CN104916392B - Monolithic electronic component and the method for manufacturing the monolithic electronic component - Google Patents
Monolithic electronic component and the method for manufacturing the monolithic electronic component Download PDFInfo
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/10—Metal-oxide dielectrics
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Soft Magnetic Materials (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Provide a kind of monolithic electronic component and the method for manufacturing the monolithic electronic component, the monolithic electronic component can have excellent direct current (DC) bias characteristic by applied metal magnetic material, low D.C. resistance Rdc is realized by increasing the area of section of Inside coil, and efficiency characteristic is improved by obtaining high magnetic permeability, while reduces the core loss of metallicl magnetic material.
Description
This application claims in Korea Spro 10-2014-0029181 for being submitted to Korean Intellectual Property Office on March 12nd, 2014
The rights and interests of state's patent application, the disclosure of the patent application are contained in this by reference.
Technical field
This disclosure relates to a kind of monolithic electronic component and the method for manufacturing the monolithic electronic component.
Background technology
In electronic building brick, the inductor quilt of circuit is formed together with resistor and capacitor as important passive element
As for removing noise or constructing the component of LC resonance circuits etc..
The passive element quilt of the power inductor used in smart phone, mobile message technology (IT) equipment etc. etc.
In 1MHz or higher high frequency band.Therefore, mainly used by mixing, being calcined and grind referred to as soft magnetic iron
Multimetal oxide (such as the Fe of oxysome2O3, NiO, CuO and ZnO) and prepare soft magnetic material.
However, recently, as volume of transmitted data of smart phone, mobile information technoloy equipment etc. etc. has significantly increased, for
For the high speed processing of data, the switching frequency increase of CPU (CPU), and due to the high score of smart mobile phone screen
Increase of resolution and area etc. and cause the amount of the power consumption in mobile device etc. quickly to increase.Due to moving as described above
The amount increase of power consumption in dynamic equipment, so the design of the drive circuit in CPU, display unit and power management module etc.
Multiple passive elements of the middle power inductor used etc. are needed with high power consumption efficiency characteristic.
According to the demand as described above for being used to improve the efficiency of power inductor etc., following power electricity has been produced
The product of sensor component：Soft magnetic ferrite material is replaced by using fine metal powder, so as to used in 1MHz or higher
High frequency band in, and by significantly decreasing eddy-current loss etc., so as to energy consumption efficiency and Dc bias with raising
Characteristic.
According to correlation technique, as the inductor using metal dust, thin film inductor and winding inductance are used for
Device.
Thin film inductor manufactures by the following method：By coating method on the plate of printed circuit board (PCB) (PCB) etc.
Form copper cash part；The metal dust epoxy mixing material obtained by mixed metal powder and epoxy resin is compressing
With around copper cash part；And the curing process of epoxy resin is performed by being heat-treated.
Winding inductor can be manufactured by following technique：Coiled wires；Mixed each other using wherein metal and epoxy resin
The composite of conjunction come surround winding copper cash；Pressing is molded to realize chip the coiled wires that will be around in mould under high pressure
Shape；Then epoxy resin cure is made by heat treatment.
Compared with ferrite multilayered inductor, by the inductor that two methods as described above manufacture with significant excellent
Good direct current (DC) bias characteristic, and obtained as by assessing the property of power management integrated circuits (PMIC) module group etc.
The result obtained, efficiency improve the amount of some percentages or more.
As described above, except improving the DC bias characteristics and inductor efficiency characteristic of inductor due to applied metal powder
The advantages of outside, in order to obtain the possibility of production in enormous quantities simultaneously, have studied metal magnetic multi-layer inductor.Metallic magnetic
Property multi-layer inductor can manufacture by the following method：By the homogeneous mixture that metal dust and polymer are formed with sheet form
To replace oxide ferrite sheet；And such as piercing process, inner conductor typography are performed to metal magnetic piece, stacks work
The series of process such as skill and sintering process.
In this metal magnetic multi-layer inductor, it is possible to achieve the DC similar to thin film inductor or winding inductor is inclined
Characteristic is pressed, but needs to improve quality factor (Q) value for the efficiency characteristic for influenceing inductor and reduces D.C. resistance Rdc.
Efficiency characteristic is mainly influenceed and mainly by Inside coil by core loss of the magnetic material in low current region
The influence of resistance in high current zone.Specifically, in order to improve directly related with the usage time of standby power
Inductor efficiency in low current, it should use the metallicl magnetic material with low core loss and high magnetic conductivity.
【Correlation technique document】
Japanese Patent Publication announces No.2007-027354
The content of the invention
Some embodiments of the present disclosure can provide a kind of monolithic electronic component and the method for manufacturing the monolithic electronic component,
The monolithic electronic component has excellent direct current (DC) bias characteristic and by improving the core loss characteristic of magnetic material simultaneously
And reduce D.C. resistance Rdc and there can be the efficiency improved.
According to some embodiments of the present disclosure, a kind of monolithic electronic component can include：Multiple metal magnetic layers；Lead inside
Body layer, including form negative printing and Inside coil the pattern part on metal magnetic layer；And upper caldding layer is with
Coating, formed on the upper and lower part including multiple metal magnetic layers and the live part of internal conductor layer, wherein, overlying
Cap rock and lower caldding layer include the metallic magnetic grain with 8 μm to 25 μm of particle diameter, and negative printing, which includes, has 5 μm extremely
The metallic magnetic grain of 15 μm of particle diameter, the metal magnetic layer of live part include the metallic magnetic with 1 μm to 10 μm of particle diameter
Property particle.
Metallic magnetic grain can be formed as having metal oxide film in its surface, and metal oxide film can be with
It is attached to the metal oxide film of metallic magnetic grain adjacent thereto.
Metallic magnetic grain can be formed as separated from one another.
Form the metal oxide film on the surface of the metallic magnetic grain included in upper caldding layer and lower caldding layer
There can be 200nm to 300nm thickness.
The surface of the metallic magnetic grain formed in the metal magnetic layer included in negative printing and live part
On metal oxide film can have 50nm to 200nm thickness.
Metallic magnetic grain can be utilized comprising the one or more selected from the group being made up of Fe, Si, Cr, Al and Ni
Kind alloy formed.
The metal magnetic layer of upper caldding layer and lower caldding layer, negative printing and live part, which can include, to be formed as
There is the metallic magnetic grain of metal oxide film in its surface, and the space between metallic magnetic grain can fill
There is fluoropolymer resin.
Fluoropolymer resin can account for the metal magnetic layer of upper caldding layer and lower caldding layer, negative printing and live part
The area of section 10% to 30%.
Inside coil pattern part and the metal magnetic layer that is stacked on a surface of Inside coil pattern part can be with
It is separated from one another to form non-contact part.
According to some embodiments of the present disclosure, a kind of monolithic electronic component can include：Multiple metal magnetic layers；Lead inside
Body layer, including the Inside coil pattern part formed on metal magnetic layer and negative printing；And upper caldding layer is with
Coating, formed on the upper and lower part including multiple metal magnetic layers and the live part of internal conductor layer, wherein, overlying
The metal magnetic layer of cap rock and lower caldding layer, negative printing and live part, which includes, is formed as having metal in its surface
The metallic magnetic grain of oxidation film, comprising metallic magnetic grain maximum particle diameter with the metal magnetic layer of live part,
Negative printing and upper caldding layer and lower caldding layer sequentially increase.
The maximum particle diameter of metallic magnetic grain included in the metal magnetic layer of live part can be 10 μm, be included in
The maximum particle diameter of metallic magnetic grain in negative printing can be 15 μm, included in upper caldding layer and lower caldding layer
The maximum particle diameter of metallic magnetic grain can be 25 μm.
Form the metal oxide film on the surface of the metallic magnetic grain included in upper caldding layer and lower caldding layer
There can be 200nm to 300nm thickness.
The surface of the metallic magnetic grain formed in the metal magnetic layer included in negative printing and live part
On metal oxide film can have 50nm to 200nm thickness.
The metal magnetic layer of upper caldding layer and lower caldding layer, negative printing and live part can include filling metal
The fluoropolymer resin in the space between magnetic-particle.
Inside coil pattern part and the metal magnetic layer that is stacked on a surface of Inside coil pattern part can be with
It is separated from one another to form non-contact part.
According to some embodiments of the present disclosure, a kind of method for manufacturing monolithic electronic component can include：Prepare multiple gold
Belong to magnetic piece；Inside coil pattern part is formed on metal magnetic piece；Inside coil pattern part shape is surrounded using magnetic paste
Into negative printing；Multiple metal magnetic pieces formed with Inside coil pattern part and negative printing thereon are stacked,
To form live part；And further stacked on the upper and lower part of live part multiple metal magnetic pieces with formed including
Upper caldding layer formed therein and the multi-layer body of lower caldding layer, wherein, the metallic magnetic of formation upper caldding layer and lower caldding layer
Property piece include with 9 μm to 11 μm of D50Metallic magnetic grain, formed negative printing magnetic paste include have 7 μm extremely
8 μm of D50Metallic magnetic grain, the metal magnetic piece for forming live part included with 3 μm to 5 μm of D50Metal magnetic
Particle.
Methods described can also include：Internally coil pattern part and a table for being stacked on Inside coil pattern part
The polymer for forming gap is formed in the space between metal magnetic piece on face, and for forming the polymer in gap
It can be pyrolyzed during sintering process internally to form non-contact part between coil pattern part and metal magnetic layer.
Methods described can also include：After sintered multilayer main body, covered with fluoropolymer resin filling upper caldding layer with
Space between the metallic magnetic grain of the metal magnetic layer of cap rock, negative printing and live part.
Brief description of the drawings
By the detailed description carried out below in conjunction with the accompanying drawings, above and other aspect, feature and the further advantage of the disclosure
To more clearly it be understood, in the accompanying drawings：
Fig. 1 is the perspective view according to the monolithic electronic component of the exemplary embodiment of the disclosure；
Fig. 2 is the sectional view along Fig. 1 I-I' lines interception；
Fig. 3 is the signal enlarged drawing of Fig. 2 part A；
Fig. 4 is the signal enlarged drawing of Fig. 2 part B；
Fig. 5 is the signal enlarged drawing of Fig. 2 C portion；
Fig. 6 is the sectional view according to the monolithic electronic component of the another exemplary embodiment of the disclosure；
Fig. 7 is to be used to compare direct current in the case where forming non-contact part according to the exemplary embodiment of the disclosure
The curve map of resistance；
Fig. 8 A to Fig. 8 E are schematically to describe the manufacture monolithic electronic component according to the exemplary embodiment of the disclosure
The view of method；And
Fig. 9 is that the method for schematically showing formation non-contact part according to the exemplary embodiment of the disclosure regards
Figure.
Embodiment
Describe the embodiment of present inventive concept in detail now with reference to accompanying drawing.
However, the disclosure can be come for example, and should not be construed as limited in many different forms
This specific embodiment proposed.And these embodiments are to provide so that the disclosure will be thoroughly and completely, and will be this public affairs
The scope opened is fully conveyed to those skilled in the art.
In the accompanying drawings, for the sake of clarity, the shape and size of element can be exaggerated, and identical reference will be by
For indicating same or analogous element all the time.
Monolithic electronic component
Hereinafter, the monolithic electronic component by description according to the exemplary embodiment of the disclosure.In detail, will describe
Multi-layer inductor, but disclosure not limited to this.
Fig. 1 is according to the perspective view of the monolithic electronic component of the exemplary embodiment of the disclosure, and Fig. 2 is the I- along Fig. 1
The sectional view of I' lines interception.
Referring to Figures 1 and 2, multiple gold can be included according to the monolithic electronic component 100 of the exemplary embodiment of the disclosure
Belong to magnetosphere 10 and form the internal conductor layer 20 on metal magnetic layer 10.
Metal magnetic layer 10 can have 10 μm to 20 μm of thickness.It is less than 10 μm of feelings in the thickness of metal magnetic layer 10
Under condition, short-circuit generation can increase, and in the case where thickness is more than 20 μm, inductance may subtract due to the increase of magnetic flux path
It is small.
Multiple metal magnetic layers 10 formed with internal conductor layer 20 can stack to form inductance to help to thereon
Live part 50, upper caldding layer 31 and lower caldding layer 32 can be formed on the upper and lower part of live part 50.
Upper caldding layer 31 and lower caldding layer 32 can be formed by stacking multiple metal magnetic pieces.Form upper caldding layer 31
May be at sintering state with multiple metal magnetic pieces of lower caldding layer 32, and adjacent metal magnetic layer it is integrated with one another so that
It is not easy to differentiate the border between them in the case of no SEM (SEM).
Metal magnetic main body 110 including live part 50 and upper caldding layer 31 and lower caldding layer 32 can be formed as having
There are the end surfaces along length (L) direction, the side surface along width (W) direction and the upper surface along thickness (T) direction and following table
The hexahedron in face.
Being electrically connected to the external electrode 130 of Inside coil can form on two end surfaces of metal magnetic main body 110.
The internal conductor layer 20 formed on metal magnetic layer 10 can include Inside coil pattern part 21 and negative print
Brush element 22.
Increase Inside coil pattern part 21 thickness to reduce D.C. resistance Rdc in the case of, due to Inside coil
The increased thickness of pattern part 21 and form stacking step part.This step may during the technique of compacting multi-layer body
Cause depression and the deformation of Inside coil pattern part 21, and decrease due to interlaminar bonding or crackle etc. and cause such as layer
Between the problem of separating.
Therefore, for being formed in the region of internal conductor layer 20, negative printing 22 can be formed except wherein
Formed in the region outside the region of Inside coil pattern part 21.It will wherein formed in the region of internal conductor layer 20,
Negative printing 22 forms not formed wherein in the region of Inside coil pattern part 21 in the region, so as to prevent
The generation for the problem of such as stacking step part, and the aspect ratio of thickness and width with relative high levels can be formed
Inside coil pattern part 21, so as to reduce D.C. resistance Rdc.
Inside coil pattern part 21 can be formed by printing the electroconductive paste comprising conducting metal, and conducting metal
It is not specifically limited, as long as it has excellent electric conductivity.For example, as conducting metal, can be used alone silver-colored (Ag),
Palladium (Pd), aluminium (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu) or platinum (Pt) etc., or their mixture can be used.
Metal magnetic layer 10, negative printing 22 and upper caldding layer 31 and lower caldding layer 32 can include metal magnetic
Particle 41,42 and 43.
Metallic magnetic grain 41,42 and 43 can include the metallic magnetic grain of non-retentive alloy, the non-retentive alloy
E.g. comprising the one or more of alloys selected from the group being made up of Fe, Si, Cr, Al and Ni, more particularly, it is
Fe-Si-Cr based alloys, but disclosure not limited to this.
Fig. 3 is the enlarged drawing for the part A for being shown schematically in the metal magnetic layer 10 shown in Fig. 2, and Fig. 4 is schematic
Ground shows the enlarged drawing of the part B of Fig. 2 negative printing 22, and Fig. 5 is the C for the lower caldding layer 32 for schematically showing Fig. 2
Partial enlarged drawing.
To Fig. 5, metal oxide film 45 can be formed included in metal magnetic layer 10, negative printing reference picture 3
22 with the surface of upper caldding layer 31 and the metallic magnetic grain 41 to 43 in lower caldding layer 32, and passing through metal oxide film
45 can obtain insulating property (properties) between metallic particles and between metallic particles and internal electrode.
Metal oxide film 45 can be formed by making at least one composition oxidation of metallic magnetic grain 41 to 43, and
And metal oxide film 45 can include such as Cr2O3。
In the case of corresponding metallic magnetic grain 41 to 43, its metal oxide film 45 can be incorporated into adjacent thereto
Metallic magnetic grain metal oxide film 45.Mechanical strength and insulation can be improved by the combination of metal oxide film 45
Property.
Meanwhile do not have between them can be with separated from one another in the case of combining for metallic magnetic grain 41 to 43.
In the case where metallic magnetic grain 41 to 43 is bonded to each other, eddy-current loss can be increased, so as to which quality factor (Q) can be reduced,
And (AC) horizontal increase is exchanged according to caused by the increase on the contact surface between metallic particles, can further be subtracted
Small Q values.Therefore, in an exemplary embodiment of the disclosure, due in the case of corresponding metallic magnetic grain 41 to 43, its
Metal oxide film 45 can be only joined to the metal oxide film 45 of metallic magnetic grain adjacent thereto, it is possible to reduce
Eddy-current loss.Further, since metallic magnetic grain 41 to 43 is not directly contacted with each other, it is possible to is reduced and is caused because of AC increases
Q values reduction, so as to when the disclosure is applied into power inductor, the disclosure can have excellent in terms of high power efficiency
Gesture.
Metallic magnetic included in metal magnetic layer 10, negative printing 22 and upper caldding layer 31 and lower caldding layer 32
The maximum particle diameter of property particle can be with metal magnetic layer 10, negative printing 22 and upper caldding layer 31 and lower caldding layer 32
Sequentially increase.
Metal magnetic layer 10 can include the metallic magnetic grain 41 with 1 μm to 10 μm of particle diameter, and metal magnetic
The maximum particle diameter of particle 41 can be 10 μm.
Negative printing 22 can include the metallic magnetic grain 42 with 5 μm to 15 μm of particle diameter, and it is maximum
Particle diameter can be 15 μm.
Upper caldding layer 31 and lower caldding layer 32 can include the metallic magnetic grain 43 with 8 μm to 25 μm of particle diameter, and
And its maximum particle diameter can be 25 μm.
In the case of using the metallic magnetic grain with relatively small particle diameter, magnetic conductivity can be due to the reduction of particle diameter
And reduce, in the case of using the metallic magnetic grain with relatively large particle diameter, magnetic conductivity can increase, but may increase
Concrete-cored loss.
Therefore, according to the exemplary embodiment of the disclosure, the metal magnetic with different-grain diameter is wherein included by being formed
The structure of particle so that maximum particle diameter with metal magnetic layer 10, negative printing 22 and upper caldding layer 31 and lower covering
Layer 32 sequentially increases, so as to reduce core loss and can realize high magnetic conductivity.
In the case where the maximum particle diameter of the metallic magnetic grain 41 included in metal magnetic layer 10 is more than 10 μm, dispersiveness
It may deteriorate, the surface roughness of metal magnetic layer 10 may increase, and the intensity of metal magnetic layer 10 may be due to metal
The increase of the amount in the hole in magnetosphere 10 and reduce.Thus it can be difficult to form the metal magnetic with 20 μm or smaller thickness
Layer 10.
In the case where the maximum particle diameter of the metallic magnetic grain 42 included in negative printing 22 is more than 15 μm,
Core loss at high-frequency may excessively increase.
It is equal to or less than in the maximum particle diameter of the metallic magnetic grain 43 included in upper caldding layer 31 and lower caldding layer 32
In the case of the maximum particle diameter of metallic magnetic grain included in metal magnetic layer 10 or negative printing 22, due to relative
Small particle diameter and be likely difficult to realize high magnetic permeability, and in the metal being wherein included in upper caldding layer 31 and lower caldding layer 32
In the case that the maximum particle diameter of magnetic-particle 43 is more than 25 μm, the core loss at high-frequency may excessively increase.
Meanwhile the gold formed on the surface of the metallic magnetic grain 43 included in upper caldding layer 31 and lower caldding layer 32
Belong to the thickness that oxidation film 45 there can be 200nm to 300nm, formed included in negative printing 22 and metal magnetic layer
Metal oxide film 45 on the surface of metallic magnetic grain 41 and 42 in 10 can have 50nm to 200nm thickness.
Upper caldding layer 31 and lower caldding layer 32, negative printing 22 and metal magnetic layer 10 are included with different-grain diameter
Metallic magnetic grain, and the metal oxide film 45 formed on the surface of metallic magnetic grain can have different thickness
Degree, so as to reduce ratio resistance, and it can prevent that magnetic conductivity reduces caused by oxidation film.
In the case that the thickness of metal oxide film 45 in upper caldding layer 31 and lower caldding layer 32 is less than 200nm, magnetic
The ratio resistance of property composite members can reduce, and the thickness of the metal oxide film 45 in upper caldding layer 31 and lower caldding layer 32 is more than
In the case of 300nm, the magnetic properties of metallic magnetic grain may significantly be deteriorated due to oxidation film, so as to reduce
Magnetic conductivity.
The thickness of metal oxide film 45 in negative printing 22 and metal magnetic layer 10 is less than 50nm situation
Under, the ratio resistance of magnetic coupling part may reduce, the metal oxide film in negative printing 22 and metal magnetic layer 10
In the case that 45 thickness is more than 200nm, the magnetic properties of metallic magnetic grain may significantly be deteriorated due to oxidation film,
So as to reduce magnetic conductivity.
Upper caldding layer 31 and lower caldding layer 32, negative printing 22 and metal magnetic layer 10 can have wherein polymer
Resin 48 is filled in the structure in the space between metallic magnetic grain.
Fluoropolymer resin 48 can fill the space between metallic magnetic grain as follows：By the metal magnetic main body of sintering
110 are immersed in fluoropolymer resin, and depressurize or fluoropolymer resin is applied to sintering metal magnetic main body 110 table
Face, fluoropolymer resin is then set to be absorbed into metal magnetic main body 110.
Fluoropolymer resin 48 fills the space between metallic magnetic grain, so as to improve the intensity of metal magnetic main body
And hygroscopicity can be reduced.
Fluoropolymer resin 48 can be from by silicon resinoid, epoxylite, phenolic resin, silicates resin, poly- ammonia
The one kind selected in the group that esters resin, acid imide resin, acrylic resin, polyester resin and polythylene resin form
Or more kind.
Fluoropolymer resin 48 can account for upper caldding layer 31 and lower caldding layer 32, negative printing 22 and metal magnetic layer 10
The area of section 10% to 30%.
In the case that the area of fluoropolymer resin 48 is less than 10% wherein, intensity can reduce, and in the feelings of high humility
Under condition, moisture can be absorbed into magnetic body, in the case that the area of fluoropolymer resin 48 is more than 30% wherein, magnetic conductivity
It can reduce.
Fig. 6 is the sectional view according to the monolithic electronic component of the another exemplary embodiment of the disclosure.
Reference picture 6, Inside coil pattern part 21 and the gold being stacked on a surface of Inside coil pattern part 21
Category magnetosphere 10 can be formed as separated from one another, so as to form non-contact part 25.
Forming the conducting metal of Inside coil pattern part 21 may receive during the sintering process of metal magnetic main body 110
Contracting, but the metallic magnetic grain for forming metal magnetic layer 10 does not shrink, so as to increase stress.
Therefore, according to the exemplary embodiment of the disclosure, non-contact part 25 forms the He of coil pattern part 21 internally
It is stacked between the metal magnetic layer 10 on a surface of Inside coil pattern part 21, so as to so that due to Inside coil
Stress relaxes caused by shrinkage factor difference between pattern part 21 and metal magnetic layer 10, and can improve agglutinating property
Matter, so as to reduce D.C. resistance Rdc (see Fig. 7).
One surface of Inside coil pattern part 21 can with contacting metal magnetosphere 10, Inside coil pattern part 21
Another surface can be because non-contact part 25 be without contacting metal magnetosphere 10.
The method for manufacturing monolithic electronic component
Fig. 8 A to Fig. 8 E are to schematically show the manufacture monolithic electronic component according to the exemplary embodiment of the disclosure
The view of method.
Reference picture 8A, it is possible, firstly, to prepare multiple metal magnetic piece 10'.
Metal magnetic piece 10' can be manufactured to piece by the following method：By metallic magnetic grain and such as binding agent and
The organic material of solvent etc. is mixed to prepare slurry；By the slurry of preparation be applied to carrier film and using doctor blade method so that its
With some μm of thickness；Then the slurry drying of application is made.
Metal magnetic piece 10' can have 10 μm to 20 μm of thickness.It is less than 10 μm in metal magnetic piece 10' thickness
In the case of, short-circuit generation may increase, and in the case where metal magnetic piece 10' thickness is more than 20 μm, inductance may be due to
The increase of magnetic flux path and reduce.
Metallic magnetic grain can be formed using non-retentive alloy, the non-retentive alloy be for example comprising from by Fe, Si,
The one or more of alloys selected in the group of Cr, Al and Ni composition, are Fe-Si-Cr based alloys in more detail, but not
It is limited to this.
Metal magnetic piece 10' can include D50For 3 μm to 5 μm of metallic magnetic grain 41.
D50It can represent by using laser diffraction with the particle diameter distribution measuring method measurement of scattering based on 50%
The particle diameter during volume of accumulative perception.
In the D of the metallic magnetic grain 41 included in metal magnetic piece 10'50In the case of 5 μm, dispersiveness may
Deterioration, metal magnetic piece 10' surface roughness may increase, and metal magnetic piece intensity may be due in metal magnetic piece
The increase in the hole in 10' and reduce.Thus it can be difficult to form the metal magnetic piece 10' with 20 μm or smaller of thickness.
Reference picture 8B, Inside coil pattern part 21 can be formed on metal magnetic piece 10'.
Inside coil pattern part 21 can carry out shape by using printing process etc. using the electroconductive paste comprising conducting metal
Into.Conducting metal is not particularly limited, as long as it has excellent electric conductivity.For example, as conducting metal, can be used alone
Silver (Ag), palladium (Pd), aluminium (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu) or platinum (Pt) etc., or theirs can be used
Mixture.As the printing process of electroconductive paste, method for printing screen or gravure process etc. can be used, but the disclosure is not
It is limited to this.
Reference picture 8C, magnetic can be utilized to paste and form negative printing 22 around Inside coil pattern part 21.
Negative printing 22 is formed around Inside coil pattern part 21, so as to prevent by Inside coil drafting department
The generation of step part is stacked caused by points 21 thickness.
Magnetic paste can include the organic material of metallic magnetic grain 42 and binding agent etc..
Metallic magnetic grain 42 can include the metallic magnetic grain of non-retentive alloy, and the non-retentive alloy is for example to wrap
It is Fe-Si-Cr more particularly containing the one or more of alloys selected from the group being made up of Fe, Si, Cr, Al and Ni
Based alloy, but not limited to this.
Forming the magnetic paste of negative printing 22 can include with 7 μm to 8 μm of D50Metallic magnetic grain 42.
The D of metallic magnetic grain 42 in being pasted included in magnetic50In the case of more than 8 μm, the core damage at high-frequency
Consumption can excessively increase.
Magnetic paste can be applied to metal magnetic piece 10' by using silk screen print method etc., and to the magnetic of application
Paste is heated and dried to form negative printing 22.
Reference picture 8D, can be more formed with Inside coil pattern part 21 and negative printing 22 thereon by stacking
Individual metal magnetic piece 10' forms live part 50.
Meanwhile the method for manufacturing monolithic electronic component can also include being formed being used for internally coil pattern part 21 and heap
It is stacked in the polymer 24 that gap is formed between the metal magnetic piece 10' on a surface of Inside coil pattern part 21.
Polymer 24 for forming gap can be pyrolyzed during the sintering process of subsequent multi-layer body, with internally
Non-contact part 25 is formed between coil pattern part 21 and metal magnetic layer 10.
Reference picture 9, (the example of polymer 24 for forming gap can be formed on the Inside coil pattern part 21 of printing
Such as, polymeric beads), and make its pyrolysis during sintering process, so as to form non-contact part 25.
Non-contact part 25 forms internally coil pattern part 21 and is stacked on one of Inside coil pattern part 21
Between metal magnetic layer 10 on surface, so as to so that due to internally between coil pattern part 21 and metal magnetic layer 10
Shrinkage factor difference caused by stress relax, and sintering property can be improved, so as to reduce D.C. resistance Rdc.
Polymer for forming gap is not specifically limited, as long as the polymer can be in the sintering temperature of multi-layer body
It is lower to be pyrolyzed so as to form gap.
One surface of Inside coil pattern part 21 can be with contacting metal magnetosphere 10, and Inside coil pattern part
21 another surface can be because non-contact part 25 be without contacting metal magnetosphere 10.
Reference picture 8E, can be by further stacking multiple metal magnetic pieces on the upper and lower part of live part 50
10' is formed with the multi-layer body of upper caldding layer 31 and lower caldding layer 32 to be formed.
Forming the metal magnetic piece 10' of upper caldding layer 31 and lower caldding layer 32 can include with 9 μm to 11 μm of D50's
Metallic magnetic grain 43.
In the metallic magnetic grain 43 included in the metal magnetic piece 10' for forming upper caldding layer 31 and lower caldding layer 32
D50In the case of less than 9 μm, due to relatively small particle diameter, it may be difficult to relatively high magnetic conductivity is realized, in formation
The D of metallic magnetic grain in the metal magnetic piece 10 ' of coating 31 and lower caldding layer 3250In the case of more than 11 μm, in height
Core loss at frequency may excessively increase.
Afterwards, can at a temperature of 700 DEG C to 800 DEG C sintered multilayer main body.
Can during sintering process the metal magnetic piece 10' included in live part 50, negative printing 22 with
And metal oxide film 45 is formed on the surface of upper caldding layer 31 and the metallic magnetic grain 41 to 43 in lower caldding layer 32.Pass through
Metal oxide film 45 can ensure insulating property (properties) between metallic particles and between metallic particles and internal electrode.
Metal oxide film 45 can be by making at least one composition of metallic magnetic grain 41 to 43 aoxidize to be formed simultaneously
And such as Cr can be included2O3。
In the case of corresponding metallic magnetic grain 41 to 43, its metal oxide film 45 can be incorporated into adjacent thereto
Metallic magnetic grain metal oxide film 45.In other words, in the case of corresponding metallic magnetic grain 41 to 43, with
The metal oxide film 45 of its adjacent particle can be with connection.Machine can be improved by the combination of metal oxide film 45
Tool intensity and insulating property (properties).
Meanwhile metallic magnetic grain 41 to 43 can not have between them it is separated from one another in the case of combining.
In the case where metallic magnetic grain 41 to 43 is bonded to each other, eddy-current loss can be increased, so as to which quality factor (Q) can be reduced, and
And according to the horizontal increase of the alternating current (AC) caused by the contact surface increase between metallic particles, can be further
Reduce Q values.Therefore, in an exemplary embodiment of the disclosure, due in the case of corresponding metallic magnetic grain 41 to 43,
Its metal oxide film 45 can be incorporated into the metal oxide film 45 of metallic magnetic grain adjacent thereto, it is possible to reduce
Eddy-current loss.Further, since metallic magnetic grain 41 to 43 is not directly contacted with each other, it is possible to is reduced and is drawn because AC increases
The reduction of the Q values risen, so as to which when the disclosure is applied into power inductor, the disclosure can have in terms of high power efficiency
Advantage.
Form the metal oxygen on the surface of the metallic magnetic grain 43 included in upper caldding layer 31 and lower caldding layer 32
Compound film 45 can have 200nm to 30nm thickness, and be formed included in negative printing 22 and metal magnetic layer
Metal oxide film 45 on the surface of metallic magnetic grain 41 and 42 in 10 can have 50nm to 200nm thickness.
Upper caldding layer 31 and lower caldding layer 32, negative printing 22 and metal magnetic layer 10 are included with different-grain diameter
Metallic magnetic grain, and the metal oxide film 45 formed on the surface of metallic magnetic grain is formed as having different thickness
Degree, so as to reduce ratio resistance, and it can prevent that magnetic conductivity reduces caused by oxidation film.
In the case that the thickness of metal oxide film 45 in upper caldding layer 31 and lower caldding layer 32 is less than 200nm, magnetic
Property composite members resistivity may reduce, in the case where the thickness is more than 300nm, the magnetic properties of metallic magnetic grain may
Significantly deteriorated due to oxidation film, so as to reduce magnetic conductivity.
The thickness of metal oxide film 45 in negative printing 22 and metal magnetic layer 10 is less than 50nm situation
Under, the resistivity of magnetic coupling part may reduce, in the case where the thickness is more than 200nm, the magnetic of metallic magnetic grain
Matter may significantly be deteriorated due to oxidation film, so as to reduce magnetic conductivity.
The method of manufacture monolithic electronic component can also include：After sintered multilayer main body, filled with fluoropolymer resin
Space between upper caldding layer 31 and the metal magnetic layer 10 of lower caldding layer 32, negative printing 22 and live part 50.
Fluoropolymer resin 48 can fill the space between metallic magnetic grain as follows：By the metal magnetic main body of sintering
110 are immersed in fluoropolymer resin；And depressurize or fluoropolymer resin is applied to sintering metal magnetic main body 110 table
Face, fluoropolymer resin is then set to be absorbed into metal magnetic main body 110.
Fluoropolymer resin 48 fills the space between metallic magnetic grain, so as to improve intensity and can reduce suction
It is moist.
Fluoropolymer resin 48 can be from by silicon resinoid, epoxylite, phenolic resin, silicates resin, poly- ammonia
One selected in the group that esters resin, acid imide resin, acrylic resin, polyester resin and polythylene resin form
Kind or more kind.
Fluoropolymer resin 48 can account for upper caldding layer 31 and lower caldding layer 32, negative printing 22 and metal magnetic layer 10
The area of section 10% to 30%.
In the case where the area of fluoropolymer resin 48 is less than 10%, intensity may reduce, and in the situation of high humility
Under, moisture can be absorbed into magnetic body, and in the case where the area of fluoropolymer resin 48 is more than 30%, magnetic conductivity may drop
It is low.
It is then possible to two end surfaces by the way that electroconductive paste to be applied to metal magnetic main body 110, are then sintering to be formed
External electrode.As the material for external electrode 130, copper (Cu), silver (Ag) or nickel (Ni) etc. are can be used alone, or can make
With their mixture, and tin (Sn) or nickel (Ni) coating can be formed on external electrode.
According to the exemplary embodiment of the disclosure, monolithic electronic component can be by applied metal magnetic material and with excellent
Good direct current (DC) bias characteristic, relatively low D.C. resistance Rdc is realized by increasing the area of section of Inside coil, and
Efficiency characteristic is improved by ensuring high magnetic permeability, while reduces the core loss of metallicl magnetic material.
, to one skilled in the art will be obvious although having been shown above and describing exemplary embodiment
, in the case where not departing from the spirit and scope of the present disclosure being defined by the following claims, may be modified and changed.
Claims (15)
1. a kind of monolithic electronic component, the monolithic electronic component includes：
Live part, including multiple metal magnetic layers and multiple internal conductor layers, each internal conductor layer include inner wire loop graph
Case part and negative printing；And
Upper caldding layer and lower caldding layer, are arranged on the upper and lower part of live part,
Wherein, the metallic magnetic grain in upper caldding layer and lower caldding layer only includes the metallic magnetic with 8 μm to 25 μm of particle diameter
Property particle, the metallic magnetic grain in negative printing only includes the metallic magnetic grain with 5 μm to 15 μm of particle diameter, has
The metallic magnetic grain imitated in the metal magnetic layer of part only includes the metallic magnetic grain with 1 μm to 10 μm of particle diameter,
Wherein, comprising metallic magnetic grain maximum particle diameter with the metal magnetic layer of live part, negative printing with
And upper caldding layer and lower caldding layer sequentially increase,
Wherein, Inside coil pattern part and the metal magnetic layer that is stacked on a surface of Inside coil pattern part be each other
Separate to form non-contact part,
Wherein, Inside coil pattern part and the metal magnetic layer that is stacked on another surface of Inside coil pattern part be each other
Directly contact.
2. monolithic electronic component according to claim 1, wherein, metallic magnetic grain is formed to have in its surface
Metal oxide film, and metal oxide film is attached to the metal oxide film of metallic magnetic grain adjacent thereto.
3. monolithic electronic component according to claim 1, wherein, metallic magnetic grain is formed separated from one another.
4. monolithic electronic component according to claim 1, wherein, formed included in upper caldding layer and lower caldding layer
Metal oxide film on the surface of metallic magnetic grain has 200nm to 300nm thickness.
5. monolithic electronic component according to claim 1, wherein, formed included in negative printing and live part
Metal magnetic layer in metallic magnetic grain surface on metal oxide film there is 50nm to 200nm thickness.
6. monolithic electronic component according to claim 1, wherein, metallic magnetic grain utilize comprising from by Fe, Si, Cr,
One or more of alloys for selecting are formed in the group of Al and Ni compositions.
7. monolithic electronic component according to claim 1, wherein, upper caldding layer and lower caldding layer, negative printing with
And the metal magnetic layer of live part includes the metallic magnetic grain for being formed have metal oxide film in its surface, and
And the space between metallic magnetic grain is filled with fluoropolymer resin.
8. monolithic electronic component according to claim 7, wherein, fluoropolymer resin accounts for upper caldding layer and lower caldding layer, the moon
The 10% to 30% of the area of section of the metal magnetic layer of property printing and live part.
9. a kind of monolithic electronic component, the monolithic electronic component includes：
Live part, including multiple metal magnetic layers and multiple internal conductor layers, each internal conductor layer include inner wire loop graph
Case part and negative printing；And
Upper caldding layer and lower caldding layer, are arranged on the upper and lower part of live part,
Wherein, the metal magnetic layer of upper caldding layer and lower caldding layer, negative printing and live part is included and is formed
There is the metallic magnetic grain of metal oxide film in its surface,
Comprising metallic magnetic grain maximum particle diameter with the metal magnetic layer, negative printing and overlying of live part
Cap rock and lower caldding layer sequentially increase,
Wherein, Inside coil pattern part and the metal magnetic layer that is stacked on a surface of Inside coil pattern part be each other
Separate to form non-contact part,
Wherein, Inside coil pattern part and the metal magnetic layer that is stacked on another surface of Inside coil pattern part be each other
Directly contact,
Wherein, the metallic magnetic grain in upper caldding layer and lower caldding layer only includes the metallic magnetic with 8 μm to 25 μm of particle diameter
Property particle, the metallic magnetic grain in negative printing only includes the metallic magnetic grain with 5 μm to 15 μm of particle diameter, has
The metallic magnetic grain imitated in the metal magnetic layer of part only includes the metallic magnetic grain with 1 μm to 10 μm of particle diameter.
10. monolithic electronic component according to claim 9 is comprising gold in the metal magnetic layer of live part
The maximum particle diameter for belonging to magnetic-particle is 10 μm, and the maximum particle diameter of the metallic magnetic grain included in negative printing is 15 μ
M, the maximum particle diameter of the metallic magnetic grain included in upper caldding layer and lower caldding layer is 25 μm.
11. monolithic electronic component according to claim 9, wherein, formed included in upper caldding layer and lower caldding layer
Metallic magnetic grain surface on metal oxide film there is 200nm to 300nm thickness.
12. monolithic electronic component according to claim 9, wherein, formed included in negative printing and effective portion
Metal oxide film on the surface of metallic magnetic grain in the metal magnetic layer divided has 50nm to 200nm thickness.
13. monolithic electronic component according to claim 9, wherein, upper caldding layer and lower caldding layer, negative printing and
The metal magnetic layer of live part includes the fluoropolymer resin in the space between filling metallic magnetic grain.
14. a kind of method for manufacturing monolithic electronic component, methods described include：
Prepare multiple metal magnetic pieces；
Inside coil pattern part is formed on metal magnetic piece；
Pasted using magnetic and form negative printing around Inside coil pattern part；
Multiple metal magnetic pieces formed with Inside coil pattern part and negative printing thereon are stacked, to form effective portion
Point；And
Multiple metal magnetic pieces are further stacked on the upper and lower part of live part, with formed include it is formed therein upper
The multi-layer body of coating and lower caldding layer,
Wherein, the metal magnetic piece for forming upper caldding layer and lower caldding layer is included with 9 μm to 11 μm of D50Metal magnetic
Grain, the magnetic paste of negative printing is formed comprising with 7 μm to 8 μm of D50Metallic magnetic grain, form live part
Metal magnetic piece is included with 3 μm to 5 μm of D50Metallic magnetic grain,
Wherein, methods described also includes：
Internally between coil pattern part and the metal magnetic piece being stacked on a surface of Inside coil pattern part
The polymer for forming gap is formed in space,
Wherein, it is pyrolyzed for forming the polymer in gap during sintering process, with internally coil pattern part and metallic magnetic
Non-contact part is formed between property layer,
Wherein, the metallic magnetic grain in upper caldding layer and lower caldding layer only includes the metallic magnetic with 8 μm to 25 μm of particle diameter
Property particle, the metallic magnetic grain in negative printing only includes the metallic magnetic grain with 5 μm to 15 μm of particle diameter, has
The metallic magnetic grain imitated in the metal magnetic layer of part only includes the metallic magnetic grain with 1 μm to 10 μm of particle diameter,
Wherein, comprising metallic magnetic grain maximum particle diameter with the metal magnetic layer of live part, negative printing with
And upper caldding layer and lower caldding layer sequentially increase.
15. according to the method for claim 14, methods described also includes：
After sintered multilayer main body, upper caldding layer and lower caldding layer, negative printing and effectively are filled with fluoropolymer resin
Space between the metallic magnetic grain of partial metal magnetic layer.
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| JP6546074B2 (en) * | 2015-11-17 | 2019-07-17 | 太陽誘電株式会社 | Multilayer inductor |
| JP7032039B2 (en) * | 2016-06-28 | 2022-03-08 | Tdk株式会社 | Multilayer coil parts |
| US11069468B2 (en) * | 2016-08-09 | 2021-07-20 | Panasonic Intellectual Property Management Co., Ltd. | Common mode choke coil and manufacturing method therefor |
| KR101963281B1 (en) | 2016-12-14 | 2019-03-28 | 삼성전기주식회사 | Inductor |
| JP6729422B2 (en) * | 2017-01-27 | 2020-07-22 | 株式会社村田製作所 | Multilayer electronic components |
| KR20180105891A (en) | 2017-03-16 | 2018-10-01 | 삼성전기주식회사 | Coil Electronic Component and Manufacturing Method Thereof |
| JP7106271B2 (en) * | 2017-12-20 | 2022-07-26 | 太陽誘電株式会社 | Magnetically coupled coil parts |
| JP7145610B2 (en) | 2017-12-27 | 2022-10-03 | Tdk株式会社 | Laminated coil type electronic component |
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| JP2001244116A (en) * | 2000-02-29 | 2001-09-07 | Taiyo Yuden Co Ltd | Electronic component and method of manufacturing the same |
| JP4794929B2 (en) | 2005-07-15 | 2011-10-19 | 東光株式会社 | Manufacturing method of multilayer inductor for high current |
| JP2012238840A (en) * | 2011-04-27 | 2012-12-06 | Taiyo Yuden Co Ltd | Multilayer inductor |
| KR101872520B1 (en) * | 2011-07-28 | 2018-06-29 | 삼성전기주식회사 | Laminated ceramic electronic parts |
| JP5048155B1 (en) * | 2011-08-05 | 2012-10-17 | 太陽誘電株式会社 | Multilayer inductor |
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| JP5960971B2 (en) * | 2011-11-17 | 2016-08-02 | 太陽誘電株式会社 | Multilayer inductor |
| KR101792273B1 (en) * | 2012-06-14 | 2017-11-01 | 삼성전기주식회사 | Multi-layered chip electronic component |
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