CN104851748A - Moving reed of large-power electromagnetic relay, and manufacturing method thereof - Google Patents
Moving reed of large-power electromagnetic relay, and manufacturing method thereof Download PDFInfo
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- CN104851748A CN104851748A CN201510200551.7A CN201510200551A CN104851748A CN 104851748 A CN104851748 A CN 104851748A CN 201510200551 A CN201510200551 A CN 201510200551A CN 104851748 A CN104851748 A CN 104851748A
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- movable contact
- contact spring
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- leading foot
- spring body
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Abstract
The invention discloses a moving reed of a large-power electromagnetic relay, and a manufacturing method thereof. The moving reed includes a sheet-shaped moving reed body. The moving reed body extends to be equipped with a moving reed lead-out pin in an integrated manner. The moving reed lead-out pin is formed by lamination of the moving reed body in a three-layered manner. The moving reed and the moving reed lead-out pin are integrated to be a whole structure, the moving reed lead-out pin is formed by a three-layer lamination mode, and extra lead-out pins are not needed. Products are simpler in structure, a reliable conductive effect is achieved, and hidden troubles of failures will not occur.
Description
Technical field
The present invention relates to a kind of relay, particularly relate to movable contact spring of a kind of high-power magnetic relay for big current occasion and preparation method thereof.
Background technology
Relay is the automatic switch element with isolation features, and being widely used in the field such as communication, automobile, automatically control, household electrical appliance, is one of most important control element.
Relay is mechanical action components and parts, converts electrical energy into mechanical energy to realize the Spline smoothing of output variable.The two ends of commutation circuit are quiet spring part and dynamic spring part respectively, and quiet spring part is made up of quiet spring and fixed contact, and dynamic spring part is made up of movable contact spring and moving contact, and movable contact spring is motion under electromagnetic force drives, until dynamic and static contact just connects external circuit.Because movable contact spring needs back and forth movement in inside, and in motion process, certain deformation can occur, therefore the thickness of movable contact spring is often at below 0.3mm.For the product of carrying small area analysis, movable contact spring can directly be drawn, when but electric current is larger, because the little meeting of current carrying area causes local overheating when thin movable contact spring is directly drawn, therefore the thick leading foot of an increase fine copper material is needed, Fig. 1 is the partial structurtes schematic diagram of a kind of electromagnetic relay of prior art, this relay comprises armature 101, yoke 102, movable contact spring 103 and dynamic spring leading foot 104, wherein, one end and the armature 101 of movable contact spring 103 fix, the other end and the yoke 102 of movable contact spring 103 fix, simultaneously, the other end of movable contact spring 103 also will fix with dynamic spring leading foot 104, dynamic spring leading foot 104 is thick leading foots of fine copper material, dynamic when fixing between spring leading foot 104 and movable contact spring 103, must realize via riveted joint or welding, if riveted joint or not prison welding, when electric current flows through riveting point/pad, serious heating can be there is, and form vicious circle, finally cause product failure.
Summary of the invention
The object of the invention is to the deficiency overcoming prior art, movable contact spring of a kind of high-power magnetic relay and preparation method thereof is provided, it is the mode adopting movable contact spring and dynamic spring leading foot integrative-structure, do not increase extra leading foot, there is product structure simpler, and conduction is reliable, can not have the hidden danger of inefficacy.
The technical solution adopted for the present invention to solve the technical problems is: a kind of movable contact spring of high-power magnetic relay, comprises the movable contact spring body of sheet shape; Described movable contact spring body also one extension is provided with dynamic spring leading foot; Described dynamic spring leading foot is stacked by forming by movable contact spring body three.
Described dynamic spring leading foot is located at the root of movable contact spring body, the root of movable contact spring body is provided with and leans against on movable contact spring body to the first kink of bending to make bending part fold to inward side, and described bending part is provided with the second kink bent in outward direction, and to make, bending part is folded again to be leaned against on described bending part again.
The length dimension of described dynamic spring leading foot is greater than the width dimensions of movable contact spring body.
A manufacture method for the movable contact spring of high-power magnetic relay, the root being included in movable contact spring body makes the process of dynamic spring leading foot;
The process that spring leading foot is moved in described making comprises:
The root of movable contact spring body is converted into the step of zigzag shape;
Zigzag shape is pressed against the step forming three laminate structure together.
The invention has the beneficial effects as follows:
1, owing to have employed, the extension of movable contact spring body one is arranged dynamic spring leading foot, do not increase extra leading foot, there is product structure simpler, and the more reliable feature of conduction;
2, stacked by forming by movable contact spring body three owing to have employed dynamic spring leading foot, increase leading foot sectional area, can be applied in the high-power magnetic relay of big current occasion, and can reliable conductive be realized, the hidden danger of inefficacy can not be had;
3, owing to have employed the step that the root of movable contact spring body is converted into zigzag shape in the manufacturing process of dynamic spring leading foot and zigzag shape being pressed against the step forming three laminate structure together, relay pin can be folded completely, ensure that pin can by effective tin sticky and plastic packaging.
Below in conjunction with drawings and Examples, the present invention is described in further detail; But movable contact spring of a kind of high-power magnetic relay of the present invention and preparation method thereof is not limited to embodiment.
Accompanying drawing explanation
Fig. 1 is the partial structurtes schematic diagram of existing electromagnetic relay;
Fig. 2 is the structural representation of movable contact spring of the present invention;
Fig. 3 is the root of movable contact spring of the present invention structural representation when being bent into zigzag shape;
Front view when Fig. 4 is the root bending zigzag shape of movable contact spring of the present invention;
Fig. 5 is the schematic diagram that the root of embodiment one movable contact spring of the present invention makes the process one of dynamic spring leading foot;
Fig. 6 is the schematic diagram that the root of embodiment one movable contact spring of the present invention makes the process two of dynamic spring leading foot;
Fig. 7 is the schematic diagram that the root of embodiment one movable contact spring of the present invention makes the process three of dynamic spring leading foot;
Fig. 8 is the schematic diagram that the root of embodiment one movable contact spring of the present invention makes the process four of dynamic spring leading foot;
Fig. 9 is the schematic diagram that the root of the movable contact spring of comparative example makes the process one of dynamic spring leading foot;
Figure 10 is the schematic diagram that the root of the movable contact spring of comparative example makes the process two of dynamic spring leading foot;
Figure 11 is the schematic diagram that the root of the movable contact spring of comparative example makes the process three of dynamic spring leading foot;
Figure 12 is the schematic diagram that the root of the movable contact spring of comparative example makes the process four of dynamic spring leading foot;
Figure 13 is the schematic diagram that the root of embodiment two movable contact spring of the present invention makes the process one of dynamic spring leading foot;
Figure 14 is the schematic diagram that the root of embodiment two movable contact spring of the present invention makes the process two of dynamic spring leading foot;
Figure 15 is the schematic diagram that the root of embodiment two movable contact spring of the present invention makes the process three of dynamic spring leading foot;
Figure 16 is the schematic diagram that the root of embodiment two movable contact spring of the present invention makes the process four of dynamic spring leading foot;
Figure 17 is the schematic diagram that the root of embodiment three movable contact spring of the present invention makes the process one of dynamic spring leading foot;
Figure 18 is the schematic diagram that the root of embodiment three movable contact spring of the present invention makes the process two of dynamic spring leading foot;
Figure 19 is the schematic diagram that the root of embodiment three movable contact spring of the present invention makes the process three of dynamic spring leading foot;
Figure 20 is the schematic diagram that the root of embodiment three movable contact spring of the present invention makes the process four of dynamic spring leading foot;
Figure 21 is the schematic diagram that the root of embodiment four movable contact spring of the present invention makes the process one of dynamic spring leading foot;
Figure 22 is the schematic diagram that the root of embodiment four movable contact spring of the present invention makes the process two of dynamic spring leading foot;
Figure 23 is the schematic diagram that the root of embodiment four movable contact spring of the present invention makes the process three of dynamic spring leading foot.
Embodiment
Embodiment one
See shown in Fig. 2 to Fig. 8, the movable contact spring of a kind of high-power magnetic relay of the present invention, comprises the movable contact spring body 1 of sheet shape; Described movable contact spring body 1 also one extension is provided with dynamic spring leading foot 2; Described dynamic spring leading foot 2 is stacked by forming by movable contact spring body three.
Described dynamic spring leading foot 2 is located at the root 11 of movable contact spring body, the root of movable contact spring body is provided with and leans against on movable contact spring body 1 to the first kink 21 of bending to make bending part 22 fold to inward side, namely bending part 22 abuts in the root 11 of movable contact spring body, and described bending part 22 is provided with the second kink 23 bent in outward direction, and to make, bending part 24 is folded again to be leaned against on described bending part 22 again.
The length dimension of described dynamic spring leading foot 2 is greater than the width dimensions of movable contact spring body 1.
The manufacture method of the movable contact spring of a kind of high-power magnetic relay of the present invention, the root being included in movable contact spring body 1 makes the process of dynamic spring leading foot 2;
The process that spring leading foot 2 is moved in described making comprises:
First time bending, is bent to form the second kink 23 downwards by the end of the root of movable contact spring body 1, make in 90 degree between the least significant end 24 of the root of movable contact spring body and movable contact spring body 1, as shown in Figure 5;
Second time bending, is upwards bent to form the first kink 21 by the end of the root of movable contact spring body 1, make in 90 degree between the secondary end 22 of the root of movable contact spring body and movable contact spring body 1, as shown in Figure 6;
The root of movable contact spring body is converted into zigzag shape, as shown in Figure 7;
Zigzag shape is pressed against and forms three laminate structure together, be close together even if the root 11 of least significant end 24, secondary end 22 and movable contact spring body is sequentially folded, form three laminate structure; As shown in Figure 8.
Movable contact spring of a kind of high-power magnetic relay of the present invention and preparation method thereof, moving plate body 1 one is extended arrange dynamic spring leading foot 2, do not increase extra leading foot, make product structure simpler, conduct electricity more reliable, and dynamic spring leading foot 2 is stacked by forming by movable contact spring body 1 three, increase leading foot sectional area, can be applied in the high-power magnetic relay of big current occasion, and in manufacture method, have employed first bending downwards, upwards bend again, last particular form of bending again, relay pin can be folded completely, ensure that pin can by effective tin sticky and plastic packaging.
If do not adopt this particular form of the present invention, and employing is that Fig. 9 makes the method for the dynamic spring leading foot of three laminate structure to another kind illustrated in fig. 12, then do not reach and relay pin is folded completely, ensure that pin can by the effect of effective tin sticky and plastic packaging.As shown in Fig. 9 to Figure 12, the manufacture method of the dynamic spring leading foot of this three laminate structure first upwards bends (as shown in Figure 9), then folded part 51 is pressed against (as shown in Figure 10) on movable contact spring body 5, again two laminate structure 52 are upwards bent (as shown in figure 11) together again, and then two laminate structure 52 are pressed against (as shown in figure 12) on movable contact spring body 5.
Because movable contact spring thickness is little, need the current carrying area being increased leading foot by lamination, after lamination is more than twice, adopt normal lamination process (shown in Fig. 9 to Figure 12), again during lamination because need to push down material (adopting binder 53), cannot bend at lamination root, need to leave certain distance to step down punch, therefore lamination root can produce space H, due to the existence of this gap H, have air herein, when pin tin sticky, when being heated, air expansion can stop tin liquor to enter this gap; Same, when pin point glue plastic packaging cures, air expands and epoxide-resin glue also can be stoped to enter this gap.Therefore there is gap all the time in relay pin, in the use procedure of relay, if the solution such as scaling powder, water enters relay inside by siphonage, may cause relay failure.
The dynamic spring leading foot that specific process of the present invention is made does not have this gap (as shown in Figure 8), relay pin can be folded completely, ensures that pin can by effective tin sticky and plastic packaging.
Embodiment two
See shown in Figure 13 to Figure 16, movable contact spring of a kind of high-power magnetic relay of the present invention and preparation method thereof, be with the difference of embodiment one, the manufacture method of movable contact spring is different, and the manufacture method of this movable contact spring is included in the process of the dynamic spring leading foot 2 of root making of movable contact spring body 1;
The process that spring leading foot 2 is moved in described making comprises:
First time bending, is upwards bent to form the first kink 21 by the end of the root of movable contact spring body 1, make in 90 degree between the end of the root of movable contact spring body and movable contact spring body 1, as shown in figure 13;
Second time bending, the end of the root of movable contact spring body 1 is bent to form the second kink 23 to side direction, and forms least significant end 24 and time end 22, in 90 degree between least significant end 24 and secondary end 22, also in 90 degree between secondary end 22 and movable contact spring body 1, as shown in figure 14;
The root of movable contact spring body is converted into zigzag shape, as shown in figure 15;
Zigzag shape is pressed against and forms three laminate structure together, be close together even if the root 11 of least significant end 24, secondary end 22 and movable contact spring body is sequentially folded, form three laminate structure; As shown in figure 16.
Embodiment three
See shown in Figure 17 to Figure 20, movable contact spring of a kind of high-power magnetic relay of the present invention and preparation method thereof, be with the difference of embodiment one, the manufacture method of movable contact spring is different, and the manufacture method of this movable contact spring is included in the process of the dynamic spring leading foot 2 of root making of movable contact spring body 1;
The process that spring leading foot 2 is moved in described making comprises:
First time pre-bending, forms bending structure as shown in figure 17;
Second time bending, forms least significant end 24 and time end 22, and in 90 degree between least significant end 24 and secondary end 22, also in 90 degree between secondary end 22 and movable contact spring body 1, as shown in figure 18;
The root of movable contact spring body is converted into zigzag shape, as shown in figure 19;
Zigzag shape is pressed against and forms three laminate structure together, be close together even if the root 11 of least significant end 24, secondary end 22 and movable contact spring body is sequentially folded, form three laminate structure; As shown in figure 20.
Embodiment four
See shown in Figure 21 to Figure 23, movable contact spring of a kind of high-power magnetic relay of the present invention and preparation method thereof, be with the difference of embodiment one, the manufacture method of movable contact spring is different, and the manufacture method of this movable contact spring is included in the process of the dynamic spring leading foot 2 of root making of movable contact spring body 1;
The process that spring leading foot 2 is moved in described making comprises:
First time bending, is upwards bent to form the first kink 21 by the end of the root of movable contact spring body 1, make in 90 degree between the end of the root of movable contact spring body and movable contact spring body 1, as shown in figure 21;
The root of movable contact spring body is converted into zigzag shape, as shown in figure 22;
Zigzag shape is pressed against and forms three laminate structure together, be close together even if the root 11 of least significant end 24, secondary end 22 and movable contact spring body is sequentially folded, form three laminate structure; As shown in figure 23.
Above-described embodiment is only used for movable contact spring further illustrating a kind of high-power magnetic relay of the present invention and preparation method thereof; but the present invention is not limited to embodiment; every above embodiment is done according to technical spirit of the present invention any simple modification, equivalent variations and modification, all fall in the protection range of technical solution of the present invention.
Claims (4)
1. a movable contact spring for high-power magnetic relay, comprises the movable contact spring body of sheet shape; Described movable contact spring body also one extension is provided with dynamic spring leading foot; It is characterized in that: described dynamic spring leading foot is stacked by forming by movable contact spring body three.
2. the movable contact spring of high-power magnetic relay according to claim 1, it is characterized in that: described dynamic spring leading foot is located at the root of movable contact spring body, the root of movable contact spring body is provided with and leans against on movable contact spring body to the first kink of bending to make bending part fold to inward side, and described bending part is provided with the second kink bent in outward direction, and to make, bending part is folded again to be leaned against on described bending part again.
3. the movable contact spring of high-power magnetic relay according to claim 1 and 2, is characterized in that: the length dimension of described dynamic spring leading foot is greater than the width dimensions of movable contact spring body.
4. a manufacture method for the movable contact spring of high-power magnetic relay, is characterized in that: the root being included in movable contact spring body makes the process of dynamic spring leading foot;
The process that spring leading foot is moved in described making comprises:
The root of movable contact spring body is converted into the step of zigzag shape;
Zigzag shape is pressed against the step forming three laminate structure together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510200551.7A CN104851748B (en) | 2015-04-24 | 2015-04-24 | A kind of movable contact spring of high-power magnetic relay and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510200551.7A CN104851748B (en) | 2015-04-24 | 2015-04-24 | A kind of movable contact spring of high-power magnetic relay and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104851748A true CN104851748A (en) | 2015-08-19 |
| CN104851748B CN104851748B (en) | 2017-11-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510200551.7A Active CN104851748B (en) | 2015-04-24 | 2015-04-24 | A kind of movable contact spring of high-power magnetic relay and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109360773A (en) * | 2018-08-21 | 2019-02-19 | 江苏华仑电子有限公司 | A kind of small high-power electromagnetic relay |
| CN111710564A (en) * | 2020-06-19 | 2020-09-25 | 哈尔滨工业大学 | Small-size sealed electromagnetic relay reed that metal bonding of bending filled tin |
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| CN201270226Y (en) * | 2008-09-27 | 2009-07-08 | 上海万佳精密元件有限公司 | Single phase magnetic latching relay |
| WO2011052301A1 (en) * | 2009-11-02 | 2011-05-05 | 東京エレクトロン株式会社 | Power connection conductor |
| CN202678233U (en) * | 2012-06-15 | 2013-01-16 | 东莞市三友联众电器有限公司 | Three-lamination pin movable reed used for electromagnetic relay |
| CN204596717U (en) * | 2015-04-24 | 2015-08-26 | 厦门宏发电声股份有限公司 | A kind of movable contact spring of high-power magnetic relay |
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2015
- 2015-04-24 CN CN201510200551.7A patent/CN104851748B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201270226Y (en) * | 2008-09-27 | 2009-07-08 | 上海万佳精密元件有限公司 | Single phase magnetic latching relay |
| WO2011052301A1 (en) * | 2009-11-02 | 2011-05-05 | 東京エレクトロン株式会社 | Power connection conductor |
| CN202678233U (en) * | 2012-06-15 | 2013-01-16 | 东莞市三友联众电器有限公司 | Three-lamination pin movable reed used for electromagnetic relay |
| CN204596717U (en) * | 2015-04-24 | 2015-08-26 | 厦门宏发电声股份有限公司 | A kind of movable contact spring of high-power magnetic relay |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109360773A (en) * | 2018-08-21 | 2019-02-19 | 江苏华仑电子有限公司 | A kind of small high-power electromagnetic relay |
| CN111710564A (en) * | 2020-06-19 | 2020-09-25 | 哈尔滨工业大学 | Small-size sealed electromagnetic relay reed that metal bonding of bending filled tin |
| CN111710564B (en) * | 2020-06-19 | 2022-05-03 | 哈尔滨工业大学 | Small-size sealed electromagnetic relay reed that metal bonding of bending filled tin |
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| Publication number | Publication date |
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| CN104851748B (en) | 2017-11-10 |
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