CN104956505B - 热电元件以及其制造方法 - Google Patents
热电元件以及其制造方法 Download PDFInfo
- Publication number
- CN104956505B CN104956505B CN201380071254.6A CN201380071254A CN104956505B CN 104956505 B CN104956505 B CN 104956505B CN 201380071254 A CN201380071254 A CN 201380071254A CN 104956505 B CN104956505 B CN 104956505B
- Authority
- CN
- China
- Prior art keywords
- thermoelectric
- contact surface
- layer
- thermoelectric layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
附图标记 | 名称 |
100 | 基底 |
110 | 热侧 |
120 | 冷侧 |
130 | 纵边缘 |
140 | 纵边缘 |
150 | 横边缘 |
160 | 横边缘 |
200 | 第一接触面 |
210 | 第二接触面 |
220 | 第三接触面 |
300 | p层 |
310 | 接触区段 |
320 | 接触区段 |
330 | n层 |
340 | 接触区段 |
350 | pn结 |
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013100691.4 | 2013-01-24 | ||
DE102013100691 | 2013-01-24 | ||
PCT/EP2013/061989 WO2014114366A1 (de) | 2013-01-24 | 2013-06-11 | Thermoelektrisches element sowie verfahren zu dessen herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104956505A CN104956505A (zh) | 2015-09-30 |
CN104956505B true CN104956505B (zh) | 2017-09-19 |
Family
ID=48748165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380071254.6A Expired - Fee Related CN104956505B (zh) | 2013-01-24 | 2013-06-11 | 热电元件以及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9627601B2 (zh) |
EP (1) | EP2917944B1 (zh) |
CN (1) | CN104956505B (zh) |
WO (1) | WO2014114366A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6093910B2 (ja) * | 2014-05-01 | 2017-03-08 | 三菱電機株式会社 | 熱電変換装置および熱電変換装置の製造方法 |
CN110474570A (zh) * | 2019-09-16 | 2019-11-19 | 桂林电子科技大学 | 一种具有柔性可延展结构的温差发电器及其制作方法 |
DE102021209656B3 (de) | 2021-09-02 | 2022-09-29 | Nikolay Iosad | Thermoelektrisches Element, thermoelektrischer Generator und Verfahren zu deren Herstellung |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1441972A (zh) * | 2000-05-02 | 2003-09-10 | 格哈德·斯番 | 热电元件 |
CN102272956A (zh) * | 2009-07-10 | 2011-12-07 | 欧-弗莱克斯科技有限公司 | 带有多个热电器件的模块 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE58904576D1 (de) * | 1988-02-22 | 1993-07-08 | Migowski Friedrich Karl | Thermogenerator. |
EP1547126A2 (en) * | 2002-08-05 | 2005-06-29 | The Research Foundation Of State University Of New York | System and method for manufacturing embedded conformal electronics |
US7851691B2 (en) * | 2003-12-02 | 2010-12-14 | Battelle Memorial Institute | Thermoelectric devices and applications for the same |
EP1737053B1 (en) * | 2004-03-25 | 2012-02-29 | National Institute of Advanced Industrial Science and Technology | Thermoelectric conversion element and thermoelectric conversion module |
JP2008205129A (ja) * | 2007-02-19 | 2008-09-04 | Tokai Rika Co Ltd | 回路ブロック及びその製造方法 |
EP1976034A3 (en) | 2007-03-29 | 2011-11-09 | Stichting IMEC Nederland | Method for manufacturing a thermopile, the thermopile thus obtrained and a thermoelectric generator comprising such thermopiles |
FR2946798B1 (fr) * | 2009-06-12 | 2011-10-28 | Commissariat Energie Atomique | Micro-structure pour generateur thermoelectrique a effet seebeck et procede de fabrication d'une telle micro- structure. |
JP2011192923A (ja) * | 2010-03-16 | 2011-09-29 | Fujitsu Ltd | 熱電変換装置及びその製造方法 |
-
2013
- 2013-06-11 US US14/762,863 patent/US9627601B2/en not_active Expired - Fee Related
- 2013-06-11 CN CN201380071254.6A patent/CN104956505B/zh not_active Expired - Fee Related
- 2013-06-11 WO PCT/EP2013/061989 patent/WO2014114366A1/de active Application Filing
- 2013-06-11 EP EP13734677.1A patent/EP2917944B1/de active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1441972A (zh) * | 2000-05-02 | 2003-09-10 | 格哈德·斯番 | 热电元件 |
CN102272956A (zh) * | 2009-07-10 | 2011-12-07 | 欧-弗莱克斯科技有限公司 | 带有多个热电器件的模块 |
Also Published As
Publication number | Publication date |
---|---|
US9627601B2 (en) | 2017-04-18 |
WO2014114366A1 (de) | 2014-07-31 |
CN104956505A (zh) | 2015-09-30 |
EP2917944A1 (de) | 2015-09-16 |
US20150325765A1 (en) | 2015-11-12 |
EP2917944B1 (de) | 2016-12-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Duisburg Patentee after: Malege Electronics Co.,Ltd. Address before: Duisburg Patentee before: O-FLEXX TECHNOLOGIES GmbH |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180723 Address after: Stuttgart, Germany Patentee after: MAHLE INTERNATIONAL GmbH Address before: Duisburg Patentee before: Malege Electronics Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170919 Termination date: 20190611 |