CN104801851B - 硅基led芯片切割方法及其切割用分光器 - Google Patents
硅基led芯片切割方法及其切割用分光器 Download PDFInfo
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- CN104801851B CN104801851B CN201510147136.XA CN201510147136A CN104801851B CN 104801851 B CN104801851 B CN 104801851B CN 201510147136 A CN201510147136 A CN 201510147136A CN 104801851 B CN104801851 B CN 104801851B
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- cutting
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- silicon base
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
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CN201510147136.XA CN104801851B (zh) | 2015-03-31 | 2015-03-31 | 硅基led芯片切割方法及其切割用分光器 |
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CN201510147136.XA CN104801851B (zh) | 2015-03-31 | 2015-03-31 | 硅基led芯片切割方法及其切割用分光器 |
Publications (2)
Publication Number | Publication Date |
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CN104801851A CN104801851A (zh) | 2015-07-29 |
CN104801851B true CN104801851B (zh) | 2019-01-18 |
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201516540U (zh) * | 2009-09-16 | 2010-06-30 | 苏州德龙激光有限公司 | 一种新型led晶圆三光束激光划片设备 |
CN101795808A (zh) * | 2007-07-24 | 2010-08-04 | Eo技术有限公司 | 使用光束分割的激光处理设备和方法 |
JP2011056544A (ja) * | 2009-09-10 | 2011-03-24 | Aisin Seiki Co Ltd | レーザ加工方法及びレーザ加工装置 |
CN202599839U (zh) * | 2012-04-27 | 2012-12-12 | 北京中拓机械有限责任公司 | Led外延片非接触式测试装置 |
CN102822952A (zh) * | 2010-03-25 | 2012-12-12 | 威科仪器有限公司 | 分裂激光划片机 |
CN103785947A (zh) * | 2014-01-27 | 2014-05-14 | 深圳英诺激光科技有限公司 | 一种能提高led芯片劈裂良率的激光切割机 |
CN103934577A (zh) * | 2014-03-12 | 2014-07-23 | 苏州兰叶光电科技有限公司 | 切宽可调的无杂光激光加工系统 |
CN104439716A (zh) * | 2014-11-17 | 2015-03-25 | 深圳锜宏伟科技有限公司 | 激光加工系统及激光加工方法 |
CN204621357U (zh) * | 2015-03-31 | 2015-09-09 | 山西南烨立碁光电有限公司 | 硅基led芯片切割用分光器 |
-
2015
- 2015-03-31 CN CN201510147136.XA patent/CN104801851B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101795808A (zh) * | 2007-07-24 | 2010-08-04 | Eo技术有限公司 | 使用光束分割的激光处理设备和方法 |
JP2011056544A (ja) * | 2009-09-10 | 2011-03-24 | Aisin Seiki Co Ltd | レーザ加工方法及びレーザ加工装置 |
CN201516540U (zh) * | 2009-09-16 | 2010-06-30 | 苏州德龙激光有限公司 | 一种新型led晶圆三光束激光划片设备 |
CN102822952A (zh) * | 2010-03-25 | 2012-12-12 | 威科仪器有限公司 | 分裂激光划片机 |
CN202599839U (zh) * | 2012-04-27 | 2012-12-12 | 北京中拓机械有限责任公司 | Led外延片非接触式测试装置 |
CN103785947A (zh) * | 2014-01-27 | 2014-05-14 | 深圳英诺激光科技有限公司 | 一种能提高led芯片劈裂良率的激光切割机 |
CN103934577A (zh) * | 2014-03-12 | 2014-07-23 | 苏州兰叶光电科技有限公司 | 切宽可调的无杂光激光加工系统 |
CN104439716A (zh) * | 2014-11-17 | 2015-03-25 | 深圳锜宏伟科技有限公司 | 激光加工系统及激光加工方法 |
CN204621357U (zh) * | 2015-03-31 | 2015-09-09 | 山西南烨立碁光电有限公司 | 硅基led芯片切割用分光器 |
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CN104801851A (zh) | 2015-07-29 |
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Address after: 046000 No. 65 Beidongxin Street, Changzhi City, Shanxi Province Patentee after: Shanxi Liqiang Technology Co.,Ltd. Address before: 046000 No. 65 Beidongxin Street, Changzhi City, Shanxi Province Patentee before: SHANXI NANYE LIGITEK OPTOELECTRONIC Co.,Ltd. |
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Effective date of registration: 20230710 Address after: 046000 No.15, west section of Huifeng street, Luzhou District, Changzhi City, Shanxi Province Patentee after: Shanxi Huajia tech Photoelectric Technology Co.,Ltd. Address before: 046000 No. 65 Beidongxin Street, Changzhi City, Shanxi Province Patentee before: Shanxi Liqiang Technology Co.,Ltd. |