CN104865311A - Pulsed eddy current probe, testing device and testing method of testing device - Google Patents
Pulsed eddy current probe, testing device and testing method of testing device Download PDFInfo
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- CN104865311A CN104865311A CN201510220868.7A CN201510220868A CN104865311A CN 104865311 A CN104865311 A CN 104865311A CN 201510220868 A CN201510220868 A CN 201510220868A CN 104865311 A CN104865311 A CN 104865311A
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Abstract
The invention relates to a pulsed eddy current probe, a testing device and a testing method of the testing device, and belongs to pulsed eddy current nondestructive testing devices and testing methods of the devices. The pulsed eddy current probe, the testing device and the testing method of the testing device are used for solving the problem that the exciting coil of an existing pulsed eddy current probe generates heat, and therefore, the actual testing accuracy is influenced. The pulsed eddy current probe comprises a shell, a terminal stud, a temperature sensor assembly, a Hall sensor, a coil skeleton, an exciting coil and an end cover. The testing device comprises a signal generator, a power amplifier, a signal conditioning circuit, the pulsed eddy current probe, a data acquisition card, a main controller and a stabilized voltage supply. The testing method comprises the step of sensor calibration, the step of three-dimensional surface building and the step of measurement and calculation. The main controller acquires the temperature simulation signals of the temperature sensor assembly and the voltage stimulation signals of the Hall sensor in real time to carry out secondary correction on the output signals of the pulsed eddy current probe, therefore, the influence caused by temperature drift on the probe is greatly reduced, and the testing effect is improved.
Description
Technical field
The invention belongs to impulse eddy current the cannot-harm-detection device and detection method thereof, be specifically related to a kind of pulse eddy current probe with temperature sensor and pick-up unit and its detection method.
Background technology
Impulse eddy current is the new detection technique that developed recently gets up, and being mainly used in surface, subsurface defect detects, is a kind of new application of EDDY CURRENT.Different as the conventional vortex encouraged (comprising: single-frequency eddy-current method, multifrequency Eddy method, frequency-sweep measuring method) from employing sinusoidal current, impulse eddy current adopts the square wave with certain dutycycle as excitation, by selecting dutycycle, larger instantaneous power can be obtained act on test specimen in drive coil, make the change of Induced magnetic field larger, thus finally make the change of transient state induced voltage on magnetic test coil more obvious.The data analysis of impulse eddy current is mainly based on the feature extraction of detection signal: as peak value, the time to peak of detection signal, the zero-crossing timing of detection signal of detection signal.
Existing pulse eddy current probe, comprises shell, terminal stud, Hall element, coil rack, drive coil and end cap, because drive coil can produce heat in long-time testing process, affects actual accuracy of detection.
Summary of the invention
The invention provides a kind of pulse eddy current probe, the pick-up unit and its detection method that comprise this probe are provided simultaneously, producing heat for solving existing pulse eddy current probe drive coil, affecting the problem of actual accuracy of detection.
A kind of pulse eddy current probe provided by the present invention, comprises shell, terminal stud, temperature sensing component, Hall element, coil rack, drive coil and end cap, it is characterized in that:
Described shell is nonmetallic pipe, and be made up of shielding heat-barrier material, its center, top has through hole; The terminal stud, temperature sensing component and the Hall element that contact successively are housed in described shell from top to bottom, and the upper end of described terminal stud passes from described through hole; Described temperature sensing component overcoat has coil rack, and described coil rack is hollow heat conduction pipe, and its outer wall side has axial pass trough; Described drive coil is air core coil, is fixed on coil rack; Described Hall element is fixed on described temperature sensing component bottom face; Described end cap is connected with described shell, and described Hall element axial compression is also closed described shell bottom at described temperature sensing component bottom face;
Described temperature sensing component comprises temperature sensor and voltage conversion circuit corresponding with it;
The wiring of described Hall element is passed by the axial pass trough of coil rack, concentrates and be connected to described terminal stud together with the wiring of described temperature sensing component and drive coil.
Temperature sensor in described temperature sensing component can be negative temperature coefficient linear temperature sensor (NTC);
Described shell can be made up of ceramic fibre material, has the performances such as high temperature resistant, resistance to chemical attack, heat shock resistance, low thermal conductivity, heat insulation, insulation, sealing, electrical isolation;
The advantages such as described coil rack by thermal conductive ceramic material, as beryllia, aluminium oxide are made, can have high heat conduction, high insulation;
Described drive coil can for adopting the cylinder type hollow coil of copper paint envelope curve coiling.
Comprise the pick-up unit of described pulse eddy current probe, it comprises signal generator, power amplifier, signal conditioning circuit, pulse eddy current probe, data collecting card, master controller and stabilized voltage supply; It is characterized in that:
Described signal generator output terminal connects power amplifier input, and power amplifier output connects the drive coil of described pulse eddy current probe;
The Hall element of described pulse eddy current probe, the wiring of temperature sensing component are connected to signal conditioning circuit respectively, and the output terminal of signal conditioning circuit is connected with data collecting card, and data collecting card is connected with master controller; Hall element, temperature sensing component and signal conditioning circuit in described stabilized voltage supply paired pulses eddy current probe are powered;
Described signal conditioning circuit changes digital signal into by data collecting card, delivers to master controller and process after carrying out filtering and signal amplification to Hall element, temperature sensing component output signal.
Described pick-up unit, the output signal of described signal generator can be frequency, amplitude, rectangle square-wave signal that dutycycle is adjustable.
Utilize the detection method of described pick-up unit, comprise transducer calibration step, set up three-dimension curved surface step and survey calculation step, it is characterized in that:
(1) transducer calibration step, comprises following sub-step:
(1.1) from environment temperature, with 0.1 DEG C for increment, the temperature t equidistantly increased progressively
iunder measure Hall element output voltage signal in air and standard specimen different depth h successively
jhall element output voltage signal corresponding to fault location, wherein, i=1,2 ..., 20, j=1,2,3,4, h
1=2mm, h
2=4mm, h
3=6mm, h
4=8mm; Using the Hall element output voltage signal in air as reference voltage signal;
Described standard specimen is the rectangular aluminum sheet of length × wide × height=300mm × 40mm × 10mm, material selection 7075 aluminium alloy, and rectangular aluminum sheet length direction is processed with equidistant 60mm four rectangular channels perpendicular to long limit, their width is 3mm, degree of depth h
jrespectively be 2mm, 4mm, 6mm, 8mm;
(1.2) output voltage signal then recorded at each deep defects place respectively and reference voltage signal carry out difference, obtain the crest voltage p of each differential signal
ij=p (t
i, h
j), as corresponding temperature t
i, depth of defect h
junder nominal data;
(2) set up three-dimension curved surface step, comprise following sub-step:
(2.1) according to corresponding temperature t
i, depth of defect h
junder nominal data p
ij, by Matlab data fitting algorithms, simulate 20 with any depth of defect x be independent variable, the corresponding differential signal crest voltage y function curve that is dependent variable:
y(t
1)＝a
01+a
11x+a
21x
2+…、
Flat
y(t
i)＝a
0i+a
1jx+a
2ix
2+…
y(t
m)＝a
0m+a
1mx+a
2mx
2+…
Wherein 0≤x≤10mm, the coefficient a in expression formula
ijnumber and size determined by fitting algorithm;
(2.2) based on the least-squres camber fitting algorithm of rectangular domain, above-mentioned 20 function curves are fitted to continuous, a smooth three-dimension curved surface, provide three-dimension curved surface analytic expression y (t, x), wherein t is arbitrary temp;
(3) survey calculation step, comprises following sub-step:
(3.1) at current environmental temperature t
cunder, the Hall element output voltage signal respectively in measurement air and the Hall element output voltage signal of corresponding fault location, calculate the differential signal crest voltage y of the two simultaneously
c;
(3.2) by data t
c, y
csubstitute into described three-dimension curved surface analytic expression y (t, x), calculate corresponding tested depth of defect x.
Described detection method, it is further characterized in that:
By the temperature t equidistantly increased progressively measured by sub-step (1.1)
i, reference voltage signal, standard specimen different depth h
jhall element output voltage signal corresponding to fault location and the current environmental temperature t measured by step (3)
c, the Hall element output voltage signal in air, the Hall element output voltage signal of corresponding fault location and the tested depth of defect x that calculates deliver to master controller and store and show.
During work, first pulse eddy current probe is placed in zero defect metal sheet surface, ensures that pulse eddy current probe axis is vertical with metal sheet surface, end cap contacts with metal sheet simultaneously; Square wave excitation signal is passed to, to produce vortex field in workpiece for measurement inside to drive coil;
Pass to stable DC voltage to Hall element, in order to detect the secondary magnetic field signal produced by vortex field in workpiece for measurement, Hall element exports the analog voltage signal relevant to magnetic field intensity;
Stable DC voltage is passed to temperature sensing component, the change of probe internal temperature will cause temperature sensor change in resistance in temperature sensing component, the voltage conversion circuit of temperature sensing component inside and then temperature sensor resistance is converted to the analog voltage corresponding with temperature and exports;
By moving pulse eddy current probe at workpiece for measurement surface level, can the defect situation of measuring workpieces diverse location, if workpiece for measurement is inner or surperficial existing defects, the analog voltage signal that Hall element exports will change thereupon, in long-time testing process, the heat produced due to drive coil in pulse eddy current probe can have influence on the actual accuracy of detection of probe, the temperature sensing component that pulse eddy current probe inside is equipped with can detect in real time and export the inner Current Temperatures of probe to main control computer, master controller passes through data collecting card Real-time Collection from the temperature simulation voltage signal of temperature sensing component and the analog voltage signal from Hall element, by detection method of the present invention, obtain revised depth of defect, thus significantly eliminate the impact of temperature drift factor on probe, promote Detection results.
Accompanying drawing explanation
Fig. 1 is the cut-open view of pulse eddy current probe of the present invention;
Fig. 2 is the A-A diagrammatic cross-section of Fig. 1;
Fig. 3 is structure and the Signal transmissions block diagram of pick-up unit of the present invention;
Fig. 4 is detection method standard specimen schematic diagram used;
Fig. 5 is detection method schematic flow sheet.
Embodiment
Below in conjunction with accompanying drawing to the detailed description of the invention:
As shown in Figure 1 and Figure 2, embodiments of the invention, comprise shell 1, terminal stud 2, temperature sensing component 3, Hall element 4, coil rack 5, drive coil 6 and end cap 7;
Described shell 1 is open for bottom, the pipe of top perforate, and be made up of shielding heat-barrier material, its center, top has through hole 1A; The terminal stud 2, temperature sensing component 3 and the Hall element 4 that contact successively are housed in described shell 1 from top to bottom, and the upper end of described terminal stud 2 passes from described through hole 1A; Described temperature sensing component 3 overcoat has coil rack 5, and described coil rack 5 is hollow heat conduction pipe, and its outer wall side has axial pass trough 5A; Described drive coil 6 is air core coil, is fixed on coil rack 5; Described Hall element 4 is fixed on described temperature sensing component 5 bottom face; Described end cap 7 is connected with described shell 3, and described Hall element 4 axial compression is also closed described shell 1 bottom at described temperature sensing component 5 bottom face;
Described temperature sensing component 3 comprises temperature sensor and voltage conversion circuit corresponding with it;
The wiring of described Hall element 4 is passed by the axial pass trough 5A of coil rack 5, all concentrates be connected to described terminal stud 2 with the wiring of described temperature sensing component 3 and drive coil 6.
In embodiments of the invention:
Temperature sensor in described temperature sensing component 3 is negative temperature coefficient temperature sensor device (NTC);
Described shell 1 and end cap 7 are made up of ceramic fibre material;
Described coil rack 5 is made up of aluminium oxide thermal conductive ceramic material;
Described drive coil 6 is the cylinder type hollow coil adopting the coiling of copper paint envelope curve.
As shown in Figure 3, comprise the eddy current testing device of described pulse eddy current probe, it comprises signal generator, power amplifier, signal conditioning circuit, pulse eddy current probe, data collecting card, master controller and stabilized voltage supply;
Described signal generator output terminal connects power amplifier input, and power amplifier output connects the drive coil of described pulse eddy current probe;
The Hall element of described pulse eddy current probe, the wiring of temperature sensing component are connected to signal conditioning circuit respectively, and the output terminal of signal conditioning circuit is connected with data collecting card, and data collecting card is connected with master controller; Described stabilized voltage supply is that Hall element, temperature sensing component and the signal conditioning circuit in pulse eddy current probe is powered;
Described signal conditioning circuit changes digital signal into by data collecting card, delivers to master controller and process after carrying out filtering and signal amplification to Hall element, temperature sensing component output signal.
As shown in Figure 3, manually signalization generator, output frequency, amplitude, the rectangle square-wave signal that dutycycle is adjustable, square-wave signal is connected to pulse eddy current probe signal input part to drive drive coil work after power amplifier amplifies, Hall sensor module in probe, the analog voltage signal that temperature sensing component exports carries out exporting data collecting card to after filter and amplification through signal conditioning circuit, master controller is by data collecting card, Multi-Channel Parallel Acquisition is from the Hall element of popping one's head in and temperature sensor voltage signal, carry out temperature compensation process, finally the detection data after compensation are carried out storing and showing.
In order to improve detection degree of accuracy, when using the present invention to carry out eddy current test to metal sheet, armstrong's patent scanning equipment can be used, eddy current probe is fixed on mechanical hand scan device, by regulating corresponding knob, probe can be controlled move horizontally along X, Y-direction on metal sheet surface, probe lift off was more can be changed simultaneously.
During work, first the present invention's probe is placed in zero defect metal sheet surface, ensures that probe axis is vertical with metal sheet surface, end cap contacts with metal sheet simultaneously; Square wave excitation signal is passed to, to produce vortex field in workpiece for measurement inside to drive coil;
Pass to stable DC voltage to Hall element, in order to detect the secondary magnetic field signal produced by vortex field in workpiece for measurement, Hall element exports the analog voltage signal relevant to magnetic field intensity;
Stable DC voltage is passed to temperature sensing component, the change of probe internal temperature will cause temperature sensor change in resistance in temperature sensing component, the voltage conversion circuit of temperature sensing component inside and then temperature sensor resistance is converted to the analog voltage corresponding with temperature and exports;
By at workpiece for measurement surface level mobile probe, can the defect situation of measuring workpieces diverse location, if workpiece for measurement is inner or surperficial existing defects, the analog voltage signal that Hall element exports will change thereupon, in long-time testing process, the heat produced due to drive coil in pulse eddy current probe can have influence on the actual accuracy of detection of probe, the temperature sensing component that pulse eddy current probe inside is equipped with can detect in real time and export the inner Current Temperatures of probe to master controller, master controller passes through data collecting card Real-time Collection from the temperature simulation voltage signal of temperature sensing component and the analog voltage signal from Hall element, then by temperature intelligent backoff algorithm, paired pulses eddy current probe output signal carries out second-order correction, thus significantly eliminate the impact of temperature drift factor on probe, promote Detection results.
As shown in Figure 4, the rectangular aluminum sheet that standard specimen is length × wide × height=300mm × 40mm × 10mm, material selection 7075 aluminium alloy, rectangular aluminum sheet length direction is processed with equidistant 60mm four rectangular channels perpendicular to long limit, their width is 3mm, and the degree of depth respectively is 2mm, 4mm, 6mm, 8mm;
As shown in Figure 5, detection method of the present invention, comprises transducer calibration step, sets up three-dimension curved surface step and survey calculation step:
(1) transducer calibration step, comprises following sub-step:
(1.1) from environment temperature, with 0.1 DEG C for increment, the temperature t equidistantly increased progressively
iunder measure Hall element output voltage signal in air and standard specimen different depth h successively
jhall element output voltage signal corresponding to fault location, wherein, i=1,2 ..., 20, j=1,2,3,4, h
1=2mm, h
2=4mm, h
3=6mm, h
4=8mm; Using the Hall element output voltage signal in air as reference voltage signal;
(1.2) output voltage signal then recorded at each deep defects place respectively and reference voltage signal carry out difference, obtain the crest voltage p of each differential signal
ij=p (t
i, h
j), as corresponding temperature t
i, depth of defect h
junder nominal data;
(2) set up three-dimension curved surface step, comprise following sub-step:
(2.1) according to corresponding temperature t
i, depth of defect h
junder nominal data p
ij, by Matlab data fitting algorithms, simulate 20 with any depth of defect x be independent variable, the corresponding differential signal crest voltage y function curve that is dependent variable:
y(t
1)＝a
01+a
11x+a
21x
2+…、
Flat
y(t
i)＝a
0i+a
1ix+a
2ix
2+…
y(t
m)＝a
0m+a
1mx+a
2mx
2+…
Wherein 0≤x≤10mm, the coefficient a in expression formula
ijnumber and size determined by fitting algorithm;
(2.2) based on the least-squres camber fitting algorithm of rectangular domain, above-mentioned 20 function curves are fitted to continuous, a smooth three-dimension curved surface, provide three-dimension curved surface analytic expression y (t, x), wherein t is arbitrary temp;
(3) survey calculation step, comprises following sub-step:
(3.1) at current environmental temperature t
cunder, the Hall element output voltage signal respectively in measurement air and the Hall element output voltage signal of corresponding fault location, calculate the differential signal crest voltage y of the two simultaneously
c;
(3.2) by data t
c, y
csubstitute into described three-dimension curved surface analytic expression y (t, x), calculate corresponding tested depth of defect x.
Described detection method, can also by the temperature t equidistantly increased progressively measured by sub-step (1.1)
i, reference voltage signal, standard specimen different depth h
jhall element output voltage signal corresponding to fault location and the current environmental temperature t measured by step (3)
c, the Hall element output voltage signal in air, the Hall element output voltage signal of corresponding fault location and the tested depth of defect x that calculates deliver to master controller and store and show.
Claims (6)
1. a pulse eddy current probe, comprise shell (1), terminal stud (2), temperature sensing component (3), Hall element (4), coil rack (5), drive coil (6) and end cap (7), it is characterized in that:
Described shell (1) is open for bottom, the pipe of top perforate, and be made up of shielding heat-barrier material, its center, top has through hole (1A); The terminal stud (2), temperature sensing component (3) and the Hall element (4) that contact successively are housed in described shell (1) from top to bottom, and the upper end of described terminal stud (2) passes from described through hole (1A); Described temperature sensing component (3) overcoat has coil rack (5), and described coil rack (5) has axial pass trough (5A) for hollow heat conduction pipe, its outer wall side; Described drive coil (6) is air core coil, is fixed on coil rack (5); Described Hall element (4) is fixed on described temperature sensing component (5) bottom face; Described end cap (7) is connected with described shell (3), and described Hall element (4) axial compression is also closed described shell (1) bottom at described temperature sensing component (5) bottom face;
Described temperature sensing component (3) comprises temperature sensor and voltage conversion circuit corresponding with it;
The wiring of described Hall element (4) is passed by the axial pass trough (5A) of coil rack (5), all concentrates be connected to described terminal stud (2) with the wiring of described temperature sensing component (3) and drive coil (6).
2. pulse eddy current probe as claimed in claim 1, is characterized in that:
Temperature sensor in described temperature sensing component (3) is negative temperature coefficient linear temperature sensor;
Described shell (1) and end cap (7) are made up of ceramic fibre material;
Described coil rack (5) is made up of thermal conductive ceramic material;
Described drive coil (6) is the cylinder type hollow coil adopting the coiling of copper paint envelope curve.
3. comprise a pick-up unit for pulse eddy current probe described in claim 1 or 2, it comprises signal generator, power amplifier, signal conditioning circuit, pulse eddy current probe, data collecting card, master controller and stabilized voltage supply; It is characterized in that:
Described signal generator output terminal connects power amplifier input, and power amplifier output connects the drive coil of described pulse eddy current probe;
The Hall element of described pulse eddy current probe, the wiring of temperature sensing component are connected to signal conditioning circuit respectively, and the output terminal of signal conditioning circuit is connected with data collecting card, and data collecting card is connected with master controller; Hall element, temperature sensing component and signal conditioning circuit in described stabilized voltage supply paired pulses eddy current probe are powered;
Described signal conditioning circuit changes digital signal into by data collecting card, delivers to master controller and process after carrying out filtering and signal amplification to Hall element, temperature sensing component output signal.
4. pick-up unit as claimed in claim 3, is characterized in that: the output signal of described signal generator is frequency, amplitude, rectangle square-wave signal that dutycycle is adjustable.
5. utilize the detection method of pick-up unit described in claim 3 or 4, comprise transducer calibration step, set up three-dimension curved surface step and survey calculation step, it is characterized in that:
(1) transducer calibration step, comprises following sub-step:
(1.1) from environment temperature, with 0.1 DEG C for increment, at equidistant increasing temperature t
iunder measure Hall element output voltage signal in air and standard specimen different depth h successively
jhall element output voltage signal corresponding to fault location, wherein, i=1,2 ..., 20, j=1,2,3,4, h
1=2mm, h
2=4mm, h
3=6mm, h
4=8mm; Using the Hall element output voltage signal in air as reference voltage signal;
Described standard specimen is the rectangular aluminum sheet of length × wide × height=300mm × 40mm × 10mm, material selection 7075 aluminium alloy, and rectangular aluminum sheet length direction is processed with equidistant 60mm four rectangular channels perpendicular to long limit, their width is 3mm, degree of depth h
jrespectively be 2mm, 4mm, 6mm, 8mm:
(1.2) output voltage signal then recorded at each deep defects place respectively and reference voltage signal carry out difference, obtain the crest voltage p of each differential signal
ij=p (t
i, h
j), as corresponding temperature t
i, depth of defect h
junder nominal data;
(2) set up three-dimension curved surface step, comprise following sub-step
(2.1) according to corresponding temperature t
i, depth of defect h
junder nominal data p
ij, by Matlab data fitting algorithms, simulate 20 with any depth of defect x be independent variable, the corresponding differential signal crest voltage y function curve that is dependent variable:
y(t
1)＝a
01+a
11x+a
21x
2+…
y(t
i)＝a
0i+a
1ix+a
2ix
2+…
y(t
m)＝a
0m+a
1mx+a
2mx
2+…
Wherein 0≤x≤10mm, the coefficient a in expression formula
ijnumber and size determined by fitting algorithm;
(2.2) based on the least-squres camber fitting algorithm of rectangular domain, above-mentioned 20 function curves are fitted to continuous, a smooth three-dimension curved surface, provide three-dimension curved surface analytic expression y (t, x), wherein t is arbitrary temp;
(3) survey calculation step, comprises following sub-step:
(3.1) at current environmental temperature t
cunder, the Hall element output voltage signal respectively in measurement air and the Hall element output voltage signal of corresponding fault location, calculate the differential signal crest voltage y of the two simultaneously
c;
(3.2) by data t
c, y
csubstitute into described three-dimension curved surface analytic expression y (t, x), calculate the degree of depth x of corresponding tested defect.
6. detection method as claimed in claim 5, is characterized in that:
By the temperature t equidistantly increased progressively measured by sub-step (1.1)
i, reference voltage signal, standard specimen different depth h
jhall element output voltage signal corresponding to fault location and the current environmental temperature t measured by step (3)
c, the Hall element output voltage signal in air, the Hall element output voltage signal of corresponding fault location and the tested depth of defect x that calculates deliver to master controller and store and show.
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