CN104797085B - Circuit board buries copper billet blind slot preparation method - Google Patents
Circuit board buries copper billet blind slot preparation method Download PDFInfo
- Publication number
- CN104797085B CN104797085B CN201510198074.5A CN201510198074A CN104797085B CN 104797085 B CN104797085 B CN 104797085B CN 201510198074 A CN201510198074 A CN 201510198074A CN 104797085 B CN104797085 B CN 104797085B
- Authority
- CN
- China
- Prior art keywords
- copper
- photoresist
- copper billet
- blind slot
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 101
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 101
- 239000010949 copper Substances 0.000 title claims abstract description 101
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 45
- 238000005530 etching Methods 0.000 claims abstract description 29
- 238000006243 chemical reaction Methods 0.000 claims abstract description 12
- 238000004140 cleaning Methods 0.000 claims abstract description 9
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 8
- 238000003475 lamination Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 6
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims description 6
- 235000017557 sodium bicarbonate Nutrition 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- BZSXEZOLBIJVQK-UHFFFAOYSA-N 2-methylsulfonylbenzoic acid Chemical compound CS(=O)(=O)C1=CC=CC=C1C(O)=O BZSXEZOLBIJVQK-UHFFFAOYSA-N 0.000 claims description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 229960004643 cupric oxide Drugs 0.000 claims description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 3
- 230000003628 erosive effect Effects 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 238000007127 saponification reaction Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 2
- 229910001431 copper ion Inorganic materials 0.000 claims description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 claims 1
- 230000007797 corrosion Effects 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000003801 milling Methods 0.000 abstract description 11
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 239000002826 coolant Substances 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 4
- 230000004224 protection Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000000227 grinding Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000001261 hydroxy acids Chemical group 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a kind of circuit board to bury copper billet blind slot preparation method, comprises the following steps：The one side for being embedded to copper billet on circuit boards attaches photoresist；Photoresist is corresponded into copper billet needs the position of open-blind groove to block, and photoresist other positions is irradiated by light polymerisation occurs；Photoresist is corresponded into copper billet needs the position of open-blind groove to be removed by developing reaction, exposes copper face；Etching solution is sprayed on copper face, etches blind slot.The circuit board section without open-blind groove is protected by using the photoresist after polymerisation; the depth of blind slot can be controlled well by etching mode; and utilize the uniformity of etching; blind slot wall after etching is smooth; so as to solve the blind slot bottom milling cutter print problem of conventionally employed Digit Control Machine Tool processing; the heating element radiating effect in later stage is lifted, copper PCB surface cooling oil, the cleaning dirty problem of coolant are buried after thoroughly solving groove milling.
Description
Technical field
The present invention relates to circuit board technology, more particularly to a kind of circuit board buries copper billet blind slot preparation method.
Background technology
With the development of electronics industry, electronic product volume is less and less, and power density is increasing, and heat dissipation problem seems
It is particularly important, it is general using copper billet is embedded on circuit boards to solve the problems, such as heat dissipation for circuit board, by CNC milling machine mode in copper
Made on block and control deep blind slot, heating element is conducted directly against the mode being attached in copper billet blind slot, heat by copper billet,
Meets the needs of radiating.And it is traditional the mode for controlling deep blind slot is made on copper billet by CNC milling machine mode, following lack be present
Point：Existing PCB equipment can not meet processing request, it is necessary to the Digit Control Machine Tool processing of professional intermetallic composite coating；CNC milling machine processing needs
Want cooling oil or coolant to cool down, need the cleaning of professional cleaning equipment to bury copper circuit board after having made；After Digit Control Machine Tool processing,
Milling cutter print can be left in blind slot, difference in height easily occurs when mounting heating element, influences heating element radiating effect.
The content of the invention
Based on this, it is necessary to the defects of for prior art, there is provided a kind of circuit board buries copper billet blind slot preparation method, can be very
Realize well and bury the making of copper billet blind slot, without the circuit board after surface cleaning, milling cutter print is also will not leave behind in the blind slot produced.
Its technical scheme is as follows：
A kind of circuit board buries copper billet blind slot preparation method, comprises the following steps：
The one side for being embedded to copper billet on circuit boards attaches photoresist；
Photoresist is corresponded into copper billet needs the position of open-blind groove to block, and photoresist other positions are passed through into light
Polymerisation occurs for irradiation；
Photoresist is corresponded into copper billet needs the position of open-blind groove to be removed by developing reaction, exposes copper face；
Etching solution is sprayed on copper face, etches blind slot.
Its further technical scheme is as follows：
The photoresist is photosensitive resist dry film.
It is embedded to before the one side attaching photoresist of copper billet, also comprises the following steps on circuit boards：
Cleaning circuit plate plate face；
Microetch is carried out to copper block surface；
Drying circuit plate plate face.
Etching solution is sprayed on copper face, after etching blind slot, is also comprised the following steps：
Photoresist after polymerisation is removed.
Photoresist after polymerisation is removed, specifically comprised the following steps：
Photopolymer in photoresist produces saponification dissolving with hydroxide ion；
Binder polymer in photoresist produces with hydroxide ion closes reaction dissolving in soda acid.
The step of etching solution etches blind slot is being sprayed on copper face, is being carried out in vacuum etch machine.
The etching solution is the mixed liquor of sodium chlorate and hydrochloric acid.
Photoresist is corresponded into copper billet needs the position of open-blind groove to expose copper face by developing reaction removal, specifically includes
Following steps：
Corresponding to copper billet in photoresist needs the position of open-blind groove to spray sodium bicarbonate solution, the photosensitive resist of the position
Film reacts with sodium bicarbonate solution, exposes the copper face of the position correspondence.
Described circuit board buries the step of copper billet blind slot preparation method also buries copper circuit board including making：
The through hole for placing copper billet is opened up on the first base material layer；
The first base material layer, prepreg, the second substrate layer successively lamination are placed, copper billet is placed on the first base material layer
In through hole；
Lamination is performed, using the high pressure of lamination process and the heated solidification of the resin gummosis of prepreg, copper billet is fixed
In the through hole of the first base material layer；
Grinding is performed, copper block surface is removed and overflows the resin gummosis of coming.
The advantages of below to preceding solution or principle illustrate：
Foregoing circuit plate buries copper billet blind slot preparation method, need not be opened by using the photoresist protection after polymerisation
The circuit board section of blind slot, the depth of blind slot can be controlled well by etching mode, and utilize the uniformity of etching, after etching
Blind slot wall it is smooth, be the hair in later stage so as to solve the blind slot bottom milling cutter print problem of conventionally employed Digit Control Machine Tool processing
Hot component welding provides good contact plane, so as to lift the heating element radiating effect in later stage, and makes blind slot
During without needing cooling oil or coolant to cool down, bury copper PCB surface cooling oil, coolant cleaning not after thoroughly solving groove milling
Net problem.
Brief description of the drawings
Fig. 1 buries the block diagram of copper billet blind slot preparation method for the circuit board described in the embodiment of the present invention；
Fig. 2 is the structural representation for burying copper circuit board described in the embodiment of the present invention；
Fig. 3 is the structural representation buried after copper circuit board open-blind groove described in the embodiment of the present invention.
Description of reference numerals：
10th, the first base material layer, 110, blind slot, 20, prepreg, 210, resin gummosis, the 30, second substrate layer, 40, copper
Block, 50, photoresist.
Embodiment
Reference picture 1,3, a kind of circuit board bury copper billet blind slot preparation method, comprised the following steps：
S100：Cleaning circuit plate plate face；Microetch is carried out to the surface of copper billet 40；Drying circuit plate plate face.
S200：The one side for being embedded to copper billet 40 on circuit boards attaches photoresist 50；
S300：Need the position of open-blind groove 110 to block the corresponding copper billet 40 of photoresist 50, by photoresist 50 its
His position is irradiated by light occurs polymerisation；
S400：Need the position of open-blind groove 110 to be removed by developing reaction the corresponding copper billet 40 of photoresist 50, expose
Copper face；
S500：Etching solution is sprayed on copper face, etches blind slot 110.
S600：Photoresist 50 after polymerisation is removed.
Circuit board described in the present embodiment buries copper billet blind slot preparation method, by using the photoresist after polymerisation
Circuit board section of 50 protections without open-blind groove, can control the depth of blind slot 110 well by etching mode, and utilize etching
Uniformity, the wall of blind slot 110 after etching is smooth, so as to solve the blind slot bottom milling cutter of conventionally employed Digit Control Machine Tool processing
Print problem, good contact plane is provided for the heating element welding in later stage, so as to lift the heating element radiating in later stage
Effect, and bury copper PCB tables after thoroughly solving groove milling without needing cooling oil or coolant to cool down during making blind slot 110
The cleaning dirty problem of face cooling oil, coolant.
Wherein, step S100 is primarily to greasy dirt, the oxide layer of removal plate face, are reacted by microetch：Using with strong
The hydrogen peroxide of oxidisability, copper is oxidized to the copper ion of divalent state, existed in the form of cupric oxide, cupric oxide generates with sulfuric acid reaction
Copper sulphate, it is roughened copper face, makes photoresist 50 good in plate face absorption, by drying plate face, prevent copper face from aoxidizing, the step
According to production requirement, may be selected to perform or do not perform.
Wherein, the preferred photosensitive resist dry film of photoresist 50 described in step S200.The hydroxy-acid group contained in dry film
With unsaturated organic compound (-) can and copper (+) produce chemical action, generate chemical bond, and dry film with it is irregular micro-
See and produce mutual interlocking between coarse copper surface, can consolidate and be attached in plate face.
Wherein, step S300 is irradiated by light, and polymerisation occurs for dry film, and the dry film after polymerization can effectively prevent to develop
The erosion of liquid and etching solution, turn into the resist layer of protection plate face.
Wherein, the corresponding copper billet 40 of photoresist 50 is needed the position of open-blind groove 110 to pass through developing reaction by step S400
Copper face is exposed in removal, specifically comprises the following steps：
The position spray developing liquid sodium bicarbonate solution of open-blind groove 110 is needed in the corresponding copper billet 40 of photoresist 50, should
The photoresist 50 of position reacts with sodium bicarbonate solution, exposes the copper face of the position correspondence.
Wherein, etching solution described in step S500 is the mixed liquor of sodium chlorate and hydrochloric acid, its concentration according to etching speed and
Depth is prepared, and the step is carried out in vacuum etch machine, the uniformity of etching solution sprinkling is effectively ensured, after making etching
Plate face is smooth, it is smooth, without obvious flash.
Wherein, step S600 removes the photoresist 50 after polymerisation, specifically comprises the following steps：
Photopolymer in photoresist 50 produces saponification dissolving with hydroxide ion；
Binder polymer in photoresist 50 produces with hydroxide ion closes reaction dissolving in soda acid.
According to production requirement, the step may be selected to perform or do not perform, or remove dry film, this example using other modes
In, the step is also to be carried out in vacuum etch machine, convenient and swift.
Reference picture 2, Fig. 3, described circuit board bury the step of copper billet blind slot preparation method also buries copper circuit board including making：
The through hole for placing copper billet 40 is opened up on the first base material layer 10；
The first base material layer 10, prepreg 20, the second substrate layer 30 successively lamination are placed, copper billet 40 is placed on first
In the through hole of substrate layer 10；
Lamination is performed, using the high pressure of lamination process and the resin gummosis 210 of prepreg 20 by heat cure, by copper billet
40 are fixed in the through hole of the first base material layer 10；
Grinding is performed, the surface of copper billet 40 is removed and overflows the resin gummosis 210 of coming.
Made by this method and control deep blind slot 110, be easy to bury the heating element of copper circuit board directly against being attached to copper billet 40
Blind slot 110 on, heat is conducted by copper billet 40, meets the needs of radiating, and the method is simple, convenient, cost is low.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (9)
1. a kind of circuit board buries copper billet blind slot preparation method, it is characterised in that comprises the following steps：Copper block surface is carried out micro-
Erosion, using the hydrogen peroxide with strong oxidizing property, copper is oxidized to the copper ion of divalent state, existed in the form of cupric oxide, cupric oxide
Copper sulphate is generated with sulfuric acid reaction, is roughened copper face；The one side for being embedded to copper billet on circuit boards attaches photoresist；Will be photosensitive anti-
Erosion film, which corresponds to copper billet, needs the position of open-blind groove to block, and photoresist other positions is irradiated by light polymerization occurs instead
Should；Photoresist is corresponded into copper billet needs the position of open-blind groove to be removed by developing reaction, exposes copper face；Sprayed on copper face
Etching solution, the etching solution are the mixed liquor of sodium chlorate and hydrochloric acid, and its concentration is prepared according to etching speed and depth, are etched
Go out blind slot.
2. circuit board as claimed in claim 1 buries copper billet blind slot preparation method, it is characterised in that the photoresist is sense
Light dry film against corrosion.
3. circuit board as claimed in claim 2 buries copper billet blind slot preparation method, it is characterised in that is embedded to copper billet on circuit boards
One side attach photoresist before, also comprise the following steps：Cleaning circuit plate plate face；Microetch is carried out to copper block surface；Dry
Dry circuit plate plate face.
4. circuit board as claimed in claim 3 buries copper billet blind slot preparation method, it is characterised in that etching is sprayed on copper face
Liquid, after etching blind slot, also comprise the following steps：Photoresist after polymerisation is removed.
5. circuit board as claimed in claim 4 buries copper billet blind slot preparation method, it is characterised in that by after polymerisation
Photoresist removes, and specifically comprises the following steps：Photopolymer and hydroxide ion generation saponification in photoresist is anti-
It should dissolve；Binder polymer in photoresist produces with hydroxide ion closes reaction dissolving in soda acid.
6. circuit board as claimed in claim 5 buries copper billet blind slot preparation method, it is characterised in that etching solution is sprayed on copper face
The step of etching blind slot, carried out in vacuum etch machine.
7. circuit board as claimed in claim 1 buries copper billet blind slot preparation method, it is characterised in that the etching solution is sodium chlorate
With the mixed liquor of hydrochloric acid.
8. circuit board as claimed in claim 1 buries copper billet blind slot preparation method, it is characterised in that photoresist is corresponded into copper
Block needs the position of open-blind groove to expose copper face by developing reaction removal, specifically comprises the following steps：It is corresponding in photoresist
Copper billet needs the position of open-blind groove to spray sodium bicarbonate solution, and photoresist and the sodium bicarbonate solution of the position react, dew
Go out the copper face of the position correspondence.
9. the circuit board as described in any one of claim 1 to 8 buries copper billet blind slot preparation method, it is characterised in that it also includes
The step of copper circuit board, is buried in making：The through hole for placing copper billet is opened up on the first base material layer；By the first base material layer, semi-solid preparation
Lamination is placed successively for piece, the second substrate layer, copper billet is placed in the through hole of the first base material layer；Lamination is performed, using being laminated
The high pressure of journey and the heated solidification of the resin gummosis of prepreg, copper billet are fixed in the through hole of the first base material layer；Execution is ground
Mill, remove copper block surface and overflow the resin gummosis of coming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510198074.5A CN104797085B (en) | 2015-04-23 | 2015-04-23 | Circuit board buries copper billet blind slot preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510198074.5A CN104797085B (en) | 2015-04-23 | 2015-04-23 | Circuit board buries copper billet blind slot preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104797085A CN104797085A (en) | 2015-07-22 |
| CN104797085B true CN104797085B (en) | 2018-01-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510198074.5A Expired - Fee Related CN104797085B (en) | 2015-04-23 | 2015-04-23 | Circuit board buries copper billet blind slot preparation method |
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| Country | Link |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611720B (en) * | 2016-03-14 | 2018-09-14 | 江苏普诺威电子股份有限公司 | PCB acoustical cavities and its processing method |
| CN105792548B (en) * | 2016-05-23 | 2018-12-14 | 上海美维科技有限公司 | A method of ladder slot structure printed circuit board is made with plating and engraving method |
| CN106132089B (en) * | 2016-06-30 | 2018-11-20 | 景旺电子科技(龙川)有限公司 | A kind of printed wiring board buries copper billet method |
| CN108811349A (en) * | 2018-06-29 | 2018-11-13 | 奥士康精密电路（惠州）有限公司 | A method of improving pcb board production efficiency |
| CN109475051B (en) * | 2018-09-26 | 2020-10-27 | 江门崇达电路技术有限公司 | Manufacturing method of local thick copper printed circuit board |
| CN114126187B (en) * | 2020-08-26 | 2024-05-10 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with embedded heat dissipation structure and manufacturing method thereof |
| CN112533395B (en) * | 2020-12-21 | 2021-12-24 | 北京同方信息安全技术股份有限公司 | Method for embedding resistor in printed circuit board and printed circuit board thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3907151B2 (en) * | 2000-01-25 | 2007-04-18 | 株式会社東芝 | Manufacturing method of semiconductor device |
| JP4041785B2 (en) * | 2003-09-26 | 2008-01-30 | 松下電器産業株式会社 | Manufacturing method of semiconductor device |
| CN101909407B (en) * | 2010-07-14 | 2012-11-07 | 深圳市深联电路有限公司 | Method for etching V-CUT on iron substrate |
| CN103491710B (en) * | 2013-09-09 | 2016-02-17 | 莆田市龙腾电子科技有限公司 | A kind of two-sided and multilayer line board machining process |
| CN103561543A (en) * | 2013-11-13 | 2014-02-05 | 惠州中京电子科技股份有限公司 | PCB countersunk groove processing method |
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| CN104797085A (en) | 2015-07-22 |
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