CN104795484A - Improved LED (light emitting diode) support - Google Patents
Improved LED (light emitting diode) support Download PDFInfo
- Publication number
- CN104795484A CN104795484A CN201510165717.6A CN201510165717A CN104795484A CN 104795484 A CN104795484 A CN 104795484A CN 201510165717 A CN201510165717 A CN 201510165717A CN 104795484 A CN104795484 A CN 104795484A
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- CN
- China
- Prior art keywords
- copper foil
- base
- led support
- led
- modified model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Abstract
The invention discloses an improved LED (light emitting diode) support. The improved LED support comprises a base and two pins, wherein accommodating space is formed in the base; a heat dissipation copper foil is arranged on the bottom of the accommodating space; each pin comprises a top plate and a connecting portion; the top plates penetrate in the base and are arranged in the accommodating space; the connecting portions are arranged on the outer side of the base; each top plate comprises at least two base plates which are sequentially connected to one another from bottom to top; a transitional plate is connected between each two base plates; a transitional plate is also connected between each base plate and the corresponding connecting portion; each transitional plate is provided with a through hole which penetrates in the transitional plate; the heat dissipation copper foil comprises a plurality of copper foil sheets; and a corner of each copper foil sheet has an arc structure. By the top plates, a moisture permeation path is prolonged, and the moisture flowing difficulty is increased; by the through holes, the pins can be clamped tightly, the number of connecting surfaces between the base and each pin is reduced, a seam formed between the base and each pin is avoided, and moisture permeation is prevented; and by the arc structures, heat can be dissipated completely along sectors of the arc structures, the service life of an LED is prolonged, and the electrical and optical characteristics of the LED are improved.
Description
Technical field
The invention belongs to LED technology field, be specifically related to a kind of modified model LED support.
Background technology
LED support is LED lamp bead substrate before encapsulation, plays protection die bond line and the shaping effect of silica gel, turning circuit, and has influence on optical and electrical properties.The quality of supporting structure performance directly has influence on LED lamp bead performance, LED support of the prior art comprises pedestal and pin, the inside of pedestal is provided with containing cavity, pin one end is positioned at containing cavity and the other end is positioned at outside pedestal through pedestal, poor air-tightness between pin and pedestal, make that LED lamp bead is exposed directly or indirectly to be lighted in atmosphere, and in air, have steam, moisture is caused to infiltrate in lamp pearl, thus under the environment causing packaging plastic to light for a long time in LED lamp bead easily and pin depart from, make to connect the alloy wire of chip in LED lamp bead and pin to depart from and form circuit and disconnect, cause lamp desperate lamp.
In prior art, the radiating mode of LED support is for arrange Copper Foil therein, the heat produced when LED product being worked by Copper Foil is derived, and Copper Foil be generally all through cut after be arranged on base interior, the Copper Foil of this structure cuts position, rear turning and is wedge angle, heat during LED product work easily accumulates in the wedge angle position of Copper Foil and can not exhale, and causes dispelling the heat bad thus affecting useful life of LED product.
Therefore, a kind of both moistureproof and modified model LED support of good heat dissipation effect is needed badly.
Summary of the invention
In order to solve the problems of the technologies described above, the invention provides a kind of modified model LED support.
In order to achieve the above object, technical scheme of the present invention is as follows:
The invention provides a kind of modified model LED support, comprise pedestal and two pins, base interior is provided with accommodation space, the bottom of accommodation space is provided with heat radiation Copper Foil, pin comprises the top board and connecting portion that are connected, top board passes pedestal bottom and is arranged in accommodation space, connecting portion is arranged at outside pedestal, top board comprises from the bottom to top at least two substrates that bending successively connects, between substrate, rebound is connected between substrate and connecting portion, rebound is provided with the through hole penetrating cab apron at vertical direction, heat radiation Copper Foil is multiple copper foil and the turning of each copper foil is set to arc structure.
In the present invention, top board is the substrate of bending connection successively from the bottom to top, extends the approach that moisture infiltrates, and adds the flowing difficulty of moisture; Through hole makes pedestal be positioned at the compact siro spinning technology of two ends up and down of pin on the one hand, pincard is obtained tighter, prevents moisture from infiltrating, and decreases the joint face of pedestal and pin on the other hand, avoids between pedestal and pin and produce gap, prevent moisture from infiltrating further; The turning of copper foil is set to arc structure, the covering of the fan of heat along arc structure can be distributed completely, realize the heat radiation of LED, thus extends the useful life of LED, improves the optical and electrical properties of LED.
Through hole above-mentioned in the present invention cross section is in the horizontal direction circle, rectangle or triangle, and above-mentioned rebound is dull and stereotyped or arc, and the radius of above-mentioned arc structure is 0.5 ~ 1mm, specifically can arrange according to demand.
On the basis of technique scheme, also can do following improvement:
As preferred scheme, above-mentioned pedestal arranged outside has waterproof boss, and connecting portion is in the below of waterproof boss.
Adopt above-mentioned preferred scheme, waterproof boss can stop that steam enters the joint face of pedestal and pin along the outer wall of pedestal, improves the sealing property of LED support further, thus improves moisture effect.
As preferred scheme, the side of above-mentioned top board is set to arcuate structure or broached-tooth design.
Adopt above-mentioned preferred scheme, the side of top board is set to arcuate structure or broached-tooth design, adds the length of pin, further increases the difficulty that moisture infiltrates, thus improves moisture-proof characteristic.
As preferred scheme, the upper surface of above-mentioned heat radiation Copper Foil is provided with heat-conducting layer.
Adopt above-mentioned preferred scheme, heat-conducting layer is convenient to by the delivered heat of LED to heat radiation Copper Foil, further the heat dispersion of raising LED support.
As preferred scheme, the both sides of above-mentioned heat radiation Copper Foil are respectively arranged with two solder joints, be connected with the first alloy wire between two solder joints, the second alloy wire of LED both positive and negative polarity is connected with one of them solder joint of heat radiation Copper Foil both sides and is connected with the first alloy wire of this solder joint respectively.
Adopt above-mentioned preferred scheme, second alloy wire of LED both positive and negative polarity is connected with one of them solder joint of heat radiation Copper Foil both sides and is connected with the first alloy wire of this solder joint respectively, LED both positive and negative polarity the second alloy wire with heat radiation Copper Foil solder joint disconnect or loose contact time, second alloy wire of LED both positive and negative polarity is connected with heat radiation Copper Foil by the first alloy wire, ensure the heat dispersion of LED, also avoid the dead lamp of LED.
Accompanying drawing explanation
Fig. 1 is the structure cutaway view of one embodiment of the present invention.
Fig. 2 is the structure vertical view of one embodiment of the present invention.
Fig. 3 is the structure cutaway view of another embodiment of the present invention.
Wherein, 1. pedestal, 11. waterproof boss, 2 pins, 21. first substrates, 22. second substrates, 23. rebounds, 24. through holes, 3. dispel the heat Copper Foil, 31. arc structures.
Embodiment
The preferred embodiment of the present invention is described in detail below in conjunction with accompanying drawing.
In order to reach object of the present invention, as shown in Figure 1 to Figure 2, a kind of modified model LED support is provided in wherein a kind of execution mode of the present invention, comprise pedestal 1 and two pins 2, pedestal 1 inside is provided with accommodation space, the bottom of accommodation space is provided with heat radiation Copper Foil 3, pin 2 comprises the top board and connecting portion that are connected, top board passes pedestal 1 bottom and is arranged in accommodation space, connecting portion is arranged at outside pedestal 1, top board comprises from the bottom to top second substrate 22 and the first substrate 21 of the connection of bending successively, between second substrate 22 and first substrate 21, rebound 23 is connected between second substrate 22 and connecting portion, rebound 23 is provided with the through hole 24 penetrating cab apron at vertical direction, heat radiation Copper Foil 3 is copper foil and the turning of each copper foil is set to arc structure 31.
In present embodiment, top board is second substrate 22 and the first substrate 21 of bending connection successively from the bottom to top, extends the approach that moisture infiltrates, and adds the flowing difficulty of moisture; Through hole 24 1 aspect makes pedestal 1 be positioned at the compact siro spinning technology of two ends up and down of pin 2, make pin 2 block tighter, prevent moisture from infiltrating, decrease the joint face of pedestal 1 and pin 2 on the other hand, avoid between pedestal 1 and pin 2 and produce gap, prevent moisture from infiltrating further; The turning of copper foil is set to arc structure 31, the covering of the fan of heat along arc structure 31 can be distributed completely, realize the heat radiation of LED, thus extends the useful life of LED, improves the optical and electrical properties of LED.
Through hole 24 above-mentioned in present embodiment cross section is in the horizontal direction circle, rectangle or triangle, and in addition, above-mentioned rebound 23 is dull and stereotyped or arc, specifically can arrange according to demand; The radius of above-mentioned arc structure 31 is 0.5 ~ 1mm, the preferred 0.6mm of present embodiment.
As shown in Figure 3, in order to optimize implementation result of the present invention further, in another embodiment of the invention, on the basis of foregoing teachings, above-mentioned pedestal 1 arranged outside has waterproof boss 11, and connecting portion is in the below of waterproof boss 11.
Adopt above-mentioned preferred scheme, waterproof boss 11 can stop that steam enters pedestal 1 and the joint face of pin 2 along the outer wall of pedestal 1, improves the sealing property of LED support further, thus improves moisture effect.
In order to optimize implementation result of the present invention further, in another embodiment of the invention, on the basis of foregoing teachings, the side of above-mentioned top board is set to arcuate structure or broached-tooth design.
Adopt above-mentioned preferred scheme, the side of top board is set to arcuate structure or broached-tooth design, adds the length of pin 2, further increases the difficulty that moisture infiltrates, thus improves moisture-proof characteristic.
In order to optimize implementation result of the present invention further, in another embodiment of the invention, on the basis of foregoing teachings, the upper surface of above-mentioned heat radiation Copper Foil 3 is provided with heat-conducting layer.
Adopt above-mentioned preferred scheme, heat-conducting layer is convenient to by the delivered heat of LED to heat radiation Copper Foil 3, further the heat dispersion of raising LED support.
In order to optimize implementation result of the present invention further, in another embodiment of the invention, on the basis of foregoing teachings, the both sides of above-mentioned heat radiation Copper Foil 3 are respectively arranged with two solder joints, be connected with the first alloy wire between two solder joints, the second alloy wire of LED both positive and negative polarity is connected with one of them solder joint of heat radiation Copper Foil 3 both sides and is connected with the first alloy wire of this solder joint respectively.
Adopt above-mentioned preferred scheme, second alloy wire of LED both positive and negative polarity is connected with one of them solder joint of heat radiation Copper Foil 3 both sides and is connected with the first alloy wire of this solder joint respectively, LED both positive and negative polarity the second alloy wire with heat radiation Copper Foil 3 solder joint disconnect or loose contact time, second alloy wire of LED both positive and negative polarity is connected with heat radiation Copper Foil by the first alloy wire, ensure the heat dispersion of LED, also avoid the dead lamp of LED.
Above-described is only the preferred embodiment of the present invention, it should be pointed out that for the person of ordinary skill of the art, and without departing from the concept of the premise of the invention, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (8)
1. a modified model LED support, comprise pedestal and two pins, described base interior is provided with accommodation space, the bottom of described accommodation space is provided with heat radiation Copper Foil, described pin comprises the top board and connecting portion that are connected, described top board passes described pedestal bottom and is arranged in described accommodation space, described connecting portion is arranged at outside described pedestal, it is characterized in that, described top board comprises from the bottom to top at least two substrates that bending successively connects, between described substrate, rebound is connected between described substrate and described connecting portion, described rebound is provided with the through hole running through described rebound at vertical direction, described heat radiation Copper Foil is multiple copper foil and the turning of each copper foil is set to arc structure.
2. modified model LED support according to claim 1, is characterized in that, described through hole cross section is in the horizontal direction circle, rectangle or triangle.
3. modified model LED support according to claim 1, is characterized in that, described pedestal arranged outside has waterproof boss, and described connecting portion is in the below of described waterproof boss.
4. modified model LED support according to claim 1, is characterized in that, described rebound is dull and stereotyped or arc.
5. modified model LED support according to claim 1, is characterized in that, the side of described top board is set to arcuate structure or broached-tooth design.
6. modified model LED support according to claim 1, is characterized in that, the radius of described arc structure is 0.5 ~ 1mm.
7. modified model LED support according to claim 1, is characterized in that, the upper surface of described heat radiation Copper Foil is provided with heat-conducting layer.
8. modified model LED support according to claim 1, it is characterized in that, the both sides of described heat radiation Copper Foil are respectively arranged with two solder joints, be connected with the first alloy wire between described two solder joints, the second alloy wire of LED both positive and negative polarity is connected with one of them solder joint of described heat radiation Copper Foil both sides respectively and is connected with the first alloy wire of this solder joint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510165717.6A CN104795484A (en) | 2015-04-09 | 2015-04-09 | Improved LED (light emitting diode) support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510165717.6A CN104795484A (en) | 2015-04-09 | 2015-04-09 | Improved LED (light emitting diode) support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104795484A true CN104795484A (en) | 2015-07-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510165717.6A Pending CN104795484A (en) | 2015-04-09 | 2015-04-09 | Improved LED (light emitting diode) support |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110069104A (en) * | 2019-04-30 | 2019-07-30 | 努比亚技术有限公司 | A kind of flexible screen mould group and wearable device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201994339U (en) * | 2011-03-18 | 2011-09-28 | 广东宏磊达光电科技有限公司 | Light-emitting diode (LED) support |
| CN202633376U (en) * | 2012-03-02 | 2012-12-26 | 佛山市国星光电股份有限公司 | Mini-type LED device |
| US20130105851A1 (en) * | 2011-10-27 | 2013-05-02 | Seoul Semiconductor Co., Ltd. | Light emitting diode package and light emitting module comprising the same |
| CN104282674A (en) * | 2013-07-10 | 2015-01-14 | 日亚化学工业株式会社 | Light emitting device |
-
2015
- 2015-04-09 CN CN201510165717.6A patent/CN104795484A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201994339U (en) * | 2011-03-18 | 2011-09-28 | 广东宏磊达光电科技有限公司 | Light-emitting diode (LED) support |
| US20130105851A1 (en) * | 2011-10-27 | 2013-05-02 | Seoul Semiconductor Co., Ltd. | Light emitting diode package and light emitting module comprising the same |
| CN202633376U (en) * | 2012-03-02 | 2012-12-26 | 佛山市国星光电股份有限公司 | Mini-type LED device |
| CN104282674A (en) * | 2013-07-10 | 2015-01-14 | 日亚化学工业株式会社 | Light emitting device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110069104A (en) * | 2019-04-30 | 2019-07-30 | 努比亚技术有限公司 | A kind of flexible screen mould group and wearable device |
| CN110069104B (en) * | 2019-04-30 | 2022-06-17 | 努比亚技术有限公司 | Flexible screen module and wearing equipment |
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Effective date of registration: 20160405 Address after: Suzhou City, Jiangsu province 215024 gangtian road Suzhou Industrial Park No. 99 Building No. 9 Applicant after: Jointec Co., Ltd. Address before: Suzhou City, Jiangsu province 215024 gangtian road Suzhou Industrial Park No. 99 Building No. 9 Applicant before: Suzhou Jointec Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150722 |
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| RJ01 | Rejection of invention patent application after publication |