CN104862647B - A kind of mask plate and preparation method thereof, display panel, display device - Google Patents
A kind of mask plate and preparation method thereof, display panel, display device Download PDFInfo
- Publication number
- CN104862647B CN104862647B CN201510242834.8A CN201510242834A CN104862647B CN 104862647 B CN104862647 B CN 104862647B CN 201510242834 A CN201510242834 A CN 201510242834A CN 104862647 B CN104862647 B CN 104862647B
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- Prior art keywords
- opening
- mask plate
- breach
- substrate
- shutter
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/18—Sheet panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
- B23K2103/05—Stainless steel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Abstract
The invention discloses a kind of mask plate and preparation method thereof, display panel, display device, the present invention to mask plate by being improved, specifically, intersection during at least part lateral incision face of each opening of mask plate with evaporation close to the surface of substrate side sets jagged, the breach is realized using chemical etching or laser cutting method, the breach enables to area of the opening close to substrate side during evaporation to be more than area of the opening away from substrate side, so as to, increase the area for the film layer fringe region being deposited on substrate, improve the degree of planarization of fringe region, avoid the possibility that the metallic diaphragm being subsequently formed is broken because step is too high, improve the yield of product.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of mask plate and preparation method thereof, display panel, display dress
Put.
Background technology
In the prior art, when making OLED display panel, typically frequently with vacuum evaporation mode by organic material or
Metal material etc. is deposited onto substrate, the film layer needed for being formed.Specifically, there are multiple openings 11 using as shown in Fig. 1 (a)
Mask plate, including shutter 12 and outer rim 13, by being heated at high temperature in vacuum chamber to vapor deposition source so that organic
Material or metal material are evaporated in substrate through opening, form corresponding film layer.
It is the cross-section structure of any one opening 11 and its neighbouring shutter 12 in existing mask plate as shown in Fig. 1 (b)
Figure, the opening 11 is surrounded by shutter tangent plane 14 to be formed, and the section of the shutter 12 near the opening 11 is in splayed, in reality
During the vapor deposition on border, the organic material or metal material that vapor deposition source is evaporated spray in pencil, utilize shutter 12
Block, organic material or metal material are passed through into opening 11, are evaporated on substrate 15, from Fig. 1 (b), because pencil is sprayed
Penetrate, the film layer of the intermediate region of its film layer 16 formed is more uniform, and the fringe region of film layer has one and is similar to step
The gradient, about 2000 to 3000 angstroms, the presence of this gradient, can in follow-up evaporation metal material, the gold resulted in
Belong to the fracture of film layer, cause shorted devices.
The content of the invention
The embodiment of the present invention provides a kind of mask plate and preparation method thereof, display panel, display device, existing to solve
Cause follow-up shape because the gradient that the film layer fringe region to be formed is deposited using existing mask plate is larger present in technology
Into metallic diaphragm be easily broken, and then the problem of cause shorted devices.
The embodiment of the present invention uses following technical scheme：
A kind of mask plate, for substrate to be deposited, including shutter, is distributed with several and presets on the shutter
The opening of shape, each opening is surrounded by tangent plane on the upside of plate thickness direction is blocked, and is surrounding at least part institute of the opening
Set jagged on the intersection on the surface of substrate side when the lateral incision face of stating is with evaporation so that the opening is close to substrate one
The area of side is more than the area of the opening away from substrate side.
Preferably, on the vertical section of the shutter, the figure of the breach is triangle or rectangle.
Preferably, the depth capacity of the breach is less than or equal to the minimum thickness of the shutter.
Preferably, the preset shape is rectangle, at 4 lateral incision faces of the opening and the evaporation close to substrate one
Breach is both provided with the intersection on the surface of side.
Preferably, the mask plate also includes outer rim, and the outer rim of the mask plate and the material of shutter are stainless
Steel metal or dilval.
Preferably, the mask plate also includes：First point of contact, the second point of contact, the first extended line and the 3rd intersection point, wherein the
One point of contact is tangent line and the intersection point in the lateral incision face on the shutter vertical section, and the second point of contact is on the shutter vertical section
Tangent line and the intersection point on the surface, the first extended line are the extended lines at vapor deposition source center and first point of contact line, and the 3rd hands over
Point is first extended line and the intersection point on the surface, and the air line distance at the second point of contact to the opening is more than or equal to the 3rd
Air line distance of the intersection point to the opening.
A kind of display panel, the film layer being made using described mask plate.
A kind of display device, including described display panel.
A kind of preparation method of mask plate, applied to the shutter for the opening that several preset shapes are distributed with, wherein, often
Individual opening is formed by blocking tangent plane on the upside of plate thickness direction and surround, surround at least part lateral incision face of the opening with
Breach is formed on the intersection on the surface of substrate side so that area of the opening close to substrate side is more than during evaporation
The area of the opening away from substrate side.
Preferably, the breach is formed using etching technics.
In embodiments of the present invention, because vapor deposition technique of the prior art can cause the side of the film layer of evaporation formation
The degree of planarization in edge region is not high, forms larger stepped area, in turn results in the metallic diaphragm being subsequently formed and be broken.
In order to improve and avoid the generation of the problem, the present invention to mask plate by being improved, specifically, and each of mask plate is opened
Set jagged on the intersection on the surface of substrate side when at least part lateral incision face of mouth is with evaporation, the breach useization
Learn etching or laser cutting method is realized, the breach enables to area of the opening close to substrate side to be more than described open
Area of the mouth away from substrate side, so that, the area for the film layer fringe region being deposited on substrate is increased, fringe region is improved
Degree of planarization, it is to avoid the possibility that the metallic diaphragm being subsequently formed is broken because step is too high, improve product
Yield.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, makes required in being described below to embodiment
Accompanying drawing is briefly introduced, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for this
For the those of ordinary skill in field, without having to pay creative labor, it can also be obtained according to these accompanying drawings
His accompanying drawing.
Fig. 1 (a) is the top view schematic diagram of mask plate in the prior art；
Fig. 1 (b) is the vertical section structure chart of any one opening and its neighbouring shutter in existing mask plate；
Fig. 2 is a kind of top view schematic diagram of mask plate provided in an embodiment of the present invention；
Fig. 3 is the local vertical section structural representation being open for any one in Fig. 2；
Fig. 4 is the design principle schematic diagram of breach in the present invention；
Fig. 5 (a) is that the vertical section figure of breach in the embodiment of the present invention is the schematic diagram of rectangle；
Fig. 5 (b) is that the vertical section figure of breach in the embodiment of the present invention is the schematic diagram of triangle；
Fig. 6 (a) is a kind of optimal gap structure schematic diagram provided in an embodiment of the present invention；
Fig. 6 (b) is a kind of cambered gap structure schematic diagram of band provided in an embodiment of the present invention；
Fig. 7 (a) -7 (c) is the schematic diagram of three kinds provided in an embodiment of the present invention evaporation modes；
Fig. 8 is a kind of structural representation of display panel provided in an embodiment of the present invention.
Embodiment
In order that the object, technical solutions and advantages of the present invention are clearer, below in conjunction with accompanying drawing the present invention is made into
One step it is described in detail, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole implementation
Example.Based on the embodiment in the present invention, what those of ordinary skill in the art were obtained under the premise of creative work is not made
All other embodiment, belongs to the scope of protection of the invention.
In embodiments of the present invention, because vapor deposition technique of the prior art can cause the side of the film layer of evaporation formation
The degree of planarization in edge region is not high, forms larger stepped area, in turn results in the metallic diaphragm being subsequently formed and be broken.
In order to improve and avoid the generation of the problem, the present invention to mask plate by being improved, specifically, and each of mask plate is opened
Set jagged on the intersection on the surface of substrate side when at least part lateral incision face of mouth is with evaporation, the breach useization
Learn etching or laser cutting method is realized so that the area close to substrate side that is open during evaporation is more than opening away from substrate one
The area of side, so that, the area for the film layer fringe region being deposited on substrate is increased, the planarization journey of fringe region is improved
Degree, it is to avoid the possibility that the metallic diaphragm being subsequently formed is broken because step is too high, improves the yield of product.
Technical scheme involved in the present invention is described in detail below by specific embodiment, the present invention include but
It is not limited to following examples.
As shown in Fig. 2 being a kind of structural representation of mask plate provided in an embodiment of the present invention, the mask plate 2 is mainly wrapped
Include：
The opening 22 of several preset shapes is distributed with shutter 21, the shutter 21, each opening 22 is equal
Surrounded by blocking tangent plane 211 on the upside of plate thickness direction and formed, the part section for any one opening 22 with reference to shown in Fig. 3
Structural representation, it is described opening 22 at least part lateral incision face 211 with evaporation when close to substrate side surface friendship
Jagged 222 are set at boundary so that area of the opening 22 close to substrate side is more than the opening away from base during evaporation
The area of plate side, the i.e. area of the unlimited region a that the opening 22 close to substrate side is collectively forming with breach 222 is more than far
From the unlimited region b of the formation of opening 22 of substrate side.
The mask plate 2 at least part lateral incision face 211 of opening 22 with evaporation when close to substrate side surface boundary
Jagged 222 are set in place, i.e., the breach 222 is close to substrate 3 so that 22 area close to substrate side that is open during evaporation is more than
Be open 22 areas away from substrate side.So as to so that the organic material or metal material evaporated from vapor deposition source lacks through this
On mouth 222, evaporation to substrate 3, such direct effect is：Increase vapor deposition source evaporation to the area of the film layer on substrate, so that,
The degree of planarization of the fringe region of film layer is improved, is improved because the degree of planarization of film layer is not high and causes what is be subsequently formed
The phenomenon that metallic diaphragm is broken.
Preferably, it is contemplated that the opening of mask plate is designed according to default panel size, therefore, implementing the present invention's
While scheme, it is ensured that the size of opening is constant, it then becomes necessary to which the shutter after ensureing to be formed breach is vertical
Area of the area of projection on orientation substrate still for default opening, this breach 222 for being accomplished by setting is met：The breach
222 depth capacity is less than or equal to the minimum thickness of the shutter.Moreover, it is contemplated that to making full use of the breach 222 to be formed,
Farthest organic material or metal material through the breach 222 are evaporated on substrate, the breach 222 of setting is also needed to
Meet：Depth capacity of the breach 222 on substrate level direction is not less than the depth capacity of the breach 222 (in substrate
Depth capacity in vertical direction) and the corresponding ratio that tangent of an angle value is deposited, wherein, the evaporation angle is the evaporation
The angle of extended line and substrate surface where the direction of the launch of deposition material in source, specifically, as shown in figure 3, lacking with described
The evaporation angle that the depth capacity of mouth 222 is corresponding is α1, wherein, α2Not form 22 corresponding evaporation angles of opening during breach 222.
Preferably, on the vertical section of shutter, the figure of the breach is triangle or rectangle.
Preferably, in embodiments of the present invention, the breach in mask plate can be configured by following principle, specifically
Ground, the mask plate also includes：First point of contact, the second point of contact, the first extended line and the 3rd intersection point, wherein, the first point of contact is institute
State the intersection point of tangent line and the lateral incision face on shutter vertical section, the second point of contact be on the shutter vertical section tangent line with it is described
The intersection point on surface, the first extended line is the extended line at vapor deposition source center and first point of contact line, and the 3rd intersection point is described
One extended line and the intersection point on the surface, the air line distance at the second point of contact to the opening are more than or equal to the 3rd intersection point described in
The air line distance of opening.Specifically, as shown in figure 4, in the mask plate, the first point of contact is x1, the second point of contact is x2, and first prolongs
Long line is L1, and the 3rd intersection point is x3, and the second point of contact x2 to opening center air line distance m is necessarily greater than or equal to the 3rd intersection point x3
To the air line distance n at opening center.
Specifically, as shown in Fig. 5 (a), the figure of breach involved in the present invention can be rectangle, and the breach hangs down in substrate
The upward depth of Nogata is the wide a of rectangle, and the depth on substrate level direction is the long b of rectangle.Therefore, the square is being determined
After the wide a of v notch v, according to the corresponding evaporation angle Α of the wide a of the rectangular indentation, it may be determined that the long b of rectangular indentation is at least
a/tanΑ。
As shown in Fig. 5 (b), the figure of breach involved in the present invention can be triangle, and the breach is in substrate Vertical Square
Upward depth capacity is a right-angle side c of triangle, and the depth capacity on substrate level direction is the another of triangle
Individual right-angle side d.Therefore, after leg c is determined, according to right-angle side c, (breach is in substrate Vertical Square
Upward depth capacity) corresponding evaporation angle Β, it may be determined that another right-angle side d of the triangle is at least c/tan Β.
A kind of embodiment preferably, the figure of the breach is triangle, and the breach is in substrate vertical direction
Depth capacity is the minimum thickness of the shutter.
It is a kind of optimal gap structure provided in an embodiment of the present invention, the portion that the breach is dug up as shown in Fig. 6 (a)
The figure divided is triangle, it is contemplated that the depth of cut of the breach is limited, therefore, and the breach is in substrate vertical direction in the present invention
On depth capacity be the shutter minimum thickness h, so, the breach both can guarantee that less than or equal to h pairs of the minimum thickness
The organic material in all evaporation angular regions or metal material answered are deposited onto substrate through the breach, be can guarantee that and are not broken again
The size of the opening of the bad mask plate, it is to avoid the influence to the size of the panel of formation.
It should be noted that in embodiments of the present invention, it is contemplated that manufacture craft has deviation, therefore, is made
The notch geometry of mask plate is not complete consistent with default notch geometry, the especially vertical section of breach, might not
Strictly linearly set, it is possible to there can be the radian as shown in Fig. 6 (b).
Preferably, the preset shape of the opening is rectangle, close to substrate when four lateral incision faces of the opening are with evaporation
The intersection on the surface of side is provided with the breach.The mask plate includes shutter, and the shutter includes several
The opening of rectangle, each opening is blocked tangent plane encirclement on the upside of plate thickness direction by four and formed.Wherein, the size of rectangle is according to institute
The panel size setting needed.Each shutter tangent plane of the opening is provided with breach.
Preferably, the mask plate also includes outer rim, moreover, to ensure there is same expansion deformation, the mask plate
The material of outer rim is consistent with the material of the shutter of the mask plate, be the smaller stainless steel metal of thermal coefficient of expansion or
Person's dilval.
Generally, the thickness of the outer rim of the mask plate is significantly larger than the thickness of shutter, to be thrown the net
When play a part of the support mask plate.
It should be noted that above-mentioned involved mask plate can have at least following three kinds of evaporation modes：
Mode one：As shown in Fig. 7 (a), substrate 41 is under, and vapor deposition source 42 is upper, and mask plate 43 is located between the two, evaporation
Organic material or metal material are sprayed downwards in source 42.
Mode two：As shown in Fig. 7 (b), substrate 51 is upper, and vapor deposition source 52 is under, and mask plate 53 is located between the two, evaporation
Organic material or metal material are sprayed upwards in source 52.
Mode three：As shown in Fig. 7 (c), substrate 61 is disposed vertically, and vapor deposition source 62 is located at the side of its film layer to be deposited, covers
Diaphragm plate 63 is located between the two, the horizontal-jet organic material of vapor deposition source 62 or metal material.
The display panel being made using mask plate of the present invention, especially OLED display panel is described below,
In fact, the application method of mask plate involved in the present invention similarly to the prior art, still, due to the structure of mask plate of the present invention
Different from the structure of mask plate in the prior art, therefore, the film layer for the display panel being made compared with prior art, its yield
Improve a lot, the production yield of display panel is improved to a certain extent, production development cost is reduced.
As shown in figure 8, being a kind of structural representation of display panel provided in an embodiment of the present invention, the display panel bag
Include：
Substrate 71, the film layer 72 being made using above-mentioned mask plate, wherein, (the rectangular broken line institute's frame face of film layer 72
Product) area be more than and be not provided with the area of the film layer 73 (dotted-line ellipse institute frame area) that the mask plate of breach is made so that,
So that the degree of planarization of fringe region is higher, it ensure that the metallic diaphragm (such as negative electrode) being subsequently formed is not broken,
Avoid occurring open circuit.
In addition, the embodiment of the present invention additionally provides a kind of display device, including described display panel.The display device
There can be display work(for mobile phone, tablet personal computer, television set, display, notebook computer, DPF, navigator etc. are any
The product or part of energy.
In addition, the embodiment of the present invention additionally provides a kind of preparation method of mask plate, preset applied to several are distributed with
In the shutter of the opening of shape, wherein, each opening is formed by tangent plane encirclement on the upside of plate thickness direction is blocked, in fact, this
Similarly to the prior art, it focuses on lateral incision face of the present invention also on plate thickness direction is blocked and is provided with for the setting of one opening
Breach, concrete operation method is：Using chemical etching or laser cutting parameter, surrounding described at least part of the opening
Breach is formed on the intersection on the surface of substrate side so that the opening is close to substrate side when lateral incision face is with evaporation
Area is more than the area of the opening away from substrate side.
, but those skilled in the art once know basic creation although preferred embodiments of the present invention have been described
Property concept, then can make other change and modification to these embodiments.So, appended claims are intended to be construed to include excellent
Select embodiment and fall into having altered and changing for the scope of the invention.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the present invention to the present invention
God and scope.So, if these modifications and variations of the present invention belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising including these changes and modification.
Claims (9)
1. a kind of mask plate, for substrate to be deposited, including shutter, several default shapes are distributed with the shutter
The opening of shape, each opening is surrounded by tangent plane on the upside of plate thickness direction is blocked, it is characterised in that
Set when surrounding at least part lateral incision face of the opening with evaporation on the intersection on the surface of substrate side
It is equipped with breach so that area of the opening close to substrate side is more than the area of the opening away from substrate side；
The depth capacity of the breach is less than or equal to the minimum thickness of the shutter；
Depth capacity of the breach on the substrate level direction is not less than the breach in the substrate vertical direction
Depth capacity and corresponding evaporation tangent of an angle value ratio, wherein, the evaporation angle is the deposition material in vapor deposition source
The direction of the launch where extended line and the substrate surface normal angle.
2. mask plate as claimed in claim 1, it is characterised in that on the vertical section of the shutter, the figure of the breach
For triangle or rectangle.
3. mask plate as claimed in claim 1, it is characterised in that the preset shape is rectangle, in 4 sides of the opening
When tangent plane is with the evaporation breach is both provided with the intersection on the surface of substrate side.
4. mask plate as claimed in claim 1, in addition to outer rim, it is characterised in that the outer rim of the mask plate and screening
The material of baffle plate is stainless steel metal or dilval.
5. mask plate as claimed in claim 1, it is characterised in that
The mask plate also includes：First point of contact, the second point of contact, the first extended line and the 3rd intersection point, wherein the first point of contact is institute
State the intersection point of tangent line and the lateral incision face on shutter vertical section, the second point of contact be on the shutter vertical section tangent line with it is described
The intersection point on surface, the first extended line is the extended line at vapor deposition source center and first point of contact line, and the 3rd intersection point is described
One extended line and the intersection point on the surface, the air line distance at the second point of contact to the opening are more than or equal to the 3rd intersection point described in
The air line distance of opening.
6. a kind of display panel, it is characterised in that the film being made using any described mask plates of claim 1-5
Layer.
7. a kind of display device, it is characterised in that including the display panel described in claim 6.
8. a kind of preparation method of mask plate, applied to the shutter for the opening that several preset shapes are distributed with, wherein, each
Opening is formed by tangent plane encirclement on the upside of plate thickness direction is blocked, it is characterised in that
When surrounding at least part lateral incision face of the opening with evaporation on the intersection on the surface of substrate side shape
Into breach so that area of the opening close to substrate side is more than the area of the opening away from substrate side.
9. preparation method as claimed in claim 8, it is characterised in that form the breach using etching technics.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510242834.8A CN104862647B (en) | 2015-05-13 | 2015-05-13 | A kind of mask plate and preparation method thereof, display panel, display device |
| US15/150,609 US20160333457A1 (en) | 2015-05-13 | 2016-05-10 | Mask plate, method for fabricating the same, display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510242834.8A CN104862647B (en) | 2015-05-13 | 2015-05-13 | A kind of mask plate and preparation method thereof, display panel, display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104862647A CN104862647A (en) | 2015-08-26 |
| CN104862647B true CN104862647B (en) | 2017-10-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510242834.8A Active CN104862647B (en) | 2015-05-13 | 2015-05-13 | A kind of mask plate and preparation method thereof, display panel, display device |
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| Country | Link |
|---|---|
| US (1) | US20160333457A1 (en) |
| CN (1) | CN104862647B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105449126B (en) * | 2015-12-22 | 2018-03-16 | 上海天马有机发光显示技术有限公司 | A kind of Vapor deposition mask plate and preparation method thereof |
| CN108091775A (en) * | 2016-11-22 | 2018-05-29 | 昆山国显光电有限公司 | The vapor deposition mask plate and evaporation coating method of a kind of Organic Light Emitting Diode |
| JP2018170152A (en) * | 2017-03-29 | 2018-11-01 | Ｔｉａｎｍａ Ｊａｐａｎ株式会社 | Manufacturing method of oled display device, mask and design method of mask |
| JP7232882B2 (en) * | 2017-03-29 | 2023-03-03 | 天馬微電子有限公司 | OLED display device manufacturing method, mask and mask design method |
| KR102388719B1 (en) * | 2017-07-20 | 2022-04-21 | 삼성디스플레이 주식회사 | Mask for thin film deposition, method for manufacturing thereof, and method for manufacturing a display apparatus using the same |
| CN107546336A (en) * | 2017-08-16 | 2018-01-05 | 武汉华星光电半导体显示技术有限公司 | A kind of OLED thin-film packages mask plate |
| CN108598292B (en) * | 2018-04-24 | 2020-08-21 | 武汉天马微电子有限公司 | Mask plate and manufacturing method thereof |
| CN109461834B (en) * | 2018-09-19 | 2022-02-11 | 云谷（固安）科技有限公司 | Light emitting display device, manufacturing method thereof and electronic equipment |
| CN109638039B (en) * | 2018-11-26 | 2020-08-11 | 武汉华星光电半导体显示技术有限公司 | Organic electroluminescent device, preparation method thereof and display device |
| US10789884B2 (en) | 2018-11-26 | 2020-09-29 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Electrogenerated organic light-emitting diode device, manufacturing method, and display device thereof |
| CN109371361A (en) * | 2018-12-15 | 2019-02-22 | 武汉华星光电半导体显示技术有限公司 | Mask plate component and display panel and preparation method thereof |
| CN110438446B (en) | 2019-07-31 | 2020-12-29 | 昆山国显光电有限公司 | Mask assembly and display device |
| WO2021096115A1 (en) * | 2019-11-11 | 2021-05-20 | (주)더숨 | Mask for manufacturing oled, and oled manufacturing method |
| CN112095074B (en) * | 2020-09-18 | 2023-04-18 | 京东方科技集团股份有限公司 | Mask plate, array substrate, display device and manufacturing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185350A (en) * | 1999-12-24 | 2001-07-06 | Sanyo Electric Co Ltd | Worn mask, its manufacturing method, electroluminescent display device and its manufacturing method |
| KR100525819B1 (en) * | 2003-05-06 | 2005-11-03 | 엘지전자 주식회사 | Shadow mask for manufacturing organic electroluminiscent display panel |
-
2015
- 2015-05-13 CN CN201510242834.8A patent/CN104862647B/en active Active
-
2016
- 2016-05-10 US US15/150,609 patent/US20160333457A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20160333457A1 (en) | 2016-11-17 |
| CN104862647A (en) | 2015-08-26 |
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