CN1049624A - Solder, brazing flux and uses thereof - Google Patents
Solder, brazing flux and uses thereof Download PDFInfo
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- CN1049624A CN1049624A CN 90104321 CN90104321A CN1049624A CN 1049624 A CN1049624 A CN 1049624A CN 90104321 CN90104321 CN 90104321 CN 90104321 A CN90104321 A CN 90104321A CN 1049624 A CN1049624 A CN 1049624A
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- solder
- brazing flux
- brazing
- soldering
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Abstract
The invention relates to the technology of solder, brazing flux and uses thereof, particularly the technology of diamond tool low-silver solder soldering.It discloses a kind of low silver-colored Cd brazing alloy free and brazing flux with matching is formed, the process conditions of using above-mentioned low-silver solder, brazing flux braze welding diamond carcass and metallic matrix are also disclosed, various diamond tools through soldering of the present invention, the shear strength of its soldered fitting reaches the level of high silver solder brazing filler metal, and index is 179.5N/mm
2
Description
The invention relates to the technology of solder, brazing flux and uses thereof, particularly relate to the technology of low-silver solder soldering on diamond tool.
The solder, the brazing flux that are used on the soldering tech in industrial maturation, application widely, all have detailed introduction already on specialized textbook.As " Welding Method ﹠ Equipment " (Zou's happy, Wei Yuezhen, China Machine Press, front page in 1981.) solder and brazing flux and soldering tech all there are detailed explanation.But with regard to low-silver solder, used brazing flux and soldering tech introduction seldom, at present the data at home and abroad report is also rarely found, and the low-silver solder, brazing flux and the soldering tech that are used for the diamond tool soldering do not see that as yet report is arranged.In known containing in the Ag solder, most widely used is to contain the Ag amount about 50% or greater than 50%.The solder that is lower than 40%Ag is used less, Ag content be lower than 10% just still less, and fail to be applied to actual production gratifying brazing flux is used, welding effect is not good because the low Ag solder of this class does not still have.Particularly most Ag solder all contains the Cd metal ingredient of some, and Cd has partial gasification in brazing process, fill the air in air, poisons environment, influences operator ' s health.Even like this, hang down the precedent yet not appearance that the Ag solder is used for the diamond tool welding.The soldering of known diamond tool, adopt the solder of Ag about 50% and the brazing flux that matches with it always, as the trade mark " HL313 " Ag50 ± 1.0%, Cu15.5 ± 1.0%, Zn16 ± 2.0%, Cd18 ± 1%, fusing point is between 625~635 ℃, with the brazing flux trade mark " QJ102 ", its chemical composition is KF42 ± 2% substantially, KBF
423 ± 1%, B
2O
335 ± 1%.Be used for the high frequency brazing of diamond tool, technology is ripe, and effect is gratifying, but owing to contain Cd, its toxicity is uneasy, and because Ag is a noble metal, price is also higher.In order to reduce the consumption of silver, reduce the cost of diamond tool, eliminate of the threat of Cd poison to health of people, adopt low-silver solder can release the diamond tool new product simultaneously, we have carried out new research work.
One of purpose of the present invention is to research and solve a kind of low-silver solder and brazing flux with matching, makes it to be fit to the soldering requirement of diamond tool, releases the new varieties diamond cutter.
Two of purpose of the present invention is at low-silver solder that works out and brazing flux, researchs and solves the soldering tech of diamond tool.
The 3rd purpose of the present invention is not only to study the low-silver solder that is fit to the diamond cutter soldering, and will eliminate the Cd metal ingredient in solder, with protection environment and operating personnel's health.
The 4th purpose of the present invention is to research and solve a kind of brazing flux of wide spectrum, makes the solder that is worked out have adaptability widely.Not only can be used for the soldering of low-silver solder, also can be used for the soldering of high silver solder, even be applicable to the low-silver solder of Ag 5%; Be not only applicable to the soldering of diamond tool, be applicable to the soldering between other metal or alloy yet, can be used for the melting welding of flame heat yet.
The low-silver solder that is used for the diamond tool soldering is the technical blank of the industry, its key problem in technology is exactly the composition that solves low-silver solder, the solder of this composition, temperature requirement when its fusion range must satisfy the diamond tool soldering has sufficient wetting capacity and enough strong bonding force to soldered material.Those skilled in the art knows, diamond cutter is made up of diamond segment and the soldering of metal or alloy matrix, diamond segment is by the diamond powder of a certain amount of various grades cooperations and the Metal Substrate or the alloy-based powder of q.s, technology according to powder metallurgy, the pseudo-alloy body that hot pressing or sintering form, copper base pseudo-alloy diamond carcass (or being briquetting) is arranged, cobalt-based pseudo-alloy diamond carcass is arranged, WC base pseudo-alloy diamond carcass or the like.Above-mentioned diamond carcass is welded on the metallic matrix through soldering, as 65Mn steel, T
8Steel or 45
#Steel etc. just can form adamantine instrument, bore or the like as diamond garden saw, band saw, milling instrument, hobber, drill bit, thin-walled.One of adamantine chemical property is exactly in air, oxidized danger is arranged, general diamond under certain high temperature, surpass 850 ℃ just obviously oxidized, the time is long more, oxidation is serious more, be exactly the most resistant to elevated temperatures black diamond, its oxidation resistance temperature is also below 960 ℃.So the brazing temperature of diamond tool below 900 ℃, does not preferably surpass 850 ℃, the fusing point of solder must be below 800 ℃ so.Under melting temperature, solder can melt rapidly, and under the help of brazing flux, fully soak into the surface of welded article, drawout apace, the filling weld seam is brought into play its connection effect.
In the soldering of diamond tool, because the contact-making surface of diamond segment and metallic matrix is all smaller, the gap of contact-making surface also requires narrow, so require that employed solder has a certain width and have the enough thin roll coil of strip, and existing silver-containing solder, (below 30%) that Ag content is low is more crisp, harder, do not mentionlet alone and be rolled into the thin roll coil of strip, also there are a lot of difficulties in the coil of wire that pulls into certain minor diameter.In order to realize the application of low-silver solder in the diamond tool soldering, the inventor has made repetition test in the prescription of low-silver solder, adjusts the ratio of each component, increases necessary metal ingredient, controls it subtly and forms, and has obtained satisfied effect.
The composition of low-silver solder of the present invention has at first been eliminated toxic metals cadmium (Cd), and control Ag amount is no more than 30%, adjusts other composition again, the compositing range of whole batching is as follows: Ag26~30%, Cu36~40%, Zn28~32%, Sn≤5%, the fusing point of this component alloy are 650~750 ℃.Experiment shows that Ag is lower than 26%, Sn be higher than 5% not only fusing point raise, and hardness and fragility all are unsuitable for and are rolled into strip.The optimum content of Sn should be between 2~2.5%.The low-silver solder of smelting out according to above-mentioned composition can be drawn into the wire rod more than the φ 0.3mm, can be rolled into 0.2mm thickness, has the thin coiled stock of certain width, and the low Ag solder that is used for the diamond tool soldering is with the form supply of material of thin coiled stock.
A typical example of solder of the present invention, its composition is Ag30%, Cu40%, Zn27.5%, Sn2.5, it can be made into the above coil of wire of φ 0.3mm and the thin coiled stock of 0.2mm * 3-10mm.
Above-mentioned solder not only is specially adapted to the soldering of diamond tool, and under the cooperation of brazing flux of the present invention, can be widely used in the relevant soldering requirement of electronics industry, mechanical industry, obtains satisfied effect.
Suitable solder must promote welding with suitable brazing flux, brazing flux cooperates the common use of solder in brazing process, it can guarantee that brazing process carries out smoothly, impel the densification that is obtained sufficient intensity between the interface of soldering to connect, in the effect that chemically has suitable catalyst or catalyst, the mechanism of its physics chemical action is exactly to improve the solder the melted wellability to the materials to be welded interface, improve the wetting capacity of solder, before soaking into generation, brazing flux under high temperature action is at first brought into play its effect of removing the materials to be welded oxide on surface, for sprawling of solder cleared the way.Can protect simultaneously solder and welded article interface not oxidized in brazing process again, and after soldering was finished, brazing flux itself was almost all squeezed outside weld seam, became welding slag and was eliminated.
Existing brazing flux proves in practice and can not satisfy the low requirement of Ag solder in the diamond tool soldering, even the low-silver solder that use in other field is also being sought new brazing flux, to obtain satisfied welding effect.
Brazing flux of the present invention on the basis of the prescription of studying existing brazing flux, is adjusted the brazing flux prescription, increases necessary composition, forms a kind of extensive adaptive brazing flux that has.The improved mixing use of to the effect that taking alkali metal fluoride, the mostly single use of the brazing flux in past KF, brazing flux of the present invention then uses the mixture of KF, NaF and LiF, adds the powder of a spot of B, Si, C simultaneously.Three kinds of element powders can mix adding simultaneously, also can use separately.Brazing flux of the present invention mainly composed as follows: H
3BO
332-38% KBF
415-21%, Na
2B
4O
78-12% MeF<38%(Me=K+Na+Li) the B powder adds the total amount of silica flour and carbon dust below 3%.The mechanism of action is as can be known in brazing process according to brazing flux; it must be before the solder fusing; play a role; for the melt flow of solder is launched the road; must when solidifying, the solder melt be squeezed outside the weld seam again, with the solder under the protection high temperature and not oxidized by the weldering interface; thereby the assurance weld strength is guaranteed welding quality.Be discharged from whole temperature range outside the weld seam from the brazing flux brazing flux that begins to play a role, be called the active temperature scope of brazing flux.This shows that the active temperature scope of brazing flux is wide more, just easy more realization of this effect.The active temperature scope of brazing flux of the present invention is than broad, and between 600 ℃~850 ℃, its active temperature surpasses 200 ℃ greatly, and it has extensive applicability.The restriction that the brazing flux in past is sat in the right seat a bit at different filler and welding object will be selected according to solder and welding object, selects the improper soldering effect that then influences.Brazing flux of the present invention has then been broken this restriction greatly, and it is to argentiferous all solders more than 5%, as long as all be suitable within the active temperature scope of this brazing flux, also is specially adapted to low Ag(26~30% of diamond tool) soldering of solder.It is not only applicable to soldering, and can be used for flame melting welding.
In brazing flux preparation, various chemical raw materials can adopt the preparation of the crystallization water, and alkali metal fluoride is limited in below 38%, and the ratio restriction of KF, LiF, NaF is not strict, but anyly all must not be less than 3%.The raw material of preparation usefulness, compound should be crushed to-200 orders, and element B, Si, C should be crushed to-300 orders.When being made into paste or pastel, at heating below 100 ℃, stirring and an amount of distilled water of even adding, making unit weight is 1.5~2.5g/cm
3Paste or pastel, also can make pulverulent mixture, powder is applicable to the flame welding process.One of example of manufacturing this brazing flux is: NaF, KF, LiF are with its total amount 36% of ratio of 1: 1: 1, H
3BO
335%, KBF
418%, Na
2B
4O
710%, B 2%, and behind the mixing, stirring adds H under 100 ℃ of heating
2O 10%, makes brown paste, the about 2g/cm of unit weight
3
Free-revving engine of the present invention is a low-sliver of realizing diamond tool, to reduce the consumption of silver, reduces production costs, and eliminates the public hazards of Cd in the solder, releases the diamond tool new product of new solder brazing simultaneously.At the low-silver solder of this purpose research, brazing flux, the improvement through the diamond tool soldering tech meets the demands fully.The process conditions of low-silver solder brazed diamond tool are to adopt the high frequency brazing technology, with foregoing invention solder and brazing flux, the usage ratio of solder and brazing flux 1: 0.6~1, under 700 ℃~850 ℃ temperature, the time that keeps 0.5~3 second, obtain the diamond cutter of novel solder brazing, average weld strength reaches the level with the 50%Ag solder brazing, and the solder side shear strength reaches 179.5N/mm
2No matter be the diamond carcass of Cu base, Co base or WC base, no matter also be and 65Mn steel, T
8Steel still is 45
#Welding, above-mentioned solder, brazing flux and soldering processes all meet the demands, and the solder that can both obtain weld layer consists of the novel diamond tool of Ag 26-30% Cu 36-40% Zn 28-32% Sn 2.0-2.5%.
Claims (8)
1, a kind of silver-bearing copper cored solder that does not contain cadmium is made up of Ag, Cu, Zn, Sn etc., it is characterized in that Ag26-30%, Cu36-40%, Zn28-32%, Sn≤5%.
2, according to the solder of claim 1 defined, it is characterized in that said Sn, its content is 2~2.5%.
3,, it is characterized in that said solder is is product form with the above coil of wire of φ 0.3mm and 0.2mm * 3-10mm roll coil of strip according to the solder of claim 1 or 2 defineds.
4, a kind of brazing flux that is suitable for the silver solder soldering is by H
3BO
3, Na
2B
4O
7, KBF
4, compositions such as KF is characterized in that H
3BO
332~38%, Na
2B
4O
78-12%, KBF
415~21%, MeF<38%(Me=K+Li+Na), the total amount of B+Si+C is less than 3%.
5, according to the brazing flux of claim 4 defined, it is characterized in that said alkali metal fluoride, KF, NaF and LiF anyly in batching must not be less than 3%.
6, according to the brazing flux of claim 4 defined, it is characterized in that said B powder, Si powder and C powder can use jointly, also can use separately, and must be below-300 orders.
7,, it is characterized in that the pseudo-alloy diamond carcass joint piece of soldering Cu base, Co base or WC base and 65Mn steel, T according to a kind of purposes of the brazing flux of claim 1-3 defined solder and 4-6 defined
8Steel or 45
#Metal or alloy matrixes such as steel form diamond tool, adopt the high frequency brazing technology, and the ratio of solder and brazing flux is 1: 0.6-1, and brazing temperature is at 700~850 ℃, and the high temperature brazing time was 0.5~3 second.
8, the diamond tool of finishing according to the technology soldering of claim 7 defined is by the pseudo-alloy diamond carcass of Cu base, Co base or WC base joint piece and 65Mn steel, T
8Steel or 45
#The metallic matrix of steel is formed, it is characterized in that between diamond carcass and the metallic matrix solder layer consist of Ag26-30%, Cu36-40%, Zn28-32%, Sn≤5%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 90104321 CN1018342B (en) | 1990-06-14 | 1990-06-14 | Soldering flux and soldering paste diamond tool |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 90104321 CN1018342B (en) | 1990-06-14 | 1990-06-14 | Soldering flux and soldering paste diamond tool |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1049624A true CN1049624A (en) | 1991-03-06 |
CN1018342B CN1018342B (en) | 1992-09-23 |
Family
ID=4878506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 90104321 Expired CN1018342B (en) | 1990-06-14 | 1990-06-14 | Soldering flux and soldering paste diamond tool |
Country Status (1)
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CN (1) | CN1018342B (en) |
Cited By (13)
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CN101524793B (en) * | 2009-04-20 | 2011-05-04 | 金华市三环焊接材料有限公司 | Cadmium-free silver filler containing lithium and niobium |
CN101954552B (en) * | 2010-01-08 | 2012-05-23 | 佛山市顺德区三胜家电制造有限公司 | Novel non-corrosive brazing flux used for silver brazing filler metal or copper-phosphorus-silver brazing filler metal |
CN102814601A (en) * | 2012-01-15 | 2012-12-12 | 洛阳美克金刚石有限公司 | Soldering flux for brazing diamond cemented carbide sand and preparation method for soldering flux |
CN103978321A (en) * | 2014-05-09 | 2014-08-13 | 西安交通大学 | Phosphorous-containing novel cadmium-free silver solder |
CN106346165A (en) * | 2016-08-30 | 2017-01-25 | 郑州机械研究所 | High-tin-content silver welding rod and manufacturing method thereof |
CN106935794A (en) * | 2017-03-15 | 2017-07-07 | 陈熙野 | A kind of preparation method of copper electrode of gilding |
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CN110625288A (en) * | 2019-08-27 | 2019-12-31 | 南京理工大学 | Ga and Nd-containing low-silver cadmium-free silver solder |
CN111344105A (en) * | 2017-12-19 | 2020-06-26 | 郑州机械研究所有限公司 | Brazing filler metal sheath and preparation method thereof, in-situ synthesized metal coating flux-cored silver brazing filler metal and preparation method thereof, welding method and connector |
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CN112453763A (en) * | 2020-12-03 | 2021-03-09 | 广东省石油化工职业技术学校 | Preparation method of diamond grinding tool |
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1990
- 1990-06-14 CN CN 90104321 patent/CN1018342B/en not_active Expired
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CN101524793B (en) * | 2009-04-20 | 2011-05-04 | 金华市三环焊接材料有限公司 | Cadmium-free silver filler containing lithium and niobium |
CN101954552B (en) * | 2010-01-08 | 2012-05-23 | 佛山市顺德区三胜家电制造有限公司 | Novel non-corrosive brazing flux used for silver brazing filler metal or copper-phosphorus-silver brazing filler metal |
CN102814601B (en) * | 2012-01-15 | 2015-07-01 | 河南飞孟金刚石工业有限公司 | Soldering flux for brazing diamond cemented carbide sand and preparation method for soldering flux |
CN102814601A (en) * | 2012-01-15 | 2012-12-12 | 洛阳美克金刚石有限公司 | Soldering flux for brazing diamond cemented carbide sand and preparation method for soldering flux |
CN107671454A (en) * | 2013-03-15 | 2018-02-09 | 林肯环球股份有限公司 | The not welding agent of boronic acid containing |
CN103978321A (en) * | 2014-05-09 | 2014-08-13 | 西安交通大学 | Phosphorous-containing novel cadmium-free silver solder |
CN106346165A (en) * | 2016-08-30 | 2017-01-25 | 郑州机械研究所 | High-tin-content silver welding rod and manufacturing method thereof |
CN106346165B (en) * | 2016-08-30 | 2019-02-05 | 郑州机械研究所 | A kind of high tin silver solder and preparation method thereof |
CN106935794B (en) * | 2017-03-15 | 2019-08-06 | 陈熙野 | A kind of preparation method for copper electrode of gilding |
CN106935794A (en) * | 2017-03-15 | 2017-07-07 | 陈熙野 | A kind of preparation method of copper electrode of gilding |
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CN107824765A (en) * | 2017-10-19 | 2018-03-23 | 驻马店恒久机械制造有限公司 | A kind of impeller flange form steel pricker closes brake drum and preparation method thereof |
CN111344105A (en) * | 2017-12-19 | 2020-06-26 | 郑州机械研究所有限公司 | Brazing filler metal sheath and preparation method thereof, in-situ synthesized metal coating flux-cored silver brazing filler metal and preparation method thereof, welding method and connector |
CN110625288A (en) * | 2019-08-27 | 2019-12-31 | 南京理工大学 | Ga and Nd-containing low-silver cadmium-free silver solder |
CN110625288B (en) * | 2019-08-27 | 2021-06-29 | 南京理工大学 | Ga and Nd-containing low-silver cadmium-free silver solder |
CN112080744A (en) * | 2020-08-20 | 2020-12-15 | 西安交通大学 | Blade tip cutting coating capable of improving bonding strength with blade tip and preparation method thereof |
CN112080744B (en) * | 2020-08-20 | 2021-12-28 | 西安交通大学 | Blade tip cutting coating capable of improving bonding strength with blade tip and preparation method thereof |
CN112453763A (en) * | 2020-12-03 | 2021-03-09 | 广东省石油化工职业技术学校 | Preparation method of diamond grinding tool |
Also Published As
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