CN104782605A - Dispensing method used for encapsulating stay wires inside grain depot - Google Patents

Dispensing method used for encapsulating stay wires inside grain depot Download PDF

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Publication number
CN104782605A
CN104782605A CN201510177136.4A CN201510177136A CN104782605A CN 104782605 A CN104782605 A CN 104782605A CN 201510177136 A CN201510177136 A CN 201510177136A CN 104782605 A CN104782605 A CN 104782605A
Authority
CN
China
Prior art keywords
grain depot
encapsulating
stay wires
holes
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510177136.4A
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Chinese (zh)
Inventor
覃义强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201510177136.4A priority Critical patent/CN104782605A/en
Publication of CN104782605A publication Critical patent/CN104782605A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a dispensing method used for encapsulating stay wires inside a grain depot. The method comprises the steps that holing holes evenly formed in a thin film of the grain depot are encapsulated; the stay wires are arranged in the holing holes; medicine bags are tied on the stay wires; the medicine bags are arranged on preset positions through the stay wires; the holes formed in the thin film are encapsulated. The purposes that manpower is saved and medicine residues are convenient to take out are achieved.

Description

For encapsulating the bracing wire medication in grain depot
Technical field
The present invention relates to grain storage and join field, particularly, relating to a kind of bracing wire medication for encapsulating in grain depot.
Background technology
Existing when encapsulating desinsection dispensing in grain depot, film medication is taken off in employing, and film medication is taken off in employing, need the whole film of encapsulation grain depot to open, then place medicine bag in precalculated position, and then film is built, need the manpower of at substantial, also there is the problem of the bad taking-up of the dregs of a decoction simultaneously, during because taking out the dregs of a decoction, also whole film will be opened, namely there is waste of manpower and the problem of the bad taking-up of the dregs of a decoction in existing film medication of taking off.
Summary of the invention
The object of the invention is to, for the problems referred to above, proposing a kind of bracing wire medication for encapsulating in grain depot, to realize saving manpower and to be convenient to take out dregs of a decoction advantage.
For achieving the above object, the technical solution used in the present invention is:
A kind ofly to comprise for the bracing wire medication encapsulated in grain depot:
For encapsulating the step that the film of grain depot evenly holes;
In the above-mentioned interior step of placing lead-in wire that holes;
Medicine bag is tied up the step on lead-in wire;
And
Medicine bag is put in by lead-in wire the position preset, and by the step of the hole sealing on film.
Technical scheme of the present invention has following beneficial effect:
Technical solution of the present invention, by holing on film, avoids the problem opened by whole film, get it filled simultaneously slag time, as long as line one is drawn at an inspection socket, the dregs of a decoction have all been drawn out.Reach and save manpower and the object of being convenient to take out the dregs of a decoction.
Embodiment
A kind ofly to comprise for the bracing wire medication encapsulated in grain depot:
For encapsulating the step that the film of grain depot evenly holes;
In the above-mentioned interior step of placing lead-in wire that holes;
Medicine bag is tied up the step on lead-in wire;
And
Medicine bag is put in by lead-in wire the position preset, and by the step of the hole sealing on film.
When holing, should rational deployment, make the number that holes minimum, to ensure the sealing of film, the diameter holed is 2.5cm.Spacing lead-in wire bundling medicine bag remains on 1m to 1.5cm and is advisable.Namely medicine bag spacing is 1m, 1.1m, 1.2m, 1.3m, 1.4m or 1.5m.
Last it is noted that the foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, although with reference to previous embodiment to invention has been detailed description, for a person skilled in the art, it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (1)

1., for encapsulating the bracing wire medication in grain depot, it is characterized in that, comprise:
For encapsulating the step that the film of grain depot evenly holes;
In the above-mentioned interior step of placing lead-in wire that holes;
Medicine bag is tied up the step on lead-in wire;
And
Medicine bag is put in by lead-in wire the position preset, and by the step of the hole sealing on film.
CN201510177136.4A 2015-04-15 2015-04-15 Dispensing method used for encapsulating stay wires inside grain depot Pending CN104782605A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510177136.4A CN104782605A (en) 2015-04-15 2015-04-15 Dispensing method used for encapsulating stay wires inside grain depot

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510177136.4A CN104782605A (en) 2015-04-15 2015-04-15 Dispensing method used for encapsulating stay wires inside grain depot

Publications (1)

Publication Number Publication Date
CN104782605A true CN104782605A (en) 2015-07-22

Family

ID=53548165

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510177136.4A Pending CN104782605A (en) 2015-04-15 2015-04-15 Dispensing method used for encapsulating stay wires inside grain depot

Country Status (1)

Country Link
CN (1) CN104782605A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4920692A (en) * 1986-08-06 1990-05-01 Sumitomo Chemical Company, Limited Mulching film for repelling insect pests
CN2100096U (en) * 1990-11-11 1992-04-01 杨世球 Apparatus for preventing and controlling pests for storing grain
CN2103525U (en) * 1991-10-15 1992-05-06 商业部四川粮食贮藏科学研究所 Packaging film for preventing insect
CN2448778Y (en) * 2000-11-13 2001-09-19 四川成都二仙桥国家粮食储备库 Inflated speration bag in passway of grain bin
CN201409323Y (en) * 2009-06-05 2010-02-24 王岩 Insect-proofing string

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4920692A (en) * 1986-08-06 1990-05-01 Sumitomo Chemical Company, Limited Mulching film for repelling insect pests
CN2100096U (en) * 1990-11-11 1992-04-01 杨世球 Apparatus for preventing and controlling pests for storing grain
CN2103525U (en) * 1991-10-15 1992-05-06 商业部四川粮食贮藏科学研究所 Packaging film for preventing insect
CN2448778Y (en) * 2000-11-13 2001-09-19 四川成都二仙桥国家粮食储备库 Inflated speration bag in passway of grain bin
CN201409323Y (en) * 2009-06-05 2010-02-24 王岩 Insect-proofing string

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
张劲松: "膜下环流熏蒸系统与综合熏蒸技术", 《四川粮油科技》 *

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Legal Events

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C06 Publication
PB01 Publication
EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150722

WD01 Invention patent application deemed withdrawn after publication