CN104742297A - Reflection element with inner surface provided with micro-convex structure array and manufacturing method of reflection element - Google Patents
Reflection element with inner surface provided with micro-convex structure array and manufacturing method of reflection element Download PDFInfo
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- CN104742297A CN104742297A CN201510075679.5A CN201510075679A CN104742297A CN 104742297 A CN104742297 A CN 104742297A CN 201510075679 A CN201510075679 A CN 201510075679A CN 104742297 A CN104742297 A CN 104742297A
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Abstract
The invention discloses a reflection element with an inner surface provided with a micro-convex structure array and a manufacturing method of the reflection element. The manufacturing method comprises the following steps: (S1) preparing a flexible transfer adhesive film of a letterpress thermal printing coating; (S2) modifying a curved surface of a male mold by virtue of seal-exhausting negative pressure adsorption; (S3) carrying out microinjection molding on a thermoplastic or thermoset sizing material; and (S4) carrying out mold release, ultrasonic cleaning and inner surface vacuum aluminizing. A micro-convex structure of the reflection element is a cone body or a table body, wherein the cone body comprises a circular cone and a pyramid; the table body comprises a circular table and a pyramid table; the minimal circumscribed circle diameter of the bottom surface of the micro-convex structure is less than or equal to 2.5 microns, and the height of the micro-convex structure is less than or equal to 3 microns. The manufacturing method of the reflection element with the inner surface provided with the micro-convex structure array has the advantages of high micro structure copy rate, precise size, simple manufacturing process and the like, and industrial production can be realized.
Description
Technical field
The present invention relates to machine-building and optical component manufacture field, be specifically related to reflecting element and manufacture method thereof that a kind of inner surface has micro-convex structure array.
Background technology
Surface micro-structure has a wide range of applications in fields such as microelectronics, optics and biology, at photoelectric field, for illuminating source, the particularly luminous characteristics of light emitting diode (LED), by building the ordered micro structure array with special microcosmos geometric shape at reflecting element inner surface, can illumination, display quality be improved, obtain the illumination of more particularity, display requirement.Develop the manufacture method of kinds of surface micro-structural at present, such as photoetching technique, electron beam lithography and micromachined, nano impression, LIGA technology and hot padding etc.But these manufacture methods are mostly because the precision manufactureing that difficulty of processing is large, high in cost of production shortcoming cannot realize wide area surface micro-structural.And manufacture the huge challenge especially of large-area ordered micro structure array at inner surface.For this kind of use of optical reflection element optical component widely, more need a kind ofly to realize low cost, precision is high, technique is simple, production efficiency is high inner surface micro-structural large area manufacturing technology.
Summary of the invention
In order to overcome the shortcoming of prior art existence with not enough, the invention provides reflecting element and manufacture method thereof that a kind of inner surface has micro-convex structure array.
The present invention overcomes the defect that existing manufacture micro-structural, particularly inner surface microstructuring method exist, provide a kind of novel inner surface method for manufacturing microstructure, there is microstructure replication than high, precision size, the advantages such as manufacturing process is simple, are easy to realize suitability for industrialized production.
The present invention adopts following technical scheme:
Inner surface has a manufacture method for the reflecting element of micro-convex structure array, comprises the steps:
S1 adopts the preparation of relief printing plate hot padding coating to have the flexible transfer glued membrane step of dimple-structures
S2 adopts sealing negative-pressure adsorption of bleeding to modify formpiston curved surface step;
The micro injection molding step of S3 thermoplasticity or thermosetting sizing material;
The vacuum aluminum-coated step of the S4 demoulding, Ultrasonic Cleaning and inner surface.
The flexible transfer glued membrane step that described employing relief printing plate hot padding coating preparation has dimple-structures specifically comprises:
S1.1 applies thermosets on film substrate, coating thickness >=140% × relief printing plate relief structure of stamp height dimension;
S1.2, to the thermosetting wet film after coating, carries out hot-air seasoning by the laddering cure profile of ladder and reaches semi-cured state;
The thermosetting wet film of S1.3 to semi-cured state carries out high-temperature process, and temperature is 110% ~ 120% of thermosets solidification temperature;
S1.4 carries out relief printing plate hot padding to the coating after high-temperature process, and relief printing plate die is at the uniform velocity pressed down the rear demoulding, obtains the flexible transfer glued membrane with dimple-structures.
Described employing sealing negative-pressure adsorption of bleeding is modified formpiston curved surface step and is specifically comprised:
S2.1 is by the flexible transfer glued membrane of dimple-structures obtained above, overlay on formpiston, formpiston edge fixed frame seals, and with air extractor, sealing area is bled, producing negative pressure makes the flexible transfer glued membrane of dimple-structures fit tightly on each punch of formpiston, and main line of bleeding is closed and maintained negative pressure fit-state, obtains the formpiston after the modification of punch array curved surface, described male mold surfaces distribution punch array, has microchannel branch road of bleeding in each punch;
S2.2 is to the nick array surface spraying releasing agent of the flexible transfer glued membrane after laminating.
The micro injection molding step of described thermoplasticity or thermosetting sizing material, comprising:
Mated by formpiston after surface modification fixing with evacuated mould, as micro injection molding die, when adopting thermoplastic, microinjection process is that the sizing material of melting is filled cavity body of mould from injection port vasopressing injection, cooling forming; When adopting thermosets, microinjection process is that liquid sizing material is filled cavity body of mould from injection port vasopressing injection, and intensification is heated to solidification temperature, curing molding.
The vacuum aluminum-coated step of the described demoulding, Ultrasonic Cleaning and inner surface, comprising:
S4.1 is when after sizing material cooling forming or curing molding, separated by formpiston after evacuated mould and surface modification, and open main line of bleeding, gas enters between the formpiston of flexible transfer glued membrane and punch array surface, both be separated, flexible transfer glued membrane together takes out together with device to be formed;
After S4.2 device air cooling to be formed keeps a period of time to room temperature, flexible transfer glued membrane is peeled off from finished article inner surface, subsequently Ultrasonic Cleaning is carried out to finished article, adopt vacuum aluminium plating process to form reflecting surface at finished article inner surface plated aluminum film, namely can be made into the reflecting element with inner surface micro-convex structure array.
Described film substrate is polytetrafluoroethylene (PTFE), polyester, polytrifluorochloroethylene, Merlon, polyimides or PEI, described thermosets is organic siliconresin, described relief printing plate relief structure of stamp is centrum or stage body, centrum comprises circular cone, pyramid, stage body comprises round platform, terrace with edge, relief printing plate relief structure of stamp bottom surface minimum circumscribed circle diameter is 2.5 μm, and the height of relief printing plate relief structure of stamp is 3 μm.
The laddering cure profile of described ladder comprises preheating insulation staircase curve and semi-solid preparation insulation staircase curve.
Described thermoplastic is polymethyl methacrylate, acetal resin or polyethylene, and described thermosets is dimethyl silicone polymer.
Inner surface has a reflecting element for micro-convex structure array, and described micro-convex structure is centrum or stage body, and centrum comprises circular cone, pyramid, and stage body comprises round platform, terrace with edge, minimum circumscribed circle diameter≤2.5 μm, micro-convex structure bottom surface, height≤3 μm of micro-convex structure.
When described micro-convex structure is cone shape, circular cone basal diameter ∈ [1.2 μm, 2.5 μm], the conical top most advanced and sophisticated radius of a ball >=150nm, cone height ∈ [1.1 μm, 3 μm].
Beneficial effect of the present invention
The present invention overcomes the defect that existing manufacture micro-structural, particularly inner surface microstructuring method exist, propose and adopt relief printing plate hot padding coating to prepare flexible transfer glued membrane, in conjunction with adopting the formpiston curved surface method of modifying sealing negative-pressure adsorption of bleeding, utilize the micro injection molding of thermoplasticity or thermosetting sizing material, finally obtain reflecting element obtained finished article inner surface is vacuum aluminum-coated;
Inner surface method for manufacturing microstructure of the present invention, have microstructure replication than high, precision size, the advantages such as manufacturing process is simple, are easy to realize suitability for industrialized production;
Reflecting element of the present invention, by building the ordered micro structure array with special microcosmos geometric shape at reflecting element inner surface, can illuminating source be improved, the particularly illumination of light emitting diode (LED) light source, display quality, obtain the illumination of more particularity, display requirement.
Accompanying drawing explanation
Fig. 1 is the relief printing plate hot embossing process of relief printing plate die to the thermosets that film substrate applies;
Fig. 2 is relief printing plate relief structure of stamp schematic diagram;
Fig. 3 is the flexible transfer glued membrane after relief printing plate hot padding;
Fig. 4 is the schematic diagram that the formpiston curved surface adopting sealing to bleed negative-pressure adsorption is modified;
Fig. 5 is formpiston cross-sectional view after curved surface is modified;
Fig. 6 is assembling die generalized section after micro injection molding;
Fig. 7 is the flexible transfer glued membrane stripping process generalized section of finished article;
After Fig. 8 is through relief printing plate hot padding, flexible transfer glued membrane impression silica-gel coating dimple structure SEM schemes;
Fig. 9 is the SEM figure that a kind of inner surface has the reflecting element of micro-convex structure array.
Shown in figure:
11-has the flexible transfer glued membrane of dimple-structures, 12-relief printing plate die, 13-thermosetting wet film, 14-film substrate, 15-relief printing plate relief structure of stamp, 21-formpiston, 22-punch array, 23-bleeds microchannel branch road, 24-fixed frame, 25-air extractor, the formpiston after the modification of 26-punch array curved surface, 31-evacuated mould, 32-injection port, 33-cavity body of mould, 34-heating rod, 41-reflecting element.
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, the present invention is described in further detail, but embodiments of the present invention are not limited thereto.
Embodiment
Inner surface has a manufacture method for the reflecting element of micro-convex structure array, comprises the steps:
S1 as shown in Figure 1, adopts the preparation of relief printing plate hot padding coating to have the flexible transfer glued membrane step of dimple-structures, comprising:
S1.1 chooses middle high thermal stability, good mechanical performance, better, the air-locked film substrate of toughness.Selected film substrate 14 applies thermosets.Coating thickness >=140% × relief printing plate relief structure of stamp 15 height dimension, described film substrate can be polytetrafluoroethylene (PTFE), polyester, polytrifluorochloroethylene, Merlon, polyimides or PEI etc.The thermosets of coating can be organic siliconresin, described relief printing plate die has relief printing plate relief structure of stamp, arrange in array, described relief printing plate relief structure of stamp is centrum or stage body, centrum comprises circular cone, pyramid, stage body comprises round platform, terrace with edge, and relief printing plate relief structure of stamp bottom surface minimum circumscribed circle diameter is 2.5 μm, and the height of relief printing plate relief structure of stamp is 3 μm., the present embodiment adopts cone dimpling shape, as shown in Figure 2.
The basal diameter of the cone of the present embodiment is 2.5 μm, and cone height is 3 μm.
Thermosetting wet film 13 after S1.2 coating, carry out hot-air seasoning by the laddering cure profile of ladder and reach semi-cured state, the laddering cure profile of described ladder comprises preheating insulation ladder and semi-solid preparation insulation ladder, and the heating rate being incubated ladder from preheating insulation ladder to semi-solid preparation is slow, inside and outside ensureing wet film, entirety reaches semi-cured state.
S1.3 carries out fast (heat time≤1s) high-temperature process to half solidified coating surface, and high temperature is 110% ~ 120% of thermosets solidification temperature.Make semi-solid preparation coating coating surface before carrying out relief printing plate hot padding have thin layer to reach solid state and be convenient to microstructure transfer printing and the demoulding.
S1.4 carries out relief printing plate hot padding to the coating after high-temperature process, heating source is positioned at below film substrate, be warming up to solidification node gradually and be incubated, while heating up gradually, relief printing plate die 12 at the uniform velocity presses to designated depth after being applied to coating and is retained to insulation and terminates the rear demoulding.Temperature retention time, the speed that presses down are determined according to thermosets characteristic.Different according to depth of indentation, the flexible transfer glued membrane 11 with dimple-structures of different form ratios can be obtained, as shown in Figure 3.
S2 adopts the formpiston curved surface sealing negative-pressure adsorption of bleeding to modify process, as shown in Figure 4, specifically comprises:
The flexible transfer glued membrane of what S1 obtained by S2.1 have dimple-structures, overlay on formpiston 21, described male mold surfaces distributes the punch array 22 mated with micro-injection moulding device size, microchannel branch road 23 of bleeding is had in each punch, formpiston edge adopts fixed frame 24 to seal, and bleed with air extractor 25 pairs of sealing areas, producing negative pressure makes flexible transfer glued membrane fit tightly on each punch, main line closedown of bleeding maintains negative pressure fit-state, formpiston 26 after obtained punch array curved surface modification, as shown in Figure 5.
S2.2 is to flexible transfer film surface spraying releasing agent after laminating, and described releasing agent is commercially available Daikin great Jin releasing agent (DAIFREE)-GA-7500.
The micro injection molding step of S3 thermoplasticity or thermosetting sizing material, as shown in Figure 6; Formpiston 26 after the punch array curved surface obtained being modified mates fixing with evacuated mould 31, as micro injection molding die, when adopting thermoplastic, microinjection process is that the sizing material of melting is filled cavity body of mould 33 from injection port 32 vasopressing injection, cooling forming.When adopting thermosets, microinjection process is that liquid sizing material is filled cavity body of mould from injection port vasopressing injection, and intensification is heated to solidification temperature.Above-mentioned evacuated mould is embedded with heating rod 34, connects temperature controller and carries out intensification heating mould.Thermoplastic can be polymethyl methacrylate, acetal resin, polyethylene etc.Thermosets can be dimethyl silicone polymer.
The vacuum aluminum-coated step of the S4 demoulding, Ultrasonic Cleaning and inner surface.
Evacuated mould and formpiston, when after sizing material cooling forming or curing molding, separate by S4.1, and open main line of bleeding, and gas enters into flexible transfer glued membrane and both is separated with punch array surface, and flexible transfer glued membrane together takes out together with finished article.
After S4.2 device air cooling to be formed keeps a period of time to room temperature, flexible transfer glued membrane is peeled off from finished article inner surface, as shown in Figure 7, subsequently Ultrasonic Cleaning is carried out to finished article.Vacuum aluminium plating process is adopted to form reflecting surface at finished article inner surface plated aluminum film.Namely can be made into the reflecting element 41 with inner surface micro-convex structure array.
A kind of inner surface that said method prepares has the reflecting element of micro-convex structure array, and described micro-convex structure is cone shape, circular cone basal diameter ∈ [1.2 μm, 2.5 μm], the conical top most advanced and sophisticated radius of a ball >=150nm, cone height ∈ [1.1 μm, 3 μm].
Embodiment 1
Inner surface has a manufacture method for the reflecting element of micro-convex structure array, comprises the steps:
S1 adopts the flexible transfer glued membrane preparation process of relief printing plate hot padding coating:
S1.1 chooses polytetrafluoroethylene film base material (PFTE), and thickness is 30 μm.Adopt scraper for coating mode, polytetrafluoroethylene film base material applies organic siliconresin, select DOW CORNING OE-6550 silica gel, coating thickness is 30 μm, the relief printing plate relief structure of stamp of the present embodiment is conical, and circular cone basal diameter is 2.5 μm, and the most advanced and sophisticated radius of a ball of conical top is 75nm, cone height is 3 μm, as shown in Figure 2.
S1.2 carries out preheating to the silica gel wet film after coating, and rise to 80 DEG C from room temperature, heating rate is 20 DEG C/min, and is incubated 3.5min at 80 DEG C.Then temperature is risen to 110 DEG C, heating rate is 30 DEG C/min, and at 110 DEG C, continue insulation 2min.After the laddering solidification of ladder, silica gel wet film entirety reaches semi-cured state.
S1.3, semi-solid preparation silica-gel coating is at the uniform velocity passed through the heating drying tunnel of long 80mm with the speed of 100mm/s, drying tunnel temperature is 170 DEG C.After quick high-temp process, silica-gel coating has very thin layer to reach solid state.
As shown in Figure 1, carry out relief printing plate hot padding to above-mentioned obtained silica-gel coating, heating source is positioned at below film substrate S1.4, is incubated 18min after being warming up to 150 DEG C gradually, and heating rate is 60 DEG C/min.But when temperature rises to 120 DEG C, stop after at the uniform velocity pressing down 2.8 μm with the speed of 0.5 μm/s after relief printing plate die is applied to silica-gel coating.After insulation terminates, relief printing plate die is departed from the silica-gel coating of solidification, obtain polytetrafluoroethylene film base material and silica-gel coating combined films that silica gel mask has circular cone dimple-structures, in this, as flexible transfer glued membrane.Be illustrated in figure 8 flexible transfer glued membrane impression silica-gel coating dimple structure SEM figure after relief printing plate hot padding.
S2 adopts the formpiston curved surface modification step sealing negative-pressure adsorption of bleeding;
S2.1 such as Fig. 4 shows, flexible transfer glued membrane overlays on formpiston, and male mold surfaces is distributed with punch array, and punch shape is truncated cone-shaped, and round platform lower surface diameter is 100mm, and upper surface diameter is 80mm, is highly 50mm.Formpiston edge adopts fixed frame press seal, and with air extractor, sealing area is bled, produce negative pressure and make flexible transfer glued membrane fit tightly on each punch, main line of bleeding is closed and is maintained negative pressure fit-state, formpiston after obtained punch array curved surface modification, as shown in Figure 5.
S2.2 is to the silica gel dimple-structures surface spraying releasing agent of flexible transfer glued membrane after laminating.
The micro injection molding step of S3 thermoplasticity or thermosetting sizing material;
As shown in Figure 6, S3.1 injection forming mold, mated by formpiston fixing with evacuated mould, the evacuated mould degree of depth is 120mm.Adopt thermosets dimethyl silicone polymer (PDMS).Under room temperature, liquid polydimethylsiloxane gum is filled cavity body of mould from injection port vasopressing injection by (25 DEG C), and pressure is 15kg/cm2.Keep this pressure, control temperature controller (not shown in FIG.) and by heating rod mould be warming up to 80 DEG C and be incubated 90min, heating rate is 50 DEG C/min.
The vacuum aluminum-coated step of the S4 demoulding, Ultrasonic Cleaning and inner surface
After the complete curing molding of S4.1 methylsiloxane sizing material, evacuated mould and formpiston are separated, and open main line of bleeding, gas enters into flexible transfer glued membrane and both is separated with punch array surface, and flexible transfer glued membrane takes out together with dimethyl silicone polymer finished article.
Flexible transfer glued membrane, after dimethyl silicone polymer finished article air cooling to room temperature continues to keep 60min, is peeled off from finished article inner surface, is carried out Ultrasonic Cleaning subsequently to finished article by S4.2.Vacuum aluminium plating process is adopted to form reflecting surface at dimethyl silicone polymer finished article inner surface plated aluminum film.Namely can be made into the dimethyl silicone polymer figured reflective element with inner surface circular cone micro-convex structure array.Micro-convex structure is cone shape, described circular cone basal diameter ∈ [1.2 μm, 2.5 μm], the conical top most advanced and sophisticated radius of a ball >=150nm, cone height ∈ [1.1 μm, 3 μm].Figure 9 shows that micro-injection moulding dimethyl silicone polymer finished article inner surface micro-convex structure SEM schemes.
Embodiment 2
Inner surface has a manufacture method for the reflecting element of micro-convex structure array, comprises the steps:
S1 adopts the flexible transfer glued membrane preparation process of relief printing plate hot padding coating
S1.1 tetrafluoroethene film substrate (PFTE), thickness is 30 μm.Adopt spin coating mode, polytetrafluoroethylene film base material applies dimethyl silicone polymer (PDMS), selects DOW CORNING Sylgard 184, coating thickness is 50 μm.
S1.2 carries out preheating to the PDMS wet film after coating, and rise to 45 DEG C from room temperature, heating rate is 10 DEG C/min, and is incubated 20min at 45 DEG C.Then temperature is risen to 60 DEG C, heating rate is 15 DEG C/min, and at 60 DEG C, continue insulation 15min.After the laddering solidification of ladder, silica gel wet film entirety reaches semi-cured state.
Semi-solid preparation PDMS coating is at the uniform velocity passed through the heating drying tunnel of long 80mm by S1.3 with the speed of 100mm/s, drying tunnel temperature is 100 DEG C.After quick high-temp process, PDMS coating has very thin layer to reach solid state.
As shown in Figure 1, carry out relief printing plate hot padding to above-mentioned obtained PDMS coating, heating source is positioned at below film substrate S1.4, is incubated 60min after being warming up to 80 DEG C gradually, and heating rate is 30 DEG C/min.But when temperature rises to 70 DEG C, stop after at the uniform velocity pressing down 3 μm with the speed of 0.5 μm/s after relief printing plate die is applied to silica-gel coating.After insulation terminates, relief printing plate die is departed from the PDMS coating of solidification, obtain polytetrafluoroethylene film base material and PDMS coatings combine film that PMDS mask has circular cone dimple-structures, in this, as flexible transfer glued membrane.
S2 adopts the formpiston curved surface modification step sealing negative-pressure adsorption of bleeding;
As shown in Figure 4, S2.1 flexible transfer glued membrane overlays on formpiston, and male mold surfaces is distributed with punch array, and punch shape is truncated cone-shaped, and round platform lower surface diameter is 100mm, and upper surface diameter is 80mm, is highly 50mm.Formpiston edge adopts fixed frame press seal, and with air extractor (being illustrated as rough schematic view), sealing area is bled, producing negative pressure makes flexible transfer glued membrane fit tightly on each punch, main line closedown of bleeding maintains negative pressure fit-state, the formpiston after obtained punch array curved surface modification.
S2.2 is to the dimethyl silicone polymer dimple-structures surface spraying releasing agent of flexible transfer glued membrane after laminating.
The micro injection molding step of S3 thermoplasticity or thermosetting sizing material;
As shown in Figure 6, combination micro injection molding die, fixedly mated with evacuated mould by formpiston, the evacuated mould degree of depth is 150mm to S3.1.Adopt thermoplastic polymethyl methacrylate (PMMA), heat 140 DEG C to molten condition, the polymethyl methacrylate sizing material vasopressing injection of melting is filled cavity body of mould, and pressure is 200kg/cm2.Under this pressure of maintenance, cooling curing is shaping.
The vacuum aluminum-coated step of the S4 demoulding, Ultrasonic Cleaning and inner surface
S4.1 is after the complete cooling curing of polymethyl methacrylate sizing material is shaping, evacuated mould and formpiston are separated, and open main line of bleeding, gas enters into flexible transfer glued membrane and both is separated with punch array surface, and flexible transfer glued membrane takes out together with polymethyl methacrylate finished article.
As shown in Figure 7, flexible transfer glued membrane, after polymethyl methacrylate finished article air cooling to room temperature continues to keep 30min, is peeled off from finished article inner surface, is carried out Ultrasonic Cleaning subsequently to finished article by S4.2.Vacuum aluminium plating process is adopted to form reflecting surface at polymethyl methacrylate finished article inner surface plated aluminum film.Namely can be made into the polymethyl methacrylate figured reflective element with inner surface circular cone micro-convex structure array.
Above-described embodiment is the present invention's preferably embodiment; but embodiments of the present invention are not limited by the examples; change, the modification done under other any does not deviate from Spirit Essence of the present invention and principle, substitute, combine, simplify; all should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (10)
1. inner surface has a manufacture method for the reflecting element of micro-convex structure array, it is characterized in that, comprises the steps:
S1 adopts the preparation of relief printing plate hot padding coating to have the flexible transfer glued membrane step of dimple-structures
S2 adopts sealing negative-pressure adsorption of bleeding to modify formpiston curved surface step;
The micro injection molding step of S3 thermoplasticity or thermosetting sizing material;
The vacuum aluminum-coated step of the S4 demoulding, Ultrasonic Cleaning and inner surface.
2. manufacture method according to claim 1, is characterized in that, the flexible transfer glued membrane step that described employing relief printing plate hot padding coating preparation has dimple-structures specifically comprises:
S1.1 applies thermosets on film substrate, coating thickness >=140% × relief printing plate relief structure of stamp height dimension;
S1.2, to the thermosetting wet film after coating, carries out hot-air seasoning by the laddering cure profile of ladder and reaches semi-cured state;
The thermosetting wet film of S1.3 to semi-cured state carries out high-temperature process, and temperature is 110% ~ 120% of thermosets solidification temperature;
S1.4 carries out relief printing plate hot padding to the coating after high-temperature process, and relief printing plate die is at the uniform velocity pressed down the rear demoulding, obtains the flexible transfer glued membrane with dimple-structures.
3. manufacture method according to claim 1, is characterized in that, described employing sealing negative-pressure adsorption of bleeding is modified formpiston curved surface step and specifically comprised:
S2.1 is by the flexible transfer glued membrane of dimple-structures obtained above, overlay on formpiston, formpiston edge fixed frame seals, and with air extractor, sealing area is bled, producing negative pressure makes the flexible transfer glued membrane of dimple-structures fit tightly on each punch of formpiston, and main line of bleeding is closed and maintained negative pressure fit-state, obtains the formpiston after the modification of punch array curved surface, described male mold surfaces distribution punch array, has microchannel branch road of bleeding in each punch;
S2.2 is to the nick array surface spraying releasing agent of the flexible transfer glued membrane after laminating.
4. manufacture method according to claim 1, is characterized in that, the micro injection molding step of described thermoplasticity or thermosetting sizing material, comprising:
Mated by formpiston after surface modification fixing with evacuated mould, as micro injection molding die, when adopting thermoplastic, microinjection process is that the sizing material of melting is filled cavity body of mould from injection port vasopressing injection, cooling forming; When adopting thermosets, microinjection process is that liquid sizing material is filled cavity body of mould from injection port vasopressing injection, and intensification is heated to solidification temperature, curing molding.
5. manufacture method according to claim 1, is characterized in that, the vacuum aluminum-coated step of the described demoulding, Ultrasonic Cleaning and inner surface, comprising:
S4.1 is when after sizing material cooling forming or curing molding, separated by formpiston after evacuated mould and surface modification, and open main line of bleeding, gas enters between the formpiston of flexible transfer glued membrane and punch array surface, both be separated, flexible transfer glued membrane together takes out together with device to be formed;
After S4.2 device air cooling to be formed keeps a period of time to room temperature, flexible transfer glued membrane is peeled off from finished article inner surface, subsequently Ultrasonic Cleaning is carried out to finished article, adopt vacuum aluminium plating process to form reflecting surface at finished article inner surface plated aluminum film, namely can be made into the reflecting element with inner surface micro-convex structure array.
6. manufacture method according to claim 2, it is characterized in that, described film substrate is polytetrafluoroethylene (PTFE), polyester, polytrifluorochloroethylene, Merlon, polyimides or PEI, described thermosets is organic siliconresin, relief printing plate relief structure of stamp is centrum or stage body, and centrum comprises circular cone, pyramid, and stage body comprises round platform, terrace with edge, described relief printing plate relief structure of stamp bottom surface minimum circumscribed circle diameter is 2.5 μm, and the height of relief printing plate relief structure of stamp is 3 μm.
7. manufacture method according to claim 2, is characterized in that, the laddering cure profile of described ladder comprises preheating insulation staircase curve and semi-solid preparation insulation staircase curve.
8. manufacture method according to claim 4, is characterized in that, described thermoplastic is polymethyl methacrylate, acetal resin or polyethylene, and described thermosets is dimethyl silicone polymer.
9. a kind of inner surface of the manufacture method manufacture according to any one of claim 1-8 has the reflecting element of micro-convex structure array, it is characterized in that, described micro-convex structure is centrum or stage body, centrum comprises circular cone or pyramid, stage body comprises round platform or terrace with edge, minimum circumscribed circle diameter≤2.5 μm, micro-convex structure bottom surface, height≤3 μm of micro-convex structure.
10. reflecting element according to claim 9, is characterized in that, when described micro-convex structure is cone shape, and circular cone basal diameter ∈ [1.2 μm, 2.5 μm], the conical top most advanced and sophisticated radius of a ball >=150nm, cone height ∈ [1.1 μm, 3 μm].
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111597597A (en) * | 2020-05-11 | 2020-08-28 | 内蒙古京泰发电有限责任公司 | Method for creating PDMS (polydimethylsiloxane) round-the-sky and square-earth structural body equipment model |
| CN112967971A (en) * | 2020-05-27 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Micro-LED transfer substrate and preparation method thereof |
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