CN104779249B - The structure and preparation method of a kind of strain film - Google Patents
The structure and preparation method of a kind of strain film Download PDFInfo
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- CN104779249B CN104779249B CN201510154605.0A CN201510154605A CN104779249B CN 104779249 B CN104779249 B CN 104779249B CN 201510154605 A CN201510154605 A CN 201510154605A CN 104779249 B CN104779249 B CN 104779249B
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Abstract
The present invention relates to underground pipeline survey technical field, more particularly to the structure and preparation method of strain film, the structure includes silicon base, formed with raceway groove in the silicon base, a plurality of piezo-resistances are covered with the raceway groove, a plurality of piezo-resistances are divided into two rows arrangement, and form Wheatstone bridge bridge arm, a plurality of piezo-resistances seal the raceway groove, form vacuum channel, the part that a plurality of piezo-resistances correspond to the vacuum channel is area of stress concentration, source region is also formed with the silicon base, drain region and drift region, the raceway groove is arranged between source region and drift region, and isolated between raceway groove and source region and drift region by protective layer.Method prepares the strain film of said structure.Strain film high sensitivity.
Description
Technical field
The present invention relates to underground pipeline survey technical field, more particularly to it is a kind of based on the structure of strain film and preparation side
Method.
Background technology
With the development of urban construction, the scale and species of underground utilities distribution increasingly increase severely.Underground utilities include cable,
Heat supply pipeline, water supply line, gas pipeline etc., because it is to be embedded in underground, once occur rupture etc. can not at once and
Shi Dingwei, the maintenance to administrative staff are made troubles.More serious danger is caused after can not more even positioning at once, causes people
The loss of member's property.Buried pipe line length occupy dark unglazed underground, even if it is according to sensor pair mostly that leakage etc., which occurs, in it
The leakage scale of construction measures to sense, and the consideration in cost, the setting of sensor be it is spaced apart, can not
Spread all over whole pipeline, it senses speed and inductive effects substantially reduce, and crack tiny on some pipelines can not just be felt in time
Situations such as should arriving, and needing leakage, is possible to sense after occurring, and often tiny crack repairing is easily simple, and once
After causing leakage, then the heavy losses of property are very likely resulted in, or even caused casualties.Therefore, how to be accurately positioned ground
The small fault position of underground pipelines, and the feedback that is accurately out of order, line losses are just avoided in time in the flaw stage, maximized
Reduce property and personal casualty loss in ground.
The content of the invention
Solve above-mentioned technical problem, the invention provides a kind of earth mat test pipeline system based on Big Dipper positioning, coordinate
It is sticked in the strain film of pipe surface, and designs an equivalent circuit, change of the detection strain film to circuitous resistance, so as to examine
The position of trouble point is measured, in time timely and accurately positions most small loss, provides for pipe-line maintenance and most timely detects
Positioning function.
, should by being sticked in pipe surface present invention also offers a kind of earth mat test pipeline method based on Big Dipper positioning
Variation film, and coordinate related circuit to sense the crack on pipeline and miniature deformation, split so as to be accurately positioned pipe surface
Seam and miniature deformation, maximized time guarantee is provided to pipe-line maintenance, and greatly reduce pipe-line maintenance cost.
In order to achieve the above object, the technical solution adopted in the present invention is a kind of earth mat pipeline based on Big Dipper positioning
Test system, including be sticked in the strain film of pipeline appearance, and the waterproofing membrane of strain film appearance is arranged on, it is described to answer
Variation film is N number of ring-type strain film, wherein N >=2, and each ring-type strain film is close to be located at pipeline circumference ring outer wall, adjacent
There is dielectric film isolation, in addition to rectification circuit, filter circuit, A/D change-over circuits, master control electricity between two ring-type strain films
Road and Big Dipper locating module, strain film group is turned into by wired in series or parallel connection per between n ring-type strain film, wherein 1
≤ n≤N, strain film group are electrically connected with successively with rectification circuit, filter circuit, A/D change-over circuits and governor circuit, the north
The locating module that struggles against is electrically connected with governor circuit, and Big Dipper locating module passes through in cordless communication network and background data base and monitoring
The heart communicates.
Further, the rectification circuit is bridge rectifier, and it is sequentially end-to-end structure by resistance R1, R2, R3, R4
Into wherein resistance R1 and resistance R2 common connection end is a ends, and resistance R1 and resistance R3 common connection end is b ends, resistance R3
Common connection end with resistance R2 is c ends, and resistance R2 and resistance R4 common connection end are d ends, and a ends connect alternating current with c ends
Source UI, b ends and d ends are voltage output end UOAnd it is connected with filter circuit input, filter circuit output end and A/D change-over circuits
Input is connected, and A/D change-over circuit output ends are connected with governor circuit.
Further, in addition to power circuit, the power circuit input connect AC power UI, the power circuit
Output dc source is respectively filter circuit, A/D change-over circuits and governor circuit and the power supply of Big Dipper locating module.
A kind of earth mat test pipeline method based on Big Dipper positioning, comprises the following steps：
Uniformly it is sticked N number of ring-type strain film, wherein N >=2, and the Surface Mount outside each ring-type strain film in pipeline appearance
If waterproofing membrane,
And set dielectric film to isolate between two neighboring ring-type strain film,
Strain film group is turned into by wired in series or parallel connection per between n ring-type strain film, wherein 1≤n≤N,
N rectification circuit, filter circuit, A/D change-over circuits, governor circuit and the Big Dipper locating modules sequentially connected are set
Form computing circuit,
And each strain film group is connected with each computing circuit, all computing circuits by cordless communication network with
Background data base and Surveillance center's communication.
The structure of strain film includes silicon base, and formed with raceway groove in the silicon base, plural number is covered with the raceway groove
Individual piezo-resistance, a plurality of piezo-resistances are divided into two rows arrangement, and form Wheatstone bridge bridge arm, a plurality of piezo-resistances
The raceway groove is sealed, forms vacuum channel, the part that a plurality of piezo-resistances correspond to the vacuum channel is stress
Concentration zones, source region, drain region and drift region are also formed with the silicon base, the raceway groove is arranged between source region and drift region,
And isolated between raceway groove and source region and drift region by protective layer.
The preparation method of strain film is as follows：
A, raceway groove is formed on a silicon substrate, and a plurality of piezo-resistances are covered on the raceway groove,
B, a plurality of piezo-resistances are divided into two rows arrangement, and form Wheatstone bridge bridge arm,
C, a plurality of piezo-resistances seal the raceway groove, form vacuum channel,
D, the part that a plurality of piezo-resistances correspond to the vacuum channel is area of stress concentration,
F, drain region is formed on a silicon substrate,
G, raceway groove both sides form source region and drift region on a silicon substrate, and protection is set between raceway groove and source region and drift region
Layer isolation.
The size of the strain film is width：The distance between 1-10cm, adjacent two strain film is 10-20cm.
The present invention compared with prior art, has the following advantages that by using above-mentioned technical proposal：
The earth mat test pipeline system based on Big Dipper positioning of the present invention, coordinates the strain film being sticked in pipe surface,
And an equivalent circuit is designed, change of the detection strain film to circuitous resistance, in time will most so as to detect the position of trouble point
Small loss timely and accurately positions, and is provided for pipe-line maintenance and most timely detects positioning function.
A kind of earth mat test pipeline method based on Big Dipper positioning of the present invention, should be thinning by being sticked in pipe surface
Film, and coordinate related circuit to sense the crack on pipeline and miniature deformation, so as to be accurately positioned pipe surface crack and
Miniature deformation, maximized time guarantee is provided to pipe-line maintenance, and greatly reduce pipe-line maintenance cost.
The strain film high sensitivity of the present invention.
Brief description of the drawings
Fig. 1 is the structural representation of embodiments of the invention 1.
Fig. 2 is Fig. 1 A portions enlarged diagram.
Fig. 3 is the circuit equivalent schematic diagram of embodiments of the invention 1.
Fig. 4 is the structural representation of embodiments of the invention 2.
Embodiment
In conjunction with the drawings and specific embodiments, the present invention is further described.
As a specific embodiment, as shown in Figure 1 to Figure 3, a kind of ground webmaster based on Big Dipper positioning of the invention
Line test system, including be sticked in the strain film of the appearance of pipeline 1, and it is arranged on the waterproofing membrane 3 of strain film appearance, institute
It is N number of ring-type strain film 2 to state strain film, i.e. waterproofing membrane 3 could be arranged to N number of, and being separately positioned on N number of ring-type should be thinning
The surface of film 2, can also set one, be coated on all surfaces of ring-type strain film 2, wherein N >=2, and N is positive integer.It is each
Ring-type strain film 2 is close to be located at pipeline circumference ring outer wall, between two neighboring ring-type strain film 2 there is dielectric film 4 to isolate,
Also include rectification circuit 5, filter circuit 6, A/D change-over circuits 7, governor circuit 8 and Big Dipper locating module 9, strained per n ring-type
Strain film group B is turned into by the series connection of wire 10 between film 2, wherein 1≤n≤N, n takes 16 in the present embodiment.Strain film group
Be electrically connected with successively with rectification circuit 5, filter circuit 6, A/D change-over circuits 7 and governor circuit 8, the Big Dipper locating module 9 with
Governor circuit 8 is electrically connected with, and Big Dipper locating module 9 is communicated by cordless communication network with background data base and Surveillance center.Institute
Stating governor circuit 8 includes dsp chip and its auxiliary circuit.
With specific reference to shown in Fig. 3, the rectification circuit 5 is bridge rectifier, and it is by resistance R1, R2, R3, R4 sequentially head
Tail connects and composes, and wherein resistance R1 and resistance R2 common connection end is a ends, and resistance R1 and resistance R3 common connection end are b
End, resistance R3 and resistance R2 common connection end be c ends, and resistance R2 and resistance R4 common connection end are d ends, a ends and c ends company
Meet AC power UI, b ends and d ends are voltage output end UOAnd it is connected with filter circuit input, filter circuit output end and A/D
The input of change-over circuit 7 is connected, and the output end of A/D change-over circuits 7 is connected with governor circuit 8.
Also include power circuit 11, the power circuit input connection AC power UI, the power circuit output is directly
It is respectively that filter circuit, A/D change-over circuits 7 and governor circuit 8 and Big Dipper locating module 9 are powered to flow power supply.
Strain film group B equivalent resistance is Ri, and the equivalent circuit accesses the b ends of rectification circuit 5, when pipeline 1 occurs to break
Split or during miniature deformation, miniature deformation or fracture etc. occur for corresponding ring-type strain film 2 so that strain film group B etc.
Effect resistance Ri changes, and now after the rectified circuit 5 of the resistance, filter circuit 6, A/D change-over circuits 7, sends to master control electricity
Road 8, monitored by corresponding resistance, then the equivalent resistance that can obtain which strain film group B is changed, and is tied calculating
Fruit is sent to background data base and Surveillance center by Big Dipper locating module 9 and communicated, convenient maintenance positioning.
In the present embodiment, the structure of the strain film includes silicon base, formed with raceway groove, the ditch in the silicon base
A plurality of piezo-resistances are covered with road, a plurality of piezo-resistances are divided into two rows arrangement, and form Wheatstone bridge bridge arm, described
A plurality of piezo-resistances seal the raceway groove, form vacuum channel, and a plurality of piezo-resistances correspond to the vacuum ditch
The part in road is area of stress concentration, and source region, drain region and drift region are also formed with the silicon base, and the raceway groove is arranged on source region
Between drift region, and isolated between raceway groove and source region and drift region by protective layer.
The preparation method of strain film is as follows：
A, raceway groove is formed on a silicon substrate, and a plurality of piezo-resistances are covered on the raceway groove,
B, a plurality of piezo-resistances are divided into two rows arrangement, and form Wheatstone bridge bridge arm,
C, a plurality of piezo-resistances seal the raceway groove, form vacuum channel,
D, the part that a plurality of piezo-resistances correspond to the vacuum channel is area of stress concentration,
F, drain region is formed on a silicon substrate,
G, raceway groove both sides form source region and drift region on a silicon substrate, and protection is set between raceway groove and source region and drift region
Layer isolation.
The size of the strain film is width：The distance between 1-10cm, adjacent two strain film is 10-20cm.
The present embodiment additionally provides a kind of earth mat test pipeline method based on Big Dipper positioning, comprises the following steps：
Uniformly it is sticked N number of ring-type strain film 2, wherein N >=2 in the appearance of pipeline 1, and outside each ring-type strain film 2
Surface Mount sets waterproofing membrane 3,
And set dielectric film 4 to isolate between two neighboring ring-type strain film 2,
Strain film group is turned into by wired in series per between n ring-type strain film 2, wherein 1≤n≤N,
The n rectification circuits sequentially connected, filter circuit 6, A/D change-over circuits 7, governor circuit 8 and Big Dipper positioning are set
Module 9 forms computing circuit,
And each strain film group is connected with each computing circuit, all computing circuits by cordless communication network with
Background data base and Surveillance center's communication.
Embodiment 2：
With reference to shown in figure 4, the present embodiment is substantially the same manner as Example 1, and difference is every n ring-type strain film 2
Between by the way that wire 10 is in parallel turn into strain film group B.Its equivalent circuit is also consistent with the equivalent circuit of embodiment 1.Should be thinning
Film group B equivalent resistance is Ri, and the equivalent circuit accesses the b ends of rectification circuit 5, when fracture or miniature deformation occur for pipeline 1,
Miniature deformation or fracture etc. occur for corresponding ring-type strain film 2 so that strain film group B equivalent resistance Ri changes
Become, now after the rectified circuit 5 of the resistance, filter circuit 6, A/D change-over circuits 7, send to governor circuit 8, by corresponding
Resistance is monitored, then the equivalent resistance that can obtain which strain film group B is changed, and result of calculation is positioned by the Big Dipper
Module 9 is sent to background data base and Surveillance center's communication, convenient maintenance positioning.
Although specifically showing and describing the present invention with reference to preferred embodiment, those skilled in the art should be bright
In vain, do not departing from the spirit and scope of the present invention that appended claims are limited, in the form and details can be right
The present invention makes a variety of changes, and is protection scope of the present invention.
Claims (3)
1. a kind of structure of strain film, the strain film note is located at the pipeline appearance of earth mat test pipeline system, the earth mat
Test pipeline system also includes rectification circuit, filter circuit, A/D change-over circuits, governor circuit and Big Dipper locating module, and n should
Strain film group is turned into by wired in series between variation film, wherein 1≤n≤N, N >=2, and N are positive integer, strain film group
It is electrically connected with successively with rectification circuit, filter circuit, A/D change-over circuits and governor circuit, the Big Dipper locating module and master control
Circuit is electrically connected with, and Big Dipper locating module is communicated by cordless communication network with background data base and Surveillance center, the master control
Circuit includes dsp chip and its auxiliary circuit, it is characterised in that：The structure of the strain film includes silicon base, the silicon base
On formed with raceway groove, a plurality of piezo-resistances are covered with the raceway groove, a plurality of piezo-resistances are divided into two rows arrangement, and are formed
Wheatstone bridge bridge arm, a plurality of piezo-resistances seal the raceway groove, form vacuum channel, a plurality of pressure-sensitive electricity
Resistance is area of stress concentration corresponding to the part of the vacuum channel, and source region, drain region and drift region are also formed with the silicon base,
The raceway groove is arranged between source region and drift region, and is isolated between raceway groove and source region and drift region by protective layer.
A kind of 2. structure of strain film according to claim 1, it is characterised in that：The size of the strain film is width
Degree：The distance between 1-10cm, adjacent two strain film is 10-20cm.
A kind of 3. preparation method for the structure for manufacturing strain film as claimed in claim 1, it is characterised in that including：
A, raceway groove is formed on a silicon substrate, and a plurality of piezo-resistances are covered on the raceway groove,
B, a plurality of piezo-resistances are divided into two rows arrangement, and form Wheatstone bridge bridge arm,
C, a plurality of piezo-resistances seal the raceway groove, form vacuum channel,
D, the part that a plurality of piezo-resistances correspond to the vacuum channel is area of stress concentration,
F, drain region is formed on a silicon substrate,
G, raceway groove both sides form source region and drift region on a silicon substrate, and set between raceway groove and source region and drift region protective layer every
From.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510154605.0A CN104779249B (en) | 2015-04-03 | 2015-04-03 | The structure and preparation method of a kind of strain film |
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| CN201510154605.0A CN104779249B (en) | 2015-04-03 | 2015-04-03 | The structure and preparation method of a kind of strain film |
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| CN104779249B true CN104779249B (en) | 2018-01-02 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1755946A (en) * | 2005-11-01 | 2006-04-05 | 清华大学 | Stress sensor chip based on SOI |
| CN101241030A (en) * | 2008-03-10 | 2008-08-13 | 清华大学 | MOS force sensitive sensor |
| CN102491256A (en) * | 2011-12-27 | 2012-06-13 | 上海先进半导体制造股份有限公司 | Composite sensor with multiple pressure sensitive elements and its manufacturing method |
| CN102809450A (en) * | 2012-08-09 | 2012-12-05 | 厦门大学 | Silicon micro resonant type pressure sensor and manufacturing method thereof |
| CN103185612A (en) * | 2011-12-27 | 2013-07-03 | 中国科学院上海微系统与信息技术研究所 | Single-silicon chip microflow sensor suitable to be packaged in surface mounting way and manufacturing method for single-silicon chip microflow sensor |
-
2015
- 2015-04-03 CN CN201510154605.0A patent/CN104779249B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1755946A (en) * | 2005-11-01 | 2006-04-05 | 清华大学 | Stress sensor chip based on SOI |
| CN101241030A (en) * | 2008-03-10 | 2008-08-13 | 清华大学 | MOS force sensitive sensor |
| CN102491256A (en) * | 2011-12-27 | 2012-06-13 | 上海先进半导体制造股份有限公司 | Composite sensor with multiple pressure sensitive elements and its manufacturing method |
| CN103185612A (en) * | 2011-12-27 | 2013-07-03 | 中国科学院上海微系统与信息技术研究所 | Single-silicon chip microflow sensor suitable to be packaged in surface mounting way and manufacturing method for single-silicon chip microflow sensor |
| CN102809450A (en) * | 2012-08-09 | 2012-12-05 | 厦门大学 | Silicon micro resonant type pressure sensor and manufacturing method thereof |
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Effective date of registration: 20171207 Address after: 225500 south side of Tongyang West Road, Jiangyan Economic Development Zone, Taizhou City, Jiangsu Province Applicant after: Taizhou Qida coating Auxiliaries Co., Ltd. Address before: 528000 Guangdong City, Chancheng Province, China Road, No. four quarter, No. 33, creative industrial park, building 5, floor 9, Foshan Mobile Applicant before: Wu Libin |
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