CN104747952A - High-power LED lamp with heat conduction compound dielectric layers - Google Patents
High-power LED lamp with heat conduction compound dielectric layers Download PDFInfo
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- CN104747952A CN104747952A CN201510138743.XA CN201510138743A CN104747952A CN 104747952 A CN104747952 A CN 104747952A CN 201510138743 A CN201510138743 A CN 201510138743A CN 104747952 A CN104747952 A CN 104747952A
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- Prior art keywords
- power led
- radiator
- heat conduction
- conduction compound
- led lamp
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/104—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using feather joints, e.g. tongues and grooves, with or without friction
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/14—Adjustable mountings
- F21V21/30—Pivoted housings or frames
Abstract
The invention relates to the technical field of high-power LED lamps, in particular to a high-power LED lamp with heat conduction compound dielectric layers. The high-power LED lamp with the heat conduction compound dielectric layers comprises a radiator, high-power LED light sources and light-admitting plates, the high-power LED light sources and the light-admitting plates are sequentially fixed below the radiator in an up-down overlapped mode, the radiator and the high-power LED light sources are each provided with a heat conduction compound dielectric layer, and each heat conduction compound dielectric layer is formed by pressing at least a copper dielectric layer and an aluminum dielectric layer in a fitting mode; during assembly, the copper dielectric layers are attached to the back surfaces of the high-power LED light sources, and the aluminum dielectric layers are attached to the lower surface of the radiator. During the working process, heat generated by the high-power LED light sources is educed to the heat conduction compound dielectric layers rapidly, and the heat is conducted to the radiator through the heat conduction compound dielectric layers, so that a heat transmission channel is always in forward direction transmission to the outside, and the heat is not accumulated on an LED chip; under the same conditions, the high-power LED lamp with the heat conduction compound dielectric layers has the advantages that the heat dissipation is rapid, the luminous efficiency of the lamp is high, and the service life is long.
Description
Technical field
The present invention relates to high-power LED lamp technical field, refer in particular to a kind of high-power LED lamp with heat conduction compound medium layer.
Background technology
As everyone knows, need to distribute amount of heat during high-power LED lamp work, if heat radiation is not smooth, will the performance and used life of LED light fixture be had a strong impact on.Because LED chip is very responsive to temperature, junction temperature is higher, and light decay is larger, and the life-span is shorter.And high-powered LED lamp, heat of light source is concentrated, in unit are, the radiating rate of high-powered LED lamp is constant, and the heat that high-powered LED lamp operationally produces gets more and more, cause produced partial heat to be accumulated in LED lamp panel, therefore the heat of high-powered LED lamp distributes for a long time not in time effectively, and LED light will be caused to imitate rapid decay.Therefore, the heat dissipation problem of high-powered LED lamp becomes the key of design.And general way strengthens radiator, like this, not only radiating effect is unsatisfactory, also increases product weight, adds cost simultaneously.
Summary of the invention
The problem that the present invention is directed to prior art provides a kind of high-power LED lamp with heat conduction compound medium layer.
In order to solve the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of high-power LED lamp with heat conduction compound medium layer, include radiator, high-power LED light source and light-passing board, described high-power LED light source and light-passing board sequentially stacked on top of one another are fixed on the below of radiator, described radiator and high-power LED light source are provided with heat conduction compound medium layer, and described heat conduction compound medium layer at least pressing has copper dielectric layer and aluminium dielectric layer; When assembling, fit in the back side of described copper dielectric layer and high-power LED light source, the lower surface of aluminium dielectric layer and radiator is fitted.
Further, described heat conduction compound medium layer also includes graphite linings, and described graphite linings is arranged at the centre of copper dielectric layer and aluminium dielectric layer by pressing.
As preferably, the thickness of described copper dielectric layer is 3 ~ 6mm, and the thickness of graphite linings is 2 ~ 3mm, and the thickness of aluminium dielectric layer is 3 ~ 5mm.
Further, described high-power LED light source comprises pcb board and is located at the number row LED chip in pcb board front, described pcb board is provided with multiple screw through-hole, and described high-power LED light source is fixed together through screw through-hole and heat conduction compound medium layer by using screw.
Further, described light-passing board is being provided with convex surface with each LEDs chip corresponding position.
Wherein, described radiator is made up of the identical left radiator of structure and right radiator, the staged being convenient to docking mutually is all had to plug together portion in the side of left radiator and right radiator, the staged portion of plugging together is provided with fixed via and securing member, after left radiator and right radiator plug together mutually and put in place, left radiator and right radiator are connected to one through fixed via by described securing member.
Further, be provided with two groups of high-power LED light sources and light-passing board below described radiator, between two groups of light-passing boards, be provided with middle compression bar.
Further, described left radiator and right radiator are respectively equipped with semicircle shoulder hole, when plug together mutually fixing after, in described radiator, be formed centrally a circular shape through hole; In described manhole, circular end cap is installed, covers to be provided with at round nose and be convenient to wire to penetrate interior wire through-hole.
Further, described round nose covers the suspension ring being also provided with and being convenient to whole light fixture to lift, described suspension ring and circular end cap one-body molded.
Further, the upper end of described radiator is provided with the bracing frame of rotatable adjustment light fixture irradiating angle, and support frame as described above comprises Qian type link, is hinged with respectively is fixedly connected with sheet on two tops of Qian type link.
beneficial effect of the present invention:
A kind of high-power LED lamp with heat conduction compound medium layer provided by the present invention, include radiator, high-power LED light source and light-passing board, described high-power LED light source and light-passing board sequentially stacked on top of one another are fixed on the below of radiator, described radiator and high-power LED light source are provided with heat conduction compound medium layer, and described heat conduction compound medium layer at least pressing has copper dielectric layer and aluminium dielectric layer; When assembling, fit in the back side of described copper dielectric layer and high-power LED light source, the lower surface of aluminium dielectric layer and radiator is fitted.Time at work, the heat that high-power LED light source produces exports to heat conduction compound medium layer rapidly, then heat conducts to radiator through heat conduction compound medium layer again, makes delivered heat passage be in outside forward transmission always, can not accumulate in LED chip; Under the same conditions, the present invention has more rapid heat dissipation, and lamp luminescence efficiency is high, the advantage of long service life.The present invention is specially adapted to more than 300W high-power LED lamp.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation one with the high-power LED lamp of heat conduction compound medium layer of the present invention.
Fig. 2 is a kind of structural representation two with the high-power LED lamp of heat conduction compound medium layer of the present invention.
Fig. 3 is a kind of structural representation of high-power LED lamp when hiding light-passing board with heat conduction compound medium layer of the present invention.
Fig. 4 is a kind of STRUCTURE DECOMPOSITION figure with the high-power LED lamp of heat conduction compound medium layer of the present invention.
Fig. 5 is the interface schematic diagram of heat conduction compound medium layer in the present invention.
Reference numeral in Fig. 1 to Fig. 5 comprises:
1-radiator, 11-left radiator 12-right radiator
13-staged plugs together portion's 2-high-power LED light source, 21-pcb board
22-LED chip, 3-light-passing board, 31-convex surface
4-heat conduction compound medium layer, 41-copper dielectric layer, 42-aluminium dielectric layer
43-graphite linings, 5-middle compression bar 6-semicircle shoulder hole
7-circular end cap 8-suspension ring, 9-bracing frame
91-Qian type link 92-be fixedly connected with sheet.
Detailed description of the invention
For the ease of the understanding of those skilled in the art, below in conjunction with embodiment and accompanying drawing, the present invention is further illustrated, and the content that embodiment is mentioned not is limitation of the invention.See Fig. 1 to Fig. 5, below in conjunction with accompanying drawing, the present invention is described in detail.
A kind of high-power LED lamp with heat conduction compound medium layer provided by the invention, include radiator 1, high-power LED light source 2 and light-passing board 3, described high-power LED light source 2 and light-passing board 3 sequentially stacked on top of one another are fixed on the below of radiator 1, as shown in Figure 2, spiral shell through hole is provided with around light-passing board 3, below by using screw light-passing board 3 to be fixed on radiator 1 of the present invention, and high-power LED light source 2 is encapsulated.Described radiator 1 is provided with heat conduction compound medium layer 4 with high-power LED light source 2, and described heat conduction compound medium layer 4 at least pressing has copper dielectric layer 41 and aluminium dielectric layer 42; When assembling, described copper dielectric layer 41 is fitted with the back side of high-power LED light source 2, and aluminium dielectric layer 42 is fitted with the lower surface of radiator 1.Further, described heat conduction compound medium layer 4 also includes graphite linings 43, and described graphite linings 43 is arranged at the centre of copper dielectric layer 41 and aluminium dielectric layer 42 by pressing.As preferably, the thickness of the dielectric layer of copper described in the present invention 41 is 3 ~ 6mm; The thickness of graphite linings 43 is 2 ~ 3mm, and the thickness of aluminium dielectric layer 42 is 3 ~ 5mm, and the thermal conductivity factor of aluminium dielectric layer 42 is more than 2.0.
The Main Function of radiator 1 is that the heat produced in LED chip 22 being worked constantly is derived and is dispersed in environment, and the temperature of LED chip 22 is remained in required scope, thus ensures that LED can normally work.The quality of radiator 1 depends primarily on the thermal resistance of radiator 1, and thermal resistance is less, and under the same terms, LED junction temperature is lower; LED chip 22 junction temperature is lower, and LED chip 22 service life will be longer.
The thermal conductivity factor of metallic copper and aluminium is higher, and proportion is little, easily processes, low price, and has good ductility; In the present invention, graphite linings 43 higher for thermal conductivity factor clamps in centre by copper dielectric layer 41 and aluminium dielectric layer 42, forms the heat conduction compound medium layer 4 that thermal conductivity factor is higher.The LED lamp panel of typical high power light fixture is directly fixed on the below of radiator, when LED lamp panel reaches certain value toward the heat of heat sink, transmission speed between LED lamp panel and radiator slows down, and heat transmission even is not between the two forward transmission, causes LED junction temperature serious.Heat conduction compound medium layer 4 of the present invention is serving as the effect that heat transmits protective layer in radiator 1 with high-power LED light source 2, time at work, the heat that high-power LED light source 2 produces can export to heat conduction compound medium layer 4 rapidly, then heat conducts to radiator 1 through heat conduction compound medium layer 4 again, in the process that heat outwards transmits, heat is first drawn through from high-power LED light source 2 by copper dielectric layer 41 by described heat conduction compound medium layer 4 fast, then graphite linings 43 and aluminium dielectric layer 42 are to radiator 1 toward radiator 1 direction release heat, make delivered heat passage be in outside forward transmission always, heat is made to accumulate in LED chip 21 like this, under the same conditions, the present invention has more rapid heat dissipation, and lamp luminescence efficiency is high, the advantage of long service life.Therefore, the present invention is relatively suitable for the great power LED use being applied to more than 300W.
Further, described high-power LED light source 2 comprises pcb board 21 and is located at the number row LED chip 22 in pcb board 21 front, and described pcb board 21 is provided with multiple screw through-hole; Because radiator 1 average heat transfer distance is shorter, radiator 1 thermal resistance is less, high-power LED light source 2 of the present invention is fixed together through screw through-hole and heat conduction compound medium layer 4 by using screw, high-power LED light source 2 and heat conduction compound medium layer 4 are affixed on tightly the below of radiator 1, the thermal resistance in heat transfer process can be effectively reduced.
Further, described light-passing board 3 is being provided with convex surface 31 with each LEDs chip 22 corresponding position.Light the gathering through convex surface 31 that LED chip 22 penetrates, light utilization can be improved and light is outranged.
In the present invention, described radiator 1 is made up of the identical left radiator 11 of structure and right radiator 12, the staged being convenient to docking mutually is all had to plug together portion 13 in the side of left radiator 11 and right radiator 12, plug together portion 13 in staged and be provided with fixed via and securing member (not marking in the drawings), after left radiator 11 and right radiator 12 plug together mutually and put in place, left radiator 11 is connected to one with right radiator 12 through fixed via by described securing member.The radiator of typical high power LED is for increasing radiating efficiency, and its volume generally designs larger, and like this, not only radiating effect is unsatisfactory, also increases product weight, adds cost simultaneously.This radiator 1 is made up of the identical left radiator 11 of structure and right radiator 12, is convenient to producer's die sinking and produces, effectively reduce the production cost of radiator.
Further, because radiator 1 is combined by two halves, its volume and surface larger; Below described radiator 1, be provided with two groups of high-power LED light sources 2 and light-passing board 3, be convenient to the light emitting source of high-power LED light source 2 to split like this, so produced heat is also just independent of each other, and is conducive to promoting the power increasing LED lamp further.Between two groups of light-passing boards 3, be provided with middle compression bar 5, the gap between two groups of light-passing boards 3 can be covered, prevent dust or water from entering in lamp, protection LED lamp is not subject to the impact of external environment.
Further, described left radiator 11 and right radiator 12 are respectively equipped with semicircle shoulder hole 6, when left radiator 11 and right radiator 12 plug together mutually fixing after, in described radiator 1, be formed centrally a circular shape through hole; Circular end cap 7 is installed in described manhole, circular end cap 7 is provided with and is convenient to wire to penetrate interior wire through-hole.Further, described circular end cap 7 is also provided with the suspension ring 8 being convenient to whole light fixture to lift, described suspension ring 8 are one-body molded with circular end cap 7.Circular end cap 7 is fixed on circular shape through hole by using screw from interior by the present invention outward, the center, top of circular end cap 7 is located at by suspension ring 8, this facilitates and this high-power LED lamp is carried out vertical lifting, only suspender can need be realized the installation of this high-power LED lamp through suspension ring 8, simple and fast.
Further, the upper end of described radiator 1 is provided with the bracing frame 9 of rotatable adjustment light fixture irradiating angle, and support frame as described above 9 comprises Qian type link 91, is hinged with respectively is fixedly connected with sheet 92 on two tops of Qian type link 91.When this high-power LED lamp is as stage or outdoor projecting lamp, general degree needs to need to carry out light regulating angle according to the illumination of reality.In use, in the upper end of radiator 1, bracing frame 9 is installed, by its slant setting.Described Qian type link 91 is fixedly connected on falsework or ground, when adjusting angle, only need firmly hold radiator 1, radiator 1 being rotated around Qian type link 91, i.e. adjustable light angle.
Above content is only preferred embodiment of the present invention, and for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, this description should not be construed as limitation of the present invention.
Claims (10)
1. one kind has the high-power LED lamp of heat conduction compound medium layer, include radiator, high-power LED light source and light-passing board, described high-power LED light source is between radiator and light-passing board, it is characterized in that: described radiator and high-power LED light source arrange heat conduction compound medium layer, described heat conduction compound medium layer at least pressing has copper dielectric layer and aluminium dielectric layer; When assembling, fit in the back side of described copper dielectric layer and high-power LED light source, the lower surface of aluminium dielectric layer and radiator is fitted.
2. a kind of high-power LED lamp with heat conduction compound medium layer according to claim 1, is characterized in that: described heat conduction compound medium layer also includes graphite linings, and described graphite linings is arranged at the centre of copper dielectric layer and aluminium dielectric layer by pressing.
3. a kind of high-power LED lamp with heat conduction compound medium layer according to claim 2, is characterized in that: the thickness of described copper dielectric layer is 3 ~ 6mm, and the thickness of graphite linings is 2 ~ 3mm, and the thickness of aluminium dielectric layer is 3 ~ 5mm.
4. a kind of high-power LED lamp with heat conduction compound medium layer according to claim 2, it is characterized in that: described high-power LED light source comprises pcb board and is located at the number row LED chip in pcb board front, described pcb board is provided with multiple screw through-hole, and described high-power LED light source is fixed together through screw through-hole and heat conduction compound medium layer by using screw.
5. a kind of high-power LED lamp with heat conduction compound medium layer according to claim 4, is characterized in that: described light-passing board is being provided with convex surface with each LEDs chip corresponding position.
6. a kind of high-power LED lamp with heat conduction compound medium layer according to claim 1, it is characterized in that: described radiator is made up of the identical left radiator of structure and right radiator, the staged being convenient to docking mutually is all had to plug together portion in the side of left radiator and right radiator, the staged portion of plugging together is provided with fixed via and securing member, after left radiator and right radiator plug together mutually and put in place, left radiator and right radiator are connected to one through fixed via by described securing member.
7. a kind of high-power LED lamp with heat conduction compound medium layer according to claim 6, is characterized in that: be provided with two groups of high-power LED light sources and light-passing board below described radiator, between two groups of light-passing boards, be provided with middle compression bar.
8. a kind of high-power LED lamp with heat conduction compound medium layer according to claim 6, it is characterized in that: described left radiator and right radiator are respectively equipped with semicircle shoulder hole, when plug together mutually fixing after, in described radiator, be formed centrally a circular shape through hole; In described manhole, circular end cap is installed, covers to be provided with at round nose and be convenient to wire to penetrate interior wire through-hole.
9. a kind of high-power LED lamp with heat conduction compound medium layer according to claim 8, is characterized in that: described round nose covers the suspension ring being also provided with and being convenient to whole light fixture to lift, described suspension ring and circular end cap one-body molded.
10. a kind of high-power LED lamp with heat conduction compound medium layer according to claim 6, it is characterized in that: the upper end of described radiator is provided with the bracing frame of rotatable adjustment light fixture irradiating angle, support frame as described above comprises Qian type link, is hinged with respectively is fixedly connected with sheet on two tops of Qian type link.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510138743.XA CN104747952B (en) | 2015-03-27 | 2015-03-27 | A kind of high-power LED lamp with heat conduction compound medium layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510138743.XA CN104747952B (en) | 2015-03-27 | 2015-03-27 | A kind of high-power LED lamp with heat conduction compound medium layer |
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| Publication Number | Publication Date |
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| CN104747952A true CN104747952A (en) | 2015-07-01 |
| CN104747952B CN104747952B (en) | 2017-07-04 |
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Citations (7)
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| CN202791620U (en) * | 2012-06-08 | 2013-03-13 | 四川华体照明科技股份有限公司 | Light-emitting diode (LED) light source |
| CN202927591U (en) * | 2012-12-11 | 2013-05-08 | 西安尚华电子科技有限公司 | LED (Light-emitting diode) illuminating lamp |
| CN204513035U (en) * | 2015-03-27 | 2015-07-29 | 浙江磐安绿光电子有限公司 | A kind of high-power LED lamp with heat conduction compound medium layer |
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2015
- 2015-03-27 CN CN201510138743.XA patent/CN104747952B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101901865A (en) * | 2009-05-28 | 2010-12-01 | 三星电机株式会社 | Metallic laminate and manufacturing method of light emitting diode package using the same |
| CN102109116A (en) * | 2010-12-27 | 2011-06-29 | 秦彪 | Led light module and led chip |
| CN202221067U (en) * | 2011-01-14 | 2012-05-16 | 赖日旺 | Composite metal heat-dissipating structure formed by mono-metal layers |
| CN202791620U (en) * | 2012-06-08 | 2013-03-13 | 四川华体照明科技股份有限公司 | Light-emitting diode (LED) light source |
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| CN104747952B (en) | 2017-07-04 |
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Effective date of registration: 20160722 Address after: Panan County, Zhejiang province 322300 Chang Jinhua City Road 15 Applicant after: ZHEJIANG PAN'AN GREEN LIGHT ELECTRONIC CO.,LTD. Address before: 322300, Jinhua County, Zhejiang province Jianshan Panan Industrial Zone Zhejiang Panan green light Electronics Co., Ltd. Applicant before: ZHEJIANG PAN'AN GREEN LIGHT ELECTRONIC CO.,LTD. Applicant before: Liu Jun Applicant before: Deng Zhixiong Applicant before: Yang Honglan |
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