CN104953219A - RF board end connector and manufacturing method thereof - Google Patents
RF board end connector and manufacturing method thereof Download PDFInfo
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- CN104953219A CN104953219A CN201410121778.8A CN201410121778A CN104953219A CN 104953219 A CN104953219 A CN 104953219A CN 201410121778 A CN201410121778 A CN 201410121778A CN 104953219 A CN104953219 A CN 104953219A
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- terminal
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- conductive layer
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Abstract
The invention discloses an RF board end connector and a manufacturing method thereof. According to the RF board end connector, after an insulator covering a central terminal and a shell terminal is formed, electroplating of a conductive layer is carried out on parts, exposed out of the insulator, of the central terminal and the shell terminal in a synchronous or asynchronous mode, and the contact part and pins of the central terminal and the shell terminal are respectively electroplated with the conductive layer. As the part, covered by the insulator, of the central terminal can not be contacted with an electroplating solution, no conductive layer is formed, and melting tin solder of the pin can be prevented from flowing to the contact part. Thus, the problem of solder flowing happening to the thin RF board end connector during an SMT soldering process can be effectively solved.
Description
Technical field
The present invention relates to a kind of connector and manufacture method thereof, particularly a kind of RF plate terminal adapter and manufacture method thereof.
Background technology
The circuit board of electronic product can pass through SMT processing procedure welded plate terminal adapter usually, with chimeric with the line-end connector of connection wire by plate terminal adapter, the signal communication between the circuit board making wire rod and electronic product.Conventional plate terminal adapter manufacture adopts impact style on two material strips, to form center terminal and housing terminal respectively, then implementing plating respectively to two material strips, making the outer surface of center terminal and housing terminal plate same material for improving the conductive layer of conductivity.Then, the privileged site of the center terminal after plating and housing terminal is formed insulator by flush type injection technique, and complete the making of plate terminal adapter, but, because the plating of center terminal and housing terminal carries out respectively, and without enough support forces, easily produce crooked after being collided or fall terminal phenomenon, this has the impact of certain degree for the production efficiency that insulator is formed.In the manufacture process of SMT, tin matter solder between plate termination pin and circuit board can be melted, so that plate terminal adapter is welded in circuit board, but, plating easily guides at the conductive layer of center terminal and housing terminal outer surface the tin matter flow of solder material dissolved, now, the tin matter solder that plate terminal adapter pin dissolves, easily by the guiding of center terminal and housing terminal outer surface conductive layer, and by plate end insulator with the gap produced because coefficient of thermal expansion is different between center terminal from housing terminal, flow to the position that center terminal contacts with line-end connector with housing terminal, what namely this phenomenon practised title climbs tin phenomenon, tin matter solder after sclerosis like this can cause obstruction to the chimeric of plate terminal adapter and line-end connector, likely cause the tin matter insufficient solder connection of plate terminal adapter pin in addition, and allow plate terminal adapter firmly cannot be welded in circuit board, even also likely cause the electrical short between center terminal and housing terminal.
Electronic product various at present has diminishing trend, makes the plate terminal adapter in electronic product strictly be required to reduce with the chimeric height of line-end connector.Described chimeric height is required to narrow down to 1.2mm from 3.5mm the earliest, even be less than now the requirement of 1mm in addition, so cause the insulation thickness of plate terminal adapter more and more thin, sometimes the thickness of insulator is even required to be less than 0.2mm, even only 0.06mm is had in the interlock insulation thickness at position of the center terminal of plate terminal adapter and housing terminal, based on practical experience, the insulation thickness of plate terminal adapter is thinner, tin matter solder just more easily climbs tin through gap, and therefore the tin problem of climbing of current the thin plate terminal adapter is needed badly and overcome.
To this, industry has people to use laser to pull out the technology of gold, uses the mode of laser heating, and the coat of metal of being climbed by plate termination pin on tin path melts, and exposes the substrate of not easily climbing tin, to reduce the situation of climbing tin in the manufacture process of SMT.But, because the size of plate termination pin is little, the privileged site of laser heating plate termination pin is used, difficulty to a certain degree can be had, the coat of metal so likely occurred plate termination pin is climbed on tin path melts not exclusively, and causes climbing tin situation and cannot effectively be got rid of.Therefore, laser pull out technology for gold and cannot eradicate plate terminal adapter completely climb tin problem.
In sum, how to solve present the thin plate terminal adapter weld time face climb tin problem, be the problem that art personage is in the urgent need to address.
Summary of the invention
In view of the variety of problems of above-mentioned prior art, the present invention main purpose be to provide a kind of RF plate terminal adapter and manufacture method thereof, climb tin problem with what solve RF plate terminal adapter.
Secondary objective of the present invention is to provide a kind of RF plate terminal adapter and manufacture method thereof, to reduce the demand of plated material.
Another object of the present invention is to provide a kind of RF plate terminal adapter and manufacture method thereof, to improve the yield of RF plate terminal adapter.
For achieving the above object and other object, the invention provides a kind of manufacture method of RF plate terminal adapter, comprise: step one, provide the first conduction material strip of the center terminal with multiple equidistant arrangement, and there is the second conduction material strip of housing terminal of multiple respectively these center terminals corresponding; Step 2, group first, second conduction material strip vertical, makes the contact site of these center terminals be placed in the inner space of corresponding housing terminal respectively, and forms the connector assembly that many groups include center terminal and housing terminal; Step 3, each connector assembly is inserted mould, after the insulating material of injection is shaping, on each connector assembly, forms insulator, the partial portion of the coated center terminal of described insulator and housing terminal, and forms RF plate terminal adapter semi-finished product; Step 4, on each connector assembly, form insulator after, by the traction of first, second conductive material band body, each connector assembly is continued and passes through electroplating process, with synchronous or asynchronous system, the position that each connector assembly exposes insulator is electroplated, to plate center terminal conductive layer at the contact site of center terminal and pin, and plate housing terminal conductive layer at the contact site of housing terminal and pin; Step 5, after completing each connector assembly and exposing the plating at insulator position, cut off the connection of each connector assembly and first, second conductive material band body, to form the finished product of multiple RF plate terminal adapter.
Wherein, center terminal and housing terminal can be formed for impact style.The formation of insulator can use imbeds ejection formation method for making, even can select to organize vertical method for making.The conductive layer of center terminal and housing terminal is electroplated can phase in single electroplating device, makes the conductive layer selectively plating different-thickness or material at the pin of this center terminal and this housing terminal and contact site.
In addition, the present invention also provides a kind of RF plate terminal adapter manufactured by the manufacture method of above-mentioned RF plate terminal adapter, and it comprises insulator, center terminal and housing terminal.A part for center terminal is coated by insulator, another part then exposes insulator, center terminal exposes the center terminal contact site of insulator and center terminal pin for being electroplate with center terminal conductive layer, and center terminal is subject to the coated part of this insulator due to cannot contact plating solution and cannot form center terminal conductive layer.Housing terminal has inner space to place center terminal contact site, a part for housing terminal is coated by insulator, another part then exposes insulator, housing terminal exposes the pin of insulator and contact site for being electroplate with housing terminal conductive layer, and is subject to the coated part of insulator due to cannot contact plating solution and cannot form housing terminal conductive layer.
Alternatively, the material of conductive layer that the pin of center terminal and housing terminal and contact site plate can be the same or different.The thickness of the conductive layer that the pin of center terminal and housing terminal and contact site plate can be the same or different.
Compared to prior art, RF plate terminal adapter provided by the present invention, after the insulator of coated center terminal and housing terminal is formed, the plating of conductive layer is carried out at the position just exposing insulator to center terminal and housing terminal, center terminal and housing terminal can't form conductive layer by the position that insulating barrier is coated, and retain the substrate that one section of script just not easily climbs tin climbing in tin path, to stop that the tin matter solder that dissolves of pin flows to contact site via conductive layer through the gap of insulating barrier, therefore can exempt under the program of pulling out gold, what solve that known RF plate terminal adapter faces in follow-up SMT processing procedure climbs tin problem.In addition, because conductive layer only electroplates the part exsertion part at center terminal and housing terminal, therefore the demand of plated material can effectively be reduced.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of plate terminal adapter manufacture method of the present invention.
Fig. 2 is the material strip stereogram being formed with plate end center terminal according to an embodiment of the invention.
Fig. 3 is the material strip stereogram being formed with plate end housing terminal according to an embodiment of the invention.
The schematic diagram that Fig. 4 combines for material strip shown in Fig. 2 and Fig. 3.
The partial portion that Fig. 5 is connector assembly shown in Fig. 4 forms the schematic diagram of plate end insulator.
Fig. 6 be cut off the connector assembly after electroplated conductive layer and material strip body connection to form the schematic diagram of multiple plate terminal adapter.
The sectional view that Fig. 7 cuts off with AA line segment for the terminal adapter of plate shown in Fig. 6.
Symbol description
Embodiment
By particular specific embodiment, technology contents of the present invention is described below, those skilled in the art can understand other advantages of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented by other different specific embodiments or be applied.Every details in this specification also based on different viewpoints and application, not departing under spirit of the present invention, can carry out various modification and change.
For avoiding when RF plate terminal adapter and welding circuit board, via plate end insulator, tin is climbed due to different the produced gap of coefficient of thermal expansion between center terminal from housing terminal three, the invention provides a kind of RF plate terminal adapter and manufacture method thereof, mainly through ejection forming technique formed coated center terminal and housing terminal partial portion insulator and after forming the semi-finished product of RF plate terminal adapter, the plating of the conductive layer for promoting electric conductivity is carried out at the position just exposing insulator to center terminal and housing terminal, in the electroplating process of conductive layer, insulator can intercept the position of coated center terminal and housing terminal and the contact of electroplating solution, conductive layer only can be plated in position (i.e. contact site and pin) that center terminal and housing terminal expose insulator, so, with cut off center terminal and housing terminal are made up of conductive layer climb tin path, and then avoid RF plate terminal adapter when SMT processing procedure, dissolve the conductive layer of tin matter solder along center terminal and housing terminal pin through the gap of insulator, climb center terminal and the contact site of housing terminal for following line-end connector in electrical contact on one tunnel.
Refer to Fig. 1, i.e. the flow chart of steps of RF plate terminal adapter manufacture method of the present invention.As shown in the figure, in the manufacture method of RF plate terminal adapter of the present invention, first, implementation step S11, first of the center terminal 11 with multiple equidistant arrangement the conduction material strip 1(is provided to see also Fig. 2 respectively), and the second conduction material strip 2(of the housing terminal 21 with multiple these center terminals 11 corresponding respectively sees also Fig. 3).First conduction material strip 1 can produce aforesaid center terminal 11 by impact style, and aforesaid housing terminal 21 is also made by the punching press to the second conduction material strip 2, housing terminal 21 in upright hollow cylindrical, via shell wall around the space that can be formed in inside for placing center terminal contact site.
Then, implementation step S12, it is vertical that the material strip 2 that conducted electricity by first conduction material strip 1 and second carries out group, the contact site 112 of the multiple center terminals 11 on the first conduction material strip 1 is made to be placed in the inner space of corresponding housing terminal 21 respectively, and form the connector assembly (seeing also Fig. 4) that many groups include center terminal 11 and housing terminal 21, it should be noted that, the center terminal and the housing terminal contact site between the two that form described connector assembly need spaced a predetermined distance from, to make electrical isolation between both contact site.Then, implementation step S13, the material strip 2 that first conduction material strip 1 and second conducted electricity inserts the assigned address of mould, adopt flush type jetting process, Fig. 5 is seen also for coated center terminal 11 with the insulator 3(of housing terminal 21 middle part to be formed on each connector assembly be made up of double material strips), to form half product of the double material strips RF plate terminal adapter that can encompass web-like.Described insulator 3 can provide center terminal 11 and housing terminal 21 respectively and locate and electrical isolation, and the electroplating solution in electroplating bath also can be stoped to infiltrate coated center terminal 11 and housing terminal 21 position.
Complete the formation of above-mentioned insulator at each connector assembly after, implementation step S14, conduct electricity material strip 2 by the first conduction material strip 1 and second and provide traction to each connector assembly, each connector assembly is made sequentially to pass through electroplating process, with synchronous or asynchronous system, the position electroplated conductive layer of insulator is exposed to each this connector assembly, to form center terminal conductive layer 111 on the center terminal contact site 112 and center terminal pin 113 of center terminal 11, and on housing terminal contact site 212 and the housing terminal pin 213 of housing terminal 21, form housing terminal conductive layer 211(see also Fig. 6, Fig. 7).It should be noted that center terminal 11 electroplate with the conductive layer of housing terminal 21, can phase in single electroplating device, make the conductive layer selectively plating different-thickness or material at the pin of center terminal 11 and both housing terminal 21 and contact site.
Described center terminal contact site 112 and housing terminal contact site 212 are in electrical contact with the line-end connector of connection wire, and described center terminal pin 113 and housing terminal pin 213 are for soldered circuit board, with the signal of telecommunication of circuit board for receiving.The material of described center terminal conductive layer and housing terminal conductive layer can be selected from different metal materials, to guarantee the stability of Signal transmissions.Because electroplating solution not easily infiltrates in insulator, respectively this connector assembly center terminal and housing terminal are subject to the coated part of insulator, can't contact with electroplating solution in the process of plating, so can not conductive layer be formed, to retain the substrate (such as, the substrate of nickel matter or copper substrate) that one section of script not easily climbs tin respectively on center terminal and housing terminal, and interrupted center terminal and housing terminal are made up of conductive layer climb tin path.Make RF plate terminal adapter when carrying out follow-up SMT processing procedure, the tin matter solder dissolved cannot easily via the conductive layer on center terminal and housing terminal pin, one tunnel climb for line-end connector contact contact site, use solve present the thin plate terminal adapter run into when SMT processing procedure welds climb tin problem.
Finally, implementation step S15, each connector assembly electroplated in step S14 and first being conducted electricity material strip 1 and the second connection of conducting electricity material strip 2 body cuts off, to form the finished goods (seeing also Fig. 6) of multiple RF plate terminal adapter.
In one embodiment of the invention, when the position each connector assembly center terminal and housing terminal being exposed to insulator is electroplated, the plated material of similar and different material can be used, and respectively first, second conductive material band is powered, to implement to electroplate to center terminal and the exposed position of housing terminal stage by stage in single electroplating device, and according to the demand of actual signal transmission, plate the identical or different and conductive layer that thickness is identical or different of material at the pin of center terminal and housing terminal and contact site.What is more, for adapting to various behaviour in service, singly can plate the conductive layer of different-thickness or material with regard to the pin of center terminal and contact site, in like manner, also singly can plate the conductive layer of different-thickness or material with regard to the pin of housing terminal and contact site.
In addition, because center terminal of the present invention and housing terminal are only for the position electroplated metal layer exposing insulator, therefore the consumption of plated material can be saved under the prerequisite not affecting Signal transmissions, and significantly can reduce material cost.It should be noted that, the metal level plating of RF plate terminal adapter of the present invention, just carry out after formation insulator forms RF plate terminal adapter semi-finished product, compared to the known techniques of first electroplating rear formation insulator, the present invention can reduce center terminal and housing terminal and to be collided before forming insulator the chance deformed, and can insert the semi-finished product that ejection shaping die makes RF plate terminal adapter smoothly.In addition, the semi-finished product of RF plate terminal adapter are in the process of plating, the stable traction of the double material strips being divided into both sides can be subject to and provide support, and not easily in the process of plating, there is deformation, namely, not easily produce crooked after being collided or fall terminal phenomenon, and the production efficiency that can be formed for insulator there are the positive influences of certain degree.Moreover, also can repair the wearing and tearing of center terminal and housing terminal metal surface when forming insulator by the metal level of plating, and then improve quality and the yield of RF plate terminal adapter finished product.
In sum, the invention provides a kind of RF plate terminal adapter and manufacture method thereof, at least there is following characteristics:
1. only carry out the plating of metal level for center terminal and the exposed pin of housing terminal and contact site, therefore the demand of plated material can be reduced.
2. center terminal and housing terminal do not have the plating of metal level at the position that insulator is coated, make follow-up in the process of SMT, the tin matter solder dissolved cannot climb for the contact site contacted with line-end connector from center terminal and pin one tunnel of housing terminal, climb tin problem with what effectively solve known plate terminal adapter.
3. after insulator forms formation RF plate terminal adapter semi-finished product, just carry out the plating of metal level, and single electroplating device can be used, be respectively RF plate terminal adapter semi-finished product and expose outside the conductive layer that the pin of insulator and contact site plate identical or different metal material, and the conductive layer thickness that pin and contact site plate can be selected identical or different on demand.
4. after forming RF plate terminal adapter semi-finished product, just carry out the mode of metal level plating, except enough intensity can be provided in the process of plating to reduce the degree of being out of shape, also can repair the scratch to center terminal and housing terminal metal surface of ejection shaping die in insulator forming process by the metal level of plating, and then improve the yield of product.
Above-described embodiment is illustrative principle of the present invention and effect only, but not for limiting the present invention.Any those skilled in the art all without prejudice under the present invention's spirit and category, can carry out modifying to above-described embodiment and change.Therefore, the scope of the present invention, should be as claimed in claim.
Claims (6)
1. a manufacture method for RF plate terminal adapter, comprises the following steps:
There is provided the first conduction material strip and the second conduction material strip, wherein, the body of described first conduction material strip is stamped out the center terminal of multiple equidistant arrangement, and the body of described second conduction material strip is stamped out the housing terminal of the corresponding described center terminal of multiple difference;
Vertical first, second conduction material strip described of group, makes the contact site of described center terminal be placed into respectively in the inner space of corresponding housing terminal, and forms the connector assembly that many groups include center terminal and housing terminal;
Each described connector assembly is inserted mould, each described connector assembly forms insulator, the partial portion of the coated center terminal of described insulator and housing terminal, and form RF plate terminal adapter semi-finished product;
After each described connector assembly forms insulator, by the traction of first, second conductive material band body described, each described connector assembly is continued and passes through electroplating process, with synchronous or asynchronous system, the position that each described connector assembly exposes insulator is electroplated, to plate center terminal conductive layer at the contact site of center terminal and pin, and plate housing terminal conductive layer at the contact site of housing terminal and pin; And
Cut off the connection of each described connector assembly and first, second conductive material band body described, to form the finished product of multiple RF plate terminal adapter.
2. the manufacture method of RF plate terminal adapter as claimed in claim 1, is characterized in that, described insulator is formed by imbedding ejection formation method for making.
3. the manufacture method of RF plate terminal adapter as claimed in claim 1, it is characterized in that, it is phase in single electroplating device that the conductive layer of described center terminal and housing terminal is electroplated, and makes the conductive layer optionally plating different-thickness or material at the pin of described center terminal and housing terminal and contact site.
4. the RF plate terminal adapter manufactured by the manufacture method of RF plate terminal adapter according to claim 1, comprising:
Insulator;
Center terminal, a part is coated by described insulator, another part then exposes described insulator, the part that described center terminal exposes described insulator is plated, to form center terminal conductive layer at contact site and pin respectively, described center terminal is subject to the formation that the coated part of described insulator there is no described center terminal conductive layer; And
Housing terminal, there is inner space to place described center terminal contact site, a part for described housing terminal is coated by described insulator, another part then exposes described insulator, the part that described housing terminal exposes described insulator is plated, to plate housing terminal conductive layer at contact site and pin respectively, described housing terminal is subject to the coated part of described insulator and there is no and plate described housing terminal conductive layer.
5. RF plate terminal adapter as claimed in claim 4, it is characterized in that, the conductive layer material that the pin of described center terminal and described housing terminal and contact site plate can be the same or different.
6. RF plate terminal adapter as claimed in claim 4, it is characterized in that, the conductive layer thickness that the pin of described center terminal conductive layer and described housing terminal and contact site plate can be the same or different.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410121778.8A CN104953219A (en) | 2014-03-28 | 2014-03-28 | RF board end connector and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410121778.8A CN104953219A (en) | 2014-03-28 | 2014-03-28 | RF board end connector and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104953219A true CN104953219A (en) | 2015-09-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410121778.8A Pending CN104953219A (en) | 2014-03-28 | 2014-03-28 | RF board end connector and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN104953219A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106558827A (en) * | 2016-10-19 | 2017-04-05 | 东莞市睿奇五金制品有限公司 | A kind of 45 connector processing technologys of RJ |
| CN111816445A (en) * | 2019-04-10 | 2020-10-23 | 太阳诱电株式会社 | Multilayer ceramic electronic component and circuit board |
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| EP0360971A2 (en) * | 1988-08-31 | 1990-04-04 | Mitsui Mining & Smelting Co., Ltd. | Mounting substrate and its production method, and printed wiring board having connector function and its connection method |
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| CN106558827A (en) * | 2016-10-19 | 2017-04-05 | 东莞市睿奇五金制品有限公司 | A kind of 45 connector processing technologys of RJ |
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Application publication date: 20150930 |