CN104916392A - Multilayered electronic component and manufacturing method thereof - Google Patents
Multilayered electronic component and manufacturing method thereof Download PDFInfo
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/10—Metal-oxide dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Soft Magnetic Materials (AREA)
Abstract
The invention provides a multilayered electronic component and a manufacturing method thereof. The multilayered electronic component has excellent DC bias voltage characteristics by employing metal magnetic materials, realizes low Rdc through adding the sectional area of inside coils, increasing efficiency characteristics through obtaining high permeability and meanwhile reducing the core loss of metal magnetic materials.
Description
This application claims and be submitted to the rights and interests of the 10-2014-0029181 korean patent application of Korean Intellectual Property Office on March 12nd, 2014, the open of this patent application is contained in this by reference.
Technical field
The disclosure relates to a kind of monolithic electronic component and manufactures the method for this monolithic electronic component.
Background technology
In electronic building brick, be used as removing noise or constructing the assembly of LC resonant circuit etc. as important passive component and resistor inductor of forming circuit together with capacitor.
The passive component of the such as power inductor used in smart phone, mobile message technology (IT) equipment etc. etc. is used in the high frequency band of 1MHz or higher.Therefore, mainly employed by mixing, roasting grinding is referred to as Multimetal oxide (the such as Fe of soft magnetic ferrite
2o
3, NiO, CuO and ZnO) and preparation soft magnetic material.
But, recently, along with the volume of transmitted data etc. of smart phone, mobile information technoloy equipment etc. has increased significantly, for the high speed processing of data, the switching frequency of CPU (CPU) increases, and causes due to the high-resolution of smart mobile phone screen and the increase of area etc. increasing fast in the amount of the middle power consumptions such as mobile device.Because the amount of power consumption in a mobile device as above increases, so multiple passive components of the such as power inductor used in the design of the such as drive circuit of CPU, display unit and power management module etc. etc. need to have high power consumption efficiency characteristic.
According to the demand of the efficiency for improving power inductor etc. as above, produce the product of following power inductor element: by replacing soft magnetic ferrite material with fine metal powder, thus can be used in the high frequency band of 1MHz or higher, and by reducing eddy current loss etc. significantly, thus energy consumption efficiency and the DC bias characteristics of raising can be had.
According to correlation technique, as the inductor utilizing metal dust, film inductor and winding inductor are employed.
Film inductor manufactures by the following method: on the plate of such as printed circuit board (PCB) (PCB) etc., form copper cash part by coating method; By compressing for the metal dust epoxy composite material that obtained by mixed metal powder and epoxy resin with around copper cash part; And the curing process of epoxy resin is performed by heat treatment.
Winding inductor can pass through following manufacture technics: coiled wires; The composite material utilizing wherein metal and epoxy resin to be mixed with each other carrys out the copper cash around winding; By around coiled wires under high pressure press shaping to realize chip form in mould; Then epoxy resin cure is made by heat treatment.
Compared with ferrite multilayered inductor, by the inductor of two kinds of method manufactures as above, there is direct current (DC) bias characteristic excellent significantly, and the result obtained as the character by assessment power management integrated circuits (PMIC) module group etc., efficiency improves the amount of some percentage or more.
As mentioned above, except improving except the DC bias characteristic of inductor and the advantage of inductor efficiency characteristic due to applied metal powder, in order to obtain the possibility of production in enormous quantities simultaneously, have studied metal magnetic multi-layer inductor.Metal magnetic multi-layer inductor can manufacture by the following method: replace oxide ferrite sheet by the homogeneous mixture forming metal dust and polymer with sheet form; And the series of process such as such as piercing process, inner conductor typography, stacking technique and sintering process are performed to metal magnetic sheet.
In this metal magnetic multi-layer inductor, the DC bias characteristic similar to film inductor or the inductor that reels can be realized, but need raising affect quality factor (Q) value of the efficiency characteristic of inductor and reduce D.C. resistance Rdc.
Efficiency characteristic is mainly subject to the impact of the core loss of magnetic material in low current region and the main impact by the resistance of Inside coil in high current zone.Specifically, in order to improve the inductor efficiency in the low current directly related with the service time of standby power, the metallicl magnetic material with low core loss and high magnetic permeability should be used.
[correlation technique document]
Japanese Patent Publication announces No.2007-027354
Summary of the invention
Embodiments more of the present disclosure can provide a kind of monolithic electronic component and manufacture the method for this monolithic electronic component, and described monolithic electronic component has excellent direct current (DC) bias characteristic and reduced D.C. resistance Rdc by the core loss characteristic that improves magnetic material and can be had the efficiency of raising.
According to embodiments more of the present disclosure, a kind of monolithic electronic component can comprise: multiple metal magnetic layer; Internal conductor layer, comprises and is formed in negative printing on metal magnetic layer and Inside coil pattern part; And upper caldding layer and lower caldding layer, be formed on the upper and lower of the live part comprising multiple metal magnetic layer and internal conductor layer, wherein, upper caldding layer and lower caldding layer comprise the metallic magnetic grain of the particle diameter with 8 μm to 25 μm, negative printing comprises the metallic magnetic grain of the particle diameter with 5 μm to 15 μm, and the metal magnetic layer of live part comprises the metallic magnetic grain of the particle diameter with 1 μm to 10 μm.
Metallic magnetic grain can be formed as having metal oxide film in its surface, and metal oxide film can be incorporated into the metal oxide film of the metallic magnetic grain be adjacent.
Metallic magnetic grain can be formed as separated from one another.
The metal oxide film be formed on the surface of the metallic magnetic grain be included in upper caldding layer and lower caldding layer can have the thickness of 200nm to 300nm.
The metal oxide film be formed on the surface of the metallic magnetic grain be included in the metal magnetic layer of negative printing and live part can have the thickness of 50nm to 200nm.
Metallic magnetic grain can utilize and comprise the one or more of alloy selected from the group be made up of Fe, Si, Cr, Al and Ni and formed.
The metal magnetic layer of upper caldding layer and lower caldding layer, negative printing and live part can comprise the metallic magnetic grain being formed as having metal oxide film in its surface, and the space between metallic magnetic grain can be filled with fluoropolymer resin.
Fluoropolymer resin can account for 10% to 30% of the area of section of the metal magnetic layer of upper caldding layer and lower caldding layer, negative printing and live part.
Inside coil pattern part and the metal magnetic layer be stacked on a surface of Inside coil pattern part can be separated from one another to form non-contact part.
According to embodiments more of the present disclosure, a kind of monolithic electronic component can comprise: multiple metal magnetic layer; Internal conductor layer, comprises and is formed in Inside coil pattern part on metal magnetic layer and negative printing; And upper caldding layer and lower caldding layer, be formed on the upper and lower of the live part comprising multiple metal magnetic layer and internal conductor layer, wherein, the metal magnetic layer of upper caldding layer and lower caldding layer, negative printing and live part comprises the metallic magnetic grain being formed as having metal oxide film in its surface, and the maximum particle diameter of the metallic magnetic grain comprised increases with the order of the metal magnetic layer of live part, negative printing and upper caldding layer and lower caldding layer.
The maximum particle diameter being included in the metallic magnetic grain in the metal magnetic layer of live part can be 10 μm, the maximum particle diameter being included in the metallic magnetic grain in negative printing can be 15 μm, and the maximum particle diameter being included in the metallic magnetic grain in upper caldding layer and lower caldding layer can be 25 μm.
The metal oxide film be formed on the surface of the metallic magnetic grain be included in upper caldding layer and lower caldding layer can have the thickness of 200nm to 300nm.
The metal oxide film be formed on the surface of the metallic magnetic grain be included in the metal magnetic layer of negative printing and live part can have the thickness of 50nm to 200nm.
The metal magnetic layer of upper caldding layer and lower caldding layer, negative printing and live part can comprise the fluoropolymer resin in the space of filling between metallic magnetic grain.
Inside coil pattern part and the metal magnetic layer be stacked on a surface of Inside coil pattern part can be separated from one another to form non-contact part.
According to embodiments more of the present disclosure, a kind of method manufacturing monolithic electronic component can comprise: prepare multiple metal magnetic sheet; Metal magnetic sheet is formed Inside coil pattern part; Utilize magnetic to stick with paste and form negative printing around Inside coil pattern part; The stacking multiple metal magnetic sheets it being formed with Inside coil pattern part and negative printing, to form live part; And further stacking multiple metal magnetic sheet comprises the multilayer main body of upper caldding layer and the lower caldding layer be formed in wherein with formation on the upper and lower of live part, wherein, the metal magnetic sheet forming upper caldding layer and lower caldding layer comprises the D with 9 μm to 11 μm
50metallic magnetic grain, formed negative printing magnetic stick with paste comprise the D with 7 μm to 8 μm
50metallic magnetic grain, form the metal magnetic sheet of live part and comprise the D with 3 μm to 5 μm
50metallic magnetic grain.
Described method can also comprise: form the polymer for the formation of gap in the space between Inside coil pattern part and the metal magnetic sheet being stacked on a surface of Inside coil pattern part, and for the formation of gap polymer can during sintering process pyrolysis to form non-contact part between Inside coil pattern part and metal magnetic layer.
Described method can also comprise: after sintered multilayer main body, the space between the metallic magnetic grain of filling the metal magnetic layer of upper caldding layer and lower caldding layer, negative printing and live part with fluoropolymer resin.
Accompanying drawing explanation
By the detailed description of carrying out below in conjunction with accompanying drawing, above-mentioned and other side, other advantage of characteristic sum of the present disclosure will more clearly be understood, in the accompanying drawings:
Fig. 1 is the perspective view of the monolithic electronic component according to exemplary embodiment of the present disclosure;
Fig. 2 is the cutaway view intercepted along the I-I' line of Fig. 1;
Fig. 3 is the signal enlarged drawing of the part A of Fig. 2;
Fig. 4 is the signal enlarged drawing of the part B of Fig. 2;
Fig. 5 is the signal enlarged drawing of the C part of Fig. 2;
Fig. 6 is the cutaway view of the monolithic electronic component according to another exemplary embodiment of the present disclosure;
Fig. 7 be according to exemplary embodiment of the present disclosure when formed non-contact part for comparing the curve chart of D.C. resistance;
Fig. 8 A to Fig. 8 E is the view of the method for the manufacture monolithic electronic component schematically described according to exemplary embodiment of the present disclosure; And
Fig. 9 is the view of the method for the formation non-contact part schematically shown according to exemplary embodiment of the present disclosure.
Embodiment
The embodiment of the present invention's design is described in detail now with reference to accompanying drawing.
But the disclosure can illustrate in many different forms, and should not be construed as limited to the specific embodiment proposed at this.But, provide these embodiments to make the disclosure to be thoroughly and complete, and the scope of the present disclosure will be conveyed to those skilled in the art fully.
In the accompanying drawings, for the sake of clarity, the shape and size of element can be exaggerated, and identical Reference numeral will be used to indicate same or analogous element all the time.
monolithic electronic component
Hereinafter, the monolithic electronic component according to exemplary embodiment of the present disclosure will be described.In detail, multi-layer inductor will be described, but the disclosure is not limited thereto.
Fig. 1 is the perspective view of the monolithic electronic component according to exemplary embodiment of the present disclosure, and Fig. 2 is the cutaway view intercepted along the I-I' line of Fig. 1.
See figures.1.and.2, according to the internal conductor layer 20 that the monolithic electronic component 100 of exemplary embodiment of the present disclosure can comprise multiple metal magnetic layer 10 and be formed on metal magnetic layer 10.
Metal magnetic layer 10 can have the thickness of 10 μm to 20 μm.When the thickness of metal magnetic layer 10 is less than 10 μm, the generation of short circuit can increase, and when thickness is greater than 20 μm, inductance may reduce due to the increase of magnetic flux path.
The multiple metal magnetic layers 10 it being formed with internal conductor layer 20 can be stacking to be formed with the live part 50 helping form inductance, and upper caldding layer 31 and lower caldding layer 32 can be formed on the upper and lower of live part 50.
Upper caldding layer 31 and lower caldding layer 32 can be formed by stacking multiple metal magnetic sheet.The multiple metal magnetic sheets forming upper caldding layer 31 and lower caldding layer 32 can be in sintering state, and the adjacent metal magnetic layer border making to be not easy when not having scanning electron microscopy (SEM) to differentiate between them integrated with one another.
The metal magnetic main body 110 comprising live part 50 and upper caldding layer 31 and lower caldding layer 32 can be formed as having the end surfaces along length (L) direction, the side surface along width (W) direction and along the upper surface in thickness (T) direction and the hexahedron of lower surface.
The external electrode 130 being electrically connected to Inside coil can be formed on two end surfaces of metal magnetic main body 110.
The internal conductor layer 20 be formed on metal magnetic layer 10 can comprise Inside coil pattern part 21 and negative printing 22.
When the thickness of increase Inside coil pattern part 21 is to reduce D.C. resistance Rdc, form stacking station exponent part due to the thickness of the increase of Inside coil pattern part 21.This step may cause depression and the distortion of Inside coil pattern part 21 during the technique of compacting multilayer main body, and weakening or crackle etc. and cause the problem of such as interlaminar separation due to interlaminar bonding.
Therefore, in the region for the formation of internal conductor layer 20, negative printing 22 can be formed in the region except the region except wherein forming Inside coil pattern part 21.Will be formed wherein in the region of internal conductor layer 20, what negative printing 22 was formed in this region is not wherein formed in the region of Inside coil pattern part 21, thus the generation of the problem of such as stacking station exponent part can be prevented, and the Inside coil pattern part 21 with the thickness of relative high levels and the aspect ratio of width can be formed, thus reduce D.C. resistance Rdc.
Inside coil pattern part 21 can be formed by printing the electroconductive paste comprising conducting metal, and conducting metal is not specifically limited, as long as it has excellent conductivity.Such as, as conducting metal, can be used alone silver (Ag), palladium (Pd), aluminium (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu) or platinum (Pt) etc., or their mixture can be used.
Metal magnetic layer 10, negative printing 22 and upper caldding layer 31 and lower caldding layer 32 can comprise metallic magnetic grain 41,42 and 43.
Metallic magnetic grain 41,42 and 43 can comprise the metallic magnetic grain of non-retentive alloy, described non-retentive alloy is such as comprise the one or more of alloy selected from the group be made up of Fe, Si, Cr, Al and Ni, more particularly, for Fe-Si-Cr base alloy, but the disclosure is not limited thereto.
Fig. 3 is the enlarged drawing of the part A being shown schematically in the metal magnetic layer 10 shown in Fig. 2, and Fig. 4 is the enlarged drawing of the part B of the negative printing 22 schematically showing Fig. 2, and Fig. 5 is the enlarged drawing of the C part of the lower caldding layer 32 schematically showing Fig. 2.
With reference to Fig. 3 to Fig. 5, metal oxide film 45 can be formed in and be included in metal magnetic layer 10, negative printing 22 with on the surface of the metallic magnetic grain 41 to 43 in upper caldding layer 31 and lower caldding layer 32, and can obtain insulating property (properties) by metal oxide film 45 between metallic particles and between metallic particles and internal electrode.
Metal oxide film 45 can be formed by making at least one composition of metallic magnetic grain 41 to 43 be oxidized, and metal oxide film 45 can comprise such as Cr
2o
3.
When corresponding metallic magnetic grain 41 to 43, its metal oxide film 45 can be incorporated into the metal oxide film 45 of the metallic magnetic grain be adjacent.Mechanical strength and insulating property (properties) can be improved by the combination of metal oxide film 45.
Meanwhile, metallic magnetic grain 41 to 43 do not occur between which combine when can be separated from one another.When metallic magnetic grain 41 to 43 is bonded to each other, eddy current loss can be increased, thus quality factor (Q) can be reduced, and the increase of interchange (AC) level caused according to the increase due to the contact surface between metallic particles, Q value can be reduced further.Therefore, in an exemplary embodiment of the disclosure, due to when corresponding metallic magnetic grain 41 to 43, its metal oxide film 45 only can be attached to the metal oxide film 45 of the metallic magnetic grain be adjacent, so can reduce eddy current loss.In addition, because metallic magnetic grain 41 to 43 does not directly contact each other, so can reduce the reduction of the Q value caused because AC increases, thus when the disclosure is applied to power inductor, the disclosure can have advantage in high power efficiency.
The maximum particle diameter being included in the metallic magnetic grain in metal magnetic layer 10, negative printing 22 and upper caldding layer 31 and lower caldding layer 32 can increase with the order of metal magnetic layer 10, negative printing 22 and upper caldding layer 31 and lower caldding layer 32.
Metal magnetic layer 10 can comprise the metallic magnetic grain 41 of the particle diameter with 1 μm to 10 μm, and the maximum particle diameter of metallic magnetic grain 41 can be 10 μm.
Negative printing 22 can comprise the metallic magnetic grain 42 of the particle diameter with 5 μm to 15 μm, and its maximum particle diameter can be 15 μm.
Upper caldding layer 31 and lower caldding layer 32 can comprise the metallic magnetic grain 43 of the particle diameter with 8 μm to 25 μm, and its maximum particle diameter can be 25 μm.
When utilization has the metallic magnetic grain of relatively little particle diameter, magnetic permeability can reduce due to the reduction of particle diameter, and when utilization has the metallic magnetic grain of relatively large particle diameter, magnetic permeability can increase, but may increase core loss.
Therefore, according to exemplary embodiment of the present disclosure, by forming the structure that wherein comprises the metallic magnetic grain with different-grain diameter thus making maximum particle diameter increase with the order of metal magnetic layer 10, negative printing 22 and upper caldding layer 31 and lower caldding layer 32, thus can core loss be reduced and high magnetic permeability can be realized.
When the maximum particle diameter of the metallic magnetic grain 41 being included in metal magnetic layer 10 is greater than 10 μm, dispersed possibility deterioration, the surface roughness of metal magnetic layer 10 may increase, and the intensity of metal magnetic layer 10 may reduce due to the increase of the amount in the hole in metal magnetic layer 10.Therefore, may be difficult to be formed the metal magnetic layer 10 with 20 μm or less thickness.
When the maximum particle diameter being included in the metallic magnetic grain 42 in negative printing 22 is greater than 15 μm, the core loss at high-frequency place may excessively increase.
When the maximum particle diameter being included in the metallic magnetic grain 43 in upper caldding layer 31 and lower caldding layer 32 is equal to or less than the maximum particle diameter of the metallic magnetic grain be included in metal magnetic layer 10 or negative printing 22, may be difficult to realize high magnetic permeability due to relatively little particle diameter, and when the maximum particle diameter being included in the metallic magnetic grain 43 in upper caldding layer 31 and lower caldding layer 32 is wherein greater than 25 μm, the core loss at high-frequency place may excessively increase.
Simultaneously, the metal oxide film 45 be formed on the surface of the metallic magnetic grain 43 be included in upper caldding layer 31 and lower caldding layer 32 can have the thickness of 200nm to 300nm, and the metal oxide film 45 be formed on the surface of the metallic magnetic grain 41 and 42 be included in negative printing 22 and metal magnetic layer 10 can have the thickness of 50nm to 200nm.
Upper caldding layer 31 and lower caldding layer 32, negative printing 22 and metal magnetic layer 10 comprise the metallic magnetic grain with different-grain diameter, and the metal oxide film 45 be formed on the surface of metallic magnetic grain can have different thickness, thus can ratio resistance be reduced, and can prevent the magnetic permeability caused due to oxidation film from reducing.
The thickness of the metal oxide film 45 in upper caldding layer 31 and lower caldding layer 32 is less than 200nm, the ratio resistance of magnetic coupling part can reduce, the thickness of the metal oxide film 45 in upper caldding layer 31 and lower caldding layer 32 is greater than 300nm, the magnetic properties of metallic magnetic grain may be deteriorated significantly due to oxidation film, thus may reduce magnetic permeability.
The thickness of the metal oxide film 45 in negative printing 22 and metal magnetic layer 10 is less than 50nm, the ratio resistance of magnetic coupling part may reduce, the thickness of the metal oxide film 45 in negative printing 22 and metal magnetic layer 10 is greater than 200nm, the magnetic properties of metallic magnetic grain may be deteriorated significantly due to oxidation film, thus may reduce magnetic permeability.
Upper caldding layer 31 and lower caldding layer 32, negative printing 22 and metal magnetic layer 10 can have wherein fluoropolymer resin 48 and be filled in the structure in the space between metallic magnetic grain.
Fluoropolymer resin 48 can fill the space between metallic magnetic grain as follows: be immersed in fluoropolymer resin by the metal magnetic main body 110 of sintering, and decompression or fluoropolymer resin is applied to the surface of metal magnetic main body 110 of sintering, then makes fluoropolymer resin be absorbed in metal magnetic main body 110.
Fluoropolymer resin 48 fills the space between metallic magnetic grain, thus can improve the intensity of metal magnetic main body and can reduce moisture absorption.
Fluoropolymer resin 48 can be from by silicon resinoid, epoxylite, select the group that forms of phenolic resin, silicates resin, polyurethane based resin, acid imide resin, acrylic resin, polyester resin and polythylene resin one or more of.
Fluoropolymer resin 48 can account for 10% to 30% of the area of section of upper caldding layer 31 and lower caldding layer 32, negative printing 22 and metal magnetic layer 10.
When the area of fluoropolymer resin 48 is less than 10% wherein, intensity can reduce, and when high humility, moisture can be absorbed in magnetic body, and when the area of fluoropolymer resin 48 is greater than 30% wherein, magnetic permeability can reduce.
Fig. 6 is the cutaway view of the monolithic electronic component according to another exemplary embodiment of the present disclosure.
With reference to Fig. 6, Inside coil pattern part 21 and the metal magnetic layer 10 be stacked on a surface of Inside coil pattern part 21 can be formed as separated from one another, thus can form non-contact part 25.
The conducting metal forming Inside coil pattern part 21 may shrink during the sintering process of metal magnetic main body 110, but the metallic magnetic grain forming metal magnetic layer 10 does not shrink, thus can increase stress.
Therefore, according to exemplary embodiment of the present disclosure, non-contact part 25 is formed in Inside coil pattern part 21 and is stacked between the metal magnetic layer 10 on a surface of Inside coil pattern part 21, thus the stress caused due to the shrinkage difference between Inside coil pattern part 21 and metal magnetic layer 10 can be made to relax, and can sintering property be improved, thus reduce D.C. resistance Rdc (see Fig. 7).
A surface of Inside coil pattern part 21 can contacting metal magnetosphere 10, another surface of Inside coil pattern part 21 can due to non-contact part 25 not contacting metal magnetosphere 10.
manufacture the method for monolithic electronic component
Fig. 8 A to Fig. 8 E is the view of the method for the manufacture monolithic electronic component schematically shown according to exemplary embodiment of the present disclosure.
With reference to Fig. 8 A, first, multiple metal magnetic sheet 10' can be prepared.
Metal magnetic sheet 10' can be manufactured to sheet by the following method: mix the organic material of metallic magnetic grain and such as binding agent and solvent etc. to prepare slurry; The slurry of preparation is applied to carrier film and utilizes doctor blade method with the thickness making it have some μm; Then the slurry drying of application is made.
Metal magnetic sheet 10' can have the thickness of 10 μm to 20 μm.When the thickness of metal magnetic sheet 10' is less than 10 μm, the generation of short circuit may increase, and when the thickness of metal magnetic sheet 10' is greater than 20 μm, inductance may reduce due to the increase of magnetic flux path.
Metallic magnetic grain can utilize non-retentive alloy to be formed, and described non-retentive alloy such as comprises the one or more of alloy selected from the group be made up of Fe, Si, Cr, Al and Ni, in more detail, is Fe-Si-Cr base alloy, but is not limited thereto.
Metal magnetic sheet 10' can comprise D
50it is the metallic magnetic grain 41 of 3 μm to 5 μm.
D
50the particle diameter when the volume of accumulative perception based on 50% by utilizing the domain size distribution method of measurement of laser diffraction and scattering to measure can be represented.
Be included in the D of the metallic magnetic grain 41 in metal magnetic sheet 10'
50when being greater than 5 μm, dispersed possibility deterioration, the surface roughness of metal magnetic sheet 10' may increase, and metal magnetic sheet intensity may reduce due to the increase in the hole in metal magnetic sheet 10'.Therefore, may be difficult to be formed the metal magnetic sheet 10' with 20 μm or less thickness.
With reference to Fig. 8 B, Inside coil pattern part 21 can be formed on metal magnetic sheet 10'.
Inside coil pattern part 21 can be formed by utilizing printing process etc. to apply the electroconductive paste comprising conducting metal.Conducting metal is not particularly limited, as long as it has excellent conductivity.Such as, as conducting metal, can be used alone silver (Ag), palladium (Pd), aluminium (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu) or platinum (Pt) etc., or their mixture can be used.As the printing process of electroconductive paste, method for printing screen or gravure process etc. can be used, but the disclosure is not limited thereto.
With reference to Fig. 8 C, magnetic can be utilized to stick with paste and to form negative printing 22 around Inside coil pattern part 21.
Negative printing 22 is formed around Inside coil pattern part 21, thus can prevent the generation of the stacking station exponent part caused by the thickness of Inside coil pattern part 21.
Magnetic sticks with paste the organic material that can comprise metallic magnetic grain 42 and such as binding agent etc.
Metallic magnetic grain 42 can comprise the metallic magnetic grain of non-retentive alloy, described non-retentive alloy such as comprises the one or more of alloy selected from the group be made up of Fe, Si, Cr, Al and Ni, more particularly, be Fe-Si-Cr base alloy, but be not limited thereto.
The magnetic paste forming negative printing 22 can comprise the D with 7 μm to 8 μm
50metallic magnetic grain 42.
Be included in the D of the metallic magnetic grain 42 in magnetic paste
50when being greater than 8 μm, the core loss at high-frequency place can excessively increase.
Metal magnetic sheet 10' can be applied to by utilizing silk screen print method etc. magnetic to be stuck with paste, and to the magnetic of application stick with paste carry out heating also drying to form negative printing 22.
With reference to Fig. 8 D, live part 50 can be formed by the stacking multiple metal magnetic sheet 10' it being formed with Inside coil pattern part 21 and negative printing 22.
Meanwhile, manufacture the method for monolithic electronic component and can also comprise the polymer 24 formed for forming gap between Inside coil pattern part 21 and the metal magnetic sheet 10' being stacked on a surface of Inside coil pattern part 21.
Polymer 24 for the formation of gap can pyrolysis during the sintering process of multilayer main body subsequently, to form non-contact part 25 between Inside coil pattern part 21 and metal magnetic layer 10.
With reference to Fig. 9, the polymer 24 (such as, polymeric beads) for the formation of gap can be formed on the Inside coil pattern part 21 of printing, and during sintering process, make its pyrolysis, thus form non-contact part 25.
Non-contact part 25 is formed in Inside coil pattern part 21 and is stacked between the metal magnetic layer 10 on a surface of Inside coil pattern part 21, thus the stress caused due to the shrinkage difference between Inside coil pattern part 21 and metal magnetic layer 10 can be made to relax, and can sintering property be improved, thus reduce D.C. resistance Rdc.
Polymer for the formation of gap is not specifically limited, if this polymer can under the sintering temperature of multilayer main body pyrolysis thus formed gap.
A surface of Inside coil pattern part 21 can contacting metal magnetosphere 10, and another surface of Inside coil pattern part 21 can due to non-contact part 25 not contacting metal magnetosphere 10.
With reference to Fig. 8 E, can form by stacking multiple metal magnetic sheet 10' further on the upper and lower of live part 50 the multilayer main body being wherein formed with upper caldding layer 31 and lower caldding layer 32.
The metal magnetic sheet 10' forming upper caldding layer 31 and lower caldding layer 32 can comprise the D with 9 μm to 11 μm
50metallic magnetic grain 43.
Be included in the D of the metallic magnetic grain 43 in the metal magnetic sheet 10' forming upper caldding layer 31 and lower caldding layer 32
50when being less than 9 μm, due to relatively little particle diameter, may be difficult to realize relatively high magnetic permeability, be included in the D of the metallic magnetic grain in the metal magnetic sheet 10 ' forming upper caldding layer 31 and lower caldding layer 32
50when being greater than 11 μm, the core loss at high-frequency place may excessively increase.
Afterwards, can at the temperature of 700 DEG C to 800 DEG C sintered multilayer main body.
Metal oxide film 45 can be formed on the surface being included in the metallic magnetic grain 41 to 43 in the metal magnetic sheet 10' of live part 50, negative printing 22 and upper caldding layer 31 and lower caldding layer 32 during sintering process.Insulating property (properties) can be guaranteed between metallic particles and between metallic particles and internal electrode by metal oxide film 45.
Metal oxide film 45 can be formed by making at least one composition of metallic magnetic grain 41 to 43 be oxidized and can comprise such as Cr
2o
3.
When the metallic magnetic grain 41 to 43 of correspondence, its metal oxide film 45 can be incorporated into the metal oxide film 45 of the metallic magnetic grain be adjacent.In other words, when the metallic magnetic grain 41 to 43 of correspondence, the metal oxide film 45 of the particle be adjacent can with its combination.Mechanical strength and insulating property (properties) can be improved by the combination of metal oxide film 45.
Meanwhile, it is separated from one another when metallic magnetic grain 41 to 43 can not occur to combine between which.When metallic magnetic grain 41 to 43 is bonded to each other, eddy current loss can be increased, thus quality factor (Q) can be reduced, and according to the increase of alternating current (AC) level caused by the contact surface increase between metallic particles, Q value can be reduced further.Therefore, in an exemplary embodiment of the disclosure, due to when the metallic magnetic grain 41 to 43 of correspondence, its metal oxide film 45 can be incorporated into the metal oxide film 45 of the metallic magnetic grain be adjacent, so can reduce eddy current loss.In addition, because metallic magnetic grain 41 to 43 does not directly contact each other, so can reduce the reduction of the Q value caused because AC increases, thus when the disclosure is applied to power inductor, the disclosure can have advantage in high power efficiency.
The metal oxide film 45 be formed on the surface of the metallic magnetic grain 43 be included in upper caldding layer 31 and lower caldding layer 32 can have the thickness of 200nm to 30nm, and the metal oxide film 45 be formed on the surface of the metallic magnetic grain 41 and 42 be included in negative printing 22 and metal magnetic layer 10 can have the thickness of 50nm to 200nm.
Upper caldding layer 31 and lower caldding layer 32, negative printing 22 and metal magnetic layer 10 comprise the metallic magnetic grain with different-grain diameter, and the metal oxide film 45 be formed on the surface of metallic magnetic grain is formed as having different thickness, thus can ratio resistance be reduced, and can prevent the magnetic permeability caused due to oxidation film from reducing.
The thickness of the metal oxide film 45 in upper caldding layer 31 and lower caldding layer 32 is less than 200nm, the resistivity of magnetic coupling part may reduce, when this thickness is greater than 300nm, the magnetic properties of metallic magnetic grain may be deteriorated significantly due to oxidation film, thus may reduce magnetic permeability.
The thickness of the metal oxide film 45 in negative printing 22 and metal magnetic layer 10 is less than 50nm, the resistivity of magnetic coupling part may reduce, when this thickness is greater than 200nm, the magnetic properties of metallic magnetic grain may be deteriorated significantly due to oxidation film, thus may reduce magnetic permeability.
Manufacture the method for monolithic electronic component can also comprise: after sintered multilayer main body, fill upper caldding layer 31 and lower caldding layer 32, space between negative printing 22 and the metal magnetic layer 10 of live part 50 with fluoropolymer resin.
Fluoropolymer resin 48 can fill the space between metallic magnetic grain as follows: be immersed in fluoropolymer resin by the metal magnetic main body 110 of sintering; And decompression or fluoropolymer resin is applied to the surface of metal magnetic main body 110 of sintering, then makes fluoropolymer resin be absorbed in metal magnetic main body 110.
Fluoropolymer resin 48 fills the space between metallic magnetic grain, thus can improve intensity and can reduce moisture absorption.
Fluoropolymer resin 48 can be from by silicon resinoid, epoxylite, select the group that forms of phenolic resin, silicates resin, polyurethane based resin, acid imide resin, acrylic resin, polyester resin and polythylene resin one or more of.
Fluoropolymer resin 48 can account for 10% to 30% of the area of section of upper caldding layer 31 and lower caldding layer 32, negative printing 22 and metal magnetic layer 10.
When the area of fluoropolymer resin 48 is less than 10%, intensity may reduce, and when high humility, moisture can be absorbed in magnetic body, and when the area of fluoropolymer resin 48 is greater than 30%, magnetic permeability may reduce.
Then, can by electroconductive paste being applied to two end surfaces of metal magnetic main body 110, then sintering forms external electrode.As the material for external electrode 130, can be used alone copper (Cu), silver (Ag) or nickel (Ni) etc., or their mixture can be used, and tin (Sn) or nickel (Ni) coating can be formed on external electrode.
According to exemplary embodiment of the present disclosure, monolithic electronic component can have excellent direct current (DC) bias characteristic by applied metal magnetic material, relatively low D.C. resistance Rdc is realized by the area of section increasing Inside coil, and by guaranteeing that high magnetic permeability raises the efficiency characteristic, reduce the core loss of metallicl magnetic material simultaneously.
Although illustrate and describe exemplary embodiment above, significantly, when not departing from the spirit and scope of the present disclosure be defined by the following claims, will can modify and change to one skilled in the art.
Claims (18)
1. a monolithic electronic component, described monolithic electronic component comprises:
Live part, comprises multiple metal magnetic layer and multiple internal conductor layer, and each internal conductor layer comprises Inside coil pattern part and negative printing; And
Upper caldding layer and lower caldding layer, be arranged on the upper and lower of live part,
Wherein, upper caldding layer and lower caldding layer comprise the metallic magnetic grain of the particle diameter with 8 μm to 25 μm, negative printing comprises the metallic magnetic grain of the particle diameter with 5 μm to 15 μm, and the metal magnetic layer of live part comprises the metallic magnetic grain of the particle diameter with 1 μm to 10 μm.
2. monolithic electronic component according to claim 1, wherein, metallic magnetic grain is formed to have metal oxide film in its surface, and metal oxide film is attached to the metal oxide film of the metallic magnetic grain be adjacent.
3. monolithic electronic component according to claim 1, wherein, metallic magnetic grain is formed separated from one another.
4. monolithic electronic component according to claim 1, wherein, the metal oxide film be formed on the surface of the metallic magnetic grain be included in upper caldding layer and lower caldding layer has the thickness of 200nm to 300nm.
5. monolithic electronic component according to claim 1, wherein, the metal oxide film be formed on the surface of the metallic magnetic grain be included in the metal magnetic layer of negative printing and live part has the thickness of 50nm to 200nm.
6. monolithic electronic component according to claim 1, wherein, metallic magnetic grain utilization comprises the one or more of alloy selected from the group be made up of Fe, Si, Cr, Al and Ni and is formed.
7. monolithic electronic component according to claim 1, wherein, the metal magnetic layer of upper caldding layer and lower caldding layer, negative printing and live part comprises the metallic magnetic grain being formed to have metal oxide film in its surface, and the space between metallic magnetic grain is filled with fluoropolymer resin.
8. monolithic electronic component according to claim 7, wherein, fluoropolymer resin accounts for 10% to 30% of the area of section of the metal magnetic layer of upper caldding layer and lower caldding layer, negative printing and live part.
9. monolithic electronic component according to claim 1, wherein, Inside coil pattern part is separated from one another to form non-contact part with the metal magnetic layer be stacked on a surface of Inside coil pattern part.
10. a monolithic electronic component, described monolithic electronic component comprises:
Live part, comprises multiple metal magnetic layer and multiple internal conductor layer, and each internal conductor layer comprises Inside coil pattern part and negative printing; And
Upper caldding layer and lower caldding layer, be arranged on the upper and lower of live part,
Wherein, the metal magnetic layer of upper caldding layer and lower caldding layer, negative printing and live part comprises the metallic magnetic grain being formed to have metal oxide film in its surface,
The maximum particle diameter of the metallic magnetic grain comprised increases with the order of the metal magnetic layer of live part, negative printing and upper caldding layer and lower caldding layer.
11. monolithic electronic components according to claim 10, wherein, the maximum particle diameter being included in the metallic magnetic grain in the metal magnetic layer of live part is 10 μm, the maximum particle diameter being included in the metallic magnetic grain in negative printing is 15 μm, and the maximum particle diameter being included in the metallic magnetic grain in upper caldding layer and lower caldding layer is 25 μm.
12. monolithic electronic components according to claim 10, wherein, the metal oxide film be formed on the surface of the metallic magnetic grain be included in upper caldding layer and lower caldding layer has the thickness of 200nm to 300nm.
13. monolithic electronic components according to claim 10, wherein, the metal oxide film be formed on the surface of the metallic magnetic grain be included in the metal magnetic layer of negative printing and live part has the thickness of 50nm to 200nm.
14. monolithic electronic components according to claim 10, wherein, the metal magnetic layer of upper caldding layer and lower caldding layer, negative printing and live part comprises the fluoropolymer resin in the space of filling between metallic magnetic grain.
15. monolithic electronic components according to claim 10, wherein, Inside coil pattern part is separated from one another to form non-contact part with the metal magnetic layer be stacked on a surface of Inside coil pattern part.
16. 1 kinds of methods manufacturing monolithic electronic component, described method comprises:
Prepare multiple metal magnetic sheet;
Metal magnetic sheet is formed Inside coil pattern part;
Utilize magnetic to stick with paste and form negative printing around Inside coil pattern part;
The stacking multiple metal magnetic sheets it being formed with Inside coil pattern part and negative printing, to form live part; And
Further stacking multiple metal magnetic sheet on the upper and lower of live part, to form the multilayer main body of upper caldding layer and the lower caldding layer comprising and being formed in wherein,
Wherein, the metal magnetic sheet forming upper caldding layer and lower caldding layer comprises the D with 9 μm to 11 μm
50metallic magnetic grain, formed negative printing magnetic stick with paste comprise the D with 7 μm to 8 μm
50metallic magnetic grain, form the metal magnetic sheet of live part and comprise the D with 3 μm to 5 μm
50metallic magnetic grain.
17. methods according to claim 16, described method also comprises:
The polymer for the formation of gap is formed in space between Inside coil pattern part and the metal magnetic sheet being stacked on a surface of Inside coil pattern part,
Wherein, for the formation of polymer pyrolysis during sintering process in gap, to form non-contact part between Inside coil pattern part and metal magnetic layer.
18. methods according to claim 16, described method also comprises:
After sintered multilayer main body, the space between the metallic magnetic grain of filling the metal magnetic layer of upper caldding layer and lower caldding layer, negative printing and live part with fluoropolymer resin.
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| KR1020140029181A KR101616610B1 (en) | 2014-03-12 | 2014-03-12 | Multilayered electronic component and manufacturing method thereof |
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| CN107017081A (en) * | 2015-11-17 | 2017-08-04 | 太阳诱电株式会社 | Laminated inductor |
| CN108364749A (en) * | 2017-01-27 | 2018-08-03 | 株式会社村田制作所 | Laminated electronic component |
| CN109313974A (en) * | 2016-08-09 | 2019-02-05 | 松下知识产权经营株式会社 | Common mode choke coil and its manufacturing method |
| CN109979700A (en) * | 2017-12-27 | 2019-07-05 | Tdk株式会社 | Superimposed line ring electronic component |
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| KR101642641B1 (en) * | 2015-01-27 | 2016-07-25 | 삼성전기주식회사 | Common Mode filter and Method of Fabricating the Same |
| JP7032039B2 (en) * | 2016-06-28 | 2022-03-08 | Tdk株式会社 | Multilayer coil parts |
| KR101963281B1 (en) | 2016-12-14 | 2019-03-28 | 삼성전기주식회사 | Inductor |
| KR20180105891A (en) | 2017-03-16 | 2018-10-01 | 삼성전기주식회사 | Coil Electronic Component and Manufacturing Method Thereof |
| JP7106271B2 (en) * | 2017-12-20 | 2022-07-26 | 太陽誘電株式会社 | Magnetically coupled coil parts |
| JP7074050B2 (en) | 2018-12-28 | 2022-05-24 | 株式会社村田製作所 | Coil parts |
| JP7251243B2 (en) * | 2019-03-22 | 2023-04-04 | Tdk株式会社 | Laminated coil parts |
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| JP2015177185A (en) | 2015-10-05 |
| JP6058584B2 (en) | 2017-01-11 |
| CN104916392B (en) | 2017-12-12 |
| KR20150106742A (en) | 2015-09-22 |
| KR101616610B1 (en) | 2016-04-28 |
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