CN104774579B - High-temperature-resistant pressure-sensitive adhesive tape and heat-resistant pressure-sensitive adhesive used by same - Google Patents
High-temperature-resistant pressure-sensitive adhesive tape and heat-resistant pressure-sensitive adhesive used by same Download PDFInfo
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- CN104774579B CN104774579B CN201510201288.3A CN201510201288A CN104774579B CN 104774579 B CN104774579 B CN 104774579B CN 201510201288 A CN201510201288 A CN 201510201288A CN 104774579 B CN104774579 B CN 104774579B
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Abstract
The invention relates to a high-temperature-resistant pressure-sensitive adhesive tape and a heat-resistant pressure-sensitive adhesive used by the same. The high-temperature-resistant pressure-sensitive adhesive tape comprises a substrate layer, a heat-resistant primer layer and a heat-resistant adhesive layer which are sequentially laminated. The heat-resistant pressure-sensitive adhesive comprises 40-80 parts of 2-acetaminoacrylic acid, 30-50 parts of ethylene glycol dimethacrylate, 10-20 parts of octadecyl acrylate, 2-10 parts of phenyltrimethoxy silane, 2-10 parts of vinyltriethoxysilane, 2-8 parts of gamma-(2,3-epoxy-propoxy)propyltrimethoxy silane, 1-6 parts of nano silicon dioxide, 1-3 parts of hexafluoro-2,4-acetyldione aluminum, 2-6 parts of polyethyleneglycol, 2-5 parts of emulsifier, 0.5-2 parts of initiator and 200-400 parts of deionized water. The prepared heat-resistant pressure-sensitive adhesive tape can work at 70-160 DEG C, can resist the high temperature of greater than 600 DEG C within a short time, and has the advantages of small surface compression deformation, wear resistance, impact resistance, heat resistance and abrasion resistance.
Description
Technical field
The present invention relates to a kind of high temperature resistant pressure sensitive adhesive band and its heat resistant pressure sensitive adhesive stick for using, belong to tape technology neck
Domain.
Background technology
With economic fast development, adhesive tape has been fully immersed into the use of all trades and professions and people's daily life
In.A kind of adhesive tape of specific type, by a kind of special adhesive（Pressure sensitive adhesive）It is applied on banding substrate and is made.Pressure sensitive adhesive is pressure-sensitive
The most important part of adhesive tape, its effect is adhesive tape is had to presser sensor adhesion characteristics.Under the effect of smaller pressure, pressure
Quick glue just can form firm bonding force, and the bonding force that it is formed between two articles surface is mainly Van der Waals force, therefore, glue
After junction is formed, the structure of gluing of surfaces is not destroyed.Because there is pressure sensitive adhesive easily glutinous, difficulty to take off, shell without damaging, for a long time
Inner glue layer is not solid, the features such as easy to use, is widely used in the numerous areas such as industrial, daily, medical.
Acrylate pressure-sensitive adhesive has excellent pressure-sensitive, adhesion, inoxidizability, light resistance and resistance to ag(e)ing due to it
The advantages of, it is widely used in all trades and professions, its yield accounts for more than the 65% of all pressure sensitive adhesive yield.Acrylate
Class pressure sensitive adhesive quick glue resistance to elevated temperatures more sub- than natural rubber type pressure sensitive adhesive and synthetic rubber type preferably, but special is built at some
Build, industrial circle, the heat resistance of the High temperature-resistanadhesive adhesive tape of usual demand generally between 120 DEG C~260 DEG C, and it is interior in short-term will
More than 500 DEG C.In the prior art, high-peeling strength, confining force high, cohesive force high and wide in range temperature in use can be provided simultaneously with
High-performance High temperature-resistanadhesive adhesive tape occur it is less.
The content of the invention
It is an object of the present invention to provide a kind of high temperature resistant pressure sensitive adhesive band and its heat resistant pressure sensitive adhesive stick for using.
To reach above-mentioned purpose, the first technical scheme that the present invention is used is：A kind of heat resistant pressure sensitive adhesive stick, it is described resistance to
The composition of raw materials of hot pressing sensitive adhesive includes the material of following weight portion：
40-80 parts of 2- acetamidoacrylic acids；
GDMA 30-50 parts；
Octadecyl acrylate 10-20 parts；
Phenyltrimethoxysila,e 2-10 parts；
VTES 2-10 parts；
γ-（2,3- glycidoxies）Propyl trimethoxy silicane 2-8 parts；
Nano silicon 1-6 parts；
1-3 parts of hexafluoro -2,4- pentanedione aluminium；
Polyethylene glycol 2-6 parts；
Emulsifying agent 2-5 parts；
Initiator 0.5-2 parts；
Deionized water 200-400 parts.
Preferred technical scheme is：The emulsifying agent is selected from lauryl sodium sulfate, neopelex, butanedioic acid
Sodium, cetyl PEO ether.
Preferred technical scheme is：The emulsifying agent is sodium succinate and cetyl PEO ether according to 1:1
The mixture that mass ratio is constituted.
Preferred technical scheme is：The initiator is potassium peroxydisulfate or ammonium persulfate.
To reach above-mentioned purpose, second technical scheme that the present invention is used is：A kind of high temperature resistant pressure sensitive adhesive band, including according to
The substrate layer of secondary stacking, heat-resisting primer layer and Heat-Resisting Adhesive layer.
Preferred technical scheme is：The material of the heat-resisting primer layer is organic siliconresin.
Preferred technical scheme is：The thickness of the heat-resisting primer layer is 0.05-0.3mm.
Preferred technical scheme is：The thickness of the heat-resisting primer layer is 0.05-0.1mm.
Preferred technical scheme is：The thickness of the heat resistant pressure sensitive adhesive stick is 0.2-0.6mm.
Preferred technical scheme is：Material of the composition of raw materials of the base material of the substrate layer comprising following masses percentage
Material：
Polyethylene terephthalate 78-80%；
Titanium dioxide 1.5-2.5%；
Aluminum oxide 2.5-3.5%；
Polyvinyl chloride 11-13%；
Polychlorostyrene 3.5-4.5%；
Dioctyl phthalate 1.5-2.5%.
Relevant content in above-mentioned technical proposal is explained as follows：
1st, in such scheme, 2- acetamidoacrylic acids and GDMA are the main list of emulsion-type pressure-sensitive
Body；
2nd, in such scheme, 2- acetamidoacrylic acids come from Hubei Ju Sheng Science and Technology Ltd.s, dimethacrylate second
Diol ester comes from Guangzhou Yuan Chuan Chemical Co., Ltd.s；
3rd, in such scheme, octadecyl acrylate is incorporated into the main chain of pressure sensitive adhesive polymer, due to octadecyl acrylate
Long alkyl chain can improve the compatibility of polyolefin and low surface energy substrates, acted on the increasing stick that this improves pressure sensitive adhesive, make
It has good adhesive effect with heat-resisting primer layer；
4th, in such scheme, octadecyl acrylate comes from Guangzhou Cai De Chemical Co., Ltd.s；
5th, in such scheme, phenyltrimethoxysila,e, VTES, γ-（2,3- glycidoxies）
Propyl trimethoxy silicane using as the organosilicon modifier of acrylate pressure-sensitive adhesive because the height of traditional polypropene pressure sensitive adhesive
Temperature stability is poor, it is difficult at high temperature with confining force high and stripping performance, it is also difficult to be bonded on the material of low-surface-energy,
And there is relatively low surface tension can soak and most of base materials are binded for organic pressure-sensitive gel, and with excellent water resistance,
The advantages of weatherability, cementability, low temperature flexibility and heat resistance, it is considered to be the expensive goods in adhesive, and in organosilicon
Phenyl and vinyl are introduced in modified pressure sensitive adhesive simultaneously, resistance to elevated temperatures and the stripping of organosilicon adhesive can be further improved
From intensity；
6th, in such scheme, VTES and phenyltrimethoxysila,e are new from Qufu City Huarong chemical industry
Materials Co., Ltd；
7th, in such scheme, γ-（2,3- glycidoxies）Propyl trimethoxy silicane is limited from the base industry of Shanghai one
Company；
8th, in such scheme, nano-silica silicon can improve glued membrane toughness reinforcing work in itself in being incorporated into polyene acid polymer
With, cohesive force is improved, because nano-particle has less dimensional effect, surface-interface effect, it should in pressure sensitive adhesive
Very big active force can be produced with other components.Then shown as base material-glue-line, glue-line-by the interface between glutinous material
The raising of bonding force, and the introducing of nano-particle can also improve the rheological property of glue-line, before glue-line bonding force is not damaged
Put, the thickness and the consumption using pressure sensitive adhesive of glue-line can be reduced to a certain degree, it is cost-effective.In further experiment of the present invention
It was found that, when with a certain proportion of γ-（2,3- glycidoxies）During propyl trimethoxy silicane modified nano-silica silicon, nanometer two
Close to 100%, the acrylate copolymer molecule for having more than 70% is grafted to the surface of silica, this raising to the envelop rate of silica
Dispersiveness of the nano silicon in acrylate copolymer；
9th, in such scheme, nano-silica silicon comes from Beijing Deco Dao Jin Science and Technology Ltd.s；
10th, in such scheme, hexafluoro -2,4- pentanediones aluminium is crosslinking agent, and hexafluoro -2,4- pentanediones are found in the present invention
Aluminium plays the role of uniqueness to pressure sensitive adhesive, and viscosity reduces with the rising of temperature during beginning, when temperature is risen to after 150 degree,
Viscosity rises with temperature again.This is that traditional crosslinking agent typically has a softening at 20 degree and 60 degree or so to pressure sensitive adhesive
Point, and hexafluoro -2,4- pentanedione aluminium make pressure sensitive adhesive in 150 degree or so many softening points, and this is matching somebody with somebody due to aluminium cross-linked point
Body exchanges the chelation occurred with the carboxyl in main chain.Can be led in the thawing of heat time alkyl side chain long and crystallization
The reversible transition of viscosity is caused, the mobility of main chain can strengthen the cooperation exchange interaction in aluminium cross-linked point, this considerably increases pressure
The cohesive force of quick glue, improves its heat resistance；
11st, in such scheme, hexafluoro -2,4- pentanediones aluminium comes from lark prestige Science and Technology Ltd.；
12nd, in such scheme, polyethylene glycol can be used together with emulsifying agent, strengthen they lubricity, moisture retention, point
Dissipate property, cementability；
13rd, in such scheme, emulsifying agent is lauryl sodium sulfate, neopelex, sodium succinate and 16
The mixing of the one or two kinds of of alkyl polyoxyethylene ether, the preferably mixing of sodium succinate and cetyl PEO ether
Thing, mixed weight compares 1:1；
14th, in such scheme, initiator is potassium peroxydisulfate（KPS）Or ammonium persulfate（APS）In one kind, preferred persulfuric acid
Potassium；
15th, in such scheme, the preparation method of heat resistant pressure sensitive adhesive stick, including step in detail below：
（1）It is prepared by pre-emulsion
According to composition of raw materials, by 2- acetamidoacrylic acids, GDMA, emulsifying agent, initiator, third
Olefin(e) acid octadecyl ester, phenyltrimethoxysila,e, VTES, hexafluoro -2,4- pentanediones aluminium, polyethylene glycol and
The deionized water mixing of 250-300g, obtains pre-emulsion after pre-emulsification；
（2）Emulsion polymerization
By the deionized water of 100-150g, corresponding weight portion γ-（2,3- glycidoxies）Propyl trimethoxy silicane,
Nano silicon is added in reactor, and 70-80 DEG C are warmed up under the stirring of 200- 500r/min rotating speeds, then will be above-mentioned
Obtained pre-emulsion is instilled in the above-mentioned reactor of addition, is dripped off within 2-3 hours, and keeping temperature is reacted 1-2 hours, then heats to 82
- 85 DEG C, continue insulation reaction 1 hour, be down to room temperature, discharging, filtering, obtain polymerized emulsion.
The heat-resisting primer layer of organic siliconresin is coated on substrate layer, then by step（2）Obtained pressure-sensitive adhesive is coated on
It is heat resistant pressure sensitive adhesive band processed after being dried at 120 DEG C on above-mentioned primer layer.
Because above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art：
Heat resistant pressure sensitive adhesive band prepared by the present invention can work at 70 DEG C to 160 DEG C, and high temperature resistant can be more than 600 in short-term
DEG C, and surface compression deformation is small, possesses wear-resisting, impact resistance, heat-resisting, wear-resisting premium properties.
Brief description of the drawings
Accompanying drawing 1 is high temperature resistant pressure sensitive adhesive band cross-sectional view.
In the figures above, 1, substrate layer；2nd, heat-resisting primer layer；3rd, Heat-Resisting Adhesive layer.
Specific embodiment
Below in conjunction with the accompanying drawings and embodiment the invention will be further described.
Embodiment one：A kind of high temperature resistant pressure sensitive adhesive band and its heat resistant pressure sensitive adhesive stick for using；
A kind of heat resistant pressure sensitive adhesive stick, the composition of raw materials of the heat resistant pressure sensitive adhesive stick includes the material of following weight portion：
2- acetamidoacrylic acids 50g；
GDMA 40g；
Octadecyl acrylate 15g；
Phenyltrimethoxysila,e 3g；
VTES 5g；
γ-（2,3- glycidoxies）Propyl trimethoxy silicane 4g；
Nano silicon 4g；
Hexafluoro -2,4- pentanedione aluminium 2g；
Polyethylene glycol 3g；
Emulsifying agent 2g；
Initiator 1g；
Deionized water 300g；
The preparation method of heat resistant pressure sensitive adhesive stick, including step in detail below：
（1）It is prepared by pre-emulsion
According to composition of raw materials by 2- acetamidoacrylic acids, GDMA, emulsifying agent dodecyl sulphur
Sour sodium, initiator potassium persulfate, octadecyl acrylate, phenyltrimethoxysila,e, VTES, hexafluoro -2,
The deionized water mixing of 4- pentanediones aluminium, polyethylene glycol and 200g, obtains pre-emulsion after pre-emulsification；
（2）Emulsion polymerization
By the deionized water of 100g, γ-（2,3- glycidoxies）Propyl trimethoxy silicane, nano silicon are added
To in reactor, 75 DEG C are warmed up under the stirring of 300r/min rotating speeds, it is above-mentioned anti-that pre-emulsion obtained above then is instilled into addition
Answer in device, drip off within 2 hours, keeping temperature is reacted 1.5 hours, then heat to 82 DEG C, continue insulation reaction 1 hour, be down to room
Temperature, discharging, filtering, obtain polymerized emulsion and are.
It is that organic siliconresin is coated on substrate layer 1 by heat-resisting primer layer 1, then by step（2）Obtained high temperature resistant pressure sensitive adhesive
Stick is coated on the heat-resisting primer layer primer layer of organic siliconresin, is heat resistant pressure sensitive adhesive band processed after being dried at 120 DEG C.It is obtained resistance to
The structure of temperature pressure sensitive band referring to shown in accompanying drawing 1, high temperature resistant pressure sensitive adhesive band, including substrate layer 1, the heat-resisting primer for stacking gradually
Layer 2 and Heat-Resisting Adhesive layer 3.Substrate layer selects Kapton.The thickness of the heat-resisting primer layer 2 is 0.1mm.It is described
The thickness of heat resistant pressure sensitive adhesive stick is 0.3mm.The selection requirement of base material is high temperature resistant, can be selected in other specific embodiments
Select such as polyether sulfone, polyether-ether-ketone, polyamide-imide.
Embodiment two：A kind of high temperature resistant pressure sensitive adhesive band and its heat resistant pressure sensitive adhesive stick for using；
A kind of heat resistant pressure sensitive adhesive stick, the composition of raw materials of the heat resistant pressure sensitive adhesive stick includes the material of following weight portion：
2- acetamidoacrylic acids 70g；
GDMA 30g；
Octadecyl acrylate 12g；
Phenyltrimethoxysila,e 5g；
VTES 5g；
γ-（2,3- glycidoxies）Propyl trimethoxy silicane 6g；
Nano silicon 5g；
Hexafluoro -2,4- pentanedione aluminium 2g；
Polyethylene glycol 5g；
Emulsifying agent 3g；
Initiator 2g；
Deionized water 350g；
The preparation method of heat resistant pressure sensitive adhesive stick, including step in detail below：
（1）It is prepared by pre-emulsion
According to composition of raw materials by 2- acetamidoacrylic acids, GDMA, emulsifying agent, initiator, third
Olefin(e) acid octadecyl ester, phenyltrimethoxysila,e, VTES, hexafluoro -2,4- pentanediones aluminium, polyethylene glycol and
The deionized water mixing of 250g, obtains pre-emulsion after pre-emulsification.The emulsifying agent is sodium succinate and cetyl polycyclic oxygen second
Alkane ether is according to 1:The mixture that 1 mass ratio is constituted.The initiator is ammonium persulfate；
（2）Emulsion polymerization
By the deionized water of 100g, respective quality part γ-（2,3- glycidoxies）Propyl trimethoxy silicane, nanometer
Silica is added in reactor, and 78 DEG C are warmed up under the stirring of 400r/min rotating speeds, then drips pre-emulsion obtained above
Enter to add in above-mentioned reactor, drip off within 3 hours, keeping temperature is reacted 2 hours, then heat to 85 DEG C, continue insulation reaction 1 small
When, room temperature, discharging, filtering are down to, obtain polymerized emulsion as heat resistant pressure sensitive adhesive stick.
Organosilicon primer layer is coated on substrate layer, then by step（2）Obtained pressure-sensitive adhesive is coated on above-mentioned bottom
It is heat resistant pressure sensitive adhesive band processed after being dried at 120 DEG C on glue-line.It is that organic siliconresin is coated on substrate layer 1 by heat-resisting primer layer 1,
Again by step（2）Obtained high temperature resistant pressure sensitive adhesive stick is coated on the heat-resisting primer layer primer layer of organic siliconresin, in 120 DEG C of bakings
It is heat resistant pressure sensitive adhesive band processed after dry.The structure of obtained high temperature resistant pressure sensitive adhesive band referring to shown in accompanying drawing 1, high temperature resistant pressure sensitive adhesive band,
Including the substrate layer 1, heat-resisting primer layer 2 and the Heat-Resisting Adhesive layer 3 that stack gradually.The thickness of the heat-resisting primer layer 2 is
0.08mm.The thickness of the heat resistant pressure sensitive adhesive stick is 0.4mm.The composition of raw materials of base material includes：Polyester film accounts for 79%, dioxy
Change titanium and account for 2%, aluminum oxide and account for 3%, polyvinyl chloride and account for 12%, polychlorostyrene and account for 4%, dioctyl phthalate and account for 2%.In solvent
Base material is obtained final product after middle polymerization.
Embodiment three：A kind of high temperature resistant pressure sensitive adhesive band and its heat resistant pressure sensitive adhesive stick for using；
A kind of heat resistant pressure sensitive adhesive stick, the composition of raw materials of the heat resistant pressure sensitive adhesive stick includes the material of following weight portion：
2- acetamidoacrylic acids 50g；
GDMA 50g；
Octadecyl acrylate 20g；
Phenyltrimethoxysila,e 4g；
VTES 4g；
γ-（2,3- glycidoxies）Propyl trimethoxy silicane 3g；
Nano silicon 6g；
Hexafluoro -2,4- pentanedione aluminium 3g；
Polyethylene glycol 2g；
Emulsifying agent 2g；
Initiator 0.8g；
Deionized water 250g；
The preparation method of heat resistant pressure sensitive adhesive stick, including step in detail below：
（1）It is prepared by pre-emulsion
According to composition of raw materials by 2- acetamidoacrylic acids, GDMA, emulsifying agent detergent alkylate
Sodium sulfonate, initiator potassium persulfate, octadecyl acrylate, phenyltrimethoxysila,e, VTES, hexafluoro-
The deionized water mixing of 2,4- pentanedione aluminium, polyethylene glycol and 170g, obtains pre-emulsion after pre-emulsification；
（2）Emulsion polymerization
By the deionized water of 80g, respective quality part γ-（2,3- glycidoxies）Propyl trimethoxy silicane, nanometer
Silica is added in reactor, 74 DEG C is warmed up under the stirring of 500r/min rotating speeds, then by pre-emulsion obtained above
Instill in the above-mentioned reactor of addition, drip off within 2.5 hours, keeping temperature is reacted 2 hours, then heat to 83 DEG C, continue insulation anti-
Answer 1 hour, room temperature, discharging, filtering are down to, obtain polymerized emulsion as heat resistant pressure sensitive adhesive stick.
It is that organic siliconresin is coated on substrate layer 1 by heat-resisting primer layer 1, then by step（2）Obtained high temperature resistant pressure sensitive adhesive
Stick is coated on the heat-resisting primer layer primer layer of organic siliconresin, is heat resistant pressure sensitive adhesive band processed after being dried at 120 DEG C.It is obtained resistance to
The structure of temperature pressure sensitive band referring to shown in accompanying drawing 1, high temperature resistant pressure sensitive adhesive band, including substrate layer 1, the heat-resisting primer for stacking gradually
Layer 2 and Heat-Resisting Adhesive layer 3.Substrate layer selects Kapton.The thickness of the heat-resisting primer layer 2 is 0.1mm.It is described
The thickness of heat resistant pressure sensitive adhesive stick is 0.6mm.
Example IV：A kind of high temperature resistant pressure sensitive adhesive band and its heat resistant pressure sensitive adhesive stick for using；
A kind of heat resistant pressure sensitive adhesive stick, the composition of raw materials of the heat resistant pressure sensitive adhesive stick includes the material of following weight portion：
2- acetamidoacrylic acids 60g；
GDMA 40g；
Octadecyl acrylate 10g；
Phenyltrimethoxysila,e 5g；
VTES 3g；
γ-（2,3- glycidoxies）Propyl trimethoxy silicane 3g；
Nano silicon 3g；
Hexafluoro -2,4- pentanedione aluminium 3g；
Polyethylene glycol 6g；
Emulsifying agent 3g；
Initiator 2g；
Deionized water 280g；
The preparation method of heat resistant pressure sensitive adhesive stick, including step in detail below：
（1）It is prepared by pre-emulsion
By the 2- acetamidoacrylic acids of described mass parts, GDMA, emulsifying agent sodium succinate,
Initiator potassium persulfate, octadecyl acrylate, phenyltrimethoxysila,e, VTES, hexafluoro -2,4- penta 2
The deionized water mixing of ketone aluminium, polyethylene glycol and 180g, obtains pre-emulsion after pre-emulsification；
（2）Emulsion polymerization
By the deionized water of 100-150g, respective quality part γ-（2,3- glycidoxies）Propyl trimethoxy silicane,
Nano silicon is added in reactor, 77 DEG C is warmed up under the stirring of 450r/min rotating speeds, then by pre- breast obtained above
Drop enters to add in above-mentioned reactor, drips off within 2 hours, and keeping temperature is reacted 2 hours, then heats to 84 DEG C, continues to be incubated instead
Answer 1 hour, room temperature, discharging, filtering are down to, obtain polymerized emulsion as heat resistant pressure sensitive adhesive stick.
It is that organic siliconresin is coated on substrate layer 1 by heat-resisting primer layer 1, then by step（2）Obtained high temperature resistant pressure sensitive adhesive
Stick is coated on the heat-resisting primer layer primer layer of organic siliconresin, is heat resistant pressure sensitive adhesive band processed after being dried at 120 DEG C.It is obtained resistance to
The structure of temperature pressure sensitive band referring to shown in accompanying drawing 1, high temperature resistant pressure sensitive adhesive band, including substrate layer 1, the heat-resisting primer for stacking gradually
Layer 2 and Heat-Resisting Adhesive layer 3.Substrate layer selects Kapton.The thickness of the heat-resisting primer layer 2 is 0.1mm.It is described
The thickness of heat resistant pressure sensitive adhesive stick is 0.3mm.
Relevant test method is as follows：
（1）Polymerization process and emulsion appearance：Visually observe；
（2）Storage stability：Emulsion is stood at ambient temperature, observation whether there is precipitation to be produced；
（3）Initial bonding strength is tested：From 6032 adhesive tape retention testing machines（MIDEL KJ-6032, Dongguan City section builds detection
Instrument Ltd.）, tested according to GB/T4852~2002, initial bonding strength size is represented with ball number；
（4）Holding power：From temperature mode adhesive tape retention testing machine（MIDEL KJ-6012, Dongguan City section builds detecting instrument
Co., Ltd）, to be tested according to GB/T4851~1998, the time dropped with adhesive tape failure by shear calculates holding power；
（5）180 ° of peel strengths：From computermatic tensile testing machine（MIDEL KJ-1065A, Dongguan City section builds detector
Device Co., Ltd）, tested according to GB/T2792~1998；
（6）High temperature holding power：From temperature mode adhesive tape retention testing machine（MIDEL KJ-6012, Dongguan City section builds detection
Instrument Ltd.）, holding power test is carried out at 100 DEG C, the resistance to elevated temperatures of pressure sensitive adhesive tape is assessed with this.
Embodiment material properties test result:
| Test event | Embodiment one | Embodiment two | Embodiment three | Example IV |
| Polymerization process | Stabilization | Stabilization | Stabilization | Stabilization |
| Storage stability | >8 months | >8 months | >8 months | >8 months |
| Initial bonding strength is tested | No. 17 | No. 15 | No. 19 | No. 21 |
| Holding power | >1 month | >1 month | >1 month | >1 month |
| 180 ° of peel strengths | 304.5N/m | 344.2N/m | 347.3N/m | 301.2N/m |
| High temperature holding power | 23 minutes 3 hours | 45 minutes 4 hours | 13 minutes 5 hours | 14 minutes 4 hours |
The above embodiments merely illustrate the technical concept and features of the present invention, its object is to allow person skilled in the art
Scholar will appreciate that present disclosure and implement according to this that it is not intended to limit the scope of the present invention.It is all according to the present invention
The equivalent change or modification that Spirit Essence is made, should all be included within the scope of the present invention.
Claims (10)
1. a kind of heat resistant pressure sensitive adhesive stick, it is characterised in that：The composition of raw materials of the heat resistant pressure sensitive adhesive stick includes following weight
The material of part：
40-80 parts of 2- acetamidoacrylic acids；
GDMA 30-50 parts；
Octadecyl acrylate 10-20 parts；
Phenyltrimethoxysila,e 2-10 parts；
VTES 2-10 parts；
γ-（2,3- glycidoxies）Propyl trimethoxy silicane 2-8 parts；
Nano silicon 1-6 parts；
1-3 parts of hexafluoro -2,4- pentanedione aluminium；
Polyethylene glycol 2-6 parts；
Emulsifying agent 2-5 parts；
Initiator 0.5-2 parts；
Deionized water 200-400 parts.
2. heat resistant pressure sensitive adhesive stick according to claim 1, it is characterised in that：The emulsifying agent is selected from dodecyl sulphate
Sodium, neopelex, sodium succinate, cetyl PEO ether.
3. heat resistant pressure sensitive adhesive stick according to claim 2, it is characterised in that：The emulsifying agent is sodium succinate and 16
Alkyl polyoxyethylene ether is according to 1:The mixture that 1 mass ratio is constituted.
4. heat resistant pressure sensitive adhesive stick according to claim 1, it is characterised in that：The initiator is potassium peroxydisulfate or over cure
Sour ammonium.
5. the high temperature resistant pressure sensitive adhesive that prepared by the heat resistant pressure sensitive adhesive stick described in a kind of use Claims 1 to 4 any claim
Band, it is characterised in that：Including the substrate layer, heat-resisting primer layer and the heat resistant pressure sensitive adhesive stick that stack gradually.
6. high temperature resistant pressure sensitive adhesive band according to claim 5, it is characterised in that：The material of the heat-resisting primer layer is organic
Silicones.
7. high temperature resistant pressure sensitive adhesive band according to claim 5, it is characterised in that：The thickness of the heat-resisting primer layer is
0.05-0.3mm。
8. high temperature resistant pressure sensitive adhesive band according to claim 7, it is characterised in that：The thickness of the heat-resisting primer layer is
0.05-0.1mm。
9. high temperature resistant pressure sensitive adhesive band according to claim 5, it is characterised in that：The thickness of the heat resistant pressure sensitive adhesive stick is
0.2-0.6mm。
10. high temperature resistant pressure sensitive adhesive band according to claim 5, it is characterised in that：The raw material of the base material of the substrate layer is matched somebody with somebody
Material of the side comprising following masses percentage：
Polyethylene terephthalate 78-80%；
Titanium dioxide 1.5-2.5%；
Aluminum oxide 2.5-3.5%；
Polyvinyl chloride 11-13%；
Polychlorostyrene 3.5-4.5%；
Dioctyl phthalate 1.5-2.5%.
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| CN201510201288.3A CN104774579B (en) | 2015-04-24 | 2015-04-24 | High-temperature-resistant pressure-sensitive adhesive tape and heat-resistant pressure-sensitive adhesive used by same |
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|---|---|---|---|
| CN201510201288.3A CN104774579B (en) | 2015-04-24 | 2015-04-24 | High-temperature-resistant pressure-sensitive adhesive tape and heat-resistant pressure-sensitive adhesive used by same |
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| CN111019549A (en) * | 2019-11-07 | 2020-04-17 | 南京清尚新材料科技有限公司 | Acid and alkali resistant cold-seal adhesive, preparation method thereof and adhesive tape prepared from same |
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| CN1305988C (en) * | 2005-09-23 | 2007-03-21 | 浙江大学 | Prepn of organosilicon modified pressure-sensitive acrylate adhesive |
| CN100425631C (en) * | 2006-10-24 | 2008-10-15 | 河北工业大学 | Poly acrylate composite emulsion for pressure' sensitive adhesive and its preparing and using method |
| CN101423734B (en) * | 2008-12-05 | 2011-03-16 | 武汉科技学院 | Method for preparing organosilicon modified acrylic ester binding agent |
| CN102604006B (en) * | 2012-03-09 | 2014-04-30 | 太原理工大学 | Preparation method for acidic silica sol in-situ modified acrylate emulsion |
| CN104356978B (en) * | 2014-12-03 | 2015-08-12 | 张亦彬 | A kind of preparation method of binding agent |
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| CN111019549A (en) * | 2019-11-07 | 2020-04-17 | 南京清尚新材料科技有限公司 | Acid and alkali resistant cold-seal adhesive, preparation method thereof and adhesive tape prepared from same |
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| CN104774579A (en) | 2015-07-15 |
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Address after: 215000 1 1 Cao Feng Road, Xu Kou Town, Wuzhong District, Suzhou, Jiangsu. Patentee after: Suzhou New Guangyi Electronics Co.,Ltd. Address before: 215000 No. 289, Cao Feng Road, Xu Kou Town, Wuzhong District, Suzhou, Jiangsu Patentee before: SUZHOU XINGUANGYI ELECTRONICS Co.,Ltd. |