CN104750327A - Method for manufacturing element substrate - Google Patents
Method for manufacturing element substrate Download PDFInfo
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- CN104750327A CN104750327A CN201410198025.7A CN201410198025A CN104750327A CN 104750327 A CN104750327 A CN 104750327A CN 201410198025 A CN201410198025 A CN 201410198025A CN 104750327 A CN104750327 A CN 104750327A
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- motherboard
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- 239000000758 substrate Substances 0.000 title claims abstract description 73
- 238000000034 method Methods 0.000 title claims description 92
- 238000004519 manufacturing process Methods 0.000 title abstract description 7
- 239000011521 glass Substances 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 45
- 239000000853 adhesive Substances 0.000 claims description 42
- 230000001070 adhesive effect Effects 0.000 claims description 42
- 239000011248 coating agent Substances 0.000 claims description 42
- 238000000576 coating method Methods 0.000 claims description 42
- 230000001681 protective effect Effects 0.000 claims description 29
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 239000002356 single layer Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 description 27
- 238000005520 cutting process Methods 0.000 description 22
- 238000010586 diagram Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 19
- 238000013461 design Methods 0.000 description 10
- 239000004020 conductor Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 238000005452 bending Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 238000005411 Van der Waals force Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- -1 allyl ester Chemical class 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000012447 hatching Effects 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 241000219289 Silene Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- DNAUJKZXPLKYLD-UHFFFAOYSA-N alumane;molybdenum Chemical compound [AlH3].[Mo].[Mo] DNAUJKZXPLKYLD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000005518 polymer electrolyte Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Abstract
The invention provides a manufacturing method of an element substrate, which comprises the following steps. Attaching a thin mother board to a carrier plate, wherein the thin mother board is made of glass and has a thickness of 0.035 mm to 0.25 mm. A plurality of independent element units are formed on a thin motherboard. The thin mother board is cut into a plurality of thin substrates, and one element unit is arranged on each thin substrate. Separating the thin motherboard from the carrier.
Description
Technical field
The invention relates to a kind of method making element, and relate to a kind of method for making of device substrate especially.
Background technology
In various electronic product now, use contact panel (touch panel) to replace the conventional input devices such as keyboard and mouse as man-machine data communication interface, to reduce the volume of electronic product widely.Existing contact panel use the thickness of substrate about 0.4 millimeter of (mm) ~ 0.55 millimeter (mm), this cannot meet the requirement for the thickness of slimming contact panel on market gradually.In addition, along with the increase of on-plane surface touch-control demand, contact panel is required to have pliability.So in existing product, great majority are still using plastic substrate as the substrate of contact panel.
But the endurance of plastic substrate itself and scratch resistance comparatively glass substrate are poor, and the light transmittance of material is lower than glass substrate.In processibility and look in the sharpness of effect, use the product of plastic substrate can be starkly lower than the product using glass substrate.For example, the visible ray penetrance of common plastic rubber substrate and glass baseplate is compared as follows table:
| Project | Glass | PC | PET | PES |
| Relative visible ray penetrance (%) | 100 | 90 | 88 | 90 |
Therefore, in existing product design, be limited to the condition of baseplate material, still cannot take into account the requirement of market for product slimming, product pliability and Product Visual effect.
Summary of the invention
The invention provides a kind of method for making of device substrate, slimming element can be produced to meet the need of market.
The method for making of device substrate of the present invention, comprises the following steps.Be attached on a support plate by a slim motherboard, wherein the material of slim motherboard comprises glass, and the thickness of slim motherboard is 0.035 millimeter to 0.25 millimeter.Multiple cell independent of each other is formed on slim motherboard.Slim motherboard is cut into multiple thin base to make each thin base is provided with one of them cell.Slim motherboard is separated with support plate.
In an embodiment of the present invention, adhesive coating is a release glue-line.Adhesive coating can comprise multiple adhesion pattern, and pattern of adhering is each other by a separated.On the one hand, each adhesion pattern is adhered between one of them thin base and support plate, and each gap is between adjacent two thin bases.Now, the method slim motherboard being cut into thin base comprises cuts slim motherboard along gap.On the other hand, each gap is between one of them thin base and support plate, and each adhesion pattern is between adjacent two thin bases.Now, the method slim motherboard being cut into thin base comprises the slim motherboard of edge cuts along adhesion pattern.
In an embodiment of the present invention, the method slim motherboard being attached at support plate comprises allows slim motherboard directly be contacted with support plate.
In an embodiment of the present invention, slim motherboard is peeled off on support plate after making thin base be separated support plate, more slim motherboard is cut into multiple thin base.After slim motherboard is peeled off on support plate, and before slim motherboard is cut into multiple thin base, also form a protective seam on slim motherboard, and protective seam and cell are positioned at the relative both sides of slim motherboard.The method forming protective seam comprises the multiple protected location of formation, and each protected location is configured on one of them thin base.
In an embodiment of the present invention, thin base to be separated with support plate and the method that slim motherboard cut into multiple thin base comprises the following steps.Cut slim motherboard and support plate to make slim motherboard cut into multiple thin base and to make support plate cut into multiple sub-support plate simultaneously, wherein each sub-support plate is pasted with one of them thin base.Peel off on self-corresponding for each thin base support plate.
In an embodiment of the present invention, thin base to be separated with support plate and the method that slim motherboard cut into multiple thin base comprises the following steps.Cut slim motherboard to be attached on support plate to make the multiple thin bases cut into by slim motherboard simultaneously.Thin base is peeled off one by one on support plate.
In an embodiment of the present invention, each thin base also forms a protective seam, and protective seam and cell are positioned at the relative both sides of one of them corresponding thin base.
In an embodiment of the present invention, before slim motherboard is attached at support plate, is also included on slim motherboard and forms a protective seam, and when slim motherboard is attached at support plate, protective seam is between support plate and slim motherboard.The method forming protective seam comprises the multiple protected location of formation, and each protected location is configured on one of them thin base.
In an embodiment of the present invention, the method for forming element unit comprises the multiple touch control unit of formation.Each touch control unit is a projected capacitive touch unit.
In an embodiment of the present invention, the method for forming element unit comprises the multiple touch control unit of formation.Each touch control unit is a single-layer electrodes touch control unit or a multi-layered electrode touch control unit.
In an embodiment of the present invention, slim motherboard is formed by multiple stack of thin, and the material of at least one of these thin layers is glass.The material of these thin layers at least another one is macromolecular material.In addition, when slim motherboard is attached at support plate, at least one of these thin layers at these thin layers between its other and support plate.
In an embodiment of the present invention, after being separated with support plate by thin base, also form an offside cell on each thin base, and offside cell and corresponding cell are positioned at the relative both sides of thin base.
Based on above-mentioned, the method for making of the device substrate of the embodiment of the present invention uses the thin base of glass material.Thus, the thin base being manufactured with cell has more desirable optical characteristics except the flexible zone properties having thin material and possess, and meets the demand of market to electronic product.The good electronic installation of slimming, optical quality can be produced according to the method for making of the electronic installation of the embodiment of the present invention.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and shown in coordinating, accompanying drawing is described in detail below.
Accompanying drawing explanation
Figure 1A to Fig. 1 G is the process flow diagram making element on thin base of first embodiment of the invention;
Fig. 2 A to Fig. 2 D is the process flow diagram making element on thin base of second embodiment of the invention;
Fig. 3 A to Fig. 3 C is the process flow diagram making element on thin base of third embodiment of the invention;
Fig. 4 A to Fig. 4 D is the process flow diagram making element on thin base of fourth embodiment of the invention;
Fig. 5 A to Fig. 5 D is the process flow diagram making element on thin base of fifth embodiment of the invention;
Fig. 6 A to Fig. 6 E is the process flow diagram making element on thin base of sixth embodiment of the invention;
Fig. 7 A to Fig. 7 F is the process flow diagram making element on thin base of seventh embodiment of the invention;
Fig. 8 A to Fig. 8 C is the process flow diagram making element on thin base of eighth embodiment of the invention;
Fig. 9 is the schematic diagram of the device substrate of one embodiment of the invention;
Figure 10 is the upper schematic diagram of the electronic installation of one embodiment of the invention;
Figure 11 A to Figure 11 H is the various embodiments figure of electronic installation along the section of hatching line I-I of Figure 10;
Figure 12 A to Figure 12 C is multiple enforcement illustrations that cell has touch-control sensing function.
Description of reference numerals:
10: support plate;
12: sub-support plate;
20,30,40,1300,1500: adhesive coating;
32,42: adhesion pattern;
100,200,300: device substrate;
110: slim motherboard;
112,112A: thin base;
120,120A, TP1, TP2, TP3: cell; 130,140,1400: protective seam;
132,142: protected location;
150: offside cell;
1000,100A ~ 100H: electronic installation;
1002: central area;
1004: surrounding zone;
1100,1100F, 1100G, 1100H: overlay;
1102, the 1102G: the first side;
1104: the second sides;
1106,1106F, 1106G: sidewall;
1200: decorative layer;
A112: first surface;
B1: the first connecting electrode;
B2: the second connecting electrode;
B112: the second;
C1 ~ C7: cutting track;
E1, E3, E5: the first conductive electrode;
E2, E4, E6: the second conductive electrode;
F: circuit board;
F1: the first connecting portion;
F2: the second connecting portion;
G1, G2, G3: gap;
M: insulating pattern;
S1: the first sensing part;
S2: the second sensing part;
T: thickness;
I-I: hatching line.
Embodiment
Figure 1A to Fig. 1 G is the process flow diagram making element on thin base of first embodiment of the invention.Please also refer to Figure 1A, be attached on a support plate 10 by a slim motherboard 110 by an adhesive coating 20, wherein the material of slim motherboard 110 comprises glass, and the thickness T of slim motherboard 110 is 0.035 millimeter to 0.25 millimeter.
Slim motherboard 110 can be a slim glass plate, also can be a slim composite plate by multiple stack of thin.When slim motherboard 110 is slim composite plate, the material of at least one of these thin layers is glass, and the glass material person in these thin layers can between the other and support plate 10.That is, slim motherboard 110 has the optical characteristics of glass substrate, such as high visible ray penetrance.In addition, in these thin layers, at least the material of another one can be macromolecular material.Further, slim motherboard 110 can be formed by least three stack of thin, and it is such as sequentially stacking flass, polymer electrolyte thin layer and another flass.Thus, the outermost layer of slim motherboard 110 has the physical property of glass material and can provide desirable endurance and anti-drawing together property.Certainly, above-mentioned three thin layers are only the use illustrated, and are not used to limit the present invention.
In the present embodiment, the thickness T-phase of slim motherboard 110 is when thin, and this makes slim motherboard 110 easily bending and cannot directly at the making step of the enterprising units of slim motherboard 110.Particularly, under the support not having support plate 10, on slim motherboard 110, directly make element will easily make slim motherboard 110 excessive and cracked because bending.Therefore, the present embodiment adopts support plate 10 carry and support slim motherboard 110, and wherein support plate 10 can be the hard substrate with supportive.The physical characteristics of support plate 10 is generally required to be enough to tolerate the condition such as temperature, pressure, potential of hydrogen needed for later fabrication steps.The material of support plate 10 can be glass, quartz or macromolecular material.
Adhesive coating 20 is used to provide the effect of temporary adhesion, and slim motherboard 110 can is temporarily attached in subsequent step and be fixed on support plate 10.Adhesive coating 20 is coat by entire surface between support plate 10 and slim motherboard 110 in the present embodiment, but in other embodiments, adhesive coating 20 can only be coated in specific region.
Then, please refer to Figure 1B, on slim motherboard 110, form multiple cell 120.It is worth mentioning that, multiple cells 120 of the present embodiment are estimated to form different devices, so these cells 120 are independent of each other, and a clearance G 1 of being separated by between adjacent two cells 120.Multiple independently cell is produced on slim motherboard 110 and contributes to reduction manufacturing process and lifting make efficiency by the present embodiment together.The method for making of cell 120 comprises rete forming step, patterning step or both combinations.Specifically, cell 120 can be touch control unit, electrode unit, active cell array, color filter patterns array or above-mentioned combination according to actual design demand.Therefore, the step making cell 120 can comprise deposition step, transfer step, application step, micro-shadow step, etching step at least one.
In the process making cell 120, slim motherboard 110 is all be attached on support plate 10.Therefore, slim motherboard 110 is not easy to occur because of gravity, external pressure or other factors significantly to bend, this helps avoid and causes cell 120 bad because of the error for the treatment of conditions, also helps avoid slim motherboard 110 because bending is excessively damaged.
Please then with reference to Fig. 1 C, after cell 120 completes, in order to reduce cell 120 situation impaired in subsequent step, the present embodiment can form a protective seam 130 further on cell 120.Protective seam 130 can patterning and comprise multiple protected location 132, and each protected location 132 is configured on one of them cell 120.Now, be also generally separated with clearance G 1 mutually between adjacent two protected locations 132, the region that therefore slim motherboard 110 corresponds to clearance G 1 is exposed.But not as limit, protective seam 130 wherein also can be configured on each cell 120 and slim motherboard 110 comprehensively.
In the present embodiment, referring to Fig. 1 C and Fig. 1 D, slim motherboard 110 and support plate 10 can be cut and cutting track C1 conform to clearance G 1 to distribute along cutting track C1 further.Thus, slim motherboard 110 and support plate 10 are cut into multiple thin base 112 and multiple sub-support plate 12 respectively.Each thin base 112 be provided with one of them cell 120 and be still attached on one of them sub-support plate 12 by adhesive coating 20.
Afterwards, please refer to Fig. 1 E and Fig. 1 F, thin base 112 is separated with sub-support plate 12, namely obtain device substrate 100.At this, the function that device substrate 100 can provide can be depending on the function of cell 120.For example, when cell 120 is touch control component, device substrate 100 is such as touch base plate, and each touch control unit can be a projected capacitive touch unit, and projecting type capacitor touch control unit can be a single-layer electrodes touch control unit or a multi-layered electrode touch control unit.When cell 120 is colour filter array, device substrate 100 is colored optical filtering substrates.In addition, in the present embodiment, because adhesive coating 20 is a kind of release glue-lines, it only provides the effect temporarily attached.Therefore, the method be separated with sub-support plate 12 by thin base 112 is such as divest method, and thin base 112 is mainly separated by the applying of external force by it on sub-support plate 12.
But, in other embodiments, can be that mode by reducing adhesive coating 20 viscosity is carried out by the method that thin base 112 is separated with sub-support plate 12.For example, it is higher that the material characteristic of adhesive coating 20 shows as temperature, and viscosity is lower, then the method be separated with sub-support plate 12 by thin base 112 can temperature-raising method, is realized by the viscosity destroying adhesive coating 20.Or it is higher that the material characteristic of adhesive coating 20 shows as humidity, and viscosity is lower, then the method that thin base 112 is separated with sub-support plate 12 can be improved humidity or infusion method.
In the present embodiment, after thin base 112 is separated on sub-support plate 12, adhesive coating 20 can have at least one part to remain on thin base 112, as shown in fig. 1f.Therefore, after thin base 112 is separated on sub-support plate 12, selectively carries out an adhesive coating and remove step and remove on thin base 112 to allow adhesive coating 20, as shown in Figure 1 G.
Fig. 2 A to Fig. 2 D is the process flow diagram making element on thin base of second embodiment of the invention.The method for making of the present embodiment can comprise the step of carrying out aforementioned Figure 1A to Fig. 1 C, and therefore the embodiment of these steps with reference to aforementioned explanation, separately can not repeat herein.Please refer to Fig. 2 A and Fig. 2 B, on slim motherboard 110 after forming element unit 120 and protected location 132, can be separated whole for slim motherboard 110 on support plate 10.Afterwards, with reference to Fig. 2 C, slim motherboard 110 is cut along cutting track C2, and forms the device substrate 100 of Fig. 2 D.Now, slim motherboard 110 is cut into multiple thin base 112, and on each cell 120 thin base 112 disposed therein.That is, the present embodiment just these thin bases 112 is cut into independently individuality after allowing all thin bases 112 first peel off on support plate 10.
In the present embodiment, slim motherboard 110 whole on support plate 10 be separated after, support plate 10 can be contributed to by using again reduce production cost.In addition, slim motherboard 110 is whole after separation, first can remove the step of carrying out again cutting slim motherboard 110 on support plate 10 by adhesive coating 20.Or, after slim motherboard 110 cuts into multiple thin base 112, then carry out the step removing adhesive coating 20.
Fig. 3 A to Fig. 3 C is the process flow diagram making element on thin base of third embodiment of the invention.The method for making of the present embodiment can comprise the step of carrying out aforementioned Figure 1A to Fig. 1 C, and therefore the embodiment of these steps with reference to aforementioned explanation, separately can not repeat herein.Please refer to Fig. 3 A, in the present embodiment, when cutting track C3 cuts slim motherboard 110, do not cut support plate 10.Therefore, as shown in Figure 3 B, although these thin bases 112 cut into by slim motherboard 110 are separated from one another, be still attached on support plate 10 simultaneously.Afterwards, the step of Fig. 3 C represents, these thin bases 112 separated from one another are peeled off one by one on support plate 10, to form independently device substrate 100.In the present embodiment, support plate 10 is not cut, and therefore support plate 10 can be contributed to by using reducing cost of manufacture once again.In addition, the present embodiment must not be separated whole for slim motherboard 110 by support plate 10, can reduce slim motherboard 110 because the curved transitions of detachment process and the situation of crack damage.
Fig. 4 A to Fig. 4 D is the process flow diagram making element on thin base of fourth embodiment of the invention.Please refer to Fig. 4 A, be attached on a support plate 10 by a slim motherboard 110 by an adhesive coating 30, wherein adhesive coating 30 comprises multiple adhesion pattern 32, and these adhesion patterns 32 are separated each other by a clearance G 2.In the present embodiment, slim motherboard 110 can with reference to the description of previous embodiment with design with the material of support plate 10.
Then, as shown in Figure 4 B, slim motherboard 110 forms multiple cell 120, and adjacent two cells 120 are separated with clearance G 1 mutually.It is worth mentioning that, in the present embodiment, each cell 120 clearance G 1 corresponding to and each one of them pattern 32 of adhering corresponds to each other with one of them clearance G 2.That is, clearance G 2 is between adjacent two cells 120.
Then, as shown in Figure 4 C, each cell 120 is formed corresponding protected location 132, and cuts slim motherboard 110 along cutting track C4.Now, cutting track C4 conforms to clearance G 2, therefore slim motherboard 110 be cut into multiple thin base 112 and these thin bases 112 each via one of them adhesion pattern 32 be attached on support plate 10.Afterwards, as shown in Figure 4 D, by these thin bases 112 one by one on support plate 10 peel off can obtain independently device substrate 100.That is, adhesive coating 30 design of the present embodiment makes between the clearance G 2 of adhering between pattern 32 thin base 112 under adjacent two predetermined cuts.
Fig. 5 A to Fig. 5 D is the process flow diagram making element on thin base of fifth embodiment of the invention.Please refer to Fig. 5 A, be attached on a support plate 10 by a slim motherboard 110 by an adhesive coating 40, wherein adhesive coating 40 comprises multiple adhesion pattern 42, and these adhesion patterns 42 are separated each other by a clearance G 3.In the present embodiment, slim motherboard 110 can with reference to the description of previous embodiment with design with the material of support plate 10.
Then, as shown in Figure 5 B, slim motherboard 110 forms multiple cell 120, and adjacent two cells 120 are separated with clearance G 1 mutually.It is worth mentioning that, in the present embodiment, each clearance G 1 cell 120 corresponding to and each one of them pattern 42 of adhering corresponds to each other with one of them clearance G 3.
Then, as shown in Figure 5 C, each cell 120 is formed corresponding protected location 132, and cuts slim motherboard 110 along cutting track C5.Now, cutting track C5 conform to adhesion pattern 42 distribute, therefore slim motherboard 110 be cut into multiple thin base 112 and these thin bases 112 after the cutting step just on support plate 10 stripping and obtain independently device substrate 100, as shown in Figure 5 D.That is, adhesive coating 40 design of the present embodiment makes between the thin base 112 of each adhesion pattern 42 under adjacent two predetermined cuts.Further, before carrying out cutting step, be accompany clearance G 3 between the thin base 112 that each is predetermined will cut down and support plate 10.
Fig. 6 A to Fig. 6 E is the process flow diagram making element on thin base of sixth embodiment of the invention.Please refer to Fig. 6 A, first on slim motherboard 110, form a protective seam 140, it comprises multiple protected location 142, but not as limit, protective seam 140 wherein also can be formed on slim motherboard 110 comprehensively.Then, with reference to Fig. 6 B, be attached on a support plate 10 by slim motherboard 110 by an adhesive coating 40, wherein adhesive coating 40 comprises multiple adhesion pattern 42, and these adhesion patterns 42 are separated each other by a clearance G 3.In the present embodiment, slim motherboard 110 can with reference to the description of previous embodiment with design with the material of support plate 10.In addition, when slim motherboard 110 is attached at support plate 10, these protected locations 142 are between support plate 10 and slim motherboard 110.
Then, as shown in Figure 6 C, slim motherboard 110 forms multiple cell 120, and adjacent two cells 120 are separated with clearance G 1 mutually.It is worth mentioning that, in the present embodiment, each clearance G 1 cell 120 corresponding to and each one of them pattern 42 of adhering corresponds to each other with one of them clearance G 3.
Then, as shown in Figure 6 D, each cell 120 is formed corresponding protected location 132, and cuts slim motherboard 110 along cutting track C5.Now, cutting track C5 conforms to adhesion pattern 42 and distributes, it is such as the slim motherboard 110 of edge cuts along adhesion pattern 42, therefore slim motherboard 110 be cut into multiple thin base 112 and these thin bases 112 after the cutting step just on support plate 10 peel off and obtain independently device substrate 200, as illustrated in fig. 6e.Each device substrate 200 includes thin base 112, cell 120, protected location 132 and protected location 142.Cell 120 and protected location 142 are positioned at the relative both sides of thin base 112, and cell 120 is between protected location 132 and thin base 112.In addition, adhesive coating 40 design of the present embodiment makes between the thin base 112 of each adhesion pattern 42 under adjacent two predetermined cuts.Further, before carrying out cutting step, be accompany clearance G 3 between the thin base 112 that each is predetermined will cut down and support plate 10.It is worth mentioning that, in the 5th embodiment and the 6th embodiment, after slim motherboard 110 cuts, each thin base 112 is just separated with support plate 10, and does not need the step additionally carrying out removing adhesive coating 40.
Fig. 7 A to Fig. 7 F is the process flow diagram making element on thin base of seventh embodiment of the invention.Please refer to Fig. 7 A, the present embodiment allows and slim motherboard 110 is directly contacted with support plate 10.Because the material of slim motherboard 110 comprises glass, particularly, the material of slim motherboard 100 superficial layer is glass, together with being attached to both slim motherboard 110 and the Van der Waals force between support plate 10 can allow.Therefore, the present embodiment and the aforementioned Main Differences implementing profit are, the present embodiment does not need to use adhesive coating 20,30 or 40.
Then, with reference to Fig. 7 B to Fig. 7 C, slim motherboard 110 sequentially forms multiple cell 120 and protected location 132.In the present embodiment, adjacent two cells 120 are separated by a clearance G 1, and the step of Fig. 7 B to Fig. 7 C with reference to the explanation of previous embodiment, separately can not repeat.Afterwards, with reference to Fig. 7 D, be separated whole for slim motherboard 110 by support plate 10.The step of Fig. 7 can be realized by the Van der Waals force destroyed between slim motherboard 110 and support plate 10, or is separated slim motherboard 110 and support plate 10 by applying external force.
Then, as seen in figure 7e, slim motherboard 110 forms multiple protected location 142, each protected location 142 is corresponding with one of them cell 120.Further, these protected locations 142 and these cells 120 are positioned at the relative both sides of slim motherboard 110.In addition, the present embodiment further cuts slim motherboard 110 along cutting track C6.At this, cutting track C6 such as conform to clearance G 1, to form the device substrate 200 shown in Fig. 7 F.
Fig. 8 A to Fig. 8 C is the process flow diagram making element on thin base of eighth embodiment of the invention.The method for making of the present embodiment can comprise the step of carrying out earlier figures 7A to Fig. 7 C, and therefore the embodiment of these steps with reference to aforementioned explanation, separately can not repeat herein.Please refer to Fig. 8 A, on slim motherboard 110 after forming element unit 120 and protected location 132, slim motherboard 110 can be cut along cutting track C7 together with support plate 10.Afterwards, with reference to Fig. 8 B, slim motherboard 110 is divided into multiple thin base 112, and support plate 10 is separated into multiple sub-support plate 12.Each thin base 112 is provided with one of them cell 120 and still by Van der Waals bonding on one of them sub-support plate 12.Then, with reference to Fig. 8 C, apply external force or destroy thin base 112 with the Van der Waals force between sub-support plate 12, thin base 112 to be separated with sub-support plate 12, and form independently device substrate 100.In the 7th embodiment and the 8th embodiment, make before slim motherboard 110 is directly contacted with support plate 10, can be formed on slim motherboard 110 heterosphere to avoid the Van der Waals force between slim motherboard 110 and support plate 10 too powerful not segregative situation.This heterosphere is such as indium tin oxide layer, and its thickness can in 20 nanometer to 40 nanometers.
Fig. 9 is the schematic diagram of the device substrate of one embodiment of the invention.Please refer to Fig. 9, device substrate 300 can make according to any one method for making of previous embodiment and include thin base 112 and cell 120.In addition, in the present embodiment, when making device substrate 300, also comprise formation one offside cell 150 on thin base 112, and cell 120 and offside cell 150 are positioned at the relative both sides of thin base 112.That is, cell 120 is formed at first surface A112 and offside cell 150 is formed at second B112.When making offside cell 150, first the first surface A112 of thin base 112 can be attached on support plate, and make according to any one production method of previous embodiment.In addition, for example, when cell 120 consists of touch control component with offside cell 150 element, device substrate 300 is such as touch base plate, each touch control unit can be a projected capacitive touch unit, and projecting type capacitor touch control unit can be two-layer electrode touch control unit.
Above-mentioned multiple embodiment illustrates the method for making of device substrate.But, the present invention does not need to be defined in the step described in above-mentioned specific embodiment.For example, in above-described embodiment, protective seam 130 and protective seam 140 are patterned as multiple independently protected location 132 and 142 and the ductility of protective seam can be avoided to affect cut yield.That is, cutting step can relatively easily by cutting of members.In addition, protective seam 130 can omit depending on actual design with configuration with the making of protected location 132, or protected location 132 can be the some of cell 120.Protective seam 140 and protected location 142 also can be looked situation and omit.Therefore, device substrate 100 and 200 only can include in fact thin base 112 and cell 120.Above separating step and the sequencing of cutting step do not need to be particularly limited to yet.Adhesive coating 20,30 and 40 described in above embodiment optionally removes on thin base 112, or remaines on thin base 112.
Device substrate made by above embodiment can be assembled in an electronic installation, will illustrate the method for making of the electronic installation of application element thereof substrate below.Figure 10 is the upper schematic diagram of the electronic installation of one embodiment of the invention.According to Figure 10.Electronic installation 1000 has the profile like rectangle in top view, and its corner can be designed as fillet (or claiming R angle).Electronic installation 1000 has central area 1002 and a surrounding zone 1004, and wherein surrounding zone 1004 is at least positioned at the side of central area 1002.
Figure 11 A to Figure 11 H is the various embodiments figure of electronic installation along the section of hatching line I-I of Figure 10.Following embodiment indicates electronic installation with 1000A to 1000H respectively, but the top view of following cross-sectional embodiments can have aspect as shown in Figure 10.Please also refer to Figure 11 A, electronic installation 1000A comprises overlay 1100, decorative layer 1200, thin base 112, cell 120 and an adhesive coating 1300.At this, thin base 112 and cell 120 can make with reference to the method for making of the aforementioned the first to the eight embodiment.Therefore, the thickness of thin base 112 about 0.035 millimeter is to 0.25 millimeter and its material comprises glass.Cell 120 is touch control component unit in the present embodiment, but the present invention is not as limit.Cell 120 can be connected to a circuit board F, and circuit board F is used for inputting or outputing signal to cell 120.
Overlay (Cover lens) 1100 is hard substrates, and in sectional view, the side of overlay 1100 can via becoming the side be made up of a plurality of plane after chamfer machining, it is commonly referred to as C angle.In addition, the side of overlay 1100 also can become a curved surface via after processing process, and it is commonly referred to as R angle.Overlay 1100 has the first side 1102 and the second side 1104 respect to one another, and wherein the first side 1102 is the outermost being set to whole device or product.That is, when user is to carry out touch control operation, the first side 1102 directly can be touched.In addition, the element of the functions such as touch-control sensing function and Presentation Function be provided then all to be arranged at the second side 1104.Overlay 1100 is the hard substrate of high mechanical properties, such as can be tempered glass, or complex plastic substrate, such as carbonic allyl ester (propylene carbonate, be called for short: PC) and polymethylmethacrylate (Polymethylmethacrylate, be called for short: composite base plate PMMA).
Decorative layer 1200 is configured on overlay 1100, and is positioned at the second side 1104, and its color can be black and white or colour.Decorative layer 1200 is positioned in fact on the surrounding zone 1004 of Figure 10.In one embodiment, whether the surrounding zone 1004 of Figure 10 can divide according to the configuration of decorative layer 1200 in fact with central area 1002.That is, the region being configured with decorative layer 1200 is surrounding zone 1004 and does not configure decorative layer 1200, and such as decorated layer 1200 around region be central area 1002.The material of decorative layer 1200 includes photoresist, class bores carbon, stupalith, ink or above-mentioned combination.Decorative layer 1200 can have single layer structure or sandwich construction.For example, when decorative layer 1200 is polychromy layers, decorative layer 1200 can be made up of one deck or multi layer colour ink layer or be made up of one deck or multilayer photoresist layer.On colored ink layers arc or photoresist layer, can also a shielding layer or reflection horizon be set further, to increase the shading character of decorative layer 1200.In other words, shielding layer or reflection horizon be provided with the optical density (OD) helping improve decorative layer 1200.At this, the material of shielding layer can be ink material, photoresist, class bore carbon, stupalith or other materials, and it has semi-transparent character, low light transmitting property or light tight character.In one embodiment, shielding layer can allow infrared light to pass.In some unshowned embodiments, an image that can be easily seen by the user can be had in the surrounding zone 1004 at decorative layer 1200 place, such as word, trade mark, decorative pattern or function key etc.Or the part of decorative layer 1200 can patterned hollow out, thus forms a light openings pattern.
Together with adhesive coating 1300 is used for thin base 112 to be attached to overlay 1100 in the present embodiment, it can possess visible ray penetrability.That is, adhesive coating 1300 can be optical cement layer.In addition, adhesive coating 1300 and cell 120 are positioned at the relative both sides of thin base 112 in the present embodiment, but the present invention is not as limit.In addition, cell 120 is touch control component unit, therefore can the function of touch control operation in order to provide at central area 1002, and cell 120 has a part at least or all status is at central area 1002.But, when other embodiments need to provide touch control operation function in surrounding zone 1004, cell 120 can be situated in surrounding zone 1004.
The embodiment of Figure 11 B is roughly similar in appearance to the embodiment of Figure 11 A, and therefore identical in two embodiments element indicates with identical component symbol.In Figure 11 B, electronic installation 1000B is set to allow adhesive coating 1300 and cell 120 the same sides at thin base 112.That is, cell 120 is between adhesive coating 1300 and thin base 112.
The embodiment of Figure 11 C is also roughly similar in appearance to the embodiment of Figure 11 A.But, in Figure 11 C, the relative both sides that electronic installation 1000C is set to thin base 112 are respectively arranged with cell 120 and offside cell 150, and cell 120 is between adhesive coating 1300 and thin base 112.Now, circuit board F then has the first connecting portion F1 and the second connecting portion F2 to be connected to cell 120 and offside cell 150 respectively.
The electronic installation 1000D of Figure 11 D, roughly similar in appearance to the electronic installation 1000A of Figure 11 A, the overlay 1100 that both difference is mainly electronic installation 1000D is provided with protective seam 1400, and protective seam 1400 covers the sidewall 1106 of overlay 1100.
The electronic installation 1000E of Figure 11 E is roughly similar in appearance to Figure 11 D electronic installation D, both difference is mainly that electronic installation 1000E also includes another thin base 112A and another cell 120A, and thin base 112A is attached at thin base 112 by adhesive coating 1500.Now, cell 120A is between thin base 112 and thin base 112A.Cell 120 and cell 120A are electrode unit respectively, and both collocation can provide touch-control sensing function.In addition, adhesive coating 1500 can be optical cement.
The embodiment of Figure 11 F is roughly similar in appearance to the embodiment of Figure 11 A, and therefore identical in two embodiments element indicates with identical component symbol.In Figure 11 F, the overlay 1100F of electronic installation 1000F has curved wall 1106F.Such overlay 1100F can be called 2.25D overlay.The embodiment of Figure 11 G is roughly similar in appearance to the embodiment of Figure 11 A, and therefore identical in two embodiments element indicates with identical component symbol.In Figure 11 G, the overlay 1100G of electronic installation 1000G has curved wall 1106F.Further, the profile of the first side 1102G is also arc in section.Such overlay 1100G can be called 2.5D overlay or 2.5D lens.The embodiment of Figure 11 H is roughly similar in appearance to the embodiment of Figure 11 A, and therefore identical in two embodiments element indicates with identical component symbol.In Figure 11 H, the overlay 1100H of electronic installation 1000H is bent into arc.Now, because thin base 112 thickness is thinned to be enough to flexure, thin base 112 can attach bending overlay 1100H and conform to the bending amplitude of overlay 1100H.
In the above-described embodiments, the specific design of cell 120,120A and offside cell 150 can decide according to the function that will provide.Make a reservation for will provide touch-control sensing function to illustrate with these cells and offside cell below.Figure 12 A to Figure 12 C is multiple enforcement illustrations that cell has touch-control sensing function.In fig. 12, cell TP1 comprises multiple first sensing part S1, multiple second sensing part S2 and is arranged at the first sensing part S1 and the second sensing part S2 and to interlock multiple insulating pattern M of part.
First sensing part S1 comprises a plurality of first conductive electrode E1 and a plurality of first connecting electrode B1, and two wherein adjacent the first conductive electrode E1 are electrically connected by least one first connecting electrode B1.Second sensing part S2 comprises a plurality of second conductive electrode E2 and a plurality of second connecting electrode B2, and two wherein adjacent the second conductive electrode E2 are electrically connected by least one second connecting electrode B2.
In the present embodiment, insulating pattern M covers the first connecting electrode B1, and the second connecting electrode B2 is arranged on insulating pattern M, and the first sensing part S1 and the second sensing part S2 is electrically insulated.First conductive electrode E1 and the second conductive electrode E2 is suitable for forming coupling capacitance, occurs to sense touch-control event.Specifically, first conductive electrode E1, the second conductive electrode E2 and the first connecting electrode B1 can first be made on substrate (such as aforesaid thin base 112), cover respectively on the first connecting electrode B1 with multiple insulating pattern M again, make the second connecting electrode B2 subsequently.But the present invention does not limit for this reason.
By the first conductive electrode E1 and the second conductive electrode E2, if have conductive body (such as pointing) near to or in contact with the surface of electronic installation, point by and mutually close conductive electrode between form coupling capacitance, thus there is the change of capacity effect at finger near to or in contact with region, to detect the position of finger or to move.Wherein, finger such as, across an insulator, overlay, can carry out the touch control operation touching insulator outside surface.Or, finger can close to but do not contact electronic installation to carry out suspension touch control operation.In addition, contact coordinate relevant measurement method about capacitive touch control techniques can with reference to the contact coordinate measuring method known at present, such as self-capacitance measuring method or mutual capacitance measuring method, embodiment such as the first sensing part S1 is a drive electrode, second sensing part S2 is the mutual capacitance measuring method of a sensing electrode, or the first sensing part S1 or the second sensing part S2 can serve as the start of driving and sensing separately to carry out self-capacitance measuring method.Self-capacitance measuring method or mutual capacitance measuring method are applicable to other implementation contents of the present invention, but the present invention not limited by particular measurement method.
The cell TP2 of Figure 12 B includes multiple first conductive electrode E3 and the second conductive electrode E4, and wherein the first conductive electrode E3 and the second conductive electrode E4 is made up of same material layer.Therefore, cell TP2 is the element of single conductive layer.With the present embodiment, the first conductive electrode E3 has pectination or finger-like profile separately, and each second conductive electrode E4 is arranged between adjacent two fingers of the first conductive electrode E3.
The cell TP3 of Figure 12 C includes multiple first conductive electrode E5 and multiple second conductive electrode E6, and wherein the first conductive electrode E5 and the second conductive electrode E6 is interlaced with each other.Specifically, the first conductive electrode E5 is parallel separately and be separately the conducting element of strip.Meanwhile, the second conductive electrode E6 is also parallel separately and be separately the conducting element of strip.In addition, in order to the first conductive electrode E5 and the second conductive electrode E6 is electrically independent each other, cell TP3 can comprise an insulation course (not shown), this insulation course is arranged between the first conductive electrode E5 and the second conductive electrode E6, wherein this insulation course can be the materials such as photoresistance, resin, viscose glue, nitride, oxide, oxides of nitrogen or substrate, but is not limited with above-mentioned material.
In the above-described embodiments, the material of conductive electrode E1 ~ E6 can be transparent conductive material, such as tin indium oxide (indium tin oxide, ITO), indium zinc oxide (indium zinc oxide be called for short:, be called for short: IZO) with aluminum zinc oxide (aluminum zinc oxide, AZO) or the stacked structure of metal oxide and metallic combination be called for short:, such as that indium tin oxide/silver/indium tin oxide or other conductive materials be applicable to formed, but not as limit, its kenel also can be latticed, but not as limit.The material of conductive electrode E1 ~ E6 also can be the composite bed (such as molybdenum-aluminium-molybdenum) of the metal material such as wherein at least one of aluminium, copper, silver, chromium, titanium, molybdenum, the alloy of above-mentioned material or above-mentioned material, but not as limit, and its kenel can be latticed, such as metal grill, but not as limit.In addition, the material of conductive electrode E1 ~ E6 can be that other conductive materials can comprise conducting particles, CNT, Graphene, silene or development, but not as limit, and its kenel also can be latticed, such as conductive grid, but not as limit.When conductive electrode E1 ~ E6 is such as that the opaque high conductivity material being less than 10 microns formed by width, because opaque material is difficult to by discernable by eye under superfine state, therefore when superfine opaque high conductivity material is staggered around a transmission region, and the area of opaque material is when being less than 10% divided by the area of transmission region, naked eyes almost will cannot pick out the existence of the first conductive electrode E1 and the second conductive electrode E2, thus make conductive electrode E1 ~ E6 region entirety seem transparent.Meanwhile, form conductive electrode E1 ~ E6 owing to employing high conductivity material, effectively can reduce impedance and be conducive to the detection of touching signals and improve sensitivity, and then being more conducive to the maximization of electronic installation.
When conductive electrode E1 ~ E6 adopts opaque conductive material to form, the superfine opaque conductive material (such as metal fine) of live width crosses multiple grid, and wherein the live width of fine rule is such as between 0.5 micron to 30 microns.And adopt the conductive electrode E1 ~ E6 of grid kenel, the opening between its fine rule is many greatly compared to the live width of fine rule, therefore the transmittance of conductive electrode E1 ~ E6 can be made to reach more than 75%.
Conductive electrode E1 ~ E6 via sputter or can be coated with whole transparent or opaque conductive material on substrate (such as aforesaid thin base 112), then via lithography step form multiple by transparent or opaque conductive material interlock around transmission region and obtain.But the present invention does not limit for this reason, in some embodiments, also can utilize laser-induced thermal etching, the mode of transfer printing or printing produces conductive electrode E1 ~ E6.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (24)
1. a method for making for device substrate, is characterized in that, comprising:
Be attached on a support plate by a slim motherboard, wherein the material of this slim motherboard comprises glass, and the thickness of this slim motherboard is 0.035 millimeter to 0.25 millimeter;
Multiple cell independent of each other is formed on this slim motherboard;
This slim motherboard is cut into multiple thin base to make respectively this thin base to be provided with one of them cell; And
This slim motherboard is separated with this support plate.
2. the method for making of device substrate according to claim 1, is characterized in that, the method that this slim motherboard is attached at this support plate is comprised and being attached on this support plate by an adhesive coating by this slim motherboard.
3. the method for making of device substrate according to claim 2, is characterized in that, this adhesive coating is a release glue-line.
4. the method for making of device substrate according to claim 2, is characterized in that, this adhesive coating comprises multiple adhesion pattern, and those adhesion patterns are each other by a separated.
5. the method for making of device substrate according to claim 4, is characterized in that, respectively this adhesion pattern is adhered between one of them thin base and this support plate, and respectively this gap between adjacent two thin bases.
6. the method for making of device substrate according to claim 5, is characterized in that, the method that this slim motherboard cuts into those thin bases is comprised and cuts this slim motherboard along those gaps.
7. the method for making of device substrate according to claim 4, is characterized in that, respectively this gap is between one of them thin base and this support plate, and respectively this adhesion pattern between adjacent two thin bases.
8. the method for making of device substrate according to claim 7, is characterized in that, the method that this slim motherboard cuts into those thin bases is comprised this slim motherboard of edge cuts along those adhesion patterns.
9. the method for making of device substrate according to claim 1, is characterized in that, the method that this slim motherboard is attached at this support plate is comprised and this slim motherboard is directly contacted with this support plate.
10. the method for making of device substrate according to claim 1, is characterized in that, after this slim motherboard is peeled off and made this slim motherboard be separated this support plate on this support plate, then this slim motherboard is cut into those thin bases.
The method for making of 11. device substrates according to claim 10; it is characterized in that; also be included in after this slim motherboard peels off on this support plate; and before this slim motherboard cut into those thin bases; form a protective seam on this slim motherboard, and this protective seam and those cells are positioned at the relative both sides of this slim motherboard.
The method for making of 12. device substrates according to claim 11, is characterized in that, the method forming this protective seam comprises the multiple protected location of formation, and respectively this protected location is configured on one of them thin base.
The method for making of 13. device substrates according to claim 1, is characterized in that, is separated by this slim motherboard and the method that this slim motherboard cuts into those thin bases is comprised with this support plate:
Cut this slim motherboard and this support plate to make this slim motherboard cut into those thin bases and to make this support plate cut into multiple sub-support plate simultaneously, respectively this sub-support plate is pasted with one of them thin base; And
Respectively this thin base this sub-support plate self-corresponding will be peeled off.
The method for making of 14. device substrates according to claim 1, is characterized in that, is separated by this slim motherboard and the method that this slim motherboard cuts into those thin bases is comprised with this support plate:
Cut this slim motherboard is attached on this support plate to make those thin bases cut into by this slim motherboard simultaneously; And
Those thin bases are peeled off one by one on this support plate.
The method for making of 15. device substrates according to claim 1, is characterized in that, be also included in and respectively this thin base form a protective seam, and this protective seam and this cell is positioned at the relative both sides of one of them corresponding thin base.
The method for making of 16. device substrates according to claim 1; it is characterized in that, be also included in before this slim motherboard is attached at this support plate, on this slim motherboard, form a protective seam; and this slim motherboard is when being attached at this support plate, this protective seam is between this support plate and this slim motherboard.
The method for making of 17. device substrates according to claim 16, is characterized in that, the method forming this protective seam comprises the multiple protected location of formation, and respectively this protected location is configured on one of them thin base.
The method for making of 18. device substrates according to claim 1, is characterized in that, the method forming those cells comprises the multiple touch control unit of formation.
The method for making of 19. device substrates according to claim 18, is characterized in that, respectively this touch control unit is a projected capacitive touch unit.
The method for making of 20. device substrates according to claim 19, is characterized in that, respectively this touch control unit is a single-layer electrodes touch control unit or a multi-layered electrode touch control unit.
The method for making of 21. device substrates according to claim 1, is characterized in that, this slim motherboard is formed by multiple stack of thin, and the material of at least one of those thin layers is glass.
The method for making of 22. device substrates according to claim 21, is characterized in that, the material of those thin layers at least another one is macromolecular material.
The method for making of 23. device substrates according to claim 21, is characterized in that, when this slim motherboard is attached at this support plate, this at least one of those thin layers is between its other and this support plate of those thin layers.
The method for making of 24. device substrates according to claim 1, it is characterized in that, also be included in after those thin bases are separated with this support plate, form an offside cell on each this thin base, and this offside cell is positioned at the relative both sides of this thin base with this corresponding cell.
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| TW102148780 | 2013-12-27 | ||
| TW102148780A TW201525567A (en) | 2013-12-27 | 2013-12-27 | Method for fabricating component substrate |
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| CN104750327A true CN104750327A (en) | 2015-07-01 |
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| CN201410198025.7A Pending CN104750327A (en) | 2013-12-27 | 2014-05-12 | Method for manufacturing element substrate |
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| TW (1) | TW201525567A (en) |
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| CN113221753A (en) * | 2021-05-14 | 2021-08-06 | 业泓科技(成都)有限公司 | Manufacturing method of touch sensing module and mother board of touch sensing module |
| CN113791504A (en) * | 2021-07-14 | 2021-12-14 | 信利光电股份有限公司 | Glass cover plate capable of reducing chromatic aberration and display device |
| CN113791504B (en) * | 2021-07-14 | 2024-04-30 | 信利光电股份有限公司 | Glass cover plate capable of reducing chromatic aberration and display equipment |
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| TW201525567A (en) | 2015-07-01 |
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