CN104752253B - Chip detection method and equipment - Google Patents
Chip detection method and equipment Download PDFInfo
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- CN104752253B CN104752253B CN201310752625.9A CN201310752625A CN104752253B CN 104752253 B CN104752253 B CN 104752253B CN 201310752625 A CN201310752625 A CN 201310752625A CN 104752253 B CN104752253 B CN 104752253B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
Abstract
The invention discloses a kind of chip detection method and equipment, wherein chip detection method comprises the following steps：Rotating disk receive controller transmission turn to the command signal of preset target position after, start rotate；When controller detects that rotating disk places the position correspondence of wafer position and sensor, sense command signal is sent to sensor；After sensor receives sense command signal, detect that rotating disk places the state of wafer position with when recording status is identical in sensor, controlling rotating disk placement wafer position to turn to preset target position.It efficiently avoid the problem of energy waste carried out in the case of no piece caused by technique is polluted with processing chamber by increasing the detection function before chip enters processing chamber.
Description
Technical field
The present invention relates to semiconductor applications, more particularly to a kind of chip detection method and equipment.
Background technology
PVD（Physical vapour deposition (PVD)）Refer under vacuum, using low-voltage, the arc-discharge technique of high current, profit
Evaporate target with gas discharge, and evaporated material is ionized with gas, at the same using electric field acceleration, make by
Evaporated material and its reaction product are deposited on chip.The method of physical vapour deposition (PVD) mainly has vacuum evaporation, arc plasma
Body plating, ion film plating and molecular beam epitaxy etc., at present, physical gas phase deposition technology not only can deposited metal film, alloy film,
Can be with deposited compound, ceramics, semiconductor and polymer etc..
Usually ensure processing performance, PVD chamber needs to carry out two kinds of regulation techniques.First regulation technique is pre-burning
Target, pre-burning target are typically to be had been exposed in PVD chamber in air or after deactivation a period of time, by target material surface
Oxide and other impurities remove, during pre-burning target technique, will auxiliary chip or masking disk be covered on pedestal, to prevent
Block compound and other impurities are deposited on pedestal；Second regulation technique is coating, and coating is usually during traditional PVD
The material surface being deposited on PVD chamber inner surface coats one layer of covering, such as：The PVD applications of titanium nitride are generally in PVD
Processing chamber inner surface produces one layer of titanium nitride, and the titanium nitride layer is frangible, and is peeled off during subsequent technique, influences manufacturability
Can, therefore by coating one layer of titanium on the titanium nitride layer surface, to prevent the peeling of titanium nitride layer, ensure subsequent technique performance.
Generally, the every predetermined interval time carries out primary coating.
At present, when carrying out PVD to chip, the equipment of use is as shown in Figure 1.When chip carries out technique in processing chamber
When, pedestal drives chip to rise to process station upwards, in the process, pedestal passes through Cover O- under the driving of Ped motors
ring（Bonnet O-ring）During position, carry Cover O-ring and rise to process station together, now, Cover O-ring will
Chip is fixed on pedestal, carries out technique；After the completion for the treatment of technique, because the process time is long or other reasonses, when Ped motors drive
When moving base is moved to low level, chip is easy to be stuck in above Cover O-ring, and this is just easily lead to when rotating disk enters
When next processing chamber carries out next technique, there is the situation of no piece, pollute pedestal and processing chamber, while can also cause resource
Waste, increase production cost.
The content of the invention
Based on this, it is necessary to the problem of without piece occur when carrying out next technique for chip, there is provided a kind of wafer inspection side
Method and equipment.
A kind of chip detection method, comprises the following steps：
S100, rotating disk receive controller transmission turn to the command signal of preset target position after, start rotate；
S200, when the controller detects that rotating disk places the position correspondence of wafer position and sensor, send detection life
Signal is made to the sensor；
S300, after the sensor receives the sense command signal, detect that the rotating disk places wafer position
State turns to the goal-selling position with when recording status is identical in the sensor, controlling the rotating disk to place wafer position
Put.
Wherein, the step S200 comprises the following steps：
S210, detects the rotating disk placement wafer position and whether the position of the sensor is corresponding；
S220, when the rotating disk places the position correspondence of wafer position and the sensor, send sense command signal
To the sensor；
S220 ', when the rotating disk place the position of wafer position and the sensor not to it is corresponding when put according to the rotating disk
The position of wafer position and the sensor is put, calculates the first rotational angle of the rotating disk；
S230 ', according to the first rotational angle of the rotating disk, control the rotating disk to place wafer position and turn to the biography
The position of sensor.
Wherein, the step S300 comprises the following steps：
S310, after the sensor receives the sense command signal, detect the shape that the rotating disk places wafer position
State；
S320, when the rotating disk places the state of wafer position with recording status difference in the sensor, send report
Alert instruction；
S320 ', when the rotating disk place wafer position state with recording status is identical in the sensor when, according to ought
The preceding rotating disk places wafer position and the preset target position, calculates the second rotational angle of the rotating disk；
S330 ', according to the second rotational angle of the rotating disk, the rotating disk placement wafer position is controlled to turn to described pre-
If target location.
Wherein, also comprise the following steps：
S100 ', according to the position of presently described rotating disk, calculate the position that the rotating disk places wafer position and the sensor
The corresponding relation put.
Accordingly, to realize above-mentioned chip detection method, present invention also offers a kind of wafer detecting device, including turn
Disk, sensor and controller, wherein：
The sensor, it is arranged on rotating disk and places between wafer position and preset target position, above the rotating disk；
The controller, it is connected respectively with the rotating disk and the sensor, including signal transmitting module, the first detection mould
Block and the first control module, wherein：
The signal transmitting module, the command signal of the preset target position is turned to for being sent to the rotating disk；
The first detection module, for detecting that the rotating disk places the position correspondence of wafer position and the sensor
When, sense command signal is sent to the sensor；
First control module, for detecting that the rotating disk places state and the institute of wafer position when the sensor
When stating that recording status is identical in sensor, the rotating disk is controlled to turn to the preset target position.
Wherein, the first detection module includes the first detection unit, the first computing unit and the first control unit, its
In：
Whether first detection unit, the position for detecting rotating disk the placement wafer position and the sensor are right
Should；
First computing unit, for when the rotating disk place wafer position and the position of the sensor it is not corresponding
When, the position of wafer position and the sensor is placed according to the rotating disk, calculates the first rotational angle of the rotating disk；
First control unit, for the first rotational angle according to the rotating disk, the rotating disk is controlled to place chip
Position turns to the position of the sensor.
Wherein, first control module includes the second control unit, the second computing unit and the 3rd control unit, its
In：
Second control unit, for detecting that the rotating disk places state and the institute of wafer position when the sensor
When stating recording status difference in sensor, alarm command is sent；
Second computing unit, for detecting that the rotating disk places state and the institute of wafer position when the sensor
When stating that recording status is identical in sensor, wafer position and the preset target position are placed according to the rotating disk, described in calculating
Second rotational angle of rotating disk；
3rd control unit, for the second rotational angle according to the rotating disk, the rotating disk is controlled to place chip
Position turns to the preset target position.
Wherein, the controller also includes the first computing module, wherein：
First computing module, for the position according to presently described rotating disk, calculate the rotating disk and place wafer position
With the corresponding relation of the position of the sensor.
Wherein, the sensor is distance setting formula sensor.
A kind of chip detection method provided by the invention and equipment, wherein method are that chip is sent into next work in rotating disk
Whether before skill chamber, the state that wafer position is placed to rotating disk detects, deposited with judging the rotating disk to place at wafer position
In chip, if in the presence of by rotating rotating disk, chip being sent into next processing chamber and carries out technique, it is by increasing in chip
Detection function before into processing chamber, it efficiently avoid and the energy waste caused by technique and work are carried out in the case of no piece
The problem of skill chamber contamination.
Brief description of the drawings
Fig. 1 is processing chamber structural representation in PVD equipment；
Fig. 2 is the specific embodiment flow chart of chip detection method one；
Fig. 3 is chip detection method another specific embodiment flow chart；
Fig. 4 is the specific embodiment structural representation of wafer detecting device one；
Fig. 5 is wafer detecting device another specific embodiment structural representation；
Fig. 6 is wafer detecting device still another embodiment structural representation；
Embodiment
For technical solution of the present invention is more clearly understood, the present invention is done into one below in conjunction with drawings and the specific embodiments
Step describes in detail.
Referring to Fig. 2, a kind of chip detection method, comprise the following steps：
S100, rotating disk receive controller transmission turn to the command signal of preset target position after, start rotate；
S200, when controller detects that rotating disk places the position correspondence of wafer position and sensor, send sense command letter
Number to sensor；
S300, after sensor receives sense command signal, detect that rotating disk places the state and sensor of wafer position
When middle recording status is identical, control rotating disk places wafer position and turns to preset target position.
A kind of chip detection method provided by the invention, before chip is sent into next processing chamber by rotating disk, to rotating disk
The state for placing wafer position is detected, and whether there is chip to judge the rotating disk to place at wafer position, if in the presence of leading to
Rotation rotating disk is crossed, chip is sent into next processing chamber carries out technique, and it is by increase before chip enters processing chamber
Detection function, it efficiently avoid the problem of energy waste carried out in the case of no piece caused by technique is polluted with processing chamber.
Here, it should be noted that recording status is when rotating disk places shape when wafer position has chip in sensor
State, when the state that rotating disk places wafer position is identical with the state recorded in sensor, show that rotating disk is placed wafer position and deposited
In chip, next preset target position can be entered, carry out next step process；Meanwhile it is brilliant to control sensor detection rotating disk to place
The process of the state of piece position can also just be detected when rotating disk starts and starts and rotate, and can also be placed in control rotating disk brilliant
When piece position is reached below sensor, then detected.
Referring to Fig. 3, it is preferred that as a kind of embodiment, step S200 comprises the following steps：
S210, detection rotating disk places wafer position and whether the position of sensor is corresponding；
S220, when rotating disk places the position correspondence of wafer position and sensor, sense command signal is sent to sensor；
S220 ', when rotating disk place the position of wafer position and sensor not to it is corresponding when according to rotating disk placement wafer position and
Sensing station, calculate the first rotational angle of rotating disk；
S230 ', according to the first rotational angle of rotating disk, control rotating disk places wafer position and turns to sensing station.
When whether there is chip by sensor detection rotating disk placement wafer position, it must ensure that rotating disk places chip position
Put it is corresponding with the position of sensor, therefore, first detect rotating disk place wafer position whether the position correspondence with sensor, i.e.,
Detect rotating disk and place wafer position whether immediately below sensor；When rotating disk places the position correspondence of wafer position and sensor
When, that is, when rotating disk is placed wafer position and is located at immediately below sensor, controller sends sense command signal, and sensor connects
After receiving sense command signal, detection rotating disk places wafer position and whether there is chip；
When detect rotating disk place the position of wafer position and sensor not to it is corresponding when i.e. rotating disk place wafer position deviation
When immediately below sensor, now, the detection light that sensor emission goes out can not accurately be irradiated to rotating disk and place at wafer position, because
This, places at wafer position so that detection rotating disk places wafer position to ensure that detection light can accurately be irradiated to rotating disk
The result of state is accurately and reliably, it is necessary to controlling rotating disk to place wafer position be located at sensor underface, as a kind of embodiment,
Relation between wafer position and the position of sensor is placed according to current dial, calculates the first rotational angle of rotating disk（That is,
Rotating disk places the angle that wafer position turns to the position of sensor）, and according to the first rotational angle of the rotating disk calculated,
Control rotating disk places the position that wafer position turns to sensor so that and rotating disk is placed wafer position and is located at immediately below sensor,
Detected in order to place wafer position to rotating disk with the presence or absence of chip.
As a kind of embodiment, step S300 comprises the following steps：
S310, after sensor receives sense command signal, detection rotating disk places the state of wafer position；
S320, when recording status difference in the state of rotating disk placement wafer position and sensor, send alarm command；
S320 ', when rotating disk place wafer position state with recording status is identical in sensor when, put according to current dial
Wafer position and preset target position are put, calculates the second rotational angle of rotating disk；
S330 ', according to the second rotational angle of rotating disk, control rotating disk places wafer position and turns to preset target position.
After controlling rotating disk to place the position correspondence of wafer position and sensor, sense command signal is sent to sensor, is passed
After sensor receives sense command signal, wafer position is placed to rotating disk and detected with the presence or absence of chip, can be real as one kind
Mode is applied, the state that sensor places wafer position by detecting rotating disk whether there is crystalline substance to judge that rotating disk places wafer position
Piece；When rotating disk that sensor detects place wafer position state and sensor in recording status not simultaneously as sensor
Middle recording status is that rotating disk places the state that wafer position has chip, shows that now rotating disk places wafer position and crystalline substance is not present
Piece, alarm command is sent, to remind operating personnel to check equipment, it is unrestrained to avoid the energy carried out in the case of no piece caused by technique
The problem of taking.
When rotating disk that sensor detects places the state of wafer position and recording status is identical in sensor, show this
When rotating disk place wafer position and chip be present, next step operation can be carried out, therefore control rotating disk to place wafer position and turn to
Preset target position；As a kind of embodiment, when control rotating disk turns to preset target position, first according to current dial
Wafer position and preset target position are placed, calculates the second rotational angle of rotating disk（That is, rotating disk placement wafer position turns to pre-
If the rotational angle needed for target location）, according to the second rotational angle of the rotating disk calculated, control rotating disk rotates, until turning
Disk places wafer position and turns to preset target position, and next step process is carried out to chip, equally avoids to enter in the case of no piece
The problem of energy waste caused by row technique.
More excellent, as a kind of embodiment, chip detection method provided by the invention also comprises the following steps：
S100 ', according to the position of current dial, calculate rotating disk and place wafer position pass corresponding with the position of sensor
System.
Accordingly, to realize above-mentioned chip detection method, present invention also offers a kind of wafer detecting device, chip inspection
Measurement equipment operation principle is identical with above-mentioned chip detection method principle, therefore, repeats part and repeats no more.
Referring to Fig. 4 to Fig. 6, a kind of wafer detecting device, including rotating disk 510, sensor 520 and controller 530, wherein：
Sensor 520, it is arranged on rotating disk and places between wafer position 511 and preset target position, above rotating disk；
Controller 530, it is connected respectively with rotating disk 510 and sensor 520, including signal transmitting module 531, first detects mould
The control module 533 of block 532 and first, wherein：
Signal transmitting module 531, the command signal of preset target position is turned to for being sent to rotating disk 510；
First detection module 532, for detecting that rotating disk places wafer position 511 and sensor 520 when controller 530
During position correspondence, sense command signal is sent to sensor 520；
First control module 533, for detecting that rotating disk places the state and sensing of wafer position 511 when sensor 520
When recording status is identical in device 520, control rotating disk 510 turns to preset target position.
The explanation of value, sensor 520 are distance setting formula sensor.
It is preferred that as a kind of embodiment, first detection module 532 is counted including the first detection unit 5320, first
The control unit 5322 of unit 5321 and first is calculated, wherein：
Whether the first detection unit 5320, the position for detecting rotating disk placement wafer position 511 and sensor 520 are right
Should；
First computing unit 5321, for placed when rotating disk the position of wafer position 511 and sensor 520 not to it is corresponding when
The position of wafer position 511 and sensor 520 is placed according to rotating disk, calculates the first rotational angle of rotating disk 510；
First control unit 5322, for the first rotational angle according to rotating disk 510, control rotating disk places wafer position
511 turn to the position of sensor 520.
As a kind of embodiment, the first control module 533 includes the second control unit 5330, the second computing unit
5331 and the 3rd control unit 5332, wherein：
Second control unit 5330, for detecting that rotating disk places the state and sensing of wafer position 511 when sensor 520
In device 520 during recording status difference, alarm command is sent；
Second computing unit 5331, for detecting that rotating disk places the state and sensing of wafer position 511 when sensor 520
When recording status is identical in device 520, wafer position 511 and preset target position are placed according to rotating disk, calculate the second of rotating disk 510
Rotational angle；
3rd control unit 5332, for the second rotational angle according to rotating disk 520, control rotating disk places wafer position
511 turn to preset target position.
More excellent, controller 530 also includes the first computing module 534, wherein：
First computing module 534, for the position according to current dial 510, calculate rotating disk and place wafer position 511 with passing
The corresponding relation of the position of sensor 520.
Referring to Fig. 6, as the specific embodiment of the present invention, rotating disk 510 is uniformly divided into 8 regions, wherein 1,3,5,7
Region is that rotating disk places wafer position, and 2,4,6,8 regions are that disk or auxiliary wafer position, X, T, Z, Y region are blocked in rotating disk placement
For the installation site of sensor 520；When carrying out coating process, rotated by rotating disk 510,1,3,5,7 regions are moved respectively
To A, B, C, D processing chamber（Preset target position）Carry out technique；When carrying out pre-burning target or coating processes, by 2,4,6,8
Region is moved respectively to A, B, C, D processing chamber and technique is adjusted.Below with the chip placed in 1 region in A processing chambers
Carry out after technique, it is necessary to be moved to before B processing chambers carry out next step process, the detection that whether there is to 1 region chip is entered
Row describes in detail：
When rotating disk 510 receives after being moved to the command signal of preset target position of controller transmission, rotating disk 510 starts
Rotate, in the rotation process of rotating disk 510, according to the position of current dial 510, calculate 1,2,3,4,5,6,7,8 regions and A, B,
C, D, X, Y, Z, T corresponding relation, and by judging whether 1,3,5,7 regions corresponding with X, T, Z, Y region, when 1,3,5,7 areas
Domain and X, T, Z, Y region to it is corresponding when when 1 region is just rotated into X position between A processing chambers and B processing chambers（Sensor
520 installation site）When below, sensor 520 by the way that detection light is irradiated at 1 region, if what sensor 520 captured
Reflected light by chip of the reflected light that 1 region reflects with being recorded in sensor 520 is identical, then shows exist at 1 region
There is chip, rotating disk 510 can be rotated further, until 1 region is sent into B processing chambers；If sensor 520 capture by
The reflected light of chip of the reflected light that 1 region reflects from being recorded in sensor 520 is different or can not capture reflected light,
Show that chip is not present in 1 region, it is possible to which in the rotation process of rotating disk 510, chip glides or dropped, or is deposited at 1 region
In abnormal conditions, therefore alarm is sent, remind operating personnel's detection device；When 1 region does not turn to X position, it is necessary to control
Rotating disk 510 rotates so that 1 region can reach X position, and a kind of embodiment is, because the rotation of usual rotating disk 510 is with T
On the basis of position and rotate clockwise, therefore, if 1 region is moved to X position by A processing chambers, by 1 region and X positions
The relation put, the first rotational angle of rotating disk 510 is calculated, movement side can be drawn according to the first rotational angle of the rotating disk 510
Case is：Control rotating disk 510 rotates so that 3 area rotations to T location, so as to realize that 1 area rotation to X position, then carries out 1
The detection of zone state.
When detect there are chip at 1 region after, according to the position of current dial 510 and B processing chamber position relationships,
The second rotational angle of now rotating disk 510 is calculated, according to the second rotational angle of the rotating disk 510, can draw and move 1 region
Mobile scheme to B processing chambers is：Control rotating disk 510 rotates so that 4 regions are moved to T location, so as to realize that 1 region is moved
B processing chambers are moved, carry out next step process；When detect chip is not present at 1 region when, send alarm, remind operator
Member checks equipment, while ensureing that process safety is carried out, avoids energy waste and dirt caused by progress technique in the case of no piece
Dye problem.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (9)
1. a kind of chip detection method, it is characterised in that comprise the following steps：
S100, rotating disk receive controller transmission turn to the command signal of preset target position after, start rotate；
S200, when the controller detects that rotating disk places the position correspondence of wafer position and sensor, send sense command letter
Number to the sensor；
S300, after the sensor receives the sense command signal, placed by what the sensor captured by rotating disk
The reflected light of chip of the reflected light that wafer position region reflects with being recorded in the sensor is identical to be judged to detect institute
State rotating disk and place the state of wafer position with when recording status is identical in the sensor, controlling the rotating disk to place wafer position
The preset target position is turned to, technological operation is carried out to chip in the preset target position.
2. chip detection method according to claim 1, it is characterised in that the step S200 comprises the following steps：
S210, detects the rotating disk placement wafer position and whether the position of the sensor is corresponding；
S220, when the rotating disk places the position correspondence of wafer position and the sensor, send the sense command signal
To the sensor；
S220 ', when the rotating disk place the position of wafer position and the sensor not to it is corresponding when according to rotating disk placement crystalline substance
Piece position and the position of the sensor, calculate the first rotational angle of the rotating disk；
S230 ', according to the first rotational angle of the rotating disk, control the rotating disk to place wafer position and turn to the sensor
Position.
3. chip detection method according to claim 2, it is characterised in that the step S300 comprises the following steps：
S310, after the sensor receives the sense command signal, detect the state that the rotating disk places wafer position；
S320, when the rotating disk places the state of wafer position with recording status difference in the sensor, send alarm and refer to
Order；
S320 ', when the rotating disk place wafer position state with recording status is identical in the sensor when, according to current institute
State rotating disk and place wafer position and the preset target position, calculate the second rotational angle of the rotating disk；
S330 ', according to the second rotational angle of the rotating disk, control the rotating disk to place wafer position and turn to the default mesh
Cursor position, technological operation is carried out to chip in the preset target position.
4. according to the chip detection method described in any one of claims 1 to 3, it is characterised in that also comprise the following steps：
S100 ', according to the position of presently described rotating disk, calculate the rotating disk and place wafer position and the position of the sensor
Corresponding relation.
A kind of 5. wafer detecting device, it is characterised in that including rotating disk, sensor and controller, wherein：
The sensor, it is arranged on rotating disk and places between wafer position and preset target position, above the rotating disk；
The controller, be connected respectively with the rotating disk and the sensor, including signal transmitting module, first detection module and
First control module, wherein：
The signal transmitting module, the command signal of the preset target position is turned to for being sent to the rotating disk；
The first detection module, during for detecting that the rotating disk places the position correspondence of wafer position and the sensor,
Sense command signal is sent to the sensor；
First control module, for being reflected back when what is captured by the sensor by rotating disk placement wafer position region
The reflected light of chip of the reflected light come with being recorded in the sensor judges that the sensor detects the rotating disk when identical
It is identical with recording status in the sensor to place the state of wafer position, controls the rotating disk to place wafer position and turns to institute
Preset target position is stated, technological operation is carried out to chip in the preset target position.
6. wafer detecting device according to claim 5, it is characterised in that the first detection module includes the first detection
Unit, the first computing unit and the first control unit, wherein：
First detection unit, for detecting, the rotating disk places wafer position and whether the position of the sensor is corresponding；
First computing unit, for placed when the rotating disk position of wafer position and the sensor not to it is corresponding when root
The position of wafer position and the sensor is placed according to the rotating disk, calculates the first rotational angle of the rotating disk；
First control unit, for the first rotational angle according to the rotating disk, the rotating disk is controlled to place wafer position
Turn to the position of the sensor.
7. wafer detecting device according to claim 6, it is characterised in that first control module includes the second control
Unit, the second computing unit and the 3rd control unit, wherein：
Second control unit, for detecting that the rotating disk places the state of wafer position and the biography when the sensor
In sensor during recording status difference, alarm command is sent；
Second computing unit, for detecting that the rotating disk places the state of wafer position and the biography when the sensor
When recording status is identical in sensor, wafer position and the preset target position are placed according to the rotating disk, calculate the rotating disk
The second rotational angle；
3rd control unit, for the second rotational angle according to the rotating disk, the rotating disk is controlled to place wafer position
The preset target position is turned to, technological operation is carried out to chip in the preset target position.
8. according to the wafer detecting device described in any one of claim 5 to 7, it is characterised in that the controller also includes the
One computing module, wherein：
First computing module, for the position according to presently described rotating disk, calculate the rotating disk and place wafer position and institute
State the corresponding relation of the position of sensor.
9. wafer detecting device according to claim 8, it is characterised in that the sensor is distance setting formula sensing
Device.
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| CN201310752625.9A CN104752253B (en) | 2013-12-31 | 2013-12-31 | Chip detection method and equipment |
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| CN201310752625.9A CN104752253B (en) | 2013-12-31 | 2013-12-31 | Chip detection method and equipment |
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| CN104752253B true CN104752253B (en) | 2018-03-09 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102315086A (en) * | 2010-06-30 | 2012-01-11 | 中芯国际集成电路制造(上海)有限公司 | Device for improving movement accuracy of mechanical arm and use method thereof |
| CN102918640A (en) * | 2010-05-27 | 2013-02-06 | 松下电器产业株式会社 | Plasma processing device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7532940B2 (en) * | 2005-06-16 | 2009-05-12 | Tokyo Electron Limited | Transfer mechanism and semiconductor processing system |
| JP2010153769A (en) * | 2008-11-19 | 2010-07-08 | Tokyo Electron Ltd | Substrate position sensing device, substrate position sensing method, film forming device, film forming method, program, and computer readable storage medium |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102918640A (en) * | 2010-05-27 | 2013-02-06 | 松下电器产业株式会社 | Plasma processing device |
| CN102315086A (en) * | 2010-06-30 | 2012-01-11 | 中芯国际集成电路制造(上海)有限公司 | Device for improving movement accuracy of mechanical arm and use method thereof |
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