CN104777924A - Touch panel and manufacture method thereof - Google Patents
Touch panel and manufacture method thereof Download PDFInfo
- Publication number
- CN104777924A CN104777924A CN201410009982.0A CN201410009982A CN104777924A CN 104777924 A CN104777924 A CN 104777924A CN 201410009982 A CN201410009982 A CN 201410009982A CN 104777924 A CN104777924 A CN 104777924A
- Authority
- CN
- China
- Prior art keywords
- metal pattern
- electrode axis
- pattern portion
- conductive
- cabling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention relates to a touch technology, and provides a touch panel and a manufacture method thereof. The touch panel comprises a sensing electrode layer and at least one metal pattern part formed on the sensing electrode layer, wherein the sensing electrode layer comprises at least one first electrode shaft, at least one second electrode shaft and an insulation layer, the first electrode shaft extends along a first axial direction, and the second electrode shaft extends along a second axial direction; the second electrode shaft comprises a plurality of electric conduction units and a plurality of wires, wherein the electric conduction units are arranged on two sides of the first electrode shaft at intervals; the wires are arranged on the first electrode shaft and are electrically connected with two adjacent electric conduction units in the second axial direction; the insulation layer is arranged between the wires and the first electrode shaft; the metal pattern part is correspondingly electrically contacted with the wires; and the resistance value of the metal pattern part is greater than the resistance value of the wires electrically contacted with the metal pattern part. The metal pattern part is additionally arranged to reinforce the continuity of the wires. In addition, the invention also provides a manufacture method of the touch panel.
Description
Technical field
The present invention has about a kind of touch technology, and particularly a kind of contact panel and preparation method thereof.
Background technology
In recent years along with the technical development of contact panel, contact panel applies in all kinds of electronic devices widely, such as mobile phone, laptop computer and palm PC etc.Contact panel (touch panel) generally can be integrated into touch control display screen with display panel (display panel) mutually, using the IO interface as electronic installation, reaches touch display function.Accordingly, user can pass through finger or touch-control sensing object (as pointer) touches touch control display screen to control electronic installation, the function of corresponding manipulation electronic installation.The touch-control input mode of known contact panel comprises resistance-type, condenser type, optical profile type, induction with sound wave induction type, and wherein condenser type is the common contact panel technology of existing market.
The touch control sensing circuit of existing contact panel is generally make with the technology of mono-layer oxidized indium tin (Single ITO, SITO).Specifically, namely be that the conductive unit of X axis sensing electrode and Y-axis in touch control sensing circuit is made on a base material, and through another transparency conducting layer (such as, tin indium oxide (ITO)) make the cabling of bridge joint Y-axis, cabling is electrically connected Y-axis conductive unit, to form Y-axis sensing electrode.Meanwhile, the overlapping region between cabling and X axis sensing electrode, through laying insulation course, makes X axis and Y-axis sensing electrode be electrically insulated.
But, the thinner thickness of known tin indium oxide, material is comparatively fragile, easily rupture in processing procedure (crack), such as produce because of etch temperature change in processing procedure and expand with heat and contract with cold or rupture because of electrostatic breakdown, thus increase the resistance value of tin indium oxide circuit, reduce sensing signal conduction benefit, open circuit may be there is time serious, cause contact panel not start, be especially positioned at the cabling of the Y-axis on insulation course, because itself circuit is thinner, and need be located on insulation course, be more prone to the problem that local fracture or open circuit occur.
Summary of the invention
In view of this, the embodiment of the present invention provides a kind of contact panel and manufacture method thereof, through setting up metal pattern portion to strengthen the cabling be originally located on insulation course, easily there is situation about rupturing because of environment or external force factor with the cabling reduced in the sensing electrode layer of contact panel.
The embodiment of the present invention provides a kind of contact panel, comprises sensing electrode layer and at least one metal pattern portion.Described sensing electrode layer comprises at least one first electrode axis, at least one second electrode axis and insulation course.Described first electrode axis axially extends along one first, and described second electrode axis axially extends along one second.Described second electrode axis also insulate staggered with described first electrode axis.Described second electrode axis comprises multiple conductive unit and many cablings, and wherein said conductive unit is spaced the both sides in described first electrode axis.Described cabling to be arranged in described first electrode axis and to be electrically connected described second two axially adjacent described conductive units.Described insulation course correspondence is arranged between described cabling and described first electrode axis.The corresponding described cabling in electrical contact in described metal pattern portion and be formed on described sensing electrode layer, the resistance value in wherein said metal pattern portion is greater than the resistance value of in electrical contact described cabling corresponding to described metal pattern portion.
In one of them embodiment of the present invention, further in electrical contact described second axially adjacent two the described conductive units in wherein said metal pattern portion.
In one of them embodiment of the present invention, wherein said metal pattern portion is strip.
In one of them embodiment of the present invention, the length in wherein said metal pattern portion is greater than the length of described cabling, and the width in described metal pattern portion is less than the width of described cabling.
In one of them embodiment of the present invention, wherein said metal pattern portion comprises multiple spaced bridge joint sections.
In one of them embodiment of the present invention, wherein said metal pattern portion comprises many bridging lines, and those bridging lines are electrically connected two adjacent described bridge joint sections.
In one of them embodiment of the present invention, wherein said first electrode axis comprises multiple first conductive part and multiple second conductive part, and wherein said second conductive part is electrically connected described first two axially adjacent described first conductive parts.
In one of them embodiment of the present invention, wherein said second conductive part and described cabling are formed staggered and are come by described insulation course isolated in electrical contact.
In one of them embodiment of the present invention, more comprise a plurality of perimeter leads, and those perimeter leads are electrically connected described first electrode axis and described second electrode axis.
In one of them embodiment of the present invention, more comprise a passivation layer, and this passivation layer is formed on described metal pattern portion and at least part of described sensing electrode layer.
In one of them embodiment of the present invention, the material of wherein said first electrode axis and described second electrode axis is one of them of indium tin oxide, indium-zinc oxide, aluminium zinc oxide, Nano Silver, Graphene and the carbon of resistance to rice pipe.
In one of them embodiment of the present invention, the material in wherein said metal pattern portion is one of them of aldary, aluminium alloy, gold, silver, aluminium, copper and molybdenum or combines.
The embodiment of the present invention provides a kind of method for making of contact panel, comprises the following steps.First, form a sensing electrode layer, wherein said sensing electrode layer comprises along at least one first axially extended first electrode axis, at least one along one second axially extended second electrode axis and an insulation course.Described second electrode axis and described first electrode axis insulation interlock.Described second electrode axis comprises multiple conductive unit and many cablings, and wherein said conductive unit is spaced the both sides in described first electrode axis.Described cabling to be formed in described first electrode axis and to be electrically connected described second two axially adjacent described conductive units, and described insulation course is formed between described cabling and described first electrode axis.Then, form at least one metal pattern portion with correspondence described cabling in electrical contact on described sensing electrode layer according to the position of described cabling, the resistance value in wherein said metal pattern portion is greater than the resistance value of in electrical contact described cabling corresponding to described metal pattern portion.
In sum, the contact panel that the embodiment of the present invention provides and manufacture method thereof, this contact panel is strengthened by the metal pattern portion set up above sensing electrode layer and is guaranteed the conduction of the electrode axis in sensing electrode layer, uses and reduces sensing electrode layer because producing the situation of circuit breaker by environment or external force factor.Accordingly, the process rate of contact panel is effectively promoted.
For enable feature and the technology contents of further understanding the present invention, refer to the following detailed description about the present invention and accompanying drawing, but these illustrate that with institute's accompanying drawings be only for the present invention is described, but not any restriction is done to interest field of the present invention.
Accompanying drawing explanation
Fig. 1 is the plan structure schematic diagram of the contact panel that first embodiment of the invention provides.
Fig. 2 is the cross-sectional view along the A-A profile line in Fig. 1.
Fig. 3 A ~ Fig. 3 C is the partial elevation view of the contact panel that another embodiment of the present invention provides respectively.
Fig. 4 is the plan structure schematic diagram of the contact panel that second embodiment of the invention provides.
Fig. 5 is the cross-sectional view along the B-B profile line in Fig. 4.
Fig. 6 is the schematic flow sheet of the method for making of the contact panel that one embodiment of the invention provides.
Fig. 7 is the schematic flow sheet of the method for making of the sensing electrode layer that one embodiment of the invention provides.
Fig. 8 is the schematic flow sheet of the method for making of the sensing electrode layer that another embodiment of the present invention provides.
Embodiment
Hereinafter, the present invention will be described in detail by the various illustrative embodiments of graphic explanation the present invention.But concept of the present invention may embody in many different forms, and should not be construed as be limited to herein the exemplary embodiments set forth.In addition, graphic middle same reference numbers can in order to assembly like representation class.
The invention provides the contact panel of a kind of tool strengthening sensing electrode layer circuit turn-on, this contact panel can by setting up metal pattern portion to assist to be located in reinforcement sensing electrode layer the conduction of the cabling above insulation course, and the electrode axis avoiding being located at insulation course is expanded with heat and contract with cold because of processing procedure process and the environment such as electrostatic breakdown or external force problem produce fracture and loss of function.In addition, first chat at this and bright be, the part that the actual design framework of sensing electrode layer and function mode on contact panel non-invention are focused on, and art has and usually knows that the knowledgeable should know actual design framework and the operation principles of sensing electrode layer, therefore only simply described in following examples.
(the first embodiment)
Please refer to Fig. 1 also simultaneously with reference to Fig. 2.Fig. 1 illustrates the plan structure schematic diagram of the contact panel that first embodiment of the invention provides, and Fig. 2 is the cross-sectional view along the A-A profile line in Fig. 1.In the present embodiment, described contact panel 10 can be applicable to the electronic installation of tool display device, such as intelligent mobile phone, personal digital assistant, flat computer, laptop computer etc.
Contact panel 10 comprises sensing electrode layer 12 and metal pattern portion 13.Wherein, the sensing electrode layer 12 of the present embodiment is realize with so-called positive process structure in process sequence, and it comprises the first electrode axis 121, second electrode axis 123 and insulation course 125.
First electrode axis 121 is along first axially (such as X axis) extension.Second electrode axis 123 is along second axially (such as Y-axis) extension, and insulate staggered with the first electrode axis 121.First electrode axis 121 of the present embodiment and the second electrode axis 123 are all design with many.Be be parallel to each other and do not have in electrical contact between all first electrode axis 121, and be also to be parallel to each other and not in electrical contact between all second electrode axis 123.Second electrode axis 123 more comprises conductive unit 1231 and cabling 1233.Conductive unit 1231 is spaced the both sides in the first electrode axis 121, and all conductive units 1231 entirety presents matrix arrangement.Cabling 1233 to be arranged in the first electrode axis 121 and to be electrically connected second two axially adjacent conductive units 1231 with insulating.Insulation course 125 is arranged between each cabling 1233 and the first electrode axis 121 accordingly, allows position interlaced with each other between the first electrode axis 121 and the second electrode axis 123 be completely cut off directly in electrical contact by insulation course 125.
More specifically, each first electrode axis 121 comprises multiple spaced first conductive part 1211 and many second conductive parts 1213 arranged in parallel, and wherein the second conductive part 1213 is electrically connected first two axially adjacent the first conductive parts 1211.And then the conductive unit 1231 of aforementioned second electrode axis 123 is the both sides of the second conductive part 1213 be spaced in the first electrode axis 121.Be interlaced overlapping between the cabling 1233 of the second electrode axis 123 and the second conductive part 1213 of the first electrode axis 121, and completely cut off directly in electrical contact through insulation course 125.In addition, as shown in Figure 2, cabling 1233 due to the second electrode axis 123 is that leap second conductive part 1213 and insulation course 125 are electrically connected second two axially adjacent conductive units 1231, therefore on the framework of sensing electrode layer 12, is able to formation one bridging structure.It should be noted that in the present embodiment, sensing electrode layer 12 comprises many first electrode axis 121 and many second electrode axis 123, but in other embodiments of the present invention, sensing electrode layer also only can comprise first electrode axis and second electrode axis.
The corresponding cabling 1233 in electrical contact in metal pattern portion 13 is also formed on sensing electrode layer 12.The metal pattern portion 13 of the present embodiment such as carrys out corresponding cabling 1233 in electrical contact in mode one to one, and the resistance value in each metal pattern portion 13 is greater than the resistance value of the cabling 1233 in electrical contact with described metal pattern portion 13.Thus, allow sensing electrode layer 12 when cabling 1233 ruptures (crack), just can carry out Signal transmissions via corresponding metal pattern portion 13, and when fracture does not occur cabling 1233, then be still via cabling 1233 to carry out Signal transmissions.
By this, the contact panel 10 of the present embodiment guarantees the conduction of the second electrode axis 123 on sensing electrode layer 12 by setting up metal pattern portion 13, avoid the cabling 1233 of the second electrode axis 123 easily in contact panel 10 manufacture process, fracture to occur because of bridging structure and increase the resistance value of the second electrode axis 123, even there is the situation of open circuit, and then the yield of contact panel 10 can be promoted.In addition, the metal pattern portion 13 of the present embodiment in electrical contact second axially adjacent two conductive units 1231 further especially.In other words, metal pattern portion 13 is arranged in the mode of crossing over whole cabling 1233 further, allows metal pattern portion 13 can provide more complete reinforcing effect to cabling 1233.
In addition, the contact panel 10 of the present embodiment more comprises substrate 11, and aforesaid sensing electrode layer 12 be formed at substrate 11 one on the surface.Substrate 11 can be such as transparent glass substrate or plastic base.In one embodiment; substrate 11 more such as can be through the substrate 11 after strengthening; except in order to except the substrate as carrying sensing electrode layer 12; more can be used as the cover sheet of contact panel 10; in other words, substrate 11 is touch input for user on a relative surface on the surface arranging sensing electrode layer 12.
Moreover, as shown in Figure 1, the region that sensing electrode layer 12 is formed may be defined as a sensing region (not illustrating), and the region beyond sensing region is neighboring area (not illustrating), the contact panel 10 of the present embodiment more comprises the perimeter leads 15 be laid in neighboring area, in order to be electrically connected the first electrode axis 121 and the second electrode axis 123.Perimeter leads 15 is separately connected to rear end circuit for detecting, such as touch detection chip (not illustrating).Accordingly, perimeter leads 15 transmits the signal between touch detection chip and the first electrode axis 121 and the second electrode axis 123, makes rear end circuit for detecting be judged the accurate location of touch points on contact panel 10.
As shown in Figure 2, the contact panel 10 of the present embodiment more comprises passivation layer (not illustrating), be formed on metal pattern portion 13 and at least part of sensing electrode layer 12, passivation layer is in order to avoid sensing electrode layer 12 and metal pattern portion 13 because being subject to chemical action or physical action and damaging as a dielectric layer.In addition, passivation layer fits with a display panel (not illustrating) by bonding coat (not illustrating) in the one side away from sensing electrode layer 12 and metal pattern portion 13, wherein said bonding coat can be realized by optical cement (Optical ClearAdhesive, OCA).
In another embodiment, carry relative one of the face of sensing electrode layer 12 at the substrate 11 of contact panel 10 and more sequentially can form protective seam (not shown) and another passivation layer (not shown) on the surface.Protective seam can be used to prevent electromagnetic interference (EMI), and another described passivation layer does not damage because external force is excessive in order to protective substrate 11.
Structure below for metal pattern portion 13 is described further.
First, as shown in Figure 1, the metal pattern portion 13 of the present embodiment is the design of a strip.In addition, the width (first length) axially that the present embodiment designs metal pattern portion 13 is further less than the width of cabling 1233, and the length in metal pattern portion 13 (second length) is axially more than or equal to the length of cabling 1233.
The known width with the resistance value of metal wire and wire is inversely proportional to, and is directly proportional to the length of wire.Therefore the present embodiment will, by visual scope, can make the resistance value in metal pattern portion 13 be greater than the resistance value of cabling 1233 corresponding in electrical contact by the width in minimizing metal pattern portion 13 or the length in increase metal pattern portion 13 in the metal pattern portion 13 of strip.In addition, usually know that the knowledgeable also can according to the line resistance demand of touch detection chip in affiliated field tool, the aspect by design metal pattern portion 13 adjusts required resistance value.
In other embodiments, please refer to Fig. 3 A ~ Fig. 3 C, illustrate the partial elevation view of the contact panel that the other embodiment of the present invention provides respectively.As shown in Figure 3A, the metal pattern portion 13a of the present embodiment comprises multiple bridge joint sections 131.Wherein, bridge joint sections 131 axially arranges in a straight line along second, and be intervally installed and be not connected.The effect being reached electric connection by cabling 1233 in electrical contact is able between each bridge joint sections 131.In addition, because the metal pattern portion 13a of the present embodiment is step-by-step design, the total resistance value that therefore all bridge joint sections 131 are added up is the resistance value being greater than cabling 1233 corresponding in electrical contact.
As shown in Figure 3 B, the metal pattern portion 13b of the present embodiment, except comprising the bridge joint sections 131 of the segmentation designed by Fig. 3 A, more comprises many bridging lines 132.Bridging line 132 is electrically connected two adjacent bridge joint sections 131, in order to make the effect directly being reached electric connection between each bridge joint sections 131 by bridging line 132.
As shown in Figure 3 C, the metal pattern portion 13c of the present embodiment is roughly identical with the bridge joint sections 131 of the segmentation designed by Fig. 3 A, and discrepancy is, the bridge joint sections 131 of the metal pattern portion 13c of the present embodiment is in non-linear configuration.
Moreover, metal pattern portion 13 with except the aspect realizations such as strip and segmentation shape, in other embodiments, can also be with other geometric configuratioies except aforementioned, such as square, circular, rhombus, triangle, hexagon or octagon etc. realize, not by above-described embodiment is limited.The practical structures in metal pattern portion 13 and set-up mode can be arranged according to the demand of resistance value and process capability, as long as can reach auxiliary to be electrically connected adjacent conductive unit 1231, and the resistance value in each metal pattern portion 13 is greater than the resistance value of cabling 1233 corresponding in electrical contact.
It is worth mentioning that, the first electrode axis 121 and the second electrode axis 123 can be formed through exposing (exposure), developing (develop) and etching photo-mask processs such as (etch) by conductive material layer respectively.The material of described conductive material layer can be such as the transparent conductive materials such as nano metal, Graphene or CNT such as indium tin oxide (Indium tin oxide, ITO), indium-zinc oxide, aluminium zinc oxide, Nano Silver.In addition, first conductive part 1211 of the first electrode axis 121 and the conductive unit 1231 of the second electrode axis 123 can be polygon-shaped block according to side circuit design requirement, such as square, rectangle, rhombus, triangle, hexagon or octagon etc., the present embodiment does not limit.
The material in metal pattern portion 13 can comprise conducting metal or the electrical conductivity alloies such as aldary, aluminium alloy, gold, silver, aluminium, copper, molybdenum, and can be utilize sputter, printing, photoetching, physical vapour deposition (PVD) (PVD) or chemical vapor deposition (Chemical Vapor Deposition, CVD) mode to be formed.The material of described perimeter leads 15 can adopt the material identical with the first electrode axis 121 (the second electrode axis 123) or metal pattern portion 13 and be formed by identical processing procedure.The material of described passivation layer comprises silicon nitride, monox, benzocyclobutene, polyester film or acryl resin etc., and can chemical vapor deposition be formed.In addition, protective seam can be realized by indium tin oxide.
(the second embodiment)
Please refer to Fig. 4 also simultaneously with reference to Fig. 5.Fig. 4 illustrates the plan structure schematic diagram of second embodiment of the invention contact panel.Fig. 5 is the cross-sectional view along the B-B profile line in Fig. 4.The contact panel 10 ' of the present embodiment is roughly all identical with the contact panel 10 in the first embodiment in composition assembly, material and application, and discrepancy is, the sensing electrode layer 12 ' of the contact panel 10 ' of the present embodiment is realize with so-called anti-process structure in process sequence.
Framework as shown in Figures 4 and 5, the sensing electrode layer 12 ' of the present embodiment is arranged on substrate 11 '.In addition, the formation order of sensing electrode layer 12 ' is the second conductive part 1213 first forming the first electrode axis 121, and correspondence forms insulation course 125 on the second conductive part 1213 afterwards.Next, property ground forms the first conductive part 1211 of the first electrode axis 121 and the conductive unit 1231 of the second electrode axis 123 and cabling 1233 again.Thus, the first conductive part 1211 forms the framework that is spaced in the both sides of cabling 1233 and axially reaches electric connection by the second conductive part 1213 originally formed first.On the other hand, the conductive unit 1231 of the second electrode axis 123 and cabling 1233 are integrated along the second axially extension, and the conductive unit 1231 of the second electrode axis 123 is the framework of the both sides be spaced in the second conductive part 1213 relatively.
The corresponding cabling 1233 in electrical contact in metal pattern portion 13 is also formed on sensing electrode layer 12 ', use the conduction guaranteeing the second electrode axis 123, avoid the cabling 1233 of the second electrode axis 123 easily in contact panel 10 ' manufacture process, fracture to occur and increase the resistance value of the second electrode axis 123, even there is the situation of open circuit, and then the yield of contact panel 10 ' can be promoted.
(the 3rd embodiment)
Please refer to Fig. 6, illustrate the schematic flow sheet of the method for making of the contact panel that one embodiment of the invention provides.The step of the method for making of the contact panel of the present embodiment comprises:
Step S100, provides a substrate, and wherein substrate can be transparent glass substrate or plastic base.
Step S110, forms sensing electrode layer on the surface in one of substrate.Wherein, sensing electrode layer comprises along the first axially extended first electrode axis, along the second axially extended second electrode axis and insulation course.Described second electrode axis and the insulation of the first electrode axis interlock, and the second electrode axis comprises multiple conductive unit and many cablings, wherein conductive unit is spaced the both sides in the first electrode axis, and cabling to be formed in the first electrode axis and to be electrically connected second two axially adjacent conductive units.Insulation course is then be formed between cabling and the first electrode axis.
Step S120, forms metal pattern portion on sensing electrode layer with correspondence described cabling in electrical contact according to the position of aforementioned cabling.Wherein, the resistance value in metal pattern portion is greater than the resistance value of the described cabling in electrical contact with described metal pattern portion.In addition, in another embodiment, metal pattern portion, more can in electrical contact second axially adjacent two conductive units further outside correspondence described cabling in electrical contact.
Step S130, forms perimeter leads and is electrically connected the first electrode axis and the second electrode axis.Wherein, in order to reduce production process, in another embodiment, if perimeter leads adopts to design with the first electrode axis and the second electrode axis same material, then this step S130 can be integrated in step S110 and formed by same fabrication steps; In addition, if perimeter leads adopts to design with metal pattern portion same material, then this step S130 can be integrated in step S120 and formed by same fabrication steps.
Step S140, forms passivation layer and be used as a dielectric layer in metal pattern portion and at least part of sensing electrode layer, damages because being subject to chemical action or physical action in order to avoid metal pattern portion, the first electrode axis and the second electrode axis.
In other embodiments; being formed with relative one of the surface of sensing electrode layer at substrate also can sequentially utilize sputter or chemical vapor deposition mode to form protective seam and another passivation layer on the surface, does not damage to prevent electromagnetic interference (EMI) and protective substrate respectively because external force is excessive.
Next, the step S110 illustrated in greater detail in the method for making of aforementioned contact panel forms the concrete implementation step of sensing electrode layer.
Please refer to Fig. 7 and coordinate the framework with reference to the first embodiment (i.e. Fig. 1 and Fig. 2) described contact panel 10.Fig. 7 illustrates the schematic flow sheet of the method for making of the sensing electrode layer that one embodiment of the invention provides.As shown in Figure 7, the method for making of sensing electrode layer 12 comprises: patterning one first conductive material layer forms the first conductive part 1211, second conductive part 1213 and conductive unit 1231 (step S200), wherein, conductive unit 1231 is spaced the both sides in the second conductive part 1213.Moreover, carry out patterning one dielectric materials layer according to the position of the second conductive part 1213 and form insulation course 125 on the second conductive part 1213 (step S202) with correspondence.Afterwards, patterning one second conductive material layer is carried out with correspondence formation cabling 1233 (step S204) on insulation course 125 in position according to conductive unit 1231 and insulation course 125, is able to two axially adjacent conductive units 1231 of electric connection second to make cabling 1233.By this, each cabling 1233 is overlapping with each second conductive part 1213 and is come by insulation course 125 isolated in electrical contact.
Please refer to Fig. 8 and coordinate the framework with reference to the contact panel 10 ' described in the second embodiment (i.e. Fig. 4 and Fig. 5).Fig. 8 illustrates the schematic flow sheet of the method for making of the sensing electrode layer that another embodiment of the present invention provides.As shown in Figure 8, the method for making of sensing electrode layer 12 ' comprising: patterning one first conductive material layer is to form many cablings 1233 (step S300).Moreover, carry out patterning one dielectric materials layer according to the position of cabling 1233 and form insulation course 125 (step S302) on cabling 1233 with correspondence.Afterwards, patterning one second conductive material layer is carried out to form the first conductive part 1211, second conductive part 1213 and conductive unit 1231 (step S304) according to the position of insulation course 125, wherein the second conductive part 1213 correspondence is formed on insulation course 125, and conductive unit 1231 is spaced the both sides in the second conductive part 1213.By this, each second conductive part 1213 is overlapping with each cabling 1233 and is come by insulation course 125 isolated in electrical contact.
What remark additionally is, the method of the patterned material layer mentioned by previous embodiment, recycle the photoetching making operation comprising exposure, development, etching etc. after can being such as first sputter material layer to realize, also can be directly realized by printing process in addition, at this not by the present invention is limited.
In sum, the contact panel that the embodiment of the present invention provides and manufacture method thereof, this contact panel is by setting up metal pattern portion to strengthen the conduction of the electrode axis in sensing electrode layer above sensing electrode layer, use and reduce sensing electrode layer because producing the situation of circuit breaker by environment or external force factor, effectively promote the process rate of contact panel.In addition, if when fracture occurs the electrode axis in sensing electrode layer, the metal pattern portion set up also can play the effectiveness of bypass resistance at this moment, effectively avoids the resistance of electrode axis significantly to increase, the running of sensing electrode layer is maintained.
The foregoing is only the embodiment of the present invention, it is also not used to the scope of the claims limiting to the present invention.
Claims (19)
1. a contact panel, is characterized in that, comprising:
One sensing electrode layer, comprising:
At least one first electrode axis, axially extends along one first;
At least one second electrode axis, axially extend along one second, described second electrode axis also insulate staggered with described first electrode axis, wherein said second electrode axis comprises multiple conductive unit and many cablings, and described conductive unit is spaced the both sides in described first electrode axis, described cabling to be arranged in described first electrode axis and to be electrically connected described second two axially adjacent described conductive units; And
One insulation course, correspondence is arranged between described cabling and described first electrode axis; And
At least one metal pattern portion, corresponding described cabling in electrical contact and be formed on described sensing electrode layer, the resistance value in wherein said metal pattern portion is greater than the resistance value of in electrical contact described cabling corresponding to described metal pattern portion.
2. contact panel as claimed in claim 1, is characterized in that, further in electrical contact described second axially adjacent two the described conductive units in described metal pattern portion.
3. the contact panel as described in claim the 1st, wherein said metal pattern portion is strip.
4. contact panel as claimed in claim 3, it is characterized in that, the length in described metal pattern portion is greater than the length of described cabling, and the width in described metal pattern portion is less than the width of described cabling.
5. contact panel as claimed in claim 1, it is characterized in that, described metal pattern portion comprises multiple spaced bridge joint sections.
6. contact panel as claimed in claim 5, it is characterized in that, described metal pattern portion comprises many bridging lines, and those bridging lines are electrically connected two adjacent described bridge joint sections.
7. contact panel as claimed in claim 1, it is characterized in that, described first electrode axis comprises multiple first conductive part and multiple second conductive part, and wherein said second conductive part is electrically connected described first two axially adjacent described first conductive parts.
8. contact panel as claimed in claim 7, it is characterized in that, described second conductive part and described cabling are formed staggered, and described second conductive part comes isolated in electrical contact through described insulation course.
9. contact panel as claimed in claim 1, is characterized in that, more comprise a plurality of perimeter leads, and those perimeter leads are electrically connected described first electrode axis and described second electrode axis.
10. contact panel as claimed in claim 1, it is characterized in that, more comprise a passivation layer, and this passivation layer is formed on described metal pattern portion and at least part of described sensing electrode layer.
11. contact panels as claimed in claim 1, is characterized in that, the material of described first electrode axis and described second electrode axis is one of them of indium tin oxide, indium-zinc oxide, aluminium zinc oxide, Nano Silver, Graphene and the carbon of resistance to rice pipe.
12. contact panels as claimed in claim 1, is characterized in that, the material in described metal pattern portion is one of them of aldary, aluminium alloy, gold, silver, aluminium, copper and molybdenum or combines.
The method for making of 13. 1 kinds of contact panels, is characterized in that, comprising:
Form a sensing electrode layer, wherein said sensing electrode layer comprises along at least one first axially extended first electrode axis, at least one along one second axially extended second electrode axis and an insulation course, wherein said second electrode axis and described first electrode axis insulation interlock, and described second electrode axis comprises multiple conductive unit and many cablings, wherein said conductive unit is spaced the both sides in described first electrode axis, described cabling to be formed in described first electrode axis and to be electrically connected described second two axially adjacent described conductive units, and described insulation course is formed between described cabling and described first electrode axis, and
Form at least one metal pattern portion on described sensing electrode layer and corresponding described cabling in electrical contact according to the position of described cabling, the resistance value in wherein said metal pattern portion is greater than the resistance value of in electrical contact described cabling corresponding to described metal pattern portion.
The method for making of 14. contact panels as claimed in claim 13, it is characterized in that, described first electrode axis comprises multiple first conductive part and multiple second conductive part, and wherein said second conductive part is electrically connected described first two axially adjacent described first conductive parts.
The method for making of 15. contact panels as claimed in claim 14, is characterized in that, in the step forming described sensing electrode layer, comprising:
Patterning one first conductive material layer forms described first conductive part, described second conductive part and described conductive unit, and wherein said conductive unit is spaced the both sides in described second conductive part;
Patterning one dielectric materials layer forms described insulation course on described second conductive part; And
Patterning one second conductive material layer forms described cabling on described insulation course.
The method for making of 16. contact panels as claimed in claim 14, is characterized in that, forms institute
The step stating sensing electrode layer comprises further:
Patterning one first conductive material layer forms described cabling;
Patterning one dielectric materials layer formed described insulation course in described walk online; And
Patterning one second conductive material layer forms described first conductive part, described second conductive part and described conductive unit, and wherein said second conductive part is formed on described insulation course, and described conductive unit is spaced the both sides in described second conductive part.
The method for making of 17. contact panels as claimed in claim 13, is characterized in that, further in electrical contact described second axially adjacent two the described conductive units in described metal pattern portion.
The method for making of 18. contact panels as claimed in claim 13, is characterized in that, more comprise: form a perimeter leads to be electrically connected described first electrode axis and described second electrode axis.
The method for making of 19. contact panels as claimed in claim 13, is characterized in that, more comprise: form a passivation layer in described metal pattern portion and at least part of described sensing electrode layer.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410009982.0A CN104777924B (en) | 2014-01-09 | 2014-01-09 | Contact panel and preparation method thereof |
| TW103133098A TWI541711B (en) | 2014-01-09 | 2014-09-24 | Capacitive touch panel and manufacturing method thereof |
| TW103216979U TWM493109U (en) | 2014-01-09 | 2014-09-24 | Capacitive touch panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410009982.0A CN104777924B (en) | 2014-01-09 | 2014-01-09 | Contact panel and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104777924A true CN104777924A (en) | 2015-07-15 |
| CN104777924B CN104777924B (en) | 2018-03-02 |
Family
ID=52783443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410009982.0A Active CN104777924B (en) | 2014-01-09 | 2014-01-09 | Contact panel and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104777924B (en) |
| TW (2) | TWI541711B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105335006A (en) * | 2015-11-18 | 2016-02-17 | 业成光电（深圳）有限公司 | Touch panel |
| CN105426018A (en) * | 2015-11-23 | 2016-03-23 | 友达光电股份有限公司 | Touch panel |
| CN106816459A (en) * | 2017-02-28 | 2017-06-09 | 上海天马微电子有限公司 | A kind of flexible display substrates and flexible display apparatus |
| CN110119224A (en) * | 2019-05-17 | 2019-08-13 | 苏州诺菲纳米科技有限公司 | Touch sensing and preparation method thereof |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI607354B (en) | 2015-01-07 | 2017-12-01 | 群創光電股份有限公司 | Touch sensor device and method for fabricating the same |
| CN105824445B (en) * | 2015-01-07 | 2019-05-10 | 群创光电股份有限公司 | Touch sensing device and its manufacturing method |
| CN107085474A (en) * | 2016-02-15 | 2017-08-22 | 宸鸿光电科技股份有限公司 | Touch-control module and its manufacture method |
| TWI744516B (en) * | 2018-04-12 | 2021-11-01 | 洋華光電股份有限公司 | Method for reducing the partial area impedance of transparent conductive film and product thereof |
| TWI688892B (en) * | 2019-04-12 | 2020-03-21 | 友達光電股份有限公司 | Touch display device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101685362A (en) * | 2008-09-22 | 2010-03-31 | 铼宝科技股份有限公司 | Light transmission touch panel |
| CN102541348A (en) * | 2010-08-20 | 2012-07-04 | 乐金显示有限公司 | Touch panel and flat panel display device having the same |
| CN102819358A (en) * | 2011-06-08 | 2012-12-12 | 联咏科技股份有限公司 | Layout structure and manufacturing method of capacitive touch panel |
| CN103049144A (en) * | 2011-10-14 | 2013-04-17 | 宸鸿科技(厦门)有限公司 | Touch control device figure and manufacture method thereof |
| CN103064551A (en) * | 2011-10-23 | 2013-04-24 | 宸鸿科技(厦门)有限公司 | Touch sensing device and manufacturing method thereof |
| WO2013118314A1 (en) * | 2012-02-10 | 2013-08-15 | アルプス電気株式会社 | Input device |
| CN203799347U (en) * | 2014-01-09 | 2014-08-27 | 宸鸿科技(厦门)有限公司 | Touch panel |
-
2014
- 2014-01-09 CN CN201410009982.0A patent/CN104777924B/en active Active
- 2014-09-24 TW TW103133098A patent/TWI541711B/en active
- 2014-09-24 TW TW103216979U patent/TWM493109U/en unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101685362A (en) * | 2008-09-22 | 2010-03-31 | 铼宝科技股份有限公司 | Light transmission touch panel |
| CN102541348A (en) * | 2010-08-20 | 2012-07-04 | 乐金显示有限公司 | Touch panel and flat panel display device having the same |
| CN102819358A (en) * | 2011-06-08 | 2012-12-12 | 联咏科技股份有限公司 | Layout structure and manufacturing method of capacitive touch panel |
| CN103049144A (en) * | 2011-10-14 | 2013-04-17 | 宸鸿科技(厦门)有限公司 | Touch control device figure and manufacture method thereof |
| CN103064551A (en) * | 2011-10-23 | 2013-04-24 | 宸鸿科技(厦门)有限公司 | Touch sensing device and manufacturing method thereof |
| WO2013118314A1 (en) * | 2012-02-10 | 2013-08-15 | アルプス電気株式会社 | Input device |
| CN203799347U (en) * | 2014-01-09 | 2014-08-27 | 宸鸿科技(厦门)有限公司 | Touch panel |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105335006A (en) * | 2015-11-18 | 2016-02-17 | 业成光电（深圳）有限公司 | Touch panel |
| CN105426018A (en) * | 2015-11-23 | 2016-03-23 | 友达光电股份有限公司 | Touch panel |
| TWI554920B (en) * | 2015-11-23 | 2016-10-21 | 友達光電股份有限公司 | Touch panel |
| CN105426018B (en) * | 2015-11-23 | 2018-06-08 | 友达光电股份有限公司 | Touch panel |
| CN106816459A (en) * | 2017-02-28 | 2017-06-09 | 上海天马微电子有限公司 | A kind of flexible display substrates and flexible display apparatus |
| CN106816459B (en) * | 2017-02-28 | 2019-08-13 | 上海天马微电子有限公司 | A kind of flexible display substrates and flexible display apparatus |
| CN110119224A (en) * | 2019-05-17 | 2019-08-13 | 苏州诺菲纳米科技有限公司 | Touch sensing and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM493109U (en) | 2015-01-01 |
| TWI541711B (en) | 2016-07-11 |
| TW201528098A (en) | 2015-07-16 |
| CN104777924B (en) | 2018-03-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104777924A (en) | Touch panel and manufacture method thereof | |
| CN103472951B (en) | A kind of touch screen and preparation method thereof, display device | |
| CN102890591B (en) | The manufacture method of a kind of touch-screen, touch control display apparatus and touch-screen | |
| CN203799347U (en) | Touch panel | |
| CN102799301B (en) | Electrode structure of touch panel, manufacturing method and touch panel | |
| CN103092414B (en) | A kind of external hanging type touch-screen and preparation method thereof, display device | |
| US20140027264A1 (en) | Touch pannel | |
| CN203414925U (en) | Touch panel | |
| TWI436252B (en) | Manufacturing method of touchpad | |
| CN104932752B (en) | A kind of touch screen base plate and preparation method thereof, touch panel and display device | |
| US20150193066A1 (en) | Touch panel and manufacturing method thereof | |
| TWI556296B (en) | Touch panel and manufacturing process thereof | |
| KR20110132957A (en) | Touch panel manufacturing method and structure thereof | |
| TWI612453B (en) | Touch panel | |
| TWI621974B (en) | Touch panel | |
| US20120007827A1 (en) | Touch Sensing Structure and Method for Making the Same | |
| CN102830836B (en) | A kind of contact panel and manufacture method, touch control device | |
| CN105353931A (en) | Touch screen and production method thereof, display device | |
| CN102830841A (en) | Touch screen, touch display device and production method of touch screen | |
| US20160026293A1 (en) | Touch screen panel and method of manufacturing the same | |
| KR20150006228A (en) | Touch panel | |
| US9619085B2 (en) | Pattern of a capacitive touch device and manufacturing method thereof | |
| CN202189340U (en) | Electrode structure of touch panel and touch panel | |
| TWI676927B (en) | Touch sensor | |
| CN103870076A (en) | Touch panel and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |