CN104750138A - Precision temperature control device for infrared single-photon detector - Google Patents
Precision temperature control device for infrared single-photon detector Download PDFInfo
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- CN104750138A CN104750138A CN201510157926.6A CN201510157926A CN104750138A CN 104750138 A CN104750138 A CN 104750138A CN 201510157926 A CN201510157926 A CN 201510157926A CN 104750138 A CN104750138 A CN 104750138A
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Abstract
The invention discloses a precision temperature control device for an infrared single-photon detector. The precision temperature control device is characterized in that a PID (proportion-integration-differentiation) operation module is used for calculating a difference value between output voltage of an instrument operational amplification module and temperature balance voltage and outputting a voltage value after operation to a class-D audio power amplification module; the class-D audio power amplification module is used for performing amplification and operation on a voltage difference between the voltage value inputted after operation of the PID operation module and the temperature balance voltage, outputting positive current to subject a TEC (thermoelectric cooler) to cooling when the voltage inputted by the PID operation module is larger than the temperature balance voltage and outputting negative current to subject the TEC to heating when the voltage inputted by the PID operation module is smaller than the temperature balance voltage, and achieves zero output to enable the TEC to stop working when the voltage inputted by the PID operation module is equal to the temperature balance voltage. The precision temperature control device is capable of performing temperature control on the infrared single-photon detector subjected to temperature drift, so that detecting efficiency of the infrared single-photon detector is unaffected by temperature.
Description
Technical field
The present invention relates to a kind of attemperating unit for ultrared single-photon detector, particularly relate to the accurate attemperating unit of a kind of ultrared single-photon detector.
Background technology
Single photon detection is as an important Technique of Weak Signal Detection, and in the subjects such as physics, uranology, chemistry, biology, medical science, various fields all has and applies very widely.At present, in the research of quantum information science, a large amount of single photon that adopts is as the carrier of quantum information, and therefore single photon detection technology plays vital effect.Single-photon detector can detect the single photon carrying quantum information, and is converted to electric signal output, then extracts the quantum information entrained by single photon by the means such as coincidence measurement, counting.Ultrared single-photon detector operationally, due to device self technological problems, when environment temperature changes, they can produce certain temperature drift, the detection efficiency that the drift of device temperature result in detector changes, a kind of temperature control circuit of precision is needed to carry out temperature control, to ensure the detection efficiency not temperature influence of detector to the device that temperature drift can occur.
Summary of the invention
The technical matters that the present invention asks for solution is for above-mentioned the deficiencies in the prior art, there is provided a kind of ultrared single-photon detector accurate attemperating unit, the accurate attemperating unit of this ultrared single-photon detector can carry out temperature control to the ultrared single-photon detector that temperature drift can occur, and makes the detection efficiency not temperature influence of ultrared single-photon detector.
For solving the problems of the technologies described above, the technical scheme that the present invention takes is: the accurate attemperating unit of ultrared single-photon detector, comprise temperature bridge, instrumentation op amplification module, PID arithmetic module and D class audio frequency power amplifier module, it is characterized in that: described temperature bridge is used for carrying out real-time sampling to the temperature of ultrared single-photon detector and converting through electric bridge the temperature sampled to magnitude of voltage and partial pressure value; Described instrumentation op amplification module exports after amplifying the pressure reduction between the magnitude of voltage obtained changed through temperature bridge and partial pressure value; When magnitude of voltage is equal with partial pressure value, operation amplifier module output voltage is zero; The output voltage of instrumentation op amplification module is divided into two-way and exports, and a road exports and is used for showing current operating temperature in real time, and another road outputs to PID arithmetic module; Described PID arithmetic module is used for the difference between the output voltage of instrumentation op amplification module and equalized temperature voltage to carry out computing, and the magnitude of voltage after union exports to D class audio frequency power amplifier module; Described D class audio frequency power amplifier module is used for the pressure reduction between the magnitude of voltage inputted after PID arithmetic module arithmetic and equalized temperature voltage to carry out amplifying and computing; When the voltage inputted after PID arithmetic module arithmetic is greater than equalized temperature voltage, D class audio frequency power amplifier module exports positive current, makes TEC carry out refrigeration cool-down; When the voltage inputted after PID arithmetic module arithmetic is less than equalized temperature voltage, D class audio frequency power amplifier module exports negative current, TEC is heated up and heats; When the voltage inputted after PID arithmetic module arithmetic equals equalized temperature voltage, it is zero that D class audio frequency power amplifier module exports, and TEC is quit work.
As further improved technical scheme of the present invention, described temperature bridge comprises resistance R711, resistance R712, resistance R704 and resistance R705; Resistance R704 one end connects positive 2.5V reference voltage, the other end connect with resistance R711 after ground connection; Resistance R705 one end connects positive 2.5V reference voltage, the other end connect with resistance R712 after ground connection; Described resistance R711 is thermistor, and described thermistor is PT1000 metal platinum resistance.
As further improved technical scheme of the present invention, described temperature bridge also comprises electric capacity C708, electric capacity C709, electric capacity C703 and electric capacity C731; Electric capacity C708 is connected in parallel on resistance R711 two ends, and electric capacity C709 is connected in parallel on resistance R712 two ends; Resistance R705 connects one end of positive 2.5V reference voltage also by electric capacity C703 ground connection; Resistance R704 connects one end of positive 2.5V reference voltage also by electric capacity C731 ground connection.
As further improved technical scheme of the present invention, described instrumentation op amplification module mainly comprises instrumentation amplifier U1; 2nd, 3 two pin of instrumentation amplifier U1 is the differential input end of instrumentation amplifier U1,4th leads ends connects the 4th pin while of bearing 2.5V reference voltage and also passes through electric capacity C710 ground connection, 5th leads ends connects positive 2.5V reference voltage, 6th pin is the output terminal of instrumentation amplifier U1,1st pin successively resistance in series R701 is connected with the 8th pin with after resistance R702, the 7th pin connect positive 5.0V voltage simultaneously the 7th pin also by electric capacity C704 ground connection; Resistance R703 is connected in parallel on resistance R702 two ends; 3rd pin of instrumentation amplifier U1 is connected with the ungrounded end of resistance R711; 2nd pin of instrumentation amplifier U1 is connected with the ungrounded end of resistance R712; Instrumentation amplifier U1 exports after being used for the pressure reduction between the 2nd, 3 two of instrumentation amplifier U1 the pin to amplify; 6th pin output voltage of instrumentation amplifier U1 is divided into two-way and exports, and a road exports, for showing current operating temperature in real time successively after resistance R715 and resistance R716 dividing potential drop; Another road outputs to PID arithmetic module.
As further improved technical scheme of the present invention, a wherein road of the 6th pin output voltage of instrumentation amplifier U1 exports, for showing current operating temperature in real time by single-chip microcomputer successively after resistance R715 and resistance R716 dividing potential drop.
As further improved technical scheme of the present invention, PID arithmetic module comprises CMOS type operational amplifier U2, resistance R706, resistance R709, resistance R710 and electric capacity C706, electric capacity C705, electric capacity C707 and electric capacity C712; Be connected with the 6th pin of instrumentation amplifier U1 after the 4th pin serial connection resistance R706 of CMOS type operational amplifier U2; 4th pin of CMOS type operational amplifier U2 also successively resistance in series R709 be connected with the 6th pin of instrumentation amplifier U1 with after electric capacity C706; Between the 4th pin that electric capacity C705 is connected in parallel on CMOS type operational amplifier U2 and the 1st pin; 4th pin of CMOS type operational amplifier U2 also successively resistance in series R710 be connected with the 1st pin of CMOS type operational amplifier U2 with after electric capacity C707; 5th pin of CMOS type operational amplifier U2 connects positive 5V voltage, the 2nd pin ground connection of CMOS type operational amplifier U2; 3rd pin of CMOS type operational amplifier U2 connects positive 2.5V reference voltage simultaneously also by electric capacity C712 ground connection; 1st pin of CMOS type operational amplifier U2 is also connected with D class audio frequency power amplifier module as output terminal;
As further improved technical scheme of the present invention, described D class audio frequency power amplifier module mainly comprises D class audio frequency power amplifier chips U3; Be connected with the 6th pin of CMOS type operational amplifier U2 after the 1st pin serial connection resistance R713 of D class audio frequency power amplifier chips U3; Between the 1st pin that resistance R714 is connected in parallel on D class audio frequency power amplifier chips U3 and the 2nd pin; 2nd pin of D class audio frequency power amplifier chips U3 also connects positive 2.5V reference voltage simultaneously by electric capacity C706 ground connection; 3rd pin of D class audio frequency power amplifier chips U3, the 4th pin, the 5th pin and the 6th pin are altogether; 7th pin of D class audio frequency power amplifier chips U3 is by electric capacity C722 ground connection; 10th pin of D class audio frequency power amplifier chips U3 is also by electric capacity C722 ground connection; 9th pin of D class audio frequency power amplifier chips U3 is by resistance R718 ground connection; 11st pin of D class audio frequency power amplifier chips U3 is by electric capacity C723 ground connection; The 12nd pin ground connection of D class audio frequency power amplifier chips U3; 13rd pin of D class audio frequency power amplifier chips U3 is also by electric capacity C724 ground connection; 14th pin of D class audio frequency power amplifier chips U3 is connected rear by electric capacity C725 ground connection with the 15th pin; 14th pin of D class audio frequency power amplifier chips U3 and the 15th pin are PVCC end; 16th pin of D class audio frequency power amplifier chips U3 and the 17th pin are altogether; 20th pin of D class audio frequency power amplifier chips U3 successively after series inductance L702, resistance B704 as output terminal for connecting TEC; 19th pin of D class audio frequency power amplifier chips U3 is connected with the 20th pin; Be connected with the 20th pin after the 18th pin serial connection electric capacity C719 of D class audio frequency power amplifier chips U3; Inductance L 702 passes through electric capacity C721 ground connection away from one end of the 20th pin of D class audio frequency power amplifier chips U3;
21st pin of D class audio frequency power amplifier chips U3 successively after series inductance L701, resistance B703 as output terminal for connecting TEC; 22nd pin of D class audio frequency power amplifier chips U3 is connected with the 21st pin; Be connected with the 21st pin after the 23rd pin serial connection electric capacity C715 of D class audio frequency power amplifier chips U3; Inductance L 701 passes through electric capacity C714 ground connection away from one end of the 21st pin of D class audio frequency power amplifier chips U3; Inductance L 701 is connected with electric capacity C717 away between one end of the 21st pin of D class audio frequency power amplifier chips U3 and inductance L 702 one end away from the 20th pin of D class audio frequency power amplifier chips U3; Resistance B703 is connected with electric capacity C718 away between one end of the 21st pin of D class audio frequency power amplifier chips U3 and resistance B704 one end away from the 20th pin of D class audio frequency power amplifier chips U3; 24th pin of D class audio frequency power amplifier chips U3 and the 25th pin are altogether; 26th pin of D class audio frequency power amplifier chips U3, the 27th pin and the 28th pin are PVCC end, and described PVCC connects positive 12V voltage after holding resistance in series B701, and described PVCC end is also by electric capacity C711 ground connection simultaneously.PVCC end is the power end of D class audio frequency power amplifier chips U3.
As further improved technical scheme of the present invention, the 29th pin of D class audio frequency power amplifier chips U3 is temperature control circuit enable pin, for by arranging low and high level to close or opening temp. control circuit; 30th pin of D class audio frequency power amplifier chips U3 and the 31st pin are temperature control circuit current detecting pin, for damage as TEC or D class audio frequency power amplifier chips U3 work abnormal cause temperature control circuit ER effect large time export the control system that a high level feeds back to single-photon detector, the 29th pin that the control system of single-photon detector crosses D class audio frequency power amplifier chips U3 closes temperature control circuit to avoid wafer damage; Connect positive 12V voltage after the 32nd pin serial connection resistance B702 of D class audio frequency power amplifier chips U3, the 32nd pin of D class audio frequency power amplifier chips U3 is also by electric capacity C713 ground connection.In resistance in series B702, B represents magnetic bead, and the effect of magnetic bead B702 is in order to filtering.
The present invention is primarily of comprising temperature bridge, instrumentation op amplification module, PID arithmetic module and D class audio frequency power amplifier module composition, and wherein thermistor R711 and chip U1, U2, U3 are critical component.Thermistor R711 adopts PT1000 metal platinum resistance, and precision 0.01 DEG C, temperature range reach ± and 100 DEG C.U1 is instrumentation amplifier, has the advantages such as gain is large, precision is high, stability is strong.U2 is a CMOS type operational amplifier, has that output area is large, gain high, is also the core devices of PID circuit simultaneously.U3 is a D class audio frequency power amplifier chips, there is extremely low output impedance and larger draw current capacity, peak power output can reach 40W, chip U3 also possesses the advantage of current sense function and bi-directional drive in addition, achieves the double-direction control of Real-Time Monitoring to whole refrigeration circuit working current and TEC cooling and warming.
Resistance R711 is thermistor PT1000, samples by the working temperature of temperature controlling device with it.Resistance R712 is equalized temperature resistance, its resistance is exactly resistance value when being reached design temperature by temperature controlling device temperature corresponding to PT1000, thermistor R711 and equalized temperature resistance R712 and two other resistance R704, R705, these four resistance constitute a temperature bridge, two output terminals of electric bridge be thermistor PT1000 real-time sampling respectively to the magnitude of voltage that converts to through electric bridge of temperature and the partial pressure value of equalized temperature resistance inside electric bridge, when both pressure reduction are not equal to 0, illustrate and also not reached by the temperature of temperature controlling device or to exceed set temperature value, TEC is needed to carry out freezing or heating.
Chip U1 is a instrumentation amplifier, and its 2,3 two pins are the differential input end of instrumentation amplifier, and 5 foots have connect a 2.5V reference voltage, and 6 pin are output terminals of instrumentation amplifier.The magnitude of voltage that the temperature that thermistor PT1000 samples converts to through electric bridge and the partial pressure value of equalized temperature resistance inside electric bridge are input to the 3rd pin and the 2nd pin of U1 respectively, U1 exports after being amplified by both pressure reduction, and the resistance of resistance R701, R702 and R703 determines enlargement factor.Suppose that 2 of U1,3 pin pressure reduction are Vin, the enlargement factor of U1 is Au, so output voltage Vo=2.5V+Vin*Au of U1, when being reached design temperature by the working temperature of temperature controlling device, then temperature bridge balance, Vin just equals 0, and now the output voltage Vo of U1 just equals 2.5V, and equalized temperature voltage is 2.5V.The 6 pin output voltages of U2 are divided into two-way and export, and the first via is exported to single-chip microcomputer after being through resistance R715 and resistance R716 dividing potential drop and shown current operating temperature in real time, and the second tunnel is then directly output to PID circuit.
Chip U2 is a CMOS type operational amplifier, and resistance R706, R709, R710 and electric capacity C706, C705, C707 and chip U2 constitute PID circuit, and 3 foots of U2 have connect a 2.5V reference voltage, and this voltage is equalized temperature voltage.When controlled device temperature does not reach design temperature, namely the output voltage Vo of U1 is not equal to 2.5V, difference between the output voltage Vo of U1 and equalized temperature voltage 2.5V is carried out ratio, differential and integral operation by PID circuit, and the voltage after computing exports to D class audio frequency power amplifier chips U3 from 1 pin of U2.When controlled device temperature reaches setting working temperature, namely the output voltage Vo of U1 equals 2.5V, and the difference now between it and equalized temperature voltage 2.5V is 0, so the output voltage of U2 is still 2.5V after ratio, differential and integral operation.
Chip U3 is a D class audio frequency power amplifier chips, it be the pressure reduction between 1 pin and 2 pin is amplified after export from 19,20 pins and 21,22 pins, suppose that the input voltage of 1 pin of U3 is V1, the input voltage of 2 pin is V2,19,20 two pins output voltages are Vn, and 21,22 two pins output voltages are Vp.As V1>V2, then Vp>Vn, U3 export as positive current; As V1<V2, then Vp<Vn, U3 export as negative current; As V1=V2, then Vp=Vn, U3 output current is 0.
Because the 1 pin voltage V1 of U3 is the output voltage of chip U2,2 pin voltage V2 are equalized temperature voltage 2.5V, so as V1>V2, illustrate that controlled device temperature has exceeded design temperature and needed TEC to carry out refrigeration cool-down, now chip U3 exports positive current, TEC refrigeration cool-down.As V1<V2, illustrate that controlled device temperature needs TEC to carry out intensification lower than design temperature and heats, now chip U3 exports negative current, and TEC heats intensification.As V1=V2, illustrate that controlled device temperature has reached design temperature and do not needed TEC to work, now chip U3 output current is that 0, TEC quits work.
29 pins of chip U3 are temperature control circuit enable pin, can by arranging low and high level to close or opening temp. control circuit.30, the 31 pin temperature control circuit current detecting pins of U3, when TEC damage or chip U3 work abnormal cause temperature control circuit ER effect large time, these two pins can export the control system that a high level feeds back to single-photon detector, and system then can close temperature control circuit to avoid wafer damage by 29 pin of U3.
The present invention carries out thermostatic control to the device easily producing temperature drift, their working temperature is controlled all the time at a steady state value and accuracy of temperature control will reach 0.01 DEG C.The present invention utilizes high-accuracy metal platinum thermistor PT1000 to sample to device real time temperature, the temperature signal that collection is returned and set temperature value compare, if sample temperature is greater than setting value, illustrating that device temperature is too high needs cooling, utilize semiconductor cooler (hereinafter referred to as TEC) to freeze to device, otherwise then heat.Because temperature exists inertia, so whole control procedure adopts the closed-loop control of hardware PID circuit realiration, precision is high, stability is strong.The present invention is based on hardware PID circuit and closed-loop control is carried out to whole temperature sampling process, utilize the two-way operation characteristic of D class audio frequency power amplifier chips to allow TEC not only can be operated in refrigerating state but also can be operated in the state of heating, whole temperature control circuit precision can reach 0.0.1 DEG C.The present invention can carry out temperature control to the ultrared single-photon detector that temperature drift can occur in a word, makes the detection efficiency not temperature influence of ultrared single-photon detector.
Accompanying drawing explanation
Fig. 1 is circuit module schematic diagram of the present invention.
Fig. 2 is electrical block diagram of the present invention.
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described further.
Embodiment
Embodiment 1
See Fig. 1 and Fig. 2, the accurate attemperating unit of this ultrared single-photon detector, comprise temperature bridge, instrumentation op amplification module, PID arithmetic module and D class audio frequency power amplifier module, described temperature bridge is used for carrying out real-time sampling to the temperature of ultrared single-photon detector and converting through electric bridge the temperature sampled to magnitude of voltage and partial pressure value; Described instrumentation op amplification module exports after amplifying the pressure reduction between the magnitude of voltage obtained changed through temperature bridge and partial pressure value; When magnitude of voltage is equal with partial pressure value, operation amplifier module output voltage is zero; The output voltage of instrumentation op amplification module is divided into two-way and exports, and a road exports and is used for showing current operating temperature in real time, and another road outputs to PID arithmetic module; Described PID arithmetic module is used for the difference between the output voltage of instrumentation op amplification module and equalized temperature voltage to carry out computing, and the magnitude of voltage after union exports to D class audio frequency power amplifier module; Described D class audio frequency power amplifier module is used for the pressure reduction between the magnitude of voltage inputted after PID arithmetic module arithmetic and equalized temperature voltage to carry out amplifying and computing; When the voltage inputted after PID arithmetic module arithmetic is greater than equalized temperature voltage, D class audio frequency power amplifier module exports positive current, makes TEC carry out refrigeration cool-down; When the voltage inputted after PID arithmetic module arithmetic is less than equalized temperature voltage, D class audio frequency power amplifier module exports negative current, TEC is heated up and heats; When the voltage inputted after PID arithmetic module arithmetic equals equalized temperature voltage, it is zero that D class audio frequency power amplifier module exports, and TEC is quit work.
Described temperature bridge comprises resistance R711, resistance R712, resistance R704 and resistance R705; Resistance R704 one end connects positive 2.5V reference voltage, the other end connect with resistance R711 after ground connection; Resistance R705 one end connects positive 2.5V reference voltage, the other end connect with resistance R712 after ground connection; Described resistance R711 is thermistor, and described thermistor is PT1000 metal platinum resistance.State temperature bridge and also comprise electric capacity C708, electric capacity C709, electric capacity C703 and electric capacity C731; Electric capacity C708 is connected in parallel on resistance R711 two ends, and electric capacity C709 is connected in parallel on resistance R712 two ends; Resistance R705 connects one end of positive 2.5V reference voltage also by electric capacity C703 ground connection; Resistance R704 connects one end of positive 2.5V reference voltage also by electric capacity C731 ground connection.
Described instrumentation op amplification module mainly comprises instrumentation amplifier U1; 2nd, 3 two pin of instrumentation amplifier U1 is the differential input end of instrumentation amplifier U1,4th leads ends connects the 4th pin while of bearing 2.5V reference voltage and also passes through electric capacity C710 ground connection, 5th leads ends connects positive 2.5V reference voltage, 6th pin is the output terminal of instrumentation amplifier U1,1st pin successively resistance in series R701 is connected with the 8th pin with after resistance R702, the 7th pin connect positive 5.0V voltage simultaneously the 7th pin also by electric capacity C704 ground connection; Resistance R703 is connected in parallel on resistance R702 two ends; 3rd pin of instrumentation amplifier U1 is connected with the ungrounded end of resistance R711; 2nd pin of instrumentation amplifier U1 is connected with the ungrounded end of resistance R712; Instrumentation amplifier U1 exports after being used for the pressure reduction between the 2nd, 3 two of instrumentation amplifier U1 the pin to amplify; 6th pin output voltage of instrumentation amplifier U1 is divided into two-way and exports, and a road exports, for showing current operating temperature in real time successively after resistance R715 and resistance R716 dividing potential drop; Another road outputs to PID arithmetic module.Preferably, a wherein road of the 6th pin output voltage of instrumentation amplifier U1 exports, for showing current operating temperature in real time by single-chip microcomputer successively after resistance R715 and resistance R716 dividing potential drop.
PID arithmetic module comprises CMOS type operational amplifier U2, resistance R706, resistance R709, resistance R710 and electric capacity C706, electric capacity C705, electric capacity C707 and electric capacity C712; Be connected with the 6th pin of instrumentation amplifier U1 after the 4th pin serial connection resistance R706 of CMOS type operational amplifier U2; 4th pin of CMOS type operational amplifier U2 also successively resistance in series R709 be connected with the 6th pin of instrumentation amplifier U1 with after electric capacity C706; Between the 4th pin that electric capacity C705 is connected in parallel on CMOS type operational amplifier U2 and the 1st pin; 4th pin of CMOS type operational amplifier U2 also successively resistance in series R710 be connected with the 1st pin of CMOS type operational amplifier U2 with after electric capacity C707; 5th pin of CMOS type operational amplifier U2 connects positive 5V voltage, the 2nd pin ground connection of CMOS type operational amplifier U2; 3rd pin of CMOS type operational amplifier U2 connects positive 2.5V reference voltage simultaneously also by electric capacity C712 ground connection; 1st pin of CMOS type operational amplifier U2 is also connected with D class audio frequency power amplifier module as output terminal;
Described D class audio frequency power amplifier module mainly comprises D class audio frequency power amplifier chips U3; Be connected with the 6th pin of CMOS type operational amplifier U2 after the 1st pin serial connection resistance R713 of D class audio frequency power amplifier chips U3; Between the 1st pin that resistance R714 is connected in parallel on D class audio frequency power amplifier chips U3 and the 2nd pin; 2nd pin of D class audio frequency power amplifier chips U3 also connects positive 2.5V reference voltage simultaneously by electric capacity C706 ground connection; 3rd pin of D class audio frequency power amplifier chips U3, the 4th pin, the 5th pin and the 6th pin are altogether; 7th pin of D class audio frequency power amplifier chips U3 is by electric capacity C722 ground connection; 10th pin of D class audio frequency power amplifier chips U3 is also by electric capacity C722 ground connection; 9th pin of D class audio frequency power amplifier chips U3 is by resistance R718 ground connection; 11st pin of D class audio frequency power amplifier chips U3 is by electric capacity C723 ground connection; The 12nd pin ground connection of D class audio frequency power amplifier chips U3; 13rd pin of D class audio frequency power amplifier chips U3 is also by electric capacity C724 ground connection; 14th pin of D class audio frequency power amplifier chips U3 is connected rear by electric capacity C725 ground connection with the 15th pin; 14th pin of D class audio frequency power amplifier chips U3 and the 15th pin are PVCC end; 16th pin of D class audio frequency power amplifier chips U3 and the 17th pin are altogether; 20th pin of D class audio frequency power amplifier chips U3 successively after series inductance L702, resistance B704 as output terminal for connecting TEC; 19th pin of D class audio frequency power amplifier chips U3 is connected with the 20th pin; Be connected with the 20th pin after the 18th pin serial connection electric capacity C719 of D class audio frequency power amplifier chips U3; Inductance L 702 passes through electric capacity C721 ground connection away from one end of the 20th pin of D class audio frequency power amplifier chips U3;
21st pin of D class audio frequency power amplifier chips U3 successively after series inductance L701, resistance B703 as output terminal for connecting TEC; 22nd pin of D class audio frequency power amplifier chips U3 is connected with the 21st pin; Be connected with the 21st pin after the 23rd pin serial connection electric capacity C715 of D class audio frequency power amplifier chips U3; Inductance L 701 passes through electric capacity C714 ground connection away from one end of the 21st pin of D class audio frequency power amplifier chips U3; Inductance L 701 is connected with electric capacity C717 away between one end of the 21st pin of D class audio frequency power amplifier chips U3 and inductance L 702 one end away from the 20th pin of D class audio frequency power amplifier chips U3; Resistance B703 is connected with electric capacity C718 away between one end of the 21st pin of D class audio frequency power amplifier chips U3 and resistance B704 one end away from the 20th pin of D class audio frequency power amplifier chips U3; 24th pin of D class audio frequency power amplifier chips U3 and the 25th pin are altogether; 26th pin of D class audio frequency power amplifier chips U3, the 27th pin and the 28th pin are PVCC end, and described PVCC connects positive 12V voltage after holding resistance in series B701, and described PVCC end is also by electric capacity C711 ground connection simultaneously.29th pin of D class audio frequency power amplifier chips U3 is temperature control circuit enable pin, for by arranging low and high level to close or opening temp. control circuit;
30th pin of D class audio frequency power amplifier chips U3 and the 31st pin are temperature control circuit current detecting pin, for damage as TEC or D class audio frequency power amplifier chips U3 work abnormal cause temperature control circuit ER effect large time export the control system that a high level feeds back to single-photon detector, the 29th pin that the control system of single-photon detector crosses D class audio frequency power amplifier chips U3 closes temperature control circuit to avoid wafer damage; Connect positive 12V voltage after the 32nd pin serial connection resistance B702 of D class audio frequency power amplifier chips U3, the 32nd pin of D class audio frequency power amplifier chips U3 is also by electric capacity C713 ground connection.
Claims (8)
1. the accurate attemperating unit of ultrared single-photon detector, comprise temperature bridge, instrumentation op amplification module, PID arithmetic module and D class audio frequency power amplifier module, it is characterized in that: described temperature bridge is used for carrying out real-time sampling to the temperature of ultrared single-photon detector and converting through electric bridge the temperature sampled to magnitude of voltage and partial pressure value; Described instrumentation op amplification module exports after amplifying the pressure reduction between the magnitude of voltage obtained changed through temperature bridge and partial pressure value; When magnitude of voltage is equal with partial pressure value, operation amplifier module output voltage is zero; The output voltage of instrumentation op amplification module is divided into two-way and exports, and a road exports and is used for showing current operating temperature in real time, and another road outputs to PID arithmetic module; Described PID arithmetic module is used for the difference between the output voltage of instrumentation op amplification module and equalized temperature voltage to carry out computing, and the magnitude of voltage after union exports to D class audio frequency power amplifier module; Described D class audio frequency power amplifier module is used for the pressure reduction between the magnitude of voltage inputted after PID arithmetic module arithmetic and equalized temperature voltage to carry out amplifying and computing; When the voltage inputted after PID arithmetic module arithmetic is greater than equalized temperature voltage, D class audio frequency power amplifier module exports positive current, makes TEC carry out refrigeration cool-down; When the voltage inputted after PID arithmetic module arithmetic is less than equalized temperature voltage, D class audio frequency power amplifier module exports negative current, TEC is heated up and heats; When the voltage inputted after PID arithmetic module arithmetic equals equalized temperature voltage, it is zero that D class audio frequency power amplifier module exports, and TEC is quit work.
2. the accurate attemperating unit of ultrared single-photon detector according to claim 1, is characterized in that: described temperature bridge comprises resistance R711, resistance R712, resistance R704 and resistance R705; Resistance R704 one end connects positive 2.5V reference voltage, the other end connect with resistance R711 after ground connection; Resistance R705 one end connects positive 2.5V reference voltage, the other end connect with resistance R712 after ground connection; Described resistance R711 is thermistor, and described thermistor is PT1000 metal platinum resistance.
3. the accurate attemperating unit of ultrared single-photon detector according to claim 2, is characterized in that: described temperature bridge also comprises electric capacity C708, electric capacity C709, electric capacity C703 and electric capacity C731; Electric capacity C708 is connected in parallel on resistance R711 two ends, and electric capacity C709 is connected in parallel on resistance R712 two ends; Resistance R705 connects one end of positive 2.5V reference voltage also by electric capacity C703 ground connection; Resistance R704 connects one end of positive 2.5V reference voltage also by electric capacity C731 ground connection.
4. the accurate attemperating unit of ultrared single-photon detector according to claim 3, is characterized in that: described instrumentation op amplification module mainly comprises instrumentation amplifier U1; 2nd, 3 two pin of instrumentation amplifier U1 is the differential input end of instrumentation amplifier U1,4th leads ends connects the 4th pin while of bearing 2.5V reference voltage and also passes through electric capacity C710 ground connection, 5th leads ends connects positive 2.5V reference voltage, 6th pin is the output terminal of instrumentation amplifier U1,1st pin successively resistance in series R701 is connected with the 8th pin with after resistance R702, the 7th pin connect positive 5.0V voltage simultaneously the 7th pin also by electric capacity C704 ground connection; Resistance R703 is connected in parallel on resistance R702 two ends; 3rd pin of instrumentation amplifier U1 is connected with the ungrounded end of resistance R711; 2nd pin of instrumentation amplifier U1 is connected with the ungrounded end of resistance R712; Instrumentation amplifier U1 exports after being used for the pressure reduction between the 2nd, 3 two of instrumentation amplifier U1 the pin to amplify; 6th pin output voltage of instrumentation amplifier U1 is divided into two-way and exports, and a road exports, for showing current operating temperature in real time successively after resistance R715 and resistance R716 dividing potential drop; Another road outputs to PID arithmetic module.
5. the accurate attemperating unit of ultrared single-photon detector according to claim 4, it is characterized in that: a wherein road of the 6th pin output voltage of instrumentation amplifier U1 exports, for showing current operating temperature in real time by single-chip microcomputer successively after resistance R715 and resistance R716 dividing potential drop.
6. the accurate attemperating unit of ultrared single-photon detector according to claim 5, is characterized in that: PID arithmetic module comprises CMOS type operational amplifier U2, resistance R706, resistance R709, resistance R710 and electric capacity C706, electric capacity C705, electric capacity C707 and electric capacity C712; Be connected with the 6th pin of instrumentation amplifier U1 after the 4th pin serial connection resistance R706 of CMOS type operational amplifier U2; 4th pin of CMOS type operational amplifier U2 also successively resistance in series R709 be connected with the 6th pin of instrumentation amplifier U1 with after electric capacity C706; Between the 4th pin that electric capacity C705 is connected in parallel on CMOS type operational amplifier U2 and the 1st pin; 4th pin of CMOS type operational amplifier U2 also successively resistance in series R710 be connected with the 1st pin of CMOS type operational amplifier U2 with after electric capacity C707; 5th pin of CMOS type operational amplifier U2 connects positive 5V voltage, the 2nd pin ground connection of CMOS type operational amplifier U2; 3rd pin of CMOS type operational amplifier U2 connects positive 2.5V reference voltage simultaneously also by electric capacity C712 ground connection; 1st pin of CMOS type operational amplifier U2 is also connected with D class audio frequency power amplifier module as output terminal.
7. the accurate attemperating unit of ultrared single-photon detector according to claim 6, is characterized in that: described D class audio frequency power amplifier module mainly comprises D class audio frequency power amplifier chips U3; Be connected with the 6th pin of CMOS type operational amplifier U2 after the 1st pin serial connection resistance R713 of D class audio frequency power amplifier chips U3; Between the 1st pin that resistance R714 is connected in parallel on D class audio frequency power amplifier chips U3 and the 2nd pin; 2nd pin of D class audio frequency power amplifier chips U3 also connects positive 2.5V reference voltage simultaneously by electric capacity C706 ground connection; 3rd pin of D class audio frequency power amplifier chips U3, the 4th pin, the 5th pin and the 6th pin are altogether; 7th pin of D class audio frequency power amplifier chips U3 is by electric capacity C722 ground connection; 10th pin of D class audio frequency power amplifier chips U3 is also by electric capacity C722 ground connection; 9th pin of D class audio frequency power amplifier chips U3 is by resistance R718 ground connection; 11st pin of D class audio frequency power amplifier chips U3 is by electric capacity C723 ground connection; The 12nd pin ground connection of D class audio frequency power amplifier chips U3; 13rd pin of D class audio frequency power amplifier chips U3 is also by electric capacity C724 ground connection; 14th pin of D class audio frequency power amplifier chips U3 is connected rear by electric capacity C725 ground connection with the 15th pin; 14th pin of D class audio frequency power amplifier chips U3 and the 15th pin are PVCC end; 16th pin of D class audio frequency power amplifier chips U3 and the 17th pin are altogether; 20th pin of D class audio frequency power amplifier chips U3 successively after series inductance L702, resistance B704 as output terminal for connecting TEC; 19th pin of D class audio frequency power amplifier chips U3 is connected with the 20th pin; Be connected with the 20th pin after the 18th pin serial connection electric capacity C719 of D class audio frequency power amplifier chips U3; Inductance L 702 passes through electric capacity C721 ground connection away from one end of the 20th pin of D class audio frequency power amplifier chips U3;
21st pin of D class audio frequency power amplifier chips U3 successively after series inductance L701, resistance B703 as output terminal for connecting TEC; 22nd pin of D class audio frequency power amplifier chips U3 is connected with the 21st pin; Be connected with the 21st pin after the 23rd pin serial connection electric capacity C715 of D class audio frequency power amplifier chips U3; Inductance L 701 passes through electric capacity C714 ground connection away from one end of the 21st pin of D class audio frequency power amplifier chips U3; Inductance L 701 is connected with electric capacity C717 away between one end of the 21st pin of D class audio frequency power amplifier chips U3 and inductance L 702 one end away from the 20th pin of D class audio frequency power amplifier chips U3; Resistance B703 is connected with electric capacity C718 away between one end of the 21st pin of D class audio frequency power amplifier chips U3 and resistance B704 one end away from the 20th pin of D class audio frequency power amplifier chips U3; 24th pin of D class audio frequency power amplifier chips U3 and the 25th pin are altogether; 26th pin of D class audio frequency power amplifier chips U3, the 27th pin and the 28th pin are PVCC end, and described PVCC connects positive 12V voltage after holding resistance in series B701, and described PVCC end is also by electric capacity C711 ground connection simultaneously.
8. the accurate attemperating unit of ultrared single-photon detector according to claim 7, is characterized in that: the 29th pin of D class audio frequency power amplifier chips U3 is temperature control circuit enable pin, for by arranging low and high level to close or opening temp. control circuit; 30th pin of D class audio frequency power amplifier chips U3 and the 31st pin are temperature control circuit current detecting pin, for damage as TEC or D class audio frequency power amplifier chips U3 work abnormal cause temperature control circuit ER effect large time export the control system that a high level feeds back to single-photon detector, the 29th pin that the control system of single-photon detector crosses D class audio frequency power amplifier chips U3 closes temperature control circuit to avoid wafer damage; Connect positive 12V voltage after the 32nd pin serial connection resistance B702 of D class audio frequency power amplifier chips U3, the 32nd pin of D class audio frequency power amplifier chips U3 is also by electric capacity C713 ground connection.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510157926.6A CN104750138A (en) | 2015-04-06 | 2015-04-06 | Precision temperature control device for infrared single-photon detector |
| CN201510585608.XA CN105223982B (en) | 2015-04-06 | 2015-09-15 | Ultrared single-photon detector precision temperature control circuit |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510157926.6A CN104750138A (en) | 2015-04-06 | 2015-04-06 | Precision temperature control device for infrared single-photon detector |
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| CN201510585608.XA Active CN105223982B (en) | 2015-04-06 | 2015-09-15 | Ultrared single-photon detector precision temperature control circuit |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111258351A (en) * | 2020-03-17 | 2020-06-09 | 国开启科量子技术(北京)有限公司 | Single photon detector TEC temperature control method and device |
| CN111351586A (en) * | 2020-03-20 | 2020-06-30 | 山东大学 | Integrated low-delay active quenching near-infrared single-photon detector |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1694321A (en) * | 2005-06-09 | 2005-11-09 | 上海大学 | Automatic power and temp. controller for pumping laser |
| CN101404376B (en) * | 2008-10-27 | 2010-04-14 | 无锡市中兴光电子技术有限公司 | Automatic temperature control apparatus of pump laser for ASE broadband light source |
| CN104331100A (en) * | 2013-07-22 | 2015-02-04 | 东荣（天津）机电有限公司 | Infrared heating control system |
| CN204087018U (en) * | 2014-06-12 | 2015-01-07 | 南京信息工程大学 | A kind of temperature control system of semiconductor laser |
| CN204965220U (en) * | 2015-09-15 | 2016-01-13 | 安徽问天量子科技股份有限公司 | Accurate temperature control device of infrared single -photon detector |
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2015
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111258351A (en) * | 2020-03-17 | 2020-06-09 | 国开启科量子技术(北京)有限公司 | Single photon detector TEC temperature control method and device |
| CN111351586A (en) * | 2020-03-20 | 2020-06-30 | 山东大学 | Integrated low-delay active quenching near-infrared single-photon detector |
| CN111351586B (en) * | 2020-03-20 | 2021-03-30 | 山东大学 | Integrated low-delay active quenching near-infrared single-photon detector |
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| CN105223982B (en) | 2017-08-29 |
| CN105223982A (en) | 2016-01-06 |
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Application publication date: 20150701 |