CN104851955A - Flexible fluorescent substrate based on secondary optical design and LED light source - Google Patents

Flexible fluorescent substrate based on secondary optical design and LED light source Download PDF

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Publication number
CN104851955A
CN104851955A CN201510164400.0A CN201510164400A CN104851955A CN 104851955 A CN104851955 A CN 104851955A CN 201510164400 A CN201510164400 A CN 201510164400A CN 104851955 A CN104851955 A CN 104851955A
Authority
CN
China
Prior art keywords
optical design
secondary optical
light source
substrate
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510164400.0A
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Chinese (zh)
Inventor
高鞠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Jing Pin New Material Ltd Co
Original Assignee
Suzhou Jing Pin New Material Ltd Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Jing Pin New Material Ltd Co filed Critical Suzhou Jing Pin New Material Ltd Co
Priority to CN201510164400.0A priority Critical patent/CN104851955A/en
Publication of CN104851955A publication Critical patent/CN104851955A/en
Priority to PCT/CN2015/093843 priority patent/WO2016161803A1/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details

Abstract

The invention provides a flexible fluorescent substrate based on secondary optical design and an LED light source. The flexible fluorescent substrate comprises fluorescent powders or quantum dots which are doped with one of the following components including PET, PI, and silica gel. A light-emitting circuit is disposed on a side of the flexible fluorescent substrate. The secondary optical design is performed on the other side of the flexible fluorescent substrate. The light-emitting circuit corresponds to horizontal LED chips or flip-chips. The secondary optical design comprises surface treatment or micro lens printing. The flexible fluorescent substrate based on secondary optical design is good in flexibility and can be used as a substrate of the LED chip. Since the light-emitting circuit is disposed on the flexible fluorescent substrate, gold threads are prevented from being arranged for the electrical connection of the LED chips. In addition, the secondary optical design is performed on the flexible fluorescent substrate and light-emitting efficiency corresponding to the LED light source is provided.

Description

Based on flexible fluorescence substrate and the LED light source of secondary optical design
Technical field
The present invention relates to lighting technical field, especially a kind of flexible fluorescence substrate based on secondary optical design and use the LED light source of this flexible fluorescence substrate.
Background technology
Light-emitting diode (Light-Emitting Diode, LED) is a kind of semiconductor electronic component that can be luminous.This electronic component occurred as far back as 1962, and can only send the ruddiness of low luminosity in early days, develop other monochromatic versions afterwards, the light that can send even to this day is throughout visible ray, infrared ray and ultraviolet, and luminosity also brings up to suitable luminosity.And purposes is also by the beginning as indicator light, display panel etc.; Along with the continuous progress of technology, light-emitting diode has been widely used in display, television set daylighting decoration and illumination.
But often light-emitting area is less, pliability is poor and luminous efficiency is not high for the light source of existing use light-emitting diode, fully cannot meet the user demand of people.
Therefore, for solving the problem, be necessary to propose further solution.
Summary of the invention
The object of the present invention is to provide a kind of flexible fluorescence substrate based on secondary optical design and use the LED light source of this flexible fluorescence substrate, to overcome the deficiencies in the prior art.
For achieving the above object, the invention provides a kind of flexible fluorescence substrate based on secondary optical design, it comprises fluorescent material or quantum dot, doped with the one in following component in described fluorescent material or quantum dot: PET, PI or silica gel;
The one side of described flexible fluorescence substrate is provided with illuminating circuit, and the another side of described flexible fluorescence substrate carries out secondary optical design;
Formal dress or the upside-down mounting of described illuminating circuit and LED chip are corresponding, and described secondary optical design comprises surface treatment or prints lenticule.
As the improvement of the flexible fluorescence substrate based on secondary optical design of the present invention, described illuminating circuit is arranged on described flexible fluorescence substrate by the mode of suppressing, printing or sputtering.
As the improvement of the flexible fluorescence substrate based on secondary optical design of the present invention, described surface treatment comprises: chemical cleaning or plasma clean or vacuum coating.
For achieving the above object, the present invention also provides a kind of LED light source, it is characterized in that, described LED light source comprises substrate and is arranged at the some LED chips on described substrate;
Described substrate is flexible fluorescence substrate described above, and described some LED chips are distributed on described flexible fluorescence substrate in the form of an array, and described some LED chips and described illuminating circuit are electrically connected.
As the improvement of LED light source of the present invention, the fixed form between described some LED chips and described flexible fluorescence substrate can be: conducting resinl, Reflow Soldering, eutectic weld.
As the improvement of LED light source of the present invention, the thickness of described LED chip is 100 ~ 150um.
As the improvement of LED light source of the present invention, the thickness of described LED light source is 300 ~ 350um.
Compared with prior art, the invention has the beneficial effects as follows: the flexible fluorescence substrate pliability based on secondary optical design of the present invention is good, can be used as the substrate of LED chip, flexible fluorescence substrate of the present invention is provided with illuminating circuit, thus makes the electrical connection of LED to choose gold thread.In addition, flexible fluorescence substrate of the present invention carries out secondary optical design, provides the luminous efficiency of corresponding LED light source.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, the accompanying drawing that the following describes is only some embodiments recorded in the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the floor map of an embodiment of the flexible fluorescence substrate based on secondary optical design of the present invention.
Embodiment
Technical scheme in the present invention is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
As shown in Figure 1, described flexible fluorescence substrate 10 of the present invention comprises fluorescent material or quantum dot, doped with the one in following component in described fluorescent material or quantum dot: PET, PI or silica gel.Thus flexible fluorescence substrate 10 can comprise the fluorescent material doped with PET, PI or silica gel, the quantum dot doped with PET, PI or silica gel also can be comprised.Setting like this, makes substrate of the present invention just have flexibility and fluorescence.
Further, the one side of described flexible fluorescence substrate 10 is provided with illuminating circuit, and the another side of described flexible fluorescence substrate 10 carries out secondary optical design.Wherein, the design of illuminating circuit depends on that the LED be positioned on flexible fluorescence substrate 10 is formal dress or upside-down mounting.Described illuminating circuit is arranged on described flexible fluorescence substrate by the mode of suppressing, printing or sputtering.Meanwhile, then gold thread need not be laid separately by arranging illuminating circuit.The surface that described secondary optical design is included in flexible fluorescence substrate 10 is carried out surface treatment or prints lenticule.Wherein, described surface treatment comprises: chemical cleaning or plasma clean or vacuum coating.
Based on flexible fluorescence substrate 10 as above, the present invention also provides a kind of LED light source using this flexible fluorescence substrate.Particularly, described LED light source some LED chips 20 of comprising flexible fluorescence substrate 10 as above and being arranged on described flexible fluorescence substrate 10.
Wherein, described some LED chips 20 are distributed on described flexible fluorescence substrate 10 in the form of an array, and described some LED chips 20 and described illuminating circuit are electrically connected.When illuminating circuit energising after, the LED chip is electrically connected with illuminating circuit can luminescence and illumination is provided.Described some LED chips 20 can adopt formal dress, and the mode of upside-down mounting also can be adopted to be arranged on flexible fluorescence substrate 10.In addition, the fixed form between described some LED chips 20 and described flexible fluorescence substrate 10 can be: conducting resinl, Reflow Soldering, eutectic weldering etc.
Further, in described some LED chips, the thickness of arbitrary LED chip is preferably 100 ~ 150um; The gross thickness of LED light source of the present invention is preferably 300 ~ 350um.
In addition, the two ends of LED light source of the present invention also lead to conductive electrode.
To sum up, the flexible fluorescence substrate pliability based on secondary optical design of the present invention is good, can be used as the substrate of LED chip, flexible fluorescence substrate of the present invention is provided with illuminating circuit, thus makes the electrical connection of LED to choose gold thread.In addition, flexible fluorescence substrate of the present invention carries out secondary optical design, provides the luminous efficiency of corresponding LED light source.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present invention or essential characteristic, the present invention can be realized in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present invention is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the present invention.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, and the technical scheme in each embodiment also through appropriately combined, can form other execution modes that it will be appreciated by those skilled in the art that.

Claims (7)

1. based on a flexible fluorescence substrate for secondary optical design, it is characterized in that, described flexible fluorescence substrate comprises fluorescent material or quantum dot, doped with the one in following component in described fluorescent material or quantum dot: PET, PI or silica gel;
The one side of described flexible fluorescence substrate is provided with illuminating circuit, and the another side of described flexible fluorescence substrate carries out secondary optical design;
Formal dress or the upside-down mounting of described illuminating circuit and LED chip are corresponding, and described secondary optical design comprises surface treatment or prints lenticule.
2. the flexible fluorescence substrate based on secondary optical design according to claim 1, is characterized in that, described illuminating circuit is arranged on described flexible fluorescence substrate by the mode of suppressing, printing or sputtering.
3. the flexible fluorescence substrate based on secondary optical design according to claim 1, it is characterized in that, described surface treatment comprises: chemical cleaning or plasma clean or vacuum coating.
4. a LED light source, is characterized in that, described LED light source comprises substrate and is arranged at the some LED chips on described substrate;
Described substrate is distributed on described flexible fluorescence substrate in the form of an array for fluorescence substrate flexible described in any one of claims 1 to 3, described some LED chips, and described some LED chips and described illuminating circuit are electrically connected.
5. LED light source according to claim 4, is characterized in that, the fixed form between described some LED chips and described flexible fluorescence substrate can be: conducting resinl, Reflow Soldering, eutectic weld.
6. LED light source according to claim 4, is characterized in that, the thickness of described LED chip is 100 ~ 150um.
7. LED light source according to claim 4, is characterized in that, the thickness of described LED light source is 300 ~ 350um.
CN201510164400.0A 2015-04-09 2015-04-09 Flexible fluorescent substrate based on secondary optical design and LED light source Pending CN104851955A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201510164400.0A CN104851955A (en) 2015-04-09 2015-04-09 Flexible fluorescent substrate based on secondary optical design and LED light source
PCT/CN2015/093843 WO2016161803A1 (en) 2015-04-09 2015-11-05 Secondary optical design-based flexible fluorescent substrate and led light source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510164400.0A CN104851955A (en) 2015-04-09 2015-04-09 Flexible fluorescent substrate based on secondary optical design and LED light source

Publications (1)

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CN104851955A true CN104851955A (en) 2015-08-19

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WO (1) WO2016161803A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016161803A1 (en) * 2015-04-09 2016-10-13 苏州晶品新材料股份有限公司 Secondary optical design-based flexible fluorescent substrate and led light source
CN108321281A (en) * 2018-03-30 2018-07-24 南方科技大学 A kind of micro- LED display panel and micro- LED display
CN108987382A (en) * 2018-07-27 2018-12-11 京东方科技集团股份有限公司 A kind of electroluminescent device and preparation method thereof

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CN102379050A (en) * 2009-02-04 2012-03-14 应用材料公司 Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors
CN102881802A (en) * 2011-07-11 2013-01-16 隆达电子股份有限公司 Light emitting diode packaging structure
CN203705097U (en) * 2013-11-22 2014-07-09 沈阳工业大学 Flexible three-dimensional contact force matrix sensing device
EP2760057A1 (en) * 2013-01-28 2014-07-30 Harvatek Corporation White light emitting diodes package containing plural blue light-emitting diodes
CN203840632U (en) * 2014-03-25 2014-09-17 许振宇 Modularized flexible circuit structure
CN204651352U (en) * 2015-04-09 2015-09-16 苏州晶品新材料股份有限公司 Based on flexible fluorescence substrate and the LED light source of secondary optical design

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CN103762211A (en) * 2011-12-31 2014-04-30 苏州晶品光电科技有限公司 Flexible circuit substrate double-sided light-emitting LED array light source
CN103867914A (en) * 2012-12-10 2014-06-18 西安君协光电科技有限公司 LED lamp
CN104851955A (en) * 2015-04-09 2015-08-19 苏州晶品新材料股份有限公司 Flexible fluorescent substrate based on secondary optical design and LED light source

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Publication number Priority date Publication date Assignee Title
CN101071232A (en) * 2006-05-10 2007-11-14 奇美电子股份有限公司 Planar lightsource device and its mkaing method, and liquid crystal display device with same
CN102379050A (en) * 2009-02-04 2012-03-14 应用材料公司 Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors
CN102881802A (en) * 2011-07-11 2013-01-16 隆达电子股份有限公司 Light emitting diode packaging structure
EP2760057A1 (en) * 2013-01-28 2014-07-30 Harvatek Corporation White light emitting diodes package containing plural blue light-emitting diodes
CN203705097U (en) * 2013-11-22 2014-07-09 沈阳工业大学 Flexible three-dimensional contact force matrix sensing device
CN203840632U (en) * 2014-03-25 2014-09-17 许振宇 Modularized flexible circuit structure
CN204651352U (en) * 2015-04-09 2015-09-16 苏州晶品新材料股份有限公司 Based on flexible fluorescence substrate and the LED light source of secondary optical design

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016161803A1 (en) * 2015-04-09 2016-10-13 苏州晶品新材料股份有限公司 Secondary optical design-based flexible fluorescent substrate and led light source
CN108321281A (en) * 2018-03-30 2018-07-24 南方科技大学 A kind of micro- LED display panel and micro- LED display
CN108987382A (en) * 2018-07-27 2018-12-11 京东方科技集团股份有限公司 A kind of electroluminescent device and preparation method thereof

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Application publication date: 20150819