CN104942660B - Manufacturing method of fission track sheets - Google Patents

Manufacturing method of fission track sheets Download PDF

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Publication number
CN104942660B
CN104942660B CN201510259524.7A CN201510259524A CN104942660B CN 104942660 B CN104942660 B CN 104942660B CN 201510259524 A CN201510259524 A CN 201510259524A CN 104942660 B CN104942660 B CN 104942660B
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grinding
thin slice
resin
polishing
fine grinding
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CN104942660A (en
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常健
邱楠生
刘念
周圆圆
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China University of Petroleum Beijing
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China University of Petroleum Beijing
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

The invention provides a manufacturing method of fission track sheets. The method includes the following steps that firstly, an automatic grinding device is used for roughly grinding primary products of the sheets till most particles are exposed on the surfaces of the sheets, then accurate grinding is performed till the largest faces of the most particles are exposed on the surfaces of the sheets, and next, the fission track sheets are obtained through fine grinding and polishing. The automatic grinding device is provided with an observation part capable of monitoring the grinding state of samples. Compared with the prior art, by means of the method, the sample preparation efficiency and the precision of the fission track sheets can be effectively improved.

Description

A kind of fission track preparation of sections method
Technical field
The invention belongs to geology, fission track and crystal optics field are and in particular to a kind of fission track preparation of sections Method.
Background technology
Fission track method be learn field commonly use a kind of hot dating technique, be widely used for study orogenic belt grand Rise the geological problems such as history, sedementary basin-thermal evolution, landform evolution.What is fission track?In nature, phosphorus The radioelement U that the mineral such as lime stone, zircon are contained within238Occur always to fission in earth history period, the two of fission generation Individual charged particle can move round about, can be produced a disturbed area by electrical charge rejection function influence along Particles Moving track Domain, causes lattice damage (i.e. radiation damage), after chemical etching, these radiation damagies just can be observed under an optical microscope Arrive, they are exactly fission track.Experimentation shows, the fission track density in mineral reduces and temperature main with contraction in length Relevant, people call anneal act this phenomenon.Using Arrhenius formula, the theoretic knowledge under laboratory condition is expanded Open up earth history period, and then propose the hot dating technique of fission track.Apatite fission track method is current development A kind of perfect heat determines year method, and its closure temperature is -120 DEG C, and corresponding partial annealing zone is 60-120 DEG C.Due to apatite The partial annealing zone of fission track and oil window have good corresponding relation, and this technology is just being widely used in basin at home Thermal history research.
The hot dating technique of fission track mainly includes two parameters:Track ages and track lenth.Fission-track age is Spontaneous track number by statistics mineral particle surface is calculated.Count spontaneous track number automatically to survey using Autoscan Amount system (a kind of optical microscope dedicated for statistics fission track) is observed and is calculated a certain mineral particle surface and crystal C The number of the parallel track etching elephant intersected with burnishing surface of axle., as about 1-4 μm of major diameter, minor axis diameter is about for track etching 0.5-1.5μm.Even if as amplifying 1000 times under an optical microscope, the identification that detects by an unaided eye still has certain difficulty for this etching Degree.Generally, in order to more easily identify and count track (etching as) it is desirable to the Apatite fission track thin slice burnishing surface of preparation On resin and mineral particle surface no scratch and pit, smoothness reaches micron order.Meanwhile, smooth burnishing surface is also beneficial to light Learn the reflected light in microscope and transmitted light function preferably acts on inside mineral grain, consequently facilitating observing and measurement granule The length of internal closing track.
Fission track thin slice preparation process generally comprises consolidated particles, grinding and polishing three phases.Existing operation side Method is primarily present problems with:(1) easily there is inequality of exerting oneself, thus causing sheet surface out-of-flatness in hand-ground and polishing;(2) Grinding can not be monitored at any time and what degree polishing proceeds to, easily produce and grind and the too short or long problem of polishing time, And need a stage body stereomicroscope irregularly to observe grinding effect.
Content of the invention
For solving the above problems, it is an object of the invention to provide a kind of fission track preparation of sections method, the method can Effectively improve sample preparation efficiency and the precision of fission track thin slice.
For reaching above-mentioned purpose, the invention provides a kind of fission track preparation of sections method, the method includes following Step:
First with automatic grinding equipment, thin slice first product is roughly ground and be exposed to sheet surface to 60%-80% granule, then refine to thick The largest face of the 50%-70% granule in the granule that mill exposes is (i.e. with its surface area on phosphorite crystal longer axis parallel direction Big cross section, as shown in Figure 3) it is exposed to sheet surface, then pass through fine grinding, polishing obtains fission track thin slice;
Described automatic grinding equipment is provided with the observation part that can monitor sample grinding state.
In the above-mentioned methods, the purpose of fine grinding is to remove the thick scratch (i.e. scratch width is more than 2 μm) that width is more than 2 μm, The purpose of polishing is to remove the trickle scratch that width is 0.3-2 μm;Remain on thin slice in thick scratch mainly rough grinding pass Scratch, trickle scratch is mainly the scratch of residual on thin slice in lapping process;These scratches include thin slice resin portion and The scratch of apatite particle part.
In the above-mentioned methods it is preferable that in described roughing operations, the grinding-material used by automatic grinding equipment is preferably Granularity is 15 μm of sand paper, and grinding pressure is preferably 15-18N, and speed of grinding plate is preferably 5000-6000rpm;In above-mentioned condition Under, general 10-15 minute of grinding can make most of apatite particle on thin slice be exposed to surface.
In the above-mentioned methods it is preferable that in described fine grinding operation, the grinding-material used by automatic grinding equipment is preferably Granularity is 9 μm of sand paper, and grinding pressure is preferably 15-18N, and speed of grinding plate is preferably 5000-6000rpm;Under these conditions, General 10-15 minute of grinding can make the largest face exposure of most of apatite particle on thin slice in surface.
In the above-mentioned methods it is preferable that in described fine grinding operation, the grinding-material used by automatic grinding equipment is preferably Granularity is 3 μm of sand paper, and grinding pressure is preferably 10-12N, and speed of grinding plate is preferably 3000-3500rpm;Under these conditions, General 8-10 minute of grinding can remove all thick scratches.
In the above-mentioned methods it is preferable that wherein said sand paper is diamond sand paper;Moistened using lubricant in grinding Sliding, lubricant is preferably water;Described automatic grinding equipment is preferably Leica EM TXP fine grinding all-in-one.
In the above-mentioned methods it is preferable that in described polishing operation, using polishing cloth (the soft and high polishing of resilience Cloth) it is polished, polish pressure is preferably 5N, and rotating speed is preferably 2500-3000rpm, and the lubricant of use is preferably 1 μm of Al2O3 Polishing fluid;Under these conditions, general polishing 20-25 minute can remove trickle scratch, and polishing cloth is preferably Struers A/S The MD-Chem polishing cloth of company.
In the above-mentioned methods it is preferable that automatic grinding equipment work in, described corase grind, fine grinding, fine grinding, polishing step Include the operation of the grinding state observing part observation thin slice by automatic grinding equipment respectively.Seen at any time by observing part Examine the grinding state of thin slice, can easily and timely determine described corase grind, fine grinding, fine grinding, the terminal of polishing.
In the above-mentioned methods it is preferable that the preparation method of described thin slice first product is:Take 2-3ml drop of resin on microscope slide, By in 1000-2000 a diameter of 60-200 μm of apatite particle resin by injection, after hardening of resin, (general standing 2 days, sets Fat can solidify completely) thin slice first product is obtained.The selection method of apatite particle generally has two kinds:One kind is directly stereoscopic micro- Select under mirror;Another kind is to screen qualified apatite particle with 150 aim cell sieves.
In the above-mentioned methods it is preferable that after in described apatite particle resin by injection, also including (can making by stirring With the tiny stirring rod such as toothpick) step that is distributed in resin bottom (contacting with microscope slide) with making apatite particle diversity.
According to specific embodiments of the present invention it is preferable that the method comprises the following steps:
Step one:Take 2-3ml drop of resin on microscope slide, then by 1000-2000 diameter between 60-200 μm of phosphorus In limestone particles resin by injection;
Step 2:By stirring, (i.e. distribution at random, no granule are stacked phenomenon) is distributed in making apatite particle diversity Resin bottom, is obtained thin slice first product after hardening of resin;
Step 3:With Leica EM TXP fine grinding all-in-one, thin slice first product is roughly ground, to the major part of thin slice first product (60%-80%) till granule is exposed to sheet surface, the diamond sand paper being 15 μm from granularity in corase grind, lubricant is pure Water, pressure is 15-18N, and rotating speed is 5000-6000rpm, passes through to observe the degree of grinding that part observes thin slice in process of lapping;
Step 4:Thin slice after corase grind is refined, to most of (50%-70% of corase grind exposure granule) granule Till largest face is exposed to sheet surface, the diamond sand paper being 9 μm from granularity in fine grinding, lubricant is pure water, and pressure is 15-18N, rotating speed is 5000-6000rpm, passes through to observe the degree of grinding that part observes thin slice in process of lapping;
Step 5:Fine grinding is carried out to the thin slice after fine grinding, removes the thick scratch of residual on thin slice in lapping process, in fine grinding The diamond sand paper being 3 μm from granularity, lubricant is pure water, and pressure is 10-12N, and rotating speed is 3000-3500rpm, grinds During by observe part observe thin slice degree of grinding;
Step 6:Thin slice after fine grinding is polished, on thin slice during removing fine grinding, the trickle scratch of residual, is obtained Fission track thin slice;Using the MD-Chem polishing cloth of Struers A/S company in polishing, lubricant is 1 μm of Al2O3Polishing fluid, Polish pressure is 5N, and rotating speed is 2500-3000rpm, and period passes through to observe the degree of grinding that part observes thin slice.
Finally, can grind and polishing effect in Autoscan Auto-Test System Microscopic observation.
The fission track preparation of sections method that the present invention provides not only is effectively improved the sample preparation of fission track thin slice Efficiency and precision;And make for micro- mineral flakes and provide a kind of efficient sample preparation scheme with process.The present invention provides Method overcome various problems in existing preparation fission track flaking process, and real work can be conveniently used in In, therefore, in the fast development of geology, there is positive role for fission track technology.
Brief description
Fig. 1 is the flow chart preparing fission track thin slice in embodiment 1;
Fig. 2 is the apatite image under apatite particle scanning electron microscope;
Fig. 3 is apatite particle largest face schematic diagram;
Fig. 4 is the schematic diagram of the thin slice first product of preparation in embodiment 1;
Fig. 5 be embodiment 1 in preparation thin slice etched obtain fission track etching as.
Specific embodiment
In order to be more clearly understood to the technical characteristic of the present invention, purpose and beneficial effect, the now skill to the present invention Art scheme carry out described further below, but it is not intended that to the present invention can practical range restriction.
Embodiment 1
Present embodiments provide a kind of fission track preparation of sections method (Fig. 1 is the flow chart of the method), it includes Following steps:
The first step:Obtain the apatite particle 1000-2000 that diameter is between 60-200 μm using 150 aim cell sieve screenings ?;Classified according to crystal optics, the apatite in nature belongs to hexagonal prism body, Fig. 2 is to observe under scanning electron microscope Apatite image, Fig. 3 be apatite particle largest face schematic diagram;
Second step:With 1:3 volume ratio allotment Epothin Epoxy Resin (epoxy resin) and Epothin Hardener (coagulator), stirs 5 minutes, makes their mix homogeneously, dip in 2-3ml with tiny stirring rod and drop on microscope slide, so It is slowly injected into the apatite particle of select afterwards, then is slowly stirred resin and apatite particle with toothpick, treat apatite particle Sink to resin bottom and disperse spread, stand 2 days, treat that resin solidifies completely, (Fig. 4 is at the beginning of the thin slice of preparation to prepared thin slice first product The schematic diagram of product);
3rd step:Using double faced adhesive tape, microscope slide is fixed on Leica EM TXP and refines on the object stage of all-in-one, then The diamond sand paper that granularity is 15 μm is fixed on mill;With pure water as lubricant, pressure parameter is set to 18N, mill Disk rotating speed is roughly ground (state before grinding is shown in Fig. 4) under the grinding condition for 5000-6000rpm;In process of lapping, pass through The binocular moment observes degree of grinding, probably grinds 15 minutes it can be seen that most of (60%-80%) apatite particle exposes In outside;
4th step:The diamond sand paper that 15 μm on mill of diamond sand paper is replaced with 9 μm is refined, with pure water For lubricant, pressure is 18N, and speed of grinding plate is 5000-6000rpm, passes through binocular vision grinding effect at intervals of two minutes, treats Till being milled to most of granule (50%-70%) largest face;
5th step:9 μm on mill of diamond sand paper is replaced with 3 μm of diamond sand paper and carries out fine grinding, still with pure Water is lubricant, but pressure parameter is set to 12N (in case pressure is excessive, crushing mineral grain), and speed of grinding plate is reduced to 3000- 3500rpm, continues to grind it is therefore an objective to remove the big scratch that corase grind produces;By binocular vision grinding effect, general 10 points Zhong Hou, now the scratch on resin and mineral is little;
6th step:After grinding terminates, by 3 μm of diamond sand paper of mill be replaced with polishing cloth (Struers A/S company MD-Chem polishing cloth), and with 1 μm of Al2O3Polishing fluid is lubricant, polishes general 20 minutes, and in removing fine grinding, residual is trickle Scratch, prepared fission track thin slice.
Using fission track Autoscan auto testing instrument, above-mentioned track fission thin slice is amplified 1000 times to be observed, send out Existing resin and apatite particle burnishing surface unusual light, nothing significantly scratch and pit.Thin slice, can be in phosphorus after chemical etching Which limestone particles surface is easily identified out is fission track vestige, greatly reduces the system being come by production effect difference band Meter error.Fig. 5 is that the track etching hole seen under fission track auto testing instrument reflected light after the thin slice making etches is (i.e. black Point).

Claims (16)

1. a kind of fission track preparation of sections method, the method comprises the following steps:
First with automatic grinding equipment, thin slice first product is roughly ground and be exposed to sheet surface to 60%-80% granule, then refine to making corase grind The largest face of the 50%-70% in the granule exposing is exposed to sheet surface, then passes through fine grinding, to obtain fission track thin for polishing Piece;
Described automatic grinding equipment is provided with the observation part that can monitor sample grinding state.
2. the grinding-material the method for claim 1, wherein in described roughing operations, used by automatic grinding equipment It is the sand paper that granularity is 15 μm, grinding pressure is 15-18N, rotating speed is 5000-6000rpm.
3. the grinding-material the method for claim 1, wherein in described fine grinding operation, used by automatic grinding equipment It is the sand paper that granularity is 9 μm, grinding pressure is 15-18N, rotating speed is 5000-6000rpm.
4. the grinding-material the method for claim 1, wherein in described fine grinding operation, used by automatic grinding equipment It is the sand paper that granularity is 3 μm, grinding pressure is 10-12N, rotating speed is 3000-3500rpm.
5. the method as described in claim 2-4 any one, wherein, described sand paper is diamond sand paper;Using profit in grinding Lubrication prescription is lubricated;Described automatic grinding equipment is that Leica EM TXP refines all-in-one.
6. method as claimed in claim 5, wherein, described lubricant is water.
7. the method for claim 1, wherein in described polishing operation, it is polished using polishing cloth, polish pressure For 5N, rotating speed is 2500-3000rpm, and the lubricant of use is 1 μm of Al2O3Polishing fluid.
8. method as claimed in claim 7, wherein, described polishing cloth is the MD-Chem polishing cloth of Struers A/S company.
9. the method for claim 1, in the work of automatic grinding equipment, described corase grind, fine grinding, fine grinding, polishing step Include the operation of the grinding state observing part observation thin slice by automatic grinding equipment respectively.
10. the method as described in claim 1-4 any one, wherein, the preparation method of described thin slice first product is:Take 2-3ml Drop of resin, on microscope slide, by 1000-2000 a diameter of 60-200 μm of apatite particle resin by injection, treats hardening of resin Thin slice first product is obtained afterwards.
11. methods as claimed in claim 5, wherein, the preparation method of described thin slice first product is:2-3ml drop of resin is taken to carry On slide, by 1000-2000 a diameter of 60-200 μm of apatite particle resin by injection, thin slice is obtained after hardening of resin First product.
12. methods as described in claim 6-9 any one, wherein, the preparation method of described thin slice first product is:Take 2-3ml Drop of resin, on microscope slide, by 1000-2000 a diameter of 60-200 μm of apatite particle resin by injection, treats hardening of resin Thin slice first product is obtained afterwards.
13. methods as claimed in claim 10, wherein, the method also includes:After in described apatite particle resin by injection, By stirring the step being distributed in resin bottom with making apatite particle diversity.
14. methods as claimed in claim 11, wherein, the method also includes:After in described apatite particle resin by injection, By stirring the step being distributed in resin bottom with making apatite particle diversity.
15. methods as claimed in claim 12, wherein, the method also includes:After in described apatite particle resin by injection, By stirring the step being distributed in resin bottom with making apatite particle diversity.
16. the method for claim 1, wherein the method comprise the following steps:
Step one:Take 2-3ml drop of resin on microscope slide, then by 1000-2000 a diameter of 60-200 μm of apatite In grain resin by injection;
Step 2:Resin bottom is distributed in making apatite particle diversity by stirring, is obtained at the beginning of thin slice after hardening of resin Product;
Step 3:With Leica EM TXP fine grinding all-in-one, thin slice first product is roughly ground, to 60%-80% of thin slice first product Till grain is exposed to sheet surface, the diamond sand paper being 15 μm from granularity in corase grind, lubricant is pure water, and pressure is 15- 18N, rotating speed is 5000-6000rpm, passes through to observe the degree of grinding of part observation thin slice and determine corase grind eventually in process of lapping Point;
Step 4:To corase grind after thin slice refine, extremely roughly grind the 50%-70% in the granule exposing largest face be exposed to thin Till piece surface, the diamond sand paper being 9 μm from granularity in fine grinding, lubricant is pure water, and pressure is 15-18N, and rotating speed is 5000-6000rpm, passes through in process of lapping to observe the degree of grinding of part observation thin slice and determine fine grinding terminal;
Step 5:Fine grinding is carried out to the thin slice after fine grinding, removes the thick scratch of residual on thin slice in lapping process, select in fine grinding Granularity is 3 μm of diamond sand paper, and lubricant is pure water, and pressure is 10-12N, and rotating speed is 3000-3500rpm, process of lapping In observe the degree of grinding of thin slice and determine fine grinding terminal by observing part;
Step 6:Thin slice after fine grinding is polished, on thin slice during removing fine grinding, the trickle scratch of residual, is obtained fission Track thin slice;Using the MD-Chem polishing cloth of Struers A/S company in polishing, lubricant is 1 μm of Al2O3Polishing fluid, polishing Pressure is 5N, and rotating speed is 2500-3000rpm, and period passes through to observe the polishing of part observation thin slice and determine polishing end point.
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CN106769999B (en) * 2017-01-19 2019-06-21 中国石油大学(北京) The method for being quickly obtained Apatite fission track annealing rate and spontaneous Track density
CN106841096B (en) * 2017-01-19 2019-06-21 中国石油大学(北京) Utilize the method for terahertz time-domain spectroscopy analysis Apatite fission track annealing grade
CN107144871B (en) * 2017-05-08 2019-05-14 北京市化工职业病防治院 Utilize the method for the track morphology of optical microscope inspection solid state nuclear track detector
CN107576545A (en) * 2017-10-13 2018-01-12 中国石油大学(北京) A kind of Zircon FT analysis preparation of sections method
CN110553897A (en) * 2019-09-25 2019-12-10 核工业北京地质研究院 Preparation method of apatite resin sheet for external detector method
CN113458877A (en) * 2021-06-30 2021-10-01 宁波江丰芯创科技有限公司 Method for repairing and recycling carrying disc for chip packaging

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0921415A1 (en) * 1997-12-02 1999-06-09 European Community A method for determining quantitatively the content of fissile material in small size particles
CN103528869A (en) * 2013-10-28 2014-01-22 北京大学 Manufacturing method for sample suitable for observation of unconventional oil and gas by ten-thousand-time scanning electron microscope
CN103712841A (en) * 2014-01-06 2014-04-09 中国石油大学(华东) Production method for rock salt fluid inclusion flakes
CN103759999A (en) * 2014-01-26 2014-04-30 国家电网公司 Metallographic sample preparation method for brittle and hard oxide layer on inner wall of heating surface tube

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0921415A1 (en) * 1997-12-02 1999-06-09 European Community A method for determining quantitatively the content of fissile material in small size particles
CN103528869A (en) * 2013-10-28 2014-01-22 北京大学 Manufacturing method for sample suitable for observation of unconventional oil and gas by ten-thousand-time scanning electron microscope
CN103712841A (en) * 2014-01-06 2014-04-09 中国石油大学(华东) Production method for rock salt fluid inclusion flakes
CN103759999A (en) * 2014-01-26 2014-04-30 国家电网公司 Metallographic sample preparation method for brittle and hard oxide layer on inner wall of heating surface tube

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
用磷灰石裂变径迹研究西湖凹陷的古地温;姜亮;《石油大学学报(自然科学版)》;20010330;第25卷(第1期);第30-33页 *
用裂变径迹法研究吉林陨石中的铀分布;胡瑞英;《核技术》;19820131(第1期);第47-48页 *

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