CN104810316B - A kind of paster technique method - Google Patents
A kind of paster technique method Download PDFInfo
- Publication number
- CN104810316B CN104810316B CN201510091508.1A CN201510091508A CN104810316B CN 104810316 B CN104810316 B CN 104810316B CN 201510091508 A CN201510091508 A CN 201510091508A CN 104810316 B CN104810316 B CN 104810316B
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- China
- Prior art keywords
- support plate
- adhesive tape
- substrate
- tool
- carrier
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Abstract
The present invention is applied to PLCC encapsulation fields, there is provided a kind of paster technique method includes：Prepared substrate；The substrate is put on pasting board tool；Support plate sticks adhesive tape by tool of taping；Post adhesive tape the support plate be positioned at pendulum have on the pasting board tool of the substrate；Stenciling the support plate makes the substrate be attached on the adhesive tape；The support plate for posting substrate is taken out from pasting board tool, and the support plate for posting substrate is fixed in ultrasonic wave cleaning basket；The support plate of substrate is posted described in ultrasonic wave cleaning.The present invention improves that deviation caused by pasting substrate on the support plate for post high temperature gummed tape by hand is big, and regular poor, being placed with substrate, more regularly uniformity is good, and because of the effect of positioning and guiding, greatly improves the efficiency of patch product by the positioning and guiding of pasting board tool.And the utilization for tool of taping, make high temperature gummed tape attaching support plate more accurate, smooth, efficiency.It is reduced to the alarm rate after machine almost nil, greatly improves efficiency and yield.
Description
Technical field
The invention belongs to PLCC encapsulation fields, more particularly to a kind of paster technique method.
Background technology
At present, in PLCC encapsulation fields, after substrate cut is returned, the technique that is required for away paster that is, first will cutting
Good substrate is ready to, and then support plate is attached on high temperature gummed tape by hand, then cut off support plate both ends adhesive tape with pocket knife, so as to
Obtain posting the support plate of high temperature gummed tape, then the support plate with high temperature gummed tape posted is fixed on paper membrane tool, it is then opposite
Press back line patch substrate on paper membrane tool, takes out the support plate for attaching substrate, now paster is completed, then from paper membrane tool after having pasted
The support plate for attaching substrate is fixed on ultrasonic wave cleaning basket, send ultrasonic wave to clean.
From the foregoing, it will be observed that prior art is to be controlled by the pure high temperature gummed tape that attaches by hand on support plate not over any auxiliary
Tool, therefore flatness is inadequate, efficiency is low.Because flatness not enough easily causes product placement also out-of-flatness after paster, follow-up
Upper machine operation can cause equipment alarm, influence efficiency.
In addition, existing be by the way of paper membrane tool：One outer block diagram for arranging substrate of printing in advance, by the housing
Figure is attached on paper membrane tool, and press back line is then marked on paper membrane tool along block diagram outside the substrate arranged with pocket knife.Though
So there is press back line (i.e. the outer wire of substrate arrangement), but be a lack of the limitation of positioning and guiding, easily pasted in adhesive substrate
Partially, the bad phenomenon such as lack of standardization, so that cause equipment alarm after subsequently upper machine, the problem of influenceing efficiency.
In summary, the guide-localization of above-mentioned paster technique is poor, and it is big to be placed with rear deviation by hand, lack of standardization, holds after upper machine
Equipment identification alarm is easily caused, influences efficiency.
The content of the invention
It is an object of the invention to provide a kind of paster technique method, it is intended to solves the guide-localization of existing paster technique
Property it is poor, it is big to be placed with rear deviation by hand, lack of standardization, and equipment identification alarm is easily caused after upper machine, the problem of influenceing efficiency.
In a first aspect, the invention provides a kind of paster technique method, the described method comprises the following steps：
Prepared substrate；
The substrate is put on pasting board tool；
Support plate sticks adhesive tape by tool of taping；
Post adhesive tape the support plate be positioned at pendulum have on the pasting board tool of the substrate；
Stenciling the support plate makes the substrate be attached on the adhesive tape；
The support plate for posting substrate is taken out from pasting board tool, and the support plate for posting substrate is fixed on ultrasonic wave cleaning indigo plant
On；
The support plate of substrate is posted described in ultrasonic wave cleaning.
Preferably, the pasting board tool includes：One body, the body surface have a support plate sky for being used to put support plate
Chamber, the support plate cavity surrounding is provided with support plate locating dowel；It is additionally provided with the support plate cavity multiple spaced
Substrate die cavity, the substrate die cavity are used to put substrate, and boss is additionally provided with the substrate die cavity；The pasting board tool also wraps
Include：Support plate is taken position, and support plate position of taking is arranged at the body side.
Preferably, it is described put the substrate on pasting board tool the step of, specifically include：
Substrate is placed on the substrate die cavity of the pasting board tool, passes through the branch of the boss in the substrate die cavity
Support makes component empty avoiding in the substrate die cavity on the substrate.
Preferably, the tool of taping includes：Base, carrier for bearing platform and adhesive tape installing mechanism；Wherein, institute
State carrier for bearing platform and the adhesive tape installing mechanism is respectively positioned on the base, the carrier for bearing platform and adhesive tape peace
Mounting mechanism is arranged on same level direction；There are two cutting knife groove positions, two cutting knife grooves on the carrier for bearing platform
Position is located at the carrier for bearing platform surface both ends respectively；The tool of taping also includes：Support column, the support column are located at
Between the carrier for bearing platform and the base, and it is respectively arranged at four angles of the carrier for bearing platform；By described
The carrier for bearing platform is fixed on the base by support column；The carrier for bearing platform surface also there is a support plate to fix
Limit chamber, the support plate fix limit chamber between the cutting knife groove position；The carrier for bearing platform surface also includes support plate
Take position, support plate position of taking is respectively arranged at the carrier for bearing platform both sides.
Preferably, the carrier for bearing platform surface also includes support plate locating dowel, and the support plate locating dowel is respectively arranged at
The support plate fixes four angles of limit chamber.
Preferably, the tool of taping also includes：Adhesive tape tightens axle, and the adhesive tape, which tightens axle and is arranged at the support plate, to be held
Between carrying platform and the adhesive tape installing mechanism, and it is fixed on the base.
Preferably, the adhesive tape installing mechanism includes：Bearing, axle, fastening screw hole position, adhesive tape carry left piece and glue
Right piece of band carrying；Wherein, the adhesive tape, which carries left piece and carries right piece with the adhesive tape, is oppositely arranged, and the axle position is in the adhesive tape
Carry left piece and the adhesive tape carries the through hole surrounded between right piece, the bearing is sheathed on the axle both ends respectively, described
Fastening screw hole position is respectively arranged at that the adhesive tape carries left piece and the adhesive tape is carried on right piece, and screw passes through the fastening spiral shell
The adhesive tape is carried silk hole position into left piece and the adhesive tape carries right piece and is fixed together.
Preferably, the step of support plate sticks adhesive tape by tool of taping, specifically includes：
Adhesive tape is first carried left piece installed in adhesive tape and adhesive tape is carried on right piece, adhesive tape carries left piece and adhesive tape carries right piece
It is fixed on by fastening screw hole position on the axle with bearing, axle is arranged in the limit fixing slot at left and right sides of base；Base
By four support column supports loadboard carrying platforms, there is carrier for bearing platform surface support plate fixation limit chamber and support plate to take for front end
Fetch bit and support plate locating dowel；Support plate is placed on support plate and fixed in limit chamber and positioned by support plate locating dowel by support plate position of taking；
Adhesive tape is pulled adhesive tape is tightened the cutting knife groove position that axle extended support plate carrying platform front end by adhesive tape again；Make smooth fast of adhesive tape
On prompt attaching support plate, finally, pocket knife removes support plate both ends excess enthalpy belt cutting along two Front cutting tool groove positions, is taken position by support plate
The support plate for posting adhesive tape is taken out, completion of so far taping.
Preferably, the support plate for posting adhesive tape is positioned at the step put and had on the pasting board tool of the substrate, tool
Body includes：
Side of the support plate with adhesive tape is covered on the side that pasting board tool carries substrate, so that support plate adhesive substrate.
Preferably, the step stenciled the support plate and make the substrate be attached on the adhesive tape, is specifically included：
Stenciling support plate twice back and forth with non-dust cloth makes substrate applied solid on adhesive tape.
In the present invention, paster technique provided by the invention is improved and pasted by hand by the positioning and guiding of pasting board tool
Have that deviation caused by pasting substrate on the support plate of high temperature gummed tape is big, it is regular poor, substrate is placed with more regularly uniformity good, and because of
The effect of positioning and guiding, greatly improve the efficiency of patch product.And the utilization for tool of taping, high temperature gummed tape is attached support plate more
Precisely, it is smooth, efficiency.It is reduced to the alarm rate after machine almost nil, greatly improves efficiency and yield.
Brief description of the drawings
Fig. 1 is the implementation process schematic diagram of paster technique method provided in an embodiment of the present invention.
Fig. 2 is the structural representation of pasting board tool provided in an embodiment of the present invention.
Fig. 3 is the structural representation of tool provided in an embodiment of the present invention of taping；
Fig. 4 is the decomposing schematic representation of the structure of tool provided in an embodiment of the present invention of taping.
Embodiment
In order that the purpose of the present invention, technical scheme and beneficial effect are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only explaining this hair
It is bright, it is not intended to limit the present invention.
In order to illustrate technical solutions according to the invention, illustrated below by specific embodiment.
Referring to Fig. 1, being the implementation process of paster technique method provided in an embodiment of the present invention, it mainly includes following step
Suddenly：
In step S101, prepared substrate；
In step s 102, the substrate is put on pasting board tool；
In step s 103, support plate sticks adhesive tape by tool of taping；
In step S104, post adhesive tape the support plate be positioned at pendulum have on the pasting board tool of the substrate；
In embodiments of the present invention, side of the support plate with adhesive tape is covered on the side that pasting board tool carries substrate, so that
Support plate adhesive substrate.That is, adhesive tape side is pasted on support plate, and opposite side is correspondingly pasted on substrate front side.
In step S105, stenciling the support plate makes the substrate be attached on the adhesive tape；
In embodiments of the present invention, stenciling support plate twice back and forth with non-dust cloth makes substrate applied solid on adhesive tape.
In step s 106, the support plate for posting substrate is taken out from pasting board tool, and the support plate for posting substrate is fixed on
In ultrasonic wave cleaning basket；
In step s 107, the support plate of substrate is posted described in ultrasonic wave cleaning.
The structure of the pasting board tool is described below in detail.
Referring to Fig. 2, the pasting board tool includes：One body 100, the surface of body 100 have a support plate cavity
101, the support plate cavity 101 is used to put support plate；The surrounding of support plate cavity 101 is provided with support plate locating dowel 102, it is described
Support plate is positioned after being well placed by the support plate locating dowel 102, so that the support plate will not shift；It is empty in the support plate
Multiple spaced substrate die cavitys 103 are additionally provided with chamber 101, the substrate die cavity 103 is used to put substrate；The substrate
Boss 104 is additionally provided with die cavity 103, the substrate is placed in the substrate die cavity 103 by the support of the boss 104
Make component empty avoiding in the substrate die cavity 103 on the substrate.
In embodiments of the present invention, the support plate locating dowel 102 includes four, and is respectively arranged at the support plate cavity
101 four angles.It is understood, however, that the support plate locating dowel 102 can also only include two or three, when two
When, then it is located at the opposite sides of the support plate cavity 101 respectively, when three, is then located at the three of the support plate cavity 101 respectively
Individual angle.
In embodiments of the present invention, the substrate die cavity 103 is arranged at the support plate cavity by preset rules arrangement spacing
In 101.For example, the substrate die cavity 103 is arranged in arrays in the support plate cavity 101.Wherein, the substrate die cavity 103
Shape and the shape of the substrate match.
As a preferred embodiment of the present invention, the height of the boss 104 is less than the height of the substrate die cavity 103, enter
One step, the height of the boss 104 is equal to the height of the substrate die cavity 103 plus the height of substrate, i.e., described substrate pendulum
The surface of the substrate and the plane of substrate die cavity 103 is caused to be in same level after being placed on the boss 104.
As another preferred embodiment of the present invention, the pasting board tool also includes：Support plate is taken position 105, and the support plate is taken
Fetch bit 105 is arranged at the side of body 100, takes position 105 by the support plate easily to put and take out support plate.Enter one
Step, the support plate is respectively provided with two relative sides of the body 100 and is taken position 105.
In embodiments of the present invention, step S102 specifically includes following steps：Substrate is placed in the pasting board tool
On substrate die cavity 103, the component on the substrate is set to exist by the support of the boss 104 in the substrate die cavity 103
Empty avoiding in the substrate die cavity 103.
From the foregoing, it will be observed that the present embodiment makes the support plate not shift by setting support plate locating dowel to position support plate；
And by setting substrate die cavity to put substrate, more facilitate so that putting substrate and irregular, substrate will not be put
It is placed with more regular.Pasting board tool provided by the invention, polarization is good, and operation is simple, improved efficiency, reduction equipment alarm.
The structure of the tool of taping is described below in detail.
It is the structural representation of tool provided in an embodiment of the present invention of taping, in order to just also referring to Fig. 3 and Fig. 4
In explanation, the part related to the embodiment of the present invention illustrate only.
The tool of taping mainly includes：Base 100, carrier for bearing platform 200 and adhesive tape installing mechanism 300.It is excellent
Choosing, also there are two cutting knife groove positions 11, two cutting knife groove positions 11 are respectively positioned at described on the carrier for bearing platform 200
The surface both ends of carrier for bearing platform 200.Wherein, the carrier for bearing platform 200 and the adhesive tape installing mechanism 300 are respectively positioned on institute
State on base 100, the carrier for bearing platform 200 and the adhesive tape installing mechanism 300 are arranged on same level direction.It is described
Base 100 is used to carry the carrier for bearing platform 200 and the adhesive tape installing mechanism 300, and the carrier for bearing platform 200 is used
In carrying support plate, the adhesive tape installing mechanism 300 is used to install adhesive tape.The adhesive tape on the adhesive tape installing mechanism 300 is pulled, is made
The adhesive tape extends to the direction of carrier for bearing platform 200, and the adhesive tape is attached to the load on the carrier for bearing platform 200
It is then, by the cutting knife groove position 11 of the pocket knife along the surface both ends of carrier for bearing platform 200 that support plate both ends are unnecessary on plate
Belt cutting remove.
In embodiments of the present invention, the tool of taping also includes：Support column 16, by support column 16 by the support plate
Carrying platform 200 is fixed on the base 100.In the present embodiment, four support columns 16 are located at the carrier for bearing platform
Between 200 and the base 100, and four angles of the carrier for bearing platform 200 are respectively arranged at, the support column 16 is by institute
State carrier for bearing platform 200 and prop up preset height, height of the height substantially with adhesive tape installing mechanism 300 maintains an equal level.
It is understood, however, that the carrier for bearing platform 200 can also be fixed on by three support columns 16
On the base 100, the position setting of three support columns 16 is triangular in shape, so also can be effectively by the carrier for bearing
Platform 200 is fixed on the base 100, and the carrier for bearing platform 200 will not be caused to swing.
As a preferred embodiment of the present invention, the surface of carrier for bearing platform 200 also there is a support plate to fix limit chamber
14, the support plate fixes limit chamber 14 between the cutting knife groove position 11, for placing support plate.
As a preferred embodiment of the present invention, the surface of carrier for bearing platform 200 is also taken position 13 including support plate, preferably
, support plate position 13 of taking includes two, and two support plates position 13 of taking is respectively arranged at the carrier for bearing platform 200
Both sides, further, support plate position 13 of taking are arranged at the centre position of the side of carrier for bearing platform 200.Operator
The position 13 that can be taken by the support plate is easily placed or taken out support plate.
As another preferred embodiment of the present invention, the surface of carrier for bearing platform 200 also includes support plate locating dowel 17, excellent
Choosing, the support plate locating dowel 17 includes four, and it is spacing that four support plate locating dowels 17 are respectively arranged at the support plate fixation
Four angles of chamber 14.The support plate locating dowel 17 is used to position support plate, avoids the support plate from moving.It is understood, however, that
The support plate locating dowel 17 can also include two or three, when two, then fix limit chamber 14 positioned at the support plate respectively
Opposite sides, when three, be then respectively arranged at three angles that the support plate fixes limit chamber 14.
As another preferred embodiment of the present invention, in embodiments of the present invention, the tool of taping also includes：Adhesive tape stretches tight
Mandrel 9, the adhesive tape are tightened axle 9 and are arranged between the carrier for bearing platform 200 and the adhesive tape installing mechanism 300, and solid
It is scheduled on the base 100.Neck is respectively equipped with the side position of base two of axle 9 specifically, installing the adhesive tape and tightening, it is described
The both ends that adhesive tape tightens axle 9 are respectively placed in the neck, so that the adhesive tape is tightened axle 9 and is fixed on the base 100.
The height that the adhesive tape tightens axle 9 is slightly above the height of the carrier for bearing platform 200, and the benefit so designed is convenient behaviour
Author operates adhesive tape.
In embodiments of the present invention, the adhesive tape installing mechanism 300 mainly includes：Bearing 2, axle 3, fastening screw hole position 4,
Adhesive tape carries left piece 5, adhesive tape fastens limited screw hole 6 (not essential) and adhesive tape carries right piece 7；Wherein, the adhesive tape is held
Carry left piece 5 and carry right piece 7 with the adhesive tape and be oppositely arranged, the axle 3 is located at the adhesive tape and carries left piece 5 to be carried with the adhesive tape
The through hole surrounded between right piece 7, the bearing 2 are sheathed on the both ends of axle 3 respectively, and the fastening screw hole position 4 is set respectively
It is placed in that the adhesive tape carries left piece 5 and the adhesive tape is carried on right piece 7, screw is through the fastening screw hole position 4 by the glue
Left piece 5 of band carrying and the adhesive tape carry right piece 7 and are fixed together.The adhesive tape fastening limited screw hole 6 is arranged at the glue
In left piece 5 of band carrying.
Carry right piece 7 it is understood, however, that the adhesive tape carries left piece 5 with the adhesive tape and can be formed in one
Structure, among it with through hole, for placing the axle 3, so just eliminate screw and the fastening screw hole position 4.Glue
Band, which is set in the adhesive tape and carries left piece 5, to be carried on right piece 7 with the adhesive tape.
In embodiments of the present invention, install be respectively equipped with the side position of base two of the adhesive tape installing mechanism 300 it is spacing
Fixing groove 8, the axle 3 of the adhesive tape installing mechanism 300 are positioned in the limit fixing slot 8, it is preferred that the bearing 2
The both ends of axle 3 are sheathed on respectively, and the bearing 2 is respectively positioned at the described spacing solid of the placement adhesive tape installing mechanism 300
Determine the outside of groove 8, can so fix the adhesive tape installing mechanism 300.
In embodiments of the present invention, step S103 specifically includes following steps：
Adhesive tape 1 is first carried left piece 5 installed in adhesive tape and adhesive tape is carried on right piece 7, adhesive tape carries left piece 5 and adhesive tape carrying
It is fixed on by fastening screw hole position 4 on the axle 3 with bearing 2 for right piece 7, axle 3 is arranged on the spacing solid of the left and right sides of base 100
Determine in groove 8.The front end of base 100 passes through four supports loadboard carrying platforms 200 of support column 16, the surface of carrier for bearing platform 200 tool
There is support plate to fix limit chamber 14 and support plate to take position 13 and support plate locating dowel 17.Support plate 12 is placed on load by support plate position 13 of taking
Plate is fixed in limit chamber 14 and positioned by support plate locating dowel 17.Adhesive tape 1 is pulled adhesive tape is tightened the extension overload of axle 9 by adhesive tape again
The cutting knife groove position 11 of the front end of plate carrying platform 200.Make on the smooth efficiently attaching support plate 12 of adhesive tape 1, finally, pocket knife is along both ends
Support plate both ends excess enthalpy belt cutting is removed in cutting knife groove position 11, by support plate take position 13 will post adhesive tape support plate take out, so far
Tape completion.
From the foregoing, it will be observed that the present embodiment is by setting base, carrier for bearing platform and adhesive tape installing mechanism；The base
For carrying the carrier for bearing platform and the adhesive tape installing mechanism, the carrier for bearing platform is used to carry support plate, described
Adhesive tape installing mechanism is used to install adhesive tape.The adhesive tape on the adhesive tape installing mechanism is pulled, the adhesive tape is held to the support plate
Carrying platform direction extends, and the adhesive tape is attached on the support plate on the carrier for bearing platform, then, by pocket knife along the load
The unnecessary belt cutting in support plate both ends is removed the cutting knife groove position at plate carrying platform surface both ends.The present invention can be by taping
Adhesive tape is attached on support plate by tool, and its flatness is good, efficiency high；Therefore product placement is also smooth after paster, follow-up
Upper machine operation will not cause equipment alarm, therefore the problem of do not interfere with efficiency.
In embodiments of the present invention, the substrate refers to：The hard wiring board after SMT patch parts is had already passed through, is contained on plate
There is component, be all the surrounding for being attached to substrate.Substrate size specification is generally 8.5*8.5*0.3mm, is lacked containing two
Angle is that motor pin avoids area.The support plate is such as 200*75mm spring steel materials, ensures that operation process will not deform.It is described
Adhesive tape is：The high temperature gummed tape that 200 ° of high temperature resistant, one side glue, width 75mm, the adhesive tape does not have to product is stained with glue, cull, hair
Yellow phenomenon.Support plate is 200*75mm spring steel materials, ensures that operation process will not deform.It is understood, however, that above-mentioned base
Plate, support plate and adhesive tape are not limited to the description above, any modification for being made within the spirit and principles of the invention, equivalent
Replace and improve etc., it should be included in the scope of the protection.
In summary, paster technique provided in an embodiment of the present invention improves craft by the positioning and guiding of pasting board tool
Deviation caused by pasting substrate on the support plate for post high temperature gummed tape is big, regular poor, substrate is placed with more regularly uniformity good, and
Because the effect of positioning and guiding, greatly improve the efficiency of patch product.And the utilization for tool of taping, attach high temperature gummed tape and carry
Plate is more accurate, smooth, efficiency.It is reduced to the alarm rate after machine almost nil, greatly improves efficiency and yield.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
- A kind of 1. paster technique method, it is characterised in that the described method comprises the following steps：Prepared substrate, the substrate refer to that having already passed through SMT pastes the hard wiring board after part, contains first device on hard wiring board Part；The substrate is put on pasting board tool；The pasting board tool includes：One body, the body surface have one to be used to put The support plate cavity of support plate is put, the support plate cavity surrounding is provided with support plate locating dowel, is additionally provided with the support plate cavity Multiple spaced substrate die cavitys, the substrate die cavity are used to put substrate；Support plate sticks adhesive tape by tool of taping；Post adhesive tape the support plate be positioned at pendulum have on the pasting board tool of the substrate；Stenciling the support plate makes the substrate be attached on the adhesive tape；The support plate for posting substrate is taken out from pasting board tool, and the support plate for posting substrate is fixed on ultrasonic wave cleaning basket；The support plate of substrate is posted described in ultrasonic wave cleaning.
- 2. the method as described in claim 1, it is characterised in that be additionally provided with boss in the substrate die cavity；The pasting board is controlled Tool also includes：Support plate is taken position, and support plate position of taking is arranged at the body side.
- 3. method as claimed in claim 2, it is characterised in that described put the substrate on pasting board tool the step of, tool Body includes：Substrate is placed on the substrate die cavity of the pasting board tool, made by the support of the boss in the substrate die cavity Component empty avoiding in the substrate die cavity on the substrate.
- 4. the method as described in claim 1, it is characterised in that the tool of taping includes：Base, carrier for bearing platform, And adhesive tape installing mechanism；Wherein, the carrier for bearing platform and the adhesive tape installing mechanism are respectively positioned on the base, described Carrier for bearing platform and the adhesive tape installing mechanism are arranged on same level direction；There are two on the carrier for bearing platform Cutting knife groove position, two cutting knife groove positions are located at the carrier for bearing platform surface both ends respectively；The tool of taping also wraps Include：Support column, the support column are respectively arranged at the support plate and held between the carrier for bearing platform and the base Four angles of carrying platform；The carrier for bearing platform is fixed on the base by the support column；The carrier for bearing Also there is platform surface a support plate to fix limit chamber, and the support plate fixes limit chamber between the cutting knife groove position；The load Plate carrying platform surface is also taken position including support plate, and support plate position of taking is respectively arranged at the carrier for bearing platform both sides.
- 5. method as claimed in claim 4, it is characterised in that the carrier for bearing platform surface also includes support plate locating dowel, The support plate locating dowel is respectively arranged at four angles that the support plate fixes limit chamber.
- 6. method as claimed in claim 5, it is characterised in that the tool of taping also includes：Adhesive tape tightens axle, the glue Band is tightened axle and is arranged between the carrier for bearing platform and the adhesive tape installing mechanism, and is fixed on the base.
- 7. method as claimed in claim 6, it is characterised in that the adhesive tape installing mechanism includes：Bearing, axle, fastening screw Hole position, adhesive tape carry left piece and adhesive tape carries right piece；Wherein, the adhesive tape carries left piece and carries right piece of phase with the adhesive tape To setting, the axle position carries left piece in the adhesive tape and the adhesive tape carries the through hole that is surrounded between right piece, the bearing The axle both ends are sheathed on respectively, and the fastening screw hole position is respectively arranged at the adhesive tape and carries left piece and adhesive tape carrying On right piece, the adhesive tape is carried into left piece through the fastening screw hole position for screw and the adhesive tape carries right piece and is fixed on one Rise.
- 8. method as claimed in claim 7, it is characterised in that the step of support plate sticks adhesive tape by tool of taping, Specifically include：Adhesive tape is first carried left piece installed in adhesive tape and adhesive tape is carried on right piece, adhesive tape carries left piece and adhesive tape carries right piece and passed through Fastening screw hole position is fixed on the axle with bearing, and axle is arranged in the limit fixing slot at left and right sides of base；Pan frontward end By four support column supports loadboard carrying platforms, carrier for bearing platform surface there is support plate to fix limit chamber and support plate take position And support plate locating dowel；Support plate is placed on support plate and fixed in limit chamber and positioned by support plate locating dowel by support plate position of taking；Draw again Dynamic adhesive tape makes adhesive tape tighten the cutting knife groove position that axle extended support plate carrying platform front end by adhesive tape；Make adhesive tape smooth efficiently Attach on support plate, finally, pocket knife removes support plate both ends excess enthalpy belt cutting along two Front cutting tool groove positions, will patch taking position by support plate The support plate for having adhesive tape takes out, completion of so far taping.
- 9. the method as described in claim 1, it is characterised in that the support plate for posting adhesive tape, which is positioned at pendulum, the base Step on the pasting board tool of plate, is specifically included：Side of the support plate with adhesive tape is covered on the side that pasting board tool carries substrate, so that support plate adhesive substrate.
- 10. the method as described in claim 1, it is characterised in that described to stencil the support plate to be attached to the substrate described Step on adhesive tape, is specifically included：Stenciling support plate twice back and forth with non-dust cloth makes substrate applied solid on adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510091508.1A CN104810316B (en) | 2015-02-28 | 2015-02-28 | A kind of paster technique method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510091508.1A CN104810316B (en) | 2015-02-28 | 2015-02-28 | A kind of paster technique method |
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| Publication Number | Publication Date |
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| CN104810316A CN104810316A (en) | 2015-07-29 |
| CN104810316B true CN104810316B (en) | 2018-01-05 |
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| CN201510091508.1A Expired - Fee Related CN104810316B (en) | 2015-02-28 | 2015-02-28 | A kind of paster technique method |
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Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4346469B2 (en) * | 2004-02-24 | 2009-10-21 | 三井金属鉱業株式会社 | Film bonding apparatus and film carrier tape for mounting electronic components |
| CN101431034B (en) * | 2008-11-27 | 2010-10-06 | 江苏康众数字医疗设备有限公司 | Method for multi-chip plane packaging |
| CN201352588Y (en) * | 2009-01-23 | 2009-11-25 | 松下能源(无锡)有限公司 | Cutting device and equipment for packing battery pole shank with adhesive tape |
| CN102221812A (en) * | 2010-04-19 | 2011-10-19 | 王锐 | Arrangement method and device for embedded quartz watch movements in pairs |
| CN202721905U (en) * | 2012-08-17 | 2013-02-06 | 腾捷（厦门）电子有限公司 | Semi-automatic printing tool with positioner |
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2015
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| CN104810316A (en) | 2015-07-29 |
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