CN104859316B - Disk cutter sweep - Google Patents
Disk cutter sweep Download PDFInfo
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- CN104859316B CN104859316B CN201410057236.9A CN201410057236A CN104859316B CN 104859316 B CN104859316 B CN 104859316B CN 201410057236 A CN201410057236 A CN 201410057236A CN 104859316 B CN104859316 B CN 104859316B
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- Prior art keywords
- readiness
- readiness sensor
- sensor
- dise knife
- width
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Abstract
The present invention discloses a kind of disk cutter sweep, and it as one man can effectively carry out cutoff process with the width of medium, and the disk cutter sweep includes：Fixing cutter, is arranged on the width of medium；Dise knife, moves along the fixing cutter, and the above-mentioned medium of cut-out that cooperated with above-mentioned fixing cutter；First position of readiness sensor and the second position of readiness sensor, can move, and be arranged respectively at the width of above-mentioned medium on above-mentioned width（Breadth）Outside side and opposite side；Detection plate, is detected by above-mentioned first position of readiness sensor and above-mentioned second position of readiness sensor；And dise knife portion, rotatably support above-mentioned dise knife and with above-mentioned detection plate, and moved between above-mentioned first position of readiness sensor and above-mentioned second position of readiness sensor.
Description
Technical field
The present invention relates to a kind of disk cutter sweep, more particularly, to hot duplication, thermal printer etc. are used
Medium cuts into the disk cutter sweep of specific length.
Background technology
In recent years, disk cutter sweep is by making the dise knife portion with dise knife in the direction orthogonal with the conveying direction of medium
Upper movement is conveyed the medium for coming so as to cut off.From the point of view of conveying direction, the position control in dise knife portion is by configuring at two ends
Position of readiness sensor is carried out, and position of readiness standby dise knife portion is sensed by moving to the position of readiness of the other end at one end
The test position of device so as to cut off medium, and before next cutoff action the other end position of readiness sensor detecting position
Put carry out it is standby.
In such disk cutter sweep, such as in heat duplication, the thermal printer with thermal head, dise knife portion
Amount of movement, typewriting width of the width with thermal head can be cut off compared to growing and for fixed and unrelated with the size of medium.Cause
This, has no problem when the width of medium and the close cut-off width in dise knife portion, but such as in the width of the medium as being used
In that case of degree is the cut-off width half in dise knife portion, the dise knife portion compared with the amount of movement required for the cut-out of medium
Amount of movement is big, so as to have waste in the time required for cutoff process.Its cutter influence corresponding with larger medium
It is bigger, especially in the case where continuous typing is carried out significantly.
The content of the invention
To solve the above problems, it is an object of the invention to provide a kind of disk cutter sweep, it can be with the width of medium
Degree as one man changes the amount of movement in dise knife portion, and can effectively be processed.
Disk cutter sweep involved by first aspect present invention, including：Fixing cutter, is arranged on the width of medium
On；Dise knife, moves along the fixing cutter, and the above-mentioned medium of cut-out that cooperated with above-mentioned fixing cutter；First position of readiness is sensed
Device and the second position of readiness sensor, can move, and be arranged respectively at the width of above-mentioned medium on above-mentioned width（Width
Face）Outside side and opposite side；Detection plate, is sensed by above-mentioned first position of readiness sensor and above-mentioned second position of readiness
Device is detected；And dise knife portion, rotatably support above-mentioned dise knife and with above-mentioned detection plate, and in above-mentioned first position of readiness
Moved between sensor and above-mentioned second position of readiness sensor.
Additionally, the disk cutter sweep involved by second aspect present invention, including：Fixing cutter, is arranged on the width of medium
On direction；Dise knife, moves along the fixing cutter, and the above-mentioned medium of cut-out that cooperated with above-mentioned fixing cutter；First position of readiness
Sensor, is configured in the end of above-mentioned width；Second position of readiness sensor, can move on above-mentioned width
It is dynamic and arranged opposite with above-mentioned first position of readiness sensor across above-mentioned medium；Detection plate, is passed by above-mentioned first position of readiness
Sensor and above-mentioned second position of readiness sensor are detected；And dise knife portion, rotatably support above-mentioned dise knife and with above-mentioned
Detection plate, and moved between above-mentioned first position of readiness sensor and above-mentioned second position of readiness sensor.
According to such composition, can be as one man variable with the width of medium（Change）The amount of movement in dise knife portion, and pass through
The waste action unrelated with the cutoff action of medium is reduced to dise knife portion so as to realize shortening the cutoff process time of medium.
Additionally, in disk cutter sweep of the invention, in above-mentioned first position of readiness sensor and the second position of readiness
The 3rd position of readiness sensing being moved on above-mentioned width, detecting above-mentioned detection plate is provided between sensor
Device.According to such composition, can not only be corresponding with the full cutting process for cutting completely through medium, but also can be cut with by medium
Reach the partial cut treatment correspondence of midway.
Additionally, disk cutter sweep of the invention, above-mentioned detection plate to be arranged on the surface in dise knife portion（Top）.According to
Such composition, dise knife portion can be carried out immediately below the first to the 3rd position of readiness sensor it is standby, because these are standby
The distance between position sensor is roughly the same with the displacement in dise knife portion, thus user can easily with the width one of medium
Cause the position of the first to the 3rd position of readiness sensor of ground adjustment.
Disk cutter sweep according to involved by the present embodiment, by can as one man change with the width of the medium for being used
Become the displacement in dise knife portion, it is possible to shortening the time of cutoff process.
Brief description of the drawings
Below, disk cutter sweep involved in the present invention is illustrated referring to the drawings.When considered in conjunction with the accompanying drawings, lead to
Cross with reference to following detailed description, can more completely more fully understand the present invention and easily learn adjoint excellent of many of which
Point, but accompanying drawing described herein is used for providing a further understanding of the present invention, constitutes the part of the application, it is of the invention
Schematic description and description does not constitute inappropriate limitation of the present invention for explaining the present invention, wherein：
Fig. 1 is the schematic configuration diagram of the disk cutter sweep involved by the present embodiment；
Fig. 2 be represent by figure from the disk cutter sweep involved by the present embodiment to the application examples of the medium of narrow width；
Fig. 3 is the figure of the situation that the printing benchmark in Fig. 2 is set as one side；And
Fig. 4 is the schematic configuration diagram of the disk cutter sweep involved by another embodiment of the present invention.
Description of reference numerals
The dise knife portion of 1 dise knife 2
The position of readiness sensor of 3 fixing cutter 4 first
5 second position of readiness sensors
The detection plate of 6 motor 7
8 the 3rd position of readiness sensors
10 disk cutter sweeps
Specific embodiment
Below, referring to the drawings, the disk cutter sweep involved by the present embodiment is described in detail.In addition, below
The embodiment of explanation is one of the invention, if each portion be configured to realize the purpose of the present invention, then certainly in its model
Enclosing interior energy suitably change or change.
Fig. 1 is the schematic configuration diagram of the disk cutter sweep involved by the present embodiment, and Fig. 2 is represented suitable for Fig. 1
The figure of the disk cutter sweep of the situation of the medium P1 of narrow width, Fig. 3 is to represent for printing benchmark to be in fig. 2 set as one side
Situation disk cutter sweep figure.
Disk cutter sweep involved by the present embodiment（Disc cutter device）Such as with to label or price tag paper
The first-class heat of temperature-sensitive that medium carries out printing is replicated, in thermal printer, is applied to the medium P cut-out established practices that will have been printed
The device of measured length.
As shown in figure 1, the disk cutter sweep 10 involved by the present embodiment includes the dise knife portion 2 with dise knife 1 and dise knife
The fixing cutter 3 of 1 cooperation cut-out medium, the first position of readiness sensor 4 in detection dise knife portion 2 and the second position of readiness sensor 5,
And drive the motor 6 in dise knife portion 2, the first position of readiness sensor 4 and the second position of readiness sensor 5 can with medium
Moved on orthogonal direction, the i.e. width of medium P of the conveying direction of P.The action of disk cutter sweep 10 is by printing
The control units that are controlled such as the printing action of owner's body are controlled.
Dise knife 1 is rotatably arranged in dise knife portion 2, by moving in the direction of the width, will be conveyed what is come
Medium P is cut off with specific length.Dise knife portion 2 has to be used to be passed by the first position of readiness sensor 4 and the second position of readiness
The detection plate 7 of the detection of sensor 5.
Fixing cutter 3 is set to cooperate cut-out medium P with dise knife 1.Fixing cutter 3 has can in the direction of the width cut off Jie
Length as the Breadth Maximum of matter P, dise knife 1 is moved so as to cut off medium P by along fixing cutter 3.
Detection plate 7 set by first position of readiness sensor 4 and the detection dise knife of the second position of readiness sensor 5 portion 2, and
Judge the beginning of the cutoff action in dise knife portion 2, terminate.First position of readiness sensor 4 and the second position of readiness sensor 5 are equal
Can move in the direction of the width（Dotted arrow）, and it is configured in the outside of the width of be applicable medium P（Double-head arrow β 1）.This
The configuration of a little position of readiness sensors can coordinate with the printer applied suitably to be carried out.
When the first position of readiness sensor 4 and the second position of readiness sensor 5 detect detection plate 7, then motor 6
Stop, the dise knife portion 2 moved simultaneously with detection plate 7 stops on the position.In addition, the first position of readiness sensor 4 and
As long as the composition that the second position of readiness sensor 5 can be moved in the direction of the width just can be such as can also being in window frame
Fixing cutter 3 is fixed in long side direction bottom, and makes the long side direction upper support opposed with fixing cutter 3 and movably constitute.This
It is outer, or the first position of readiness sensor 4 and the second position of readiness sensor 5 is loaded and unloaded, and width can be arranged on
The composition on optional position on direction.The width of medium used due to typically being determined by specification, so such as by
Scale consistent with its specification width etc. is set on width, so as to first treat the first position of readiness sensor 4 and second
The configuration consistent with the width of medium P of machine position sensor 5 becomes easy.
Motor 6 be for make dise knife portion 2 the first position of readiness sensor 4 and the second position of readiness sensor 5 it
Between the motor that moves, annular metal cord is such as set in the way of the both ends for being erected at width, and dise knife portion 2 is installed
On the annular metal cord, annular metal cord is set to move so that dise knife portion 2 moves by motor 6.
Additionally, motor 6 is in addition to the cutoff action for medium, also dise knife 1 and fixing cutter are protected in terms of getting rusty etc.
3, due to keep（Knife）It is fast blunt, so when certain certain hour or certain cutting number is reached, it is also possible to enter to exercise dise knife portion 2 and move
Move the action of cut-off maximum magnitude.When such action is carried out, circle substantially is will appreciate that preferably with according to step number
The stepper motor of the position in knife portion 2.
Referring to figs. 1 to Fig. 3, the action to the disk cutter sweep 10 involved by the present embodiment is described in detail.
As shown in figure 1, the first position of readiness sensor 4 and the second position of readiness sensor 5 are configured in the width of medium P
（Breadth）Outside.Dise knife portion 2 with dise knife 1 is in addition to the cutoff action of medium P under the first position of readiness sensor 4
Fang Jinhang is standby, so as to not hinder the conveying of medium P.Realized on medium P by printer and print and be prescribed apart from defeated
After sending, dise knife portion 2 cuts off Jie while being moved to the second position of readiness sensor 5 from the first position of readiness sensor 4
Matter P（Arrow α 1）.Dise knife portion 2 moves, until the second position of readiness sensor 5 detects detection plate 7, when the second standby position
Put and be then judged as that cutoff action has terminated when sensor 5 detects detection plate 7, and dise knife portion 2 is sensed in the second position of readiness
The lower section of device 5 is standby.
Afterwards, after realizing printing and being prescribed distance conveying on medium P again, dise knife portion 2 is standby from second
Position sensor 5 while moved to the first position of readiness sensor 4 to medium P in lower location of a cut cut off
（Arrow α 2）.Dise knife portion 2 moves, until the first position of readiness sensor 4 detects detection plate 7.When the first position of readiness
Sensor 4 is then judged as that cutoff action has terminated when detecting detection plate 7, and makes dise knife portion 2 in the first position of readiness sensor 4
Lower section it is standby to next cutoff action.The round cutoff action is repeated, medium P is cut off.
As shown in Fig. 2 when the medium P1 of narrow width compared with medium P is applied in disk cutter sweep 10, Yong Hufen
Do not make the position of the first position of readiness sensor 4 and the second position of readiness sensor 5 to width medial movement（Dotted line arrow
Head）, and configured in the way of on the outside of the width positioned at medium P1（Double-head arrow β 2）.First position of readiness sensor 4 and
The position movement of two position of readiness sensors 5 such as makes it slide in the direction of the width or temporarily unload by user, is arranged on
Desired position is first-class to be carried out.In the cutoff action of medium P1, the first position of readiness that dise knife portion 2 can be after movement is passed
Reciprocation type action is carried out between the position of readiness sensor 51 of sensor 41 and second.
Additionally, as shown in figure 3, when printer printing benchmark Bu Shi centers such as be located at left side when, as long as first is standby
The position of position sensor 4 remains stationary as, and only makes the position of the second position of readiness sensor 5 to width medial movement（It is empty
Line arrow）And configured with the width lateral approach positioned at medium P1 just can be with.In the cutoff action of medium P1, dise knife portion
2 can carry out reciprocation type action between the second position of readiness sensor 52 after the first position of readiness sensor 4 and movement.Separately
Outward, the printer only unilateral for printing benchmark, or by the first position of readiness sensor 4 of the side of the printing benchmark
Or second position of readiness sensor 5 be fixed on width one end and irremovable specification.
Additionally, as shown in figure 4, the disk cutter sweep 20 involved by the present embodiment can also be can be in the direction of the width
The 3rd mobile position of readiness sensor 8 is arranged between the first position of readiness sensor 4 and the second position of readiness sensor 5
Constitute.
By setting the 3rd position of readiness sensor 8, dise knife portion 2 not only can be in the first above-mentioned position of readiness sensor
4 and second between position of readiness sensor 5（Arrow α 1）It is mobile, but also can be in the first position of readiness sensor 4 or the second
Between the position of readiness sensor 8 of position of readiness sensor 5 and the 3rd（Arrow α 4）It is mobile（Can be in the first position of readiness sensor
4 and the 3rd move or in the second position of readiness sensor 5 and the 3rd position of readiness sensor 8 between position of readiness sensor 8
Between move）.In the disk cutter sweep 20 of such composition, dise knife portion 2 has two different displacements, can cut
Turn-off from, can not only realize cutting completely through the full cutting process of medium P, but also can realize by medium P cut to midway
Partial cut treatment.
So, disk cutter sweep involved by the present embodiment is due to can be by position of readiness sensor in the direction of the width
Moved on optional position, so the amount of movement in dise knife portion can be as one man limited with medium, and being capable of Waste reduction cut-off part
Time required for reason.
In addition, though embodiments of the invention are illustrated, but the embodiment is proposed as an example, not
The scope of intended limitation invention.The embodiment can be implemented with other various forms, as long as not departing from the main idea of invention
In the range of can carry out various omissions, replacement, change.Embodiment and its deformation are comprised in the scope of invention or main idea,
And, it is included in invention and its impartial scope described in the scope of claim.
Claims (10)
1. a kind of disk cutter sweep, it is characterised in that including：
Fixing cutter, is arranged on the width of medium；
Dise knife, moves along the fixing cutter, and the cut-out medium that cooperated with the fixing cutter；
First position of readiness sensor and the second position of readiness sensor, can move on the width, and respectively by
Side and opposite side of the configuration in the outside of the width of the medium；
Detection plate, is detected by the first position of readiness sensor and the second position of readiness sensor；And
Dise knife portion, rotatably supports the dise knife and with the detection plate, and in the first position of readiness sensor
Moved and the second position of readiness sensor between.
2. disk cutter sweep according to claim 1, it is characterised in that
It is provided with the width between the first position of readiness sensor and the second position of readiness sensor
Upper movement, the detection detection plate the 3rd position of readiness sensor.
3. disk cutter sweep according to claim 1 and 2, it is characterised in that
The detection plate is arranged on the surface in the dise knife portion.
4. disk cutter sweep according to claim 2, it is characterised in that
Moved or in institute between the first position of readiness sensor and the 3rd position of readiness sensor in the dise knife portion
State and moved between the second position of readiness sensor and the 3rd position of readiness sensor.
5. disk cutter sweep according to claim 1, it is characterised in that
The first position of readiness sensor and the second position of readiness sensor judge the cutoff action in the dise knife portion
Beginning, terminate.
6. a kind of disk cutter sweep, it is characterised in that including：
Fixing cutter, is arranged on the width of medium；
Dise knife, moves along the fixing cutter, and the cut-out medium that cooperated with the fixing cutter；
First position of readiness sensor, is configured in the end of the width；
Second position of readiness sensor, can move on the width, and standby with described first across the medium
Position sensor is arranged opposite；
Detection plate, is detected by the first position of readiness sensor and the second position of readiness sensor；And
Dise knife portion, rotatably supports the dise knife and with the detection plate, and in the first position of readiness sensor
Moved and the second position of readiness sensor between.
7. disk cutter sweep according to claim 6, it is characterised in that
It is provided with the width between the first position of readiness sensor and the second position of readiness sensor
Upper movement, the detection detection plate the 3rd position of readiness sensor.
8. the disk cutter sweep according to claim 6 or 7, it is characterised in that
The detection plate is arranged on the surface in the dise knife portion.
9. disk cutter sweep according to claim 7, it is characterised in that
Moved or in institute between the first position of readiness sensor and the 3rd position of readiness sensor in the dise knife portion
State and moved between the second position of readiness sensor and the 3rd position of readiness sensor.
10. disk cutter sweep according to claim 6, it is characterised in that
The first position of readiness sensor and the second position of readiness sensor judge the cutoff action in the dise knife portion
Beginning, terminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410057236.9A CN104859316B (en) | 2014-02-20 | 2014-02-20 | Disk cutter sweep |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410057236.9A CN104859316B (en) | 2014-02-20 | 2014-02-20 | Disk cutter sweep |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104859316A CN104859316A (en) | 2015-08-26 |
| CN104859316B true CN104859316B (en) | 2017-06-13 |
Family
ID=53905676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410057236.9A Expired - Fee Related CN104859316B (en) | 2014-02-20 | 2014-02-20 | Disk cutter sweep |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104859316B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105195805B (en) * | 2015-09-29 | 2017-09-15 | 安徽省宁国市天成科技发展有限公司 | A kind of many executing agency's steel pipe cutting control systems |
| CN106825753B (en) * | 2015-12-03 | 2019-06-21 | Posco公司 | Material cutter device and clamping partitioning device |
| CN108858308B (en) * | 2018-06-20 | 2020-09-08 | 台山市宏盛自动化机械有限公司 | Disc cutting device |
| JP7363141B2 (en) * | 2019-07-11 | 2023-10-18 | セイコーエプソン株式会社 | Cutter device and printing device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5531530A (en) * | 1993-01-12 | 1996-07-02 | Nitto Denko Corp. | Printer and a method of sorting out and cutting papers printed thereby |
| CN2417022Y (en) * | 2000-03-09 | 2001-01-31 | 南京紫金电子信息设备有限公司 | Automatic paper-cutting printer |
| CN101456300A (en) * | 2007-12-14 | 2009-06-17 | 富士通电子零件有限公司 | Rotary cutter unit and printer device having the unit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3962251B2 (en) * | 2001-12-26 | 2007-08-22 | 株式会社サトー | Cutter equipment |
-
2014
- 2014-02-20 CN CN201410057236.9A patent/CN104859316B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5531530A (en) * | 1993-01-12 | 1996-07-02 | Nitto Denko Corp. | Printer and a method of sorting out and cutting papers printed thereby |
| CN2417022Y (en) * | 2000-03-09 | 2001-01-31 | 南京紫金电子信息设备有限公司 | Automatic paper-cutting printer |
| CN101456300A (en) * | 2007-12-14 | 2009-06-17 | 富士通电子零件有限公司 | Rotary cutter unit and printer device having the unit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104859316A (en) | 2015-08-26 |
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