A kind of electrically conducting transparent laminate body
Technical field
The present invention relates to the raw material of the touch panel of touch technology product, particularly a kind of electrically conducting transparent laminate body.
Background technology
Touch technology has been widely used for FPD, screen formula touch technology, solar panel, solar energy control at present
It is film-made, prevents the numerous areas such as defrosting glass, ice glass, anti-static coating that haze.The touch panel of touch technology product, structure
Generally comprise substrate and the conductive layer being attached on substrate.It, generally can will be transparent in production projected capacitive touch panel process
Transparency conducting layer on conductive multilayer plate body etches specific pattern, and patterned conductive, transparent lamilate is made.It is transparent to lead
When electric layer plywood body is heated in an etching step, often there are electrically conducting transparent layer segment and there is no electrically conducting transparent layer segment
The difference of upper residual stress so as to which patterned layer at transparent layer be caused to generate the phenomenon that uneven, causes transparent base
The flexural deformation of plate and influence use quality.
In order to which layer at transparent layer caused by reducing stress difference generates uneven, and then transparent substrate bending is caused to become
Shape is usually to add a material layer on one side without attachment transparency conducting layer to increase substrate thickness on the transparent substrate at present
To improve the non-deformability of substrate or cover up the up-and-down defects of vision on substrate.Such as Chinese Patent No.
A kind of ITO electrode disclosed in No. 201220096169.8, structure include base material, ITO conductive layer and optical adhesive layer, and base material includes the
One surface and the second surface opposite with first surface, ITO conductive layer are attached on one in first surface and second surface
And form scheduled pattern, optical adhesive layer is fitted on surface opposite with ITO conductive layer on base material, for cover up base material in response to
The defects of vision caused by the Bending Deformation that force difference generates.For another example a kind of ITO disclosed in Chinese Patent No. 20122005904.3 is thin
Membrane material includes base material, ITO conductive layer and high temperature dwell cuticula, and base material includes first surface and second table opposite with first surface
Face, ITO conductive layer is attached on one in first surface and second surface, and forms scheduled pattern, high temperature dwell cuticula patch
Together in the one side of unattached ITO conductive layer in first surface and second surface, after increasing high temperature dwell cuticula, matrix structure is strong
Degree is improved, and is made to will not generate apparent stress difference flexural deformation between the etching region of ITO conductive layer and non-etched area.On
The shortcomings that stating prior art be:Substrate deformation cannot be eliminated or elimination substrate deformation effect is undesirable, and in manufacturing process
It needs all to be processed the two sides of base material, technique is more complicated.
Invention content
In order to overcome the problems, such as that the prior art solves the effect of the flexural deformation of conductive layer and the uneven generation of substrate stress
The defects of undesirable, and technique is more complicated, the object of the present invention is to provide a kind of improved electrically conducting transparent laminate body, can with gram
The defects of taking the prior art.
The technical solution adopted by the present invention to solve the technical problems is:A kind of conductive, transparent laminate body, including transparent
Substrate and the folded transparency conducting layer set on the transparent substrate, transparency conducting layer are etched with specific pattern, it is characterized in that:It is described
The transparent buffer layer that modulus of elasticity is 10~30 GPa, thickness is 4 or 10 μm, institute are equipped between bright substrate and transparency conducting layer
The material of transparent buffer layer is stated using acrylic ester resin or curable acrylic resin, the thickness of the transparency conducting layer takes
10~30nm or 20~25nm.
The preferred embodiment of the modulus of elasticity of transparent buffer layer described in above-mentioned technical proposal can take 10~20 GPa.
The thickness of transparent substrate described in above-mentioned technical proposal can take 2~300 μm, and preferred embodiment can take 10~250 μm.
Tin indium oxide may be used in the material of transparency conducting layer described in above-mentioned technical proposal(ITO), oxidation can also be used
Any one of indium, tin oxide, titanium oxide, aluminium oxide, zinc oxide, gallium oxide or the two or more mixing being composed therein
Object.
Polyethylene terephthalate, poly- naphthalenedicarboxylic acid second may be used in the material of transparent substrate described in above-mentioned technical proposal
Diester, polypropylene, high density polyethylene (HDPE), low density polyethylene (LDPE), polyvinyl chloride, polyvinyl dichloride, Triafol T, acetic acid are fine
Tie up element, makrolon, polyvinyl alcohol, polymethyl methacrylate, cyclic olefine copolymer, polyimides it is any.
Transparent buffer layer is laid with described in above-mentioned technical proposal between transparent substrate and transparency conducting layer, dry type may be used
Coating method or wet coating method are preferred to complete in wet coating method, and roller coating, rotation may be used in wet coating method
Painting or dip-coating etc..
The beneficial effects of the invention are as follows:It is 10 due to being equipped with modulus of elasticity between the transparent substrate and transparency conducting layer
~30 GPa, the transparent buffer layer that thickness is 4 or 10 μm, the material of the transparent buffer layer use acrylic ester resin or hard
Change type acrylic resin, the thickness of the transparency conducting layer take 10~30nm or 20~25nm, so when being etched into specific pattern
Conductive transparent layer when there is Stress non-homogeneity, transparent buffer layer can directly absorb in conductive transparent layer it is uneven should
Power so that conductive transparent layer is not in uneven phenomenon or uneven phenomenon unobvious, so as to which substrate be made not had
The uneven phenomenon of volt and electrically conducting transparent laminate body do not see there is uneven phenomenon visually, eliminate in this way conductive transparent layer with
Substrate deformation effect is more satisfactory, due to only machined the same face of substrate in technique, so its processing technology is fairly simple.
Below in conjunction with drawings and examples, the invention will be further described.
Description of the drawings
Fig. 1 is the broken section enlarged diagram of one embodiment of the present invention.
In figure:1st, transparent substrate;2nd, transparency conducting layer;3rd, pattern;4th, transparent buffer layer.
Specific embodiment
With reference to Fig. 1, this conductive, transparent laminate body, including transparent substrate 1 and the folded electrically conducting transparent being located on transparent substrate 1
Layer 2, transparency conducting layer has been etched into specific pattern 3, it is characterized in that:It is laid between the transparent substrate 1 and transparency conducting layer 2
There is the transparent buffer layer 4 that one layer of modulus of elasticity is 10~30 GPa, thickness is 4 or 10 μm, the material of the transparent buffer layer 4 is adopted
With acrylic ester resin or curable acrylic resin, the thickness of the transparency conducting layer 2 takes 10~30nm or 20~25nm.
In addition, the thickness of the transparent substrate 1 takes 2~300 μm, preferred embodiment is 10~250 μm.Transparent buffer layer 4
It is laid with by roller coating or the wet coating method of spin coating.The material of transparency conducting layer 2 uses tin indium oxide(ITO).It is described
The material of transparent substrate 1 uses polyethylene terephthalate.