CN104900956A - Device for switching waveguide to substrate integrated waveguide - Google Patents

Abstract

The invention discloses a device for switching a waveguide to a substrate integrated waveguide. The device comprises a special waveguide and a substrate integrated waveguide; the substrate integrated waveguide consists of a top metal layer, a dielectric substrate and a bottom metal layer; the top metal layer is etched with first multi-folding fin line gaps; the bottom metal layer is etched with second multi-folding fin line gaps; the special waveguide comprises an upper metal block and a lower metal block, the upper metal block is provided with a first waveguide slot, and the lower metal block is provided with a second waveguide slot and a substrate slot; the substrate integrated waveguide is put into the substrate slot, the first multi-folding fin line gaps are matched and aligned with the first waveguide slot, and the second multi-folding fin line gaps are matched and aligned with the second waveguide slot; and the first waveguide slot and the second waveguide slot form a waveguide opening of a standard waveguide. The device has the advantages of wide band, low insertion loss, low reflection coefficient, low machining cost, low machining difficulty and small size, so the device is favorable for large-scale production and application.

Description

A kind of waveguide is to the conversion equipment of substrate integration wave-guide

Technical field

The present invention relates to a kind of conversion equipment of waveguide to substrate integration wave-guide carrying out special waveguide and the substrate integration wave-guide in surface etch many foldings fin line gap to be communicated with rear formation, belong to microwave and millimeter wave device arts.

Background technology

In microwave radio commu system, microwave circuit is very important underlying hardware always, is thus subject to the very large attention of people.In 19 end of the centurys, the development of Electromagnetic Fields & Magnetic Waves theory, has expedited the emergence of the basic conception of microwave circuit, and guided wave structure formed be the basis of microwave circuit, be related to the overall performance of microwave system.Guided wave structure formedly be developed at the beginning of 21 century, research worker proposes low-loss, easy of integration, miniaturized substrate integration wave-guide, indicates guided wave structure formedly to be developed to the new stage.

Microwave circuit is divided into the module of multiple difference in functionality usually.In order to discrimination circuit function, and the convenient needs transplanted and test, each module of microwave circuit needs design separately and test usually, and the microwave circuit comprising substrate integrated wave guide structure needs use joint to carry out connecting test usually.

In below 50GHz frequency range, people test with coaxial fitting usually.But for the frequency range of more than 50GHz, coaxial fitting is expensive especially, and be especially easily interfered at so high frequency range coaxial fitting and coaxial cable, penalty is very serious, and therefore, people use traditional metal waveguide to carry out connecting and testing usually.Current substrate integration wave-guide is excessive to the switching technique loss of waveguide, and bandwidth of operation is narrower, and difficulty of processing is very large, which greatly limits the development of substrate integration wave-guide circuit, brings very large obstruction to the design of substrate integration wave-guide circuit and test.Therefore, broadband, high-performance, easy waveguide of processing have very important Research Significance to the conversion equipment of substrate integration wave-guide.

Summary of the invention

Goal of the invention: in order to overcome the deficiencies in the prior art, the invention provides a kind of conversion equipment of waveguide to substrate integration wave-guide being applicable to microwave and millimeter wave device arts, this conversion equipment has the advantages such as easy processing, low cost, low reflection coefficient, low-loss and broadband operation.

To achieve these goals, the technical solution used in the present invention is: a kind of waveguide, to the conversion equipment of substrate integration wave-guide, comprises special waveguide (1) and substrate integration wave-guide (7); Described substrate integration wave-guide (7) comprises the top layer metallic layer (8), dielectric substrate (9), the bottom metal layer (10) that set gradually from top to bottom, and described substrate integration wave-guide (7) is provided with two rows' plated-through hole (11) of running through top layer metallic layer (8), dielectric substrate (9), bottom metal layer (10); Described top layer metallic layer (8) is etched with a pair more than first foldings fin line gap (12) simultaneously, these a pair more than first foldings fin line gap (12) are arranged at the horizontal two ends of top layer metallic layer (8), and being positioned between two row's plated-through holes (11), the longitudinal centre line simultaneously about top layer metallic layer (8) is symmetrical; And described bottom metal layer (10) is etched with a pair more than second foldings fin line gap (13), these a pair more than second foldings fin line gap (13) are arranged at the horizontal two ends of bottom metal layer (10), and being positioned between two row's plated-through holes (11), the longitudinal centre line simultaneously about bottom metal layer (10) is symmetrical; Described special waveguide (1) comprises metal derby (2) and lower metal derby (3), and upper metal derby (2) and lower metal derby (3) are oppositely arranged; Described upper metal derby (2) offers to roll over fin line gap (12) and to match the first wave guide groove (4) alignd with more than first, simultaneously described lower metal derby (3) offers and to roll over fin line gap (13) with more than second and to match the Second Wave guide groove (5) alignd, and lower metal derby (3) offers the substrate slot (6) matched with substrate integration wave-guide (4) profile; Described substrate integration wave-guide (7) puts into substrate slot (6), and roll over fin line gap (12) more first and mate with first wave guide groove (4) and align, folding fin line gap (13) more than second and Second Wave guide groove (5) mate and align; And the waveguide mouth of first wave guide groove (4) and the standard waveguide of Second Wave guide groove (5) composition.

Preferred: described special waveguide (1) offers for installing with standard waveguide the screwed hole and pin hole that are connected.

Preferred: the horizontal direction of described more than first foldings fin line gap (12) and folding fin line gap (13) more than second is all positioned at the middle of substrate integration wave-guide (7); And folding fin line gap (12) rolls over fin line gap (13) in downward projection about longitudinal symmetry with more than second more than first.

Preferred: described more than first foldings fin line gap (12) and more than second are rolled over fin line gap (13) and are the identical many foldings fin line gap of structure; Described first wave guide groove (4), Second Wave guide groove (5) are the identical waveguide slot of structure; The profile in described many folding fin line gaps is by two mutually perpendicular straightway A and straightway B, and a curved section C be made up of many straightways forms, and the length of described straightway A is identical with the lateral length of waveguide slot, the length of described straightway B is identical with longitudinal total length of curved section C, and head and the tail are connected mutually successively between straightway A, straightway B and curved section C, form the profile of more than first foldings fin line gap (12) or folding fin line gap (13) more than second.

Preferred: described many folding fin line gaps are provided with wedge grading structure, this wedge grading structure is more than first foldings fin line gap (12) and rolls over overlap is hinted obliquely in fin line gap (13) part at top layer metallic layer (8) and bottom metal layer (10) more second.

Preferred: longitudinal total length of described first wave guide groove (4) is longer than the longitudinal total length rolling over fin line gap (12) first more; Longitudinal total length of Second Wave guide groove (5) is longer than the longitudinal total length rolling over fin line gap (13) second more.

Preferred: described substrate slot (6) transverse width is identical with substrate integration wave-guide (7) width, the vertical direction degree of depth of described substrate slot (6) is identical with the thickness of substrate integration wave-guide (7); Described Second Wave guide groove (5) is positioned at the middle of substrate slot (6) in a lateral direction; Described Second Wave guide groove (5) vertical direction depth ratio first wave guide groove (4) the vertical direction degree of depth is greater than the thickness of half substrate integration wave-guide (7).

Preferred: carry out equivalent substrate integration wave-guide with Filled Dielectrics rectangular waveguide, the medium of this medium and described substrate integration wave-guide has identical characteristics, then the equivalent formulation between substrate integration wave-guide (7) and Filled Dielectrics rectangular waveguide is:

$W_{\mathrm{RWG}}=W_{\mathrm{SIW}}\×[{\mathrm{\ξ}}_1+\frac{{\mathrm{\ξ}}_2}{s/d+({\mathrm{\ξ}}_1+{\mathrm{\ξ}}_2-{\mathrm{\ξ}}_3)/({\mathrm{\ξ}}_3-{\mathrm{\ξ}}_1)}];$

${\mathrm{\ξ}}_1=1.0198+\frac{0.3465}{W_{\mathrm{SIW}}/s-1.0684};$

${\mathrm{\ξ}}_2=-0.1183-\frac{1.2729}{W_{\mathrm{SIW}}/s-1.2010};$

${\mathrm{\ξ}}_3=1.0082=-\frac{0.9163}{W_{\mathrm{SIW}}/s+0.2152};$

Wherein, d is plated-through hole diameter, and s is adjacent metal through hole centre distance, W _sIWfor the distance between the center line that two row's plated-through holes of described substrate integration wave-guide arrange, W _rWGfor the length of the longer sides in cross section in corresponding equivalent traditional sucrose rectangular waveguide;

Or, when s is enough little, meet equivalent waveguide width W simultaneously _rWGbetween W _sIWand W _sIWtime between-d, the equivalent formulation between corresponding substrate integration wave-guide (7) and Filled Dielectrics rectangular waveguide is:

$W_{\mathrm{RWG}}=W_{\mathrm{SIW}}-\frac{d^2}{0.95\×s}.$

Preferred: at millimeter wave frequency band, described plated-through hole (11) diameter is 0.3mm-1mm; Adjacent metal through hole (11) centre distance is 0.6mm-2mm.

Preferred: when operating frequency is at f _cto 2f _cbetween time, substrate integration wave-guide only transmits accurate TE ₁₀mould; Wherein main mould cut-off frequency c is the light beam in vacuum, μ _r=1, ε _rfor the relative dielectric constant of dielectric substrate, accurate TE ₁₀mould cut-off wavelength λ _c=2W _rWG, W _rWGfor the length of the longer sides in cross section in corresponding equivalent traditional sucrose rectangular waveguide.

Beneficial effect

A kind of waveguide provided by the invention, to the conversion equipment of substrate integration wave-guide, compared to existing technology, has following beneficial effect:

1) the special waveguiding structure of the present invention is simply compact, and difficulty of processing is little, and processing cost is low, is convenient to low cost, large-scale production and use.

2) substrate integration wave-guide in layer on surface of metal etching of the present invention many foldings fin line gap can utilize common PCB technology to process, and precision is high, reproducible, is applicable to producing low-costly and in high volume.

3) described conversion equipment is enclosed construction, all enter in many folding fin line structures from the electromagnetic wave entered the waveguide mouth of special waveguide, all enter substrate integration wave-guide from many folding fin line structures again, there is no electromagnetic leakage and radiation, thus little on peripheral circuits impact, can carry out integrated with rear class radio circuit easily.

4) described conversion equipment working band is wide, and reflection coefficient is low, and insertion loss is low.Test result in embodiment of the present invention shows, the relative bandwidth of conversion equipment work reaches 40%, in whole V-band, insertion loss is 1.28-1.52dB, reflection coefficient <-18.1dB, wherein, in 50-72GHz, insertion loss is 1.28-1.42dB, reflection coefficient <-20dB.

Accompanying drawing explanation

Fig. 1 is the conversion device structure schematic diagram of waveguide of the present invention to substrate integration wave-guide.

Fig. 2 is the structural representation in many folding fin line gaps of the present invention.

Fig. 3 is the end view of special waveguide 1 in embodiment 1.

Fig. 4 is the vertical view of substrate integration wave-guide 7 in embodiment 1.

Fig. 5 is the emulation of embodiment 1 and the S parameter comparison diagram of test.

Have in figure: 1 be special waveguide, 2 be upper metal derby, 3 be lower metal derby, 4 be first wave guide groove, 5 be Second Wave guide groove, 6 be substrate slot, 7 be substrate integration wave-guide, 8 be top layer metallic layer, 9 be dielectric substrate, 10 to be two row's plated-through holes, 12 be that more than first folding fin line gaps, 13 are that more than second to roll over fin line gaps, 14 be the 3rd waveguide slot, 15 is the 4th waveguide slot for bottom metal layer, 11, D is wedge grading structure.

Embodiment

Below in conjunction with accompanying drawing, the present invention is further described.

Waveguide, to a conversion equipment for substrate integration wave-guide, as shown in Figure 1, comprises special waveguide 1 and substrate integration wave-guide 7; Described substrate integration wave-guide 7 comprises the top layer metallic layer 8, dielectric substrate 9, the bottom metal layer 10 that set gradually from top to bottom, and described substrate integration wave-guide 7 is provided with the two row's plated-through holes 11 running through top layer metallic layer 8, dielectric substrate 9, bottom metal layer 10.

First, carry out equivalent described substrate integration wave-guide with Filled Dielectrics rectangular waveguide, the medium of this medium and described substrate integration wave-guide has identical characteristics; Traditionally Filled Dielectrics rectangular waveguide transmission theory, calculates the length of the longer sides in the interior cross section of corresponding traditional sucrose rectangular waveguide; According to described length, and the equivalent formulation between substrate integration wave-guide and Filled Dielectrics rectangular waveguide, the distance between the center line that the two row's plated-through holes calculating described substrate integration wave-guide arrange, ensures only to propagate accurate TE in substrate integration wave-guide ₁₀pattern.Shown equivalent formulation between substrate integration wave-guide 7 and Filled Dielectrics rectangular waveguide is:

$W_{\mathrm{RWG}}=W_{\mathrm{SIW}}\&times;[{\mathrm{\&xi;}}_1+\frac{{\mathrm{\&xi;}}_2}{s/d+({\mathrm{\&xi;}}_1+{\mathrm{\&xi;}}_2-{\mathrm{\&xi;}}_3)/({\mathrm{\&xi;}}_3-{\mathrm{\&xi;}}_1)}];$

${\mathrm{\&xi;}}_1=1.0198+\frac{0.3465}{W_{\mathrm{SIW}}/s-1.0684};$

${\mathrm{\&xi;}}_2=-0.1183-\frac{1.2729}{W_{\mathrm{SIW}}/s-1.2010};$

${\mathrm{\&xi;}}_3=1.0082=-\frac{0.9163}{W_{\mathrm{SIW}}/s+0.2152};$

Wherein, d is plated-through hole diameter, and s is adjacent metal through hole centre distance, W _sIWfor the distance between the center line that two row's plated-through holes of described substrate integration wave-guide arrange, W _rWGfor the length of the longer sides in cross section in corresponding equivalent traditional sucrose rectangular waveguide;

Or, when s is enough little, meet equivalent waveguide width W simultaneously _rWGbetween W _sIWand W _sIWtime between-d, the equivalent formulation between corresponding substrate integration wave-guide 7 and Filled Dielectrics rectangular waveguide is:

$W_{\mathrm{RWG}}=W_{\mathrm{SIW}}-\frac{d^2}{0.95\&times;s}.$

The main mould of substrate integration wave-guide, i.e. accurate TE ₁₀mould cut-off wavelength λ _c=2W _rWG, main mould cut-off frequency wherein, c is the light beam in vacuum, μ _r=1, ε _rfor the relative dielectric constant of dielectric substrate.When operating frequency is at f _cto 2f _cbetween time, substrate integration wave-guide only transmits accurate TE ₁₀mould.

At millimeter wave frequency band, described plated-through hole 11 diameter is 0.3mm-1mm; Adjacent metal through hole 11 centre distance is 0.6mm-2mm.

Select suitable dielectric material, just determine the relative dielectric constant of substrate, thus the distance W that the substrate integration wave-guide two of satisfying the demand arranges metal throuth hole wall can be calculated _sIW, and the width of described dielectric substrate 9 needs slightly larger than W _sIWto ensure that metal through-hole wall is completely inside dielectric substrate.

As shown in Figure 3,4, described top layer metallic layer 8 is etched with a pair more than first folding fin line gaps 12, these a pair more than first folding fin line gaps 12 are arranged at the two ends of top layer metallic layer 8 transverse direction, and between two row's plated-through holes 11, the longitudinal centre line simultaneously about top layer metallic layer 8 is symmetrical; And described bottom metal layer 10 is etched with a pair more than second folding fin line gaps 13, these a pair more than second folding fin line gaps 13 are arranged at the two ends of bottom metal layer 10 transverse direction, and between two row's plated-through holes 11, the longitudinal centre line simultaneously about bottom metal layer 10 is symmetrical; The horizontal direction in described more than first folding fin line gaps 12 and more than second folding fin line gaps 13 is all positioned at the middle of substrate integration wave-guide 7; And fin line gap 13 is rolled in downward projection about longitudinal symmetry in the fin line gap 12 and more than second of folding more than first.

Described more than first folding fin line gaps 12 and more than second are rolled over fin line gap 13 and are the identical many foldings fin line gap of structure; Described first wave guide groove 4, Second Wave guide groove 5 be the waveguide slot that structure is identical; As shown in Figure 2, the profile in described many folding fin line gaps is by two mutually perpendicular straightway A and straightway B, and a curved section C be made up of many straightways forms; The length of described straightway A is identical with the lateral length of waveguide slot, the length of described straightway B is identical with longitudinal total length of curved section C, and head and the tail are connected mutually successively between straightway A, straightway B and curved section C, form the profile in more than first folding fin line gaps 12 or more than second folding fin line gaps 13.

Described more than first folding fin line gaps 12 and more than second are rolled over fin line gap 13 and are extended certain length in a longitudinal direction from the narrow limit of described substrate integration wave-guide 7 in a longitudinal direction, the part of same length is extended in a longitudinal direction from the described narrow limit of described substrate integration wave-guide 7, comprise described special waveguide 1 and the part of substrate integration wave-guide 7 within the scope of this, common composition many foldings fin line structure.

Described many folding fin line gaps are provided with wedge grading structure, described substrate integration wave-guide 7 is hinted obliquely at overlapping part at top layer metallic layer 8 and bottom metal layer 10 and is formed wedge grading structure after etching the fin line gap of folding more than first 12 and more than second folding fin line gaps 13.

In described many foldings fin line structure, the part of the equal covering metal layer of levels is wedge grading structure, described wedge grading structure is the core that substrate integration wave-guide arrives the impedance transformation of waveguide, the length of Reasonable adjustment wedge grading structure and gradual change form be realize described in the waveguide key of mating to the conversion equipment middle impedance of substrate integration wave-guide.

Described curved section C is made up of more than three (comprising three) continuous print line segments, to ensure that described many folding fin line structures can realize the good impedance matching from waveguide to substrate integration wave-guide.

Longitudinal total length of described first wave guide groove 4 is longer than the longitudinal total length rolling over fin line gap 12 first more; Longitudinal total length of Second Wave guide groove 5 is longer than the longitudinal total length rolling over fin line gap 13 second more.

The concrete structure parameter in described more than first folding fin line gaps 12 and more than second folding fin line gaps 13, needs by utilizing electromagnetic simulation software (as Ansys HFSS etc.) simulation optimization to obtain.

Longitudinal total length of described first wave guide groove 4 is longer than the longitudinal total length rolling over fin line gap 12 first more; Longitudinal total length of Second Wave guide groove 5 is longer than the longitudinal total length rolling over fin line gap 13 second more.Longitudinal total length of described first wave guide groove 4 is longer than longitudinal total length in the fin line of folding more than first gap 12 by 1 to 2mm; Longitudinal total length of Second Wave guide groove 5 is longer than longitudinal total length in the fin line of folding more than second gap 13 by 1 to 2mm.

As shown in Figure 1, described special waveguide 1 comprises metal derby 2 and lower metal derby 3, and upper metal derby 2 and lower metal derby 3 are oppositely arranged; Described upper metal derby 2 offers to be rolled over fin line gap 12 and to match the first wave guide groove 4 alignd with more than first, simultaneously described lower metal derby 3 offers and to roll over fin line gap 13 with more than second and to match the Second Wave guide groove 5 alignd, and lower metal derby 3 offers the substrate slot 6 matched with substrate integration wave-guide 4 profile; Described substrate integration wave-guide 7 puts into substrate slot 6, and rolls over fin line gap 12 more first and mate with first wave guide groove 4 and align, and folding fin line gap 13 more than second and Second Wave guide groove 5 coupling are alignd; And first wave guide groove 4 and Second Wave guide groove 5 form the waveguide mouth of a standard waveguide.

Described substrate slot 6 transverse width is identical with substrate integration wave-guide 7 width, and the vertical direction degree of depth of described substrate slot 6 is identical with the thickness of substrate integration wave-guide 7; Described Second Wave guide groove 5 is positioned at the middle of substrate slot 6 in a lateral direction; The described Second Wave guide groove 5 vertical direction depth ratio first wave guide groove 4 vertical direction degree of depth is greater than the thickness of half substrate integration wave-guide 7.The described Second Wave guide groove 5 vertical direction degree of depth does not comprise the degree of depth of described substrate slot 6.

Because described first wave guide groove 4 and Second Wave guide groove 5 are positioned at the middle of described substrate slot 6 in a lateral direction, again because described more than first folding fin line gaps 12 and more than second folding fin line gap 13 horizontal directions are positioned at the middle of substrate integration wave-guide 7, so, described substrate integration wave-guide 7 is put into described substrate slot 6, close after described upper metal derby 2 and described lower metal derby 3, described first wave guide groove 4 and described more than first is rolled over fin line gap 12 and is just in time alignd, and described Second Wave guide groove 5 and described more than second is rolled over fin line gap 13 and just in time alignd; Described upper metal derby 2 and described lower metal derby 3 are compressed described substrate integration wave-guide 7, the described special waveguide 1 of composition jointly of described upper metal derby 2 and described lower metal derby 3, described first wave guide groove 4 and Second Wave guide groove 5 form the waveguide mouth of the standard waveguide that completes; Described standard waveguide refers to the ordinary rectangular hollow metal waveguide of the required working frequency range in national standard, and its standard a nd norm is shown in GB GB-T11450.2-1989.

The conveniently connection of described special waveguide and standard waveguide, be provided with for installing with standard waveguide the screwed hole and pin hole that are connected at the side opening of the open waveguide groove of special waveguide 1, the size in described hole is identical with position with the size of respective aperture in standard waveguide ring flange with position; Described standard waveguide ring flange refers to the normal rectangular waveguide ring flange of required working frequency range, and state's label of its specification is GB-T11449.2-1989; Special waveguide 1 is connected with the standard waveguide of required working frequency range, the waveguide mouth of described special waveguide just in time with the waveguide mouth seamless link of described standard waveguide.

Example:

Be applicable to V-band, namely 50GHz-75GHz waveguide to substrate integration wave-guide conversion device structure as shown in the figure.Conveniently test, this example takes back-to-back type structure, namely devises waveguide-substrate integration wave-guide-Waveguide conversion device.

Upper metal derby 2 and lower metal derby 3 size of special waveguide 1 are 22.0mm × 30.0mm × 10.0mm, and material is all copper, and substrate slot 6 is of a size of 11.0mm × 30.0mm × 0.28mm; The waveguide mouth overall size of special waveguide 1 is 1.88mm × 9.0mm × 3.759m; Distance between the center line of two row's plated-through hole row of substrate integration wave-guide 7 is 2.814mm, and adjacent through-holes center distance is 0.6mm, and through-hole diameter is 0.4mm; Top layer metallic layer 8 and bottom metal layer 10 thickness are 0.018mm; Dielectric substrate 9 is of a size of 11.0mm × 30.0mm × 0.254mm, and material is Rogers 5880, and relative dielectric constant is 2.2; Curved section C in the profile of many foldings fin line gap is made up of five straightways, and longitudinal total length of curved section C is 7.0mm; Because what adopt is back-to-back type structure, so all open screwed hole and pin hole in two sides of special waveguide 1, the size in described hole is identical with position with the size of respective aperture in the standard waveguide ring flange of V-band with position, and the specification of described V-band standard waveguide ring flange is shown in GB GB-T11449.2-1989; Some screwed holes are opened and pin hole is fixing to facilitate in upper metal derby 2 and lower metal derby 3.

The S parameter goodness of fit of the simulate and test of this example is high, and Fig. 5 is shown in the contrast of the two.Test result shows, this conversion equipment working frequency range is V-band, relative bandwidth reaches 40% (50GHz-75GHz), in whole V-band, insertion loss is 1.28-1.52dB, reflection coefficient <-18.1dB, wherein, in 50-72GHz, insertion loss is 1.28-1.42dB, reflection coefficient <-20dB.Above-mentioned test result includes containing the special waveguide of two waveguide mouths, the loss of rolling over fin line structure and the long substrate integration wave-guide of one section of 16mm two more, the present embodiment achieve broadband, low insertion loss, low reflection coefficient, easily processing V-band waveguide to the conversion equipment of substrate integration wave-guide.

The above is only the preferred embodiment of the present invention; be noted that for those skilled in the art; under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.

Claims (10)

1. waveguide is to a conversion equipment for substrate integration wave-guide, it is characterized in that: comprise special waveguide (1) and substrate integration wave-guide (7); Described substrate integration wave-guide (7) comprises the top layer metallic layer (8), dielectric substrate (9), the bottom metal layer (10) that set gradually from top to bottom, and described substrate integration wave-guide (7) is provided with two rows' plated-through hole (11) of running through top layer metallic layer (8), dielectric substrate (9), bottom metal layer (10); Described top layer metallic layer (8) is etched with a pair more than first foldings fin line gap (12) simultaneously, these a pair more than first foldings fin line gap (12) are arranged at the horizontal two ends of top layer metallic layer (8), and being positioned between two row's plated-through holes (11), the longitudinal centre line simultaneously about top layer metallic layer (8) is symmetrical; And described bottom metal layer (10) is etched with a pair more than second foldings fin line gap (13), these a pair more than second foldings fin line gap (13) are arranged at the horizontal two ends of bottom metal layer (10), and being positioned between two row's plated-through holes (11), the longitudinal centre line simultaneously about bottom metal layer (10) is symmetrical; Described special waveguide (1) comprises metal derby (2) and lower metal derby (3), and upper metal derby (2) and lower metal derby (3) are oppositely arranged; Described upper metal derby (2) offers to roll over fin line gap (12) and to match the first wave guide groove (4) alignd with more than first, simultaneously described lower metal derby (3) offers and to roll over fin line gap (13) with more than second and to match the Second Wave guide groove (5) alignd, and lower metal derby (3) offers the substrate slot (6) matched with substrate integration wave-guide (4) profile; Described substrate integration wave-guide (7) puts into substrate slot (6), and roll over fin line gap (12) more first and mate with first wave guide groove (4) and align, folding fin line gap (13) more than second and Second Wave guide groove (5) mate and align; And the waveguide mouth of first wave guide groove (4) and the standard waveguide of Second Wave guide groove (5) composition.

2. waveguide according to claim 1 is to the conversion equipment of substrate integration wave-guide, it is characterized in that: described special waveguide (1) offers for installing with standard waveguide the screwed hole and pin hole that are connected.

3. waveguide according to claim 1 is to the conversion equipment of substrate integration wave-guide, it is characterized in that: the horizontal direction of described more than first foldings fin line gap (12) and folding fin line gap (13) more than second is all positioned at the middle of substrate integration wave-guide (7); And folding fin line gap (12) rolls over fin line gap (13) in downward projection about longitudinal symmetry with more than second more than first.

4. waveguide according to claim 3 is to the conversion equipment of substrate integration wave-guide, it is characterized in that: described more than first foldings fin line gap (12) and more than second are rolled over fin line gap (13) and are the identical many foldings fin line gap of structure; Described first wave guide groove (4), Second Wave guide groove (5) be the waveguide slot that structure is identical; The profile in described many folding fin line gaps is by two mutually perpendicular straightway A and straightway B, and a curved section C be made up of many straightways forms; And the length of described straightway A is identical with the lateral length of waveguide slot, the length of straightway B is identical with longitudinal total length of curved section C, and between straightway A, straightway B and curved section C, head and the tail are connected mutually successively.

5. waveguide according to claim 4 is to the conversion equipment of substrate integration wave-guide, it is characterized in that: described many folding fin line gaps are provided with wedge grading structure, this wedge grading structure is more than first foldings fin line gap (12) and rolls over overlap is hinted obliquely in fin line gap (13) part at top layer metallic layer (8) and bottom metal layer (10) more second.

6. waveguide according to claim 1 is to the conversion equipment of substrate integration wave-guide, it is characterized in that: longitudinal total length of described first wave guide groove (4) is longer than the longitudinal total length rolling over fin line gap (12) first more; Longitudinal total length of Second Wave guide groove (5) is longer than the longitudinal total length rolling over fin line gap (13) second more.

7. waveguide according to claim 1 is to the conversion equipment of substrate integration wave-guide, it is characterized in that: described substrate slot (6) transverse width is identical with substrate integration wave-guide (7) width, the vertical direction degree of depth of described substrate slot (6) is identical with the thickness of substrate integration wave-guide (7); Described Second Wave guide groove (5) is positioned at the middle of substrate slot (6) in a lateral direction; Described Second Wave guide groove (5) vertical direction depth ratio first wave guide groove (4) the vertical direction degree of depth is greater than the thickness of half substrate integration wave-guide (7).

8. waveguide according to claim 1 is to the conversion equipment of substrate integration wave-guide, it is characterized in that: carry out equivalent substrate integration wave-guide with Filled Dielectrics rectangular waveguide, the medium of this medium and described substrate integration wave-guide has identical characteristics, then the equivalent formulation between substrate integration wave-guide (7) and Filled Dielectrics rectangular waveguide is:

$W_{\mathrm{RWG}}=W_{\mathrm{SIW}}\&times;[{\mathrm{\&xi;}}_1+\frac{{\mathrm{\&xi;}}_2}{s/d+({\mathrm{\&xi;}}_1+{\mathrm{\&xi;}}_2-{\mathrm{\&xi;}}_3)/({\mathrm{\&xi;}}_3-{\mathrm{\&xi;}}_1)}];$

${\mathrm{\&xi;}}_1=1.0198+\frac{0.3465}{W_{\mathrm{SIW}}/s-1.0684};$

${\mathrm{\&xi;}}_2=-0.1183-\frac{1.2729}{W_{\mathrm{SIW}}/s-1.2010};$

${\mathrm{\&xi;}}_3=1.0082-\frac{0.9163}{W_{\mathrm{SIW}}/s+0.2152};$

Wherein, d is plated-through hole diameter, and s is adjacent metal through hole centre distance, W _sIWfor the distance between the center line that two row's plated-through holes of described substrate integration wave-guide arrange, W _rWGfor the length of the longer sides in cross section in corresponding equivalent traditional sucrose rectangular waveguide;

Or, when s is enough little, meet equivalent waveguide width W simultaneously _rWGbetween W _sIWand W _sIWtime between-d, the equivalent formulation between corresponding substrate integration wave-guide (7) and Filled Dielectrics rectangular waveguide is:

$W_{\mathrm{RWG}}=W_{\mathrm{SIW}}-\frac{d^2}{0.95\&times;s}.$

9. waveguide according to claim 1 is to the conversion equipment of substrate integration wave-guide, it is characterized in that: at millimeter wave frequency band, and described plated-through hole (11) diameter is 0.3mm-1mm; Adjacent metal through hole (11) centre distance is 0.6mm-2mm.

10. waveguide according to claim 1 is to the conversion equipment of substrate integration wave-guide, it is characterized in that: when operating frequency is at f _cto 2f _cbetween time, substrate integration wave-guide only transmits accurate TE ₁₀mould; Wherein main mould cut-off frequency c is the light beam in vacuum, μ _r=1, ε _rfor the relative dielectric constant of dielectric substrate, accurate TE ₁₀mould cut-off wavelength λ _c=2W _rWG, W _rWGfor the length of the longer sides in cross section in corresponding equivalent traditional sucrose rectangular waveguide.