CN104931320A - Sample piece with two material interfaces containing preset microcracks and production method of sample piece - Google Patents
Sample piece with two material interfaces containing preset microcracks and production method of sample piece Download PDFInfo
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- CN104931320A CN104931320A CN201510350534.1A CN201510350534A CN104931320A CN 104931320 A CN104931320 A CN 104931320A CN 201510350534 A CN201510350534 A CN 201510350534A CN 104931320 A CN104931320 A CN 104931320A
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Abstract
The invention discloses a sample piece with two material interfaces containing preset microcracks and a production method of the sample piece. The production method includes: (1) determining two materials about to be preset with the interface microcracks; (2) presetting the microcracks; (3) coating a mask plate; (4) producing a mask layer; (5) forming the sample piece with the material interfaces containing the preset microcracks. The sample piece can be provided with different interface microcracks according to research objectives, and parameters such as shapes and positions of the microcracks are good in controllability; influence of interface forms on product performance can be analyzed in a targeted manner, purposefulness is high, the sample piece is simple in structure, special expensive support equipment is not needed for sample selection, and the preparation method is simple, flexible, high in operability and good in practicality. According to the method, the special expensive support equipment is not needed for sample selection, and the method is simple in sample piece preparation steps, high in operability and good in targeted performance and practicality.
Description
Technical field
Patent of the present invention relates to the technology evaluating material interface crack defect in product, and specifically a kind of bi-material interface contains exemplar of preset micro-crack and preparation method thereof.
Background technology
Micro-electron packaging device, semiconductor LED packaging are generally made up of the material of multiple different attribute, under the acting in conjunction of the many factors such as variation of ambient temperature and physical shock, very easily sprout micro-crack in two material interface bond strengths lower (or stress is concentrated) part, shape and the position distribution of micro-crack have Unpredictability; Along with the continuous expansion of micro-crack, whole packaging just can lose efficacy.Interfacial delamination is one of dominant failure mode of epoxy seal semiconductor device and micro-system, and the mechanism of action of form to the various performance parameter of product of further investigation interfacial delamination is extremely important.The people such as Li [Zongtao Li, Yong Tang, Xinrui Ding, Reconstruction and thermal performance analysis die-bonding filling states for high-power light-emitting diode devices, Applied Thermal Engineering, 6 (2014), pp236-245] by adopting slabbing (or cavity) distribution of limited element analysis technique reconstruct LED chip bonding interface, and then analyze different interfacial delamination form to the impact of properties of product.But existing method is all the form obtaining interfacial delamination based on existing sample and specific software and hardware, picks out the sample of tool interfacial configuration in need; These election process costs are high, poor controllability, and the sample obtained, can not the form of look-ahead interface micro-crack, and study the impact that interfacial configuration produces product targetedly, very limited to the mechanism of action of assay surface behavior.Visible, necessary exploration is a kind of can the method for fixing quantity interfacial delamination form.
Summary of the invention
The object of the invention is the deficiency for existing technology, and a kind of bi-material interface provided contains exemplar of preset micro-crack and preparation method thereof.
The advantage of this exemplar is: can arrange different interface micro-cracks according to research purpose, and the parameter such as shape, position of micro-crack has good controllability; Can assay surface form to be on the impact of properties of product targetedly, its purpose is strong, and the structure of exemplar is simple, do not need the special support equipment of somewhat expensive to carry out sample choice, its preparation method simple and flexible, workable, there is good practicality.
The advantage of this method is: do not need the special support equipment of somewhat expensive to carry out sample choice, prepare exemplar step succinct, workable, there is good specific aim and practicality.
The technical scheme realizing the object of the invention is:
Bi-material interface is containing the exemplar of preset micro-crack, comprise the material layer that the substrate layer that formed by a kind of detected materials and another kind of material are formed, described substrate layer and material layer splice, and are provided with mask layer between substrate layer and material layer, and described mask layer is provided with micro-crack.
Described mask layer has the characteristic that prevention two material layer combines, and mask layer has the performance be not combined with material layer.
Bi-material interface, containing the preparation method of the exemplar of preset micro-crack, comprises the steps:
1) determine the bi-material wanting preset interface micro-crack, and by wherein a kind of detected materials is as substrate layer, another material, as material layer, gets the mask plate making mask layer ready simultaneously;
2) preset micro-crack, mask plate arranges according to the micro-crack of desired morphology the through hole of corresponding desired location, shape, size;
3) make mask layer, will through step 2) after on mask plate covered substrate layer, then adopt coating technique to plate thin film on mask plate;
4) mask plate is taken off from substrate layer, the material surface of substrate layer can leave the mask layer corresponding with mask plate through hole;
5) to splice on the surface material layer at substrate layer, and carry out substrate layer, the bonding of this bi-material layer of material layer or welding, form the exemplar of bi-material interface containing preset micro-crack.
In step 3), membraneous material have prevention two material occur welding or bonding wait combination characteristic, and membraneous material has the performance be not combined with second layer material, described membraneous material is pottery, can also adopts silicon dioxide, solder mask, or the macromolecular material such as epoxy resin, phenolics, polyimide.
By changing the design parameter of through hole on mask plate and position, shape, size, repeat step 1)-5) can realize containing different interfaces micro-crack specification exemplar, and then reach the controlled preset of interface micro-crack defect.
The advantage of this exemplar is: can arrange different interface micro-cracks according to research purpose, and the parameter such as shape, position of micro-crack has good controllability; Can assay surface form to be on the impact of properties of product targetedly, its purpose is strong, and the structure of exemplar is simple, does not need the special support equipment of somewhat expensive to carry out sample choice; Because substrate layer upper surface plates the thin film section bar bed of material in advance, and the effect of this layer film section bar bed of material is the isolated combinations with stopping two materials, and serving as preset interface micro-crack defect exists in faying face, realizes the preset as required of blind crack defect in interface.This preparation method's simple and flexible, workable, there is good practicality.
Accompanying drawing explanation
Fig. 1 is substrate layer structural representation in embodiment;
Fig. 2 is the schematic diagram that in embodiment, mask plate is placed on substrate layer surface;
Fig. 3 is that in embodiment, mask layer is placed on substrate layer surface and carries out the schematic diagram after plated film;
Fig. 4 is the exemplar structural representation that in embodiment, bi-material interface contains preset micro-crack.
In figure, 1. substrate layer 2. mask layer 3. material layer 4. mask plate.
Embodiment
Below in conjunction with drawings and Examples, content of the present invention is further elaborated, but is not limitation of the invention.
Embodiment:
With reference to Fig. 4, a kind of bi-material interface is containing the exemplar of preset micro-crack, comprise the material layer 3 that the substrate layer 1 that formed by a kind of detected materials and another kind of material are formed, described substrate layer 1 splices with material layer 3, be provided with mask layer 2 between substrate layer 1 and material layer 3, described mask layer 2 is provided with micro-crack.
Described mask layer 2 has the characteristic that prevention two material layer combines, and mask layer 2 has the performance be not combined with material layer 3.
Particularly, substrate layer 1 is copper, mask layer 2 is ceramic membrane, material layer 3 is solder, and the length, width and height of substrate layer 1 are of a size of 50mm30mm5mm.The micro-crack defect of the rectangular interfaces of preset three 5mm3mm is arranged on the interface of substrate layer 1 and material layer 3, and is evenly arranged.
Bi-material interface, containing the preparation method of the exemplar of preset micro-crack, comprises the steps:
1) determine the bi-material wanting preset interface micro-crack, and by wherein a kind of detected materials is as substrate layer 1, as shown in Figure 1, substrate layer 1 is copper, and another material is as material layer 3, and material layer 3 is solder, gets the mask plate 4 making mask layer 2 simultaneously ready;
2) preset micro-crack, mask plate 4 arranges according to the micro-crack of desired morphology the through hole of corresponding desired location, shape, size; Expection micro-crack defect is the rectangular through-hole of three 53, and is evenly distributed on mask plate 4, and the present embodiment mask plate 4 thickness is 0.5, and mask thicknesses is 10, forms the mask plate 4 with expection micro-crack opposite position, shape, large small through hole;
3) make mask layer 2, by through step 2) after mask plate 4 cover on the surface of substrate layer 1 bronze medal, as shown in Figure 2, then adopt coating technique to plate thin film on mask plate 4, described membraneous material be ceramic;
4) mask plate 4 is taken off from substrate layer 1, mask layer 2 ceramic membrane corresponding with mask plate 4 through hole can be left on the surface at substrate layer 1 copper product, as shown in Figure 3; Mask layer 2 ceramic membrane has the characteristic stoping substrate layer 1 bronze medal and material layer 3 solder bonds, and mask layer 2 ceramic membrane have not with the performance of material layer 3 solder solder bond;
5) to splice on the surface material layer 3 solder at substrate layer 1 bronze medal, and carry out substrate layer 1, the bonding of this bi-material layer of material layer 3, welding, formation substrate layer 1 bronze medal, material layer 3 solder bi-material interface contain the exemplar of preset mask layer 2 ceramic membrane micro-crack, as shown in Figure 4.
By changing the design parameter of through hole on mask plate 4 and position, shape, size, repeat step 1)-5) can realize containing different interfaces micro-crack specification exemplar, and then reach the controlled preset of interface micro-crack defect.
In step 3), described membraneous material, except pottery, also can adopt silicon dioxide, solder mask, or the macromolecular material such as epoxy resin, phenolics, polyimide.
Claims (3)
1. bi-material interface is containing the exemplar of preset micro-crack, it is characterized in that, comprise the material layer that the substrate layer that formed by a kind of detected materials and another kind of material are formed, described substrate layer and material layer splice, be provided with mask layer between substrate layer and material layer, described mask layer is provided with micro-crack.
2. bi-material interface is containing the preparation method of the exemplar of preset micro-crack, it is characterized in that, comprises the steps:
1) determine the bi-material wanting preset interface micro-crack, and by wherein a kind of material is to be measured as substrate layer, another material, as material layer, gets the mask plate making mask layer ready simultaneously;
2) preset micro-crack, mask plate arranges according to the micro-crack of desired morphology the through hole of corresponding desired location, shape, size;
3) make mask layer, will through step 2) after on mask plate covered substrate layer, then adopt coating technique to plate thin film on mask plate;
4) mask plate is taken off from substrate layer, the material surface of substrate layer can leave the mask layer corresponding with mask plate through hole;
5) to splice on the surface material layer at substrate layer, and carry out substrate layer, the bonding of this bi-material layer of material layer or welding, form the exemplar of bi-material interface containing preset micro-crack.
3. bi-material interface according to claim 2 is containing the preparation method of the exemplar of preset micro-crack, it is characterized in that, in step 3), membraneous material has prevention two material and welding or the bonding characteristic waiting combination occurs, and membraneous material has the performance be not combined with second layer material.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510350534.1A CN104931320A (en) | 2015-06-24 | 2015-06-24 | Sample piece with two material interfaces containing preset microcracks and production method of sample piece |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510350534.1A CN104931320A (en) | 2015-06-24 | 2015-06-24 | Sample piece with two material interfaces containing preset microcracks and production method of sample piece |
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| CN104931320A true CN104931320A (en) | 2015-09-23 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111238891A (en) * | 2020-01-16 | 2020-06-05 | 中国科学院长春光学精密机械与物理研究所 | Preparation method of internal defects of reaction sintered silicon carbide ceramic |
Citations (5)
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| JPH10325807A (en) * | 1997-03-24 | 1998-12-08 | Hitachi Ltd | Standard sample for calibration of optical inspection apparatus, its manufacture and method for calibrating sensitivity of the apparatus |
| JP2002361166A (en) * | 2001-06-12 | 2002-12-17 | Mitsubishi Heavy Ind Ltd | Method for forming heat insulating layer having artificial defect |
| CN1919719A (en) * | 2005-08-24 | 2007-02-28 | 中国科学院金属研究所 | Prefabricated method for thin film microcrack and special apparatus for the same |
| CN103454130A (en) * | 2013-09-06 | 2013-12-18 | 南京理工大学 | Test piece for III type rupture energy release rate of bonding interface |
| CN103645078A (en) * | 2013-12-05 | 2014-03-19 | 广东工业大学 | Rapid cross section manufacture and sub-surface micro-crack detection method of single crystal semiconductor substrate |
-
2015
- 2015-06-24 CN CN201510350534.1A patent/CN104931320A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10325807A (en) * | 1997-03-24 | 1998-12-08 | Hitachi Ltd | Standard sample for calibration of optical inspection apparatus, its manufacture and method for calibrating sensitivity of the apparatus |
| JP2002361166A (en) * | 2001-06-12 | 2002-12-17 | Mitsubishi Heavy Ind Ltd | Method for forming heat insulating layer having artificial defect |
| CN1919719A (en) * | 2005-08-24 | 2007-02-28 | 中国科学院金属研究所 | Prefabricated method for thin film microcrack and special apparatus for the same |
| CN103454130A (en) * | 2013-09-06 | 2013-12-18 | 南京理工大学 | Test piece for III type rupture energy release rate of bonding interface |
| CN103645078A (en) * | 2013-12-05 | 2014-03-19 | 广东工业大学 | Rapid cross section manufacture and sub-surface micro-crack detection method of single crystal semiconductor substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111238891A (en) * | 2020-01-16 | 2020-06-05 | 中国科学院长春光学精密机械与物理研究所 | Preparation method of internal defects of reaction sintered silicon carbide ceramic |
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Application publication date: 20150923 |