDZx, 11st pin of integrated chip (U1) is connected with one end of resistance (R9), 13rd pin of integrated chip (U1) is connected with one end of resistance (R7), 10th pin of integrated chip (U1) is connected with one end of electric capacity (C3), 12nd pin of integrated chip (U1) respectively with one end of fuse (F1), one end of electric capacity (C3), one end of resistance (R11), one end of resistance (R12), one end of resistance (R13), one end of resistance (R14), positive pole one end of diode (VD3) and electric capacity (E1) connects, the other end of fuse (F1) is connected with+24V power supply, power supply ground, the negative pole one end GNDZx of electric capacity (E1) connects, one end of diode (VD2) respectively with one end of inductance (L1), the other end of resistance (R7), the other end of resistance (R11), the other end of resistance (R12), the other end of resistance (R13) and the other end of resistance (R14) connect, one end of metal-oxide-semiconductor (VT2) is connected with the other end of resistance (R9), the other end of metal-oxide-semiconductor (VT2) is connected with the other end of inductance (L1) and the other end of diode (VD2) respectively, the other end of metal-oxide-semiconductor (VT2) respectively with the other end of resistance (R8), the other end of diode (VD1), one end of metal-oxide-semiconductor (VT1), one end of diode (VD4), one end of Transient Suppression Diode (VD5) and one end of common mode inductance (L2) connect, the other end of metal-oxide-semiconductor (VT1) is connected with the other end of resistance (R20), metal-oxide-semiconductor (VT1) other end is connected with one end of resistance (R21) and one end of resistance (R22) respectively, the other end of resistance (R21) respectively with the other end of resistance (R22), the other end of diode (VD4), the other end of Transient Suppression Diode (VD5) and the other end of common mode inductance (L2) connect, 1st pin of output port (J1) connects power supply ground, 2nd pin of integrated chip (U2) respectively with one end of diode (VD6), one end of diode (VD7) is connected with one end of diode (VD12), the other end of diode (VD7) respectively with one end of diode (VD11), one end of electric capacity (C17), one end of diode (VD8), one end of Transient Suppression Diode (VP1) and the other end of common mode inductance (L2) connect, the other end of diode (VD6) respectively with one end of diode (VD10), one end of electric capacity (C6), one end of diode (VD9) and one end of resistance (R15) connect, Transient Suppression Diode (VP1) is connected with the other end of resistance (R15) and the other end of common mode inductance (L2) respectively, the other end of diode (VD8) respectively with the other end of diode (VD9), one end of resistance (R25) and one end of resistance (R24) connect, the other end of resistance (R25) is connected with the other end of resistance (R24) and the positive terminal of electric capacity (E3) respectively, the negative pole end of electric capacity (E3) is connected with power supply ground GNDYx, the other end of electric capacity (C6), the other end of electric capacity (C7), the other end of diode (VD10) and the other end of diode (VD11) are connected with power supply ground GNDYx respectively, the other end of diode (VD12) is connected with resistance (R16), 3rd pin of integrated chip (U2) is connected with power supply ground GNDYx, 5th pin of integrated chip (U2) is connected with the 6th pin of integrated chip (U2) and one end of electric capacity (C8) respectively, 8th pin of integrated chip (U2) respectively with the other end of resistance (R16), the positive terminal of electric capacity (E2) and one end of electric capacity (C9) connect, the other end of electric capacity (C8), the negative pole end of electric capacity (E2) and the other end of electric capacity (C9) are connected with power supply ground GNDYx respectively, 4th pin of integrated chip (U2) is connected respectively with to one end of optocoupler (Q10) and one end of optocoupler (Q9), the other end of optocoupler (Q10) respectively with one end of resistance (R26), one end of electric capacity (C11), the other end of optocoupler (Q9) and one end of resistance (R27) connect, the other end of optocoupler (Q10) is connected with power supply+5V, optocoupler (Q9) other end is connected with power supply ground GNDYx, the other end of resistance (R26) is connected with power supply+3.3V, one end of resistance (R29) is connected with the other end of electric capacity (C11), the other end of resistance (R29) is connected with power supply respectively with the other end of resistance (R27), the other end of optocoupler (Q9) is connected with the other end of optocoupler (Q10) and the 1st pin of output (J2) respectively, 7th pin of integrated chip (U2) is connected respectively with to one end of optocoupler (Q7) and one end of optocoupler (Q8), the other end of optocoupler (Q7) respectively with one end of resistance (R31), one end of electric capacity (C10), the other end of optocoupler (Q8) and one end of resistance (R28) connect, the other end of optocoupler (Q7) is connected with power supply+3.3V, optocoupler (Q8) other end is connected with power supply ground, the other end of resistance (R31) is connected with power supply+5V, one end of resistance (R30) is connected with the other end of electric capacity (C10), the other end of resistance (R30) and the other end of resistance (R28) are connected with power supply ground GNDYx respectively, the other end of optocoupler (Q7) is connected with the other end of optocoupler (Q8) and the 2nd pin of output (J2) respectively, 3rd pin of output (J2) is connected with power supply ground.
8. free topology type according to claim 4 can be powered electrodeless two-wire system communication bus-m-bus bus, it is characterized in that: described bus slave station communication isolation circuit of not powering comprises integrated chip (U1), 1st pin of described integrated chip (U1) is connected with one end of resistance (R2), resistance (R2) other end is connected with optocoupler (Q4) one end, optocoupler (Q4) one end is connected with one end of resistance (R4), and be connected to output (J1), resistance (R4) other end is connected to power supply VCC_MCU, optocoupler (Q4) two other port is connected respectively to power supply+5V and power supply ground, 15th pin of integrated chip (U1) is connected with one end of resistance (R3) and one end of optocoupler (Q1) respectively, resistance (R3) other end is connected with power supply+5V, optocoupler (Q1) other end is connected with one end of resistance (R1), the other end of resistance (R1) is connected with power supply VCC_MCU, optocoupler (Q1) other end is connected with the 2nd pin of output (J1), optocoupler (Q1) other end is connected to GNDZx power supply ground, 16th pin of integrated chip (U1) is connected with one end of optocoupler (Q2) and one end of optocoupler (Q3) respectively, optocoupler (Q2) other end respectively with one end of resistance (R5), one end of electric capacity (C1), the other end of optocoupler (Q3) and one end of resistance (R6) connect, resistance (R5) other end is connected to power supply VCC_MCU, the other end of electric capacity (C1) is connected with one end of resistance (R23), the other end of resistance (R23) and the other end of resistance (R6) are connected respectively to power supply ground, the other end and the other end of optocoupler (Q3) of optocoupler (Q2) are interconnected and are connected with the 5th pin of output port (J1) afterwards, 2nd pin of integrated chip (U1) is connected with one end of optocoupler (Q6) and one end of optocoupler (Q5) respectively, optocoupler (Q6) other end respectively with one end of resistance (R18), one end of electric capacity (C2), the other end of optocoupler (Q5) and one end of resistance (R19) connect, the other end of resistance (R18) is connected with power supply+5V, electric capacity (C2) is connected with one end of resistance (R17), the other end of resistance (R17) and the other end of resistance (R19) are connected with power supply ground GNDZx respectively, the other end of optocoupler (Q6) is connected with the other end of optocoupler (Q5) and is connected with the 4th pin of output (J1) afterwards, the other end of optocoupler (Q6) is connected with power supply VCC_MCU, the other end of optocoupler (Q5) is connected with power supply ground, 3rd pin of integrated chip (U1) is connected with one end of resistance (R20), be connected with one end of electric capacity (C4) after 6th pin of integrated chip (U1) is connected with the 5th pin, and be connected with power supply+5V, 4th pin of integrated chip (U1) is connected with power supply ground GNDZx, the other end of electric capacity (C4) is connected with power supply ground GNDZx, 7th pin of integrated chip (U1) is connected with one end of resistance (R10), the other end of resistance (R10) is connected with power supply ground GNDZx, 8th pin of integrated chip (U1) is connected with one end of resistance (R8), 9th pin of integrated chip (U1) is connected with one end of electric capacity (C5) and one end of diode (VD1) respectively, the other end of electric capacity (C5) is connected with power supply ground GNDZx, 11st pin of integrated chip (U1) is connected with one end of resistance (R9), 13rd pin of integrated chip (U1) is connected with one end of resistance (R7), 10th pin of integrated chip (U1) is connected with one end of electric capacity (C3), 12nd pin of integrated chip (U1) respectively with one end of fuse (F1), one end of electric capacity (C3), one end of resistance (R11), one end of resistance (R12), one end of resistance (R13), one end of resistance (R14), positive pole one end of diode (VD3) and electric capacity (E1) connects, the other end of fuse (F1) is connected with+24V power supply, power supply ground, the negative pole one end GNDZx of electric capacity (E1) connects, one end of diode (VD2) respectively with one end of inductance (L1), the other end of resistance (R7), the other end of resistance (R11), the other end of resistance (R12), the other end of resistance (R13) and the other end of resistance (R14) connect, one end of metal-oxide-semiconductor (VT2) is connected with the other end of resistance (R9), the other end of metal-oxide-semiconductor (VT2) is connected with the other end of inductance (L1) and the other end of diode (VD2) respectively, the other end of metal-oxide-semiconductor (VT2) respectively with the other end of resistance (R8), the other end of diode (VD1), one end of metal-oxide-semiconductor (VT1), one end of diode (VD4), one end of Transient Suppression Diode (VD5) and one end of common mode inductance (L2) connect, the other end of metal-oxide-semiconductor (VT1) is connected with the other end of resistance (R20), metal-oxide-semiconductor (VT1) other end is connected with one end of resistance (R21) and one end of resistance (R22) respectively, the other end of resistance (R21) respectively with the other end of resistance (R22), the other end of diode (VD4), the other end of Transient Suppression Diode (VD5) and the other end of common mode inductance (L2) connect, 1st pin of output port (J1) connects power supply ground, 2nd pin of integrated chip (U2) respectively with one end of diode (VD6), one end of diode (VD7) is connected with one end of diode (VD12), the other end of diode (VD7) respectively with one end of diode (VD11), one end of electric capacity (C17), one end of Transient Suppression Diode (VP1) and the other end of common mode inductance (L2) connect, the other end of diode (VD6) respectively with one end of diode (VD10), one end of electric capacity (C6) and one end of resistance (R15) connect, Transient Suppression Diode (VP1) is connected with the other end of resistance (R15) and the other end of common mode inductance (L2) respectively, the other end of diode (VD10) and the other end of diode (VD11) respectively with power supply be connected, the other end of diode (VD12) is connected with resistance (R16), 3rd pin of integrated chip (U2) is connected with power supply ground, 5th pin of integrated chip (U2) is connected with the 6th pin of integrated chip (U2) and one end of electric capacity (C8) respectively, 8th pin of integrated chip (U2) respectively with the other end of resistance (R16), the positive terminal of electric capacity (E2) and one end of electric capacity (C9) connect, the other end of electric capacity (C8), the negative pole end of electric capacity (E2) and the other end of electric capacity (C9) respectively with power supply be connected, 4th pin of integrated chip (U2) is connected respectively with to one end of optocoupler (Q10) and one end of optocoupler (Q9), the other end of optocoupler (Q10) respectively with one end of resistance (R24), one end of electric capacity (C11), the other end of optocoupler (Q9) and one end of resistance (R25) connect, the other end of optocoupler (Q10) is connected with power supply+5V, optocoupler (Q9) other end is connected with power supply ground GNDYx, the other end of resistance (R24) is connected with power supply+3.3V, one end of resistance (R27) is connected with the other end of electric capacity (C11), the other end of resistance (R25) is connected with power supply respectively with the other end of resistance (R27), the other end of optocoupler (Q10) is connected with the other end of optocoupler (Q9) and the 1st pin of output (J2) respectively, 7th pin of integrated chip (U2) is connected respectively with to one end of optocoupler (Q7) and one end of optocoupler (Q8), the other end of optocoupler (Q7) respectively with one end of resistance (R29), one end of electric capacity (C10), the other end of optocoupler (Q8) and one end of resistance (R26) connect, the other end of optocoupler (Q7) is connected with power supply+3.3V, optocoupler (Q8) other end is connected with power supply ground, the other end of resistance (R29) is connected with power supply+5V, one end of resistance (R28) is connected with the other end of electric capacity (C10), the other end of resistance (R26) and the other end of resistance (R28) are connected with power supply ground GNDYx respectively, the other end of optocoupler (Q7) is connected with the other end of optocoupler (Q8) and the 2nd pin of output (J2) respectively, 3rd pin of output (J2) is connected with power supply ground.
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