CN104907943A - Diamond resin grinding wheel - Google Patents
Diamond resin grinding wheel Download PDFInfo
- Publication number
- CN104907943A CN104907943A CN201510354891.5A CN201510354891A CN104907943A CN 104907943 A CN104907943 A CN 104907943A CN 201510354891 A CN201510354891 A CN 201510354891A CN 104907943 A CN104907943 A CN 104907943A
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- CN
- China
- Prior art keywords
- diamond
- grinding wheel
- tooth
- resin
- resin grinding
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with cooling provisions, e.g. with radial slots
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention relates to a diamond resin grinding wheel. The diamond resin grinding wheel comprises a matrix with a middle axle hole and a positioning hole and a peripheral diamond resin ring. The matrix positions and fixes a grinding wheel through the middle axle hole and the positioning hole, the diamond resin ring is a deeply processed grinding contact surface of a ceramic workpiece, the diamond resin ring is provided with irregularly-shaped teeth formed by successively penetrating inner through straight teeth, through helical teeth and outer through straight teeth from the inside to the outside, and irregularly-shaped chip grooves are formed among the irregularly-shaped teeth. According to the diamond resin grinding wheel, through arranging the irregularly-shaped chip grooves, the chip removal capability is substantially improved, at the same time, the cooling capability is also enhanced accordingly, the diamond resin grinding wheel can be adapted to rapid and high-efficiency operation without burning damage, and the service life is prolonged. Furthermore, the diamond resin grinding wheel is neither restricted to dry grinding nor restricted to ceramic brick processing, and can also be applied to dry grinding of the resin diamond grinding wheel or processing of various materials in presence of cooling water.
Description
Technical field
The present invention relates to ceramic workpiece deep processing high speed edging emery wheel, particularly relate to efficient high-strength ceramic workpiece high speed edging diamond resin ring-type emery wheel.
Background technology
Diamond-resin grinding wheel, has widely been applied in the middle low speed processing of Ceramic Tiles edging, the diamond resin cup emery wheel of prior art, its diamond building ring at present, the main form adopted without ring gear, internal gear, outer tooth ring, logical straight-tooth ring, logical helical teeth ring.
Prior art without ring gear (see figure 1), be continous way processing, not easily produce and collapse limit, but due to without chip area, cooling capacity extreme difference, its chip removal process is long causes break flour aggregate amount greatly and frictional heat is huge.The logical straight-tooth ring (see figure 2) of prior art, has good chip removal and cooling capacity, but beating of bringing of intermittent grinding, easily impact to cause to the glaze layer of Ceramic Tiles and collapse limit, the tooth of prior art, circumferential width is larger, generally be greater than the width of the radial ring gear of 0.5 times, therefore chip area quantity is few.Logical helical teeth ring (see figure 3), is the modified form of logical straight-tooth ring, has good chip removal and cooling capacity, and beating during intermittent grinding declines relatively, reduces and causes to ceramic brick glaze layer the possibility collapsing limit.Internal gear (see figure 4), because logical helical teeth ring is in the side of internal-and external diameter chip area, there is the acute angle crown (as shown in Figure 3) much smaller than 90 °, when absorption surface, very easily be knocked and rush broken or break, cause emery wheel periphery incomplete, after this during stone, the violent impact of generation is beated, ceramic tile glaze paint is caused to collapse limit, in order to evade this possibility, prior art have employed internal tooth mode, makes the cylindrical continuous grinding of emery wheel, but this kind of mode, bring break flour to be very easily gathered in internal spline and not easily to discharge, for a long time it, its chip removal function may lose efficacy.Outer tooth ring (see figure 5), between without the situation between ring gear and logical straight-tooth ring, its advantage to improve the intensity of logical straight-tooth.
Grinding rapidly and efficiently, brings increasing considerably of unit interval stock removal, and the impact namely suffered by emery wheel and grinding force increase considerably, and simultaneously break flour amount significantly increases, grinding heat increases considerably.Therefore, resin wheel is needed to improve structural strength, grinding capacity, chip removal ability, cooling capacity.The diamond resin wheel of prior art cannot adapt to rapidly and efficiently process, processing of especially dry grinding, and it typically shows as: Ceramic Tiles burn, collapse limit, arrisdefect or cracked, resin wheel burn, fall block, cracked or life-span falls sharply.
Summary of the invention
Based on this, for prior art, technical problem to be solved of the present invention is just to provide that a kind of structure is simple, the high-intensity high-speed edging diamond resin cup emery wheel of long service life, efficient high grinding capacity and chip removal ability.
Technical scheme of the present invention is as follows:
A kind of diamond-resin grinding wheel, comprise the matrix of band central axis hole and locating hole and peripheral diamond resin ring, the location that described matrix carries out emery wheel by described central axis hole and location is fixed, described diamond resin ring is the Grinding Contact face of the deep processing of ceramic workpiece, described diamond resin ring is provided with the heteromorphic teeth be formed through by interior logical straight-tooth, logical helical teeth and outer logical straight-tooth successively from inside to outside, forms special-shaped chip area between described heteromorphic teeth.
Wherein in an embodiment, the corresponding central angle alpha of heteromorphic teeth and adjacent 1 described chip area described in the every bar on described diamond resin ring, the maximum central angle β corresponding to described pottery absorption surface wheel face, α/β ratio is greater than 1.
Preferably, described α/β ratio is 1.05 ~ 2.5.
Still more preferably, described α/β ratio is 1.5 ~ 2.
Wherein in an embodiment, described in every bar, the outside diameter hoop arc length c of heteromorphic teeth gets 50% ~ 180% of described ceramic workpiece thickness.
Wherein in an embodiment, the well width of described special-shaped chip area, the described well width b span of smallest cross-sectional is 0.5mm ~ 5mm.
Wherein in an embodiment, the tooth depth of described heteromorphic teeth is 5 ~ 15mm.
Wherein in an embodiment, the radial width of described interior logical straight-tooth and described outer logical straight-tooth, is not less than 1/5 of the circumference arc length of corresponding inside and outside tooth.
Wherein in an embodiment, the bight scope 90 ± 1 ° of described interior logical straight-tooth and described outer logical straight-tooth., the radial direction of heteromorphic teeth outer, in, interior position, different formulations material can be adopted to obtain.
Hinge structure, beneficial effect of the present invention is, diamond-resin grinding wheel, by arranging special-shaped chip area, increases substantially chip removal ability, has driven the raising of cooling capacity simultaneously, can adapt to work rapidly and efficiently and can not burn, improve service life.Further, diamond-resin grinding wheel of the present invention is not limited to dry grinding, does not also limit to and processing ceramic brick, also can be applicable to resin wheel diamond wheel dry grinding or with processing various material when cooling water.
Accompanying drawing explanation
Fig. 1 is anodontia ring-type grinding wheel structure and the grinding schematic diagram of prior art;
Fig. 2 is straight-through ring gear shape grinding wheel structure and the grinding schematic diagram of prior art;
Fig. 3 is tiltedly logical ring gear shape grinding wheel structure and the grinding schematic diagram of prior art;
Fig. 4 is internal tooth ring-type grinding wheel structure and the grinding schematic diagram of prior art;
Fig. 5 is external tooth ring-type grinding wheel structure and the grinding schematic diagram of prior art;
Fig. 6 is diamond-resin grinding wheel structure and the grinding schematic diagram of special-shaped chip area of the present invention.
Below respectively scheme, 10,100--diamond-resin grinding wheel; 11--leads directly to tooth; 12--is logical tooth tiltedly; 13--acute angle crown; 20--machined material (ceramic workpiece); 21--glaze layer; 22--potter's clay layer; 110--matrix; 120-diamond resin ring; The special-shaped chip area of 130--; 131--is logical straight-tooth outward; 132--leads to helical teeth; Logical straight-tooth in 133--; 140--locating hole; 150--central axis hole; D1--emery wheel traffic direction; D2-feedstock direction; α--the corresponding central angle of tooth+chip area; β-maximum the central angle of ceramic workpiece contact corresponding to wheel face; B--chip area groove width; C--monodentate cylindrical arc length.
Detailed description of the invention
And the present invention is described in detail in conjunction with the embodiments below with reference to the accompanying drawings.It should be noted that, when not conflicting, the feature in following embodiment and embodiment can combine mutually.
Fig. 1 ~ Fig. 5 gives various toroidal wheel structure and the grinding schematic diagram of prior art, Fig. 6 gives diamond-resin grinding wheel structure and the grinding schematic diagram of special-shaped chip area of the present invention, composition graphs 1 ~ Fig. 6 is known, diamond-resin grinding wheel 100 of the present invention, by matrix 110, diamond resin ring 120, the special-shaped chip area 130 formed between heteromorphic teeth and adjacent heteromorphic teeth, wherein, heteromorphic teeth is by outer logical straight-tooth 131, logical helical teeth 132 and Nei Tong straight-tooth 133 are formed through, axial place in matrix 110 is provided with central axis hole 150 and locating hole 140, fix for emery wheel and locate.Grinding Contact face when diamond resin ring 120 is machined material 20 grinding, machined material 20 is made up of potter's clay layer 22 and glaze layer 21, due to machined material--the surface of ceramic workpiece 20 is crisp hard glaze layer 21, in order to prevent collapsing limit, the upper surface (i.e. glaze layer 21 face) that what first ceramic workpiece 20 and diamond-resin grinding wheel 100 contacted should be Ceramic Tiles, and the direction of rotation of diamond-resin grinding wheel 100 is with the surface direction operation down of ceramic workpiece upper surface, be specially, the feedstock direction D2 of ceramic workpiece 20 is vertical thrust from outside to inside, the emery wheel traffic direction D1 of diamond-resin grinding wheel 100 is clockwise.The contact position of usual ceramic workpiece 20 and diamond-resin grinding wheel 100 is the lower semisection of emery wheel, the position at middle part between emery wheel internal diameter to mandrel.Obviously, the angle of logical straight-tooth is not extremely conducive to chip removal (as shown in Figure 2).Heteromorphic teeth first contacts the different situations of Ceramic Tiles by according to adding man-hour inside and outside footpath, successively heteromorphic teeth radial direction outer, in, interior position, different recipe configuration can be adopted, to adapt to process needs.Diamond-resin grinding wheel of the present invention, its inside and outside edge adopts logical straight-tooth, and the acute angle tooth having evaded logical helical teeth is easy to the problem ruptured.
On diamond-resin grinding wheel 100, the corresponding central angle of each heteromorphic teeth and an adjacent chip area is α, the maximum central angle of ceramic workpiece contact corresponding to wheel face is β, any moment of Ceramic Tiles comprehensive engagement emery wheel is guaranteed with this, the tooth participating in grinding is greater than 1, grinding force is decomposed by the tooth of more than 2 take on, reduce the danger of tooth fracture, and also guarantee there is a minimum chip area in grinding face all the time in work simultaneously, within the specific limits, α/β ratio is larger, effect is better, obtains optimization data by test.Design parameter α/β ratio of the present invention is greater than 1.Optimum results is, α/β ratio is 1.05 ~ 2.5; Further optimum results is, α/β ratio is 1.5 ~ 2.
During grinding, bite is larger, and the width value of tooth is larger, and to guarantee that emery wheel external diameter linear velocity is large, processing capacity brings greatly intensity when tooth withstands shocks.High but the bite hour of speed, the width value of tooth is less, improves chip removal speed reduce heat with this.The emery wheel number of teeth, value is according to the size and the process velocity height that are bite, and the present invention, optimal design is the 50%-180% that monodentate cylindrical arc length c gets ceramic workpiece 20 thickness, obtains optimization data by test.
The chip area groove width b of diamond resin ring 120 of the present invention, in ring, position adopts logical helical teeth, the area of wall scroll chip area is made to be greater than the area of the wall scroll chip area of the same groove width b of logical straight-tooth, not cause, to collapse limit be basic constraints to groove width b, the optimal value of unlike material Ceramic Tiles is obtained by test method, span 0.5mm ~ the 5mm of chip area groove width b of the present invention, the tooth depth of heteromorphic teeth is 5-15mm.
The radial width of logical straight-tooth 131,133, external diameter can meet shock proof requirement of strength with tooth, and internal diameter can meet with tooth the requirement of strength that anti-grinding force breaks, and value of the present invention is be not less than corresponding inside and outside footpath tooth circumference arc length 1/5.The bight of interior logical straight-tooth 133 and outer logical straight-tooth 131 is approximately equal to 90 °, the bight scope 90 ± 1 ° that the present invention optimizes.
Embodiment 1
Ceramic workpiece is the Ceramic Tiles of thickness 8mm, and wherein upper surface glazed thickness is 1mm, and potter's clay layer thickness is 7mm, and processing mode is axial through type, by stroke 600mm.According to processing request, select diameter 200mm, diamond layer width 25mm, the resin wheel of thickness 13mm, diamond particle diameter is 0.15mm.Arranging the number of teeth is 45, and monodentate cylindrical arc length c is 12.16mm, and meet through testing the monodentate cylindrical arc length c span condition drawn, namely monodentate outer-diameter circular arc girth span is the 50% ~ 180%(4 ~ 14.4mm of ceramic workpiece (Ceramic Tiles) thickness).The chip area groove width b of abnormity chip area 130 is 1.8mm.
Based on this kind of tooth Shape Design, the corresponding central angle of each heteromorphic teeth and an adjacent chip area is for being 23.7 °, the maximum central angle 15.32 ° of ceramic workpiece contact corresponding to wheel face, α/β ratio is 1.55, therefore any moment of Ceramic Tiles comprehensive engagement emery wheel can be guaranteed, the tooth participating in grinding is greater than 1, grinding force is decomposed by the tooth of more than 2 take on, reduce the danger of tooth fracture, and also guarantee there is a minimum chip area in grinding face all the time in work, to improve its operating efficiency simultaneously.
The diamond-resin grinding wheel 100 of the present embodiment, by arranging special-shaped chip area 130, increase substantially chip removal ability, driven the raising of cooling capacity simultaneously, along with the decline of grinding heat and frictional heat, enable resinoid bond adapt to work rapidly and efficiently and can not burn, add the change of structure, the stressed relation adding man-hour is improved, ensure that emery wheel meets and rapidly and efficiently add the requirement of man-hour to intensity.
Embodiment 2
For the situation that allowance is large, utilize the outer lines speed of emery wheel high, the large intensity of the facewidth is high, therefore in the formula at position outside, can increase diamond concentration 5-10%, to bear maximum stock removal relative to middle position.In like manner, the high 5-10% at the comparable interior position of the formula diamond concentration at middle position.
Embodiment 3
For the situation that surface roughness requirements is high, can outside, in, in the formula at interior position, adopt the diamond of relatively carse, medium and small granularity, realize corase grind, fine grinding, fine grinding relatively, both met High-speed machining, and better ensured crudy again.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a diamond-resin grinding wheel, comprise the matrix of band central axis hole and locating hole and peripheral diamond resin ring, the location that described matrix carries out emery wheel by described central axis hole and location is fixed, described diamond resin ring is the Grinding Contact face of the deep processing of ceramic workpiece, it is characterized in that, described diamond resin ring is provided with the heteromorphic teeth be formed through by interior logical straight-tooth, logical helical teeth and outer logical straight-tooth successively from inside to outside, forms special-shaped chip area between described heteromorphic teeth.
2. diamond-resin grinding wheel according to claim 1, it is characterized in that, the corresponding central angle alpha of heteromorphic teeth and adjacent 1 described chip area described in every bar on described diamond resin ring, the maximum central angle β of described ceramic workpiece contact corresponding to wheel face, α/β ratio is greater than 1.
3. diamond-resin grinding wheel according to claim 2, is characterized in that, described α/β ratio is 1.05 ~ 2.5.
4. diamond-resin grinding wheel according to claim 3, is characterized in that, described α/β ratio is 1.5 ~ 2.
5. diamond-resin grinding wheel according to claim 1, is characterized in that, described in every bar, the outside diameter hoop arc length c of heteromorphic teeth gets 50% ~ 180% of described ceramic workpiece thickness.
6. diamond-resin grinding wheel according to claim 1, is characterized in that, the well width of described special-shaped chip area, and the described well width b span of smallest cross-sectional is 0.5mm ~ 5mm.
7. diamond-resin grinding wheel according to claim 1, is characterized in that, the tooth depth of described heteromorphic teeth is 5 mm ~ 15mm.
8. diamond-resin grinding wheel according to claim 1, is characterized in that, the radial width of described interior logical straight-tooth and described outer logical straight-tooth, is not less than 1/5 of the circumference arc length of corresponding inside and outside tooth.
9. diamond-resin grinding wheel according to claim 1, is characterized in that, the bight angular range 90 ± 1 ° of described interior logical straight-tooth and described outer logical straight-tooth.
10. diamond-resin grinding wheel according to claim 1, is characterized in that, the radial direction of heteromorphic teeth outer, in, interior position, different diamond concentrations and/or varigrained diamond formulation material can be adopted to obtain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510354891.5A CN104907943B (en) | 2015-06-25 | 2015-06-25 | Diamond-resin grinding wheel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510354891.5A CN104907943B (en) | 2015-06-25 | 2015-06-25 | Diamond-resin grinding wheel |
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| CN104907943A true CN104907943A (en) | 2015-09-16 |
| CN104907943B CN104907943B (en) | 2017-12-08 |
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| CN201510354891.5A Active CN104907943B (en) | 2015-06-25 | 2015-06-25 | Diamond-resin grinding wheel |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108296997A (en) * | 2018-03-14 | 2018-07-20 | 桂林创源金刚石有限公司 | A kind of grinding cooling system |
| WO2019174580A1 (en) * | 2018-03-12 | 2019-09-19 | 桂林创源金刚石有限公司 | Abrasive tool and fabrication method therefor |
| CN111136580A (en) * | 2018-11-06 | 2020-05-12 | 丹阳华昌钻石工具制造有限公司 | L-shaped section block bowl mill for processing high-hardness brittle material |
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| CN205325492U (en) * | 2015-06-25 | 2016-06-22 | 珠海市世创金刚石工具制造有限公司 | Diamond resin grinding wheel |
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| CN201026592Y (en) * | 2007-03-30 | 2008-02-27 | 张小军 | Improved structure of tool for soldering diamond |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2019174580A1 (en) * | 2018-03-12 | 2019-09-19 | 桂林创源金刚石有限公司 | Abrasive tool and fabrication method therefor |
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| CN111136580A (en) * | 2018-11-06 | 2020-05-12 | 丹阳华昌钻石工具制造有限公司 | L-shaped section block bowl mill for processing high-hardness brittle material |
| CN111136580B (en) * | 2018-11-06 | 2021-12-14 | 丹阳华昌钻石工具制造有限公司 | L-shaped section block bowl mill for processing high-hardness brittle material |
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| CN104907943B (en) | 2017-12-08 |
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