CN104911441A - 一种低熔点金属及其制备方法和应用 - Google Patents
一种低熔点金属及其制备方法和应用 Download PDFInfo
- Publication number
- CN104911441A CN104911441A CN201510396268.6A CN201510396268A CN104911441A CN 104911441 A CN104911441 A CN 104911441A CN 201510396268 A CN201510396268 A CN 201510396268A CN 104911441 A CN104911441 A CN 104911441A
- Authority
- CN
- China
- Prior art keywords
- melting point
- low melting
- point metal
- metal
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002844 melting Methods 0.000 title claims abstract description 65
- 239000002184 metal Substances 0.000 title claims abstract description 65
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 65
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 230000008018 melting Effects 0.000 claims abstract description 57
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 18
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 15
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 12
- 239000000956 alloy Substances 0.000 claims abstract description 12
- 229910052738 indium Inorganic materials 0.000 claims abstract description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 11
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000011135 tin Substances 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 229910052709 silver Inorganic materials 0.000 claims abstract description 10
- 239000004332 silver Substances 0.000 claims abstract description 10
- 229910052718 tin Inorganic materials 0.000 claims abstract description 10
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052742 iron Inorganic materials 0.000 claims abstract description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000007858 starting material Substances 0.000 claims description 2
- -1 tin metals Chemical class 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 239000006071 cream Substances 0.000 description 6
- 238000010622 cold drawing Methods 0.000 description 4
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- WGCXSIWGFOQDEG-UHFFFAOYSA-N [Zn].[Sn].[In] Chemical compound [Zn].[Sn].[In] WGCXSIWGFOQDEG-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Powder Metallurgy (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510396268.6A CN104911441B (zh) | 2015-07-08 | 2015-07-08 | 低熔点金属及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510396268.6A CN104911441B (zh) | 2015-07-08 | 2015-07-08 | 低熔点金属及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104911441A true CN104911441A (zh) | 2015-09-16 |
CN104911441B CN104911441B (zh) | 2017-05-03 |
Family
ID=54080879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510396268.6A Expired - Fee Related CN104911441B (zh) | 2015-07-08 | 2015-07-08 | 低熔点金属及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104911441B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105838333A (zh) * | 2016-04-05 | 2016-08-10 | 中国科学院深圳先进技术研究院 | 一种相变合金热界面复合材料及其制备方法 |
CN106119653A (zh) * | 2016-06-29 | 2016-11-16 | 北京态金科技有限公司 | 一种相变金属合金、合金恒温被及合金的制备方法 |
CN107267832A (zh) * | 2017-06-13 | 2017-10-20 | 清华大学 | 一种温控不可逆相变多孔液态金属材料及其制备和应用 |
CN108511246A (zh) * | 2018-05-28 | 2018-09-07 | 北京梦之墨科技有限公司 | 一种采用丝网印刷方式制备的薄膜开关及制备装置和方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103725946A (zh) * | 2013-12-04 | 2014-04-16 | 曹帅 | 一种五相液态金属材料及其制备方法 |
CN104032199A (zh) * | 2014-06-17 | 2014-09-10 | 北京依米康科技发展有限公司 | 一种低熔点液态金属及其制备方法和应用 |
-
2015
- 2015-07-08 CN CN201510396268.6A patent/CN104911441B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103725946A (zh) * | 2013-12-04 | 2014-04-16 | 曹帅 | 一种五相液态金属材料及其制备方法 |
CN104032199A (zh) * | 2014-06-17 | 2014-09-10 | 北京依米康科技发展有限公司 | 一种低熔点液态金属及其制备方法和应用 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105838333A (zh) * | 2016-04-05 | 2016-08-10 | 中国科学院深圳先进技术研究院 | 一种相变合金热界面复合材料及其制备方法 |
CN106119653A (zh) * | 2016-06-29 | 2016-11-16 | 北京态金科技有限公司 | 一种相变金属合金、合金恒温被及合金的制备方法 |
CN106119653B (zh) * | 2016-06-29 | 2018-02-16 | 北京态金科技有限公司 | 一种相变金属合金、合金恒温被及合金的制备方法 |
CN107267832A (zh) * | 2017-06-13 | 2017-10-20 | 清华大学 | 一种温控不可逆相变多孔液态金属材料及其制备和应用 |
CN107267832B (zh) * | 2017-06-13 | 2019-03-22 | 清华大学 | 一种温控不可逆相变多孔液态金属材料及其制备和应用 |
CN108511246A (zh) * | 2018-05-28 | 2018-09-07 | 北京梦之墨科技有限公司 | 一种采用丝网印刷方式制备的薄膜开关及制备装置和方法 |
CN108511246B (zh) * | 2018-05-28 | 2024-05-03 | 北京梦之墨科技有限公司 | 一种采用丝网印刷方式制备的薄膜开关及制备装置和方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104911441B (zh) | 2017-05-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104032199B (zh) | 一种低熔点液态金属及其制备方法和应用 | |
CN106884107B (zh) | 一种具有反熔特性的液态金属热界面材料及其制备方法 | |
CN104911441A (zh) | 一种低熔点金属及其制备方法和应用 | |
CN103289650B (zh) | 一种低熔点金属导热膏 | |
CN106701031A (zh) | 一种由金属网格与低熔点合金构成的复合热界面材料 | |
CN104745911A (zh) | 一种高粘度低熔点金属导热片的制备方法及应用 | |
CN103396769B (zh) | 一种低熔点金属导热膏及其制备方法和应用 | |
CN104766921A (zh) | 热电模块以及使用其的热转换装置 | |
CN103740978A (zh) | 一种具有阻溢作用的多相液态金属热界面材料及其制备方法 | |
CN103642465A (zh) | 一种液态金属导热膏及其制备方法和应用 | |
CN203040093U (zh) | 用于大功率热源的散热装置 | |
CN105281198A (zh) | 一种半导体激光器的热管理装置 | |
CN107052308B (zh) | 一种泡沫铜复合的液态金属热界面材料 | |
CN104449588B (zh) | 一种低熔点金属吸热溶液 | |
CN204369797U (zh) | 一种金属垫片 | |
CN111913550A (zh) | 一种可插拔的散热系统 | |
CN105400497A (zh) | 一种全金属导热膏及其制备方法 | |
CN103509987B (zh) | 一种低熔点金属合金导热材料及其制备方法 | |
CN203798221U (zh) | 基于低温合金的储能复合式控温系统 | |
CN106702243A (zh) | 低熔点金属及其制备方法和应用 | |
CN203385237U (zh) | 一种基于热电温度补偿的低熔点金属相变散热装置 | |
CN103940268A (zh) | 基于低温合金的储能复合式控温系统 | |
CN212460507U (zh) | 一种可插拔的散热系统 | |
CN206686497U (zh) | 一种基于金属相变导热导电的散热装置 | |
CN104917025B (zh) | 一种电缆导电连接的方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 100040, room 368, Yuquan building, 3 Shijingshan Road, Beijing, Shijingshan District Applicant after: BEIJING LIQUIDKING TECHNOLOGY Co.,Ltd. Address before: 100040, room 368, Yuquan building, 3 Shijingshan Road, Beijing, Shijingshan District Applicant before: BEIJING EMIKON TECHNOLOGY DEVELOPMENT CO.,LTD. |
|
COR | Change of bibliographic data | ||
CB02 | Change of applicant information |
Address after: 100040, Shijingshan Road, Beijing, Yuquan building on the west side of the 9 floor, 3 Applicant after: BEIJING LIQUIDKING TECHNOLOGY Co.,Ltd. Address before: 100040, room 368, Yuquan building, 3 Shijingshan Road, Beijing, Shijingshan District Applicant before: BEIJING LIQUIDKING TECHNOLOGY Co.,Ltd. |
|
COR | Change of bibliographic data | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191112 Address after: Room 203, Yuantong entrepreneurship service center, urban rural integration demonstration zone, Sanmenxia City, Henan Province Patentee after: Henan State Grid Rapid Manufacturing Technology Co.,Ltd. Address before: 100040, Shijingshan Road, Beijing, Yuquan building on the west side of the 9 floor, 3 Patentee before: BEIJING LIQUIDKING TECHNOLOGY Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170503 |