CN104955268A - 电路板 - Google Patents

电路板 Download PDF

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Publication number
CN104955268A
CN104955268A CN201410115607.4A CN201410115607A CN104955268A CN 104955268 A CN104955268 A CN 104955268A CN 201410115607 A CN201410115607 A CN 201410115607A CN 104955268 A CN104955268 A CN 104955268A
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CN
China
Prior art keywords
copper foil
circuit board
tip
wide portion
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410115607.4A
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English (en)
Inventor
彭章龙
陈俊生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Wuhan Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Wuhan Co Ltd
Priority to CN201410115607.4A priority Critical patent/CN104955268A/zh
Priority to US14/543,303 priority patent/US20150282316A1/en
Publication of CN104955268A publication Critical patent/CN104955268A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

一种电路板，包括板体、铜箔、焊料及电子元件，所述铜箔设置于所述板体上，所述焊料涂覆于所述铜箔上而形成焊接部，所述焊接部包括焊接于所述铜箔上的宽部及自所述宽部延伸形成的尖部，所述电子元件焊接于所述宽部而与所述铜箔电性连接，所述宽部的厚度大于所述尖部的厚度，所述尖部呈扇形，顺着所述尖部能够方便将所述焊接部从所述铜箔上脱离。

Description

电路板
技术领域
本发明涉及一种电路板。
背景技术
电子产品的大量使用，使得应用于电子产品的电路板也得到广泛应用，为了满足广大用户的需求，电路板上的电路线布局越来越紧密，有些电路板上的电子元件的管脚较密，管脚之间的空隙大小不一，在拆卸相关的电子元件时，电路板上的锡膏不容易脱落。
发明内容
鉴于以上内容，有必要提供一种方便脱锡的电路板。
一种电路板，包括板体、铜箔、焊料及电子元件，所述铜箔设置于所述板体上，所述焊料涂覆于所述铜箔上而形成焊接部，所述焊接部包括焊接于所述铜箔上的宽部及自所述宽部延伸形成的尖部，所述电子元件焊接于所述宽部而与所述铜箔电性连接，所述宽部的厚度大于所述尖部的厚度，所述尖部呈扇形，顺着所述尖部能够方便将所述焊接部从所述铜箔上脱离。
优选地，所述铜箔包括头部及自所述头部延伸形成的尾部，所述宽部焊接于所述头部，所述尖部焊接于所述尾部。
优选地，所述头部的面积大于所述尾部的面积。
优选地，所述板体包括底层及相对于所述底层的顶层，所述铜箔设置于所述顶层。
优选地，所述宽部包括中心点，所述尖部包括端点，所述铜箔设有对称直线，所述对称直线自所述中心点及所述端点连接形成，所述焊接部沿所述对称直线呈轴对称。
优选地，所述尖部包括两外边，所述两外边之间形成一锐角。
优选地，所述电路板还包括环设于所述铜箔的防焊漆。
优选地，所述防焊漆为绿油。
优选地，所述焊料为锡膏。
与现有技术相比，所述电路板中，所述宽部的厚度大于所述尖部的厚度，顺着所述尖部能够方便将所述焊接部从所述铜箔上脱离。
附图说明
图1是本发明电路板的一较佳实施方式的一结构图。
图2是本发明电路板的一较佳实施方式的一示意图，其中焊料未涂覆于铜箔上。
图3是本发明电路板的一较佳实施方式的另一示意图，其中焊料未涂覆于铜箔上。
图4是图2中电子元件焊接于铜箔上的一示意图。
图5是本发明电路板的一较佳实施方式的一剖视图。
图6是图5中的焊接区域的一截面图。
主要元件符号说明
板体 10
顶层 11
接地层 12
底层 13
铜箔 20
头部 21
尾部 23
焊料 30
焊接部 31
宽部 310
尖部 312
外边 3120
中心点 314
端点 316
对称直线 318
电子元件 40
主体部 41
引脚 43
防焊漆 50
间隙 60
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，本发明电路板的一较佳实施方式包括一板体10、多个设置于所述板体10上的铜箔20、涂覆于所述铜箔20上的焊料30、一电子元件40及环设于所述铜箔20的防焊漆50。在一实施例中，所述焊料30为锡膏，所述防焊漆50为绿油。所述焊料30涂覆于所述铜箔20上而将所述电子元件40焊接于所述铜箔20上。
请参阅图2及图3，所述板体10包括一顶层11、一接地层12及一相对于所述顶层11的底层13。所述接地层12位于所述顶层11与所述底层13之间。在一实施例中，所述顶层11及所述底层13均为绝缘层。所述铜箔20用于沉设于所述顶层11及所述底层13。
请参阅图4，每一铜箔20包括一头部21及一自所述头部21延伸形成的尾部23。所述头部21的面积大于所述尾部23的面积。
所述电子元件40包括一主体部41及一自所述主体部41延伸形成的引脚43。
请参阅图5及图6，所述焊料30涂覆于每一铜箔20上而形成一焊接部31、并将所述电子元件40的引脚43焊接于所述铜箔20的头部21。每一焊接部31均包括一对应所述头部21的宽部310及一对应所述尾部23的尖部312。所述尖部312自所述宽部310延伸形成。所述宽部310焊接于所述头部21。所述尖部312焊接于所述尾部23。所述宽部310的厚度大于所述尖部312的厚度。所述宽部310呈圆形并包括一中心点314。所述尖部312呈扇形并包括一端点316。所述尖部312还包括两外边3120。所述两外边3120之间形成一锐角。所述焊接部31设有一对称直线318。所述对称直线318自所述中心点314及所述端点316连接形成。所述焊接部31为一围绕所述对称直线318的轴对称图形。所述多个对称直线318相互平行。相邻两个所述焊接部31的尖部312之间形成一间隙60。
请参阅图4及图5，在所述电路板中，当需要脱落所述焊料30时，操作所述尖部312能带动所述宽部310从所述铜箔20上脱落，从而方便脱落所述焊料30。由于每相邻的两个焊接部31的尖部312之间的间隙60较大，从而避免短路现象发生。
对本领域的技术人员来说，可以根据本发明的发明方案和发明构思结合生产的实际需要做出其他相应的改变或调整，而这些改变和调整都应属于本发明所公开的范围。

Claims (9)

1.一种电路板，包括板体、铜箔、焊料及电子元件，所述铜箔设置于所述板体上，其特征在于：所述焊料涂覆于所述铜箔上而形成焊接部，所述焊接部包括焊接于所述铜箔上的宽部及自所述宽部延伸形成的尖部，所述电子元件焊接于所述宽部而与所述铜箔电性连接，所述宽部的厚度大于所述尖部的厚度，所述尖部呈扇形，顺着所述尖部能够方便将所述焊接部从所述铜箔上脱离。
2.如权利要求1所述的电路板，其特征在于：所述铜箔包括头部及自所述头部延伸形成的尾部，所述宽部焊接于所述头部，所述尖部焊接于所述尾部。
3.如权利要求2所述的电路板，其特征在于：所述头部的面积大于所述尾部的面积。
4.如权利要求1所述的电路板，其特征在于：所述板体包括底层及相对于所述底层的顶层，所述铜箔设置于所述顶层。
5.如权利要求1所述的电路板，其特征在于：所述宽部包括中心点，所述尖部包括端点，所述铜箔设有对称直线，所述对称直线自所述中心点及所述端点连接形成，所述焊接部沿所述对称直线呈轴对称。
6.如权利要求1所述的电路板，其特征在于：所述尖部包括两外边，所述两外边之间形成一锐角。
7.如权利要求1所述的电路板，其特征在于：所述电路板还包括环设于所述铜箔的防焊漆。
8.如权利要求7所述的电路板，其特征在于：所述防焊漆为绿油。
9.如权利要求1所述的电路板，其特征在于：所述焊料为锡膏。
CN201410115607.4A 2014-03-26 2014-03-26 电路板 Pending CN104955268A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201410115607.4A CN104955268A (zh) 2014-03-26 2014-03-26 电路板
US14/543,303 US20150282316A1 (en) 2014-03-26 2014-11-17 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410115607.4A CN104955268A (zh) 2014-03-26 2014-03-26 电路板

Publications (1)

Publication Number Publication Date
CN104955268A true CN104955268A (zh) 2015-09-30

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ID=54169501

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CN201410115607.4A Pending CN104955268A (zh) 2014-03-26 2014-03-26 电路板

Country Status (2)

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US (1) US20150282316A1 (zh)
CN (1) CN104955268A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112347727A (zh) * 2019-08-08 2021-02-09 深圳市立创软件开发有限公司 一种支持圆弧边的填充型覆铜方法、系统、设备及存储介质

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4164778A (en) * 1976-07-20 1979-08-14 Matsushita Electric Industrial Co., Ltd. Printed circuit board
US5300815A (en) * 1992-07-17 1994-04-05 Lsi Logic Corporation Technique of increasing bond pad density on a semiconductor die
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
US6194667B1 (en) * 1998-08-19 2001-02-27 International Business Machines Corporation Receptor pad structure for chip carriers
US6201305B1 (en) * 2000-06-09 2001-03-13 Amkor Technology, Inc. Making solder ball mounting pads on substrates
US6590296B2 (en) * 2000-12-04 2003-07-08 Oki Electric Industry Co., Ltd. Semiconductor device with staggered hexagonal electrodes and increased wiring width
US6734570B1 (en) * 2003-01-24 2004-05-11 Gennum Corporation Solder bumped substrate for a fine pitch flip-chip integrated circuit package
US20050225406A1 (en) * 2004-01-29 2005-10-13 Kyocera Corporation Temperature-compensated quartz-crystal oscillator
US20080001273A1 (en) * 2006-06-29 2008-01-03 Park Jeong Hyun Semiconductor package having optimal interval between bond fingers for reduced substrate size
US20080236882A1 (en) * 2007-03-30 2008-10-02 Sharp Kabushiki Kaisha Circuit board and method of manufacturing same

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4164778A (en) * 1976-07-20 1979-08-14 Matsushita Electric Industrial Co., Ltd. Printed circuit board
US5300815A (en) * 1992-07-17 1994-04-05 Lsi Logic Corporation Technique of increasing bond pad density on a semiconductor die
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
US6194667B1 (en) * 1998-08-19 2001-02-27 International Business Machines Corporation Receptor pad structure for chip carriers
US6201305B1 (en) * 2000-06-09 2001-03-13 Amkor Technology, Inc. Making solder ball mounting pads on substrates
US6590296B2 (en) * 2000-12-04 2003-07-08 Oki Electric Industry Co., Ltd. Semiconductor device with staggered hexagonal electrodes and increased wiring width
US6734570B1 (en) * 2003-01-24 2004-05-11 Gennum Corporation Solder bumped substrate for a fine pitch flip-chip integrated circuit package
US20050225406A1 (en) * 2004-01-29 2005-10-13 Kyocera Corporation Temperature-compensated quartz-crystal oscillator
US20080001273A1 (en) * 2006-06-29 2008-01-03 Park Jeong Hyun Semiconductor package having optimal interval between bond fingers for reduced substrate size
US20080236882A1 (en) * 2007-03-30 2008-10-02 Sharp Kabushiki Kaisha Circuit board and method of manufacturing same

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Application publication date: 20150930