CN104805613A - Electronic fabric surface processing process - Google Patents
Electronic fabric surface processing process Download PDFInfo
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- CN104805613A CN104805613A CN201510207532.7A CN201510207532A CN104805613A CN 104805613 A CN104805613 A CN 104805613A CN 201510207532 A CN201510207532 A CN 201510207532A CN 104805613 A CN104805613 A CN 104805613A
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- China
- Prior art keywords
- heat
- cloth
- resin solution
- electronics
- epoxy resin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Treatment Of Fiber Materials (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The invention provides an electronic fabric surface processing process. The electronic fabric surface processing process mainly comprises the following steps of surface chemical treatment, continuous heat treatment and batch heat treatment. The manufacturing process is simple and feasible, a produced electronic fabric is high in precision, high in density and low in doping amount, and micro cells in the electronic fabric can be obviously reduced.
Description
technology field
The present invention relates to electronics cloth manufacturing technique, particularly relate to a kind of electronics cloth process of surface treatment.
background technique
Electronics cloth refers to the general name of the electronic-grade glass fiber cloth for electronics industry.It is the expensive goods in electronic-grade glass fiber cloth.Main specifications has 7637,7630,7628,7615,1506,2116,2113,3313,1080,106,104, is mainly used in the manufacture of copper-clad plate.According to IPCEG 140 standard that the U.S. promulgates in April, 1988, this electronic-grade glass fiber cloth is totally 33 specifications, and the thinnest is called 104 cloth, and thickness only has 0.028mm; The heaviest is called as 7652 cloth, can reach 252g/m2.The electronics cloth of these special requirements, electronics industry consumption is all few.At present, electronics industry commonly uses electronics cloth specification three kinds.The maximum one of consumption is 7628 cloth, and thickness is 0.173mm, and unit are matter is 204.4g/m2; Next is 2116 cloth, and its nominal thickness is 0.094mm, and mass area ratio is 102g/m2; The one that consumption is slightly few is 1080 cloth, and its nominal thickness is 0.053mm, mass area ratio 46.8g/m2.
Summary of the invention
The invention provides a kind of electronics cloth process of surface treatment.For realizing object of the present invention, process program of the present invention is as follows:
A kind of electronics cloth process of surface treatment, it is characterized in that, its concrete steps are:
(1) chemical surface treatment
A, one or more fillers joined respectively in one or more organic resin solution and fully mix, making glue;
B, electronics cloth is immersed in glue;
(2) continuous heat
In sealed furnace, heat electronics cloth, temperature controls at 320-350 DEG C, and heat time heating time is 20-30min;
(3) batch heat
In airtight high bake temperature stove, carry out batch heat to cloth, temperature controls at 380-420 DEG C, and heat time heating time is 40-60min;
Preferably, in step (1), organic resin solution comprises epoxy resin solution, brominated epoxy resin solution or epoxy resin novolac solution.
Preferably, state in step (1) that filler comprises in cenosphere, ceramic powders, gel one or more.
Beneficial effect: the invention provides a kind of electronics cloth process of surface treatment, its key step comprises continuous heat-batch heat-chemical surface treatment, this manufacturing technique is simple, the electronics cloth high accuracy produced, high density, doping are low, obviously can reduce the microvesicle hole in electronics cloth.
Detailed description of the invention
The process means realized for making the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with detailed description of the invention, setting forth the present invention further.
A kind of electronics cloth process of surface treatment, it is characterized in that, its concrete steps are:
(1) chemical surface treatment
A, one or more fillers joined respectively in one or more organic resin solution and fully mix, making glue;
B, electronics cloth is immersed in glue;
(2) continuous heat
In sealed furnace, heat electronics cloth, temperature controls at 320-350 DEG C, and heat time heating time is 20-30min;
(3) batch heat
In airtight high bake temperature stove, carry out batch heat to cloth, temperature controls at 380-420 DEG C, and heat time heating time is 40-60min;
In step (1), organic resin solution comprises epoxy resin solution, brominated epoxy resin solution or epoxy resin novolac solution.
State in step (1) that filler comprises in cenosphere, ceramic powders, gel one or more.
The invention provides a kind of electronics cloth process of surface treatment, its key step comprises continuous heat-batch heat-chemical surface treatment, this manufacturing technique is simple, and the electronics cloth high accuracy produced, high density, doping are low, obviously can reduce the microvesicle hole in electronics cloth.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technology field, be all in like manner included in scope of patent protection of the present invention.
Claims (3)
1. an electronics cloth process of surface treatment, is characterized in that, its concrete steps are:
(1) chemical surface treatment
A, one or more fillers joined respectively in one or more organic resin solution and fully mix, making glue;
B, electronics cloth is immersed in glue;
(2) continuous heat
In sealed furnace, heat electronics cloth, temperature controls at 320-350 DEG C, and heat time heating time is 20-30min;
(3) batch heat
In airtight high bake temperature stove, carry out batch heat to cloth, temperature controls at 380-420 DEG C, and heat time heating time is 40-60min.
2. a kind of circuit board manufacturing process according to claim 1, is characterized in that, in step (1), organic resin solution comprises epoxy resin solution, brominated epoxy resin solution or epoxy resin novolac solution.
3. a kind of circuit board manufacturing process according to claim 1, is characterized in that, states filler comprises in cenosphere, ceramic powders, gel one or more in step (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510207532.7A CN104805613A (en) | 2015-04-28 | 2015-04-28 | Electronic fabric surface processing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510207532.7A CN104805613A (en) | 2015-04-28 | 2015-04-28 | Electronic fabric surface processing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104805613A true CN104805613A (en) | 2015-07-29 |
Family
ID=53690792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510207532.7A Pending CN104805613A (en) | 2015-04-28 | 2015-04-28 | Electronic fabric surface processing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104805613A (en) |
-
2015
- 2015-04-28 CN CN201510207532.7A patent/CN104805613A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150729 |