CN104745860A - Copper alloy for electronic and electrical equipment - Google Patents
Copper alloy for electronic and electrical equipment Download PDFInfo
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- CN104745860A CN104745860A CN201510166674.3A CN201510166674A CN104745860A CN 104745860 A CN104745860 A CN 104745860A CN 201510166674 A CN201510166674 A CN 201510166674A CN 104745860 A CN104745860 A CN 104745860A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
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Abstract
The invention relates to electronic and electrical materials, and in particular relates to a copper alloy for electronic and electrical equipment. The copper alloy is characterized in that the copper alloy comprises the ingredients by mass percent: 1.5-40% of Fe, 1-15% of Ti, 0.01-10% of Ag, 1-10% of Al, and the balance of Cu and unavoidable impurities, wherein a ratio of the content of Fe to the content of Ti meets an atomic ratio that Fe/Ti is greater than or equal to 0.1 and less than or equal to 10. The copper alloy for the electrical equipment is high in conductivity and yield strength, and good in elasticity and abrasion resistance, can be heated and processed, can be widely applied to the electrical equipment, and has a wide application prospect.
Description
Technical field
The present invention relates to electric material, particularly relate to a kind of electronic electric equipment copper alloy.
Background technology
Copper alloy has excellent physicals and chemical property, be widely used in the electrical communications in electrical industry, motor manufacturing, communication cable, electric wiring, with electron tube, printed wiring, unicircuit, lead frame in electronic industry, and transportation industries automobile, railway, boats and ships, aircraft, light industry, construction industry etc.Tool has broad application prospects, and is just day by day subject to the attention of countries in the world.National governments guide one after another energetically, support that numerous material supplier authors launches research to its technology of preparing and basic theory.
Copper alloy for matrix adds the alloy that one or more other elements form, has good electroconductibility, thermal conductivity, ductility and erosion resistance etc. with fine copper.Along with the development of electric cause and the raising of electrical apparatus technology, more and more higher to the characteristic project required by electronic electric equipment material, the mechanical propertys such as such as specific conductivity, intensity, plasticity, elasticity, resistance to fatigue, hardness, wear resistance, thermal treatment workability have higher requirement.
Therefore, in order to solve the problem, spy provides a kind of new technical scheme to satisfy the demands.
Summary of the invention
The object of this invention is to provide a kind of electric copper alloy, this material there is the excellent properties such as good electric conductivity, wear resistance, yield strength is high, thermal treatment can be processed.
In order to reach above-mentioned technical purpose, technical scheme of the present invention is specially, a kind of electronic electric equipment copper alloy, it is characterized in that: described copper alloy contains the Fe that mass percent is 1.5%-40%, the Ti of 1%-15%, the Al of the Ag of 0.01%-10%, 1%-10%, all the other are Cu and the inevitable impurity of surplus; The content of Fe meets atomic ratio 0.1≤Fe/Ti≤10 with the ratio of the content of Ti.
Further, the average crystallite particle diameter of described copper alloy is 0.1-50 μm.
Further, the crystal grain median size of the α phase of Cu, Fe of described copper alloy is at 0.5-20 μm.
Further, in described copper alloy crystal grain, the cross-section be made up of the vertical direction in plate face and the parallel direction of rolling direction to particle diameter be in the Fe-Si dispersed particle of 50-200nm, particle diameter be the particle of 100-200nm account for more than 30%.
Further, the Mn that mass percent is 0.2%-3% is also comprised in described copper alloy.
Further, the Cr that mass percent is 0.01%-3% is also comprised in described copper alloy.
Beneficial effect of the present invention: the electroconductibility of electric material copper alloy is high, good springiness, wear resisting property are good, yield strength is high, heating can be processed, silver improves its conductivity, titanium improves alloy elastic, aluminium and manganese improve the wear resisting property of copper alloy, and alloy particle diameter 0.1-50 μm makes its bending machining performance good, meets the requirement of electric installation.
Embodiment
The present invention is explained further below in conjunction with embodiments of the invention.Should be appreciated that specific embodiment described herein only for explaining the present invention, being not intended to limit the present invention.Described method is ordinary method if no special instructions.
Embodiment 1
Cu alloy material manufacture method of the present invention is quenching after melting the thermal treatment → hot rolling → hot rolling of casting → evenly → cold rolling → with the recrystallization process → cold rolling → ageing treatment of solid solution.
By metal simple-substance according to a certain ratio in the melting of intermediate frequency vacuum induction furnace, keep the condition of 30min ~ 12h at the temperature of 800 ~ 1100 DEG C under, carry out even thermal treatment, hot rolling, quenching; Cold rolling, utilize this cold rolling alloy obtaining specifying, the recrystallization process with solid solution is subject to this alloy, the such condition of 5-300S is kept to carry out from 700 ~ 900 DEG C, improve proof stress, with cold rolling after the recrystallization process of solid solution be carry out under the condition of 15%-45% in working modulus, improve its bending property; And implement low-temperature annealing process, its annealing temperature is 100 ~ 900 DEG C, and annealing time is 0.5h ~ 2h.The billet of 40 × 100mm cast by alloy.Car goes surface imperfection, and is amputated by head, is cut into the disk that 20mm is thick.
A kind of electronic electric equipment copper alloy, copper alloy contains the Fe that mass percent is 1.5%, the Ti of 1%, the Ag of 0.01%, the Al of 1%, and all the other are Cu and the inevitable impurity of surplus; The content of Fe is atomic ratio Fe/Ti=1.29 with the ratio of the content of Ti.
The average crystallite particle diameter of copper alloy is 0.1 μm, and the crystal grain median size of the α phase of Cu, Fe of copper alloy is at 0.5 μm.The cross-section be made up of the vertical direction in plate face and the parallel direction of rolling direction to particle diameter be in the Fe-Si dispersed particle of 50-200nm, particle diameter be the particle of 100-200nm account for 30%.
Conductance measurement, use with the test film of rolling direction 40 × 100mm, according to non-ferrous metal material conductance measurement method, what utilize double bridge formula resistance measurement device determines resistance, utilize average cross section area method to calculate specific conductivity, the specific conductivity of this material is 38%IACS.
Yield strength measures, and using with rolling direction is the test film of length direction, and 0.2% yield strength is 560N/mm
2.
The mensuration of average crystallite particle diameter, uses and coldly buries after resin obtains the sightingpiston that rolling direction and thickness direction form, and the polishing wheel of spraying with the water-fast pouncing papers of No. 2400, the diamond that is coated with 1 μm, has carried out precision work grinding.Again with chromic acid and iron(ic) chloride corrosion crystal boundary, obtain thus observing sample.Related organization is observed, and uses opticmicroscope to obtain macrograph with the multiplying power of 400 times.About the mensuration of average crystallite particle diameter, use the process of chopping, the direction of line segment is made to become the parallel direction of rolling direction, macrograph draws 4 line segments, the length of every bar line segment is 250 μm, using the mean value of grain size number obtained each line segment as average crystallite particle diameter, the average crystallite particle diameter of this material is 0.08 μm.
The mensuration of dispersed particle, makes the cross section be made up of rolling direction and thickness of slab direction of ion milling, use field emission type scanning electronic microscope to observe under the multiplying power of 1.5 ten thousand times.To the number of sample at the dispersed particle of the area test 30 ~ 300nm of 100 μm.In addition, particle diameter be 30 ~ 300nm point spread in particle, investigate the frequency of particle diameter and its appearance, obtain the ratio that ratio that particle diameter is the number of the particle of 50 ~ 200nm and particle diameter are the number of 100 ~ 200nm, it should be noted that, in the present invention, the particle diameter of dispersed particle refers to the major diameter of particle, and the particle of 100 ~ 200nm particle diameter of this material accounts for 50%.
Embodiment 2
A kind of electronic electric equipment copper alloy, the preparation method of this material is identical with embodiment 1, and difference is that the proportioning of material is different, be specially copper alloy and contain the Fe that mass percent is 40%, the Ti of 15%, the Ag of 10%, the Al of 10%, all the other are Cu and the inevitable impurity of surplus; The content of Fe is atomic ratio Fe/Ti=1.29 with the ratio of the content of Ti.
The average crystallite particle diameter of copper alloy is 50 μm, and the crystal grain median size of the α phase of Cu, Fe of copper alloy is at 20 μm.The cross-section be made up of the vertical direction in plate face and the parallel direction of rolling direction to particle diameter be in the Fe-Si dispersed particle of 50-200nm, particle diameter be the particle of 100-200nm account for 40%.
Conductance measurement, use with the test film of rolling direction 40 × 100mm, according to non-ferrous metal material conductance measurement method, what utilize double bridge formula resistance measurement device determines resistance, utilize average cross section area method to calculate specific conductivity, the specific conductivity of this material is 45%IACS.
Yield strength measures, and using with rolling direction is the test film of length direction, and 0.2% yield strength is 550N/mm
2.
The mensuration of average crystallite particle diameter, uses and coldly buries after resin obtains the sightingpiston that rolling direction and thickness direction form, and the polishing wheel of spraying with the water-fast pouncing papers of No. 2400, the diamond that is coated with 1 μm, has carried out precision work grinding.Again with chromic acid and iron(ic) chloride corrosion crystal boundary, obtain thus observing sample.Related organization is observed, and uses opticmicroscope to obtain macrograph with the multiplying power of 400 times.About the mensuration of average crystallite particle diameter, use the process of chopping, the direction of line segment is made to become the parallel direction of rolling direction, macrograph draws 4 line segments, the length of every bar line segment is 250 μm, using the mean value of grain size number obtained each line segment as average crystallite particle diameter, the average crystallite particle diameter of this material is 50 μm.
The mensuration of dispersed particle, makes the cross section be made up of rolling direction and thickness of slab direction of ion milling, use field emission type scanning electronic microscope to observe under the multiplying power of 1.5 ten thousand times.To the number of sample at the dispersed particle of the area test 30 ~ 300nm of 100 μm.In addition, particle diameter be 30 ~ 300nm point spread in particle, investigate the frequency of particle diameter and its appearance, obtain the ratio that ratio that particle diameter is the number of the particle of 50 ~ 200nm and particle diameter are the number of 100 ~ 200nm, it should be noted that, in the present invention, the particle diameter of dispersed particle refers to the major diameter of particle, and the particle of 100 ~ 200nm particle diameter of this material accounts for 40%.
Embodiment 3
A kind of electronic electric equipment copper alloy, the preparation method of this material is identical with embodiment 1, difference is that the proportioning of material is different, material is different, be specially copper alloy and contain the Fe that mass percent is 1.5%, the Ti of 1%, the Ag of 0.01%, the Al of 1%, also comprise the Mn that mass percent is 0.2%, all the other are Cu and the inevitable impurity of surplus; The content of Fe is atomic ratio Fe/Ti=1.29 with the ratio of the content of Ti.
The average crystallite particle diameter of copper alloy is 0.1 μm, and the crystal grain median size of the α phase of Cu, Fe of copper alloy is at 0.5 μm.The cross-section be made up of the vertical direction in plate face and the parallel direction of rolling direction to particle diameter be in the Fe-Si dispersed particle of 50-200nm, particle diameter be the particle of 100-200nm account for 50%.
Conductance measurement, use with the test film of rolling direction 40 × 100mm, according to non-ferrous metal material conductance measurement method, what utilize double bridge formula resistance measurement device determines resistance, utilize average cross section area method to calculate specific conductivity, the specific conductivity of this material is 39%IACS.
Yield strength measures, and using with rolling direction is the test film of length direction, and 0.2% yield strength is 600N/mm
2.
The mensuration of average crystallite particle diameter, uses and coldly buries after resin obtains the sightingpiston that rolling direction and thickness direction form, and the polishing wheel of spraying with the water-fast pouncing papers of No. 2400, the diamond that is coated with 1 μm, has carried out precision work grinding.Again with chromic acid and iron(ic) chloride corrosion crystal boundary, obtain thus observing sample.Related organization is observed, and uses opticmicroscope to obtain macrograph with the multiplying power of 400 times.About the mensuration of average crystallite particle diameter, use the process of chopping, the direction of line segment is made to become the parallel direction of rolling direction, macrograph draws 4 line segments, the length of every bar line segment is 250 μm, using the mean value of grain size number obtained each line segment as average crystallite particle diameter, the average crystallite particle diameter of this material is 0.1 μm.
The mensuration of dispersed particle, makes the cross section be made up of rolling direction and thickness of slab direction of ion milling, use field emission type scanning electronic microscope to observe under the multiplying power of 1.5 ten thousand times.To the number of sample at the dispersed particle of the area test 30 ~ 300nm of 100 μm.In addition, particle diameter be 30 ~ 300nm point spread in particle, investigate the frequency of particle diameter and its appearance, obtain the ratio that ratio that particle diameter is the number of the particle of 50 ~ 200nm and particle diameter are the number of 100 ~ 200nm, it should be noted that, in the present invention, the particle diameter of dispersed particle refers to the major diameter of particle, and the particle of 100 ~ 200nm particle diameter of this material accounts for 50%.
Embodiment 4
A kind of electronic electric equipment copper alloy, the preparation method of this material is identical with embodiment 1, difference is that the proportioning of material is different, material is different, be specially copper alloy and contain the Fe that mass percent is 40%, the Ti of 15%, the Ag of 10%, the Al of 10%, also comprise the Cr that mass percent is 0.01%, all the other are Cu and the inevitable impurity of surplus; The content of Fe is atomic ratio Fe/Ti=1.29 with the ratio of the content of Ti.
The average crystallite particle diameter of copper alloy is 50 μm, and the crystal grain median size of the α phase of Cu, Fe of copper alloy is at 20 μm.The cross-section be made up of the vertical direction in plate face and the parallel direction of rolling direction to particle diameter be in the Fe-Si dispersed particle of 50-200nm, particle diameter be the particle of 100-200nm account for 40%.
Conductance measurement, use with the test film of rolling direction 40 × 100mm, according to non-ferrous metal material conductance measurement method, what utilize double bridge formula resistance measurement device determines resistance, utilize average cross section area method to calculate specific conductivity, the specific conductivity of this material is 44%IACS.
Yield strength measures, and using with rolling direction is the test film of length direction, and 0.2% yield strength is 590N/mm
2.
The mensuration of average crystallite particle diameter, uses and coldly buries after resin obtains the sightingpiston that rolling direction and thickness direction form, and the polishing wheel of spraying with the water-fast pouncing papers of No. 2400, the diamond that is coated with 1 μm, has carried out precision work grinding.Again with chromic acid and iron(ic) chloride corrosion crystal boundary, obtain thus observing sample.Related organization is observed, and uses opticmicroscope to obtain macrograph with the multiplying power of 400 times.About the mensuration of average crystallite particle diameter, use the process of chopping, the direction of line segment is made to become the parallel direction of rolling direction, macrograph draws 4 line segments, the length of every bar line segment is 250 μm, using the mean value of grain size number obtained each line segment as average crystallite particle diameter, the average crystallite particle diameter of this material is 50 μm.
The mensuration of dispersed particle, makes the cross section be made up of rolling direction and thickness of slab direction of ion milling, use field emission type scanning electronic microscope to observe under the multiplying power of 1.5 ten thousand times.To the number of sample at the dispersed particle of the area test 30 ~ 300nm of 100 μm.In addition, particle diameter be 30 ~ 300nm point spread in particle, investigate the frequency of particle diameter and its appearance, obtain the ratio that ratio that particle diameter is the number of the particle of 50 ~ 200nm and particle diameter are the number of 100 ~ 200nm, it should be noted that, in the present invention, the particle diameter of dispersed particle refers to the major diameter of particle, and the particle of 100 ~ 200nm particle diameter of this material accounts for 40%.
Embodiment 5
A kind of electronic electric equipment copper alloy, the preparation method of this material is identical with embodiment 1, difference is that the proportioning of material is different, material is different, being specially copper alloy, to contain mass percent be the Fe of 40%, the Ti of 3.43%, the Ag of 1%, the Al of 5%, also comprise the Mn that mass percent is 1%, the Cr of 0.05%, all the other are Cu and the inevitable impurity of surplus; The content of Fe is atomic ratio Fe/Ti=10 with the ratio of the content of Ti.
The average crystallite particle diameter of copper alloy is 1 μm, and the crystal grain median size of the α phase of Cu, Fe of copper alloy is at 2 μm.The cross-section be made up of the vertical direction in plate face and the parallel direction of rolling direction to particle diameter be in the Fe-Si dispersed particle of 50-200nm, particle diameter be the particle of 100-200nm account for more than 45%.
Conductance measurement, use with the test film of rolling direction 40 × 100mm, according to non-ferrous metal material conductance measurement method, what utilize double bridge formula resistance measurement device determines resistance, utilize average cross section area method to calculate specific conductivity, the specific conductivity of this material is 42%IACS.
Yield strength measures, and using with rolling direction is the test film of length direction, and 0.2% yield strength is 580N/mm
2.
The mensuration of average crystallite particle diameter, uses and coldly buries after resin obtains the sightingpiston that rolling direction and thickness direction form, and the polishing wheel of spraying with the water-fast pouncing papers of No. 2400, the diamond that is coated with 1 μm, has carried out precision work grinding.Again with chromic acid and iron(ic) chloride corrosion crystal boundary, obtain thus observing sample.Related organization is observed, and uses opticmicroscope to obtain macrograph with the multiplying power of 400 times.About the mensuration of average crystallite particle diameter, use the process of chopping, the direction of line segment is made to become the parallel direction of rolling direction, macrograph draws 4 line segments, the length of every bar line segment is 250 μm, using the mean value of grain size number obtained each line segment as average crystallite particle diameter, the average crystallite particle diameter of this material is 1 μm.
The mensuration of dispersed particle, makes the cross section be made up of rolling direction and thickness of slab direction of ion milling, use field emission type scanning electronic microscope to observe under the multiplying power of 1.5 ten thousand times.To the number of sample at the dispersed particle of the area test 30 ~ 300nm of 100 μm.In addition, particle diameter be 30 ~ 300nm point spread in particle, investigate the frequency of particle diameter and its appearance, obtain the ratio that ratio that particle diameter is the number of the particle of 50 ~ 200nm and particle diameter are the number of 100 ~ 200nm, it should be noted that, in the present invention, the particle diameter of dispersed particle refers to the major diameter of particle, and the particle of 100 ~ 200nm particle diameter of this material accounts for 45%.
Apply specific case herein to set forth principle of the present invention and embodiment, the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and this description should not be construed as limitation of the present invention.
Claims (6)
1. an electronic electric equipment copper alloy, is characterized in that: described copper alloy contains the Fe that mass percent is 1.5%-40%, the Al of the Ag of the Ti of 1%-15%, 0.01%-10%, 1%-10%, and all the other are Cu and the inevitable impurity of surplus; The content of Fe meets atomic ratio 0.1≤Fe/Ti≤10 with the ratio of the content of Ti.
2. a kind of electronic electric equipment copper alloy according to claim 1, is characterized in that, the average crystallite particle diameter of described copper alloy is 0.1-50 μm.
3. a kind of electronic electric equipment copper alloy according to claim 1, is characterized in that, the crystal grain median size of the α phase of Cu, Fe of described copper alloy is at 0.5-20 μm.
4. a kind of electronic electric equipment copper alloy according to claim 1, it is characterized in that, in described copper alloy crystal grain, the cross-section be made up of the vertical direction in plate face and the parallel direction of rolling direction to particle diameter be in the Fe-Si dispersed particle of 50-200nm, particle diameter be the particle of 100-200nm account for more than 30%.
5. a kind of electronic electric equipment copper alloy according to claim 1, is characterized in that, also comprises the Mn that mass percent is 0.2%-3% in described copper alloy.
6. a kind of electronic electric equipment copper alloy according to claim 1, is characterized in that, also comprises the Cr that mass percent is 0.01%-3% in described copper alloy.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510166674.3A CN104745860A (en) | 2015-04-10 | 2015-04-10 | Copper alloy for electronic and electrical equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510166674.3A CN104745860A (en) | 2015-04-10 | 2015-04-10 | Copper alloy for electronic and electrical equipment |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008030368A1 (en) * | 2006-09-08 | 2008-03-13 | Tosoh Smd, Inc. | Copper sputtering target with fine grain size and high electromigration resistance and methods of making the same |
| CN101605917A (en) * | 2007-02-16 | 2009-12-16 | 株式会社神户制钢所 | Intensity and the copper alloy plate for electric and electronic parts that has excellent formability |
| CN101748309A (en) * | 2008-11-28 | 2010-06-23 | 同和金属技术有限公司 | Copper alloy plate and method for producing same |
| CN101821416A (en) * | 2007-07-27 | 2010-09-01 | Msi株式会社 | Copper alloy material |
| CN103361512A (en) * | 2012-03-28 | 2013-10-23 | 株式会社神户制钢所 | Electric and electronic part copper alloy sheet with excellent bending workability and stress relaxation resistance |
-
2015
- 2015-04-10 CN CN201510166674.3A patent/CN104745860A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008030368A1 (en) * | 2006-09-08 | 2008-03-13 | Tosoh Smd, Inc. | Copper sputtering target with fine grain size and high electromigration resistance and methods of making the same |
| CN101605917A (en) * | 2007-02-16 | 2009-12-16 | 株式会社神户制钢所 | Intensity and the copper alloy plate for electric and electronic parts that has excellent formability |
| CN101821416A (en) * | 2007-07-27 | 2010-09-01 | Msi株式会社 | Copper alloy material |
| CN101748309A (en) * | 2008-11-28 | 2010-06-23 | 同和金属技术有限公司 | Copper alloy plate and method for producing same |
| CN103361512A (en) * | 2012-03-28 | 2013-10-23 | 株式会社神户制钢所 | Electric and electronic part copper alloy sheet with excellent bending workability and stress relaxation resistance |
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