CN104917430A

CN104917430A - Air blowing heating intelligent control module

Info

Publication number: CN104917430A
Application number: CN201510253079.3A
Authority: CN
Inventors: 郑越江
Original assignee: NINGBO ZONBO ELECTRIC APPLIANCE CO Ltd
Current assignee: NINGBO ZONBO ELECTRIC APPLIANCE CO Ltd
Priority date: 2015-05-15
Filing date: 2015-05-15
Publication date: 2015-09-16

Abstract

The invention relates to an air blowing heating intelligent control module. With the air blowing heating intelligent control module adopted, defects in the prior art can be eliminated. According to the technical schemes of the invention, the air blowing heating intelligent control module includes a three-phase Hall-free direct current motor, a motor driving module, a power supply module, a CPU control driving module, a protection module and a modulation module; the input end of the power supply module is connected with a power source; the output end of the power supply module is electrically connected with the input end of the motor driving module and the CPU control driving module; the output end of the power supply module is electrically connected with the CPU control driving module and the three-phase Hall-free direct current motor respectively through the protection module; the driving end and the feedback end of the motor driving module are both electrically connected with the CPU control module; the output end of the motor driving module is electrically connected with the input end of the three-phase Hall-free direct current motor; the CPU control driving module is also electrically connected with the modulation module.

Description

Intelligent control module is warmed in blowing

Technical field

The present invention relates to a kind of blowing and warm control module, especially efficiency is than high, consumes energy little, and control module is warmed in the blowing that noise is low.

Technical background

Be applied to air heat in the market, the household electrical appliance of dust suction mostly drive with alternating current machine, such advantage is technology maturation, product supply chain is ripe, processing cost is little, but shortcoming is efficiency ratio, consume energy high, noise is large, and a project development direct current machine of setting up the project drives above-mentioned household electrical appliance can promote 85% efficiency.

Brushless, permanently excited direct current motor is the Novel electromechanical integration product occurred along with semiconductor electronic technical development, is the product that modern electronic technology (comprising power electronics, microelectric technique), control theory and motor technology combine.Brushless, permanently excited direct current motor has that structure is simple, reliability is high, easy to maintenance, operational efficiency is high and the advantage such as good speed adjustment features, along with the development of microprocessor technology, power electronic technology, control theory and low cost, high energy product permanent magnetic material, obtain applying more and more widely.Although the brushless, permanently excited direct current motor with position transducer provides the most effective detection method for rotor-position, add volume and the structural complexity of motor, also improve the cost of motor.More importantly DC motor Driver also exists the problem of a series of application and protective circuit reliability.

Summary of the invention

Technical problem to be solved by this invention is the problem of a series of application for DC motor Driver and protective circuit reliability, and provide a kind of efficiency than high, consume energy little, intelligent control module is warmed in the blowing that noise is low.

The technical solution adopted for the present invention to solve the technical problems is: intelligent control module is warmed in a kind of blowing, by Power supply, comprise three-phase without Hall direct current machine, motor drive module, supply module, CPU controls driver module, protection module and modulation module, the input of described supply module is connected with power supply, the output of described supply module controls driver module with the input of motor drive module and CPU respectively and is electrically connected, the output of described supply module also controls driver module with CPU respectively by protection module and three-phase is electrically connected without Hall direct current machine, the drive end of described motor drive module and feedback end all control driver module with CPU and are electrically connected, the output list of motor drive module is electrically connected with the input of described three-phase without Hall direct current machine, described CPU controls driver module and is also electrically connected with described modulation module.The present invention adopts position Sensorless Control, then effectively can solve these deficiencies, improve the reliability of system works simultaneously.At present, position sensorless technology has obtained and has applied comparatively widely on brushless, permanently excited direct current motor, particularly very universal in household appliance technical field, as: the control etc. of the motors such as convertible frequency air-conditioner, frequency conversion refrigerator and brushless direct-current cross flow fan.Product mainly applies to large-scale hair-dryer, air-dry machine, and in the Motor Control such as air-heater, product is used in three-phase without Hall direct current machine, PWM high frequency modulated can control the rotating speed of motor.1 is had in the present invention) three-phase full-wave drives without position; 2) duty ratio of PWM can be regulated easily by analog signals such as external potentiometers; 3) overcurrent protection function; 4) positive/negatively controlling functions is turned; 5) the optional advantage of advance angle (7.5/15), may be used in alternating voltage (80V-250V) direct voltage (120V-360V) voltage.Motor speed can speed governing arbitrarily at 500 turns-4000 turns.High-frequency drive on year-on-year basis power frequency drive efficiency exceeds more than 88%.PWM drives the anti-interference shielding properties of good EMC.There is soft start function, avoid current over pulse, available protecting motor.

As preferably, described motor drive module comprises chip U2, electric capacity C12, electric capacity C14, electric capacity C4, electric capacity C5, electric capacity C6, electric capacity C7, electric capacity E3, electric capacity E4, electric capacity E5, resistance R12, resistance R13, resistance R14, resistance R15, resistance R37, resistance R38, resistance R39, resistance R40, diode D2, diode D3, diode D4 and diode D9, described chip U2 is FNB40560 chip, the VTH termination supply module of described chip U2, the RTH end of described chip U2 is successively by resistance R14 and resistance R15 ground connection, the P termination supply module of chip U2, the U end of described chip U2 is electrically connected with protection module by resistance R37, the U end of described chip U2 is also connected without Hall direct current machine with three-phase, the V end of described chip U2 is electrically connected with protection module by resistance R38, the V end of described chip U2 is also connected without Hall direct current machine with three-phase, the W end of described chip U2 is electrically connected with protection module by resistance R39, the W end of described chip U2 is also connected without Hall direct current machine with three-phase, the Nu end of described chip U2, Nv end and Nw end control driver module with CPU and are electrically connected, the Nu end of described chip U2, Nv end and Nw are also all by resistance R12 in parallel and resistance R13 ground connection, Vb (u) end of chip U2 is connected with the negative electrode of diode D2, anode and the V of described chip U2 of diode D2 are that (u) holds and be connected, electric capacity C5 is connected with between the negative electrode of diode D2 and the anode of diode D2, the positive pole of electric capacity E3 is connected with the negative electrode of diode D2, the negative pole of electric capacity E3 is connected with the anode of diode D2, Vb (v) end of chip U2 is connected with the negative electrode of diode D3, anode and the V of described chip U2 of diode D3 are that (v) holds and be connected, electric capacity C4 is connected with between the negative electrode of diode D3 and the anode of diode D3, the positive pole of electric capacity E4 is connected with the negative electrode of diode D3, the negative pole of electric capacity E4 is connected with the anode of diode D3, Vb (w) end of chip U2 is connected with the negative electrode of diode D4, anode and the V of described chip U2 of diode D4 are that (w) holds and be connected, electric capacity C6 is connected with between the negative electrode of diode D4 and the anode of diode D4, the positive pole of electric capacity E5 is connected with the negative electrode of diode D4, the negative pole of electric capacity E5 is connected with the anode of diode D4, IN (uh) end of described chip U2, IN (vh) holds, IN (wh) holds, IN (ul) holds, IN (vl) end and IN (wl) end all control driver module with described CPU and are electrically connected, VCC (l) end of described chip U2 is connected with power supply, VCC (l) end of described chip U2 to be held with the COM of chip U2 by electric capacity C7 and is connected, the COM of chip U2 holds ground connection, the Ssc end of chip U2 is by electric capacity C12 ground connection, the Vfo end of chip U2 is by resistance R40 ground connection, the Vfo end of chip U2 is by electric capacity C14 ground connection, the Vfo end of chip U2 is also connected with the anode of diode D9, negative electrode and the CPU of diode D9 control driver module and are connected.

As preferably, described protection module comprises chip U3, resistance RY1, resistance R23, resistance R26, resistance R27, resistance R32, resistance R33, resistance R35, resistance R36, electric capacity C8, electric capacity C9 and electric capacity C13, described chip U3 is LM393 chip, the OUTA end of described chip U3 is connected with supply module by resistance R27, the OUTA end of described chip U3 to be held with the Ssc of chip U2 by resistance R26 and is connected, the INA-end of chip U3 connects supply module by resistance RY1, chip U3 is by resistance R23 ground connection, chip U3 is also by electric capacity C8 ground connection, the INA+ end of chip U3 to be held with the GND of chip U3 by electric capacity C9 and is connected, the INA+ end of chip U3 to be held with the RTH of chip U2 by resistance R15 and is connected, the GND of chip U3 holds ground connection, the VCC termination supply module of chip U3, the OUTB end of chip U3 connects supply module by resistance R32, the INB-end of described chip U3 connects supply module by resistance R36, the INB-end of described chip U3 controls driver module electrical connection by resistance R35 and CPU, the INB+ end of chip U3 is connected with the first end of resistance R33, second end of resistance R33 is respectively by resistance R37, resistance R38 is connected with chip U2 with resistance R39, the INB+ end of chip U3 is also by electric capacity C13 ground connection.

As preferably, described CPU controls driver module and comprises chip U5, resistance RY2, resistance RY3, resistance RY5, resistance RY6, resistance RY7, resistance R21, resistance R22, resistance R24, resistance R25, resistance R34, resistance R41, resistance R42, resistance R43, resistance R44, resistance R45, resistance R46, resistance R47, resistance R48, resistance R49, crystal oscillator Y1, electric capacity E8, electric capacity C20, electric capacity C21, electric capacity C22, electric capacity C23, electric capacity C24, electric capacity C25, electric capacity C26, electric capacity C27, electric capacity C28, electric capacity C29, electric capacity C30 and electric capacity C31, described chip U5 is TB6575 chip, the GND of chip U5 holds ground connection, the SC end of chip U5 is by electric capacity C23 ground connection, the OS end of chip U5 is by resistance R42 ground connection, the FMAX end of chip U5 connects supply module by resistance RY3, the FMAX end of chip U5 is by resistance R41 ground connection, the VSP end of chip U5 is electrically connected with modulation module, the CW_CCW end of chip U5 connects supply module by resistance R24, the CW_CCW end of chip U5 is by resistance R22 ground connection, the START end of chip U5 is successively by resistance R43 and electric capacity C22 ground connection, the IP end of chip U5 is by electric capacity C22 ground connection, the XTout end of chip U5 is connected with the first end of crystal oscillator Y1, the XTin end of chip U5 is connected with second end of crystal oscillator Y1, the first end of crystal oscillator Y1 is by electric capacity C20 ground connection, second end of crystal oscillator Y1 is by electric capacity C21 ground connection, the LA end of chip U5 connects supply module by resistance R21, the LA end of chip U5 is by resistance RY2 ground connection, the FST end of chip U5 connects supply module by resistance RY5, the FST end of chip U5 is by resistance R25 ground connection, the WAVE end of chip U5 is held with the OUTB of chip U3 and is connected, the WAVE end of chip U5 is by electric capacity C24 ground connection, the OC end of chip U5 to be held with the Nu of chip U2 by resistance R34 and is connected, the OC end of chip U5 also to be held with the INB-of described chip U3 by resistance R34 and resistance R35 successively and is connected, the OC end of chip U5 is by electric capacity C25 ground connection, the vdd terminal of described chip U5 is connected with supply module, the vdd terminal of chip U5 to be held with the SEL_LAP of chip U5 by resistance RY6 and resistance RY7 successively and is connected, the vdd terminal of chip U5 is held with the SEL_LAP of chip U5 by electric capacity C11 successively and is connected, the vdd terminal of chip U5 is held with the SEL_LAP of chip U5 by electric capacity E8 successively and is connected, the OUT_WN end of chip U5 to be held with the IN (wl) of chip U2 by resistance R44 and is connected, the OUT_WN end of chip U5 is also successively by resistance R44 and electric capacity C26 ground connection, the OUT_WP end of chip U5 to be held with the IN (wh) of chip U2 by resistance R45 and is connected, the OUT_WP end of chip U5 is also successively by resistance R45 and electric capacity C27 ground connection, the OUT_VN end of chip U5 to be held with the IN (vl) of chip U2 by resistance R46 and is connected, the OUT_VN end of chip U5 is also successively by resistance R46 and electric capacity C28 ground connection, the OUT_VP end of chip U5 to be held with the IN (vh) of chip U2 by resistance R47 and is connected, the OUT_VP end of chip U5 is also successively by resistance R47 and electric capacity C29 ground connection, the OUT_UN end of chip U5 to be held with the IN (ul) of chip U2 by resistance R48 and is connected, the OUT_UN end of chip U5 is also successively by resistance R48 and electric capacity C30 ground connection, the OUT_UP end of chip U5 to be held with the IN (uh) of chip U2 by resistance R49 and is connected, the OUT_UP end of chip U5 is also successively by resistance R49 and electric capacity C31 ground connection.

As preferably, described modulation module comprises resistance R101, resistance R102, slide-changing resistor R103, slide-changing resistor R104, resistance R105, slide-changing resistor R106 and electric capacity C101, the first end of described resistance R101 is held with the VSP of chip U5 and is connected, second end of described resistance R101 is by resistance R102 ground connection, second end of described resistance R101 is by electric capacity C101 ground connection, second end of described resistance R101 is also connected with the first end of slide-changing resistor R103, the sliding end that becomes of slide-changing resistor R103 is connected with the first end of slide-changing resistor R103, second end of described slide-changing resistor R103 is also connected with the first end of slide-changing resistor R104, the sliding end that becomes of slide-changing resistor R104 is connected with the first end of slide-changing resistor R104, second end of slide-changing resistor R104 is connected with supply module, second end of slide-changing resistor R104 is held with the VSP of chip U5 by resistance R105 and is connected, second end of slide-changing resistor R106 is held with the VSP of chip U5 and is connected, the first end ground connection of slide-changing resistor R106, the first end of slide-changing resistor R106 also becomes to hold with slide-changing resistor R106 sliding and is connected.

Substantial effect of the present invention is: have 1 in the present invention) three-phase full-wave drives without position; 2) duty ratio of PWM can be regulated easily by analog signals such as external potentiometers; 3) overcurrent protection function; 4) positive/negatively controlling functions is turned; 5) the optional advantage of advance angle (7.5/15), may be used in alternating voltage (80V-250V) direct voltage (120V-360V) voltage.Motor speed can speed governing arbitrarily at 500 turns-4000 turns.High-frequency drive on year-on-year basis power frequency drive efficiency exceeds more than 88%.PWM drives the anti-interference shielding properties of good EMC.There is soft start function, avoid current over pulse, available protecting motor.

Accompanying drawing explanation

Fig. 1 is the circuit diagram that in the present invention, CPU controls driver module part;

Fig. 2 is the circuit diagram of protection module part in the present invention;

Fig. 3 is the circuit diagram of motor drive module part in the present invention;

Fig. 4 is the circuit diagram of modulation module part in the present invention.

Embodiment

Below by specific embodiment, and by reference to the accompanying drawings, technical scheme of the present invention is described in further detail.

Embodiment:

Intelligent control module is warmed in a kind of blowing, by Power supply, (see accompanying drawing 1 to 4) comprises three-phase without Hall direct current machine, motor drive module, supply module, CPU controls driver module, protection module and modulation module, the input of described supply module is connected with power supply, the output of described supply module controls driver module with the input of motor drive module and CPU respectively and is electrically connected, the output of described supply module also controls driver module with CPU respectively by protection module and three-phase is electrically connected without Hall direct current machine, the drive end of described motor drive module and feedback end all control driver module with CPU and are electrically connected, the output list of motor drive module is electrically connected with the input of described three-phase without Hall direct current machine, described CPU controls driver module and is also electrically connected with described modulation module.Described motor drive module comprises chip U2, electric capacity C12, electric capacity C14, electric capacity C4, electric capacity C5, electric capacity C6, electric capacity C7, electric capacity E3, electric capacity E4, electric capacity E5, resistance R12, resistance R13, resistance R14, resistance R15, resistance R37, resistance R38, resistance R39, resistance R40, diode D2, diode D3, diode D4 and diode D9, described chip U2 is FNB40560 chip, the VTH termination supply module of described chip U2, the RTH end of described chip U2 is successively by resistance R14 and resistance R15 ground connection, the P termination supply module of chip U2, the U end of described chip U2 is electrically connected with protection module by resistance R37, the U end of described chip U2 is also connected without Hall direct current machine with three-phase, the V end of described chip U2 is electrically connected with protection module by resistance R38, the V end of described chip U2 is also connected without Hall direct current machine with three-phase, the W end of described chip U2 is electrically connected with protection module by resistance R39, the W end of described chip U2 is also connected without Hall direct current machine with three-phase, the Nu end of described chip U2, Nv end and Nw end control driver module with CPU and are electrically connected, the Nu end of described chip U2, Nv end and Nw are also all by resistance R12 in parallel and resistance R13 ground connection, Vb (u) end of chip U2 is connected with the negative electrode of diode D2, anode and the V of described chip U2 of diode D2 are that (u) holds and be connected, electric capacity C5 is connected with between the negative electrode of diode D2 and the anode of diode D2, the positive pole of electric capacity E3 is connected with the negative electrode of diode D2, the negative pole of electric capacity E3 is connected with the anode of diode D2, Vb (v) end of chip U2 is connected with the negative electrode of diode D3, anode and the V of described chip U2 of diode D3 are that (v) holds and be connected, electric capacity C4 is connected with between the negative electrode of diode D3 and the anode of diode D3, the positive pole of electric capacity E4 is connected with the negative electrode of diode D3, the negative pole of electric capacity E4 is connected with the anode of diode D3, Vb (w) end of chip U2 is connected with the negative electrode of diode D4, anode and the V of described chip U2 of diode D4 are that (w) holds and be connected, electric capacity C6 is connected with between the negative electrode of diode D4 and the anode of diode D4, the positive pole of electric capacity E5 is connected with the negative electrode of diode D4, the negative pole of electric capacity E5 is connected with the anode of diode D4, IN (uh) end of described chip U2, IN (vh) holds, IN (wh) holds, IN (ul) holds, IN (vl) end and IN (wl) end all control driver module with described CPU and are electrically connected, VCC (l) end of described chip U2 is connected with power supply, VCC (l) end of described chip U2 to be held with the COM of chip U2 by electric capacity C7 and is connected, the COM of chip U2 holds ground connection, the Ssc end of chip U2 is by electric capacity C12 ground connection, the Vfo end of chip U2 is by resistance R40 ground connection, the Vfo end of chip U2 is by electric capacity C14 ground connection, the Vfo end of chip U2 is also connected with the anode of diode D9, negative electrode and the CPU of diode D9 control driver module and are connected.Described protection module comprises chip U3, resistance RY1, resistance R23, resistance R26, resistance R27, resistance R32, resistance R33, resistance R35, resistance R36, electric capacity C8, electric capacity C9 and electric capacity C13, described chip U3 is LM393 chip, the OUTA end of described chip U3 is connected with supply module by resistance R27, the OUTA end of described chip U3 to be held with the Ssc of chip U2 by resistance R26 and is connected, the INA-end of chip U3 connects supply module by resistance RY1, chip U3 is by resistance R23 ground connection, chip U3 is also by electric capacity C8 ground connection, the INA+ end of chip U3 to be held with the GND of chip U3 by electric capacity C9 and is connected, the INA+ end of chip U3 to be held with the RTH of chip U2 by resistance R15 and is connected, the GND of chip U3 holds ground connection, the VCC termination supply module of chip U3, the OUTB end of chip U3 connects supply module by resistance R32, the INB-end of described chip U3 connects supply module by resistance R36, the INB-end of described chip U3 controls driver module electrical connection by resistance R35 and CPU, the INB+ end of chip U3 is connected with the first end of resistance R33, second end of resistance R33 is respectively by resistance R37, resistance R38 is connected with chip U2 with resistance R39, the INB+ end of chip U3 is also by electric capacity C13 ground connection.Described CPU controls driver module and comprises chip U5, resistance RY2, resistance RY3, resistance RY5, resistance RY6, resistance RY7, resistance R21, resistance R22, resistance R24, resistance R25, resistance R34, resistance R41, resistance R42, resistance R43, resistance R44, resistance R45, resistance R46, resistance R47, resistance R48, resistance R49, crystal oscillator Y1, electric capacity E8, electric capacity C20, electric capacity C21, electric capacity C22, electric capacity C23, electric capacity C24, electric capacity C25, electric capacity C26, electric capacity C27, electric capacity C28, electric capacity C29, electric capacity C30 and electric capacity C31, described chip U5 is TB6575 chip, the GND of chip U5 holds ground connection, the SC end of chip U5 is by electric capacity C23 ground connection, the OS end of chip U5 is by resistance R42 ground connection, the FMAX end of chip U5 connects supply module by resistance RY3, the FMAX end of chip U5 is by resistance R41 ground connection, the VSP end of chip U5 is electrically connected with modulation module, the CW_CCW end of chip U5 connects supply module by resistance R24, the CW_CCW end of chip U5 is by resistance R22 ground connection, the START end of chip U5 is successively by resistance R43 and electric capacity C22 ground connection, the IP end of chip U5 is by electric capacity C22 ground connection, the XTout end of chip U5 is connected with the first end of crystal oscillator Y1, the XTin end of chip U5 is connected with second end of crystal oscillator Y1, the first end of crystal oscillator Y1 is by electric capacity C20 ground connection, second end of crystal oscillator Y1 is by electric capacity C21 ground connection, the LA end of chip U5 connects supply module by resistance R21, the LA end of chip U5 is by resistance RY2 ground connection, the FST end of chip U5 connects supply module by resistance RY5, the FST end of chip U5 is by resistance R25 ground connection, the WAVE end of chip U5 is held with the OUTB of chip U3 and is connected, the WAVE end of chip U5 is by electric capacity C24 ground connection, the OC end of chip U5 to be held with the Nu of chip U2 by resistance R34 and is connected, the OC end of chip U5 also to be held with the INB-of described chip U3 by resistance R34 and resistance R35 successively and is connected, the OC end of chip U5 is by electric capacity C25 ground connection, the vdd terminal of described chip U5 is connected with supply module, the vdd terminal of chip U5 to be held with the SEL_LAP of chip U5 by resistance RY6 and resistance RY7 successively and is connected, the vdd terminal of chip U5 is held with the SEL_LAP of chip U5 by electric capacity C11 successively and is connected, the vdd terminal of chip U5 is held with the SEL_LAP of chip U5 by electric capacity E8 successively and is connected, the OUT_WN end of chip U5 to be held with the IN (wl) of chip U2 by resistance R44 and is connected, the OUT_WN end of chip U5 is also successively by resistance R44 and electric capacity C26 ground connection, the OUT_WP end of chip U5 to be held with the IN (wh) of chip U2 by resistance R45 and is connected, the OUT_WP end of chip U5 is also successively by resistance R45 and electric capacity C27 ground connection, the OUT_VN end of chip U5 to be held with the IN (vl) of chip U2 by resistance R46 and is connected, the OUT_VN end of chip U5 is also successively by resistance R46 and electric capacity C28 ground connection, the OUT_VP end of chip U5 to be held with the IN (vh) of chip U2 by resistance R47 and is connected, the OUT_VP end of chip U5 is also successively by resistance R47 and electric capacity C29 ground connection, the OUT_UN end of chip U5 to be held with the IN (ul) of chip U2 by resistance R48 and is connected, the OUT_UN end of chip U5 is also successively by resistance R48 and electric capacity C30 ground connection, the OUT_UP end of chip U5 to be held with the IN (uh) of chip U2 by resistance R49 and is connected, the OUT_UP end of chip U5 is also successively by resistance R49 and electric capacity C31 ground connection.Described modulation module comprises resistance R101, resistance R102, slide-changing resistor R103, slide-changing resistor R104, resistance R105, slide-changing resistor R106 and electric capacity C101, the first end of described resistance R101 is held with the VSP of chip U5 and is connected, second end of described resistance R101 is by resistance R102 ground connection, second end of described resistance R101 is by electric capacity C101 ground connection, second end of described resistance R101 is also connected with the first end of slide-changing resistor R103, the sliding end that becomes of slide-changing resistor R103 is connected with the first end of slide-changing resistor R103, second end of described slide-changing resistor R103 is also connected with the first end of slide-changing resistor R104, the sliding end that becomes of slide-changing resistor R104 is connected with the first end of slide-changing resistor R104, second end of slide-changing resistor R104 is connected with supply module, second end of slide-changing resistor R104 is held with the VSP of chip U5 by resistance R105 and is connected, second end of slide-changing resistor R106 is held with the VSP of chip U5 and is connected, the first end ground connection of slide-changing resistor R106, the first end of slide-changing resistor R106 also becomes to hold with slide-changing resistor R106 sliding and is connected.

The present embodiment has 1) three-phase full-wave drives without position; 2) duty ratio of PWM can be regulated easily by analog signals such as external potentiometers; 3) overcurrent protection function; 4) positive/negatively controlling functions is turned; 5) the optional advantage of advance angle (7.5/15), may be used in alternating voltage (80V-250V) direct voltage (120V-360V) voltage.Motor speed can speed governing arbitrarily at 500 turns-4000 turns.High-frequency drive on year-on-year basis power frequency drive efficiency exceeds more than 88%.PWM drives the anti-interference shielding properties of good EMC.There is soft start function, avoid current over pulse, available protecting motor.

Above-described embodiment is one of the present invention preferably scheme, not does any pro forma restriction to the present invention, also has other variant and remodeling under the prerequisite not exceeding the technical scheme described in claim.

Claims

1. intelligent control module is warmed in a blowing, by Power supply, it is characterized in that, comprise three-phase without Hall direct current machine, motor drive module, supply module, CPU controls driver module, protection module and modulation module, the input of described supply module is connected with power supply, the output of described supply module controls driver module with the input of motor drive module and CPU respectively and is electrically connected, the output of described supply module also controls driver module with CPU respectively by protection module and three-phase is electrically connected without Hall direct current machine, the drive end of described motor drive module and feedback end all control driver module with CPU and are electrically connected, the output list of motor drive module is electrically connected with the input of described three-phase without Hall direct current machine, described CPU controls driver module and is also electrically connected with described modulation module.

2. intelligent control module is warmed in blowing according to claim 1, it is characterized in that: described motor drive module comprises chip U2, electric capacity C12, electric capacity C14, electric capacity C4, electric capacity C5, electric capacity C6, electric capacity C7, electric capacity E3, electric capacity E4, electric capacity E5, resistance R12, resistance R13, resistance R14, resistance R15, resistance R37, resistance R38, resistance R39, resistance R40, diode D2, diode D3, diode D4 and diode D9, described chip U2 is FNB40560 chip, the VTH termination supply module of described chip U2, the RTH end of described chip U2 is successively by resistance R14 and resistance R15 ground connection, the P termination supply module of chip U2, the U end of described chip U2 is electrically connected with protection module by resistance R37, the U end of described chip U2 is also connected without Hall direct current machine with three-phase, the V end of described chip U2 is electrically connected with protection module by resistance R38, the V end of described chip U2 is also connected without Hall direct current machine with three-phase, the W end of described chip U2 is electrically connected with protection module by resistance R39, the W end of described chip U2 is also connected without Hall direct current machine with three-phase, the Nu end of described chip U2, Nv end and Nw end control driver module with CPU and are electrically connected, the Nu end of described chip U2, Nv end and Nw are also all by resistance R12 in parallel and resistance R13 ground connection, Vb (u) end of chip U2 is connected with the negative electrode of diode D2, anode and the V of described chip U2 of diode D2 are that (u) holds and be connected, electric capacity C5 is connected with between the negative electrode of diode D2 and the anode of diode D2, the positive pole of electric capacity E3 is connected with the negative electrode of diode D2, the negative pole of electric capacity E3 is connected with the anode of diode D2, Vb (v) end of chip U2 is connected with the negative electrode of diode D3, anode and the V of described chip U2 of diode D3 are that (v) holds and be connected, electric capacity C4 is connected with between the negative electrode of diode D3 and the anode of diode D3, the positive pole of electric capacity E4 is connected with the negative electrode of diode D3, the negative pole of electric capacity E4 is connected with the anode of diode D3, Vb (w) end of chip U2 is connected with the negative electrode of diode D4, anode and the V of described chip U2 of diode D4 are that (w) holds and be connected, electric capacity C6 is connected with between the negative electrode of diode D4 and the anode of diode D4, the positive pole of electric capacity E5 is connected with the negative electrode of diode D4, the negative pole of electric capacity E5 is connected with the anode of diode D4, IN (uh) end of described chip U2, IN (vh) holds, IN (wh) holds, IN (ul) holds, IN (vl) end and IN (wl) end all control driver module with described CPU and are electrically connected, VCC (l) end of described chip U2 is connected with power supply, VCC (l) end of described chip U2 to be held with the COM of chip U2 by electric capacity C7 and is connected, the COM of chip U2 holds ground connection, the Ssc end of chip U2 is by electric capacity C12 ground connection, the Vfo end of chip U2 is by resistance R40 ground connection, the Vfo end of chip U2 is by electric capacity C14 ground connection, the Vfo end of chip U2 is also connected with the anode of diode D9, negative electrode and the CPU of diode D9 control driver module and are connected.

3. intelligent control module is warmed in blowing according to claim 2, it is characterized in that: described protection module comprises chip U3, resistance RY1, resistance R23, resistance R26, resistance R27, resistance R32, resistance R33, resistance R35, resistance R36, electric capacity C8, electric capacity C9 and electric capacity C13, described chip U3 is LM393 chip, the OUTA end of described chip U3 is connected with supply module by resistance R27, the OUTA end of described chip U3 to be held with the Ssc of chip U2 by resistance R26 and is connected, the INA-end of chip U3 connects supply module by resistance RY1, chip U3 is by resistance R23 ground connection, chip U3 is also by electric capacity C8 ground connection, the INA+ end of chip U3 to be held with the GND of chip U3 by electric capacity C9 and is connected, the INA+ end of chip U3 to be held with the RTH of chip U2 by resistance R15 and is connected, the GND of chip U3 holds ground connection, the VCC termination supply module of chip U3, the OUTB end of chip U3 connects supply module by resistance R32, the INB-end of described chip U3 connects supply module by resistance R36, the INB-end of described chip U3 controls driver module electrical connection by resistance R35 and CPU, the INB+ end of chip U3 is connected with the first end of resistance R33, second end of resistance R33 is respectively by resistance R37, resistance R38 is connected with chip U2 with resistance R39, the INB+ end of chip U3 is also by electric capacity C13 ground connection.

4. intelligent control module is warmed in blowing according to claim 3, it is characterized in that: described CPU controls driver module and comprises chip U5, resistance RY2, resistance RY3, resistance RY5, resistance RY6, resistance RY7, resistance R21, resistance R22, resistance R24, resistance R25, resistance R34, resistance R41, resistance R42, resistance R43, resistance R44, resistance R45, resistance R46, resistance R47, resistance R48, resistance R49, crystal oscillator Y1, electric capacity E8, electric capacity C20, electric capacity C21, electric capacity C22, electric capacity C23, electric capacity C24, electric capacity C25, electric capacity C26, electric capacity C27, electric capacity C28, electric capacity C29, electric capacity C30 and electric capacity C31, described chip U5 is TB6575 chip, the GND of chip U5 holds ground connection, the SC end of chip U5 is by electric capacity C23 ground connection, the OS end of chip U5 is by resistance R42 ground connection, the FMAX end of chip U5 connects supply module by resistance RY3, the FMAX end of chip U5 is by resistance R41 ground connection, the VSP end of chip U5 is electrically connected with modulation module, the CW_CCW end of chip U5 connects supply module by resistance R24, the CW_CCW end of chip U5 is by resistance R22 ground connection, the START end of chip U5 is successively by resistance R43 and electric capacity C22 ground connection, the IP end of chip U5 is by electric capacity C22 ground connection, the XTout end of chip U5 is connected with the first end of crystal oscillator Y1, the XTin end of chip U5 is connected with second end of crystal oscillator Y1, the first end of crystal oscillator Y1 is by electric capacity C20 ground connection, second end of crystal oscillator Y1 is by electric capacity C21 ground connection, the LA end of chip U5 connects supply module by resistance R21, the LA end of chip U5 is by resistance RY2 ground connection, the FST end of chip U5 connects supply module by resistance RY5, the FST end of chip U5 is by resistance R25 ground connection, the WAVE end of chip U5 is held with the OUTB of chip U3 and is connected, the WAVE end of chip U5 is by electric capacity C24 ground connection, the OC end of chip U5 to be held with the Nu of chip U2 by resistance R34 and is connected, the OC end of chip U5 also to be held with the INB-of described chip U3 by resistance R34 and resistance R35 successively and is connected, the OC end of chip U5 is by electric capacity C25 ground connection, the vdd terminal of described chip U5 is connected with supply module, the vdd terminal of chip U5 to be held with the SEL_LAP of chip U5 by resistance RY6 and resistance RY7 successively and is connected, the vdd terminal of chip U5 is held with the SEL_LAP of chip U5 by electric capacity C11 successively and is connected, the vdd terminal of chip U5 is held with the SEL_LAP of chip U5 by electric capacity E8 successively and is connected, the OUT_WN end of chip U5 to be held with the IN (wl) of chip U2 by resistance R44 and is connected, the OUT_WN end of chip U5 is also successively by resistance R44 and electric capacity C26 ground connection, the OUT_WP end of chip U5 to be held with the IN (wh) of chip U2 by resistance R45 and is connected, the OUT_WP end of chip U5 is also successively by resistance R45 and electric capacity C27 ground connection, the OUT_VN end of chip U5 to be held with the IN (vl) of chip U2 by resistance R46 and is connected, the OUT_VN end of chip U5 is also successively by resistance R46 and electric capacity C28 ground connection, the OUT_VP end of chip U5 to be held with the IN (vh) of chip U2 by resistance R47 and is connected, the OUT_VP end of chip U5 is also successively by resistance R47 and electric capacity C29 ground connection, the OUT_UN end of chip U5 to be held with the IN (ul) of chip U2 by resistance R48 and is connected, the OUT_UN end of chip U5 is also successively by resistance R48 and electric capacity C30 ground connection, the OUT_UP end of chip U5 to be held with the IN (uh) of chip U2 by resistance R49 and is connected, the OUT_UP end of chip U5 is also successively by resistance R49 and electric capacity C31 ground connection.

5. intelligent control module is warmed in blowing according to claim 4, it is characterized in that: described modulation module comprises resistance R101, resistance R102, slide-changing resistor R103, slide-changing resistor R104, resistance R105, slide-changing resistor R106 and electric capacity C101, the first end of described resistance R101 is held with the VSP of chip U5 and is connected, second end of described resistance R101 is by resistance R102 ground connection, second end of described resistance R101 is by electric capacity C101 ground connection, second end of described resistance R101 is also connected with the first end of slide-changing resistor R103, the sliding end that becomes of slide-changing resistor R103 is connected with the first end of slide-changing resistor R103, second end of described slide-changing resistor R103 is also connected with the first end of slide-changing resistor R104, the sliding end that becomes of slide-changing resistor R104 is connected with the first end of slide-changing resistor R104, second end of slide-changing resistor R104 is connected with supply module, second end of slide-changing resistor R104 is held with the VSP of chip U5 by resistance R105 and is connected, second end of slide-changing resistor R106 is held with the VSP of chip U5 and is connected, the first end ground connection of slide-changing resistor R106, the first end of slide-changing resistor R106 also becomes to hold with slide-changing resistor R106 sliding and is connected.