CN104893601A - Conductive adhesive film with two conductive structures and preparation method of conductive adhesive film - Google Patents
Conductive adhesive film with two conductive structures and preparation method of conductive adhesive film Download PDFInfo
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- CN104893601A CN104893601A CN201510257056.XA CN201510257056A CN104893601A CN 104893601 A CN104893601 A CN 104893601A CN 201510257056 A CN201510257056 A CN 201510257056A CN 104893601 A CN104893601 A CN 104893601A
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Abstract
The invention discloses a conductive adhesive film with two conductive structures and a preparation method of the conductive adhesive film. The conductive adhesive film is composed of two conductive matters and adhesive layers and has excellent mechanical strength and conductivity, wherein the two conductive matters are three-dimensional and netlike conductive carrier layers 3, which are embedded in and parallel to the adhesive layers 2, and conductive packing layers 4, each of which has a certain thickness, are embedded between the upper and lower surfaces of the conductive carrier layers 3 and adhered matters 1. A material of each adhesive layer 2 is a thermosetting resin, such as epoxy resin and bismaleimide resin. Each conductive carrier layer 3 is woven or non-woven cloth which is subjected to conductive treatment or is conductive itself. Each conductive packing layer 4 is an array or accumulation body, which is composed of conductive fibers or conductive sheet layers. According to the technical scheme proposed in the invention, the conductive adhesive film has the shearing strength more than 25Mpa, the 90-degree peeling strength more than 3.5kN/m, and the volume resistance less than 5.0*10<-4> omega.cm.
Description
Technical field
The present invention a kind ofly has conductive adhesive film of two kinds of conductive structures and preparation method thereof, belongs to the conductive adhesive technical field of material.
Background technology
For under the prerequisite not damaging connecting object, tackiness agent is referred to as by material homogeneity or heterogeneous two or more materials coupled together.Its type comprises organic polymer material, metal-salt, inorganic polymer etc., use temperature from subzero tens of degree to thousands of degree not etc.What be wherein most widely used is glued joint in (room temperature ~ 200) DEG C solidification, can within the scope of (room temperature ~ 100) DEG C the organic polymer tackiness agent of life-time service.
The type of adhesive tube is not why, and connecting differing materials is its most basic attribute.But in the process of practical application, user, except paying close attention to the Joint strength of tackiness agent, needs toward contact some functional performance utilizing tackiness agent.The object that the occasion of the selection Main Basis adhesive applications of functional tackiness agent is connected with it and being determined.Such as, for the wire in junction circuit system and conductive resin that is antistatic, the assembling of anti-lightning, electromagnetic armouring structure; For the heat-conducting glue that radiator element, lighting system internal structure connect; And for damping, noise-reducing structure connect damping shock absorption tackiness agent; The Green Flammability tackiness agent connect for inside carrier materials such as car, ship, aircrafts, decorated etc. are numerous.Regrettably, between the base attribute and its functionalization adeditive attribute of tackiness agent, often there is contradictory relation.For conductive polymer glue, for the Joint strength (singly overlapping tensile shear strength) of the high-performance adhesive of anatomical connectivity usually at more than 20MPa, aluminium-aluminium shearing resistance measured value that aviation field is used for the structural adhesive bonding joint that load bearing structure glueds joint can reach more than 35MPa; And once to adding conduction requirement in the design of adhesively bonded joint, use high-performance conducting resin commercially available at present as Henkel
8700, the BQ-6886 etc. of Uniwell glueds joint, although can obtain desirable electroconductibility, its shearing resistance is no more than 15MPa usually, and almost cannot bear the peel stress effect of opening pattern.
Due to the insulation of macromolecular material body, therefore the action principle of conductive resin mainly reaches " percolation threshold " by the conductive filler material in polymer inside as silver, copper, carbon filler etc. form " conductive network ", realizes the conducting in insulating polymer inside.But the filling of conductive filler material in polymer body realizes mainly through homodisperse form at present, and a large amount of conductive filler materials often reduces the mechanical property of material.
The negative impact brought for avoiding mass filler, often adopts sheet and fibrous conductive filler material, compared with granulated filler, can reduce the addition of the filler when percolation threshold.But when the length-to-diameter ratio of filler is more than 50, filler length-to-diameter ratio increases and weakens gradually the impact of percolation threshold.The people such as the Wu Xijun of Zhejiang University have prepared nano silver wire uniform filling conductive resin with high length-diameter ratio nano silver wire, and when packing quality mark is added into 50%, conductive resin can reach percolation threshold, and tackiness agent shearing resistance reaches 17.6MPa, volume specific resistance 1.2 × 10
-4Ω cm.Although possessed good electroconductibility, mechanical property still can not meet the requirement that high strength is gluedd joint.
Summary of the invention
The present invention designs for above-mentioned the deficiencies in the prior art just and provides a kind of conductive adhesive film of two kinds of conductive structures and preparation method thereof that has, its objective is and solid netted conductive micro structures is directly introduced membranaceous macromolecule adhesive layer, significantly reduce the addition of conductive filler material, retain the mechanical property of adhesive layer to greatest extent.
The object of the invention is to be achieved through the following technical solutions:
Technical solution of the present invention provides a kind of conductive adhesive film with two kinds of conductive structures, this conductive adhesive film is made up of adhesive layer (2) and the conducting material implanted wherein, for bonding, lower bonded object (1), it is characterized in that: described conducting material refers to the solid parallel with adhesive layer (2) implanted in adhesive layer (2), netted conducting carrier layer (3), and upper at conducting carrier layer (3), between lower surface and bonded object (1), that implants has certain thickness conductive filler layer (4), the conductive micro structures of this conductive filler layer (4) penetrates adhesive layer (2) by conducting carrier layer (3) and adherend (1) conducting,
The thickness of described conductive filler layer (4) is 0.5% ~ 15% of adhesive layer (2) thickness;
The material of adhesive layer (2) is epoxy resin, bimaleimide resin, thermoset polyimide resin, Polybenzoxazine resin, resol, cyanate ester resin or unsaturated polyester resin, above-mentioned raw materials through extruding, mold pressing, roller refining, be coated with membrane process make adhesive layer (2);
Conducting carrier layer (3) is made up of flexible carrier layer (5) and conducting medium (6), wherein, the material of flexible carrier layer (5) is nylon, polyaryletherketone, polyimide, polyetherimide, polyethersulfone, polyether-ether-ketone, aramid fiber macromolecular fibre, carbon fiber, carbon nanotube, the fabric of vegetable fibre, non-woven fabrics or aramid paper, at the surface attachment conducting medium (6) of flexible carrier layer (5), the adhesion amount of conducting medium (6) is at 2 ~ 150g/m
2between, the thickness of conducting carrier layer (3) is 70% ~ 99% of adhesive layer (2) thickness, and conducting medium (6) is for one of following:
The attachment material of a conducting medium (6) is one or more mixture in nano silver wire or particle, nickel nano wire or particle, carbon nanotube, Graphene, gas-phase carbon fiber;
B conducting medium (6) be in silver, copper, nickel metal one or more flexible carrier layer (5) surface settled layer;
C conducting medium (6) is silver, in one or more settled layers on flexible carrier layer (5) surface and nano silver wire or particle, nickel nano wire or particle, carbon nanotube, Graphene, gas-phase carbon fiber, the mixture of one or more forms in copper, nickel metal.
The material of described conductive filler layer (4) is multi-layer graphene, expanded graphite, carbon nano pipe array, carbon nanohorn, silver nano line array, Arrays of Copper Nanowires, conduction four pin ZnOw, conductive zinc oxide nano flower, electric conductive oxidation copper nano flower or conducting aluminium oxide nano flower.
Technical solution of the present invention additionally provides a kind of for the preparation of the described method with the conductive adhesive film of two kinds of conductive structures, it is characterized in that: the step of the method is as follows:
Step one, prepare conducting carrier layer (3), preparation method is one of following:
1.1 choose conducting medium (6) by a item of claim 1, join water, ethanol, propyl alcohol, butanols, acetone, methylene dichloride, chloroform, tetrahydrofuran (THF), sherwood oil, ethyl acetate, N, N-dimethylformamide, N, in N N,N-DIMETHYLACETAMIDE, methyl-sulphoxide or N-Methyl pyrrolidone equal solvent, be made into suspension liquid, the concentration of suspension liquid is 1mg/ml ~ 200mg/ml, flexible carrier layer (5) is soaked 5min ~ 30min wherein, dry in room temperature after taking-up or dry, making conducting carrier layer (3);
1.2 choose conducting medium (6) by the b item of claim 1, by the method for electroless plating, plating, chemical vapor deposition, magnetron sputtering, conducting medium (6) are deposited on flexible carrier layer (5) surface;
1.3 choose conducting medium (6) by the c item of claim 1, first the mixture of one or more in nano silver wire or particle, nickel nano wire or particle, carbon nanotube, Graphene, gas-phase carbon fiber is attached on flexible carrier layer (5) by above-mentioned steps 1.1, then by above-mentioned steps 1.2 depositing silver, copper, nickel metal one or more;
The glued membrane of step 2, adhesive layer (2) is placed on Flat pressure machine and is heated to softening temperature, conducting carrier layer (3) is pressed into the glued membrane middle position of softening adhesive layer (2), this conducting carrier layer (3) is parallel with the upper and lower surface of adhesive layer (2);
Or with adhesive film machine by being heated on softening temperature, be used for the resin of formed adhesive layer (2) and be directly coated in conducting carrier layer (3);
Step 3, by the material choosing conductive filler layer (4) described in claim 1, join in solvent described in above-mentioned steps 1.1, add the glued membrane of adhesive layer (2) again, being mixed with suspension liquid is coated in the template or demoulding cloth of remover process, dry or dry the rear conductive filler layer (4) formed with conductive micro structures, the volume ratio of the material of conductive filler layer (4) and the glued membrane of adhesive layer (2) is 0.5 ~ 5, and the area density of material in template or demoulding cloth of conductive filler layer (4) is 5 ~ 20g/m
2;
Step 4, the template or demoulding cloth that are coated with conductive micro structures be attached to the two sides of the adhesive layer (2) that step 2 is formed, on Flat pressure machine, carry out pressurizeing, heat that it is inner to make conductive micro structures be punctured to adhesive layer (2), contact with conducting carrier layer (3);
Or omit above-mentioned steps three, adhesive layer (2) two sides that (2) step formed are sprinkling upon directly by the homogenize material of conductive filler layer (4), on adhesive film machine, carry out pressurizeing, heat that it is inner to make conductive micro structures be punctured to adhesive layer (2), contact with conducting carrier layer (3), the area density being sprinkling upon the material of the conductive filler layer (4) of adhesive layer (2) side is 3 ~ 15g/m
2;
The pressure of above-mentioned pressurization is 0.1MPa ~ 10MPa, and the temperature of heating is 50 DEG C ~ 220 DEG C.
The feature of technical solution of the present invention contains conducting carrier layer (3) and conductive filler layer (4) two kinds of conductive structures, and two kinds of conductive structures all have good consistency with the resin matrix of adhesive layer (2).Conductive filler layer (4) sets up the netted conductive micro structures of 3 D stereo between conducting carrier layer (3) and adherend (1), when the design of this kind of conductive micro structures solves and directly conducting material is implanted adhesive layer (2) inside, because it can not full extension and formed occur this problem of high-resistance insulating resin layer between adherend (1), this kind of conductive micro structures forms by the conductive filler material of high length-diameter ratio is stacking, adhesive layer (2) can be penetrated, by conducting carrier layer (3) and adherend (1) conducting.This kind of conductive micro structures and conducting carrier layer (3) significantly can reduce the addition of conductive filler material, retain the cohesive strength of macromolecule adhesive layer (2) to greatest extent, be equivalent to the mechanical property that improve adhesive layer (2).
In technical solution of the present invention, the material forming conductive filler layer (4) has flexibility, because conductive micro structures is in adhesive layer (2), having flexibility can make the concavo-convex place of conductive micro structures adherend (1) form mechanical interlock, can promote the Joint strength of interface zone.Because peel stress and strain concentrating many in the interface zone of adhesive layer (2), make adhesively bonded joint easily be subject to stripping damage, therefore this kind of effect can promote the stripping strength of tackiness agent.
The conductive adhesive film with two kinds of conductive structures that technical solution of the present invention proposes, its shearing resistance>=25MPa, 90 ° of stripping strength>=3.5kN/m, volume specific resistance < 5.0 × 10
-4Ω cm.
Accompanying drawing explanation
Accompanying drawing 1 is conduct electricity the stereoscan photograph of conductive filler layer 4 of four pin zinc oxide in embodiment 1
Accompanying drawing 2 is the stereoscan photograph of the conducting carrier layer 3 of electroconductive nylon gauze in embodiment 1
Accompanying drawing 3 is the stereoscan photograph in adhesively bonded joint cross section in embodiment 1
Accompanying drawing 4 is the XRD Surface scan photo in adhesively bonded joint cross section in embodiment 1
Accompanying drawing 5 is the structural representation of the conducting carrier layer 3 of electroconductive nylon gauze in embodiment 1
The distribution schematic diagram of two kinds of conducting material that accompanying drawing 6 is electricity consumption packing layer 4 in embodiment 1, conducting carrier layer 3 forms
Accompanying drawing 7 be in embodiment 2 by the conductive filler layer 4 of expanded graphite, with the conducting carrier layer 3 of conduction aramid fiber non-woven fabrics, the structural representation of adhesive layer 2 made with bismaleimide resin
Accompanying drawing 8 is the continuous processing production process schematic diagram of conductive adhesive film in embodiment 3
Embodiment
Below with reference to drawings and Examples, technical solution of the present invention is further described:
Embodiment 1
Shown in accompanying drawing 1 ~ 6, the adhesive layer 2 that this conductive adhesive film is prepared by epoxy resin and the conducting material implanted wherein are formed, for bonding, lower bonded object 1, it is characterized in that: described conducting material refers to the solid parallel with adhesive layer 2 implanted in adhesive layer 2, netted conducting carrier layer 3, and upper at conducting carrier layer 3, between lower surface and bonded object 1, that implants has conductive filler layer 4 prepared by certain thickness employing conduction four pin zinc oxide, the conductive micro structures of this conductive filler layer 4 penetrates adhesive layer 2 by conducting carrier layer 3 and bonded object 1 conducting,
The thickness of this conductive filler layer 4 is 15% of adhesive layer 2 thickness;
The glued membrane of adhesive layer 2 is made up of expressing technique;
Conducting carrier layer 3 is made up of the flexible carrier layer 5 adopting nylon fabrics to prepare and the conducting medium layer 6 be attached on flexible carrier layer 5, and conducting medium layer 6 adopts the mode of deposition of silver to be formed, and the deposition of silver adhesion amount of conducting medium layer 6 is 20g/m
2, the thickness of conducting carrier layer 3 is 85% of adhesive layer 2 thickness.
The step of the method for the conductive adhesive film of preparation described in embodiment 1 is as follows:
Step one, prepare conducting carrier layer 3, preparation method is:
With electroless plating method by the surface of deposition of silver in the nylon fabrics after sensitization and activation, deposition of silver adhesion amount is 20g/m
2;
Step 2, the adhesive layer 2 adopting glue epoxy resin to prepare is placed on Flat pressure machine is heated to softening temperature, conducting carrier layer 3 is pressed into the glued membrane middle position of softening adhesive layer 2, this conducting carrier layer 3 is parallel with the upper and lower surface of adhesive layer 2;
Step 3, preparation conductive filler layer 4, preparation method is:
Conduction four pin zinc oxide is joined in methylene dichloride, add epoxy resin again, being mixed with suspension liquid is coated in the template or demoulding cloth of remover process, dry or become electric packing layer 4 after drying, the volume ratio of four pin zinc oxide and epoxy resin of conducting electricity is 2.5, and the area density of four pin zinc oxide in template or demoulding cloth of conducting electricity is 20g/m
2;
Step 4, conductive filler layer 4 is attached to the two sides of the adhesive layer 2 that step 2 is formed, on Flat pressure machine, carries out pressurizeing, heat that it is inner to make the conductive micro structures in conductive filler layer 4 be punctured to adhesive layer 2, contact with conducting carrier layer 3;
The pressure of above-mentioned pressurization is 5MPa, and the temperature of heating is 100 DEG C.
Accompanying drawing 1 is the stereoscan photograph of the conductive filler layer 4 of conduction four pin zinc oxide.This conduction tetrapod shaped whisker has unique three-dimensional arrangement, and no matter the initial orientation of this whisker is why, consisting of the thickness of conductive filler layer 4 be a steady state value;
Accompanying drawing 2 is the stereoscan photograph of the conducting carrier layer 3 of electroconductive nylon gauze.With this conducting carrier layer 3 for relying on, available minimum conducting medium 6, forms the conductive network stretched continuously in the inside of adhesive layer 2;
Accompanying drawing 3 is the stereoscan photograph in adhesively bonded joint cross section in embodiment 1, can find out from this photo, and the cross section of adhesive layer 2 is run through by two kinds of structures of wire and arc-shaped, is connected with bonded object 1;
Accompanying drawing 4 is the XRD Surface scan photo in adhesively bonded joint cross section in embodiment 1, contains a large amount of silver element conducted electricity in the wire in this photo explanation accompanying drawing 3 and two kinds of continuous structures of arc-shaped;
Accompanying drawing 5 is the structural representation of the conducting carrier layer 3 of electroconductive nylon gauze in embodiment 1, and conducting carrier layer 3 is made up of jointly coated conducting medium 6 outside flexible carrier layer 5 and its;
The distribution schematic diagram of two kinds of conducting material that accompanying drawing 6 is electricity consumption packing layer 4 in embodiment 1, conducting carrier layer 3 forms, conductive filler layer 4 is positioned at the both sides up and down of conducting carrier layer 3, and be connected with upper and lower bonded object 1, adhesive layer 2 is filled in space therebetween.
Embodiment 2
Shown in accompanying drawing 7, the adhesive layer 2 that this conductive adhesive film is prepared by bimaleimide resin and the conducting material implanted wherein are formed, for bonding, lower bonded object 1, it is characterized in that: described conducting material refers to the solid parallel with adhesive layer 2 implanted in adhesive layer 2, netted conducting carrier layer 3, and upper at conducting carrier layer 3, between lower surface and bonded object 1, that implants has conductive filler layer 4 prepared by certain thickness employing expanded graphite, the conductive micro structures of this conductive filler layer 4 penetrates adhesive layer 2 by conducting carrier layer 3 and bonded object 1 conducting,
The thickness of this conductive filler layer 4 is 10% of adhesive layer 2 thickness;
The glued membrane of adhesive layer 2 is made up of roller sweetening process;
Conducting carrier layer 3 is made up of the flexible carrier layer 5 adopting aramid fiber non-woven fabrics to prepare and the conducting medium layer 6 be attached on flexible carrier layer 5, conducting medium layer 6 is formed by the mixture of nano silver wire and nickel deposition, and the nano silver wire of conducting medium layer 6 and nickel deposition adhesion amount are 80g/m
2, the thickness of conducting carrier layer 3 is 90% of adhesive layer 2 thickness.
The step of the method for the conductive adhesive film of preparation described in embodiment 2 is as follows:
Step one, prepare conducting carrier layer 3, preparation method is:
Nano silver wire joins in propyl alcohol by 1.1, is made into suspension liquid, and the concentration of suspension liquid is 5mg/ml, and aramid fiber non-woven fabrics is soaked 5min wherein, dries or dry after taking-up in room temperature;
The method of 1.2 use magnetron sputterings, by the surface of nickel deposition at the aramid fiber non-woven fabrics 5 processed through step 1.1, obtains conducting carrier layer 3;
Step 2, with adhesive film machine by being heated on softening temperature, be used for the bimaleimide resin of formed adhesive layer 2 and be directly coated in conducting carrier layer 3;
Step 3, preparation conductive filler layer 4, preparation method is:
Expanded graphite is joined in chloroform, add bimaleimide resin again, being mixed with suspension liquid is coated in the template or demoulding cloth of remover process, dry or become electric packing layer 4 after drying, the volume ratio of expanded graphite and bimaleimide resin is 5, and the area density of expanded graphite in template or demoulding cloth is 10g/m
2;
Step 4, conductive filler layer 4 is attached to the two sides of the adhesive layer 2 that step 2 is formed, on Flat pressure machine, carries out pressurizeing, heat that it is inner to make the conductive micro structures in conductive filler layer 4 be punctured to adhesive layer 2, contact with conducting carrier layer 3;
The pressure of above-mentioned pressurization is 2MPa, and the temperature of heating is 80 DEG C.
Accompanying drawing 7 be in embodiment 2 by the conductive filler layer 4 of expanded graphite, with the conducting carrier layer 3 of conduction aramid fiber non-woven fabrics, the structural representation of adhesive layer 2 made with bismaleimide resin, in the preparation process of this embodiment, conducting carrier layer 3 is overlayed on the both sides up and down of adhesive layer 2 by paving, the two is by hot binding, and conductive filler layer 4 implants adhesive layer 2 surface by method of reprinting.
Embodiment 3
The adhesive layer 2 that this conductive adhesive film is prepared by cyanate ester resin and the conducting material implanted wherein are formed, for bonding upper and lower bonded object 1, it is characterized in that: described conducting material refers to solid, the netted conducting carrier layer 3 parallel with adhesive layer 2 implanted in adhesive layer 2, and between the upper and lower surface and bonded object 1 of conducting carrier layer 3, that implants has conductive filler layer 4 prepared by certain thickness employing carbon nanotube, and the conductive micro structures of this conductive filler layer 4 penetrates adhesive layer 2 by conducting carrier layer 3 and bonded object 1 conducting;
The thickness of this conductive filler layer 4 is 1% of adhesive layer 2 thickness;
The glued membrane of adhesive layer 2 is made up of coating process;
Conducting carrier layer 3 is made up of the flexible carrier layer 5 adopting carbon fibre fabric to prepare and the conducting medium layer 6 be attached on flexible carrier layer 5, and the material of conducting medium layer 6 is Graphene, and the Graphene adhesion amount of conducting medium layer 6 is 5g/m
2, the thickness of conducting carrier layer 3 is 99% of adhesive layer 2 thickness.
Shown in accompanying drawing 8, the step of the method for the conductive adhesive film of preparation described in embodiment 3 is as follows:
Step one, prepare conducting carrier layer 3, preparation method is:
By chemical vapor deposition method, Graphene is deposited on carbon fibre fabric surface;
Step 2, with adhesive film machine by being heated on softening temperature, be used for the cyanate ester resin of formed adhesive layer 2 and be directly coated in conducting carrier layer 3;
Step 3, carbon nano-tube material is sprinkling upon uniformly adhesive layer 2 two sides that step 2 formed and forms conductive filler layer 4, on adhesive film machine, carry out pressurizeing, heat that it is inner to make the conductive micro structures in conductive filler layer 4 be punctured to cyanate ester resin adhesive layer 2, contact with High-conductivity carbon fiber fabric layer 3, the area density being sprinkling upon the carbon nanotube layer material of adhesive layer 2 side is 2g/m
2.
The pressure of above-mentioned pressurization is 5MPa, and the temperature of heating is 100 DEG C.
Accompanying drawing 8 is the continuous processing production process schematic diagram of conductive adhesive film in embodiment 3, compared with embodiment 1, embodiment 2, the advantage of process program described in this embodiment be can automatization, continuous production glued membrane, be applicable to the scale operation of conductive adhesive film.
Compared with prior art, the conductive adhesive film described in technical solution of the present invention has interface and the cohesive strength of high strength concurrently, and more excellent conductivity, achieves the structure-function integration of tackiness agent.This conductive adhesive film can be used for load bearing structure in the fields such as aerospace, automobile making, utilization of new energy resources, electronics production and is connected with the conduction of product, is struck by lightning and big current protection, and electromagnetic shielding guarantee.
Claims (2)
1. one kind has the conductive adhesive film of two kinds of conductive structures, this conductive adhesive film is made up of adhesive layer (2) and the conducting material implanted wherein, for bonding, lower bonded object (1), it is characterized in that: described conducting material refers to the solid parallel with adhesive layer (2) implanted in adhesive layer (2), netted conducting carrier layer (3), and upper at conducting carrier layer (3), between lower surface and bonded object (1), that implants has certain thickness conductive filler layer (4), the conductive micro structures of this conductive filler layer (4) penetrates adhesive layer (2) by conducting carrier layer (3) and adherend (1) conducting,
The thickness of described conductive filler layer (4) is 0.5% ~ 15% of adhesive layer (2) thickness;
The material of adhesive layer (2) is epoxy resin, bimaleimide resin, thermoset polyimide resin, Polybenzoxazine resin, resol, cyanate ester resin or unsaturated polyester resin, above-mentioned raw materials through extruding, mold pressing, roller refining, be coated with membrane process make adhesive layer (2);
Conducting carrier layer (3) is made up of flexible carrier layer (5) and conducting medium (6), wherein, the material of flexible carrier layer (5) is nylon, polyaryletherketone, polyimide, polyetherimide, polyethersulfone, polyether-ether-ketone, aramid fiber macromolecular fibre, carbon fiber, carbon nanotube, the fabric of vegetable fibre, non-woven fabrics or aramid paper, at the surface attachment conducting medium (6) of flexible carrier layer (5), the adhesion amount of conducting medium (6) is at 2 ~ 150g/m
2between, the thickness of conducting carrier layer (3) is 70% ~ 99% of adhesive layer (2) thickness, and conducting medium (6) is for one of following:
The attachment material of a conducting medium (6) is one or more mixture in nano silver wire or particle, nickel nano wire or particle, carbon nanotube, Graphene, gas-phase carbon fiber;
B conducting medium (6) be in silver, copper, nickel metal one or more flexible carrier layer (5) surface settled layer;
C conducting medium (6) is silver, in one or more settled layers on flexible carrier layer (5) surface and nano silver wire or particle, nickel nano wire or particle, carbon nanotube, Graphene, gas-phase carbon fiber, the mixture of one or more forms in copper, nickel metal.
The material of described conductive filler layer (4) is multi-layer graphene, expanded graphite, carbon nano pipe array, carbon nanohorn, silver nano line array, Arrays of Copper Nanowires, conduction four pin ZnOw, conductive zinc oxide nano flower, electric conductive oxidation copper nano flower or conducting aluminium oxide nano flower.
2. for the preparation of a method with the conductive adhesive film of two kinds of conductive structures according to claim 1, it is characterized in that: the step of the method is as follows:
Step one, prepare conducting carrier layer (3), preparation method is one of following:
1.1 choose conducting medium (6) by a item of claim 1, join water, ethanol, propyl alcohol, butanols, acetone, methylene dichloride, chloroform, tetrahydrofuran (THF), sherwood oil, ethyl acetate, N, N-dimethylformamide, N, in N N,N-DIMETHYLACETAMIDE, methyl-sulphoxide or N-Methyl pyrrolidone equal solvent, be made into suspension liquid, the concentration of suspension liquid is 1mg/ml ~ 200mg/ml, flexible carrier layer (5) is soaked 5min ~ 30min wherein, dry in room temperature after taking-up or dry, making conducting carrier layer (3);
1.2 choose conducting medium (6) by the b item of claim 1, by the method for electroless plating, plating, chemical vapor deposition, magnetron sputtering, conducting medium (6) are deposited on flexible carrier layer (5) surface;
1.3 choose conducting medium (6) by the c item of claim 1, first the mixture of one or more in nano silver wire or particle, nickel nano wire or particle, carbon nanotube, Graphene, gas-phase carbon fiber is attached on flexible carrier layer (5) by above-mentioned steps 1.1, then by above-mentioned steps 1.2 depositing silver, copper, nickel metal one or more;
The glued membrane of step 2, adhesive layer (2) is placed on Flat pressure machine and is heated to softening temperature, conducting carrier layer (3) is pressed into the glued membrane middle position of softening adhesive layer (2), this conducting carrier layer (3) is parallel with the upper and lower surface of adhesive layer (2);
Or with adhesive film machine by being heated on softening temperature, be used for the resin of formed adhesive layer (2) and be directly coated in conducting carrier layer (3);
Step 3, by the material choosing conductive filler layer (4) described in claim 1, join in solvent described in above-mentioned steps 1.1, add the glued membrane of adhesive layer (2) again, being mixed with suspension liquid is coated in the template or demoulding cloth of remover process, dry or dry the rear conductive filler layer (4) formed with conductive micro structures, the volume ratio of the material of conductive filler layer (4) and the glued membrane of adhesive layer (2) is 0.5 ~ 5, and the area density of material in template or demoulding cloth of conductive filler layer (4) is 5 ~ 20g/m
2;
Step 4, the template or demoulding cloth that are coated with conductive micro structures be attached to the two sides of the adhesive layer (2) that step 2 is formed, on Flat pressure machine, carry out pressurizeing, heat that it is inner to make conductive micro structures be punctured to adhesive layer (2), contact with conducting carrier layer (3);
Or omit above-mentioned steps three, adhesive layer (2) two sides that (2) step formed are sprinkling upon directly by the homogenize material of conductive filler layer (4), adhesive film machine carries out pressurize, heat that it is inner to make conductive micro structures be punctured to adhesive layer (2), contact with conducting carrier layer (3), the area density being sprinkling upon the material of the conductive filler layer (4) of adhesive layer (2) side is 3 ~ 15g/m
2;
The pressure of above-mentioned pressurization is 0.1MPa ~ 10MPa, and the temperature of heating is 50 DEG C ~ 220 DEG C.
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| CN105907357A (en) * | 2016-05-06 | 2016-08-31 | 金宝丽科技（苏州）有限公司 | Photo-curing and thermal curing heat-resistant conductive adhesive material and preparation method thereof |
| CN105907358A (en) * | 2016-05-06 | 2016-08-31 | 金宝丽科技（苏州）有限公司 | High-temperature-resistant conductive adhesive material and preparation process thereof |
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| CN106139394A (en) * | 2016-07-25 | 2016-11-23 | 合肥凯利光电科技有限公司 | The flexible slide glass of self-adhesion conductive glue slice |
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| CN110522077B (en) * | 2018-05-24 | 2024-04-23 | 中国科学院理化技术研究所 | Conductive tobacco shred and preparation method and application thereof |
| CN108749244A (en) * | 2018-06-07 | 2018-11-06 | 苏州袭麟光电科技产业有限公司 | A kind of optics high flexibility electro-conductive glass film and preparation method thereof |
| CN109291575A (en) * | 2018-08-22 | 2019-02-01 | 中国航发北京航空材料研究院 | A kind of surfacecti proteon type conducing composite material and preparation method thereof |
| CN109173571A (en) * | 2018-11-03 | 2019-01-11 | 北京卡林新能源技术有限公司 | A kind of preparation method of activated carbon fiber electrothermal desorption structure |
| CN109107333A (en) * | 2018-11-03 | 2019-01-01 | 北京卡林新能源技术有限公司 | A kind of activated carbon fiber electrothermal desorption structure |
| CN109462937A (en) * | 2019-01-08 | 2019-03-12 | 昆山域之光电子有限公司 | Novel different side's conductive adhesive film and preparation method thereof |
| CN109788586A (en) * | 2019-01-25 | 2019-05-21 | 陕西科技大学 | A kind of high-strength aramid nano-fiber base composite electric hotting mask of flexibility and preparation method thereof |
| CN109788586B (en) * | 2019-01-25 | 2022-02-22 | 陕西科技大学 | Flexible high-strength aramid nanofiber-based composite electrothermal film and preparation method thereof |
| CN111925746A (en) * | 2020-08-24 | 2020-11-13 | 烟台元申新材料有限公司 | High-heat-resistance conductive silver adhesive and preparation method thereof |
| CN112445035A (en) * | 2020-11-30 | 2021-03-05 | 深圳同兴达科技股份有限公司 | Conductive paste and liquid crystal display module |
| CN112920728A (en) * | 2021-04-02 | 2021-06-08 | 中国科学院苏州纳米技术与纳米仿生研究所 | Conductive adhesive film based on carbon nanotube film, and preparation method and application thereof |
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