CN104910843A - Cationically curable adhesive and application thereof - Google Patents
Cationically curable adhesive and application thereof Download PDFInfo
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- CN104910843A CN104910843A CN201410089992.XA CN201410089992A CN104910843A CN 104910843 A CN104910843 A CN 104910843A CN 201410089992 A CN201410089992 A CN 201410089992A CN 104910843 A CN104910843 A CN 104910843A
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- caking agent
- cationically curable
- curing
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Abstract
A cationically curable adhesive comprises an epoxy resin main body, an epoxy compound, a cationic photoinitiator, a dilutent and a stabilizer. The adhesive generates a small amount of a discharge gas in the adhesion process, so the influences on adhered parts and adjacent parts are reduced; and the electric corrosion resistance can be improved, and low temperature rapid curing is realized.
Description
Technical field
The present invention relates to a kind of caking agent, particularly relate to a kind of cationically curable caking agent and application method.
Background technology
Composition epoxy resin has been widely used in electronic component field and other various fields as caking agent.In the field of the particularly electronic component such as hard disk drive (HDD), the trend of its miniaturization is fairly obvious.Along with miniaturization, in HDD assembling procedure, the part such as screw, screw thread is utilized to carry out screwing togather or physical property engages and becomes difficulty.In order to by part miniaturization, need the precision improving processing, but the stably manufactured that can produce part becomes difficulty and the problems such as the unit price rising of part.On the other hand, the adjustment of spray volume or ejection shape can be utilized to be simplified by packaging technology owing to engaging by the chemical of caking agent etc., and assemble while the working accuracy of part can be improved, so its importance increases.
Commonly, the connection between the actuating arm in disc driver, bearing assembly, magnetic head fold piece combination adopts caking agent to bond.Traditional caking agent adopts ultraviolet curing type anerobe caking agent, and it comprises light trigger, organic hydroperoxide thing, active crylic acid alicyclic monomer and CALCIUM ACRYLATE oligopolymer and other additives.
But, adopt this kind of caking agent outstanding problem to be a large amount of Exhaust Gas.Particularly, the curing of traditional caking agent, by ultraviolet or visible ray homenergic ray solidification completely or solidify completely by heating.Commonly, be to the region of irradiation energy ray carrying out photocuring, the shadow portion of not illuminated energy-ray utilized and is heating and curing, make it to solidify completely.In the case, in order to improve the solidified nature by energy-ray, the ratio in composition epoxy resin shared by CALCIUM ACRYLATE is very high, thus produces a lot of Exhaust Gas, thus causes a lot of problem.Such as, produced a large amount of Exhaust Gas materials by bonding surface, the magnetic head that media surface is stopped is sticked in media surface, or produce larger frictional force, again and medium and magnetic head can contaminated thing bonding and produce head failure, thus the read-write of information cannot be carried out.Given this, in HDD, the reduction of Exhaust Gas is proposed by as important problem.
Summary of the invention
The object of the present invention is to provide a kind of caking agent of cationically curable, it produces a small amount of Exhaust Gas in bonding process, thus reduces the impact on bonding part and contiguous part; The electrocorrosion-resisting of caking agent can be improved, realize low-temperature fast-curing.
Another object of the present invention is to provide a kind of curing utilizing the caking agent of cationically curable to carry out, it produces a small amount of Exhaust Gas in bonding process, thus reduces the impact on bonding part and contiguous part; The electrocorrosion-resisting of caking agent can be improved, realize low-temperature fast-curing.
For achieving the above object, the caking agent of cationically curable of the present invention, comprising: body of epoxy resin; Epoxy compounds; Cation light initiator; Thinner and stablizer.
Compared with prior art, caking agent of the present invention produces a small amount of Exhaust Gas in bonding process, thus reduces the impact on bonding part and contiguous part; And can improve caking agent electrocorrosion-resisting, realize low-temperature fast-curing.
Preferably, described epoxy compounds comprises one or more alicyclic diepoxides.
Preferably, described cation light initiator is: diazonium salt, diaryl group iodized salt, triaryl sulfonium salts, alkyl sulfosalt, iron arene salt, sulfonyloxy ketone and triaryl silica ether.
Preferably, described thinner is selected from compound, vinyl ethers, oxetane compound, the polyalcohols with epoxy group(ing).
Correspondingly, the invention provides a kind of curing, comprising: the caking agent of the cationically curable that the surface coated to adherend is above-mentioned, then makes it solidify by light source irradiation.
Preferably, described adherend is the component of harddisk driving unit.
Preferably, irradiate light to described caking agent and carry out Procuring, the intensity of described light is 300 ~ 600mW/cm
2, the time length is 0.1 ~ 10s.
Embodiment
Below in conjunction with embodiment, the caking agent of cationically curable of the present invention and application thereof are described further, but therefore do not limit the present invention.
An embodiment of the caking agent of cationically curable of the present invention comprises following component: epoxy resin, epoxy compounds, cation light initiator, thinner and stablizer.
Epoxy resin in the present invention is bulk composition, is the compound in 1 molecule with at least 1 epoxy group(ing) in principle.And epoxy compounds can comprise one or more alicyclic diepoxides, also the epoxy compounds of spendable unit price, such as phenyl glycidyl ether, cresylglycidylether, to tert-butyl-phenyl glycidyl ether, butylglycidyl ether, C12 ~ C14 alcohol glycidyl ether, butane diglycidylether, hexane diglycidylether, cyclohexanedimethyl diglycidylether or using polyoxyethylene glycol or polypropylene glycol as the glycidyl ether etc. of matrix, but be not limited to them.
The optional diazonium salts of cation light initiator of the present invention, diaryl group iodized salt, triaryl sulfonium salts, alkyl sulfosalt, iron arene salt, sulfonyloxy ketone and triaryl silica ether.The curing speed of this little cation light initiator is fast, and bonding strength is good.In adhesive component of the present invention, relative to epoxy resin 100 mass parts, this cation light initiator is preferably 1 ~ 15 mass parts, to ensure the control of solidification effect and Exhaust Gas amount.Most preferably, 1 ~ 3 mass parts is adopted.The present invention adopts cation light initiator, so when carrying out bonding solidification, hot positively charged ion is polymerized, and Exhaust Gas amount is few, and electrocorrosion-resisting is good, and can realize low-temperature fast-curing.
Other known thinners can be contained in this adhesive component, suitably can use compound, vinyl ethers, oxetane compound, the polyalcohols of epoxy group(ing), particularly, aliphatic alkyl list or the bisglycidyl base ethers such as cyclohexanedimethanodiglycidyl diglycidyl ether, butylglycidyl ether, 2-hexyl glycidyl ether, propenyl glycidyl ether can be enumerated; Glycidyl methacrylate; Styrene oxide 98min.; The aromatic alkyl such as phenyl glycidyl ether, cresyl glycidyl ether list glycidyl ether; List or the polyfunctional vinyl ethers such as cyclohexanedimethanol divinyl base ether, triethylene glycol divinyl ether.
Some stablizers are also comprised, such as thermo-stabilizer, preserving stabilizer etc. in the present invention.In addition, also can add as required containing the weighting agent such as silicon-dioxide, mica, static inhibitor, silane coupling agent etc.
To sum up, caking agent of the present invention produces a small amount of Exhaust Gas in bonding process, thus reduces the impact on bonding part and contiguous part; And can improve caking agent electrocorrosion-resisting, realize low-temperature fast-curing.
Here is the application scenarios of caking agent of the present invention in HDD and application method.
1, bonding with between cantilever tongue piece of the magnetic head in magnetic head fold piece combination.Wherein curing process comprises the following steps:
(1) in cantilever tongue piece, appropriate above-mentioned caking agent is sprayed;
(2) adopt LED UV-light Procuring 1 ~ 5s, this light intensity is 400 ~ 500m W/cm
2;
(3) magnetic head is placed on caking agent;
(4) adopt LASER HEATING solidification, duration is 30 ~ 60s, and temperature controls at 80 DEG C;
(5) solidification is completed.
2, bonding between actuating arm and bearing assembly.Wherein curing process comprises the following steps:
(1) on the surface of bearing assembly, appropriate caking agent of the present invention is sprayed;
(2) adopt LED UV-light Procuring 2 ~ 3s, this light intensity is 400 ~ 500m W/cm
2;
(3) place actuating arm on this caking agent, and keep 3 ~ 5min;
(4) bonding part is placed in baking oven and dries 0.5 ~ 1h;
(5) solidification is completed.
Use the curing of caking agent of the present invention, because the low-temperature curing performance of caking agent is good, therefore can adopt lower light intensity when Procuring, the shorter time length can realize solidification to a certain extent, and then makes follow-up bonding process become simple, easy to operate.And the Exhaust Gas amount of caking agent of the present invention in bonding process is few, the performance of magnetic head and correlated parts (such as disk) can not be affected.
Obviously, the above-mentioned application scenario being only described caking agent of the present invention for HDD, but the present invention is not restricted to this, and the bonding field of other electronic devices and components is applicable equally, not for example at this.
Above disclosedly be only preferred embodiment of the present invention, certainly can not limit the interest field of the present invention with this, therefore according to the equivalent variations that the present patent application the scope of the claims is done, still belong to the scope that the present invention is contained.
Claims (7)
1. a caking agent for cationically curable, is characterized in that, comprising:
Body of epoxy resin;
Epoxy compounds;
Cation light initiator;
Thinner; And
Stablizer.
2. the caking agent of cationically curable as claimed in claim 1, is characterized in that: described epoxy compounds comprises one or more alicyclic diepoxides.
3. the caking agent of cationically curable as claimed in claim 1, is characterized in that: described cation light initiator is: diazonium salt, diaryl group iodized salt, triaryl sulfonium salts, alkyl sulfosalt, iron arene salt, sulfonyloxy ketone and triaryl silica ether.
4. the caking agent of cationically curable as claimed in claim 1, is characterized in that: described thinner is selected from compound, vinyl ethers, oxetane compound, the polyalcohols with epoxy group(ing).
5. a curing, is characterized in that: to the caking agent of the cationically curable of surface coated as described in any one of Claims 1 to 4 of adherend, then make it solidify by light source irradiation.
6. curing as claimed in claim 5, is characterized in that: described adherend is the component of harddisk driving unit.
7. curing as claimed in claim 5, is characterized in that: irradiate light to described caking agent and carry out Procuring, the intensity of described light is 300 ~ 600mW/cm
2, the time length is 0.1 ~ 10s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410089992.XA CN104910843A (en) | 2014-03-12 | 2014-03-12 | Cationically curable adhesive and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410089992.XA CN104910843A (en) | 2014-03-12 | 2014-03-12 | Cationically curable adhesive and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104910843A true CN104910843A (en) | 2015-09-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410089992.XA Pending CN104910843A (en) | 2014-03-12 | 2014-03-12 | Cationically curable adhesive and application thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107474773A (en) * | 2017-09-09 | 2017-12-15 | 烟台德邦科技有限公司 | A kind of intelligent card chip adhesive and preparation method thereof |
| CN108018011A (en) * | 2017-12-05 | 2018-05-11 | 烟台德邦科技有限公司 | A kind of ultraviolet cured adhesive suitable for non-transparent material bonding sticks agent |
| WO2020221178A1 (en) * | 2019-04-29 | 2020-11-05 | 常州强力电子新材料股份有限公司 | Photocurable adhesive composition, photocurable adhesive, polarizer and optical device |
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| CN1483776A (en) * | 2002-09-19 | 2004-03-24 | 日本油漆株式会社 | Cation type electrodeposited coating composition for electronic device |
| CN1516727A (en) * | 2001-06-19 | 2004-07-28 | 3M | Method for adhering substrates using ultraviolet activatable adhesive film and ultraviolet irradiation apparatus |
| WO2013084708A1 (en) * | 2011-12-05 | 2013-06-13 | 協立化学産業株式会社 | Cationic hardening resin composition for hard disk drive assembly |
| WO2014014045A1 (en) * | 2012-07-20 | 2014-01-23 | 協立化学産業株式会社 | Curable composition for hard disk drive |
-
2014
- 2014-03-12 CN CN201410089992.XA patent/CN104910843A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1516727A (en) * | 2001-06-19 | 2004-07-28 | 3M | Method for adhering substrates using ultraviolet activatable adhesive film and ultraviolet irradiation apparatus |
| CN1483776A (en) * | 2002-09-19 | 2004-03-24 | 日本油漆株式会社 | Cation type electrodeposited coating composition for electronic device |
| WO2013084708A1 (en) * | 2011-12-05 | 2013-06-13 | 協立化学産業株式会社 | Cationic hardening resin composition for hard disk drive assembly |
| WO2014014045A1 (en) * | 2012-07-20 | 2014-01-23 | 協立化学産業株式会社 | Curable composition for hard disk drive |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107474773A (en) * | 2017-09-09 | 2017-12-15 | 烟台德邦科技有限公司 | A kind of intelligent card chip adhesive and preparation method thereof |
| CN108018011A (en) * | 2017-12-05 | 2018-05-11 | 烟台德邦科技有限公司 | A kind of ultraviolet cured adhesive suitable for non-transparent material bonding sticks agent |
| CN108018011B (en) * | 2017-12-05 | 2021-03-30 | 烟台德邦科技股份有限公司 | Ultraviolet curing adhesive suitable for bonding non-light-transmitting materials |
| WO2020221178A1 (en) * | 2019-04-29 | 2020-11-05 | 常州强力电子新材料股份有限公司 | Photocurable adhesive composition, photocurable adhesive, polarizer and optical device |
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Application publication date: 20150916 |
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