CN104882198A - Copper alloy wire - Google Patents

Copper alloy wire Download PDF

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Publication number
CN104882198A
CN104882198A CN201510302521.7A CN201510302521A CN104882198A CN 104882198 A CN104882198 A CN 104882198A CN 201510302521 A CN201510302521 A CN 201510302521A CN 104882198 A CN104882198 A CN 104882198A
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CN
China
Prior art keywords
less
copper alloy
alloy wire
copper
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510302521.7A
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Chinese (zh)
Inventor
张�杰
张明超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Luxshare Precision Industry Chuzhou Ltd
Original Assignee
Luxshare Precision Industry Chuzhou Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Luxshare Precision Industry Chuzhou Ltd filed Critical Luxshare Precision Industry Chuzhou Ltd
Priority to CN201510302521.7A priority Critical patent/CN104882198A/en
Publication of CN104882198A publication Critical patent/CN104882198A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a copper alloy wire. The copper alloy wire comprises, by weight, 94.7036% or higher of copper, 0.2% or higher of tin, 0.00038% or less of nickel, 0.000475% or less of ferrum, 0.00095% or less of antimony, 0.00019% or less of zinc, 0.0057% or less of oxygen, 0.000475% or less of manganese, 0.000475% or less of phosphorus, 0.0019% or less of bismuth, 0.000475% or less of arsenic, 0.000475% or less of gold and more than 5% of electroplating silver. The flexibility and the ductility of the copper alloy wire are improved.

Description

Copper alloy wire
Technical field
The present invention relates to field of alloy material, particularly relate to a kind of copper alloy wire.
Background technology
The wire used in present cable, mainly annealed copper wire or it is coated with the twisting thread of the stranded formation of copper cash of tin etc.The requirement of the recent pliability to wire, ductility and electric conductivity is also more and more higher, and existing wire cannot meet these requirements.
Summary of the invention
The object of the present invention is to provide a kind of copper alloy wire with pliability and ductility.
For realizing aforementioned object, the present invention adopts following technical scheme: a kind of copper alloy wire, and its material composition composition includes by weight percentage: copper >=94.7036%, tin >=0.2%, nickel≤0.00038%, iron≤0.000475%, antimony≤0.00095%, zinc≤0.00019%, oxygen≤0.0057%, manganese≤0.000475%, phosphorus≤0.000475%, bismuth≤0.0019%, arsenic≤0.000475%, gold≤0.000475%, electrosilvering > 5%.
The present invention utilizes ag material to have preferably pliability and ductility, promotes pliability and the ductility of copper alloy wire, and in addition, during copper alloy wire welding, the tin sticky of electrosilvering is respond well, can ensure that wire can be welded on corresponding object reliably.
Embodiment
Copper alloy wire of the present invention is used as the wire used in cable, its material composition composition includes by weight percentage: copper >=94.7036%, tin >=0.2%, nickel≤0.00038%, iron≤0.000475%, antimony≤0.00095%, zinc≤0.00019%, oxygen≤0.0057%, manganese≤0.000475%, phosphorus≤0.000475%, bismuth≤0.0019%, arsenic≤0.000475%, gold≤0.000475%, electrosilvering > 5%, ag material is utilized to have preferably pliability and ductility, promote pliability and the ductility of copper alloy wire, in addition, during copper alloy wire welding, the tin sticky of electrosilvering is respond well, can ensure that wire can be welded on corresponding object reliably.
Although be example object, disclose the preferred embodiment of the present invention, but those of ordinary skill in the art will recognize, when not departing from scope and spirit of the present invention disclosed in appending claims, various improvement, increase and replacement are possible.

Claims (1)

1. a copper alloy wire, its material composition composition includes by weight percentage: copper >=94.7036%, tin >=0.2%, nickel≤0.00038%, iron≤0.000475%, antimony≤0.00095%, zinc≤0.00019%, oxygen≤0.0057%, manganese≤0.000475%, phosphorus≤0.000475%, bismuth≤0.0019%, arsenic≤0.000475%, gold≤0.000475%, electrosilvering > 5%.
CN201510302521.7A 2015-06-05 2015-06-05 Copper alloy wire Pending CN104882198A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510302521.7A CN104882198A (en) 2015-06-05 2015-06-05 Copper alloy wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510302521.7A CN104882198A (en) 2015-06-05 2015-06-05 Copper alloy wire

Publications (1)

Publication Number Publication Date
CN104882198A true CN104882198A (en) 2015-09-02

Family

ID=53949662

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510302521.7A Pending CN104882198A (en) 2015-06-05 2015-06-05 Copper alloy wire

Country Status (1)

Country Link
CN (1) CN104882198A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106057282A (en) * 2016-05-26 2016-10-26 合肥中海信息科技有限公司 Tensile low temperature-resisting silver-copper alloy aerospace cable

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106057282A (en) * 2016-05-26 2016-10-26 合肥中海信息科技有限公司 Tensile low temperature-resisting silver-copper alloy aerospace cable

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150902