CN104801872B - A kind of semiconductor refrigeration member bonding machine - Google Patents
A kind of semiconductor refrigeration member bonding machine Download PDFInfo
- Publication number
- CN104801872B CN104801872B CN201510216326.2A CN201510216326A CN104801872B CN 104801872 B CN104801872 B CN 104801872B CN 201510216326 A CN201510216326 A CN 201510216326A CN 104801872 B CN104801872 B CN 104801872B
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- China
- Prior art keywords
- cylinder
- plumb joint
- disk
- frame
- sides
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Abstract
The present invention relates to the equipment of cooling component production technical field, title is a kind of semiconductor refrigeration member bonding machine, including frame, in frame, have the first cylinder to link plumb joint, there is transporter below plumb joint, second cylinder is installed in the frame behind plumb joint, below the second described cylinder, has cooling conduction seat；In frame, first cylinder and the second cylinder both sides are respectively provided with a slideway, the 3rd cylinder is separately installed with the two slideways, 3rd cylinder Jing control device connection liquid cylinder pressures, also power set connect the 3rd cylinder, and the 3rd cylinder can be run between the both sides of the both sides of plumb joint and cooling conduction seat along slideway movement in the presence of power set；It also keeps out disk including one, with cooling component can be made to reduce temperature and have a firm process under keeping certain pressure at short notice, to improve the advantage of welding quality, also with the effect for reducing energy waste, ensureing production efficiency.
Description
Technical field
The present invention relates to the equipment of cooling component production technical field, more particularly to cooling component bonding machine.
Background technology
Cooling component is made up of porcelain plate and multiple crystal grain for being welded on porcelain plate, is that crystal grain, both sides are in the middle of cooling component
Porcelain plate, the quality that crystal grain is welded on porcelain plate are directly connected to the quality of cooling component.
On porcelain plate it is cooling component bonding machine by crystal particle welding, such bonding machine has frame, has in frame
The plumb joint of cylinder linkage, has heater on described plumb joint, has transporter below plumb joint；The process of welding
It is such：It is placed on after crystal grain is placed on porcelain plate on transporter, transporter is transported to below plumb joint,
Plumb joint is run downwards, and plumb joint pushes porcelain plate and crystal grain at high temperature, can complete the welding to cooling component.
Using such bonding machine, after cooling component is welded, if plumb joint departs from cooling component at a higher temperature,
Make cooling component in freely stress-free state, welding quality will be affected；If after the temperature for waiting plumb joint reduction certain again
Cooling component is moved away from, then because plumb joint has larger thermal capacity, there is difficult intensification again, the waste energy, affects production to imitate
The shortcoming of rate.
The cooling component being welded is made to reduce temperature and have a firm mistake under keeping certain pressure at short notice
Journey, is the effective measures for improving cooling component welding quality, meanwhile, reduce energy waste, ensure that production efficiency is also chasing after for producer
Ask.
The content of the invention
The purpose of the present invention is aiming at disadvantages mentioned above, there is provided one kind can make cooling component reduce temperature at short notice
Degree, and keep having a firm process under certain pressure, to improve the semiconductor refrigeration member bonding machine of welding quality, while
Reach the effect for reducing energy waste, ensureing production efficiency.
The technical scheme is that what is be achieved in that：A kind of semiconductor refrigeration member bonding machine, including frame, in frame
The plumb joint for having the first cylinder to link, the first cylinder Jing control device connection liquid cylinder pressures have heater on described plumb joint,
There is transporter below plumb joint, below transporter, have supporting plate；
It is characterized in that：
Second cylinder, the second cylinder Jing control device connection liquid cylinder pressures, institute are installed in the frame behind plumb joint
There is cooling conduction seat below the second cylinder stated, inside cooling transmission seat, have circulation pipe, circulation pipe connects coolant；
In frame, the first cylinder and the second cylinder both sides are respectively provided with a slideway, pacify on the two slideways respectively
Equipped with the 3rd cylinder, the 3rd cylinder Jing control device connection liquid cylinder pressures, also power set connect the 3rd cylinder, and the 3rd cylinder exists
Can run between the both sides of the both sides of plumb joint and cooling conduction seat along slideway movement in the presence of power set；
It also keeps out disk including one, it is described keep out disk be a high-strength steel made by lamellar body, keep out
The structure for coordinating plumb joint, two the 3rd cylinders to push, keeps out above after there is the centre below disk cooperation cooling component to weld
Structure, it is the structure for tilting to keep out the both sides below disk.
Described plumb joint side is provided with the first Magnet, and the second Magnet, the first Magnet be provided with disk in described are kept out
Disk can will be kept out with the cooperation of the second Magnet to adsorb below the first cylinder.
The invention has the beneficial effects as follows：Such bonding machine have can make in the cooling component short time reduce temperature and
There is a firm process under the certain pressure of holding, to improve the advantage of welding quality, while reaching reduction energy waste, protecting
The effect of card production efficiency.
Described plumb joint side is provided with the first Magnet, and the second Magnet, the first Magnet be provided with disk in described are kept out
Coordinate with the second Magnet and disk absorption can will be kept out below the first cylinder, keep out disk more easily advantage with installation.
Description of the drawings
Fig. 1 is the structural representation of the present invention.
Fig. 2 be welding after keep out disk, plumb joint, the head-down position relation schematic diagram of the 3rd cylinder.
Fig. 3 is that the 3rd cylinder is run in the second cylinder process from plumb joint, keeps out the head-down position of disk and the 3rd cylinder
Relation schematic diagram.
Fig. 4 is to keep out disk at the second cylinder side, keeps out disk, the second cylinder, the 3rd cylinder head-down position relation and illustrates
Figure.
Wherein：1st, frame 2, the first cylinder 3, plumb joint 4, heater 5, transporter 6, supporting plate 7, the second gas
Cylinder 8, cooling conduction seat 9, circulation pipe 10, slideway 11, the 3rd cylinder 12, keep out disk 13, the first Magnet 14, the second magnetic
Ferrum 15, power set 16, product.
Specific embodiment
The invention will be further described below in conjunction with the accompanying drawings.
As shown in figure 1, a kind of semiconductor refrigeration member bonding machine, including frame 1, there is the linkage of the first cylinder 2 in frame 1
Plumb joint 3,2 Jing control device connection liquid cylinder pressures of the first cylinder, has heater 4, under plumb joint on described plumb joint
There is transporter 5 in face, has supporting plate 6 below transporter；
It is characterized in that：
Second cylinder 7,7 Jing control device connection liquid cylinder pressures of the second cylinder, institute are installed in the frame behind plumb joint
There is cooling conduction seat 8 below the second cylinder stated, inside cooling transmission seat, have circulation pipe 9, circulation pipe connects coolant；
In frame, the first cylinder and the second cylinder both sides are respectively provided with a slideway 10, on the two slideways respectively
3rd cylinder 11 is installed, the 3rd cylinder Jing control device connection liquid cylinder pressures, also power set 15 connect the 3rd cylinder, the 3rd
Cylinder can be run between the both sides of the both sides of plumb joint and cooling conduction seat along slideway movement in the presence of power set；
It also keeps out disk 12 including one, it is described keep out disk be a high-strength steel made by lamellar body, keep out mask on disk
There is the structure for coordinating plumb joint, two the 3rd cylinders to push, keep out the centre below disk and have above after cooperation cooling component welding
Structure, keep out the both sides below disk be tilt structure；
Plumb joint can be welded to cooling component, and described transporter can be conveyer belt, and described keeps out disk tool
There is certain pressure bearing capacity.
When this device is used, the 3rd cylinder runs to the both sides of plumb joint, by it is following keep out disk be placed on it is to be welded
Above product, welded, then the operation of the 3rd cylinder, press against it is following keep out disk both sides, continue to cooling component to press, at this moment
Keep out disk, plumb joint, the 3rd cylinder head-down position relation as shown in Fig. 2 in figure 16 represent product.
First cylinder runs up, and departs from welding, at this moment in the case where the 3rd cylinder continues to press downwards, fills in power
Run to the second cylinder both sides under the effect of putting, Fig. 3 be the 3rd cylinder run in the second cylinder process from plumb joint, keep out disk and
The head-down position relation schematic diagram of the 3rd cylinder.
Second cylinder is pushed, and product can be cooled down, and cooling work at this moment also has the downward pressure of the 3rd cylinder
Acting on and keeping out disk, whole process is just carried out under stress, the purpose of the present invention can be realized, Fig. 4 is disk to be kept out in the second gas
During cylinder side, disk, the second cylinder, the 3rd cylinder head-down position relation schematic diagram are kept out, it is possible to achieve cold in the case of pressure
But, the effect with the present invention.
Described plumb joint side is provided with the first Magnet 13, and the second Magnet 14 be provided with disk in described is kept out, and first
Magnet and the cooperation of the second Magnet can will keep out disk absorption below the first cylinder.
So can will keep out disk and be placed on below plumb joint before welding, with quick for installation, para-position easily, use
More easily advantage.
The specific embodiment of the present invention is the foregoing is only, but the architectural feature of the present invention is not limited to this, any ability
The technical staff in domain in the field of the invention, all cover in the scope of the claims of the present invention by the change or modification made.
Claims (2)
1. a kind of semiconductor refrigeration member bonding machine, including frame, in frame, have the first cylinder to link plumb joint, the first cylinder
Jing control device connection liquid cylinder pressures, have heater on described plumb joint, have transporter, transmission dress below plumb joint
Putting has supporting plate below；
It is characterized in that：
Second cylinder is installed in the frame behind plumb joint, the second cylinder Jing control device connection liquid cylinder pressures, described
There is cooling conduction seat below two cylinders, inside cooling transmission seat, have circulation pipe, circulation pipe connects coolant；
In frame, the first cylinder and the second cylinder both sides are respectively provided with a slideway, are separately installed with the two slideways
3rd cylinder, also the 3rd cylinder Jing control device connection liquid cylinder pressures, power set connect the 3rd cylinder, and the 3rd cylinder is in power
Can run between the both sides of the both sides of plumb joint and cooling conduction seat along slideway movement in the presence of device；
It also keeps out disk including one, it is described keep out disk be a high-strength steel made by lamellar body, keep out to have above disk and coordinate
The structure that plumb joint, two the 3rd cylinders are pushed, keeps out the centre below disk and has the structure for coordinating cooling component above after welding,
It is the structure for tilting to keep out the both sides below disk.
2. semiconductor refrigeration member bonding machine according to claim 1, is characterized in that：Described plumb joint side is provided with
One Magnet, described keeping out be provided with disk the second Magnet, and the first Magnet and the cooperation of the second Magnet can will be kept out disk absorption and exist
Below first cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510216326.2A CN104801872B (en) | 2015-05-04 | 2015-05-04 | A kind of semiconductor refrigeration member bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510216326.2A CN104801872B (en) | 2015-05-04 | 2015-05-04 | A kind of semiconductor refrigeration member bonding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104801872A CN104801872A (en) | 2015-07-29 |
| CN104801872B true CN104801872B (en) | 2017-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510216326.2A Active CN104801872B (en) | 2015-05-04 | 2015-05-04 | A kind of semiconductor refrigeration member bonding machine |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109483001A (en) * | 2018-12-28 | 2019-03-19 | 湖北赛格瑞新能源科技有限公司 | A kind of welding equipment and welding method for micro thermoelectric device |
| CN110423132B (en) * | 2019-08-14 | 2023-12-22 | 许昌市森洋电子材料有限公司 | Semiconductor refrigeration piece welding set |
| CN112077472A (en) * | 2020-08-17 | 2020-12-15 | 国为(南京)软件科技有限公司 | Semiconductor refrigeration piece welding set |
Citations (8)
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| JPH0446666A (en) * | 1990-05-31 | 1992-02-17 | Eiteitsuku Tekutoron Kk | Reflow soldering method and device |
| JP2006173471A (en) * | 2004-12-17 | 2006-06-29 | Suzuki Co Ltd | Reflow soldering apparatus |
| JP2011174449A (en) * | 2010-02-25 | 2011-09-08 | Toshiba Carrier Corp | Hermetic compressor and refrigerating cycle device |
| CN202607158U (en) * | 2012-05-24 | 2012-12-19 | 芜湖众力底盘系统有限公司 | Adjustable welding jig for safety belt reinforced plate |
| CN204095126U (en) * | 2014-08-04 | 2015-01-14 | 林东球 | Cooling component welder |
| CN204122996U (en) * | 2014-09-17 | 2015-01-28 | 河南机电高等专科学校 | The apparatus for welding and positioning of truck drive shaft intermediate supports bracket |
| CN204308445U (en) * | 2014-12-13 | 2015-05-06 | 江西宏宇铝业有限公司 | A kind of aluminium alloy welding mechanism |
| CN204565437U (en) * | 2015-05-04 | 2015-08-19 | 河南鸿昌电子有限公司 | A kind of semiconductor refrigeration member bonding machine |
-
2015
- 2015-05-04 CN CN201510216326.2A patent/CN104801872B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0446666A (en) * | 1990-05-31 | 1992-02-17 | Eiteitsuku Tekutoron Kk | Reflow soldering method and device |
| JP2006173471A (en) * | 2004-12-17 | 2006-06-29 | Suzuki Co Ltd | Reflow soldering apparatus |
| JP2011174449A (en) * | 2010-02-25 | 2011-09-08 | Toshiba Carrier Corp | Hermetic compressor and refrigerating cycle device |
| CN202607158U (en) * | 2012-05-24 | 2012-12-19 | 芜湖众力底盘系统有限公司 | Adjustable welding jig for safety belt reinforced plate |
| CN204095126U (en) * | 2014-08-04 | 2015-01-14 | 林东球 | Cooling component welder |
| CN204122996U (en) * | 2014-09-17 | 2015-01-28 | 河南机电高等专科学校 | The apparatus for welding and positioning of truck drive shaft intermediate supports bracket |
| CN204308445U (en) * | 2014-12-13 | 2015-05-06 | 江西宏宇铝业有限公司 | A kind of aluminium alloy welding mechanism |
| CN204565437U (en) * | 2015-05-04 | 2015-08-19 | 河南鸿昌电子有限公司 | A kind of semiconductor refrigeration member bonding machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104801872A (en) | 2015-07-29 |
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