CN104902691A - Printed circuit board information system and realization method for the same - Google Patents

Printed circuit board information system and realization method for the same Download PDF

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Publication number
CN104902691A
CN104902691A CN201410365844.6A CN201410365844A CN104902691A CN 104902691 A CN104902691 A CN 104902691A CN 201410365844 A CN201410365844 A CN 201410365844A CN 104902691 A CN104902691 A CN 104902691A
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pcb
assembly
file
module
rfid
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CN104902691B (en
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易建军
姜辉
顾春华
朱晓民
罗金龙
徐骏
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East China University of Science and Technology
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East China University of Science and Technology
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Abstract

The invention relates to a printed circuit board assembling information system, comprising a PCB assembling knowledge acquisition module, a PCB assembling main body instantiation module, a PCB assembling main body knowledge base module, a PCB basic information acquisition module, a PCB basic information database module, a PCB assembling parameter collection module, a RFID data pre-processing middleware, a PCB assembling operation determination module, a PCB information retrieval module, a PCB knowledge base query module and a PCB file output module. The invention relates to the printed circuit board assembling information system and the realization method for the printed circuit board assembling information system , which can set various PCB assembling main body instances on the system according to the various types of the printed circuit boards, so that the assembling of the printed circuit board is adjusted according to the needs. The invention solves the problems in the prior art that the cost for the assembling of the small batch of the printed circuit board is high and the product cycle is long.

Description

Printed circuit board assembly information system and its implementation
Technical field
The present invention relates to a kind of printed circuit board assembly information system and its implementation.
Background technology
Printed circuit board (Printed Circuit Board), is called for short PCB, also known as printed circuit board (PCB), is the supplier of electronic devices and components electrical connection.Printed circuit board, after design, having manufactured, also needs to assemble corresponding electronic devices and components, and by designing requirement after test, could normally work.Traditional printed circuit board assembling mainly comprises the technical processs such as the assembling of surface patch element, the test of ventilating hole element form, fit, and function.Wherein, the assembling of surface patch element completes primarily of surface mount system, surface patch components and parts are accurately placed on the pad of printed circuit board by mobile dress head by this system, then, adopt reflow soldering process to make components and parts and printed circuit board realize being electrically connected.Ventilating hole element assembling, by manually ventilating hole element being inserted printed circuit board, then, adopts wave-soldering to make components and parts and printed circuit board realize being electrically connected.During functional test, tester, for the designing requirement of printed circuit board, adopts specific frock to carry out functional test to printed circuit board.
Radio frequency identification (Radio Frequency Identification) is called for short RFID, it is a kind of wireless communication technology, related data can be read and write by radio signals identification specific objective, and without the need to forming machinery or optical contact between recognition system and specific objective.In recent years, radio frequency identification has been widely applied to the fields such as vehicle production, storage, livestock management, effectively improves the level of IT application of relevant industries.
In recent years, along with the development of electronic technology, the manufacturing technology level of printed circuit board constantly promotes, and develops into two-sided, multilayer and flexibility from individual layer, the density of components of its assembling and complexity also corresponding lifting.In many industrial application of information technology processes, need the printed circuit board using customization, to complete the functions such as specific transfer of data, control, but the general batch of this kind of printed circuit board is less.When adopting traditional printed circuit board production line to carry out small lot assembling, the change of the production factors such as file, through-hole component rigging position, test environment is produced due to surface mount system, need to carry out dynamic-configuration to production line, thus, the assembly cost of small lot printed circuit board is higher, and the production cycle is longer.
Summary of the invention
The invention provides a kind of printed circuit board assembly information system and its implementation, the technical problem such as the assembly cost efficiently solving prior art small batch printed circuit board is higher, the production cycle is longer.
For solving the problem, the invention provides following technical scheme:
The present invention relates to a kind of printed circuit board assembly information system, comprising:
One PCB assembly knowledge acquisition module, for gathering at least one group of PCB assembly knowledge of extraneous input; Each assembling is joined knowledge and is comprised a PCB, the surface mount elements assembly knowledge of corresponding described PCB, ventilating hole element assembly knowledge and PCB functional parameter knowledge on testing;
One PCB assembled body instantiation module, for carrying out instantiation process to described PCB assembly knowledge, each group PCB assembly knowledge is made to form a PCB assembled body example, the body construction of each PCB assembled body example comprises: a PCB, one surface mount elements load module, one ventilating hole element load module and a PCB functional parameter test module, paster assembly relation is formed between described surface mount elements load module and described PCB, through hole assembly relation is formed between described ventilating hole element load module and described PCB, detection relation is formed between described PCB functional parameter test module and described PCB, wherein, described surface mount elements load module comprises paster assembly project file, reflow soldering process Parameter File, described ventilating hole element load module comprises ventilating hole element assembling and detects file, ventilating hole element assembling schematic diagram file and solder wave process Parameter File, described PCB functional parameter test module comprises image measurement project file, functional test project file, wherein, described ventilating hole element assembling schematic diagram is video file, and described surface mount elements assembly project file, described reflow soldering process Parameter File, described ventilating hole element assembling detection file, described solder wave process Parameter File, described image measurement project file and described functional test project file are the operation file in PCB assembling process,
One PCB assembled body base module, for storing at least one PCB assembled body example;
One PCB basic information collection module, for gathering at least one group of PCB Back ground Information of extraneous input; Each group Back ground Information comprises resource identifier, PCB sequence number, PCB orders unit, PCB order time, PCB assembles initial time, PCB assembles end time and PCB testing result;
One PCB basic information database module, for storing at least one PCB Back ground Information table, described PCB Back ground Information table comprises at least one RFID coding and at least one group of PCB Back ground Information; The corresponding RFID coding of each group Back ground Information;
One PCB assembly parameter acquisition module, for gathering at least one group of PCB assembly parameter of extraneous input; Each group PCB assembly parameter comprises Reflow Soldering temperature and wave-soldering temperature;
One RFID data preliminary treatment middleware, for obtaining and store, the encrypted RFID coding processed in RFID that preliminary treatment is arranged on a printed circuit board to be assembled;
One PCB assembly manipulation judge module, is arranged on the assembly manipulation classification of position judgment in PCB assembling process on PCB assembly equipment, that obtain the RFID reader of RFID coding for basis; Described assembly manipulation classification comprises surface mount elements location, Reflow Soldering, surface mount elements assembles detection, ventilating hole element is placed, ventilating hole element places detection, wave-soldering, ventilating hole element assemble detection, functional test;
One PCB information searching module, for being coded in described PCB basic information database module the one group of PCB Back ground Information retrieving corresponding described RFID coding according to pretreated RFID;
One PCB KnowledgeBase-query module, for obtaining described PCB Back ground Information, inquires about a PCB assembled body example of corresponding described printed circuit board to be assembled in described PCB assembled body base module according to the described resource identifier in described PCB Back ground Information; Video file in this PCB assembled body example or operation file is called according to described PCB assembly parameter and described assembly manipulation classification; And
One PCB file output module, for showing described video file or exporting described operation file; Described PCB file output module comprises a display module, for showing described video file, and a PCB assembly parameter output module, for exporting described operation file.
Further, described RFID data preliminary treatment middleware comprises:
One reader communication interface module, for receiving described RFID coding;
One RFID encoding filter module, carries out filtration treatment for the RFID coding of encoding to the RFID of corrupted data or repeat to read; And
One RFID coding and decoding module, for carrying out decoding process to the described RFID coding after filtration treatment.
The invention still further relates to a kind of printed circuit board assembly system, comprising:
At least one printed circuit board to be assembled;
At least one RFID, each printed circuit board to be assembled is provided with a RFID, for storing the RFID coding of corresponding described printed circuit board to be assembled;
At least one RFID reader, is wirelessly connected to described RFID, for reading described RFID coding;
One computer, is provided with described printed circuit board assembly information system; Described computer is connected to described RFID reader, for identifying RFID coding in described RFID, retrieves one group of PCB Back ground Information, the PCB assembled body example inquired about in described PCB assembled body base module of corresponding described RFID coding, calls and display of visually file, call and export described operation file; And
At least one PCB assembly equipment, is connected to described computer, for obtaining described operation file and carrying out assembly manipulation according to described operation file to described printed circuit board to be assembled; Each PCB assembly equipment is provided with at least one described RFID reader.
Described PCB assembly equipment comprises surface mount elements positioner, reflow soldering apparatus, surface mount elements assembling detection device, ventilating hole element apparatus for placing, ventilating hole element places checkout gear, Wave-soldering device, ventilating hole element assembling detection device, device for testing functions, described surface mount elements positioner, described reflow soldering apparatus, described surface mount elements assembling detection device, described ventilating hole element apparatus for placing, described ventilating hole element places checkout gear, described Wave-soldering device, described ventilating hole element assembling detection device, described device for testing functions is respectively equipped with the RFID reader described in.
A kind of printed circuit board assembly information system, comprising:
One PCB assembly knowledge acquisition module, for gathering at least one group of PCB assembly knowledge of extraneous input; Each assembling is joined knowledge and is comprised a PCB, the surface mount elements assembly knowledge of corresponding described PCB, ventilating hole element assembly knowledge and PCB functional parameter knowledge on testing;
One PCB assembled body instantiation module, for carrying out instantiation process to described PCB assembly knowledge, each group PCB assembly knowledge is made to form a PCB assembled body example, the body construction of each PCB assembled body example comprises: a PCB, one surface mount elements load module, one ventilating hole element load module and a PCB functional parameter test module, paster assembly relation is formed between described surface mount elements load module and described PCB, through hole assembly relation is formed between described ventilating hole element load module and described PCB, detection relation is formed between described PCB functional parameter test module and described PCB, wherein, described surface mount elements load module comprises paster assembly project file, reflow soldering process Parameter File, described ventilating hole element load module comprises ventilating hole element assembling and detects file, ventilating hole element assembling schematic diagram file and solder wave process Parameter File, described PCB functional parameter test module comprises image measurement project file, functional test project file, wherein, described ventilating hole element assembling schematic diagram is video file, and described surface mount elements assembly project file, described reflow soldering process Parameter File, described ventilating hole element assembling detection file, described solder wave process Parameter File, described image measurement project file and described functional test project file are the operation file in PCB assembling process,
One PCB assembled body base module, for storing at least one PCB assembled body example;
One PCB basic information collection module, for gathering at least one group of PCB Back ground Information of extraneous input; Each group Back ground Information comprises resource identifier, PCB sequence number, PCB orders unit, PCB order time, PCB assembles initial time, PCB assembles end time and PCB testing result;
One PCB basic information database module, for storing at least one PCB Back ground Information table, described PCB Back ground Information table comprises at least one RFID coding and at least one group of PCB Back ground Information; The corresponding RFID coding of each group Back ground Information;
One PCB assembly parameter acquisition module, for gathering at least one group of PCB assembly parameter of extraneous input; Each group PCB assembly parameter comprises Reflow Soldering temperature, wave-soldering temperature, assembly precision threshold value and printed circuit board number to be assembled;
One RFID data preliminary treatment middleware, for obtaining and store, the encrypted RFID coding processed in RFID that preliminary treatment is arranged on a printed circuit board to be assembled;
One PCB assembly manipulation judge module, is arranged on the assembly manipulation classification of position judgment in PCB assembling process on PCB assembly equipment, that obtain the RFID reader of RFID coding for basis; Described assembly manipulation classification comprises surface mount elements location, Reflow Soldering, surface mount elements assembles detection, ventilating hole element is placed, ventilating hole element places detection, wave-soldering, ventilating hole element assemble detection, functional test;
One PCB information searching module, for being coded in described PCB basic information database module the one group of PCB Back ground Information retrieving corresponding described RFID coding according to pretreated RFID;
One PCB KnowledgeBase-query module, for obtaining described PCB Back ground Information, inquires about a PCB assembled body example of corresponding described printed circuit board to be assembled in described PCB assembled body base module according to the described resource identifier in described PCB Back ground Information; Video file in this PCB assembled body example or operation file is called according to described PCB assembly parameter and described assembly manipulation classification; And
One PCB file output module, for showing described video file or exporting described operation file; Described PCB file output module comprises a display module, for showing described video file, and a PCB assembly parameter output module, for exporting described operation file.
Described RFID data preliminary treatment middleware comprises:
One reader communication interface module, for receiving described RFID coding;
One RFID encoding filter module, carries out filtration treatment for the RFID coding of encoding to the RFID of corrupted data or repeat to read; And
One RFID coding and decoding module, for carrying out decoding process to the described RFID coding after filtration treatment.
A kind of printed circuit board assembly system, comprising:
At least one printed circuit board to be assembled;
At least one RFID, each printed circuit board to be assembled is provided with a RFID, for storing the RFID coding of corresponding described printed circuit board to be assembled;
At least one RFID reader, is wirelessly connected to described RFID, for reading described RFID coding;
One computer, is provided with printed circuit board assembly information system as claimed in claim 1 or 2; Described computer is connected to described RFID reader, for identifying RFID coding in described RFID, retrieves one group of PCB Back ground Information, the PCB assembled body example inquired about in described PCB assembled body base module of corresponding described RFID coding, calls and display of visually file, call and export described operation file; And
At least one PCB assembly equipment, is connected to described computer, for obtaining described operation file and carrying out assembly manipulation according to described operation file to described printed circuit board to be assembled; Each PCB assembly equipment is provided with at least one described RFID reader.
Described PCB assembly equipment comprises surface mount elements positioner, reflow soldering apparatus, surface mount elements assembling detection device, ventilating hole element apparatus for placing, ventilating hole element places checkout gear, Wave-soldering device, ventilating hole element assembling detection device, device for testing functions, described surface mount elements positioner, described reflow soldering apparatus, described surface mount elements assembling detection device, described ventilating hole element apparatus for placing, described ventilating hole element places checkout gear, described Wave-soldering device, described ventilating hole element assembling detection device, described device for testing functions is respectively equipped with the RFID reader described in.
The invention still further relates to a kind of implementation method of described printed circuit board assembly information system, comprise the steps:
Gather at least one group of PCB assembly knowledge of extraneous input; Each assembling is joined knowledge and is comprised a PCB, the surface mount elements assembly knowledge of corresponding described PCB, ventilating hole element assembly knowledge and PCB functional parameter knowledge on testing;
Instantiation process is carried out to described PCB assembly knowledge, each group PCB assembly knowledge is made to form a PCB assembled body example, the body construction of each PCB assembled body example comprises: a PCB, a surface mount elements load module, a ventilating hole element load module and a PCB functional parameter test module, paster assembly relation is formed between described surface mount elements load module and described PCB, form through hole assembly relation between described ventilating hole element load module and described PCB, between described PCB functional parameter test module and described PCB, form detection relation; Wherein, described surface mount elements load module comprises paster assembly project file, reflow soldering process Parameter File; Described ventilating hole element load module comprises ventilating hole element assembling and detects file, ventilating hole element assembling schematic diagram file and solder wave process Parameter File; Described PCB functional parameter test module comprises image measurement project file, functional test project file; Wherein, described ventilating hole element assembling schematic diagram is video file, and described surface mount elements assembly project file, described reflow soldering process Parameter File, described ventilating hole element assembling detection file, described solder wave process Parameter File, described image measurement project file and described functional test project file are the operation file in PCB assembling process;
Store at least one PCB assembled body example to described PCB assembled body base module;
Gather at least one group of PCB Back ground Information of extraneous input; Each group Back ground Information comprises resource identifier, PCB sequence number, PCB orders unit, PCB order time, PCB assembles initial time, PCB assembles end time and PCB testing result;
Store at least one PCB Back ground Information table, described PCB Back ground Information table comprises at least one RFID coding and at least one group of PCB Back ground Information; The corresponding RFID coding of each group Back ground Information;
Gather at least one group of PCB assembly parameter of extraneous input; Each group PCB assembly parameter comprises Reflow Soldering temperature, wave-soldering temperature, assembly precision threshold value and printed circuit board number to be assembled;
Acquisition and preliminary treatment are arranged on that store in the RFID on a printed circuit board to be assembled, the encrypted RFID coding processed;
According to being arranged on the assembly manipulation classification of position judgment in PCB assembling process on PCB assembly equipment, that obtain the RFID reader of RFID coding; Described assembly manipulation classification comprises surface mount elements location, Reflow Soldering, surface mount elements assembles detection, ventilating hole element is placed, ventilating hole element places detection, wave-soldering, ventilating hole element assemble detection, functional test;
The one group of PCB Back ground Information retrieving corresponding described RFID coding is coded in described PCB basic information database module according to pretreated RFID;
Obtain described PCB Back ground Information, in described PCB assembled body base module, inquire about a PCB assembled body example of corresponding described printed circuit board to be assembled according to the described resource identifier in described PCB Back ground Information; Video file in this PCB assembled body example or operation file is called according to described PCB assembly parameter and described assembly manipulation classification; And
Show described video file or export described operation file.
Further, acquisition and preliminary treatment are arranged on that store in the RFID on a printed circuit board to be assembled, the encrypted RFID coding processed, and comprise the steps:
Receive described RFID coding;
The RFID coding of encoding to the RFID of corrupted data or repeat to read carries out filtration treatment; And
Decoding process is carried out to the described RFID coding after filtration treatment.
The invention has the advantages that, a kind of printed circuit board assembly information system and its implementation are provided, can for the dissimilar printed circuit board (PCB) PCB assembled body example different to Operation system setting, thus as required to described enter system in PCB assembled body example produce file, through-hole component rigging position, the production factors such as test environment are called, effectively reduce the production cost in small lot printed circuit board assembling process, and effectively shorten the production cycle, the assembly cost solving prior art small batch printed circuit board is higher, the technical problems such as the production cycle is longer.
Accompanying drawing explanation
Fig. 1 is the structural representation of printed circuit board assembly system in the present invention;
Fig. 2 is the structured flowchart of printed circuit board assembly information system in the present invention;
Fig. 3 is the body construction block diagram of a PCB assembled body example in the present invention;
Fig. 4 is the character string structure chart of a kind of resource identifier in the present invention;
Fig. 5 is the character string structure chart of another kind of resource identifier in the present invention;
Fig. 6 is the FB(flow block) of the implementation method of printed circuit board assembly information system in the present invention;
Fig. 7 is the FB(flow block) of printed circuit board assembling in the present invention;
Fig. 8 is the FB(flow block) of surface mount elements position fixing process in the present invention;
Fig. 9 is the FB(flow block) of reflow process in the present invention;
Figure 10 is the FB(flow block) of surface mount elements assembling testing process in the present invention;
Figure 11 is the FB(flow block) of ventilating hole element put procedure in the present invention;
Figure 12 is the FB(flow block) that in the present invention, ventilating hole element places testing process;
Figure 13 is the FB(flow block) of paster wave-soldering process in the present invention;
Figure 14 is the FB(flow block) of paster ventilating hole element assembling testing process in the present invention;
Figure 15 is the FB(flow block) of functional test procedures in the present invention.
Embodiment
Describe the specific embodiment of the present invention in detail below in conjunction with accompanying drawing, those skilled in the art is more clearly understood and how to realize the present invention.Although should be appreciated that and the invention describes its preferred specific embodiments, but these are the elaboration to embodiment, instead of limit the scope of the invention.
A kind of printed circuit board assembly system as shown in Figure 1, comprising: at least one printed circuit board 2 to be assembled; At least one RFID 3, each printed circuit board 2 to be assembled is provided with a RFID 3; At least one RFID reader 4, is wirelessly connected to RFID 3; One computer 1, is connected to RFID reader 4, is provided with a printed circuit board assembly information system 10, and at least one PCB assembly equipment 5, is connected to computer 1, each PCB assembly equipment is installed with at least one described RFID reader.
Printed circuit board assembly information system 10 is as shown in Figure 2 a kind of software that can be arranged in computer operating system, comprising:
One PCB assembly knowledge acquisition module 11, for gathering at least one group of PCB assembly knowledge of extraneous input; Each assembling is joined knowledge and is comprised a PCB, the surface mount elements assembly knowledge of corresponding described PCB, ventilating hole element assembly knowledge and PCB functional parameter knowledge on testing; Printed circuit board Assembly Engineer by PCB assembly knowledge described in input equipment (keyboard) typing at least one group of computer 1 to PCB assembly knowledge input module 11.
One PCB assembled body instantiation module 12, for carrying out instantiation process to described PCB assembly knowledge, makes each group PCB assembly knowledge form a PCB assembled body example.In computer science and information science field, body refers to one " formal, for the clear and definite of shared ideas system and detailed description ".The PCB assembled body knowledge base body built in the present invention is for organizing and storing file, the material that printed circuit board assembles each process procedure.This body contains 4 abstract printed circuit board assembling field concepts, i.e. printed circuit board, surface mount elements assembling, ventilating hole element assembling and printed circuit board functional parameter, surface mount elements assembling, ventilating hole element assembling and printed circuit board functional parameter form corresponding relation with printed circuit board respectively, form a body.Be illustrated in figure 3 the body construction of a PCB assembled body example 20140605, comprise: a PCB121(printed circuit board 20140605), one surface mount elements load module 122(surface mount elements load module 20140605), one ventilating hole element load module 123(ventilating hole element load module 20140605) and a PCB functional parameter test module 124(printed circuit board functional parameter module 20140605), paster assembly relation is formed between surface mount elements load module 122 and PCB121, through hole assembly relation is formed between ventilating hole element load module 123 and PCB121, detection relation is formed between PCB functional parameter test module 124 and PCB121, wherein, surface mount elements load module 122 comprises paster assembly project file, reflow soldering process Parameter File, ventilating hole element load module 123 comprises ventilating hole element assembling and detects file, ventilating hole element assembling schematic diagram file and solder wave process Parameter File, PCB functional parameter test module 124 comprises image measurement project file, functional test project file, wherein, described ventilating hole element assembling schematic diagram is video file, and described surface mount elements assembly project file, described reflow soldering process Parameter File, described ventilating hole element assembling detection file, described solder wave process Parameter File, described image measurement project file and described functional test project file are the operation file in PCB assembling process.When described operation file refers to that PCB assembly equipment operates printed circuit board (PCB) with reference to file, a certain operating means in described PCB assembly equipment carries out operational processes according to corresponding operation file to printed circuit board (PCB).
One PCB assembled body base module 13, for storing at least one PCB assembled body example.PCB assembled body knowledge base is based on ontological KBS, for organizing and storing file, the material that printed circuit board assembles each process procedure.
One PCB basic information collection module 14, for gathering at least one group of PCB Back ground Information of extraneous input; Each group Back ground Information comprises resource identifier, PCB sequence number, PCB orders unit, PCB order time, PCB assembles initial time, PCB assembles end time and PCB testing result.Wherein, described resource identifier, namely described PCB assembled body example Uniform Resource Identifier, is a character string, for identifying a resource to be obtained.As shown in Figure 5, a kind of composition structure of PCB assembled body example Uniform Resource Identifier embodiment, comprises successively: access protocal 141, access domain name 142, access catalogue 143 and Access Filename 144; Wherein, access protocal 141 is for showing the access protocal of described resource to be obtained, access domain name 142 is the domain name of resource place to be obtained server, and access catalogue 143 is the catalogue of described resource to be obtained correspondence on described server, and Access Filename 144 is the file name of resource to be obtained.In embodiment shown in Fig. 4, access protocal 141 is http(HyperText Transfer Protocol, HTML (Hypertext Markup Language)), access domain name 142 is pcbassembly; Access catalogue 143 is ontology, and Access Filename 144 is pcbknowledge.owl.Uses ": // " symbol to split between access protocal 141 and access domain name 142, access domain name 142, access between catalogue 143 and Access Filename 144 and use "/" symbol to split respectively.Another embodiment of described PCB assembled body example Uniform Resource Identifier as shown in Figure 5, its composition structure comprises successively: access protocal 141, access domain name 142, access catalogue 143, Access Filename 144 and resource name 145, adopt " # " symbol to split between Access Filename 144 and resource name 145.Wherein, resource name 145 for the mark title of resource to be obtained file pointed by described Access Filename, described resource name be the Alternative Content of described resource identifier.If resource to be obtained is the file pointed by whole Access Filename 804, then described resource identifier adopts character string structure as shown in Figure 5.
One PCB basic information database module 15, for storing at least one PCB Back ground Information table, described PCB Back ground Information table comprises at least one RFID coding and at least one group of PCB Back ground Information; The corresponding RFID coding of each group Back ground Information, specifically, the corresponding RFID coding of the resource identifier in each group Back ground Information, same group of PCB Back ground Information is to should resource identifier in group.
One PCB assembly parameter acquisition module 16, for gathering at least one group of PCB assembly parameter of extraneous input; Each group PCB assembly parameter comprises the parameters such as Reflow Soldering temperature, wave-soldering temperature, assembly precision threshold value and printed circuit board number to be assembled.Before printed circuit board assembling, by printed circuit board assembly manipulation person by PCB assembly parameter described in input equipment (keyboard) typing at least one group of computer to PCB assembly parameter acquisition module 16.
One RFID data preliminary treatment middleware 17, for obtaining and store, the encrypted RFID coding 301 processed in RFID that preliminary treatment is arranged on a printed circuit board to be assembled.RFID data preliminary treatment middleware 17 comprises: a reader communication interface module 171, for receiving described RFID coding, the Interface Matching and the data protocol that realize reader 4 and printed circuit board assembly information system 10 are changed, and make described RFID coding adapt to the data handling requirements of printed circuit board assembly information system 10; One RFID encoding filter module 172, carry out filtration treatment for the RFID coding of encoding to the RFID of corrupted data or repeat to read, ensure that RFID coding 301 enters correctness and the validity of electronic tag coding and decoding module 173 process; And a RFID coding and decoding module 173, for carrying out to the described RFID coding after filtration treatment process (for ensureing the fail safe of data, electronic tag coding 301 is all encrypted in actual applications) of decoding.Wherein, reader communication interface module 171 is connected to PCB information searching module 19 by RFID encoding filter module 172, RFID coding and decoding module 173 successively.
One PCB assembly manipulation judge module 18, is arranged on the assembly manipulation classification of position judgment in PCB assembling process on PCB assembly equipment, that obtain the RFID reader of RFID coding for basis; Described assembly manipulation classification comprises surface mount elements location, Reflow Soldering, surface mount elements assembles detection, ventilating hole element is placed, ventilating hole element places detection, wave-soldering, ventilating hole element assemble detection, functional test.In addition, PCB assembly manipulation judge module 18 also can be called PCB assembly manipulation information acquisition module, gather the operation information in printed circuit board assembling process, operation information comprises surface mount elements locating information, Reflow Soldering information, surface mount elements assembling Detection Information, ventilating hole element places information, ventilating hole element places Detection Information, wave-soldering information, ventilating hole element assemble Detection Information, functional test information, such as, in the functional test stage, using operation information " functional test " also as a parameter collection in PCB assembly manipulation information acquisition module.
One PCB information searching module 19, for being coded in described PCB basic information database module 15 the one group of PCB Back ground Information retrieving corresponding described RFID coding according to pretreated RFID.
One PCB KnowledgeBase-query module 20, for obtaining described PCB Back ground Information, in described PCB assembled body base module, inquire about a PCB assembled body example of corresponding described printed circuit board to be assembled according to the described resource identifier in described PCB Back ground Information; Video file in this PCB assembled body example or operation file is called according to described PCB assembly parameter and described assembly manipulation classification.Operation file in described PCB assembled body instantiation module is corresponding with the described assembly manipulation classification in PCB assembly manipulation judge module respectively, alternatively, in PCB assembling process, and the operation file that different assembly manipulation classification is corresponding different.Such as: if assembly manipulation is surface mount elements location, call the surface mount elements assembly project file in described PCB assembled body example; If assembly manipulation is Reflow Soldering, call the reflow soldering process Parameter File in described PCB assembled body example; Detect or ventilating hole element assembling detection if assembly manipulation is surface mount elements assembling, call the image measurement project file in described PCB assembled body example; Place if assembly manipulation is ventilating hole element, call the ventilating hole element assembling schematic diagram in described PCB assembled body example; If assembly manipulation is ventilating hole element place detection, the ventilating hole element assembling of calling in described PCB assembled body example detects file; If assembly manipulation is wave-soldering, call the solder wave process Parameter File in described PCB assembled body example; If assembly manipulation is functional test, call the functional test project file in described PCB assembled body example.Each group PCB assembly parameter comprises Reflow Soldering temperature, wave-soldering temperature, assembly precision threshold value and printed circuit board number to be assembled etc.; If assembly manipulation is Reflow Soldering, while calling described reflow soldering process Parameter File, call Reflow Soldering temperature; If assembly manipulation is wave-soldering, while calling described solder wave process Parameter File, call wave-soldering temperature.
One PCB file output module 21, for showing described video file or exporting described operation file; Described PCB file output module comprises a display module 211, for showing described video file, and a PCB assembly parameter output module 212, for exporting described operation file.
Wherein, PCB assembly knowledge acquisition module is connected to described PCB KnowledgeBase-query module by described assembled body instantiation module, PCB assembled body base module successively, PCB basic information collection module is connected to described PCB KnowledgeBase-query module by described PCB basic information database module, described PCB information searching module successively, described RFID data preliminary treatment middleware is connected to described PCB information searching module, and described PCB assembly parameter input module, described PCB assembly manipulation information acquisition module are connected to described PCB KnowledgeBase-query module respectively.
A kind of printed circuit board assembly system as shown in Figure 1, comprising:
At least one printed circuit board 2 to be assembled.
At least one RFID 3, each printed circuit board 2 to be assembled is provided with a RFID 3, for storing the RFID coding 301 of corresponding described printed circuit board 2 to be assembled.RFID 3 can select the passive RF label of high frequency, hyperfrequency.The length of RFID coding 301 is determined by the type of RFID 3, such as, the memory capacity of the ultra-high-frequency passive tag of ISO18000-6C standard is 96bit, its coding rule can ensure RFID encode 301 uniquenesss prerequisite under, determine depending on practical situations.
At least one RFID reader 4, is wirelessly connected to RFID 3, for reading RFID coding 301.
One computer 1, is provided with described printed circuit board assembly information system 10, computer 1 is connected to RFID reader 4, for identifying the RFID coding 301 in RFID 3, input at least one group of PCB assembly parameter and at least one group of PCB assembly knowledge to printed circuit board assembly information system 10, in PCB basic information database module 15, one group of PCB Back ground Information of corresponding RFID coding 301 is retrieved according to RFID coding 301, PCB assembled body example in PCB assembled body base module according to the resource identifier query in PCB Back ground Information, call the video file in PCB assembled body example and operation file, carry out display of visually file by the display of computer or export described operation file to PCB assembly equipment 5.Computer 1 comprises input equipment (mouse and keyboard) and output equipment (display), and the display module 211 in PCB file output module 21 is connected to the display of computer, shows described video file by the display of computer; PCB assembly parameter output module 212 in PCB file output module 21 is connected to PCB assembly equipment 5, exports described operation file to PCB assembly equipment 5.
At least one PCB assembly equipment 5, is connected to computer 1, for obtaining described operation file and carrying out assembly manipulation according to described operation file to described printed circuit board to be assembled; Each PCB assembly equipment is installed with at least one described RFID reader.
PCB assembly equipment 5 comprises surface mount elements positioner, reflow soldering apparatus, surface mount elements assembling detection device, ventilating hole element apparatus for placing, ventilating hole element places checkout gear, Wave-soldering device, ventilating hole element assembling detection device, device for testing functions, described surface mount elements positioner, described reflow soldering apparatus, described surface mount elements assembling detection device, described ventilating hole element apparatus for placing, described ventilating hole element places checkout gear, described Wave-soldering device, described ventilating hole element assembling detection device, described device for testing functions is respectively equipped with the RFID reader 4 described in.Multiple RFID reader 4 can number consecutively, when a certain RFID reader 4 reads RFID 3, just can determine the position of this RFID reader according to the numbering of this RFID reader 4, PCB assembly manipulation judge module 18 is according to the assembly manipulation classification of position judgment in PCB assembling process getting this RFID reader that RFID is encoded; Video file in this PCB assembled body example or operation file is called according to described PCB assembly parameter and described assembly manipulation classification.In PCB assembly equipment 5, corresponding operating means, carries out corresponding operational processes according to operation file to PCB to be assembled.Described operational processes, namely assembles class of operation, comprise surface mount elements location, Reflow Soldering, surface mount elements assembling detect, ventilating hole element place, ventilating hole element place detections, wave-soldering, ventilating hole element assembling detection, functional test.
Be illustrated in figure 7 a kind of implementation method of described printed circuit board assembly information system 10, comprise the steps:
Step S1) gather the extraneous at least one group of PCB assembly knowledge inputted; Each assembling is joined knowledge and is comprised a PCB, the surface mount elements assembly knowledge of corresponding described PCB, ventilating hole element assembly knowledge and PCB functional parameter knowledge on testing; Printed circuit board Assembly Engineer by PCB assembly knowledge described in the typing at least one group in advance of the input equipment (keyboard) of computer to PCB assembly knowledge input module 11.Many groups PCB assembly knowledge difference is corresponding dissimilar, the PCB of different model.
Step S2) instantiation process is carried out to described PCB assembly knowledge, each group PCB assembly knowledge is made to form a PCB assembled body example, the body construction of each PCB assembled body example comprises: a PCB, a surface mount elements load module, a ventilating hole element load module and a PCB functional parameter test module, paster assembly relation is formed between described surface mount elements load module and described PCB, form through hole assembly relation between described ventilating hole element load module and described PCB, between described PCB functional parameter test module and described PCB, form detection relation; Wherein, described surface mount elements load module comprises paster assembly project file, reflow soldering process Parameter File; Described ventilating hole element load module comprises ventilating hole element assembling and detects file, ventilating hole element assembling schematic diagram file and solder wave process Parameter File; Described PCB functional parameter test module comprises image measurement project file, functional test project file; Wherein, described ventilating hole element assembling schematic diagram is video file, and described surface mount elements assembly project file, described reflow soldering process Parameter File, described ventilating hole element assembling detection file, described solder wave process Parameter File, described image measurement project file and described functional test project file are the operation file in PCB assembling process.
Step S3) store at least one PCB assembled body example to described PCB assembled body base module.
Step S4) gather the extraneous at least one group of PCB Back ground Information inputted; Each group Back ground Information comprises resource identifier, PCB sequence number, PCB orders unit, PCB order time, PCB assembles initial time, PCB assembles end time and PCB testing result.Wherein, described resource identifier, namely described PCB assembled body example Uniform Resource Identifier, is a character string, for identifying a resource to be obtained; The composition structure of described resource identifier, comprises successively: access protocal, access domain name, access catalogue and Access Filename; Wherein, described access protocal is for showing the access protocal of described resource to be obtained; Described access domain is called the domain name of resource place to be obtained server; Described access catalogue is the catalogue of described resource to be obtained correspondence on described server; Described access file is called the file name of resource to be obtained.Another composition structure of described PCB assembled body example Uniform Resource Identifier, comprises successively: access protocal, access domain name, access catalogue, Access Filename and resource name; Wherein, described resource name for the mark title of resource to be obtained file pointed by described Access Filename, described resource name be the Alternative Content of described resource identifier.
Step S5) store at least one PCB Back ground Information table to PCB basic information database module 15, described PCB Back ground Information table comprises at least one RFID coding and at least one group of PCB Back ground Information; The corresponding RFID coding of each group Back ground Information.Specifically, the corresponding RFID coding of the resource identifier in each group Back ground Information, same group of PCB Back ground Information is to should resource identifier in group.
Step S6) gather the extraneous at least one group of PCB assembly parameter inputted; Each group PCB assembly parameter comprises the parameters such as Reflow Soldering temperature, wave-soldering temperature, assembly precision threshold value and printed circuit board number to be assembled.Before printed circuit board assembling, by printed circuit board assembly manipulation person by PCB assembly parameter described in input equipment (keyboard) typing at least one group of computer to PCB assembly parameter acquisition module 16.
Step S7) obtain and store in RFID that preliminary treatment is arranged on a printed circuit board to be assembled, encrypted RFID process encodes.Step S7) specifically comprise the steps: step S71) receive described RFID coding, the Interface Matching and the data protocol that realize reader 4 and printed circuit board assembly information system 10 are changed, and make described RFID coding adapt to the data handling requirements of printed circuit board assembly information system 10; Step S72) filtration treatment is carried out to the RFID of corrupted data coding or the RFID coding that repeats to read, ensure that RFID coding 301 enters correctness and the validity of electronic tag coding and decoding module 173 process; And step S73) process (for ensureing the fail safe of data, electronic tag coding 301 is all encrypted in actual applications) of decoding is carried out to the described RFID coding after filtration treatment.
Step S8) according to being arranged on the assembly manipulation classification of position judgment in PCB assembling process on PCB assembly equipment, that obtain the RFID reader of RFID coding; Described assembly manipulation classification comprises surface mount elements location, Reflow Soldering, surface mount elements assembles detection, ventilating hole element is placed, ventilating hole element places detection, wave-soldering, ventilating hole element assemble detection, functional test.PCB assembly equipment 5 comprises surface mount elements positioner, reflow soldering apparatus, surface mount elements assembling detection device, ventilating hole element apparatus for placing, ventilating hole element places checkout gear, Wave-soldering device, ventilating hole element assembling detection device, device for testing functions, described surface mount elements positioner, described reflow soldering apparatus, described surface mount elements assembling detection device, described ventilating hole element apparatus for placing, described ventilating hole element places checkout gear, described Wave-soldering device, described ventilating hole element assembling detection device, described device for testing functions is respectively equipped with the RFID reader 4 described in.Multiple RFID reader 4 can number consecutively, when a certain RFID reader 4 reads RFID 3, just can determine the position of this RFID reader according to the numbering of this RFID reader 4, PCB assembly manipulation judge module 18 is according to the assembly manipulation classification of position judgment in PCB assembling process getting this RFID reader that RFID is encoded.
Step S9) the one group of PCB Back ground Information retrieving corresponding described RFID coding is coded in described PCB basic information database module according to pretreated RFID.
Step S10) obtain described PCB Back ground Information, in described PCB assembled body base module, a PCB assembled body example of corresponding described printed circuit board to be assembled is inquired about according to the described resource identifier in described PCB Back ground Information; Video file in this PCB assembled body example or operation file is called according to described PCB assembly parameter and described assembly manipulation classification.Operation file in described PCB assembled body instantiation module is corresponding with the described assembly manipulation classification in PCB assembly manipulation judge module respectively, alternatively, in PCB assembling process, and the operation file that different assembly manipulation classification is corresponding different.
Step S11) show described video file or export described operation file.PCB file output module 21 comprises a display module 211, be connected to the display of computer, described video file is shown by the display of computer, and a PCB assembly parameter output module 212, be connected to PCB assembly equipment 5, export device corresponding to the operation file called in described operation file to PCB assembly equipment 5, and perform corresponding operation according to described operation file.
Wherein, step S1)-S5) be assembling preparation stage of printed circuit board, set the PCB assembled body base module 13 in printed circuit board assembly information system 10, PCB basic information database module 15 in advance, with for later use.Step S6) refer to before printed circuit board assembling, by printed circuit board assembly manipulation person by input equipment (keyboard) typing at least one group of PCB assembly parameter of computer to PCB assembly parameter acquisition module 16, described PCB assembly parameter is arranged by the printed circuit board assembly manipulation person on PCB production line according to concrete assembling demand.
As shown in Figure 7, the assemble flow of printed circuit board, mainly comprises the surface patch operation of printed circuit board, ventilating hole element assembly process and functional test operation.The surface patch operation of printed circuit board comprises surface mount elements position fixing process S101, reflow process S102 and surface mount elements assembling testing process S103 successively; Ventilating hole element assembly process comprises ventilating hole element put procedure S104 successively, ventilating hole element places testing process S105, wave-soldering process S106 and ventilating hole element assembling testing process S107; Functional test operation and functional test procedures S108.Each operation comprises at least one course of processing, and each process can utilize printed circuit board assembly information system 10 of the present invention to realize.
As shown in Figure 8, surface mount elements position fixing process S101, concrete steps are as follows:
Step S1011) after pending printed circuit board enters surface mount elements positioner, the RFID reader 4 of corresponding described surface mount elements positioner reads RFID 3, obtains RFID coding 301.
Step S1012) RFID data preliminary treatment middleware 17 obtains and preliminary treatment RFID encodes 301;
Step S1013) in described PCB basic information database module, the PCB Back ground Information of corresponding described RFID coding is retrieved according to pretreated RFID coding 301;
Step S1014) assembly parameter acquisition module 16 receive printed circuit board assembly manipulation person input at least one group of PCB assembly parameter; PCB assembly manipulation judge module 18 judges the assembly manipulation classification in PCB assembling process, determines that this assembly manipulation is surface mount elements location;
Step S1015) receive described PCB Back ground Information, in described PCB assembled body base module, inquire about a PCB assembled body example according to the described resource identifier in described PCB Back ground Information; Call to should the operation file of assembly manipulation classification (surface mount elements location) in this PCB assembled body example according to described PCB assembly parameter and assembly manipulation classification (surface mount elements location), i.e. surface mount elements assembly project file;
Step S1016) PCB assembly parameter output module 212 exports the surface mount elements assembly project file of this PCB assembled body example to the surface mount elements positioner in PCB assembly equipment 5;
Step S1017) surface mount elements positioner carries out surface mount elements localization process to pending printed circuit board, is positioned at needing the surface mount elements of location on this printed circuit board.
As shown in Figure 9, reflow process S102, concrete steps are as follows:
Step S1021) after pending printed circuit board enters reflow soldering apparatus, the RFID reader 4 of corresponding described reflow soldering apparatus reads RFID 3, obtains RFID coding 301.
Step S1022) RFID data preliminary treatment middleware 17 obtains and preliminary treatment RFID encodes 301;
Step S1023) in described PCB basic information database module, the PCB Back ground Information of corresponding described RFID coding is retrieved according to pretreated RFID coding 301;
Step S1024) assembly parameter acquisition module 16 receive printed circuit board assembly manipulation person input at least one group of PCB assembly parameter; PCB assembly manipulation judge module 18 judges the assembly manipulation classification in PCB assembling process, determines that this assembly manipulation is Reflow Soldering;
Step S1025) receive described PCB Back ground Information, in described PCB assembled body base module, inquire about a PCB assembled body example according to the described resource identifier in described PCB Back ground Information; Call to should the operation file of assembly manipulation classification (Reflow Soldering) in this PCB assembled body example according to described PCB assembly parameter and assembly manipulation classification (Reflow Soldering), i.e. reflow soldering process Parameter File;
Step S1026) PCB assembly parameter output module 212 exports the reflow soldering process Parameter File of this PCB assembled body example to the reflow soldering apparatus in PCB assembly equipment 5;
Step S1027) reflow soldering apparatus carries out reflow process to pending printed circuit board, location bak stay element is welded on this printed circuit board.
As shown in Figure 10, surface mount elements assembling testing process S103, concrete steps are as follows:
Step S1031) after pending printed circuit board enters surface mount elements assembling detection device, the RFID reader 4 of corresponding described surface mount elements assembling detection device reads RFID 3, obtains RFID coding 301.
Step S1032) RFID data preliminary treatment middleware 17 obtains and preliminary treatment RFID encodes 301;
Step S1033) in described PCB basic information database module, the PCB Back ground Information of corresponding described RFID coding is retrieved according to pretreated RFID coding 301;
Step S1034) assembly parameter acquisition module 16 receive printed circuit board assembly manipulation person input at least one group of PCB assembly parameter; PCB assembly manipulation judge module 18 judges the assembly manipulation classification in PCB assembling process, determines that this assembly manipulation is that surface mount elements assembling detects;
Step S1035) receive described PCB Back ground Information, in described PCB assembled body base module, inquire about a PCB assembled body example according to the described resource identifier in described PCB Back ground Information; Call to should the operation file of assembly manipulation classification (surface mount elements assembling detects) in this PCB assembled body example according to described PCB assembly parameter and assembly manipulation classification (surface mount elements assembling detects), i.e. image measurement project file;
Step S1036) PCB assembly parameter output module 212 exports the image measurement project file of this PCB assembled body example to the surface mount elements assembling detection device in PCB assembly equipment 5;
Step S1037) surface mount elements assembling detection device carries out surface mount elements assembling check processing to pending printed circuit board, to confirm that whether patch location on printed circuit board is correct, judges that whether the printed circuit board (PCB) of paster operation process is qualified.If qualified, surface patch operation terminates, and enters subsequent processing; If defective, manually reprocessed by printed circuit board assembly manipulation person.
As shown in figure 11, ventilating hole element put procedure S104, concrete steps are as follows:
Step S1041) after pending printed circuit board enters described ventilating hole element apparatus for placing, the RFID reader 4 of corresponding described ventilating hole element apparatus for placing reads RFID 3, obtains RFID coding 301.
Step S1042) RFID data preliminary treatment middleware 17 obtains and preliminary treatment RFID encodes 301;
Step S1043) in described PCB basic information database module, the PCB Back ground Information of corresponding described RFID coding is retrieved according to pretreated RFID coding 301;
Step S1044) assembly parameter acquisition module 16 receive printed circuit board assembly manipulation person input at least one group of PCB assembly parameter; PCB assembly manipulation judge module 18 judges the assembly manipulation classification in PCB assembling process, determines that this assembly manipulation is that ventilating hole element is placed;
Step S1045) receive described PCB Back ground Information, in described PCB assembled body base module, inquire about a PCB assembled body example according to the described resource identifier in described PCB Back ground Information; Call in this PCB assembled body example should the operation file of assembly manipulation classification (ventilating hole element placement), i.e. ventilating hole element assembling schematic diagram according to described PCB assembly parameter and assembly manipulation classification (ventilating hole element placement);
Step S1046) display module 211 exports the ventilating hole element assembling schematic diagram of this PCB assembled body example to the display of computer, to show the image of ventilating hole element assembling schematic diagram;
Step S1047) manually placed on the printed circuit board after at least one ventilating hole element to paster processing according to ventilating hole element assembling schematic diagram by printed circuit board assembly manipulation person.
As shown in figure 12, ventilating hole element placement testing process step is as follows:
Step S1051) pending printed circuit board enters described ventilating hole element and places after checkout gear, and the reader 4 that corresponding described ventilating hole element places checkout gear reads RFID 3, obtains RFID coding 301.
Step S1052) RFID data preliminary treatment middleware 17 obtains and preliminary treatment RFID encodes 301;
Step S1053) in described PCB basic information database module, the PCB Back ground Information of corresponding described RFID coding is retrieved according to pretreated RFID coding 301;
Step S1054) assembly parameter acquisition module 16 receive printed circuit board assembly manipulation person input at least one group of PCB assembly parameter; PCB assembly manipulation judge module 18 judges the assembly manipulation classification in PCB assembling process, determines that this assembly manipulation is that ventilating hole element places detection;
Step S1055) receive described PCB Back ground Information, in described PCB assembled body base module, inquire about a PCB assembled body example according to the described resource identifier in described PCB Back ground Information; Call to should the operation file of assembly manipulation classification (ventilating hole element is placed and detected) in this PCB assembled body example according to described PCB assembly parameter and assembly manipulation classification (ventilating hole element is placed and detected), namely ventilating hole element assembling detects file;
Step S1056) PCB assembly parameter output module 212 export this PCB assembled body example ventilating hole element assembling detect file to the ventilating hole element assembling detection device in PCB assembly equipment 5;
Step S1057) ventilating hole element assembling detection device carries out ventilating hole element assembling check processing to placing the printed circuit board after ventilating hole element.If the position that ventilating hole element is placed is wrong, adjusted the position of the ventilating hole element placing mistake by printed circuit board assembly manipulation person; If the position that ventilating hole element is placed is errorless, enter wave-soldering process.
As shown in figure 13, wave-soldering process steps is as follows:
Step S1061) after pending printed circuit board enters described Wave-soldering device, the RFID reader 4 of corresponding described Wave-soldering device reads RFID 3, obtains RFID coding 301.
Step S1062) RFID data preliminary treatment middleware 17 obtains and preliminary treatment RFID encodes 301;
Step S1063) in described PCB basic information database module, the PCB Back ground Information of corresponding described RFID coding is retrieved according to pretreated RFID coding 301;
Step S1064) assembly parameter acquisition module 16 receive printed circuit board assembly manipulation person input at least one group of PCB assembly parameter; PCB assembly manipulation judge module 18 judges the assembly manipulation classification in PCB assembling process, determines that this assembly manipulation is wave-soldering;
Step S1065) receive described PCB Back ground Information, in described PCB assembled body base module, inquire about a PCB assembled body example according to the described resource identifier in described PCB Back ground Information; Call to should the operation file of assembly manipulation classification (wave-soldering) in this PCB assembled body example according to described PCB assembly parameter and assembly manipulation classification (wave-soldering), i.e. solder wave process Parameter File;
Step S1066) PCB assembly parameter output module 212 exports the solder wave process Parameter File of this PCB assembled body example to the Wave-soldering device in PCB assembly equipment 5;
Step S1067) Wave-soldering device carries out wave-soldering process to pending printed circuit board, the ventilating hole element placed is welded on this printed circuit board.
As shown in figure 14, ventilating hole element assembling testing process step is as follows:
Step S1071) after pending printed circuit board enters described ventilating hole element assembling detection device, the RFID reader 4 of corresponding described ventilating hole element assembling detection device reads RFID 3, obtains RFID coding 301.
Step S1072) RFID data preliminary treatment middleware 17 obtains and preliminary treatment RFID encodes 301;
Step S1073) in described PCB basic information database module, the PCB Back ground Information of corresponding described RFID coding is retrieved according to pretreated RFID coding 301;
Step S1074) assembly parameter acquisition module 16 receive printed circuit board assembly manipulation person input at least one group of PCB assembly parameter; PCB assembly manipulation judge module 18 judges the assembly manipulation classification in PCB assembling process, determines that this assembly manipulation is that ventilating hole element assembling detects;
Step S1075) receive described PCB Back ground Information, in described PCB assembled body base module, inquire about a PCB assembled body example according to the described resource identifier in described PCB Back ground Information; Call to should the operation file of assembly manipulation classification (ventilating hole element assembling detection device) in this PCB assembled body example according to described PCB assembly parameter and assembly manipulation classification (ventilating hole element assembling detects), i.e. image measurement project file;
Step S1076) PCB assembly parameter output module 212 exports the image measurement project file of this PCB assembled body example to the ventilating hole element assembling detection device in PCB assembly equipment 5;
Step S1077) ventilating hole element assembling detection device to pending printed circuit board carry out ventilating hole element assembling check processing, to confirm whether the pin of the ventilating hole element on printed circuit board welds well, judge that whether the printed circuit board (PCB) of ventilating hole element assembly process process is qualified.If qualified, ventilating hole element assembly process terminates, and enters subsequent processing; If defective, manually reprocessed by printed circuit board assembly manipulation person.
As shown in figure 15, functional test procedures S108, concrete steps are as follows:
Step S1081) after pending printed circuit board enters described device for testing functions, the RFID reader 4 of corresponding described device for testing functions reads RFID 3, obtains RFID coding 301.
Step S1082) RFID data preliminary treatment middleware 17 obtains and preliminary treatment RFID encodes 301;
Step S1083) in described PCB basic information database module, the PCB Back ground Information of corresponding described RFID coding is retrieved according to pretreated RFID coding 301;
Step S1084) assembly parameter acquisition module 16 receive printed circuit board assembly manipulation person input at least one group of PCB assembly parameter; PCB assembly manipulation judge module 18 judges the assembly manipulation classification in PCB assembling process, determines that this assembly manipulation is functional test;
Step S1085) receive described PCB Back ground Information, in described PCB assembled body base module, inquire about a PCB assembled body example according to the described resource identifier in described PCB Back ground Information; Call to should the operation file of assembly manipulation classification (functional test) in this PCB assembled body example according to described PCB assembly parameter and assembly manipulation classification (functional test), i.e. functional test project file;
Step S1086) PCB assembly parameter output module 212 exports the functional test project file of this PCB assembled body example to the device for testing functions in PCB assembly equipment 5;
Step S1087) device for testing functions is according to the test environment of the functional test project file of this PCB assembled body example configuration printed circuit board functional test equipment; By the manual connecting test cable of printed circuit board assembly manipulation person, functional test is carried out to printed circuit board.If functional test results is that product is qualified, then functional test operation terminates; If functional test results is that product is defective, underproof printed circuit board is manually reprocessed.
The above is only the preferred embodiment of the present invention; should be understood that; those skilled in the art are under the prerequisite not departing from the principle of the invention and technical scheme, and can also make some improvements and modifications to this, these improvements and modifications also should be considered as protection scope of the present invention.

Claims (6)

1. a printed circuit board assembly information system, is characterized in that, comprising:
One PCB assembly knowledge acquisition module, for gathering at least one group of PCB assembly knowledge of extraneous input; Each assembling is joined knowledge and is comprised a PCB, the surface mount elements assembly knowledge of corresponding described PCB, ventilating hole element assembly knowledge and PCB functional parameter knowledge on testing;
One PCB assembled body instantiation module, for carrying out instantiation process to described PCB assembly knowledge, each group PCB assembly knowledge is made to form a PCB assembled body example, the body construction of each PCB assembled body example comprises: a PCB, one surface mount elements load module, one ventilating hole element load module and a PCB functional parameter test module, paster assembly relation is formed between described surface mount elements load module and described PCB, through hole assembly relation is formed between described ventilating hole element load module and described PCB, detection relation is formed between described PCB functional parameter test module and described PCB, wherein, described surface mount elements load module comprises paster assembly project file, reflow soldering process Parameter File, described ventilating hole element load module comprises ventilating hole element assembling and detects file, ventilating hole element assembling schematic diagram file and solder wave process Parameter File, described PCB functional parameter test module comprises image measurement project file, functional test project file, wherein, described ventilating hole element assembling schematic diagram is video file, and described surface mount elements assembly project file, described reflow soldering process Parameter File, described ventilating hole element assembling detection file, described solder wave process Parameter File, described image measurement project file and described functional test project file are the operation file in PCB assembling process,
One PCB assembled body base module, for storing at least one PCB assembled body example;
One PCB basic information collection module, for gathering at least one group of PCB Back ground Information of extraneous input; Each group Back ground Information comprises resource identifier, PCB sequence number, PCB orders unit, PCB order time, PCB assembles initial time, PCB assembles end time and PCB testing result;
One PCB basic information database module, for storing at least one PCB Back ground Information table, described PCB Back ground Information table comprises at least one RFID coding and at least one group of PCB Back ground Information; The corresponding RFID coding of each group Back ground Information;
One PCB assembly parameter acquisition module, for gathering at least one group of PCB assembly parameter of extraneous input; Each group PCB assembly parameter comprises Reflow Soldering temperature, wave-soldering temperature, assembly precision threshold value and printed circuit board number to be assembled;
One RFID data preliminary treatment middleware, for obtaining and store, the encrypted RFID coding processed in RFID that preliminary treatment is arranged on a printed circuit board to be assembled;
One PCB assembly manipulation judge module, is arranged on the assembly manipulation classification of position judgment in PCB assembling process on PCB assembly equipment, that obtain the RFID reader of RFID coding for basis; Described assembly manipulation classification comprises surface mount elements location, Reflow Soldering, surface mount elements assembles detection, ventilating hole element is placed, ventilating hole element places detection, wave-soldering, ventilating hole element assemble detection, functional test;
One PCB information searching module, for being coded in described PCB basic information database module the one group of PCB Back ground Information retrieving corresponding described RFID coding according to pretreated RFID;
One PCB KnowledgeBase-query module, for obtaining described PCB Back ground Information, inquires about a PCB assembled body example of corresponding described printed circuit board to be assembled in described PCB assembled body base module according to the described resource identifier in described PCB Back ground Information; Video file in this PCB assembled body example or operation file is called according to described PCB assembly parameter and described assembly manipulation classification; And
One PCB file output module, for showing described video file or exporting described operation file; Described PCB file output module comprises a display module, for showing described video file, and a PCB assembly parameter output module, for exporting described operation file.
2. printed circuit board assembly information system as claimed in claim 1, it is characterized in that, described RFID data preliminary treatment middleware comprises:
One reader communication interface module, for receiving described RFID coding;
One RFID encoding filter module, carries out filtration treatment for the RFID coding of encoding to the RFID of corrupted data or repeat to read; And
One RFID coding and decoding module, for carrying out decoding process to the described RFID coding after filtration treatment.
3. a printed circuit board assembly system, comprising:
At least one printed circuit board to be assembled;
At least one RFID, each printed circuit board to be assembled is provided with a RFID, for storing the RFID coding of corresponding described printed circuit board to be assembled;
At least one RFID reader, is wirelessly connected to described RFID, for reading described RFID coding;
One computer, is provided with printed circuit board assembly information system as claimed in claim 1 or 2; Described computer is connected to described RFID reader, for identifying RFID coding in described RFID, retrieves one group of PCB Back ground Information, the PCB assembled body example inquired about in described PCB assembled body base module of corresponding described RFID coding, calls and display of visually file, call and export described operation file; And
At least one PCB assembly equipment, is connected to described computer, for obtaining described operation file and carrying out assembly manipulation according to described operation file to described printed circuit board to be assembled; Each PCB assembly equipment is provided with at least one described RFID reader.
4. printed circuit board assembly system as claimed in claim 3, it is characterized in that, described PCB assembly equipment comprises surface mount elements positioner, reflow soldering apparatus, surface mount elements assembling detection device, ventilating hole element apparatus for placing, ventilating hole element places checkout gear, Wave-soldering device, ventilating hole element assembling detection device, device for testing functions, described surface mount elements positioner, described reflow soldering apparatus, described surface mount elements assembling detection device, described ventilating hole element apparatus for placing, described ventilating hole element places checkout gear, described Wave-soldering device, described ventilating hole element assembling detection device, described device for testing functions is respectively equipped with the RFID reader described in.
5. an implementation method for printed circuit board assembly information system as claimed in claim 1, is characterized in that, comprise the steps:
Gather at least one group of PCB assembly knowledge of extraneous input; Each assembling is joined knowledge and is comprised a PCB, the surface mount elements assembly knowledge of corresponding described PCB, ventilating hole element assembly knowledge and PCB functional parameter knowledge on testing;
Instantiation process is carried out to described PCB assembly knowledge, each group PCB assembly knowledge is made to form a PCB assembled body example, the body construction of each PCB assembled body example comprises: a PCB, a surface mount elements load module, a ventilating hole element load module and a PCB functional parameter test module, paster assembly relation is formed between described surface mount elements load module and described PCB, form through hole assembly relation between described ventilating hole element load module and described PCB, between described PCB functional parameter test module and described PCB, form detection relation; Wherein, described surface mount elements load module comprises paster assembly project file, reflow soldering process Parameter File; Described ventilating hole element load module comprises ventilating hole element assembling and detects file, ventilating hole element assembling schematic diagram file and solder wave process Parameter File; Described PCB functional parameter test module comprises image measurement project file, functional test project file; Wherein, described ventilating hole element assembling schematic diagram is video file, and described surface mount elements assembly project file, described reflow soldering process Parameter File, described ventilating hole element assembling detection file, described solder wave process Parameter File, described image measurement project file and described functional test project file are the operation file in PCB assembling process;
Store at least one PCB assembled body example to described PCB assembled body base module;
Gather at least one group of PCB Back ground Information of extraneous input; Each group Back ground Information comprises resource identifier, PCB sequence number, PCB orders unit, PCB order time, PCB assembles initial time, PCB assembles end time and PCB testing result;
Store at least one PCB Back ground Information table, described PCB Back ground Information table comprises at least one RFID coding and at least one group of PCB Back ground Information; The corresponding RFID coding of each group Back ground Information;
Gather at least one group of PCB assembly parameter of extraneous input; Each group PCB assembly parameter comprises Reflow Soldering temperature, wave-soldering temperature, assembly precision threshold value and printed circuit board number to be assembled;
Acquisition and preliminary treatment are arranged on that store in the RFID on a printed circuit board to be assembled, the encrypted RFID coding processed;
According to being arranged on the assembly manipulation classification of position judgment in PCB assembling process on PCB assembly equipment, that obtain the RFID reader of RFID coding; Described assembly manipulation classification comprises surface mount elements location, Reflow Soldering, surface mount elements assembles detection, ventilating hole element is placed, ventilating hole element places detection, wave-soldering, ventilating hole element assemble detection, functional test;
The one group of PCB Back ground Information retrieving corresponding described RFID coding is coded in described PCB basic information database module according to pretreated RFID;
Obtain described PCB Back ground Information, in described PCB assembled body base module, inquire about a PCB assembled body example of corresponding described printed circuit board to be assembled according to the described resource identifier in described PCB Back ground Information; Video file in this PCB assembled body example or operation file is called according to described PCB assembly parameter and described assembly manipulation classification; And
Show described video file or export described operation file.
6. the implementation method of printed circuit board assembly information system as claimed in claim 5, it is characterized in that, acquisition and preliminary treatment are arranged on that store in the RFID on a printed circuit board to be assembled, the encrypted RFID coding processed, and comprise the steps:
Receive described RFID coding;
The RFID coding of encoding to the RFID of corrupted data or repeat to read carries out filtration treatment; And
Decoding process is carried out to the described RFID coding after filtration treatment.
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