CN104772947B - Plate nickel chromium triangle part and its manufacture method - Google Patents
Plate nickel chromium triangle part and its manufacture method Download PDFInfo
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- CN104772947B CN104772947B CN201510105215.4A CN201510105215A CN104772947B CN 104772947 B CN104772947 B CN 104772947B CN 201510105215 A CN201510105215 A CN 201510105215A CN 104772947 B CN104772947 B CN 104772947B
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Abstract
Plating nickel chromium triangle part disclosed by the invention and its manufacture method, wherein plating nickel chromium triangle part includes base material；Coating is pre-processed, it is deposited over the whole substrate, is formed with copper plate and functional layer on pretreatment coating, it is formed on copper plate, wherein functional layer includes low potential nickel dam and the micropore nickel dam being formed on low potential nickel dam；And decorative layer, it is formed on micropore nickel dam.The present invention is by the basis of the micropore, chrome-plated process that parts surface is set, increase low potential nickel coating, so as to the decay resistance of the decay resistance, especially trivalent chromium chrome plating product that improve product, it can promote that more environmentally friendly trivalent chromium product is more massive to be applicable.
Description
Technical field
The present invention relates to a kind of workpiece and its electroplating technology with electroplating surface Rotating fields, particularly a kind of plating nickel-chrome
Part and its manufacture method.
Electrical potential difference is the difference of the standard electrode potential measured with adjacent two layers respectively as an entirety in the application.
Background technology
European market to the increasingly tighter of environmental requirement, and each automobile factory to electroplate it is corrosion proof require more and more higher,
Current chromium plating can not meet the corrosion requirement of specific environment (while reaching salt-fog resistant test 80h and resistance to Russian mud experiment
336h)。
Be normally applied in electroplating industry first plating double layer nickel or three layers of nickel again chromium plating method improve workpiece antiseptic power, quilt
Wide variety of double layer nickel technique has:Semi-gloss nickel+light nickel+flawless chromium, three layers of nickel technique being widely used have:Semi-gloss nickel+
Light nickel+microporous nickel+flawless chromium, or semi-gloss nickel+light nickel+micro-crack nickel+flawless chromium, but due to the stress of layers of chrome itself
Greatly, a kind of chromium electrodeposited coating (including Cr VI and trivalent chrome plating) completely without crackle or hole is industrially hardly resulted in, cruelly
Reveal after aerial chromium electrodeposited coating is passivated, its current potential than nickel just, when running into corrosive medium, just constitutes corrosion electricity with nickel dam
Pond, causes the corrosion of nickel dam, excessive corrosion occurs in extreme environment, causes the large area of surface layers of chrome to come off, influence production
The quality of product.In order to further improve the antiseptic power of coating, microporous nickel and micro-crack nickel are applied on light nickel coating, and it is made
With being, by different plating technologies, to promote product surface to produce substantial amounts of micro-crack or micropore, form substantial amounts of small corruption
Passage is lost, so that hot spot is divided into the point that can not recognize of naked eyes, coming off for layers of chrome is reduced, with during reaching and improving use
Exterior quality.It is limited to corrosion proof improve due to microporous nickel or micro-crack nickel is used alone；And micro-crack and three
Valency chromium coordinates, and there are problems that, causes the product for high corrosion resistant requirement to there is unworthiness.While the existing skill in part
In art, disclose change microporous nickel technique and reach noble potential characteristic, so as to meet trivalent chromium decay resistance requirement, but this this
Technology, which can not be realized, all meet the corrosion-resistant requirement of high-quality with Cr VI, trivalent chromium mixed production, two kinds of parts.
In the prior art, such as Chinese patent application (publication number：The A of CN 101988211) it is related to one kind with excellent anti-corrosion
The metal surface multiple layer nickel plating technique of performance, electroplating technology flow is：A. plastic part surface metallizes, and B. bright coppers, C. half is bright
Nickel, D. high-sulfur nickel E. bright nickels, F. microporous nickels, G. washings, H. light chromium, I. washings, J. is dried；Although being adopted in the technical scheme
The corrosion resistance for improving working of plastics to a certain extent is electroplated in frosting with four layers of nickel nickel plating solution, but should
The resistance to corrosion of technique is still unable to reach containing deicer salts (CaCl2) corrosive environment requirement.And relevant introduce micro-crack
The technique of nickel, such as Chinese patent application (publication number：CN101705508A) it is related to a kind of electroplate liquid electroplated for micro-crack nickel
And its apply, the main composition of the micro-crack nickel electroplate liquid is as follows：Nickel chloride：180~260 g/l, acetic acid：20~60 milliliters/
Rise, ELPELYT MR：80~120 ml ls, 62A：1~5 ml l, the actual limit of evaluation of the example described in patent document
Cr VI plating is made as, trivalent chromium plating is not referred to, while entering checking has a poor corrosion resistance, the phenomenon such as outward appearance is not met.
The content of the invention
To solve the above problems, nickel-chrome part is plated the invention discloses one kind, it is many by organically combining land productivity functional layer
The corrosion resistance characteristic and chemical property of layer nickel structure, both ensure that the shiny appearance characteristic of micropore nickel dam, have again comprising micro-
The dual corrosion resistance of the functional layer of hole nickel, can make product reach superelevation corrosion resistance and structural stability, even if in low potential nickel dam
After being corroded, micropore nickel dam can equally play the effect supported and delay corrosion.
Plating nickel-chrome part disclosed by the invention, the part includes：
Base material；Here base material of the present invention using metal, plastics and other can be applicable the part of plating.
Pre-processing coating, (pretreatment coating can include any in electroless nickel layer or bottoming nickel dam or two layers multiple
Close, the layer is also not present on base material, it is specifically chosen depending on the material of base material, when simultaneously electroless nickel layer and bottoming nickel dam are present
When, then electroless nickel layer is formed on base material, and bottoming nickel dam is formed in electroless nickel layer), it is deposited over the whole substrate, is being located in advance
Copper plate is formed with reason coating；With
Functional layer, it is formed on copper plate, and wherein functional layer includes low potential nickel dam and is formed on low potential nickel dam
Micropore nickel dam；With
Decorative layer, it is formed on micropore nickel dam.
A kind of improvement of plating nickel-chrome part disclosed by the invention, decorative layer is trivalent chrome plating or sexavalence chrome plating
Any, wherein trivalent chrome plating can be the white chrome plating of trivalent or the plating of trivalent black chromium plating or the trivalent chromium of other species
Layer.Wherein passivating film can also be formed on trivalent chrome plating.
A kind of improvement of plating nickel-chrome part disclosed by the invention, micropore nickel dam is 10- with the potential difference of low potential nickel dam
120mv。
A kind of improvement of plating nickel-chrome part disclosed by the invention, low potential nickel dam includes high-sulfur nickel dam, micro-crack nickel dam
In it is compound between one layer or two layers.It is further preferred that the potential difference between micropore nickel dam and low potential nickel dam is 20-
00mv。
When composite deposite of the low potential nickel dam using micro-crack nickel dam and high-sulfur nickel dam, micro-crack nickel dam and high-sulfur nickel dam
Between potential difference be 10-80mv in.Here when eroding to up to low potential nickel dam, because the current potential of micro-crack nickel dam is than high-sulfur nickel
The current potential of layer is high, and now high-sulfur nickel dam is preferentially corroded as anodic coating again, extends the corrosion of micro-crack nickel dam, so as to enter
One step improves corrosion resistant erosion degree.
The manufacture method of plating nickel-chrome part disclosed by the invention comprises the following steps：
The surface of base material is pre-processed；
Pretreatment coating is deposited over the whole substrate, and copper plate is formed on pretreatment coating；With
Low potential nickel dam in functional layer is formed on copper plate；With
Micropore nickel dam in functional layer is formed on low potential nickel dam；Current potential between micropore nickel dam and low potential nickel dam
Difference is in the range of 10-120mv；
Decorative layer is formed on micropore nickel dam.By potential difference control in the range of this, it is difficult out in electroplating process
Existing bubbling, while coating structure is more stable and firm, is not susceptible to separation and peels off.Here low potential nickel dam is matched somebody with somebody with copper plate and is combined into
By low potential nickel dam Direct Electroplating on copper plate, centre undopes other coating.
A kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, decorative layer is trivalent chrome plating or six
Any of valency chrome plating, wherein trivalent chrome plating can be the white chrome plating of trivalent or trivalent black chromium plating or other species
Trivalent chrome plating.
A kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, decorative layer is the white chrome plating of trivalent, trivalent
White chrome plating is formed using the white chromium plating solution plating of plating trivalent, and the white chromium plating solution of trivalent includes composition and concentration is (unit volume plating solution
Middle addition)：Aqueous chromium chloride 90-150g/L, potassium formate 50-100g/L, ammonium bromide 8-25g/L, ammonium chloride 40-60g/L, chlorine
Change potassium 40-100g/L, sodium acetate 10-60g/L, boric acid 40-80g/L, wetting agent 0.5-2.5ml/L.
A kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, decorative layer is trivalent black chromium plating, trivalent
Black chromium plating is formed using the black chromium plating solution plating of plating trivalent, and the black chromium plating solution of trivalent includes composition and concentration is (unit volume plating solution
Middle addition)：Aqueous chromium chloride 150-250g/L, oxalic acid 2-5g/L, ammonium acetate 3-10g/L, ammonium chloride 20-40g/L, boric acid
20-41g/L, additive 0.5-3g/L.
A kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, decorative layer is sexavalence chrome plating, Cr VI
Coating is formed using the plating solution plating of plating Cr VI, and Cr VI plating solution includes composition and concentration (to add in unit volume plating solution
Amount)：Chromic anhydride 260-360g/L, sulfuric acid 0.5-3g/L, decorative chromium brightener 1-4g/L, chromium fog inhibitor 0.1-0.4ml/L.
The first aspect of the present invention provides plating nickel part, and it includes following：Base material；Pre-processing coating (can include chemistry
Nickel dam, bottoming nickel dam are any or the two is compound), it is formed on whole base material；Copper plate, copper plate is formed at pretreatment plating
On layer；Functional layer, it is formed on copper plate, and wherein functional layer includes low potential nickel dam and is formed at micro- on low potential nickel dam
Hole nickel dam, the low potential nickel dam in functional layer is formed on copper plate；Low electricity is formed at by the micropore nickel dam in functional layer
On the nickel dam of position；Potential difference wherein between micropore nickel dam and low potential nickel dam is in the range of 10-120mv；(trivalent is white with decorative layer
Any of chrome plating or trivalent black chromium plating or sexavalence chrome plating), it is formed on micropore nickel coating, and with micropore
Structure and micro-cracked structure it is at least one of any.
Low potential nickel dam has two ways when coordinating with copper plate, and one kind is in copper plate by low potential nickel dam Direct Electroplating
On, centre undopes other coating, and another way is to be plated on low potential nickel dam on copper plate indirectly, that is to say, that low
Other coating can also be electroplated between current potential nickel dam and copper plate, referred to generally at based on coating, basic coating can be with here
Full light nickel, semi-gloss nickel, the corresponding coating of husky fourth nickel or high-sulfur nickel etc. in plating.
The second aspect of the present invention provides the manufacture method of plating nickel-chrome part, and it comprises the following steps：By the surface of base material
Pre-processed；Pretreatment coating is deposited over the whole substrate, and copper plate is formed on pretreatment coating；With by function
Low potential nickel dam in layer is formed on copper plate；It is formed at by the micropore nickel dam in functional layer on low potential nickel dam；It is described
Potential difference between micropore nickel dam and low potential nickel dam is in the range of 10-120mv；Decorative layer is formed on micropore nickel dam.
A kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, low potential nickel dam include high-sulfur nickel dam,
It is compound between one layer or two layers in micro-crack nickel dam.
In a kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, foregoing plating micropore nickel dam process, micropore
Nickel dam is formed using the nickel plating bath plating of plating micropore, and plating micropore nickel plating bath includes composition and concentration is：Aqueous sulfuric acid nickel 300-350g/
L, aqueous nickel chloride 50-60g/L, boric acid 40-50g/L, nickel envelope brightener 6-12ml/L (firmly believe that the chemical trade (Shanghai) of happy think of has
Limit company is hereinafter referred to as happy to think, wheat dolantin science and technology (Suzhou) Co., Ltd hereinafter referred to as wheat dolantin, such as happy 63 and the wheat dolantin thought
NIMAC 14INDEX), nickel envelope key light agent 4-7.5ml/L (such as the happy 610CFC thought and the NIMAC 33 of wheat dolantin), nickel envelope
Grain 0.2-1.5g/L (such as the happy ENHANCER thought and the NiMac Hypore XL dispersants of wheat dolantin), nickel envelope particle dispersants
0.5-3ml/L, wetting agent 1-5ml/L.Operation temperature control is between 50~60 DEG C when micropore nickel dam is coated with, and pH value control exists
Between 3.8~4.6, current density is 2~5ASD, and the operating time is controlled between 2~8min, by way of direct current is electrolysed
Nickel is set to be deposited on plated item, micropore nickel layer thickness is not less than 1.5 microns.
In a kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, foregoing plating low potential nickel dam process
Plate in micro-crack nickel dam process, micro-crack nickel dam is formed using the plating solution plating of plating micro-crack nickel, and plating micro-crack nickel plating solution includes into
Divide and concentration is (addition in unit volume plating solution)：Aqueous 180~260g/L of nickel chloride, acetic acid 20~60ml/L, PN-1A
1~5ml/L of 40~90g/L, PN-2A, 1~5ml/L of wetting agent.Wetting agent such as the happy 62A thought and the NIMAC 32C of wheat dolantin
WETTER.Technological temperature control is between 25~35 DEG C when micro-crack nickel dam is coated with, and pH to control is between 3.6~4.6, electric current
Density is 5~9ASD, and the operating time is controlled between 2~8min, nickel is deposited on plated item by way of direct current is electrolysed
On surface, micro-crack nickel layer thickness is not less than 1.0 microns.
In a kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, foregoing plating low potential nickel dam process
Plate in high-sulfur nickel dam process, high-sulfur nickel dam is formed using the nickel plating bath plating of plating high-sulfur, and plating high-sulfur nickel plating bath includes composition and concentration
For (addition in unit volume plating solution)：Aqueous sulfuric acid nickel 250-350g/L, aqueous nickel chloride 35-60g/L, boric acid 35-65g/
L, high sulfur additives 3-10ml/L, wetting agent 0.5--3ml/L.Wetting agent such as the happy 62A thought and the NIMAC 32C of wheat dolantin
WETTER.Temperature control is between 55~65 DEG C when high-sulfur nickel dam is coated with, and pH to control is between 2.0~3.5, and current density is
2~6ASD, the operating time is controlled between 2~8min, nickel is deposited on plated item surface by way of direct current is electrolysed,
High-sulfur nickel layer thickness is not less than 1.0 microns
In above-mentioned manufacture method, also including base material early stage pretreatment process, including the non-gold including ABS resin
Category class base material early stage pretreatment process at least includes surface grease treatment process, surface hydrophilic, surface coarsening treatment process, table
Face neutralisation treatment operation, surface preimpregnation, surface activation process process and surface dispergation treatment process；And metal class base material then exists
Surface grease treatment process can carry out subsequently being coated with before work, equally applicable non-metallic base set forth below after carrying out oil removing
Corresponding process in phase pretreatment process.
In above-mentioned manufacture method, non-metallic substrate early stage pretreatment process is specially in hydroxide by base material blank
Degreasing is cleaned in sodium, sodium carbonate and sodium metasilicate mixed solution, is immersed after degreasing in chromic anhybride and sulfuric acid mixture liquid and carries out table
Face roughening treatment, is then placed in progress surface neutralization in hydrochloric acid solution, is carried out after neutralization using colloid palladium solution at surface active
Reason, then carries out surface dispergation processing in sulfuric acid solution.
Preferably, the mixed solution of surface grease treatment process includes composition and concentration is:The concentration of NaOH
For 20-50g/L, the concentration of sodium carbonate is 10-40g/L, and the concentration of sodium metasilicate is 10-40g/L, surfactant 1-3g/L.
Here surface degreasing step can remove the greasy dirt and other impurities of substrate surface, promote surface coarsening uniform, carry
High binding force of cladding material.
Preferably, the sulfuric acid solution concentration of surface hydrophilic process is 20-100g/L, whole face agent 0.5-2ml/L.
Preferably, the mixed liquor of surface coarsening treatment process includes composition and concentration is：The concentration of chromic anhybride is
330-480g/L, the concentration of sulfuric acid is 330-480g/L.
Here chromic anhybride is the main salt in plating solution, by the mechanism of oxidation-reduction reaction and electron exchange in substrate surface
Deposit crome metal and production chrome green hyrate etc. so that coating blacks, chromic anhybride has to the covering power of plating solution
Considerable influence, if chromic anhybride content is high, covering power is strong, and it is careful to crystallize, if but chromic anhybride too high levels, plating can be caused
The hardness of layer declines, in addition, chromic anhybride and sulfuric acid can form microcosmic in corrosion substrate surface as corrosive agent in substrate surface
Rough surface, to ensure " lock effect " required during chemical plating, the adhesion of substrate surface and coating is improved with this.But
Sulfate radical can reduce the color characteristics of coating so that coating turns to be yellow, harmful in order to be able to reach corrosion substrate surface and reduction simultaneously
Influence is, it is necessary to accurately configure the content of sulfuric acid.
Preferably, the concentration of hydrochloric acid solution of surface neutralization step is 30-100ml/L, hydrazine hydrate 15-60ml/L.
Preferably, the concentration of hydrochloric acid solution of surface preimpregnation process is 40-120ml/L.
Preferably, the colloid palladium solution of surface activation process includes composition and concentration is：The concentration of palladium bichloride is 20-
60ppm, the concentration 1-6g/L of stannous chloride, hydrochloric acid 180-280ml/L.
Here in colloid palladium solution, palladium bichloride is covered in substrate surface, and catalytic center is provided for follow-up chemical nickel, and chlorine
Changing the tin ion of stannous can be then deposited on around palladium ion with the group of chemical combination too, it is to avoid palladium ion is aoxidized in water or in air
With come off, the usage cycles of colloid palladium solution can be increased.
Preferably, the sulfuric acid solution concentration of surface dispergation treatment process is 40-100g/L.
Surface dispergation, which is handled, to be referred to remove the stannous chloride being coated in colloid palladium solution around palladium oxide using sulfuric acid, will
Metal Palladium particle is exposed so that the heavy nickel technique of subsequent chemistry is more smoothly.
Preferably, the electroless nickel layer plating solution of electroless nickel layer process includes composition and concentration is：The concentration of nickel sulfate is
15-40g/L, the concentration of sodium hypophosphite is 20-50g/L, and the concentration of sodium citrate is 10-4g/L, ammonium chloride 10-50g/L, ammonia
Water, PH regulations are used, PH=8.6-9.2.
Here chemical sinking nickel refers to deposit one layer of thin conductive layer in the Metal Palladium for having catalytic activity in substrate surface, just
During various metals, chemical sinking nickel is subsequently electroplated, nickel sulfate provides nickel element；Sodium hypophosphite is strong reductant, and it will
Nickel element in nickel sulfate is reduced into metallic nickel；Sodium citrate is buffer, and it make it that sodium hypophosphite reduces the anti-of nickel element
Should be more gentle, in the present invention, buffer is used as using sodium citrate.
Preferably, the bottoming nickel plating bath of plating bottoming nickel process includes composition and concentration is：The concentration of aqueous sulfuric acid nickel
For 180-280g/L, the concentration of aqueous nickel chloride is 35-60g/L, and the concentration of boric acid is 35-60g/L, wetting agent 1-3ml/L.
In the presence of electroless nickel layer and bottoming nickel dam are on matrix simultaneously, matrix passes through oxidation in chemical sinking nickel
Reduction reaction causes after the conductive nickel dam that substrate surface covers layer；And in plating bottoming nickel, then using electrochemistry
Method last layer nickel is plated in chemical nickel, further strengthen coating electric conductivity.In this step, aqueous sulfuric acid nickel, aqueous chlorine
Change nickel and nickel ion needed for electrochemical reaction is provided.
Preferably, each component and concentration are in the copper plate plating solution of copper plate process：The concentration of copper sulphate is 160-
260g/L, the concentration of sulfuric acid is 50-100g/L, and chlorion is 40-100ppm, leveling agent 0.2-1ml/L, and walk agent 0.2-1ml/
L, open cylinder agent 2-10ml/L.
Here the purpose of copper plate be using copper sulphate characteristic to improve the brightness and planarization of substrate surface, and
The overall toughness of coating can also be improved.Because copper coating is compared to nickel coating and other coats of metal, its ductility is more preferable, because
This is plated after sour layers of copper, and the toughness and Surface flat of overall coating are improved.
Plating micro-crack nickel refer to substrate surface plate one layer and the coating containing numerous crackle, can be with distributed erosion
Electric current, reduces corrosion electric current density, and plating microporous nickel refers to that plating one layer in substrate surface uniformly contains numerous non-conductive particulate
Coating, can further distributed erosion electric current, reduce corrosion electric current density, coating corrosion stability improved comprehensively.
In chemical sinking nickel and plating bottoming nickel step, preplating nickel coating mainly helps out, and boric acid can not only rise therebetween
To the blackening agent for surface that stabilizer function or plating solution are main, the covering power and covering power of plating solution can be improved, plated layer compact is improved
Property.
Wherein when low potential nickel dam uses independent micro-crack nickel dam or for answering that high-sulfur nickel dam and micro-crack nickel dam are constituted
Nickel dam is closed, the present invention can be made to reach optimal anticorrosion effect, here micro-crack nickel dam, micropore nickel dam or both in functional layer
It is with reference to the reason for playing anticorrosion and protection base material, coated metal/substrate metal extremely easily formation corrosion on workpiece
Battery, in the case where negative and positive electrode potential is determined, its corrosion rate is sudden and violent by coated metal (negative electrode) surface substrate metal (anode)
Long-pending ratio of showing up is controlled.During hot spot at only one, at this moment cathode/anode ratio is maximum, and corrosion current is just concentrated
In this point, corrosion rate just becomes very big, is easily inwardly formed pitting, but when metal coating surface has more potential corruption
During pitting, cathode/anode ratio is smaller, and corrosion current is assigned to everywhere, and originally the electric current in hot spot is just significantly reduced
, corrosion rate is greatly reduced.Simultaneously as the segmentation between micropore or crackle, makes coating negative electrode be formed discontinuously, is divided
Coating after cutting becomes small area by large area, so further limits cathode/anode ratio.However as when ask push away
Move, when coating surface is influenceed to start to occur large-scale crackle by extraneous factor, micro-crack, the potential corrosion electricity of microcellular structure
Pond will be initiated, so that it is acted on to protection by hot spot, so as to can just play double-core reduction corrosion electric current density
Effect, so that significant increase corrosion resistant erosion degree.
The anticorrosive mechanism of low potential nickel
The first step：When piece surface releases corrosive medium, because there is the blunt of highly corrosion resistant in decorative layer (such as layers of chrome)
Change layer, the micropore on layers of chrome surface is present, nickel dam expansion of the guiding corrosion at micropore, due to the discontinuity of micropore, causes
In the case that corrosion total amount is constant, corrosion is separated into numerous regions, therefore corrodes the progress in the case where not influenceing apparent condition..
Second step：When eroding to up to low potential nickel dam, because microporous nickel current potential is higher than low potential nickel current potential, now low electricity
Position nickel is preferentially corroded (i.e. low potential nickel dam preferentially as sacrifice layer) as anodic coating, and the corrosion in microporous nickel is by end
Only.Guiding corrosion deploys simultaneously in crackle depth and laterally in the presence of a large amount of discontinuous micro-cracks, the nickel dam corroded
Area will increase significantly and discontinuously, in the case where corrosion current is certain, these " micropores " have greatly disperseed corrosion current,
Single-point corrosion rate is again reduced, the corrosion rate delayed, while protecting the layers of chrome and its adhesion layer micropore in appearance
Nickel dam, product surface corrosion resistance is further improved.
3rd step：When corrosion is extended further downward in low potential nickel dam, because coating (is such as plated below low potential nickel dam
Layers of copper) current potential it is same higher than low potential nickel, low potential nickel has equally been taken as anodic coating, the corrosion now extended downwardly
It is terminated, corrosion position is laterally carried out in low potential nickel, has so further delayed corrosion to the time of base material, dropped significantly
The speed of bottom corrosion.
Compared with prior art, the advantage of the invention is that：
1st, the present invention is by after base material workpiece premenstruum (premenstrua) pretreatment process, being follow-up low potential nickel dam and micropore nickel dam electricity
Plating lays the first stone, and process stabilizing, compatibility is reasonable；
2nd, the micropore nickel dam and low potential nickel dam that substrate surface plating of the present invention is obtained is high hard with high anticorrosive property energy
Degree, high-wearing feature, binding force of cladding material is good, the advantages of brightness is high；Simultaneously with micropore nickel dam and tool with high potential characteristic
There is the MULTI-LAYER NICKEL of low potential characteristic --- low potential nickel dam is functional layer, and using low potential nickel dam as sacrifice layer, with micropore
The micropore nickel dam of structure can disperse the micro-current of electrochemical corrosion, delay to occur by corrosion, while being formed to lead to
Cross microcellular structure and form oxide after oxidation and be supported, can be in the low potential nickel dam as sacrifice layer by more serious
Corrosion after form support to it, reduction part coating damage speed.Be provided as sacrifice layer low potential nickel dam have compared with
Low potential, when electrochemical corrosion occurs for piece surface coating, low potential nickel dam preferentially corrodes, and with microporous nickel
When layer or micro-crack nickel dam, its micropore or micro-cracked structure can equally play distributed erosion micro-current, while in low electricity
Also there is when protective layer (such as decorative layer or) during layer structure can also pass through micropore or micro-cracked structure on the outside of the nickel dam of position
Outboard structure is supported, the steadiness of reinforcing material structure.Other the present invention program utilizes microporous nickel and micro-crack nickel
Pore structure, while reinforcing material structural support performance, can also play reduction quality of coating and reduce what raw material expended
Effect.Its micro hole structure can also form the sull structure of large area when occurring oxide etch simultaneously, so that pole
The earth delays the generation of corrosion.
3rd, in addition, the present invention selects the small plating solution of effect on environment when being formulated and choosing as far as possible so that electroplating technology is more
Environmental protection, further, coating are firmly combined with, and are evenly distributed, and service life is longer, no matter make final products in outward appearance or performance
On can meet the requirement of user, make technique obtained by the present invention that there is the higher market competitiveness.
Brief description of the drawings
Fig. 1 plates the coating structure schematic diagram of the embodiment of nickel-chrome part for the present invention.
The plating nickel-chrome part CASS of Fig. 2 prior arts after 72 hours in metallograph, Fig. 2 (a) for experiment after sample just
(b) is side (section) metallograph of sample after experiment in face metallograph, Fig. 2.
(a) is the front gold of sample after experiment to Fig. 3 present invention platings nickel-chrome part CASS in metallograph, Fig. 3 after 72 hours
(b) is the side metallograph of sample after experiment in phasor, Fig. 3.
The plating nickel-chrome component corrosion cream of Fig. 4 prior arts tests the picture after carrying out 168 and 336 hours.
Fig. 5 present invention plating nickel-chrome component corrosion cream tests the picture after carrying out 168 and 336 hours
(low potential nickel dam is high-sulfur nickel dam or micro-crack nickel dam to the single low potential nickel dam potential difference picture of Fig. 6 present invention
It is any).
(low potential nickel dam is high-sulfur nickel dam and micro-crack nickel dam to the compound low potential nickel dam potential difference picture of Fig. 7 present invention
Composite bed).
The MULTI-LAYER NICKEL corrosion principle figure of Fig. 8 present invention (using ABS as part base material).
Reference numerals list：
1st, base material；2nd, coating is pre-processed；21st, vacancy is corroded；
3rd, copper plate；31st, surface micropore；32nd, etch pit；
4th, functional layer；141st, low potential nickel dam；142nd, micropore nickel dam；
801st, corrosive medium；802nd, decorative layer；805th, erosional surface；
808th, bottoming nickel dam；809th, electroless nickel layer；810th, ABS substrate.
Embodiment
With reference to the accompanying drawings and detailed description, the present invention is furture elucidated, it should be understood that following embodiments are only
For illustrate the present invention rather than limitation the scope of the present invention, here base material of the present invention can use metal, plastics and its
It can be applicable the part of plating.
As shown in figure 1, following illustrate to the coating structure that the present invention plates nickel-chrome part.
Constructive embodiment 1
The plating nickel-chrome part of the present embodiment, the part includes：Base material 1 (ABS materials)；Pre-processing coating 2 includes chemical nickel
Layer 809, bottoming nickel dam 808 and copper plate 3, heavy 809 product of electroless nickel layer is on whole base material 1, and bottoming nickel dam 808 is deposited on chemistry
On nickel dam 809, copper plate 3 is formed with bottoming nickel dam 808；With functional layer 4, it is formed on copper plate 3, wherein functional layer
4 include low potential nickel dam 141 and micropore nickel dam 142, and wherein low potential nickel dam 141 is high-sulfur nickel dam, is formed on high-sulfur nickel dam
Micropore nickel dam 142；With the decorative layer 802 (the white chrome plating of trivalent) being formed on micropore nickel dam 142.
Constructive embodiment 2
The plating nickel-chrome part of the present embodiment, the part includes：Base material 1 (ABS materials)；Pre-processing coating 2 includes chemical nickel
Layer 809, bottoming nickel dam 808 and copper plate 3, heavy 809 product of electroless nickel layer is on whole base material 1, and bottoming nickel dam 808 is deposited on chemistry
On nickel dam 809, copper plate 3 is formed with bottoming nickel dam 808；With functional layer 4, it is formed on copper plate 3, wherein functional layer
4 include low potential nickel dam 141 and micropore nickel dam 142, and wherein low potential nickel dam 141 is micro-crack nickel dam, is formed at micro-crack nickel
Micropore nickel dam 142 on layer；With the decorative layer 802 (trivalent black chromium plating) being formed on micropore nickel dam 142.
Constructive embodiment 3
The plating nickel-chrome part of the present embodiment, the part includes：Base material 1 (ABS materials)；Pre-processing coating 2 includes chemical nickel
Layer 809, bottoming nickel dam 808 and copper plate 3, heavy 809 product of electroless nickel layer is on whole base material 1, and bottoming nickel dam 808 is deposited on chemistry
On nickel dam 809, copper plate 3 is formed with bottoming nickel dam 808；With functional layer 4, it is formed on copper plate 3, wherein functional layer
4 include low potential nickel dam 141 and micropore nickel dam 142, and wherein low potential nickel dam 141 is that high-sulfur nickel dam and micro-crack nickel dam (can be with
It is that high-sulfur nickel dam is formed on copper plate 3, micro-crack nickel dam is formed on high-sulfur nickel dam；Can also be that micro-crack nickel dam is formed at
On copper plate 3, high-sulfur nickel dam is formed on micro-crack nickel dam), it is formed at the micropore nickel dam 142 on low potential nickel dam 141；And shape
Into in the decorative layer 802 (sexavalence chrome plating) on micropore nickel dam 142.
Constructive embodiment 4
The plating nickel-chrome part of the present embodiment, the part includes：Base material 1 (ABS materials)；Pre-processing coating 2 includes chemical nickel
Layer 809 and copper plate 3, electroless nickel layer 809 are deposited on whole base material 1, and copper plate 3 is formed with electroless nickel layer 809；And work(
Ergosphere 4, it is formed on copper plate 3, and wherein functional layer 4 includes low potential nickel dam 141 and micropore nickel dam 142, wherein low potential
Nickel dam 141 is high-sulfur nickel dam, is formed at the micropore nickel dam 142 on high-sulfur nickel dam；With the decorative layer being formed on micropore nickel dam 142
802 (sexavalence chrome platings).
Constructive embodiment 5
The plating nickel-chrome part of the present embodiment, the part includes：Base material 1 (ABS materials)；Pre-processing coating 2 includes bottoming nickel
Layer 808 and copper plate 3, bottoming nickel dam 808 are deposited on whole base material 1, and copper plate 3 is formed with bottoming nickel dam 808；And work(
Ergosphere 4, it is formed on copper plate 3, and wherein functional layer 4 includes low potential nickel dam 141 and micropore nickel dam 142, wherein low potential
Nickel dam 141 is micro-crack nickel dam, is formed at the micropore nickel dam 142 on micro-crack nickel dam；With the dress being formed on micropore nickel dam 142
Adorn layer 802 (the white chrome plating of trivalent).
Constructive embodiment 6
The plating nickel-chrome part of the present embodiment, the part includes：Base material 1 (ABS materials)；Pre-processing coating 2 includes copper plate
3, copper plate 3 is directly formed with base material 1；With functional layer 4, it is formed on copper plate 3, and wherein functional layer 4 includes low electricity
Position nickel dam 141 and micropore nickel dam 142, wherein low potential nickel dam 141 are high-sulfur nickel dam and micro-crack nickel dam (can be high-sulfur nickel dam
It is formed on copper plate 3, micro-crack nickel dam is formed on high-sulfur nickel dam；Can also be that micro-crack nickel dam is formed on copper plate 3,
High-sulfur nickel dam is formed on micro-crack nickel dam), it is formed at the micropore nickel dam 142 in functional layer 4；Be formed at micropore nickel dam 142
On decorative layer 802 (trivalent black chromium plating).
The unique of constructive embodiment 7-12 and constructive embodiment 1-6 differs only in：Base material 1 is pp materials；
The unique of constructive embodiment 13-18 and constructive embodiment 1-6 differs only in：Base material 1 is nylon nylon material；
The unique of constructive embodiment 19-24 and constructive embodiment 1-6 differs only in：Base material 1 is pc materials；
The unique of constructive embodiment 25-30 and constructive embodiment 1-6 differs only in：Base material 1 is pet materials；
The unique of constructive embodiment 31-36 and constructive embodiment 1-6 differs only in：Base material 1 is bakelite material；
The unique of constructive embodiment 37-42 and constructive embodiment 1-6 differs only in：Base material 1 is that cast iron (includes without limit
In grey cast-iron, white cast-iron, spheroidal graphite cast-iron, vermicular cast iron, malleable cast iron and alloy cast iron etc.) material；
The unique of constructive embodiment 43-48 and constructive embodiment 1-6 differs only in：Base material 1 is that steel is (including various general
Logical steel, stainless steel etc.) and aluminum alloy material, magnesium alloy material；
The material of base material 1 employed in technical solution of the present invention can also for it is other can be used for being coated with its surface copper,
The material of nickel, chrome plating.
The solvent of solution is water and (includes but not limited to distilled water, deionization unless otherwise indicated in the embodiment of the present invention
Water, low-hardness water etc.), concentration is with the solution measures of unit volume or quality.
The base material of following examples part is preferred to use ABS materials.
Prepare embodiment 1-5
The manufacture method of the plating nickel-chrome part of an embodiment of the present invention is as follows, the surface of base material is pre-processed (pre-
Processing in turn includes the following steps：Surface degreasing, surface hydrophilic processing, surface coarsening processing, surface neutralisation treatment, preimpregnation,
Surface activation process, the processing of surface dispergation)；Will pretreatment coating (including chemical sinking nickel and bottoming nickel, in addition pretreatment plating
The selection whether layer retains and pre-process coating composition carries out flexibly selecting according to base material material and handicraft product demand) it is heavy
Product over the whole substrate, the electroless nickel layer and bottoming nickel dam being sequentially outwardly formed by substrate surface, and copper plate being formed at pre-
Handle on coating (outside bottoming nickel dam)；It is formed at by the low potential nickel dam in functional layer on copper plate, here low potential nickel dam
For high-sulfur nickel dam；It is formed at by the micropore nickel dam in functional layer on high-sulfur nickel dam；It is formed at by decorative layer on micropore nickel dam,
Wherein decorative layer is the white chrome plating of trivalent.
Potential difference between micropore nickel dam and high-sulfur nickel dam (low potential nickel dam) is respectively 10,20,30,40,50,60,70,
80th, 90,100,110, (embodiment 1-5 can be selected other arbitrary values in the range of 120mv any or 10-120 respectively
Different numerical value are microporous nickel in the potential difference in corresponding embodiment between micropore nickel dam and low potential nickel dam, each embodiment in 10-120
Layer can also be identical with the potential difference between low potential nickel dam).Micropore nickel dam be product surface plate one layer it is uniform and containing whetheing there is
The nickel dam of several non-conductive particles and conductive particle, so that ABS substrate workpiece surface has high anticorrosive property energy, high hard
Degree, high-wearing feature, binding force of cladding material is good, the advantages of brightness is high.
Electric plating method comprises the following steps on above-mentioned part：
(1) surface degreasing：In NaOH NaOH, sodium carbonate Na2CO3, sodium metasilicate Na2SiO3It is mixed with surfactant
Close cleaning treatment in solution.In this step, the concentration proportioning of each component in different embodiments is shown in Table one in mixed solution：Surface
Activating agent is conventional surfactants such as dodecyl sodium sulfate, sodium stearyl sulfonate etc..
Table one
(2) surface hydrophilic is handled：Carried out in sulfuric acid and whole face agent mixed solution.Sulfuric acid and whole face agent be not in this step
Concentration proportioning in be the same as Example is shown in Table two：
Table two
(3) surface coarsening is handled：In chromic anhybride CrO3With sulfuric acid H2SO4Carried out in mixed liquor.In this step, chromic anhybride
CrO3With sulfuric acid H2SO4Concentration proportioning in different embodiments is shown in Table three：
Table three
(4) surface neutralisation treatment：Base material after surface coarsening is handled is put into hydrochloric acid with being carried out in hydrazine hydrate mixed solution.
In this step, hydrochloric acid and hydrazine hydrate solution are shown in Table four in the concentration proportioning of not be the same as Example：
Table four
(5) surface is presoaked：Base material after the neutralisation treatment of surface is carried out in hydrochloric acid solution, and in this step, hydrochloric acid solution exists
The concentration proportioning of be the same as Example is not shown in Table five：
Table five
(6) surface activation process：Surface activation process uses colloid palladium solution, colloid palladium Chlorine in Solution palladium PdCl2, chlorine
Change stannous SnCl2Concentration proportioning with hydrochloric acid in not be the same as Example is shown in Table six：
Table six
(7) surface dispergation is handled：In sulfuric acid H2SO4Carried out in solution.Sulfuric acid solution is in the dense of not be the same as Example in this step
Degree proportioning is shown in Table seven：
Table seven
(8) chemical sinking nickel：Containing hydration nickel sulfate, hydration sodium hypophosphite, sodium citrate C6H5Na3O7, ammonium chloride and
Carried out in ammoniacal liquor (PH that ammoniacal liquor is used for adjusting solution is 8.6-9.2) mixed solution.In this step, each component exists in mixed solution
The concentration proportioning in be the same as Example is not shown in Table eight：
Table eight
(9) bottoming nickel is plated：Containing aqueous sulfuric acid nickel2SO4-6H2O, aqueous nickel chloride NiCl2-6H2O, boric acid H3BO3
And carried out in the mixed solution of wetting agent.In this step, the concentration proportioning of each component in different embodiments in mixed solution
It is shown in Table nine：Wetting agent is the NIMAC 32C WETTER such as the happy 62A thought and wheat dolantin in table nine.
Table nine
(10) copper plate：In copper sulphate CuSO4, sulfuric acid H2SO4, chlorion, leveling agent, walk agent and open cylinder agent mixing
Carried out in solution.Respectively composition is shown in Table ten to solution in the concentration proportioning of not be the same as Example：Wherein leveling agent, the agent that walks, open cylinder agent can
With from the happy 1560 sour copper additives series thought.
Table ten
(11) high-sulfur nickel dam (low potential nickel dam), plating micropore nickel dam are plated successively.Wherein plating microporous nickel, the technique of high-sulfur nickel are walked
In rapid, the main component of plating solution is the same, is aqueous sulfuric acid nickel2SO4-6H2O, aqueous nickel chloride NiCl2-6H2O and boric acid
H3BO3Mixed solution.Plating microporous nickel and plating high-sulfur are shown in Table 11 and table 12 respectively in the concentration proportioning of not be the same as Example, here
Nickel envelope brightener is the 63 of happy think of；Nickel envelope key light agent is the happy 610CFC thought；Nickel envelope particulate vector is the happy ENHANCER thought.Table
Wetting agent is the NIMAC 32C WETTER such as the happy 62A thought and wheat dolantin in 11 boxes 12.
Table 11 (plating microporous nickel)
Table 12 (plating high-sulfur nickel)
(12) decorative layer, is plated, is electroplated in the plating white chromium plating solution of trivalent, solution respectively constitutes the concentration proportioning in not be the same as Example
It is shown in Table 13：
Table 13 (the white chromium of plating trivalent)
Above example CASS experiments reach 96-120h and more than, corrod kote paste experiment then reaches stable more than 336h.
The unique of embodiment 6-10 and embodiment 1-5 differs only in, and low potential nickel dam includes micro-crack nickel dam, decoration
Layer is trivalent black chromium plating.And accordingly micro-crack nickel dam plating solution uses the plating solution as shown in following table 14, and accordingly three
Valency black chromium plating plating solution uses the plating solution as shown in following table 15, and wherein wetting agent is conventional surfactants, such as dodecyl sulphur
Sour sodium, sodium stearyl sulfonate etc..Wetting agent is the NIMAC 32C WETTER such as the happy 62A thought and wheat dolantin in table 14.
Table 14 (plating micro-crack nickel)
Table 15 (the black chromium of plating trivalent)
Prepare embodiment 11-15 and differed only in preparing the unique of embodiment 1-5, low potential nickel dam includes high-sulfur nickel
Layer (each embodiment plating solution is accordingly sequentially referring to shown in table 12), micro-crack nickel dam (accordingly sequentially join by each embodiment plating solution
Be shown in Table shown in 14) it is compound between two layers, now between micro-crack nickel dam and high-sulfur nickel dam potential difference be 10,20,30,40,
50th, 60,70,80 any or 10-80 scopes arbitrary value mv；Decorative layer is sexavalence chrome plating, and accordingly Cr VI is plated
Layer plating solution uses the plating solution as shown in following table 16, and wherein decorative chromium brightener can be such as happy 1120F thought and Japan's metallization
The 7000C of work.
Table 16 (plating Cr VI)
Prepare embodiment 16-30 and differed only in preparing the unique of embodiment 1-15, nickel envelope brightener is wheat dolantin
NIMAC14INDEX；Nickel envelope key light agent is the NIMAC 33 of wheat dolantin；Nickel envelope particulate vector is the NiMac Hypore of wheat dolantin
XL dispersants.
Prepare embodiment 31-60 and differed only in preparing the unique of embodiment 1-30, plating micropore nickel plating bath also includes micro-
(consumption in embodiment on micropore powder particles can select arbitrary value to hole powder particles 0.3-0.8ml/L here：0.3、
0.32、0.33、0.34、0.37、0.39、0.4、0.42、0.43、0.44、0.47、0.49、0.5、0.52、0.53、0.54、
0.57th, 0.59,0.6,0.62,0.63,0.64,0.67,0.69,0.7,0.72,0.73,0.74,0.77,0.79,0.8), it is happy to think
618；(consumption in embodiment on wetting agent can select arbitrary value to wetting agent 1.0-3.0ml/L here：1、
1.2nd, 1.3,1.4,1.7,1.9,2,2.2,2.3,2.4,2.7,2.9,3.0), the happy 62A thought.
Prepare embodiment 61-90 and differed only in preparing the unique of embodiment 31-60, micropore powder in plating micropore nickel plating bath
Particle is the NiMac Hypore XL pulvis of wheat dolantin；Wetting agent is the NIMAC 32C WETTER of wheat dolantin.
Prepare embodiment 91-180 and differed only in preparing the unique of embodiment 1-90, pretreatment coating is chemical nickel
Layer.
Prepare embodiment 181-270 and differed only in preparing the unique of embodiment 1-90, pretreatment coating is bottoming nickel
Layer.
Prepare embodiment 271-360 and differed only in preparing the unique of embodiment 1-90, the pretreatment plating of substrate surface
Layer is sky, and copper plate is formed directly into substrate surface.
PN-1A, PN-2A are Atotech (China) Chemical Co., Ltd. commercially available prod in embodiment made above.
Base material, which can also be used, in technical solution of the present invention includes but not limited to PC, PP, nylon, PET, bakelite and metal material
What the material including the materials such as material was made.When selecting other base materials in addition to ABS, pretreatment coating can be according to actual material
Performance and process requirements carry out selection have pretreatment coating or without pretreatment coating.
As Fig. 3 obtains for the plating nickel-chrome part sample obtained by one embodiment of the invention after 72h CASS experiments
Etch state figure, with Fig. 2 for prior art plating nickel part sample by 72h CASS experiment after (under equal experiment condition)
Obtained etch state figure, can be intuitive to see, existing sample has substantial amounts of plating exfoliation after the test by contrast
And the corrosion vacancy 21 produced after corrosion, severely impact the quality of product coating.Fig. 3 then can be seen that of the invention obtain
To nickel plating sample a number of surface micropore 31 is then only existed on surface, and section is shown, is equally only existed smaller
Etch pit 32, the etch pit that either surface micropore and sacrifice layer are produced all without the coating structure of part can be destroyed,
The use of product is not influenceed and attractive in appearance.
Fig. 4 and Fig. 5 then be respectively prior art plating nickel part sample and one embodiment of the invention obtained by nickel plating-
Sample surfaces etch state figure after chromium part sample tests (336h, 336h, 168h) through corrod kote paste (justifies inside and is divided into reality in figure
Test region), as can be seen that the plating nickel part sample surfaces of prior art are by different degrees of corrosion in figure, and it is of the invention
Obtained sample is then very slight by extent of corrosion, does not change colour substantially.As can be seen here, unquestionable the technology of the present invention side
The plating nickel-chrome part that case is obtained has more excellent coating stability and corrosion resistance so that plating nickel part is more durable, beautiful
See.
By Fig. 6 and Fig. 7 coating potential diagram then it can be seen from the present invention program, no matter low potential nickel dam is simple layer
Or lamination layer structure, be when being corroded using low potential nickel dam as sacrifice layer, low potential nickel dam be high-sulfur nickel dam with it is micro-
During the composite bed of crackle nickel dam, the height of high-sulfur nickel dam and the current potential of micro-crack nickel dam is adjusted with actual production technique, can
To be that high-sulfur nickel dam potential is slightly higher or micro-crack nickel dam potential is slightly higher.
As shown in figure 8, the mechanism when plating nickel-chrome part that the present invention program is obtained is corroded is：It is in ABS bases in figure
Electroless nickel layer 809, bottoming nickel dam 808, copper plate 3, low potential nickel dam 141, the and of micropore nickel dam 142 are formed on material 810 layer by layer
Decorative layer 802, corrosive medium 801 is on (the i.e. trivalent chrome plating or sexavalence chrome plating) surface of decorative layer 802 and in micropore nickel dam
142 microcellular structure is with distributed erosion electric current and enters low potential nickel dam 141 (based on corrosion rate in electrochemical corrosion with participating in
Electrode area is the reason for corrosion current size is directly related, reduces the area of actual participation corrosion here, so that with smaller
Corroded area, multiple independent hot spots are formed, so that distributed erosion electric current, delays corrosion rate), form corrosion in corrosion
Behind face 805, the copper plate 3 of high potential is run into after erosional surface 805 runs through low potential nickel dam 141, the rear longitudinal direction that stops is corroded as horizontal stroke
To corrosion until whole low potential nickel dam 141 is corroded, the corrosion of next step can be just carried out, until coating structure is integrally broken
It is bad.
, equally all will in the present invention in place of this place embodiment is to the claimed non-limit of technical scope midrange
In the range of asking protection.
Technological means disclosed in the present invention program is not limited only to the technological means disclosed in above-mentioned technological means, also includes
Constituted technical scheme is combined by above technical characteristic.Above is the embodiment of the present invention, it is noted that right
For those skilled in the art, under the premise without departing from the principles of the invention, some improvement can also be made
And retouching, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. plating nickel-chrome part, the part includes：
Base material；
Coating is pre-processed, it is deposited over the whole substrate, and copper plate is formed with pretreatment coating；With
Functional layer, it is formed on copper plate, and wherein functional layer includes low potential nickel dam and is formed at micro- on low potential nickel dam
Hole nickel dam, the potential difference between the micropore nickel dam and low potential nickel dam is in the range of 10-120mv；With
Decorative layer, it is formed on micropore nickel dam, and the decorative layer is any of trivalent chrome plating or sexavalence chrome plating.
2. plating nickel-chrome part according to claim 1, it is characterised in that：Described low potential nickel dam includes high-sulfur nickel
It is compound between one layer or two layers in layer, micro-crack nickel dam.
3. plating nickel-chrome part according to claim 1 or 2, it is characterised in that：The micropore nickel dam and low potential nickel dam it
Between potential difference in the range of 20-100mv.
4. plating nickel-chrome part according to claim 2, it is characterised in that：Between the micropore nickel dam and low potential nickel dam
Potential difference in the range of 20-100mv.
5. plating nickel-chrome part according to claim 2, it is characterised in that：When low potential nickel dam using micro-crack nickel dam with
During the composite deposite of high-sulfur nickel dam, potential difference is in 10-80mv between micro-crack nickel dam and high-sulfur nickel dam.
6. a kind of manufacture method of plating nickel-chrome part as described in claim 1-5 is any, this comprises the following steps：By base material
Surface pre-processed；Pretreatment coating is deposited over the whole substrate, and copper plate is formed on pretreatment coating；With
Low potential nickel dam in functional layer is formed on copper plate；Low potential nickel dam is formed at by the micropore nickel dam in functional layer
On, the potential difference between the micropore nickel dam and low potential nickel dam is in the range of 10-120mv；Decorative layer is formed at microporous nickel
On layer.
7. the manufacture method of plating nickel-chrome part according to claim 6, it is characterised in that：The decorative layer is trivalent chromium
Any of coating or sexavalence chrome plating.
8. the manufacture method of the plating nickel-chrome part according to claim 6 or 7, it is characterised in that：Described decorative layer is three
The white chrome plating of valency, the white chrome plating of trivalent is formed using the white chromium plating solution plating of plating trivalent, and the white chromium plating solution of trivalent includes into
Part and concentration are：Aqueous chromium chloride 90-150g/L, potassium formate 50-100g/L, ammonium bromide 8-25g/L, ammonium chloride 40-60g/L,
Potassium chloride 40-100g/L, sodium acetate 10-60g/L, boric acid 40-80g/L, wetting agent 0.5-2.5ml/L.
9. the manufacture method of the plating nickel-chrome part according to claim 6 or 7, it is characterised in that：Described decorative layer is three
Valency black chromium plating, the trivalent black chromium plating is formed using the black chromium plating solution plating of plating trivalent, and the black chromium plating solution of trivalent includes into
Part and concentration are：Aqueous chromium chloride 150-250g/L, oxalic acid 2-5g/L, ammonium acetate 3-10g/L, ammonium chloride 20-40g/L, boric acid
20-41g/L, additive 0.5-3g/L.
10. the manufacture method of the plating nickel-chrome part according to claim 6 or 7, it is characterised in that：Described decorative layer is
Sexavalence chrome plating, the sexavalence chrome plating is formed using the plating solution plating of plating Cr VI, and the Cr VI plating solution includes composition and dense
Spend and be：Chromic anhydride 260-360g/L, sulfuric acid 0.5-3g/L, decorative chromium brightener 1-4g/L, chromium fog inhibitor 0.1-0.4ml/L.
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| CN104775143A (en) * | 2015-03-11 | 2015-07-15 | 嘉兴敏惠汽车零部件有限公司 | Multilayer ultra corrosion resistant nickel-chromium plating part and manufacturing method thereof |
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| CN109338432A (en) * | 2018-11-27 | 2019-02-15 | 东莞市慧泽凌化工科技有限公司 | A kind of electroplating technology of stainless steel and aluminium alloy compound part |
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| JPH01309997A (en) * | 1988-06-09 | 1989-12-14 | Kanto Kasei Kogyo Kk | Method for obtaining copper-nickel-chromium bright electroplating having excellent corrosion resistance and plating film obtained thereby |
| JPH06146070A (en) * | 1992-10-30 | 1994-05-27 | Toyoda Gosei Co Ltd | Formation of ornamental chrome plating film |
| US10266957B2 (en) * | 2009-02-13 | 2019-04-23 | Nissan Motor Co., Ltd. | Chrome-plated part and manufacturing method of the same |
| CN102943292B (en) * | 2012-11-07 | 2016-06-08 | 嘉兴敏惠汽车零部件有限公司 | A kind of method of plastic surface plating micro-crack nickel |
| CN204585986U (en) * | 2015-03-11 | 2015-08-26 | 嘉兴敏惠汽车零部件有限公司 | Nickel plating-chromium parts |
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