CN104724709A - Chassis assembly for polycrystalline silicon reduction furnace - Google Patents
Chassis assembly for polycrystalline silicon reduction furnace Download PDFInfo
- Publication number
- CN104724709A CN104724709A CN201510140179.5A CN201510140179A CN104724709A CN 104724709 A CN104724709 A CN 104724709A CN 201510140179 A CN201510140179 A CN 201510140179A CN 104724709 A CN104724709 A CN 104724709A
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- chassis
- chassis body
- polycrystalline silicon
- reducing furnace
- silicon reducing
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Abstract
The invention discloses a chassis assembly for a polycrystalline silicon reduction furnace. The chassis assembly for the polycrystalline silicon reduction furnace comprises a chassis body, a plurality of electrode holders, a plurality of air inlet pipes and a plurality of air exhaust pipes, wherein four spiral flow passages, which are spiraled from the center of the chassis body to the edge of the chassis body, are defined in the chassis body, at least four coolant inlets and at least four coolant outlets, which are communicated with the four spiral flow passages, are formed in the chassis body, and distances from the circle centers of the at least four coolant inlets to the circle center of the chassis body are equal; the electrode holders are arranged on the chassis body; the air inlet pipes and the air exhaust pipes are arranged on the chassis body. The chassis assembly for the polycrystalline silicon reduction furnace, disclosed by the embodiments of the invention, has the advantages that the coolant flow resistance is low, the cooling effect is good, the radial temperature distribution is uniform, temperature difference stress and deformation are difficultly generated, and the like.
Description
Technical field
The present invention relates to technical field of polysilicon production, in particular to a kind of chassis assembly for polycrystalline silicon reducing furnace.
Background technology
Polycrystalline silicon reducing furnace is the nucleus equipment of output the finished product in production of polysilicon, is also the key link of decision systems production capacity, energy consumption.Small-sized polycrystalline silicon reducing furnace (as 12 to rod, 18 to excellent reduction furnace etc.) the general energy consumption of production unit weight product is higher, single furnace output is relatively low, more and more be not suitable with current market demands. along with development and the raising of polysilicon equipment level, large-scale reduction furnace is continually developed, occurred 36 to rod, 48 to rod even 60 to excellent reduction furnace.
Large polycrystalline silicon reducing furnace in correlation technique, although solve the problem of some output and energy consumption, but along with the maximization of equipment and complicated, cooling liquid flowing dynamic resistance in its chassis increases, cause cooling performance poor, and due to the flow process of cooling fluid longer, chassis radial temperature profile is uneven, causes chassis to produce temperature stress and distortion.
Summary of the invention
The present invention is intended to solve one of above-mentioned technical problem in correlation technique at least to a certain extent.For this reason, the present invention proposes a kind of chassis assembly for polycrystalline silicon reducing furnace, and this chassis assembly being used for polycrystalline silicon reducing furnace has that cooling liquid flowing dynamic resistance is little, good cooling results, radial temperature profile evenly, not easily produce the advantage such as temperature stress and distortion.
For achieving the above object, according to embodiments of the invention, a kind of chassis assembly for polycrystalline silicon reducing furnace is proposed, the described chassis assembly for polycrystalline silicon reducing furnace comprises: chassis body, four helical flow paths of the edge from chassis body described in the center rotation direction of described chassis body are limited with in described chassis body, described chassis body is provided with at least four cooling liquid inlets and at least four cooling liquid outlets that are communicated with four described helical flow paths respectively, and the center of circle of described at least four cooling liquid inlets and the distance of center circle of described chassis body are from equal; Multiple electrode holder, multiple described electrode holder is arranged in described chassis body; Multiple inlet pipe and multiple vapor pipe, multiple described inlet pipe and multiple described vapor pipe are arranged in described chassis body.
Have that cooling liquid flowing dynamic resistance is little according to the chassis assembly for polycrystalline silicon reducing furnace of the embodiment of the present invention, good cooling results, radial temperature profile evenly, not easily produce the advantage such as temperature stress and distortion.
In addition, the chassis assembly for polycrystalline silicon reducing furnace according to the above embodiment of the present invention can also have following additional technical characteristic:
According to one embodiment of present invention, the length of four described helical flow paths is equal.
According to one embodiment of present invention, four described helical flow paths are coiled into six layers along the radial transmission line of described chassis body.
According to one embodiment of present invention, described chassis body comprises: chassis flange; Upper plate, described upper plate is located in the flange of described chassis; Lower shoe, described lower shoe to be located in the flange of described chassis and to be positioned at below described upper plate, and described lower shoe and described upper plate and described chassis flange limit cooling chamber; Four flow deflectors, four described flow deflectors to be located in described cooling chamber and in described cooling chamber, to limit four described helical flow paths.
According to one embodiment of present invention, four described flow deflectors are welded on described lower shoe.
According to one embodiment of present invention, the described inlet pipe of the vicinity of described flow deflector, described vapor pipe and described electrode holder place are respectively equipped with segmental arc.
According to one embodiment of present invention, each described flow deflector is provided with some communicating apertures.
According to one embodiment of present invention, the described chassis assembly for polycrystalline silicon reducing furnace also comprises and is located at four cooling fluid inlet pipes in described chassis body and at least four cooling fluids go out pipe, described cooling fluid inlet pipe is arranged on the inner peripheral place of described chassis body and is communicated with all described cooling liquid inlet of corresponding described helical flow path respectively, and described cooling fluid goes out pipe and is arranged on the outer peripheral edge place of described chassis body and is communicated with corresponding described cooling liquid outlet respectively.
According to one embodiment of present invention, cooling fluid described in any one goes out the vertex of vertex higher than cooling fluid inlet pipe described in any one of pipe.
According to one embodiment of present invention, multiple described inlet pipe is between the inner peripheral and outer peripheral edge of described chassis body, and described vapor pipe is four and arranges the inner peripheral place of described chassis body and be nested in respectively in four described cooling fluid inlet pipes.
Accompanying drawing explanation
Fig. 1 is the axial sectional view of the chassis assembly for polycrystalline silicon reducing furnace according to the embodiment of the present invention.
Fig. 2 is the radial cross-section of the chassis assembly for polycrystalline silicon reducing furnace according to the embodiment of the present invention.
Reference numeral: go out pipe 600 for the chassis assembly 10 of polycrystalline silicon reducing furnace, chassis body 100, helical flow path 110, cooling liquid inlet 120, cooling liquid outlet 130, chassis flange 140, upper plate 150, lower shoe 160, cooling chamber 180, flow deflector 190, segmental arc 191, electrode holder 200, inlet pipe 300, vapor pipe 400, cooling fluid inlet pipe 500, cooling fluid.
Embodiment
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the present invention, and can not limitation of the present invention be interpreted as.
Below with reference to the accompanying drawings the chassis assembly 10 for polycrystalline silicon reducing furnace according to the embodiment of the present invention is described.
As depicted in figs. 1 and 2, chassis body 100, multiple electrode holder 200, multiple inlet pipe 300 and multiple vapor pipe 400 is comprised according to the chassis assembly 10 for polycrystalline silicon reducing furnace of the embodiment of the present invention.
Four helical flow paths 110 are limited with in chassis body 100, four helical flow paths 110 are from the outer peripheral edge of the center rotation direction chassis body 100 of chassis body 100, chassis body 100 is provided with at least four cooling liquid inlets 120 and at least four cooling liquid outlets 130 that are communicated with four helical flow paths 110 respectively, namely each helical flow path 110 is communicated with at least one cooling liquid outlet 130 with at least one cooling liquid inlet 120, wherein, the center of circle of cooling liquid inlet 120 and the distance of center circle of chassis body 100 are from equal.Multiple electrode holder 200 is arranged in chassis body 100.Multiple inlet pipe 300 and multiple vapor pipe 400 to be arranged in chassis body 100 and to run through chassis body 100 (above-below direction is as shown in the arrow A in accompanying drawing) along the vertical direction.
According to the chassis assembly 10 for polycrystalline silicon reducing furnace of the embodiment of the present invention, by arranging four helical flow paths 110 from the outer peripheral edge of the center rotation direction chassis body 100 of chassis body 100 in chassis body 100, and arrange in chassis body 100 and be communicated with four helical flow paths 110 respectively and at least four cooling liquid inlets 120 equidistant with the center of circle of chassis body 100, such cooling fluid can enter four helical flow paths 110 respectively by cooling liquid inlet 120, to the upper surface of chassis body 100, multiple inlet pipe 300, multiple vapor pipe 400 and multiple electrode holder 200 carry out pressure cooling.Owing to arranging four helical flow paths 110 in chassis body 100, make the flow process of each helical flow path 110 shorter, decrease the resistance to flow of cooling fluid, improve cooling performance, and it is excessive to avoid chassis body 100 radial temperature difference, be conducive to preventing chassis body 100 from producing temperature stress and distortion.Therefore, have that cooling liquid flowing dynamic resistance is little according to the chassis assembly 10 for polycrystalline silicon reducing furnace of the embodiment of the present invention, good cooling results, radial temperature profile evenly, not easily produce the advantage such as temperature stress and distortion.
Below with reference to the accompanying drawings the chassis assembly 10 for polycrystalline silicon reducing furnace according to the specific embodiment of the invention is described.
In specific embodiments more of the present invention, as depicted in figs. 1 and 2, chassis body 100, multiple electrode holder 200, multiple inlet pipe 300 and multiple vapor pipe 400 is comprised according to the chassis assembly 10 for polycrystalline silicon reducing furnace of the embodiment of the present invention.
Further, the length of four helical flow paths 110 is equal, and the width at the equal length place of four helical flow paths 110 is equal.The homogeneity of chassis body 100 radial temperature can be improved thus further, thus prevent chassis body 100 from producing temperature stress and distortion further.
Alternatively, as shown in Figure 1, four helical flow paths 110 are coiled into six layers along the radial transmission line of chassis body 100, and cooling liquid outlet 130 is arranged on the outer peripheral edge place of chassis body 100, and cooling fluid is discharged by after the heart channel of Hang-Shaoyin helical flow path 110 in chassis body 100.
In concrete examples more of the present invention, as depicted in figs. 1 and 2, chassis body 100 comprises chassis flange 140, upper plate 150, lower shoe 160.Chassis flange 140 is for connecting body of heater.Upper plate 150 and lower shoe 160 are all located in chassis flange 140, and lower shoe 160 is positioned at below upper plate 150, and lower shoe 160 limits cooling chamber 180 with upper plate 150 and chassis flange 140.Inlet pipe 300 and vapor pipe 400 run through upper plate 150 and lower shoe 160.Can reduce lower portion of furnace body inlet pipe quantity thus, simplified apparatus is installed and piping layout.
In order to arrange helical flow path 110 in above-mentioned chassis body 100, four flow deflectors 190 can being located in cooling chamber 180 and in cooling chamber 180, limiting four helical flow paths 110, namely cooling chamber 180 can be made up of jointly four helical flow paths 110.For improving the stability of flow deflector 190 in cooling chamber 180, four flow deflectors 190 can be welded on the upper surface of lower shoe 160.
Further, as shown in Figure 1, the contiguous inlet pipe 300 of each flow deflector 190, vapor pipe 400 and electrode holder 200 place are respectively equipped with segmental arc 191, the cross-sectional area of helical flow path 110 can be kept substantially constant with the flow speed stability ensureing cooling fluid on the one hand thus, can avoid on the other hand occurring cooling dead angle and affecting cooling performance.
That the quantity of the segmental arc 191 on each flow deflector 190 and position and can require to arrange according to practical application with it will be appreciated by those skilled in the art that.
Advantageously, each flow deflector 190 is provided with the spaced multiple communicating aperture (not shown) of length direction along flow deflector 190, particularly, each flow deflector 190 can be provided with 3-10 described communicating aperture, communicating aperture described in these can be communicated with the helical flow path 110 of flow deflector 190 both sides, cooling fluid in two adjacent helical flow paths 110 is circulated mutually, thus avoids producing coolant flow dead band.
In specific embodiments more of the present invention, as shown in Figure 2, chassis assembly 10 for polycrystalline silicon reducing furnace also comprises four cooling fluid inlet pipes 500 and at least four cooling fluids go out pipe 600, and cooling fluid inlet pipe 500 and cooling fluid go out pipe 600 and to be all located in chassis body 100 and to run through lower shoe 160.Wherein, cooling fluid inlet pipe 500 is arranged on the inner peripheral place of chassis body 100 and is communicated with all cooling liquid inlets 120 of corresponding helical flow path 110 respectively.For example, cooling liquid inlet 120 is eight, and each helical flow path 110 is communicated with two cooling liquid inlets 120, and each cooling fluid inlet pipe 500 is communicated with corresponding helical flow path 110 by two cooling liquid inlets 120.Cooling fluid goes out pipe 600 and is arranged on the outer peripheral edge place of chassis body 100 and is communicated with corresponding cooling liquid outlet 130 respectively.By arranging cooling fluid inlet pipe 500 and cooling fluid goes out pipe 600, the input and output of cooling fluid can be facilitated.
Alternatively, as depicted in figs. 1 and 2, multiple inlet pipe 300 between the inner peripheral and outer peripheral edge of chassis body 100 and three become one group.Vapor pipe 400 is four and is arranged on the inner peripheral place of chassis body 100, and four vapor pipes 400 are nested in four cooling fluid inlet pipes 500 respectively.The structure of chassis assembly 10 can be simplified like this, and the quantity of chassis assembly 10 appearance pipeline can be reduced, thus the space that reduction pipeline takies in chassis body 100.
Advantageously, as shown in Figure 2, any one cooling fluid goes out the vertex of vertex higher than any one cooling fluid inlet pipe 500 of pipe 600, can make thus to ensure a certain amount of cooling fluid at any time in cooling chamber 180.
In describing the invention, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore limitation of the present invention can not be interpreted as.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In describing the invention, the implication of " multiple " is at least two, such as two, three etc., unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can comprise the first and second features and directly contact, also can comprise the first and second features and not be directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " comprise fisrt feature immediately below second feature and tiltedly below, or only represent that fisrt feature level height is less than second feature.
In the description of this specification sheets, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.In addition, the different embodiment described in this specification sheets or example can carry out engaging and combining by those skilled in the art.
Although illustrate and describe embodiments of the invention above, be understandable that, above-described embodiment is exemplary, can not be interpreted as limitation of the present invention, and those of ordinary skill in the art can change above-described embodiment within the scope of the invention, revises, replace and modification.
Claims (10)
1. for a chassis assembly for polycrystalline silicon reducing furnace, it is characterized in that, comprising:
Chassis body, four helical flow paths of the edge from chassis body described in the center rotation direction of described chassis body are limited with in described chassis body, described chassis body is provided with at least four cooling liquid inlets and at least four cooling liquid outlets that are communicated with four described helical flow paths respectively, and the center of circle of described at least four cooling liquid inlets and the distance of center circle of described chassis body are from equal;
Multiple electrode holder, multiple described electrode holder is arranged in described chassis body;
Multiple inlet pipe and multiple vapor pipe, multiple described inlet pipe and multiple described vapor pipe are arranged in described chassis body.
2. the chassis assembly for polycrystalline silicon reducing furnace according to claim 1, is characterized in that, the length of four described helical flow paths is equal.
3. the chassis assembly for polycrystalline silicon reducing furnace according to claim 1, is characterized in that, four described helical flow paths are coiled into six layers along the radial transmission line of described chassis body.
4. the chassis assembly for polycrystalline silicon reducing furnace according to claim 1, is characterized in that, described chassis body comprises:
Chassis flange;
Upper plate, described upper plate is located in the flange of described chassis;
Lower shoe, described lower shoe to be located in the flange of described chassis and to be positioned at below described upper plate, and described lower shoe and described upper plate and described chassis flange limit cooling chamber;
Four flow deflectors, four described flow deflectors to be located in described cooling chamber and in described cooling chamber, to limit four described helical flow paths.
5. the chassis assembly for polycrystalline silicon reducing furnace according to claim 4, is characterized in that, four described flow deflectors are welded on described lower shoe.
6. the chassis assembly of polycrystalline silicon reducing furnace according to claim 4, is characterized in that, the described inlet pipe of vicinity of described flow deflector, described vapor pipe and described electrode holder place are respectively equipped with segmental arc.
7. the chassis assembly of polycrystalline silicon reducing furnace according to claim 4, is characterized in that, each described flow deflector is provided with some communicating apertures.
8. the chassis assembly for polycrystalline silicon reducing furnace according to claim 1, it is characterized in that, also comprise and be located at four cooling fluid inlet pipes in described chassis body and at least four cooling fluids go out pipe, described cooling fluid inlet pipe is arranged on the inner peripheral place of described chassis body and is communicated with all described cooling liquid inlet of corresponding described helical flow path respectively, and described cooling fluid goes out pipe and is arranged on the outer peripheral edge place of described chassis body and is communicated with corresponding described cooling liquid outlet respectively.
9. the chassis assembly for polycrystalline silicon reducing furnace according to claim 8, is characterized in that, cooling fluid described in any one goes out the vertex of vertex higher than cooling fluid inlet pipe described in any one of pipe.
10. the chassis assembly for polycrystalline silicon reducing furnace according to claim 8, it is characterized in that, multiple described inlet pipe is between the inner peripheral and outer peripheral edge of described chassis body, and described vapor pipe is four and arranges the inner peripheral place of described chassis body and be nested in respectively in four described cooling fluid inlet pipes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510140179.5A CN104724709A (en) | 2015-03-27 | 2015-03-27 | Chassis assembly for polycrystalline silicon reduction furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510140179.5A CN104724709A (en) | 2015-03-27 | 2015-03-27 | Chassis assembly for polycrystalline silicon reduction furnace |
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| Publication Number | Publication Date |
|---|---|
| CN104724709A true CN104724709A (en) | 2015-06-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510140179.5A Pending CN104724709A (en) | 2015-03-27 | 2015-03-27 | Chassis assembly for polycrystalline silicon reduction furnace |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55117230A (en) * | 1979-02-19 | 1980-09-09 | Siemens Ag | Semiconductor material precipitating device |
| CN201485283U (en) * | 2009-08-20 | 2010-05-26 | 上海森松压力容器有限公司 | Polysilicon reducing furnace chassis with three centrosymmetric spiral flow guide channels |
| CN102910632A (en) * | 2012-11-19 | 2013-02-06 | 中国恩菲工程技术有限公司 | Chassis component used for polycrystalline silicon reduction furnace |
| CN102923710A (en) * | 2012-11-19 | 2013-02-13 | 中国恩菲工程技术有限公司 | Polycrystalline silicon reducing furnace |
| CN102936013A (en) * | 2012-11-19 | 2013-02-20 | 中国恩菲工程技术有限公司 | Polycrystalline silicon reduction furnace |
| CN204224265U (en) * | 2014-08-28 | 2015-03-25 | 上海森松新能源设备有限公司 | Polycrystalline silicon reduction furnace base plate device |
| CN204529323U (en) * | 2015-03-27 | 2015-08-05 | 中国恩菲工程技术有限公司 | For the chassis assembly of polycrystalline silicon reducing furnace |
-
2015
- 2015-03-27 CN CN201510140179.5A patent/CN104724709A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55117230A (en) * | 1979-02-19 | 1980-09-09 | Siemens Ag | Semiconductor material precipitating device |
| CN201485283U (en) * | 2009-08-20 | 2010-05-26 | 上海森松压力容器有限公司 | Polysilicon reducing furnace chassis with three centrosymmetric spiral flow guide channels |
| CN102910632A (en) * | 2012-11-19 | 2013-02-06 | 中国恩菲工程技术有限公司 | Chassis component used for polycrystalline silicon reduction furnace |
| CN102923710A (en) * | 2012-11-19 | 2013-02-13 | 中国恩菲工程技术有限公司 | Polycrystalline silicon reducing furnace |
| CN102936013A (en) * | 2012-11-19 | 2013-02-20 | 中国恩菲工程技术有限公司 | Polycrystalline silicon reduction furnace |
| CN204224265U (en) * | 2014-08-28 | 2015-03-25 | 上海森松新能源设备有限公司 | Polycrystalline silicon reduction furnace base plate device |
| CN204529323U (en) * | 2015-03-27 | 2015-08-05 | 中国恩菲工程技术有限公司 | For the chassis assembly of polycrystalline silicon reducing furnace |
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Application publication date: 20150624 |