CN104851748B - A kind of movable contact spring of high-power magnetic relay and preparation method thereof - Google Patents
A kind of movable contact spring of high-power magnetic relay and preparation method thereof Download PDFInfo
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- CN104851748B CN104851748B CN201510200551.7A CN201510200551A CN104851748B CN 104851748 B CN104851748 B CN 104851748B CN 201510200551 A CN201510200551 A CN 201510200551A CN 104851748 B CN104851748 B CN 104851748B
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Abstract
The invention discloses a kind of movable contact spring of high-power magnetic relay and preparation method thereof, the movable contact spring includes the movable contact spring body of piece shape；Also integrally extension is provided with dynamic spring leading foot to the movable contact spring body；The dynamic spring leading foot is laminated by forming by movable contact spring body three.The present invention is by the way of movable contact spring and dynamic spring leading foot integrative-structure, and dynamic spring leading foot is formed using three stacking sheet modes, not increase extra leading foot, has that product structure is simpler, and conductive reliable, will not there is the hidden danger of failure.
Description
Technical field
The present invention relates to a kind of relay, more particularly to a kind of high-power magnetic relay for high current occasion
Movable contact spring and preparation method thereof.
Background technology
Relay is the automatic switch element for having isolation features, is widely used in communication, automobile, automatically controls, family expenses
The fields such as electrical equipment, it is one of most important control element.
Relay is mechanical action component, converts electrical energy into mechanical energy to realize the Spline smoothing of output quantity.Switching
The both ends of circuit are quiet spring part and dynamic spring part respectively, and quiet spring part is made up of quiet spring and stationary contact, move spring part by moving spring
Piece and movable contact are formed, and movable contact spring moves under electromagnetic force driving, until dynamic and static contact just connects external circuit.Due to
Movable contact spring internally needs back and forth movement, and certain deformation can occur in motion process, therefore the thickness of movable contact spring is often
In below 0.3mm.Product for carrying low current, movable contact spring can be directly led out；But electric current it is larger when, thin movable contact spring
When directly leading out hot-spot can be caused because current carrying area is small, it is therefore desirable to increase the thick leading foot of a fine copper material,
Fig. 1 is a kind of partial structural diagram of electromagnetic relay of prior art, the relay include armature 101, yoke 102,
Movable contact spring 103 and dynamic spring leading foot 104, wherein, one end and the phase of armature 101 of movable contact spring 103 are fixed, movable contact spring 103 it is another
End is fixed with the phase of yoke 102, meanwhile, the other end of movable contact spring 103 will also be fixed with the dynamic phase of spring leading foot 104, move spring leading foot
104 be the thick leading foot of fine copper material, is moved when mutually being fixed between spring leading foot 104 and movable contact spring 103, it is necessary to via riveting or
Weld to realize, if riveting or not prison welding, when electric current flows through riveting point/pad, it may occur that serious heating, and shape
Into vicious circle, product failure is ultimately resulted in.
The content of the invention
It is an object of the invention to overcome the deficiency of prior art, there is provided a kind of movable contact spring of high-power magnetic relay and
Its preparation method, it is by the way of movable contact spring and dynamic spring leading foot integrative-structure, does not increase extra leading foot, there is production
Product structure is simpler, and conductive reliable, will not there is the hidden danger of failure.
The technical solution adopted for the present invention to solve the technical problems is：A kind of movable contact spring of high-power magnetic relay,
Movable contact spring body including piece shape；Also integrally extension is provided with dynamic spring leading foot to the movable contact spring body；The dynamic spring leading foot by
Movable contact spring body three is laminated by forming.
The dynamic spring leading foot is located at the root of movable contact spring body, and the root of movable contact spring body is provided with to inward side to bending
The first kink to cause bending part to fold against on movable contact spring body, the bending part is provided with and bent in outward direction
Second kink is so that bending part is folded against on the bending part again again.
The length dimension of the dynamic spring leading foot is more than the width dimensions of movable contact spring body.
A kind of preparation method of the movable contact spring of high-power magnetic relay, the root for being included in movable contact spring body make dynamic spring
The process of leading foot；
The process for making dynamic spring leading foot includes：
The step of root of movable contact spring body is converted into zigzag shape；
The step of zigzag shape is pressed against forming three laminate structures.
The beneficial effects of the invention are as follows：
1st, integrally extend as a result of by movable contact spring body to set dynamic spring leading foot, not increase extra extraction
The characteristics of pin, has that product structure is simpler, and conductive more reliable；
2nd, it is laminated as a result of by dynamic spring leading foot by movable contact spring body three by forming, increases leading foot sectional area,
It can apply in the high-power magnetic relay of high current occasion, and reliable conductive can be realized, the hidden danger that will not have failure；
3rd, the root of movable contact spring body is converted into zigzag shape due to being employed in the manufacturing process of dynamic spring leading foot
The step of and the step of zigzag shape is pressed against forming three laminate structures, can be complete by relay pin
Fold entirely, ensure that pin can be by effective tin sticky and plastic packaging.
The present invention is described in further detail below in conjunction with drawings and Examples；A kind of but great-power electromagnetic of the present invention
Movable contact spring of relay and preparation method thereof is not limited to embodiment.
Brief description of the drawings
Fig. 1 is the partial structural diagram of existing electromagnetic relay；
Fig. 2 is the structural representation of the movable contact spring of the present invention；
Fig. 3 is the structural representation when root of the movable contact spring of the present invention is bent into zigzag shape；
Front view when Fig. 4 is the root bending zigzag shape of the movable contact spring of the present invention；
Fig. 5 is the schematic diagram for the process one that the root of the movable contact spring of the present invention of embodiment one makes dynamic spring leading foot；
Fig. 6 is the schematic diagram for the process two that the root of the movable contact spring of the present invention of embodiment one makes dynamic spring leading foot；
Fig. 7 is the schematic diagram for the process three that the root of the movable contact spring of the present invention of embodiment one makes dynamic spring leading foot；
Fig. 8 is the schematic diagram for the process four that the root of the movable contact spring of the present invention of embodiment one makes dynamic spring leading foot；
Fig. 9 is the schematic diagram for the process one that the root of the movable contact spring of comparative example makes dynamic spring leading foot；
Figure 10 is the schematic diagram for the process two that the root of the movable contact spring of comparative example makes dynamic spring leading foot；
Figure 11 is the schematic diagram for the process three that the root of the movable contact spring of comparative example makes dynamic spring leading foot；
Figure 12 is the schematic diagram for the process four that the root of the movable contact spring of comparative example makes dynamic spring leading foot；
Figure 13 is the schematic diagram for the process one that the root of the movable contact spring of the present invention of embodiment two makes dynamic spring leading foot；
Figure 14 is the schematic diagram for the process two that the root of the movable contact spring of the present invention of embodiment two makes dynamic spring leading foot；
Figure 15 is the schematic diagram for the process three that the root of the movable contact spring of the present invention of embodiment two makes dynamic spring leading foot；
Figure 16 is the schematic diagram for the process four that the root of the movable contact spring of the present invention of embodiment two makes dynamic spring leading foot；
Figure 17 is the schematic diagram for the process one that the root of the movable contact spring of the present invention of embodiment three makes dynamic spring leading foot；
Figure 18 is the schematic diagram for the process two that the root of the movable contact spring of the present invention of embodiment three makes dynamic spring leading foot；
Figure 19 is the schematic diagram for the process three that the root of the movable contact spring of the present invention of embodiment three makes dynamic spring leading foot；
Figure 20 is the schematic diagram for the process four that the root of the movable contact spring of the present invention of embodiment three makes dynamic spring leading foot；
Figure 21 is the schematic diagram for the process one that the root of the movable contact spring of the example IV present invention makes dynamic spring leading foot；
Figure 22 is the schematic diagram for the process two that the root of the movable contact spring of the example IV present invention makes dynamic spring leading foot；
Figure 23 is the schematic diagram for the process three that the root of the movable contact spring of the example IV present invention makes dynamic spring leading foot.
Embodiment
Embodiment one
Referring to shown in Fig. 2 to Fig. 8, a kind of movable contact spring of high-power magnetic relay of the invention, include the dynamic spring of piece shape
Piece body 1；The movable contact spring body 1 also one extension is provided with dynamic spring leading foot 2；The dynamic spring leading foot 2 is by movable contact spring body
Three stackings are by forming.
The dynamic spring leading foot 2 is located at the root 11 of movable contact spring body, the root of movable contact spring body be provided with to inward side to
First kink 21 of bending is to cause bending part 22 to fold against on movable contact spring body 1, i.e., bending part 22 abuts in dynamic spring
The root 11 of piece body, the bending part 22 is provided with the second kink 23 for bending in outward direction so that bending part 24 again
Fold against again on the bending part 22.
The length dimension of the dynamic spring leading foot 2 is more than the width dimensions of movable contact spring body 1.
A kind of preparation method of the movable contact spring of high-power magnetic relay of the present invention, it is included in the root of movable contact spring body 1
Portion makes the process of dynamic spring leading foot 2；
The process for making dynamic spring leading foot 2 includes：
Bend for the first time, the end of the root of movable contact spring body 1 is bent to form downwards the second kink 23, makes movable contact spring
It is in 90 degree between the least significant end 24 and movable contact spring body 1 of the root of body, as shown in Figure 5；
Second of bending, the end of the root of movable contact spring body 1 is folded upward to form the first kink 21, makes movable contact spring
It is in 90 degree between the secondary end 22 of the root of body and movable contact spring body 1, as shown in Figure 6；
The root of movable contact spring body is converted into zigzag shape, as shown in Figure 7；
Zigzag shape is pressed against to form three laminate structures, even if least significant end 24, secondary end 22 and dynamic spring
The root 11 of piece body sequentially folds against together, forms three laminate structures；As shown in Figure 8.
Movable contact spring of a kind of high-power magnetic relay of the present invention and preparation method thereof, is integrally to prolong moving plate body 1
Stretch to set dynamic spring leading foot 2, not increase extra leading foot so that product structure is simpler, conductive more reliable, and dynamic spring
Leading foot 2 is laminated by forming by movable contact spring body 1 three, is increased leading foot sectional area, be can apply to the big of high current occasion
In power electromagnet relay, and in preparation method, first bending, then be folded upward at downwards is employed, that finally bends again is special
Mode, relay pin can be folded completely, ensure that pin can be by effective tin sticky and plastic packaging.
If not using this particular form of the present invention, and using Fig. 9 to another making illustrated in fig. 12
The method of the dynamic spring leading foot of three laminate structures, then do not reach and fold completely by relay pin, ensures that pin can be had
Imitate the effect of tin sticky and plastic packaging.As shown in Fig. 9 to Figure 12, the preparation method of the dynamic spring leading foot of this three laminate structure is first
(as shown in Figure 9) is folded upward at, is then pressed against folded portion 51 on movable contact spring body 5 (as shown in Figure 10), then by two layers
Lamination 52 bends (as shown in figure 11) again upwards together, and two laminate structures 52 then are pressed against into movable contact spring body 5 again
Upper (as shown in figure 12).
Because movable contact spring thickness is small, it is necessary to increase the current carrying area of leading foot by lamination, when lamination takes second place more than two
Afterwards, using normal lamination process (shown in Fig. 9 to Figure 12), again during lamination since it is desired that push down material (using binder 53),
It can not be bent in lamination root, it is necessary to certain distance resigning punch-pin be left, therefore lamination root can produce space H, due to the seam
Gap H presence, there is air herein, and air, which expands, in pin tin sticky, in the case of being heated can prevent tin liquor from entering the gap；Together
Sample, when pin dispensing plastic packaging is bakeed, air, which expands, can also prevent epoxide-resin glue from entering the gap.Therefore relay
All the time there is gap in pin, during the use of relay, if the solution such as scaling powder, water enters relay by siphonage
Inside, it may result in relay failure.
The dynamic spring leading foot that specific process of the present invention is made does not have this gap (as shown in Figure 8), can
To fold relay pin completely, ensure that pin can be by effective tin sticky and plastic packaging.
Embodiment two
Referring to shown in Figure 13 to Figure 16, movable contact spring of a kind of high-power magnetic relay of the invention and preparation method thereof,
It is with the difference of embodiment one, the preparation method of movable contact spring is different, and the preparation method of the movable contact spring is included in movable contact spring
The root of body 1 makes the process of dynamic spring leading foot 2；
The process for making dynamic spring leading foot 2 includes：
Bend for the first time, the end of the root of movable contact spring body 1 is folded upward to form the first kink 21, makes movable contact spring
It is in 90 degree between the end of the root of body and movable contact spring body 1, as shown in figure 13；
Second bends, and by the end of the root of movable contact spring body 1 to being laterally bent to form the second kink 23, and is formed
Least significant end 24 and time end 22, it is in 90 degree between least significant end 24 and secondary end 22, is also between secondary end 22 and movable contact spring body 1
90 degree, as shown in figure 14；
The root of movable contact spring body is converted into zigzag shape, as shown in figure 15；
Zigzag shape is pressed against to form three laminate structures, even if least significant end 24, secondary end 22 and dynamic spring
The root 11 of piece body sequentially folds against together, forms three laminate structures；As shown in figure 16.
Embodiment three
Referring to shown in Figure 17 to Figure 20, movable contact spring of a kind of high-power magnetic relay of the invention and preparation method thereof,
It is with the difference of embodiment one, the preparation method of movable contact spring is different, and the preparation method of the movable contact spring is included in movable contact spring
The root of body 1 makes the process of dynamic spring leading foot 2；
The process for making dynamic spring leading foot 2 includes：
First time pre-bend, form bending structure as shown in figure 17；
Second of bending, least significant end 24 and time end 22 are formed, and be in 90 degree between least significant end 24 and secondary end 22, it is penultimate
Also it is in 90 degree between end 22 and movable contact spring body 1, as shown in figure 18；
The root of movable contact spring body is converted into zigzag shape, as shown in figure 19；
Zigzag shape is pressed against to form three laminate structures, even if least significant end 24, secondary end 22 and dynamic spring
The root 11 of piece body sequentially folds against together, forms three laminate structures；As shown in figure 20.
Example IV
Referring to shown in Figure 21 to Figure 23, movable contact spring of a kind of high-power magnetic relay of the invention and preparation method thereof,
It is with the difference of embodiment one, the preparation method of movable contact spring is different, and the preparation method of the movable contact spring is included in movable contact spring
The root of body 1 makes the process of dynamic spring leading foot 2；
The process for making dynamic spring leading foot 2 includes：
Bend for the first time, the end of the root of movable contact spring body 1 is folded upward to form the first kink 21, makes movable contact spring
It is in 90 degree between the end of the root of body and movable contact spring body 1, as shown in figure 21；
The root of movable contact spring body is converted into zigzag shape, as shown in figure 22；
Zigzag shape is pressed against to form three laminate structures, even if least significant end 24, secondary end 22 and dynamic spring
The root 11 of piece body sequentially folds against together, forms three laminate structures；As shown in figure 23.
Above-described embodiment is only used for further illustrating the movable contact spring and its system of a kind of high-power magnetic relay of the present invention
Make method, but the invention is not limited in embodiment, what every technical spirit according to the present invention was made to above example appoints
What simple modification, equivalent change and modification, each falls within the protection domain of technical solution of the present invention.
Claims (2)
1. a kind of movable contact spring of high-power magnetic relay, include the movable contact spring body of piece shape；The movable contact spring body is also integral
Extension is provided with dynamic spring leading foot；It is characterized in that：The dynamic spring leading foot is laminated by forming by movable contact spring body three；The dynamic spring
Width of the leading foot along movable contact spring body is located at the root of movable contact spring body, and the root of movable contact spring body is provided with along dynamic spring
The length of piece body is described curved to inward side to the first kink of bending to cause bending part to fold against on movable contact spring body
Folding part is arranged with the second kink bent in outward direction along the length of movable contact spring body so that bending part folds against again again
On the bending part；The length dimension of the dynamic spring leading foot is more than the width dimensions of movable contact spring body.
A kind of 2. preparation method of the movable contact spring of high-power magnetic relay, it is characterised in that：It is included in the root of movable contact spring body
Portion makes the process of dynamic spring leading foot；
The process for making dynamic spring leading foot includes：
The step of root of movable contact spring body is converted into zigzag shape；The step causes the root of movable contact spring body to be provided with
Along the length of movable contact spring body to inward side to the first kink of bending in order to bending part is folded against in movable contact spring body
On, the step also cause the bending part be provided with along the second kink for bending in outward direction of length of movable contact spring body with
It is easy to bending part to fold against again on the bending part again；
The step of zigzag shape is pressed against forming three laminate structures；The step causes the dynamic spring leading foot
Length dimension be more than movable contact spring body width dimensions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510200551.7A CN104851748B (en) | 2015-04-24 | 2015-04-24 | A kind of movable contact spring of high-power magnetic relay and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510200551.7A CN104851748B (en) | 2015-04-24 | 2015-04-24 | A kind of movable contact spring of high-power magnetic relay and preparation method thereof |
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| Publication Number | Publication Date |
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| CN104851748A CN104851748A (en) | 2015-08-19 |
| CN104851748B true CN104851748B (en) | 2017-11-10 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109360773A (en) * | 2018-08-21 | 2019-02-19 | 江苏华仑电子有限公司 | A kind of small high-power electromagnetic relay |
| CN111710564B (en) * | 2020-06-19 | 2022-05-03 | 哈尔滨工业大学 | Small-size sealed electromagnetic relay reed that metal bonding of bending filled tin |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201270226Y (en) * | 2008-09-27 | 2009-07-08 | 上海万佳精密元件有限公司 | Single phase magnetic latching relay |
| JP5268863B2 (en) * | 2009-11-02 | 2013-08-21 | 東京エレクトロン株式会社 | Connecting conductor for power |
| CN202678233U (en) * | 2012-06-15 | 2013-01-16 | 东莞市三友联众电器有限公司 | Three-lamination pin movable reed used for electromagnetic relay |
| CN204596717U (en) * | 2015-04-24 | 2015-08-26 | 厦门宏发电声股份有限公司 | A kind of movable contact spring of high-power magnetic relay |
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