CN104795482B - A kind of preparation method of LED photonic crystal - Google Patents
A kind of preparation method of LED photonic crystal Download PDFInfo
- Publication number
- CN104795482B CN104795482B CN201510233631.2A CN201510233631A CN104795482B CN 104795482 B CN104795482 B CN 104795482B CN 201510233631 A CN201510233631 A CN 201510233631A CN 104795482 B CN104795482 B CN 104795482B
- Authority
- CN
- China
- Prior art keywords
- photonic crystal
- light
- light beam
- laser
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004038 photonic crystal Substances 0.000 title claims abstract description 51
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 230000001427 coherent effect Effects 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 15
- 230000010287 polarization Effects 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 6
- 239000010409 thin film Substances 0.000 claims abstract 5
- 239000011148 porous material Substances 0.000 claims abstract 2
- 238000012544 monitoring process Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 5
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 4
- 230000003287 optical effect Effects 0.000 description 6
- 238000010923 batch production Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 238000000025 interference lithography Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/833—Transparent materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/032—Manufacture or treatment of electrodes
Landscapes
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Polarising Elements (AREA)
- Microscoopes, Condenser (AREA)
Abstract
Description
技术领域technical field
本发明涉及光子晶体领域,更具体地,涉及一种LED光子晶体的制备方法。The invention relates to the field of photonic crystals, and more specifically, to a preparation method of LED photonic crystals.
背景技术Background technique
光子晶体是指具有光子带隙特性的人造周期性电介质结构,而光子晶体是提高GaN基蓝光LED光提取效率的重要方式之一。理论上,光子晶体提高LED光提取效率是利用与该LED输出光波长对应的光子晶体带隙结构,通过把受限于发光层内的导波模转换成为辐射模实现的。给定输出光波长的LED,在其表面制备具有特定的晶格类型和几何结构的光子晶体,一般要求该结构的光子晶体在该光波长(或频率)处具有光子带隙。现有制备光子晶体的方法大都采用电子束光刻、全息光刻等方法,从工艺角度看起来比较容易实现,但是对于可见光范围的LED,要使得中心波长的光子处于带隙内,光子晶体的周期要小到波长分数的尺度,一般为100多纳米,实现这种纳米尺度的加工设备复杂、工艺步骤较多,而且成本高、产出小,不便于批量化、规模化生产。Photonic crystals refer to artificial periodic dielectric structures with photonic band gap characteristics, and photonic crystals are one of the important ways to improve the light extraction efficiency of GaN-based blue LEDs. Theoretically, photonic crystals improve LED light extraction efficiency by utilizing the photonic crystal bandgap structure corresponding to the output light wavelength of the LED, and converting the guided wave mode confined in the light-emitting layer into a radiation mode. For an LED with a given output light wavelength, a photonic crystal with a specific lattice type and geometric structure is prepared on its surface. Generally, the photonic crystal with this structure is required to have a photonic band gap at the light wavelength (or frequency). Most of the existing methods for preparing photonic crystals use electron beam lithography, holographic lithography and other methods, which seem to be relatively easy to implement from the perspective of technology, but for LEDs in the visible light range, the photons of the central wavelength must be within the band gap. The period should be as small as the wavelength fraction, generally more than 100 nanometers. The processing equipment to realize this nanoscale is complex, with many process steps, high cost and small output, which is not convenient for batch and large-scale production.
发明内容Contents of the invention
本发明为解决现有技术中的制备光子晶体纳米加工技术难度大、工艺步骤复杂、成本高、不利于规模化生产的问题,提供了一种LED光子晶体的制备方法。The invention provides a method for preparing LED photonic crystals in order to solve the problems in the prior art that the nano-processing technology for preparing photonic crystals is difficult, the process steps are complicated, the cost is high, and it is not conducive to large-scale production.
本发明的技术方案是这样实现的:一种LED光子晶体的制备方法,所述方法包括采用Nd:YAG激光的三倍频激光束作为直接刻蚀激光,波长为λ,经分束镜分成三束相干激光,所述三束相干激光之间任意两束相干激光形成相同夹角θ,且所述三束相干激光均具有相同偏振方向,并同时汇聚在LED芯片的透明电极薄膜上;通过给予Nd:YAG激光器一个或者多个脉冲,最后形成了具有一定周期T和孔径大小的光子晶体。The technical solution of the present invention is realized in the following way: a preparation method of LED photonic crystal, said method comprises adopting the three-frequency laser beam of Nd:YAG laser as the direct etching laser, the wavelength is λ, and is divided into three parts by a beam splitter A coherent laser beam, any two coherent laser beams among the three coherent laser beams form the same angle θ, and the three coherent laser beams all have the same polarization direction, and converge on the transparent electrode film of the LED chip at the same time; by giving One or more pulses of Nd:YAG laser, and finally a photonic crystal with a certain period T and aperture size is formed.
进一步的,所述分束镜分成三束相干激光包括以下步骤:Further, the splitting of the beam splitter into three beams of coherent laser light includes the following steps:
a、所述三倍频激光束经过光阑后,经过第一分束镜分成第一光束和第二光束;a. After the frequency tripled laser beam passes through the diaphragm, it is divided into a first beam and a second beam by a first beam splitter;
b、所述第一光束经过第二分束镜分成第三光束和第四光束;所述第二光束经过第三分束镜分成第五光束和第六光束;b. The first light beam is divided into a third light beam and a fourth light beam through a second beam splitter; the second light beam is divided into a fifth light beam and a sixth light beam through a third beam splitter;
c、所述第三光束、第四光束以及第五光束均分别通过起偏镜、反射镜调制后同时汇聚所述LED芯片的透明电极薄膜上,即第三光束经过第一起偏镜后经第一反射镜反射形成第七束光,第四光束经第二反射镜反射后经第二起偏镜形成第八束光,以及第五光束经过第三起偏镜后经第三反射镜反射形成第九束光,最后所述第七束光、第八束光以及第九束光具有相同偏振方向和相同相位或者相位差为2π的整数倍,并同时汇聚所述LED芯片的透明电极薄膜上。c. The third light beam, the fourth light beam and the fifth light beam are respectively modulated by polarizers and mirrors and converged on the transparent electrode film of the LED chip at the same time, that is, the third light beam passes through the first polarizer and then passes through the second light beam. The seventh beam is reflected by a mirror, the fourth beam is reflected by the second mirror and then the eighth beam is formed by the second polarizer, and the fifth beam is formed by the third polarizer and then reflected by the third mirror The ninth light, finally the seventh light, the eighth light and the ninth light have the same polarization direction and the same phase or the phase difference is an integer multiple of 2π, and converge on the transparent electrode film of the LED chip at the same time .
进一步的,所述第六光束直接输入至光功率计,用于检测和监控Nd:YAG激光的功率。Further, the sixth light beam is directly input to an optical power meter for detecting and monitoring the power of the Nd:YAG laser.
进一步的,所述夹角与光子晶体周期T之间的关系为 Further, the relationship between the included angle and the period T of the photonic crystal is
进一步的,所述夹角θ的范围为10°~40°。Further, the included angle θ ranges from 10° to 40°.
进一步的,给予所述Nd:YAG激光器的脉冲数量越多,所述形成的光子晶体的孔径越大。Further, the more pulses given to the Nd:YAG laser, the larger the aperture of the formed photonic crystal.
进一步的,所述第七光束、第八光束以及第九光束三者形成的三维锥角的角平分线方向与所述LED芯片的透明电极薄膜表面的法线方向一致。Further, the direction of the bisector of the three-dimensional cone angle formed by the seventh light beam, the eighth light beam and the ninth light beam is consistent with the normal direction of the surface of the transparent electrode film of the LED chip.
本发明相对于现有技术,具有以下有益效果:Compared with the prior art, the present invention has the following beneficial effects:
(1)本发明工艺可以一次完成在芯片表面制备光子晶体,工艺简单、方便快捷,无需掩没、后处理等步骤;(1) The process of the present invention can complete the preparation of photonic crystals on the surface of the chip at one time, and the process is simple, convenient and quick, and does not require steps such as masking and post-processing;
(2)本发明所制备的光子晶体周期可控,通过改变夹角θ的范围即可得到周期为300nm-数μm的光子晶体,与无光子晶体的LED芯片相比,有光子晶体的LED芯片发光功率提高了50-110%;(2) The period of the photonic crystal prepared by the present invention is controllable, and a photonic crystal with a period of 300nm-several μm can be obtained by changing the range of the included angle θ. Compared with an LED chip without a photonic crystal, an LED chip with a photonic crystal Luminous power increased by 50-110%;
(3)本发明工艺的加工面积大、加工低成本,适用于批量化、规模化生产。(3) The process of the present invention has large processing area and low processing cost, and is suitable for batch and large-scale production.
附图说明Description of drawings
图1是本发明方法制备LED光子晶体的光路示意图。Fig. 1 is a schematic diagram of the optical path for preparing LED photonic crystals by the method of the present invention.
其中,G、光阑,F1、第一分束镜,F2、第二分束镜,F3、第三分束镜,B1、第一起偏镜,B2、第二起偏镜,B3、第三起偏镜,S1、第一反射镜,S2、第二反射镜,S3、第三反射镜L、光功率计。Among them, G, aperture, F1, the first beam splitter, F2, the second beam splitter, F3, the third beam splitter, B1, the first polarizer, B2, the second polarizer, B3, the third Polarizer, S1, first reflector, S2, second reflector, S3, third reflector L, optical power meter.
具体实施方式detailed description
下面结合实施例及附图,对本发明作进一步地详细说明,但本发明的实施方式不限于此。The present invention will be described in further detail below in conjunction with the embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.
实施例1Example 1
如图1所示,采用Nd:YAG激光的三倍频激光束(355nm)作为直接刻蚀激光,在GaN芯片上,在ITO层上制备了三角晶格的不同周期、不同深度的光子晶体,所述三倍频激光束经过光阑G后,经过第一分束镜F1分成第一光束和第二光束;所述第一光束经过第二分束镜F2分成第三光束和第四光束;所述第二光束经过第三分束镜F3分成第五光束和第六光束;所述第六光束直接输入至光功率计L,用于检测和监控Nd:YAG激光的功率。所述第三光束、第四光束以及第五光束均分别通过起偏镜、反射镜调制后同时汇聚所述LED芯片的透明电极薄膜上,即第三光束经过第一起偏镜B1后经第一反射镜S1反射形成第七束光,第四光束经第二反射镜S2反射后经第二起偏镜B2形成第八束光,以及第五光束经过第三起偏镜B3后经第三反射镜S3反射形成第九束光,最后所述第七束光、第八束光以及第九束光具有相同偏振方向和相同相位或者相位差为2π的整数倍,并同时汇聚在所述LED芯片的透明电极薄膜上,这三束光形成的三维锥角的角平分线方向与所述LED芯片的透明电极薄膜表面的法线方向一致。三束相干激光之间任意两束相干激光形成相同夹角θ,所述夹角范围为10°-40°,夹角与光子晶体周期T之间的关系为夹角θ越大,光子晶体周期越小,给予Nd:YAG激光器的脉冲数量越多,形成的光子晶体的孔径越大。当夹角θ=23.68°时,T=0.51μm,将有光子晶体和无光子晶体的LED芯片进行测试,在阈值电压2.4V以上,在2.8-4.0V电压范围内,本实施例的LED发光功率提高了90%。As shown in Figure 1, the three-frequency laser beam (355nm) of Nd:YAG laser is used as the direct etching laser. On the GaN chip, photonic crystals with different periods and different depths of the triangular lattice are prepared on the ITO layer. After the frequency tripled laser beam passes through the diaphragm G, it is divided into a first beam and a second beam through the first beam splitter F1; the first beam is divided into a third beam and a fourth beam through the second beam splitter F2; The second beam is divided into a fifth beam and a sixth beam by the third beam splitter F3; the sixth beam is directly input to the optical power meter L for detecting and monitoring the power of the Nd:YAG laser. The third light beam, the fourth light beam and the fifth light beam are respectively modulated by polarizers and reflectors and converged on the transparent electrode film of the LED chip at the same time, that is, the third light beam passes through the first polarizer B1 and then passes through the first polarizer B1. The seventh beam is reflected by the mirror S1, the fourth beam is reflected by the second mirror S2 and then passed through the second polarizer B2 to form the eighth beam, and the fifth beam is reflected by the third beam after passing through the third polarizer B3 The mirror S3 reflects to form the ninth light beam, and finally the seventh light beam, the eighth light beam and the ninth light beam have the same polarization direction and the same phase or the phase difference is an integer multiple of 2π, and are converged on the LED chip at the same time On the transparent electrode film, the direction of the bisector of the three-dimensional cone angle formed by the three beams of light is consistent with the normal direction of the surface of the transparent electrode film of the LED chip. Any two coherent laser beams among the three coherent laser beams form the same angle θ, the angle range is 10°-40°, and the relationship between the angle and the period T of the photonic crystal is: The larger the angle θ is, the smaller the period of the photonic crystal is, the more pulses are given to the Nd:YAG laser, and the larger the aperture of the formed photonic crystal is. When the included angle θ=23.68°, T=0.51 μm, the LED chips with photonic crystal and without photonic crystal are tested, and the LED of this embodiment emits light when the threshold voltage is above 2.4V and within the voltage range of 2.8-4.0V 90% more power.
实施例2Example 2
如图1所示,采用Nd:YAG激光的三倍频激光束作为直接刻蚀激光,在GaN芯片上,在ITO层上制备了三角晶格的不同周期、不同深度的光子晶体,所述三倍频激光束经过光阑G后,经过第一分束镜F1分成第一光束和第二光束;所述第一光束经过第二分束镜F2分成第三光束和第四光束;所述第二光束经过第三分束镜F3分成第五光束和第六光束;所述第六光束直接输入至光功率计L,用于检测和监控Nd:YAG激光的功率。所述第三光束、第四光束以及第五光束均分别通过起偏镜、反射镜调制后同时汇聚所述LED芯片的透明电极薄膜上,即第三光束经过第一起偏镜B1后经第一反射镜S1反射形成第七束光,第四光束经第二反射镜S2反射后经第二起偏镜B2形成第八束光,以及第五光束经过第三起偏镜B3后经第三反射镜S3反射形成第九束光,最后所述第七束光、第八束光以及第九束光具有相同偏振方向和相同相位或者相位差为2π的整数倍,并同时汇聚在所述LED芯片的透明电极薄膜上,这三束光形成的三维锥角的角平分线方向与所述LED芯片的透明电极薄膜表面的法线方向一致。三束相干激光之间任意两束相干激光形成相同夹角θ,所述夹角范围为10°-40°,当夹角优选为13.68°,夹角与光子晶体周期T之间的关系为T=867nm。给予Nd:YAG激光器的脉冲数量越多,所形成的光子晶体的孔径越大。将有光子晶体和无光子晶体的LED芯片进行测试,在阈值电压2.4V以上,在2.8-4.0V电压范围内,本实施例的LED发光功率提高了50%。实施例3As shown in Figure 1, the three-frequency laser beam of Nd:YAG laser is used as the direct etching laser. On the GaN chip, photonic crystals with different periods and different depths of the triangular lattice are prepared on the ITO layer. The three After the frequency-doubled laser beam passes through the diaphragm G, it is divided into a first beam and a second beam through the first beam splitter F1; the first beam is divided into a third beam and a fourth beam through the second beam splitter F2; The second beam is divided into a fifth beam and a sixth beam by the third beam splitter F3; the sixth beam is directly input to the optical power meter L for detecting and monitoring the power of the Nd:YAG laser. The third light beam, the fourth light beam and the fifth light beam are respectively modulated by polarizers and reflectors and converged on the transparent electrode film of the LED chip at the same time, that is, the third light beam passes through the first polarizer B1 and then passes through the first polarizer B1. The seventh beam is reflected by the mirror S1, the fourth beam is reflected by the second mirror S2 and then passed through the second polarizer B2 to form the eighth beam, and the fifth beam is reflected by the third beam after passing through the third polarizer B3 The mirror S3 reflects to form the ninth light beam, and finally the seventh light beam, the eighth light beam and the ninth light beam have the same polarization direction and the same phase or the phase difference is an integer multiple of 2π, and are converged on the LED chip at the same time On the transparent electrode film, the direction of the bisector of the three-dimensional cone angle formed by the three beams of light is consistent with the normal direction of the surface of the transparent electrode film of the LED chip. Any two coherent laser beams among the three coherent laser beams form the same angle θ, and the range of the included angle is 10°-40°. When the included angle is preferably 13.68°, the relationship between the included angle and the period T of the photonic crystal is: T = 867nm. The higher the number of pulses given to the Nd:YAG laser, the larger the aperture of the formed photonic crystal. The LED chips with and without photonic crystals were tested, and the luminous power of the LED in this embodiment increased by 50% when the threshold voltage was above 2.4V and within the voltage range of 2.8-4.0V. Example 3
如图1所示,采用Nd:YAG激光的三倍频激光束作为直接刻蚀激光,在GaN芯片上,在ITO层上制备了三角晶格的不同周期、不同深度的光子晶体,所述三倍频激光束经过光阑G后,经过第一分束镜F1分成第一光束和第二光束;所述第一光束经过第二分束镜F2分成第三光束和第四光束;所述第二光束经过第三分束镜F3分成第五光束和第六光束;所述第六光束直接输入至光功率计L,用于检测和监控Nd:YAG激光的功率。所述第三光束、第四光束以及第五光束均分别通过起偏镜、反射镜调制后同时汇聚所述LED芯片的透明电极薄膜上,即第三光束经过第一起偏镜B1后经第一反射镜S1反射形成第七束光,第四光束经第二反射镜S2反射后经第二起偏镜B2形成第八束光,以及第五光束经过第三起偏镜B3后经第三反射镜S3反射形成第九束光,最后所述第七束光、第八束光以及第九束光具有相同偏振方向和相同相位或者相位差为2π的整数倍,并同时汇聚在所述LED芯片的透明电极薄膜上,这三束光形成的三维锥角的角平分线方向与所述LED芯片的透明电极薄膜表面的法线方向一致。三束相干激光之间任意两束相干激光形成相同夹角θ,所述夹角范围为10°-40°,当夹角优选为26.68°,夹角与光子晶体周期T之间的关系为光子晶体周期为456nm。给予Nd:YAG激光器的脉冲数量越多,所形成的光子晶体的孔径越大。将有光子晶体和无光子晶体的LED芯片进行测试,在阈值电压2.4V以上,在2.8-4.0V电压范围内,本实施例的LED发光功率提高了110%。As shown in Figure 1, the three-frequency laser beam of Nd:YAG laser is used as the direct etching laser. On the GaN chip, photonic crystals with different periods and different depths of the triangular lattice are prepared on the ITO layer. The three After the frequency-doubled laser beam passes through the diaphragm G, it is divided into a first beam and a second beam through the first beam splitter F1; the first beam is divided into a third beam and a fourth beam through the second beam splitter F2; The second beam is divided into a fifth beam and a sixth beam by the third beam splitter F3; the sixth beam is directly input to the optical power meter L for detecting and monitoring the power of the Nd:YAG laser. The third light beam, the fourth light beam and the fifth light beam are respectively modulated by polarizers and reflectors and converged on the transparent electrode film of the LED chip at the same time, that is, the third light beam passes through the first polarizer B1 and then passes through the first polarizer B1. The seventh beam is reflected by the mirror S1, the fourth beam is reflected by the second mirror S2 and then passed through the second polarizer B2 to form the eighth beam, and the fifth beam is reflected by the third beam after passing through the third polarizer B3 The mirror S3 reflects to form the ninth light beam, and finally the seventh light beam, the eighth light beam and the ninth light beam have the same polarization direction and the same phase or the phase difference is an integer multiple of 2π, and are converged on the LED chip at the same time On the transparent electrode film, the direction of the bisector of the three-dimensional cone angle formed by the three beams of light is consistent with the normal direction of the surface of the transparent electrode film of the LED chip. Any two coherent laser beams form the same angle θ between the three coherent laser beams, and the range of the included angle is 10°-40°. When the included angle is preferably 26.68°, the relationship between the included angle and the period T of the photonic crystal is: The photonic crystal period is 456nm. The higher the number of pulses given to the Nd:YAG laser, the larger the aperture of the formed photonic crystal. The LED chips with and without photonic crystals were tested, and the luminous power of the LED in this embodiment increased by 110% when the threshold voltage was above 2.4V and within the voltage range of 2.8-4.0V.
上述实施例为本发明较佳的实施方式,但本发明的实施方式并不受上述实施例的限制,其他的任何未违背本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化,均应为等效的置换方式,都包含在本发明的保护范围之内。The above-mentioned embodiment is a preferred embodiment of the present invention, but the embodiment of the present invention is not limited by the above-mentioned embodiment, and any other changes, modifications, substitutions, combinations, Simplifications should be equivalent replacement methods, and all are included in the protection scope of the present invention.
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510233631.2A CN104795482B (en) | 2015-05-08 | 2015-05-08 | A kind of preparation method of LED photonic crystal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510233631.2A CN104795482B (en) | 2015-05-08 | 2015-05-08 | A kind of preparation method of LED photonic crystal |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104795482A CN104795482A (en) | 2015-07-22 |
CN104795482B true CN104795482B (en) | 2017-10-03 |
Family
ID=53560155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510233631.2A Expired - Fee Related CN104795482B (en) | 2015-05-08 | 2015-05-08 | A kind of preparation method of LED photonic crystal |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104795482B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105403935A (en) * | 2015-12-02 | 2016-03-16 | 山东建筑大学 | Preparation method of white-light three-dimensional photonic crystal and apparatus thereof |
CN110814515B (en) * | 2019-11-15 | 2021-08-17 | 中南大学 | A kind of hollow microstructure of LED and its manufacturing method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1595232A (en) * | 2004-06-22 | 2005-03-16 | 天津大学 | A method and apparatus for producing three-dimensional photon crystal structure |
CN1796039A (en) * | 2004-12-29 | 2006-07-05 | 中国科学院理化技术研究所 | Method and system for making multiple period microstructure in photosensitive material by laser |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050124712A1 (en) * | 2003-12-05 | 2005-06-09 | 3M Innovative Properties Company | Process for producing photonic crystals |
-
2015
- 2015-05-08 CN CN201510233631.2A patent/CN104795482B/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1595232A (en) * | 2004-06-22 | 2005-03-16 | 天津大学 | A method and apparatus for producing three-dimensional photon crystal structure |
CN1796039A (en) * | 2004-12-29 | 2006-07-05 | 中国科学院理化技术研究所 | Method and system for making multiple period microstructure in photosensitive material by laser |
Also Published As
Publication number | Publication date |
---|---|
CN104795482A (en) | 2015-07-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102540476B (en) | A method and device for generating a three-dimensional hollow spot | |
CN105444896B (en) | Vortex beams topological charge value measurement method based on Magen David diffraction by aperture | |
CN108061975A (en) | A kind of method and device for efficiently generating arbitrary vectorial field | |
CN102289080A (en) | Method and device for generating radial polarization beam | |
CN106695116B (en) | A kind of optics module and laser cutting device | |
CN104795482B (en) | A kind of preparation method of LED photonic crystal | |
CN106842605A (en) | Light-dividing device based on polarization spectroscope | |
CN102707542B (en) | Method for regulating best matching state of type-II KDP (Potassium Dihydrogen Phosphate) crystal for frequency multiplication of infrared light | |
CN103217803A (en) | Polarization coupling device for semi-conductor laser device adopting prism | |
CN101726868A (en) | Method and device for multiplexing and encoding orbital angular momentum states of light beams | |
CN105988261B (en) | A kind of vortex light field generation device | |
CN107065213A (en) | A kind of method and device that non-uniform polarisation light beam is produced based on single Amici prism | |
CN206671690U (en) | Light-dividing device based on polarization spectroscope | |
CN102289081B (en) | Method and device for generating azimuthally polarized beam | |
CN105572779B (en) | A kind of angular polarization light generating device and method | |
CN205070153U (en) | Ultra wide band is tunable and optical parametric amplification ware of multiband output | |
CN203573545U (en) | Novel laser lissajous-figure observer | |
Li et al. | Optimizing the design of highly linearly polarized white LED with multilayer metal-dielectric grating structure | |
CN107402454B (en) | Device for realizing radial variation nonlinear ellipsometry rotation based on ellipsometry vector light field | |
CN102013627B (en) | Linearly polarized chirped ultrashort laser pulse production technique and compensation technique | |
CN104536252A (en) | Projection screen based on nonlinear luminescent material and projection system | |
CN104297939B (en) | A kind of for selecting the laser tail mirror assembly angularly polarized | |
CN102082394B (en) | High-power semiconductor laser polarization coupling device and coupling method thereof | |
CN202649606U (en) | Improved polarized light recycling structure | |
CN102411161B (en) | Wire polarizer |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
EXSB | Decision made by sipo to initiate substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171003 Termination date: 20200508 |
|
CF01 | Termination of patent right due to non-payment of annual fee |