CN104776337B - Greeting lamp - Google Patents

Abstract

A kind of greeting lamp, including housing, radiator, the LED light and the wiring board of the connection radiator being arranged on the radiator, the radiator includes body and the heat sink being arranged on the body, the LED light includes pcb board and some LED chips being arranged on the pcb board, the wiring board includes fixed band and the conductor wire being arranged in parallel with the fixed band, the fixed band is set on the body, the pcb board is arranged on the fixation and takes, some LED chips are correspondingly arranged on the pcb board of the fixed band, the pcb board is electrically connected with the conductor wire, the housing open up container and with the matched cover board of the container, the radiator, the LED light and the wiring board are placed in the container.Above-mentioned greeting lamp, by the ring groove being opened on radiator body and fills radiator in the ring groove, and is evenly distributed with heat sink in the outer peripheral edge of body, so as to improve the radiating efficiency of greeting lamp.

Description

Greeting lamp

Technical field

The present invention relates to lamps and lanterns, more particularly to greeting lamp.

Background technology

At present, greeting lamp is widely used in that household, automobile and square etc. are local, because its send the light of colour temperature relatives and extensively by Welcome.Its light source uses new LED lamplight.

But whether greeting lamp work stablizes, quality quality, radiates closely related in itself with lamp body.At present, in the market is met The heat dissipation of guest's lamp, it is usually unsatisfactory using natural heat dissipation, effect；For example, the theoretical service life of LED light is 100,000 hours, But since heat dissipation effect is bad, often actual life is less than 20,000 hours, even lower than 10,000 hours.

Therefore, how heat radiation performance, be the technical issues that need to address.

The content of the invention

Based on this, it is necessary to the problem of for how to improve radiating efficiency, there is provided a kind of greeting lamp.

A kind of greeting lamp, including housing, radiator, the LED light being arranged on the radiator and the connection heat dissipation The wiring board of device, the radiator, which includes body and the heat sink being arranged on the body, the LED light, includes pcb board And some LED chips on the pcb board are arranged on, the wiring board includes fixed band and is set with the fixation with parallel The conductor wire put, the fixed band are set on the body, and the pcb board is arranged on the fixation and takes, some LED Chip is correspondingly arranged on the pcb board of the fixed band, and the pcb board is electrically connected with the conductor wire, the shell Body opens up container and is placed in the matched cover board of the container, the radiator, the LED light and the wiring board The container.

In one of the embodiments, the cover board is plastic products.

In one of the embodiments, rotation position, the cover board rotation are provided with the housing of the container both sides Turn to be installed on the rotation position.

In one of the embodiments, it is provided with encapsulation groove on the cover board, the radiator, the LED light and described Wiring board is arranged at the encapsulation groove, also, the radiator, the LED light and the wiring board house or expose to institute State container.

In one of the embodiments, the LED light and the wiring board are packaged in the encapsulation groove.

In one of the embodiments, the rotation position is provided with positioning part, and the positioning part is used to adjust the cover board With the angle of the housing.

In one of the embodiments, the cover board and the housing the angle ranging from 30 degree.

In one of the embodiments, the cover board and the housing the angle ranging from 160 degree.

In one of the embodiments, the radiating fin exposed outside is in the housing.

In one of the embodiments, the housing is additionally provided with fixed bit, and the fixed bit is used to install the welcome Lamp.

In one of the embodiments, the body is cylinder, it offers circle away from axle center close to the region of outer wall Ring groove, the ring groove are filled with radiator, and the heat sink is uniformly distributed along the outer wall of the body, also, institute State heat sink and be provided with thermal dispersant coatings.

In one of the embodiments, circular groove, the circle are offered between the ring groove and the axle center Groove is filled with coolant.

Above-mentioned greeting lamp, radiator and the heat sink being uniformly distributed on radiator, improve the heat dissipation effect of lighting device Rate, also, by housing and container with housing is opened up, radiator, LED light and wiring board etc. can be placed in collecting Groove, so that greeting lamp also improves the service life of greeting lamp and using model while possessing luminous shinny function Enclose.

Above-mentioned greeting lamp, by the ring groove being opened on radiator body and fills radiator in the ring groove, And heat sink is evenly distributed with the outer peripheral edge of body, so as to improve the radiating efficiency of greeting lamp.

Brief description of the drawings

Fig. 1 is the schematic diagram of one embodiment of greeting lamp of the present invention；

Fig. 2 is the positive structure diagram shown in Fig. 1；

Fig. 3 is A-A schematic cross-sectional views shown in Fig. 2；

Fig. 4 is the schematic diagram of another embodiment of greeting lamp of the present invention；

Fig. 5 is positive structure diagram shown in Fig. 4；

Fig. 6 is B-B schematic cross-sectional views shown in Fig. 5；

Fig. 7 is the schematic diagram of another embodiment of greeting lamp of the present invention；

Fig. 8 is the schematic diagram of another embodiment of greeting lamp of the present invention；

Fig. 9 is the schematic diagram of another embodiment of greeting lamp of the present invention.

Embodiment

In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention Embodiment be described in detail.Many details are elaborated in the following description in order to fully understand this hair It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not Similar improvement is done in the case of running counter to intension of the present invention, therefore the present invention is from the limitation of following public specific embodiment.

It should be noted that when element is referred to as " being fixed on ", " being arranged at " another element, it can be directly another On a element or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be It is directly connected to another element or may be simultaneously present centering elements.Term as used herein " vertically ", " level ", "left", "right" and similar statement for illustrative purposes only, it is unique embodiment to be not offered as.

Also referring to Fig. 1 and Fig. 8, greeting lamp 40 includes housing 400, radiator 10, the LED being arranged on radiator 10 Lamp and the light bar for connecting radiator 10, for example, light bar includes wiring board 300, radiator 10 includes body 100 and is arranged at Heat sink 110 on body 100, body 100 are cylinder, and heat sink 110 is uniformly distributed along the outer wall of body 100, such as Fig. 6 Shown, LED light includes pcb board 210 and some LED chips 220 being arranged on pcb board 210, and wiring board 300 includes fixing Band and the conductor wire being arranged in parallel with fixed band, fixed band are arranged on body 100, and pcb board 210 is arranged on fixation and takes, Some LED chips 220 are correspondingly arranged on the pcb board 210 of fixed band, and pcb board 210 is electrically connected with conductor wire, housing 400 Open up container and be placed in container with the matched cover board of container, radiator 10, LED light and wiring board 300.For example, Greeting lamp 40 includes housing 400, radiator 10, the LED light being arranged on radiator 10 and the wiring board for connecting radiator 10 300, radiator 10 includes body 100 and the heat sink 110 being arranged on body 100, and body 100 is cylinder, its is remote Axle center offers ring groove 120 close to the region of outer wall, and ring groove 120 is used to filling heat dissipation crystal grain, heat sink 110 along The outer wall of body 100 is uniformly distributed, and LED light includes pcb board 210 and some LED chips 220 being arranged on pcb board 210, Wiring board 300 includes fixed band and the conductor wire being arranged in parallel with fixed band, and fixed band is arranged on body 100, pcb board 210, which are arranged on fixation, takes, and some LED chips 220 are correspondingly arranged on the pcb board 210 of fixed band, and pcb board 210 is with leading Electric wire be electrically connected, housing 400 open up container and with the matched cover board of container, radiator 10, LED light and wiring board 300 It is placed in container.For example, the greeting lamp can also be applied in other lighting devices.

Preferably, housing 400 is hollow cuboid, it offers container, and radiator 10, be arranged on radiator 10 LED light and connect wiring board 300 etc. of radiator 10 and be contained in container.

For the ease of printing opacity and light direct projection user is prevented, for example, cover board is transparent plastic.The transparent plastic is provided with Refractive power surface.For example, the refractive power surface adopt it is made of plastic so that by line light bounce back container, it is therefore prevented that light direct projection User.And for example, aobvious word bit is provided with cover board, which is used to place welcome's letter stencil, which covers the cover board, For showing the word on welcome's letter stencil under the action of LED lamplight.And for example, which uses double guide rail drawing and pulling types, i.e., Welcome's letter stencil is placed on the aobvious word bit along guide rail.In this way, by the cover board, user can be facilitated to make the welcome of personalization Demand, it is simple and practical in structure.

In order to make greeting lamp 40 that there is adjustable light angle, for example, being provided with rotation on the housing 400 of container both sides Indexing, cover board rotation are installed on rotation position.For example, rotation position is provided with positioning part, positioning part is used to adjust cover board and housing 400 angle.For example, the positioning part is hinge installation position, a hinge part is installed on cover board, and another part is installed on housing On 400 so that cover board is rotatable with respect to housing 400.For example, hinge is spring hinge, it is provided with adjusting screw, passes through the tune Save screw can up and down, the height and angle of left and right adjusting cover board, for example, angle be 30 degree, and for example, angle be 160 degree.

LED lamplight linear user in order to prevent, for example, radiator 10, the LED light being arranged on radiator 10 and connection The grade of wiring board 300 of radiator 10 is installed on towards on the one side of the cover board of the collecting channel opening, so that the light of LED light Line directive houses trench bottom.For example, towards being provided with encapsulation groove on the cover board of the collecting channel opening, radiator 10, LED light and Wiring board 300 is arranged on encapsulation groove.For example, LED light and wiring board 300 are packaged on encapsulation groove.Installed since cover board rotates In on housing 400, rotating plate can drive the light angle of LED light, be adjusted as needed easy to user.

Radiate for the ease of radiator 10, for example, housing 400 offers some ventilation holes.For example, some ventilation hole bendings Set, to prevent light direct projection to outside housing 400.For example, some ventilation holes are distributed into two rows.For example, two rows of ventilation pore size distributions On side wall of the container close to bottom.In this way, since air in container and air outside container are negotiable, can effectively protect Demonstrate,prove the heat dissipation of LED light.

In other embodiment, housing groove sidewall and open up some perforation, heat sink 110 wears the perforating exposed in housing 400, To be further ensured that the radiating efficiency of radiator 10, ensure the normal work of LED light.

In order to which greeting lamp 40 is fixed on outside, for example, being additionally provided with fixed bit on housing 400, fixed bit is used to install Or mount greeting lamp 40.For example, the fixed bit is the installation screw being extended on housing 400, for being fixed in installation It is fixed during the greeting lamp 40 by screw.For example, the fixed bit is welding position, for greeting lamp 40 to be welded on welcome's platform On.In this way, user can be facilitated to be installed according to demand.

Referring to Fig. 1, radiator 10 includes body 100 and the heat sink 110 being arranged on body 100, body 100 are Cylinder, heat sink 110 are uniformly distributed along the outer wall of body 100, also, heat sink 110 is provided with thermal dispersant coatings.Such as Fig. 2 Shown in Fig. 3, for example, body 100 is cylinder, it offers ring groove 120, annulus away from axle center close to the region of outer wall Groove 120 is filled with radiator.For example, body 100 is cylinder, it is recessed that it away from axle center offers annulus close to the region of outer wall Groove 120, the filling heat dissipation particle of ring groove 120.For example, body 100 is cylinder, it is opened away from axle center close to the region of outer wall Equipped with ring groove 120, ring groove 120 is filled with heat dissipation particulate；And for example, the heat dissipation particulate is heat dissipation crystal grain.For example, this Body 100 is cylinder, it offers ring groove 120 away from axle center close to the region of outer wall, and ring groove 120 is filled with heat dissipation Crystal grain.In other embodiments, body 100 can be any one in square, cuboid, cone or round estrade.This Sample, radiator 10 realize preferable heat dissipation effect under the dual heat conduction and heat radiation of radiator and heat sink 110, particularly suitable for The heat dissipation of LED lamp.

In order to further enhance the radiating efficiency of radiator 10, the region between ring groove 120 and axle center offers circle Connected in star 130, circular groove 130 are filled with coolant, for example, circular groove is filled with the first coolant, the first coolant is Water, it is preferred that coolant is heavy water, and the expense cost of heavy water is more expensive than light water, and about 20 yuan/milliliter, have fluctuation according to purity, But its heat dissipation effect is about than light water lifting 10%~15%.For example, the region between ring groove 120 and axle center opens up There is square groove, square groove is filled with the second coolant, for example, second coolant is conduction oil.For example, ring groove Region between 120 and axle center offers round platform connected in star, and round platform groove is filled with the 3rd coolant, for example, the 3rd heat dissipation Agent is heat-conducting silicone grease.In this way, since each coolant is non-solid material, flowing can be produced after it is heated, so as to take away heat source Heat, and then strengthen radiator 10 radiating efficiency.

For example, the pcb board 210 is arranged on the body 100, also, some LED chips 220 are correspondingly arranged On the pcb board backwards to the ring groove so that the heat that some LED chips 220 produce can pass through in time Radiator is conducted to surrounding, so as to improve radiating efficiency.

In order to concentrate the heat derives of heat source, for example, heat source is LED chip, body 100 is additionally provided with and circular groove 130 matched lids 140, lid 140 are tightly connected with circular groove 130.For example, lid 140 covers whole circular groove 130 Opening, so that the coolant in circular groove 130 is sealed in circular groove 130, prevents coolant from spilling into external environment.Example Such as, lid 140 covers whole circular groove 130 and is open and extends over to periphery at body 100, i.e. lid 140 is justified in covering Connected in star 130 also cover the opening of ring groove 120 while opening so that ring groove 120 is also sealed, and prevents from sealing The radiator being installed therein is spilled over to outside body 100.In this way, by the way that LED chip to be arranged on to the lid backwards to circular groove 130 On body 140, the heat that rapidly can be produced LED chip concentrates conduction to outside.

In preferred embodiment, body 100 further includes some heat conducting pipes, which is arranged in circular groove 130, connection 130 hot inner wall of lid 140 and circular groove.For example, some LED chips are arranged on the lid backwards to circular groove 130 by pcb board On body 140, thermal hole is offered on position corresponding with each LED chip on lid 140, heat conducting pipe wears thermal hole, supports Connect the pcb board in LED chip.That is, one end of some heat conducting pipes corresponds the heat conduction being threaded through on lid 140 Hole simultaneously abuts pcb board corresponding with thermal hole, and LED chip is correspondingly arranged on the pcb board, and the other end of some heat conducting pipes abuts The inner wall of circular groove 130.In this way, heat conducting pipe by being arranged on body 100 and LED chip is abutted correspondingly, can Immediately to conduct the heat produced by LED chip to the inner wall of circular groove 130, so as to reach LED directly and quickly The most heat produced on chip is conducted to outside.

In order to increase the heat transfer efficiency of lid 140,140 periphery of lid is provided with heat-conducting silicone grease.For example, lid 140 and circle When connected in star 130 is tightly connected, 140 periphery of lid is provided with the place contacted on the body 100 of 130 periphery of circular groove and leads Hot silicone grease.For example, lid 140 covers whole circular groove 130 when being open and extending over to 100 outer peripheral edge of body, lid 140 Periphery is provided with heat-conducting silicone grease with the place contacted on the body 100 of 120 periphery of 130 periphery of circular groove and ring groove.It is excellent Choosing, lid 140 is weldingly fixed on body 100.The ground contacted on lid 140 with the body 100 of 130 periphery of circular groove Side is additionally provided with solid adhesive, for lid 140 to be pasted onto body 100.In this way, what lid 140 was contacted with body 100 Part can be rapidly conducted heat on body 100 under the action of heat-conducting silicone grease.That is, lid 140 is by heat Conduction is to can be by radiator and coolant or by heat-conducting silicone grease, in this way, lifting lid 140 during body 100 Also the radiating efficiency of whole radiator 10 is lifted while heat transfer efficiency.

In order to strengthen the service life of radiator 10, circular groove 130 and lid 140 are provided with waterproof coating, for example, anti- Water coating is provided with acrylic acid.For example, water-proof acrylic acid paint is using pure acrylic acid polymer emulsion as base-material and adds other Additive is made.Since the cured rear waterproofing membrane formed of polyacrylic water-proof coating has crack resistance, impermeability and weatherability, It can play the role of waterproof, prevent blending protection.So as to which circle can be increased in the case where circular groove 130 fills coolant The ability of the waterproof and antiseepage of groove 130 and lid 140, can prevent on the inner wall and lid 140 of circular groove 130 with dissipate Chemical attack reaction occurs for thermit powder contact portion, and then improves the service life of radiator 10, improves product quality.

In order to improve the heat-sinking capability of radiator 10, for example, radiator is graphene particles.For example, ring groove 120 is filled out Fill graphene particles.Since the thermal conductivity factor of graphene is high, when its filling is to ring groove 120, it is in contact with it on lid 140 The heat of part can directly be rapidly transferred in graphene particles, graphene particles conduct heat to heat sink 110 again, And then conducted under the action of heat sink 110 to outside.In other embodiment, radiator can be heat dissipation thermal conductivity factor compared with graphite The low graphite particle of alkene.In this way, since the heat for influencing LED chip luminous efficiency is rapidly transferred to outside LED chip, therefore can be with The heat-sinking capability of radiator 10 is further improved, improves the luminous efficiency of LED chip.

In order to which the heat on body 100, lid 140 and radiator etc. is rapidly transferred in surrounding environment, heat dissipation Piece 110 is graphite-aluminium alloy.Since the thermal conductivity factor of graphite is high, aluminium has the hardness of metal, have when both combine relative to The more excellent heat transfer efficiency of aluminium alloy.Above-mentioned graphite-aluminium alloy includes each component of following mass parts：Si：15~18 parts, Cu：9 ~13 parts, Ti：10~15 parts, Mg：5~8 parts, Ai：45~65 parts, C：25~35 parts, Ni：25~35 parts.

And for example, graphite-aluminium alloy includes each component of following mass parts：Si：10~14 parts, Cu：13~17 parts, Ti：5~9 Part, Mg：2~4 parts, Ai：25~43 parts, C：36~55 parts, Ni：36~55 parts.

And for example, graphite-aluminium alloy includes each component of following mass parts：Si：8~12 parts, Cu：5~8 parts, Ti：2~4 parts, Mg：2~6 parts, Ai：65~75 parts, C：55~75 parts, Ni：55~75 parts.

Above-mentioned each combination has excellent thermal conductivity factor after being grouped into graphite-aluminium alloy, while has the plasticity of metal, Effectively the heat on the positions such as body 100, lid 140 and radiator can be conducted into surrounding environment.

In order to further improve radiating efficiency, for example, heat sink 110 is aluminium alloy, the aluminium alloy is along body 100 Outer wall is uniformly distributed, also, each heat sink 110 is laminated with a graphite heat radiation fin 110.And for example, described in the aluminium alloy parcel Graphite heat radiation fin, in this way, stronger structure can be obtained；For example, heat sink 110 is tabular, it is evenly distributed on body 100 Outer wall.For example, heat sink 110 is reversed acanthoid, it is evenly distributed on the outer wall of body 100.For example, heat sink 110 is aerofoil profile, It is evenly distributed on the outer wall of body 100.Preferably, graphite heat radiation fin 110 is provided with adhesive layer, for by graphite heat radiation fin 110 are pasted onto on heat sink 110.In this way, it is distributed in the heat sink 110 of the outer wall of body 100 and the knot of graphite heat radiation fin 110 Close, on the one hand can accelerate to conduct the heat on body 100 to heat sink 110, on the other hand add radiator 10 with it is outer The surface area of boundary's contact, improves the radiating efficiency of radiator 10.

In order to improve the radiating efficiency of heat sink 110, for example, being provided with some heat dissipation convex blocks on heat sink 110.For example, Each heat dissipation convex block is prism structure.For example, each heat dissipation convex block is sphere structure.Using each heat dissipation convex block as prism Exemplified by structure, for example, each heat dissipation convex block is regular hexagonal prism structure, it is provided with into every one side wall of each regular hexagonal prism First heat dissipation scales of matrix distribution, are provided with one on each incline of each regular hexagonal prism and ranked second heat dissipation scales, also, The second heat dissipation scales between adjacent heat radiation convex block intersect and do not abut against each other.For example, each heat dissipation convex block is positive three Prism structure, the 3rd heat dissipation scales of matrix distribution is provided with into every one side wall of each regular triangular prism, each positive three One is provided with each incline of prism and ranked fourth heat dissipation scales, also, the 4th heat dissipation scales phase between adjacent heat radiation convex block Mutually intersect and do not abut against each other.In this way, by be laminated in heat sink 110 more embranchment Designs, have it is multiple dissipate The heat dissipation convex block of hot scale so that the heat on heat sink 110 is conducted to outside rapidly from each heat dissipation convex block, improves heat sink 110 radiating efficiency.

In order to improve the radiating efficiency of heat dissipation convex block, for example, heat dissipation convex block is hollow structure, also, the convex block that radiates also is opened Equipped with some thermal vias.That is, heat dissipation convex block is hollow prism structure, if also, being further opened with every one side wall Dry thermal vias.For example, heat dissipation convex block is hollow regular hexagonal prism structure, it is provided with every one side wall of each regular hexagonal prism Into the 5th heat dissipation scales of matrix distribution, first thermal vias is offered on the side wall between adjacent 5th heat dissipation scales. For example, heat dissipation convex block is hollow regular triangular prism structure, matrix distribution is provided with into every one side wall of each regular triangular prism The 6th heat dissipation scales, offer second thermal vias on the side wall between adjacent 6th heat dissipation scales.In this way, due to dissipating The temperature of air is more than the temperature of the outer air of heat dissipation convex block in hot convex block so that air heats are uneven, in the convex block that radiates temperature compared with High air expansion rises, and the relatively low air of the outer temperature of heat dissipation convex block is padded in heat dissipation convex block by thermal vias, so that shape Into local air convection current.Also, the relatively low air of temperature is padded to by thermal vias in heat dissipation convex block outside heat dissipation convex block During, the flowing of each heat dissipation scales surrounding air on side wall is driven, increases the radiating efficiency of each heat dissipation scales, so that whole The radiating efficiency of heat dissipation convex block is improved on body.

In order to improve the radiating efficiency of heat dissipation convex block, for example, heat dissipation convex block is provided with thermal dispersant coatings.For example, heat dissipation convex block Thermal dispersant coatings are provided with lateral wall.For example, thermal dispersant coatings be arranged on lateral wall remove the thermal vias and each heat dissipation scales Outside other plane domains, to improve its radiating efficiency.For example, thermal dispersant coatings are provided with heat radiation coating, the heat radiation coating For special material, since it is present product and technology, therefore details are not described herein again.By being provided with heat dissipation convex block lateral wall Thermal dispersant coatings, improve the radiating efficiency on the sidewall areas surface, so as to improve the radiating efficiency of heat dissipation convex block.

It is set to be combined into the complementation in heat transfer heat conduction of an entirety in order to integrate each heat sink 110, for example, heat sink 110 are uniformly distributed along the outer wall of body 100, and heat sink 110 is bar-shaped, and the one end of heat sink 110 away from body 100 is provided with Bending part, bending part are provided with some heat dissipation hangnails, and some heat dissipation hangnails are uniformly distributed along bending part, and some bending parts offer Intercommunicating pore, intercommunicating pore are equipped with heat conducting bar, and some heat sinks 110 are connected by heat conducting bar.For example, heat sink 110 is bar-shaped.Example Such as, heat sink 110 is tabular, and heat sink 110 is uniformly distributed along the outer wall of body 100.For example, heat sink 110 is prism-shaped, Heat sink 110 is uniformly distributed along the outer wall of body 100, and the one end of heat sink 110 away from body 100 is provided with bending part.Example Such as, heat sink 110 is round table-like that heat sink 110 is uniformly distributed along the outer wall of body 100, and heat sink 110 is away from body 100 One end be provided with bending part, bending part is provided with some heat dissipation hangnails, and some heat dissipation hangnails are uniformly distributed along bending part.Example Such as, heat sink 110 is centrum shape, and heat sink 110 is uniformly distributed along the outer wall of body 100, and heat sink 110 is away from body 100 One end be provided with bending part, bending part is provided with some heat dissipation hangnails, and some heat dissipation hangnails are uniformly distributed along bending part, some Bending part offers intercommunicating pore, and intercommunicating pore is equipped with heat conducting bar, and some heat sinks 110 are connected by heat conducting bar.For example, the heat conduction Bar is made of graphite-aluminium alloy.In this way, each heat sink 110 is connected with each other by heat conduction so that when each heat sink 110 is heated When uneven, when particularly a certain 110 temperature of heat sink is excessive, can be conducted heat to by the heat conducting bar adjacent temperature compared with In low heat sink 110, also, while heat is conducted to the relatively low heat sink 110 of temperature, which in itself can also By heat derives to outside, so as to further improve thermal efficiency.

In order to improve heat dissipation effect, it is preferred that and for example, at least one heat sink is also extended some radiating fins. For example, in the heat sink, the area of the radiating fin is the 0.2%-0.8% of the area of the heat sink；For example, described dissipate The area of hot fin is the 0.5%-0.6% of the area of the heat sink.And for example, the gross area of each radiating fin is described The 60%-95% of the area of heat sink.

For example, the radiating fin includes：It is sequentially overlapped the first film layer of setting, the second film layer, third membrane layer, the 4th film Layer and the 5th film layer, i.e. the first film layer, the second film layer, third membrane layer, the 4th film layer and the 5th film layer are sequentially overlapped attaching, also It is to say, the second film layer is attached in the first film layer, and third membrane layer is attached in the second film layer, and the 4th film layer is attached at third membrane layer On, the 5th film layer is attached in the 4th film layer.For example, the first film layer connects or is in close contact the heat sink

For example, the present invention provides a kind of radiating fin, the first film layer therein, it is good with insulation effect, thermal conductivity factor The advantages of big and thermal coefficient of expansion is low, in this way, when heat is directly delivered to first film layer, first film layer can be fast Speed and the heat for guiding near zone aggregation in time, to ensure the normal work of product to be radiated.Secondly as described first The distance between film layer and product to be radiated are nearest, its heat conduction load undertaken is maximum, when the thermal expansion system of first film layer When number is low, it is possible to avoid producing gap between first film layer and second film layer, avoid with first film layer certainly Body produces gap, and then the problem of can be reduced to avoid the thermal conductivity factor that is produced behind the gap and gap filling air.Finally, by It is nearest in the distance between first film layer and product to be radiated, electric elements easily occur and are directly connect with first film layer The problem of touching, when the insulation effect of first film layer is good, it is possible to avoid the first film layer from being powered, so as to improve described dissipate The security performance of hot fin, safety standard are higher.

For example, first film layer of an embodiment of the present invention, it includes each component of following mass parts：40 parts of carborundum~ 70 parts, 13 parts~55 parts of alundum (Al2O3), 2 parts~15 parts of silica, 3 parts~25 parts of binding agent, 2 parts~20 parts of kaolin, 0.2 part~0.5% part of 0.5 part~2 parts of magnesia, 0.5 part~2 parts of Dongyang soil, 0.5 part~2 parts of light weight calcium and rare earth oxide. Above-mentioned first film layer mixes remaining raw material that can be used for preparing ceramics by the use of carborundum as primary raw material, so that Above-mentioned first film layer has been provided simultaneously with that thermal conductivity factor height, good insulation preformance, thermal coefficient of expansion are low and heat resistance is preferably excellent Point, in addition, also to have the advantages that to be readily produced manufacture low with manufacture cost for above-mentioned first film layer.

Preferably, first film layer of an embodiment of the present invention includes each component of following mass parts：50 parts of carborundum~ 60 parts, 30 parts~50 parts of alundum (Al2O3), 0 part~15 parts of silica 1,10 parts~20 parts of binding agent, kaolin 15 parts~20 Part, 1 part~1.5 parts of magnesia, Dongyang is 1 part~1.5 parts native, 1 part~1.5 parts of light weight calcium and rare earth oxide 0.3 part~0.4% Part.Preferably, first film layer of an embodiment of the present invention includes each component of following mass parts：55 parts of carborundum, three oxidations Two 40 parts of aluminium, 3 parts of silica 1,15 parts of binding agent, 18 parts of kaolin, 1.5 parts of magnesia, 1.5 parts of Dongyang soil, light weight calcium 1.5 0.3 part of part and rare earth oxide.

It should be noted that because above-mentioned second film layer is directly bonded with first film layer, then the first film layer meeting The heat being absorbed to from product to be radiated is directly passed to second film layer, this requires second film layer with high Thermal conductivity factor, will can be delivered to rapidly in second film layer from the heat that first film layer is absorbed to, in addition, also will Ask second film layer that there is preferable heat dissipation performance, and relatively low thermal coefficient of expansion at the same time.

For example, the present invention provides a kind of second film layer, it is high with thermal conductivity factor, perfect heat-dissipating and good mechanical property Advantage, in this way, when the heat being absorbed to from product to be radiated is directly passed to second film layer by first film layer, then The heat that first film layer is absorbed to can be delivered to rapidly in second film layer, and during heat conduction, is based on Heat in second film layer, can also be lost in the air in the external world by the excellent heat dissipation performance of second film layer.Its It is secondary, since second film layer also can be higher also in the distance with product relative close to be radiated, the temperature of itself, but It is, based on the relatively low thermal coefficient of expansion of second film layer, it is possible to avoid between second film layer and the third membrane layer Produce gap, it is ensured that the compactness that both are bonded.

For example, second film layer of an embodiment of the present invention, it includes each component of following mass parts：80 parts of graphene~ 95 parts, 0.1 part~20 parts of 0.1 part~20 parts of carbon nanotubes and carbon nano-fiber.Above-mentioned second film layer is by using graphene Primary raw material so that its thermal conductivity factor is greatly improved, and heat-conducting effect is preferable.In addition, again by adding carbon nanotubes And carbon fiber, heat dissipation channel can be formed, heat dissipation performance is also preferable.

Preferably, the second film layer includes each component of following mass parts：85 parts~90 parts of graphene, 5 parts of carbon nanotubes~ 15 parts and 5 parts~15 parts of carbon nano-fiber.Preferably, the second film layer includes 90 parts of graphene, 10 parts of carbon nanotubes and nano-sized carbon 10 parts of fiber.

It should be noted that two layers before passing through because of heat, i.e., after described first film layer and second film layer, have one The heat divided is lost in the air in the external world.Further, since the cost of second film layer is higher, itself main reason is that, institute The primary raw material for stating the second film layer is the higher graphene of manufacturing cost, therefore, heat transfer and heat dissipation based on the third membrane layer Bear it is relatively small in the case of, the third membrane layer can use the most common metal heat dissipation material in current market, to reach Reduce cost and obtain the effect of preferable heat transfer property.

For example, the present invention provides a kind of third membrane layer, it is high with thermal conductivity factor, perfect heat-dissipating, good mechanical property with And lower-cost advantage, in this way, when the heat transfer of second film layer gives the third membrane layer, then second film The heat that layer is absorbed to can be relatively rapidly delivered in the third membrane layer, and during heat transfer, the tertiary membrane The heat of part can also be directly delivered in the air in the external world by layer.

For example, the third membrane layer of an embodiment of the present invention, it includes each component of following mass parts：Copper 93 parts~97 Part, 2 parts~4.5 parts of aluminium, 0.1 part~0.3 part of nickel, 0.1 part~0.4 part of manganese, 0.1 part~0.3 part of titanium, 0.1 part~0.3 part of chromium and 0.1 part~0.3 part of vanadium.

Above-mentioned third membrane layer, which contains copper (Cu), can make the heat conductivility of third membrane layer be maintained at a higher level. When the mass parts of copper are 93 parts~97 parts, the coefficient of heat conduction of the third membrane layer can reach more than 380W/mK, can be compared with Rapidly the heat being transmitted in second film layer is passed, and then be evenly dispersed in the knot of the third membrane layer entirety On structure, to prevent heat from being accumulated on the contact position between second film layer and the third membrane layer, hot-spot is caused The generation of phenomenon.Moreover, the density of the third membrane layer but only has 8.0kg/m³~8.1kg/m³, far smaller than fine copper density, It so can effectively mitigate the weight of the third membrane layer, more conducively installation manufacture, while also greatly reduce cost.This Outside, the third membrane layer contain mass parts be 2 parts~4.5 parts aluminium, 0.1 part~0.3 part of nickel, 0.1 part~0.4 part of manganese, 0.1 part~0.3 part of titanium, 0.1 part~0.3 part of chromium and 0.1 part~0.3 part of vanadium.Relative to fine copper, third membrane layer is prolonged Malleability energy, toughness, intensity and resistance to elevated temperatures are improved significantly, and not easy-sintering.

In order to make the third membrane layer that there is preferably performance, for example, the third membrane layer contain mass parts for 0.1 part~ 0.3 part of nickel (Ni), can improve the resistance to elevated temperatures of third membrane layer.And for example, third membrane layer contain mass parts for 0.2 part~ 1.2 parts of vanadium (V) can suppress third membrane layer crystal grain and grow up, and more uniform tiny grain structure be obtained, to reduce the described 3rd The brittleness of film layer, improves the mechanical property of the third membrane layer entirety, to improve toughness and intensity.And for example, the third membrane layer Containing the titanium (Ti) that mass parts are 0.1 part~0.3 part, it can cause the crystal grain miniaturization of the third membrane layer, with described in raising The ductility of third membrane layer；And for example, it is 1 part~2.5 parts of silicon (Si) that the third membrane layer, which further includes mass parts, when described the When three film layers contain suitable silicon, described can be effectively lifted on the premise of the third membrane layer heat conductivility is not influenced The hardness and abrasion resistance of three film layers.

Preferably, the third membrane layer includes each component of following mass parts：94 parts~96 parts of copper, 3 parts~4 parts of aluminium, nickel 0.2 part~0.3 part of 0.2 part~0.3 part, 0.2 part~0.3 part of manganese, 0.2 part~0.3 part of titanium, 0.2 part~0.3 part of chromium and vanadium.It is excellent Choosing, the third membrane layer includes each component of following mass parts：95 parts of copper, 3.5 parts of aluminium, 0.3 part of nickel, manganese 0.2 part~0.3 Part, 0.2 part~0.3 part of titanium, 0.2 part~0.3 part of chromium and 0.2 part~0.3 part of vanadium.

It should be noted that working as the heat that product to be radiated produces passes through three first layers, i.e., respectively described first film layer, institute After stating the second film layer and the third membrane layer, have relatively large a part of heat and be dissipated in transmission in air dielectric, this Outside, since the primary raw material of the third membrane layer is copper, its heavier mass, therefore, bears phase based on the 4th convection In the case of less, the 4th film layer can use heat dissipation effect it is preferable, lighter in weight, lower-cost material, with up to To reducing cost and weight, and obtain the effect of preferable heat dissipation performance.

For example, the present invention provides a kind of 4th film layer, it is preferable with heat dissipation effect, lighter in weight and lower-cost excellent Point, in this way, when four film layer described in the heat transfer of the third membrane layer, then the 4th film layer can be by the overwhelming majority Heat be dissipated in air dielectric, to coordinate first film layer, second film layer and the third membrane layer to complete gradient The effect of heat transfer, in this way, different heat regions can be directed to, i.e., is measured with the distance with product distance to be radiated, realized The gradient transmission of heat and lost effect, it is poor to solve traditional heat sinks insulation resistance, of high cost, quality weight, heat conduction and The problem of heat dissipation effect is poor.

For example, the 4th film layer of an embodiment of the present invention, it includes each component of following mass parts：Copper 47 parts~50 Part, 49 parts~52 parts of aluminium, 0.2 part~0.7 part of magnesium, 0.2 part~0.7 part of iron, 0.2 part~0.5 part of manganese, 0.1 part~0.3 part of titanium, 0.1 part~0.3 part of 0.05 part~0.1 part of chromium and vanadium.

Above-mentioned 4th film layer contains the copper and 49 parts~52 parts of aluminium that mass parts are 47 parts~50 parts, can cause described The coefficient of heat conduction of 4th film layer is maintained at 300W/mK~350W/mK, to ensure that the 4th film layer can will be by the described 3rd The heat that film layer passes over rapidly is dissipated in air dielectric, and then prevents heat from being accumulated in the 4th film layer, is made Produced into hot-spot phenomenon.Relative to the prior art, merely using price costly and the larger copper of quality, the above-mentioned 4th Film layer both has good heat dissipation effect, and rapidly heat can be lost in air, but with lighter weight, be easily installed casting, The advantages of price is less expensive.Meanwhile relative to the prior art, merely using the poor aluminium alloy of heat dissipation effect, the above-mentioned 4th Film layer has more preferably heat transfer property.In addition, the 4th film layer contain mass parts be 0.2 part~0.7 part magnesium, 0.2 part~0.7 part Iron, 0.2 part~0.5 part of manganese, 0.1 part~0.3 part of titanium, 0.05 part~0.1 part of chromium and 0.1 part~0.3 vanadium, change It has been apt to yield strength, tensile strength and the resistance to elevated temperatures of the 4th film layer.For example, sent out through many experiments evidence and theory analysis Existing, the 4th film layer contains the magnesium that mass parts are 0.2 part~0.7 part, can assign the 4th film layer yield strength to a certain extent And tensile strength.

Preferably, the 4th film layer includes each component of following mass parts：48 parts~49 parts of copper, 50 parts~52 parts of aluminium, 0.2 part~0.5 part of magnesium, 0.2 part~0.5 part of iron, 0.3 part~0.5 part of manganese, 0.2 part~0.3 part of titanium, 0.05 part~0.08 part of chromium With 0.2 part~0.3 part of vanadium.Preferably, the 4th film layer includes each component of following mass parts：48 parts of copper, 51 parts of aluminium, magnesium 0.3 part of 0.3 part, 0.3 part of iron, 0.4 part of manganese, 0.4 part of titanium, 0.08 part of chromium and vanadium.

It should be noted that four layers before passing through because of the heat of product to be radiated, i.e., described first film layer, second film After layer, the third membrane layer and the 4th film layer, the heat of a greatly part has been lost in the air in the external world.Therefore, base It is relatively small in the heat dissipation burden of the 5th film layer, and in the case that self-temperature is relatively low, the larger generation of thermal coefficient of expansion Influence it is minimum in the case of, the third membrane layer can use the most common plastic material in current market, and cost is reduced to reach And weight, and obtain preferable surface protection performance.

For example, the present invention provides a kind of 5th film layer, it is good with surface protection performance, and lighter in weight, cost are relatively low excellent Point, in this way, when the 5th film layer is located at the outermost layer of the radiating fin, can have preferable heat dissipation performance, preferably Surface protection performance, lighter weight and relatively low cost.

For example, the 5th film layer of an embodiment of the present invention, it includes each component of following mass parts：5th film layer Include each component of following mass parts：20 parts~40 parts of graphite, 20 parts~30 parts of carbon fiber, 40 parts~60 parts of polyamide are water-soluble 10 parts~20 parts of silicate of property, 1 part~8 parts of hexagonal boron nitride, 2 parts~5 parts of bismaleimide, silane coupling agent 0.5 part~2 Part, 0.25 part~1 part of antioxidant.

When above-mentioned water-soluble silicate is mixed with graphite and carbon fiber, it can be total under the high temperature conditions with polyamide Poly- reaction, forms heat dissipation channel, so that heat dissipation performance is improved, and more fluffy empty structure, quality are lighter.Further, since it with the addition of Carbon fiber, its surface protection performance and mechanical performance are more preferable, for example, it is more anti-oxidant, more resistant to soda acid, more resistant to corrosion.

Preferably, the 5th film layer includes each component of following mass parts：30 parts~35 parts of graphite, 25 parts of carbon fiber~ 30 parts, 45 parts~50 parts of polyamide, 15 parts~20 parts of water-soluble silicate, 4 parts~6 parts of hexagonal boron nitride, bismaleimide 3 Part~4 parts, 1 part~1.5 parts of silane coupling agent, 0.5 part~1 part of antioxidant.Preferably, the 5th film layer includes following quality The each component of part：35 parts of graphite, 28 parts of carbon fiber, 45 parts of polyamide, 18 parts of water-soluble silicate, 5 parts of hexagonal boron nitride, span Come 3.5 parts of acid imide, 1.8 parts of silane coupling agent, 0.7 part of antioxidant.

In order to preferably so that first film layer, second film layer, the third membrane layer, the 4th film layer and institute The heat conduction and sinking path for stating the 5th film layer more optimize, therefore, considering cost, weight, heat conduction and heat dissipation effect, and In the case of surface protection performance, second film layer, the third membrane layer, the 4th film layer of an embodiment of the present invention And the 5th thicknesses of layers ratio is 1~1.5：8~12：5~7：6~10：2~2.5, in this way, can cause first film Layer, second film layer, the third membrane layer, the 4th film layer and the heat conduction of the 5th film layer and sinking path are more excellent Change.

In order to further such that first film layer, second film layer, the third membrane layer, the 4th film layer and institute State the 5th film layer to be fixed together, to further improve structural stability, and reduce to the radiating fin heat conduction and conductivity of heat The influence of energy, for example, also setting up filling adhesive layer between each film layer.

For example, the first filling adhesive layer is set, between the second film layer and third membrane layer between the first film layer and the second film layer Second filling adhesive layer is set, the 3rd filling adhesive layer, the 4th film layer and the 5th are provided between third membrane layer and the 4th film layer 4th filling adhesive layer is set between film layer.It is appreciated that the first film layer, the second film layer, the second film layer, third membrane layer, the 4th And a fairly large number of gap small there is structure, its reason mainly exist between the adjacent interfaces two-by-two of film layer and the 5th film layer In, due to the binding face defective tightness of above layers material, and by set first filling adhesive layer, second filling adhesive layer, 3rd filling adhesive layer and the 4th filling adhesive layer can preferably fill these gaps, while also function to the effect of bonding.

For example, the present invention provides the first filling adhesive layer of an embodiment, it includes each group of following mass parts Point：300 parts~1000 parts of nano alumina particles, 5 parts~30 parts of methyl vinyl silicone rubber, vinyl silicone oil 10 parts~50 Part, 1 part~20 parts of 10 parts~100 parts of dimethicone and MQ silicones.

Preferably, the first filling adhesive layer includes each component of following mass parts：800 parts of nano alumina particles~ 1000 parts, 20 parts~30 parts of methyl vinyl silicone rubber, 40 parts~50 parts of vinyl silicone oil, 80 parts~100 parts of dimethicone With 15 parts~20 parts of MQ silicones.

Preferably, the first filling adhesive layer includes each component of following mass parts：900 parts of nano alumina particles, 20 parts of 25 parts of methyl vinyl silicone rubber, 45 parts of vinyl silicone oil, 85 parts of dimethicone and MQ silicones.

For example, the present invention provides the second filling adhesive layer of an embodiment, it includes each group of following mass parts Point：200 parts~800 parts of nano alumina particles, 10 parts~40 parts of methyl vinyl silicone rubber, vinyl silicone oil 10 parts~50 Part, 1 part~20 parts of 10 parts~100 parts of dimethicone and MQ silicones；

Preferably, the second filling adhesive layer includes each component of following mass parts：500 parts of nano alumina particles~ 700 parts, 20 parts~30 parts of methyl vinyl silicone rubber, 30 parts~40 parts of vinyl silicone oil, 50 parts~80 parts of dimethicone and 10 parts~15 parts of MQ silicones.

Preferably, the second filling adhesive layer includes each component of following mass parts：600 parts of nano alumina particles, 15 parts of 15 parts of methyl vinyl silicone rubber, 35 parts of vinyl silicone oil, 65 parts of dimethicone and MQ silicones.

For example, the present invention provides the 3rd filling adhesive layer of an embodiment, it includes each group of following mass parts Point：200 parts~700 parts of nano alumina particles, 10 parts~40 parts of methyl vinyl silicone rubber, vinyl silicone oil 10 parts~50 Part, 1 part~20 parts of 10 parts~100 parts of dimethicone and MQ silicones.

Preferably, the 3rd filling adhesive layer includes each component of following mass parts：200 parts of nano alumina particles~ 600 parts, 20 parts~40 parts of methyl vinyl silicone rubber, 20 parts~50 parts of vinyl silicone oil, 30 parts~100 parts of dimethicone and 5 parts~10 parts of MQ silicones.

Preferably, the 3rd filling adhesive layer includes each component of following mass parts：500 parts of nano alumina particles, 8 parts of 25 parts of methyl vinyl silicone rubber, 25 parts of vinyl silicone oil, 30 parts of dimethicone and MQ silicones.

For example, the present invention provides the 4th filling adhesive layer of an embodiment, it includes each group of following mass parts Point：150 parts~700 parts of nano alumina particles, 15 parts~45 parts of methyl vinyl silicone rubber, vinyl silicone oil 10 parts~50 Part, 1 part~20 parts of 10 parts~100 parts of dimethicone and MQ silicones.

Preferably, the 4th filling adhesive layer includes each component of following mass parts：150 parts of nano alumina particles~ 450 parts, 15 parts~25 parts of methyl vinyl silicone rubber, 10 parts~25 parts of vinyl silicone oil, 80 parts~100 parts of dimethicone and 1 part~10 parts of MQ silicones.

Preferably, the 4th filling adhesive layer includes each component of following mass parts：250 parts of nano alumina particles, 5 parts of 18 parts of methyl vinyl silicone rubber, 20 parts of vinyl silicone oil, 95 parts of dimethicone and MQ silicones.

It is above-mentioned first filling adhesive layer, second filling adhesive layer, the 3rd filling adhesive layer and the 4th filling adhesive layer with Organic siliconresin is basis material, and adds the nano alumina particles with preferable heat-conducting effect.By in organic siliconresin Conduction powder nano aluminium oxide is added in matrix, thermal conductivity factor high filling jointing material stronger so as to prepare bonding force, And then can be preferably so that first film layer, second film layer, the third membrane layer, the 4th film layer and described the Five film layers are fixed together, to further improve structural stability.

It is emphasized that the first filling adhesive layer, the second filling adhesive layer, the 3rd filling adhesive layer and the 4th filling are viscous The content for closing nano alumina particles in layer is successively decreased successively, is because heat load is also from the first film layer, the second film layer, the 3rd Film layer, the 4th film layer to the 5th film layer are successively decreased successively, in this way, the effect of gradient heat conduction and heat dissipation can preferably be got.

First film layer, second film layer, the third membrane layer, the 4th film layer and institute are held in order to preferably viscous The 5th film layer is stated, while avoids increasing excessive thickness, and reduces the influence to heat conduction and heat dissipation performance, for example, described first Fill the thickness ratio of adhesive layer, the second filling adhesive layer, the 3rd filling adhesive layer and the 4th filling adhesive layer for 1~ 1.5：2~2.5：3~3.5：4~4.5, and for example, the first filling adhesive layer and the thickness ratio of first film layer are 1：50 ~80.

Above-mentioned radiating fin sets the first film layer, the second film layer, third membrane layer, the 4th film layer and the 5th by being sequentially overlapped Film layer, can obtain good insulating, the coefficient of expansion are low, thermal conductivity factor is big, good heat dissipation effect and it is light the advantages of.

Referring to Fig. 4, LED light 20 includes radiator 10 and the LED light group 200 being arranged on radiator 10, radiator 10 include body 100 and the heat sink 110 being arranged on body 100, and body 100 is cylinder, it is away from axle center close to outer The region of wall offers ring groove 120, and ring groove 120 is used to filling radiator, and heat sink 110 is along the outer of body 100 Wall is uniformly distributed, also, heat sink 110 is provided with thermal dispersant coatings；LED light group 200 includes pcb board 210 and is arranged on pcb board Some LED chips 220 on 210；Pcb board 210 is arranged on body 100, also, some LED chips 220 are correspondingly arranged at the back of the body To on the pcb board 210 of ring groove 120.

In order to improve the radiating efficiency of pcb board 210, for example, pcb board 210 is circle, its radius size is equal to the body 100 radius size.Since the body 100 is cylinder, circular pcb board 210 is coaxially disposed with the body 100, and It is fixed on the lid 140.For example, being provided with some bolt apertures on pcb board 210, corresponding, the lid 140 is provided with With the matched some threaded holes of the bolt apertures, pcb board 210, which is spirally connected, to be fixed on the lid 140.For example, pcb board 210 exists Edge is wherein symmetrically arranged with two bolt apertures on the both sides of a diameter, corresponding, both sides of the lid 140 along a wherein diameter On symmetrically offer two threaded holes matched with the bolt apertures, pcb board 210, which is spirally connected, to be fixed on the lid 140.This Sample, by the way that PCB lamps are fixed on the lid 140, it is fully abutted with 140 surface of lid so that on pcb board 210 Heat be able to be rapidly transferred on the lid 140.

Radiating efficiency is caused to decline since contact is uneven in order to prevent, for example, pcb board 210 is fixed by heat-conducting silicone grease On the body 100.That is, the one side of pcb board 210 towards the lid 140 is provided with one layer of heat-conducting silicone grease, make The heat that pcb board 210 produces is obtained to conduct to the lid 140 by the heat-conducting silicone grease.Efficiently solve due to pcb board 210 On scolding tin pin cause pcb board 210 to contact uneven the problem of causing radiating efficiency low with the lid 140, also, at this Under the action of heat-conducting silicone grease so that pcb board 210 is more smoothly fixed on the lid 140, increases the safety of LED light 20 Property and stability.

In order to improve the radiating efficiency of LED chip 220, for example, some LED chips 220 are distributed in pcb board into circular array On 210.For example, pcb board 210 is toroidal, some LED chips 220 are outwards divided into circular array along 210 center of circle of pcb board Cloth.For example, some LED chips 220 are distributed on the pcb board 210 of the circular groove 130 into circular array.It is in this way, some LED chip 220 work caused by heat will be conducted by the coolant for being filled in the circular groove 130 to outside so that Reach the effect of quick heat radiating.

In order to improve the radiating efficiency of LED chip 220, for example, some LED chips 220 are divided in pcb board 210 into annular shape On.That is, some LED chips 220 are arranged on the pcb board 210 of the ring groove 120, i.e., along the circle Ring groove 120 is distributed on pcb board 210 into annular shape.In this way, some LED chips 220 work caused by heat will be by filling out The radiator filled in the ring groove 120 is conducted to outside, so as to reach the effect of quick heat radiating.

Referring to Fig. 7, for example, greeting lamp includes the light bar 30 being arranged in housing.For example, light bar 30 includes radiator 10th, the LED light and the wiring board 300 of connection radiator 10 being arranged on radiator 10, wherein, the radiator is above-mentioned Radiator described in one embodiment；For example, radiator 10 includes body 100 and the heat sink 110 being arranged on body 100, this Body 100 is cylinder, and LED light includes pcb board 210 and some LED chips 220 being arranged on pcb board 210, wiring board 300 Including fixed band and the conductor wire being arranged in parallel with fixed band, fixed band is arranged on body 100, and pcb board 210 is arranged on solid Surely take, some LED chips 220 are correspondingly arranged on the pcb board 210 of fixed band, and pcb board 210 is electrically connected with conductor wire. And for example, light bar 30 includes radiator 10, the LED light being arranged on radiator 10 and the wiring board 300 for connecting radiator 10, dissipates Hot device 10 includes body 100 and the heat sink 110 being arranged on body 100, and body 100 is cylinder, it is leaned on away from axle center The region of nearly outer wall offers ring groove 120, and ring groove 120 is used to filling heat dissipation crystal grain, and heat sink 110 is along body 100 outer wall is uniformly distributed, also, heat sink 110 is provided with thermal dispersant coatings, and LED light includes pcb board 210 and is arranged on PCB Some LED chips 220 on plate 210, wiring board 300 includes fixed band and the conductor wire being arranged in parallel with fixed band, fixed Band is arranged on body 100, and pcb board 210 is arranged on fixation and takes, and some LED chips 220 are correspondingly arranged at backwards to fixed band On pcb board 210, pcb board 210 is electrically connected with conductor wire.

In order to strengthen the practicality of light bar 30, wiring board 300 is flexible circuit board 300, i.e., the flexible circuit board 300 is to make The printed circuit made of flexible insulating substrate.Since it can be particularly suitable for daily life with free bend, winding and folding The needs of middle illumination, for example, the light bar 30 can be made to watchband, and using the power supply in wrist-watch, when user walks at night The light bar 30 on arm can be opened during road with illuminating road.And for example, which is installed on the shoulder belt of student's school bag, in advance If the light bar 30 shines opened the light bar 30 in upper class hour to remind the driver's deceleration for driving vehicle to allow for yellow, student OK, so as to be effectively protected the safety of going to school of student.

In the present embodiment, which is used in the lamp lighting of family, for example, using the light bar 30 as on ceiling Corner lamp.For example, using the light bar 30 as ground corner lamp.For example, using the light bar 30 as other ornament lamps.

For the ease of light bar 30 is mounted externally, for example, body 100 is provided with installation position, peace is offered on installation position Hole is filled, installation position is used for by mounting hole that radiator 10 is mounted externally.For example, light bar 30 is installed on by wall by installation position On wall, used as ornament lamp.And for example, light bar 30 is installed on corridor by installation position, as the lamp body of sensing lamp, relatively Conventional bulb burns out situation of the rear corridor without illumination, and light bar 30 possesses numerous LED chips 220 due to it so that in a certain LED Corridor still can improve user experience with bright light when chip 220 breaks down.

Taken in order to which LED light is installed on fixation, for example, fixed band offers mounting groove, pcb board 210 is contained in installation Groove.For example, the mounting groove is and the matched circular mounting groove of pcb board 210.For example, being additionally provided with adhesive on pcb board 210, lead to Cross the adhesive fixation of pcb board 210 is placed in the mounting groove.For example, the height of mounting groove is equal to the thickness of pcb board 210, So that fixed belt surface is more smooth, beneficial to the encapsulation operation in later stage.In other embodiment, conductor wire and fixed band one into Type, that is to say, that fixed to take the support plate for being integrated with LED drive circuit and installing LED chip 220.

In order to make pcb board 210 with fixed with being preferably electrically connected, for example, mounting groove is provided with conductive bit, the conduction Line is connected in conductive bit.Pcb board 210 is provided with and conductive bit is matched connects current potential, and conductive bit is electrically connected with connecing current potential.Example Such as, conductive bit is wire connection terminal.For example, conductive bit is electrically connected with connecing the plug-in that electrically connects as of current potential, in order to assemble.Due to Wire connection terminal, which is adopted, to be screwed, and ensures reliable contacts and by enough electric currents to drive LED chip 220.

In order to avoid causing pcb board 210 and fixed band loose contact due to loosening, for example, pcb board 210 leads to mounting groove Cross heat conductive silica gel encapsulation.For example, the fixation away from mounting groove surrounding takes and is additionally provided with fixing groove, which is mounted with Plastic lens, is filled with heat conductive silica gel between plastic lens and pcb board 210.For example, the fixation away from mounting groove surrounding takes also Fixing groove is provided with, which is mounted with plastic lens, and heat conductive silica gel is filled between plastic lens and pcb board 210, Phosphor powder layer is additionally provided between pcb board 210 and LED chip 220.For example, the fixation away from mounting groove surrounding takes and also sets up There is fixing groove, which is mounted with plastic lens, and heat conductive silica gel, PCB are filled between plastic lens and pcb board 210 Phosphor powder layer is additionally provided between plate 210 and LED chip 220.Preferably, which is phonon thermal conductance heat-conducting cream.In this way, By the effect of heat conductive silica gel and plastic lens, LED chip 220 can be fixed in light bar 30, avoided due to LED chip 220 loosening causes bad electrical contact, reduces user experience.

Referring to Fig. 9, for example, the radiator in greeting lamp 40 can also apply to other lighting devices 50, for example, according to Bright device 50 includes radiator 10, the LED light being arranged on radiator 10 and the wiring board 300 for connecting radiator 10, heat dissipation Device 10 includes body 100 and the heat sink 110 being arranged on body 100, and body 100 is cylinder, and heat sink 110 is along originally The outer wall of body 100 is uniformly distributed, and LED light includes pcb board 210 and some LED chips 220 being arranged on pcb board 210, line Road plate 300 includes fixed band and the conductor wire being arranged in parallel with fixed band, and fixed band is arranged on body 100, pcb board 210 It is arranged on fixation to take, the pcb board 210 is electrically connected with conductor wire, and fixed band, which is provided with, fastens position and with fastening position The buckling parts matched somebody with somebody.Fasten position to match with buckling parts, for the button of lighting device 50 to be hung over outside.

In order to improve radiating efficiency, for example, radiator 10 includes body 100 and the heat sink being arranged on body 100 110, body 100 is cylinder, and heat sink 110 is uniformly distributed along the outer wall of body 100, also, the heat sink 110 is set There are thermal dispersant coatings, LED light includes pcb board 210 and some LED chips 220 being arranged on pcb board 210, wiring board 300 wrap Fixed band and the conductor wire being arranged in parallel with fixed band are included, fixed band is arranged on body 100, and pcb board 210 is arranged on fixation Take, the pcb board 210 is electrically connected with conductor wire, and fixed band, which is provided with, fastens position and the matched buckling parts with fastening position. Fasten position to match with buckling parts, for the button of lighting device 50 to be hung over outside.

In order to improve radiating efficiency, for example, LED light includes pcb board 210 and some LED being arranged on pcb board 210 Chip 220, wiring board 300 include fixed band and the conductor wire being arranged in parallel with fixed band, and fixed band is arranged on body 100 On, pcb board 210 is arranged on fixation and takes, and some LED chips are correspondingly arranged at the pcb board backwards to the fixed band On 210, the pcb board 210 is electrically connected with conductor wire, and fixed band, which is provided with, fastens position and the matched fastening with fastening position Portion.Fasten position to match with buckling parts, for the button of lighting device 50 to be hung over outside.

In order to improve fastening intensity, for example, fastening position and a portion that buckling parts is respectively four-part button.For example, should Four-part button is snak link.By fastening position, which can be detained and hang over outside.For example, button is hung on arm.

Referring to Fig. 9, in order to improve the radiating efficiency of lighting device 50, for example, 100 lateral wall of body radiates positioned at two Region between piece 110 is provided with some thrermostatic bimetal-plates 500.Thrermostatic bimetal-plate 500 is pair with active layers and passive layer Layer sheet metal, the higher referred to as active layers of thermal expansion coefficients, the relatively low referred to as passive layer of the coefficient of expansion, works as thrermostatic bimetal-plate 500 it is heated when, the deformation of active layers is greater than the deformation of passive layer, so that the entirety of thrermostatic bimetal-plate 500 will be to passive layer Curving.For example, the region between two heat sinks 110 of 100 lateral wall of body is fixed in one end of its active layers, separately It is close to body 100 in one end.So that when thermo bimetal is thermally deformed, active layers are bent to the direction away from 100 outer wall of body, So as to increase heat dissipation area.

In order to further improve the radiating efficiency of lighting device 50, for example, thrermostatic bimetal-plate 500 is along the outer of body 100 Periphery is evenly distributed on the region between two heat sinks 110, i.e. some 500 stacked distributions of thrermostatic bimetal-plate.For example, with always Two thrermostatic bimetal-plates 500 are provided with line, are respectively the first thrermostatic bimetal-plate 500 and the second thrermostatic bimetal-plate 500, the first heat is double It is free end that wherein one end of sheet metal 500, which is fixed on body 100 close to the side of the pcb board 210, the other end, it is close to Body 100.Wherein one end of second thrermostatic bimetal-plate 500 is fixed on the body below the free end of the first thrermostatic bimetal-plate 500 On 100, the other end is close to body 100.Preferably, it is additionally provided with graphite between the first thrermostatic bimetal-plate and the second thrermostatic bimetal-plate Layer.For example, the thickness of the graphite linings is 5-25nm；And for example, the graphite linings include some graphite powders.

In order to reach more preferable heat dissipation effect, for example, active layers are manganin manganin alloy, it includes each group of following mass parts Point：Mn：22~43 parts, Ni：38~65 parts, Cu：12~23 parts.And for example, Mn：12~33 parts, Ni：58~75 parts, Cu：12~33 Part.And for example, Mn：23~35 parts, Ni：58~85 parts, Cu：8~13 parts.In order to reach more preferable heat dissipation effect, for example, active layers For nichrome, it includes each component of following mass parts：Fe：32~43 parts, Cr：18~35 parts, Ni：52~73 parts.Example Such as, Fe：42~53 parts, Cr：9~15 parts, Ni：62~75 parts.And for example, Fe：22~35 parts, Cr：18~25 parts, Ni：52~85 Part.In order to reach more preferable heat dissipation effect, for example, active layers are nicalloy, it includes each component of following mass parts： Fe：22~33 parts, Mn：18~45 parts, Ni：42~78 parts.For example, Fe：32~43 parts, Mn：12~34 parts, Ni：55~69 parts.

In order to reach more preferable heat dissipation effect, for example, passive layer is dilval, it includes each group of following mass parts Point：Ni：38~55 parts, Fe：45~62 parts.And for example, Ni：45~61 parts, Fe：39~55 parts.

In this way, when thrermostatic bimetal-plate 500 is heated, two thrermostatic bimetal-plates 500 when uneven heating is even different due to bending, so And after the first 500 heated bending of thrermostatic bimetal-plate, the free end of the first thrermostatic bimetal-plate 500 is hanging, at this time, heat conduction To the second thrermostatic bimetal-plate 500,500 heated bending of the second thrermostatic bimetal-plate, since the free end of the first thrermostatic bimetal-plate 500 hangs It is empty and reply to the topic on body 100 after cooling down, at this time, the heat on body 100 conduct again to the first thrermostatic bimetal-plate 500 from By holding, and reduce conduction to the second thrermostatic bimetal-plate 500 heat, at this time the free end of the second thrermostatic bimetal-plate 500 cool back Patch, the free end heated bending of the first thrermostatic bimetal-plate 500, so that reach continuous alternating bending and money order receipt to be signed and returned to the sender to body 100, into And improve the radiating efficiency of lighting device 50.

Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, the scope that this specification is recorded all is considered to be.

Embodiment described above only expresses the several embodiments of the present invention, its description is more specific and detailed, but simultaneously Cannot therefore it be construed as limiting the scope of the patent.It should be pointed out that come for those of ordinary skill in the art Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.

Claims (10)

1. a kind of greeting lamp, it is characterised in that including housing, radiator, the LED light being arranged on the radiator, Yi Jilian The wiring board of the radiator is connect,

The radiator includes body and the heat sink being arranged on the body,

The heat sink is uniformly distributed along the outer peripheral edge of the body,

Each heat sink layer is laminated with a graphite heat radiation fin, and the graphite heat radiation fin is provided with adhesive layer, for graphite to be dissipated Backing is pasted onto on the heat sink；

The one end of the heat sink away from the body is provided with bending part, and the bending part is provided with some heat dissipation hangnails, if The dry heat dissipation hangnail is uniformly distributed along the bending part, and the bending part offers intercommunicating pore, and the intercommunicating pore, which is equipped with, leads Hot rod, some heat sinks are connected by the heat conducting bar；

At least one heat sink is also extended some radiating fins, and the area of the radiating fin is the face of the heat sink Long-pending 0.2%-0.8%；

The radiating fin includes：It is sequentially overlapped the first film layer, the second film layer, third membrane layer, the 4th film layer and the 5th of setting Film layer, the second film layer are attached in the first film layer, and third membrane layer is attached in the second film layer, and the 4th film layer is attached at third membrane layer On, the 5th film layer is attached in the 4th film layer；

Second film layer, the third membrane layer, the 4th film layer and the 5th thicknesses of layers ratio are 1~1.5：8~12： 5~7：6~10：2~2.5；

First filling adhesive layer is set between the first film layer and the second film layer, sets second to fill out between the second film layer and third membrane layer Adhesive layer is filled, the 3rd filling adhesive layer is provided between third membrane layer and the 4th film layer, is set between the 4th film layer and the 5th film layer The 4th filling adhesive layer is put, the first filling adhesive layer includes each component of following mass parts：800 parts of nano alumina particles ~1000 parts, 20 parts~30 parts of methyl vinyl silicone rubber, 40 parts~50 parts of vinyl silicone oil, dimethicone 80 parts~100 15 parts~20 parts of part and MQ silicones；The second filling adhesive layer includes each component of following mass parts：Nano aluminium oxide 15 parts of 600 parts of grain, 15 parts of methyl vinyl silicone rubber, 35 parts of vinyl silicone oil, 65 parts of dimethicone and MQ silicones, it is described 3rd filling adhesive layer includes each component of following mass parts：200 parts~600 parts of nano alumina particles, methyl ethylene silicon 5 parts~10 parts of 20 parts~40 parts of rubber, 20 parts~50 parts of vinyl silicone oil, 30 parts~100 parts of dimethicone and MQ silicones, The 4th filling adhesive layer includes each component of following mass parts：150 parts~450 parts of nano alumina particles, ethylene methacrylic 1 part of 15 parts~25 parts of base silicon rubber, 10 parts~25 parts of vinyl silicone oil, 80 parts~100 parts of dimethicone and MQ silicones~ 10 parts；

The LED light includes pcb board and some LED chips being arranged on the pcb board,

The wiring board includes fixed band and the conductor wire being arranged in parallel with the fixed band, the fixed band are arranged on described On body, the pcb board is arranged on the fixation and takes, and some LED chips are correspondingly arranged at backwards to the fixed band On the pcb board, the pcb board is electrically connected with the conductor wire,

The housing open up container and with the matched cover board of the container, the radiator, the LED light and the line Road plate is placed in the container.

2. greeting lamp according to claim 1, it is characterised in that the cover board is plastic products.

3. greeting lamp according to claim 2, it is characterised in that be provided with rotation on the housing of the container both sides Indexing, the cover board rotation are installed on the rotation position.

4. greeting lamp according to claim 3, it is characterised in that it is provided with encapsulation groove on the cover board, the radiator, The LED light and the wiring board are arranged at the encapsulation groove, also, the radiator, the LED light and the wiring board hold Put or expose to the container.

5. greeting lamp according to claim 4, it is characterised in that the LED light and the wiring board are packaged in the envelope Tankage.

6. greeting lamp according to claim 5, it is characterised in that the rotation position is provided with positioning part, the positioning part For adjusting the angle of the cover board and the housing.

7. greeting lamp according to claim 6, it is characterised in that the cover board the angle ranging from 30 with the housing Degree.

8. greeting lamp according to claim 6, it is characterised in that the cover board the angle ranging from 160 with the housing Degree.

9. greeting lamp according to claim 1, it is characterised in that the radiating fin exposed outside is in the housing.

10. greeting lamp according to claim 1, it is characterised in that the housing is additionally provided with fixed bit, the fixed bit For installing the greeting lamp.