CN104723402A - IC chip die cutting device - Google Patents

IC chip die cutting device Download PDF

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Publication number
CN104723402A
CN104723402A CN 201510004516 CN201510004516A CN104723402A CN 104723402 A CN104723402 A CN 104723402A CN 201510004516 CN201510004516 CN 201510004516 CN 201510004516 A CN201510004516 A CN 201510004516A CN 104723402 A CN104723402 A CN 104723402A
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CN
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Prior art keywords
die
cutting
chip
ic
upper
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CN 201510004516
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Chinese (zh)
Inventor
陈友兵
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池州睿成微电子有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38Cutting-out; Stamping-out
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38Cutting-out; Stamping-out
    • B26F1/44Cutters therefor; Dies therefor

Abstract

The invention discloses an IC chip die cutting device. The IC chip die cutting device comprises a machine base, a left supporting seat, a right supporting seat, a top plate, a hydraulic cylinder, an upper die plate, an upper cutting die, a lower cutting die and a conveyor. Compared with the prior art, resin containing an IC chip is placed on the lower cutting die, the upper cutting die is pushed to descend by the hydraulic cylinder, the upper cutting die and the lower cutting die cut the resin containing with the IC chip into pieces, the pieces fall on the top of the conveyor, and the IC chip pieces are conveyed by the conveyor. By manual sorting and packaging, the production efficiency is improved, manual collecting is avoided, and the unexpected casualty is prevented from happening.

Description

一种IC芯片模切装置 An IC chip die cutting apparatus

技术领域 FIELD

[0001] 本发明涉及一模切装置,尤其涉及一种IC芯片模切装置。 [0001] The present invention relates to a die cutting apparatus, particularly to an IC chip die cutting apparatus.

背景技术 Background technique

[0002] 随着科技的发展,电子产品越来越先进,体积越来越小,而电子产品发展的根本在于IC芯片的大量使用,由于电子芯片体积极小,为了IC芯片能方便使用,需要在芯片包裹一层树脂,通常情况下是一块树脂上包有若干件芯片,在通过加工装置将其剪切成单件,目前是通过模具剪切,但是有IC芯片体积小,在剪切成单件后收集不便,从而导致效率低,并且通过人工去收集,上模会有意外掉落,发生重大伤亡事故,鉴于以上缺陷,实有必要设计一种IC芯片模切装置。 [0002] With the development of science and technology, electronic products are more and more advanced, smaller and smaller, while the fundamental electronic product development lies in the extensive use of IC chips, because the electronic chips are so small IC chip can for ease of use, need in the chip package with a resin, usually a resin on a chip package has a number of members, by processing means which cut in one piece, there is cut by the die, but a small IC chip size, the cut into after one-piece collection inconvenience, resulting in low efficiency, and by doing so to collect, there is accidentally dropped on the mold, causing serious casualty, in view of the above disadvantages, there is a need to design a die cutting apparatus IC chip.

发明内容 SUMMARY

[0003] 本发明所要解决的技术问题在于:提供一种IC芯片模切装置,来解决效率低和人员伤亡事故发生的问题。 [0003] The present invention solves the technical problem is that: an IC chip to provide a die-cutting apparatus, to solve the problem of low efficiency and casualties occur.

[0004] 为解决上述技术问题,本发明的技术方案是:一种IC芯片模切装置,包括机座,包括左支撑座、右支撑座、顶板、液压缸、上模板、上剪切模、下剪切模、输送器,所述的左支撑座位于机座顶部中心左端,二者焊接相连,所述的右支撑座位于机座顶部中心右端,二者焊接相连,所述的顶板位于左支撑座和右支撑座顶部中心处,其与左支撑座、右支撑座焊接相连,所述的液压缸位于顶板顶部中心处,二者螺纹相连,所述的上模板位于顶板底板中心处,其与液压缸螺纹相连,所述的上剪切模位于上模板底部中心处,二者螺纹相连,所述的下剪切模位于机座顶部中心处,二者螺纹相连,所述的输送器位于机座顶端内部中心处,二者活动相连。 [0004] To solve the above technical problem, the technical solution of the present invention is: An IC chip die cutting apparatus comprising a base, a support base includes a left and right supporting base, a top plate, a hydraulic cylinder, the template, the shear modulus, lower shear modulus, conveyor, said left base supporting the seat on top of the left center, welding both connected to the right seat support stand top center of the right end, both connected to the welding, the top plate in the left and a support base supporting the top center of the right seat support base with the left and right support base connected to the welding, the hydraulic cylinder at the top center of the roof, is connected to both threads, the template located at the center of the bottom plate a top plate connected to the threaded cylinder, said upper shear modulus at the bottom center of the upper template, both connected to the thread, the shear modulus is lower at the top center of the base, connected to both threads, the conveyor is located the top center of the inner base connected to both activities.

[0005] 进一步,所述的输送器包含了电机、主动轮、从动轮、传输皮带。 [0005] Further, the conveyor comprises a motor driving wheel, a driven wheel, the transmission belt.

[0006] 进一步,所述的电机位于机座背面中心上侧,二者螺纹相连。 [0006] Further, the motor base is located on the back surface side of the center, is connected to both threads.

[0007] 进一步,所述的主动轮位于机架顶端内部中心处,其与机座活动相连,与电机螺纹相连。 [0007] Further, the drive wheel is located at the center of the inside top of the rack, which is connected to base activity, the motor is connected to the thread.

[0008] 进一步,所述的从动轮位于主动轮中心右侧,其与机座活动相连。 [0008] Further, the driven wheel on the right side of the center of the driving wheel, which is connected to the base activity.

[0009] 进一步,所述的传输皮带位于主动轮和从动轮外端,其与主动轮、从动轮活动相连。 [0009] Further, the conveying belt on the outer end of the driving wheel and the driven wheel, which is connected to the driving wheel, the driven wheel activities.

[0010] 进一步,所述的下剪切模顶部中心右侧还设有导柱,其与上模板活动相连,与下剪切模螺纹相连。 [0010] Further, the right side of the top center of the shear modulus is also a guide post, which is connected to the template activity, connected to the lower shear modulus thread.

[0011] 进一步,所述的导柱与上模板连接处还设有导套,其与上模螺纹相连。 [0011] Further, the guide post and the connecting points on the template are also provided with a guide sleeve, which is connected to the upper die threads.

[0012] 与现有技术相比,将包有IC芯片的树脂放置在下剪切模中,通过液压推动上剪切模下降,与下剪切模共同将包有IC芯片的树脂剪切成单件掉落在输送器顶部,再有输送器将单件的IC芯片输送出来,通过人工整理包装,从而提高了生产效率,并且避免了人工去收集,防止意外伤亡事故发生。 [0012] Compared with the prior art, the IC chip package placed on the lower shear modulus of the resin by hydraulically pushing the shear modulus decreased with lower shear modulus packet common IC chip is cut into a single resin drop on top of the conveyor member, and then the IC chip has a single conveyor conveyor element out, through manual collation package, thereby improving the production efficiency, and avoids doing to collect, to prevent accidental casualties.

附图说明 BRIEF DESCRIPTION

[0013] 图1是装置的的剖视图 [0013] FIG. 1 is a cross-sectional view of the apparatus

[0014] 图2是装置的局部视图 [0014] FIG. 2 is a partial view of the device

[0015] 机座I 左支撑座2 [0015] I left support base stand 2

[0016] 右支撑座3 顶板4 [0016] The top plate 3 of the right support base 4

[0017] 液压缸5 上模板6 [0017] Template 6 on the cylinder 5

[0018] 上剪切模7 下剪切模8 Lower shear modulus shear modulus 7 [0018] 8

[0019] 输送器9 导套601 [0019] conveyor guide sleeve 601 9

[0020] 导柱801电机901 [0020] The guide post 801 Motor 901

[0021] 主动轮902从动轮903 [0021] The driven pulley 903 driving wheel 902

[0022] 传送皮带903 [0022] A conveyor belt 903

[0023] 如下具体实施方式将结合上述附图进一步说明。 [0023] The following detailed description will be further described in conjunction with the above-described drawings.

具体实施方式 detailed description

[0024] 在下文中,阐述了多种特定细节,以便提供对构成所描述实施例基础的概念的透彻理解。 [0024] In the following, numerous specific details are set forth in order to provide a thorough understanding of the concepts described embodiments of the basic configuration of embodiment. 然而,对本领域的技术人员来说,很显然所描述的实施例可以在没有这些特定细节中的一些或者全部的情况下来实践。 However, those skilled in the art, it is clear that the described embodiments may be practiced without these specific details in some cases or all be practiced. 在其他情况下,没有具体描述众所周知的处理步骤。 In other instances, well known process steps described specifically.

[0025] 如图1、图2所示,包括机座I,左支撑座2、右支撑座3、顶板4、液压缸5、上模板6、上剪切模7、下剪切模8、输送器9,所述的左支撑座2位于机座I顶部中心左端,二者焊接相连,所述的右支撑座3位于机座I顶部中心右端,二者焊接相连,所述的顶板4位于左支撑座2和右支撑座3顶部中心处,其与左支撑座2、右支撑座3焊接相连,所述的液压缸5位于顶板4顶部中心处,二者螺纹相连,所述的上模板6位于顶板4底板中心处,其与液压缸5螺纹相连,所述的上剪切模7位于上模板6底部中心处,二者螺纹相连,所述的下剪切模8位于机座I顶部中心处,二者螺纹相连,所述的输送器9位于机座I顶端内部中心处,二者活动相连,所述的输送器9包含了电机901、主动轮902、从动轮903、传输皮带904,所述的电机901位于机座I背面中心上侧,二者螺纹相连,所述的主动轮902位于 [0025] As shown in FIG 1, FIG. 2, includes a base I, the support base 2 left and right support base 3, a top plate 4, the hydraulic cylinder 5, the plate 6, 7 on the shear modulus, shear modulus 8, conveyor 9, the supporting base 2 is located in the left stand I top center of the left, both connected to the welding, the supporting base 3 located at the right stand I top center of the right end, both connected to the welding, the top plate 4 is located left support base 2 and the top 3 at the center of the right support seat part 2, 3 are welded support base is connected to the right and the left support base, the hydraulic cylinder 5 located at the top center of the top plate 4, both connected to the thread, the upper template a top plate 6 located in the center of the bottom plate 4, which is connected to the threaded cylinder 5, the shear modulus of the center of the bottom 7 is located on the template 6, both connected to the thread, the shear modulus I of the top stand 8 located at the center, is connected to both threads, the conveyor 9 is located at the internal center to the top I base connected both activities, the conveyor 9 comprises a motor 901 driving wheel 902, a driven gear 903, the transmission belt 904 the motor 901 is located on the center of the back surface side of the chassis I, both connected to the screw, the drive wheel 902 is located 机架I顶端内部中心处,其与机座I活动相连,与电机901螺纹相连,所述的从动轮903位于主动轮902中心右侧,其与机座I活动相连,所述的传输皮带904位于主动轮902和从动轮903外端,其与主动轮902、从动轮903活动相连,所述的下剪切模8顶部中心右侧还设有导柱801,其与上模板6活动相连,与下剪切模8螺纹相连,所述的导柱801与上模板6连接处还设有导套601,其与上模板6螺纹相连,其中机座1、左支撑座2、右支撑座3、顶板4、上模板6是组成该装置的支撑固定机构,导柱801与导套601是防止上剪切模7与下剪切模8合模偏离,该装置是将包有IC芯片的树脂放置在下剪切模8中,通过液压5推动上剪切模7下降,与下剪切8模共同将包有IC芯片的树脂剪切成单件掉落在传送皮带904顶部,通过电机901带动主动轮902旋转,在从动轮903的作用下,传送皮带904转动,将单件的IC芯片 I at the internal center to the top chassis, which is connected to the base I activities, the motor 901 is connected to the thread, the driven wheel 903 to the right of the center of the drive wheel 902, which is connected to the base I activity, said transport belt 904 902 and the driven wheel 903 is located in the outer end of the driving wheel, which is connected with the driven gear 903 activities capstan 902, right at a shear center of the top die 8 is further provided with guide post 801, which is connected to the upper plate 6 activity, connected to the lower shear modulus thread 8, the guide post 801 is connected with the upper plate 6 is also provided at the guide bush 601, which is connected to the threaded upper plate 6, wherein the base 1, the left support base 2, the right support base 3 , a top plate 4, the plate 6 is fixed to a support means constituting the apparatus, the guide post 801 and the guide sleeve 601 to prevent the shear modulus of the shear modulus lower 7 mold 8 offset from, the apparatus is an IC chip package resin 8 placed on the lower shear modulus, shear modulus 7 5 lowered by hydraulic driven, and the lower shearing die 8 together with an IC chip package will be cut as a single piece resin falling on top of the conveyor belt 904, driven by a motor 901 capstan 902 is rotated under the action of the driven wheel 903, conveyor belt 904 is rotated, the IC chip in one piece 传送出去,通过人工整理包装,从而提高了生产效率,并且避免了人工去收集,防止意外伤亡事故发生。 Sent out by manual sorting packaging, resulting in improved production efficiency and avoid artificial to collect, to prevent accidental casualties.

[0026] 本发明不局限于上述具体的实施方式,本领域的普通技术人员从上述构思出发,不经过创造性的劳动,所做出的种种变换,均落在本发明的保护范围之内。 [0026] The present invention is not limited to the specific embodiments, those of ordinary skill in the art from the concepts described above, without creative labor, all the conversion made, are within the scope of the present invention.

Claims (8)

  1. 1.一种IC芯片模切装置,包括机座,其特征在于包括左支撑座、右支撑座、顶板、液压缸、上模板、上剪切模、下剪切模、输送器,所述的左支撑座位于机座顶部中心左端,二者焊接相连,所述的右支撑座位于机座顶部中心右端,二者焊接相连,所述的顶板位于左支撑座和右支撑座顶部中心处,其与左支撑座、右支撑座焊接相连,所述的液压缸位于顶板顶部中心处,二者螺纹相连,所述的上模板位于顶板底板中心处,其与液压缸螺纹相连,所述的上剪切模位于上模板底部中心处,二者螺纹相连,所述的下剪切模位于机座顶部中心处,二者螺纹相连,所述的输送器位于机座顶端内部中心处,二者活动活动相连。 1. An IC chip die cutting apparatus comprising a base, which support base comprising a left and right supporting base, a top plate, a hydraulic cylinder, the template, the shear modulus, shear modulus, the conveyor, the base supporting the seat on the left top of the left center, connected to both welded, supporting the seat on the right top center of the right stand, both connected to the welding, the top plate in the left and right seat supporting the top center of the support base, which supporting seat and the left and right support base connected to the welding, the hydraulic cylinder at the top center of the roof, is connected to both threads, the center of the upper plate the bottom plate a top plate, which is connected to the threaded cylinder, said upper shear die-cut at the center of the template on the bottom, connected to both threaded and said lower shear modulus at the top center of the base, connected to both threaded, located at the top of the conveyor at the internal center stand, both Events connected.
  2. 2.如权利要求1所述的一种IC芯片模切装置,其特征在于所述的输送器包含了电机、主动轮、从动轮、传输皮带。 2. An IC chip die cutting apparatus according to claim 1, characterized in that said conveyor comprises a motor driving wheel, a driven wheel, the transmission belt.
  3. 3.如权利要求2所述的一种IC芯片模切装置,其特征在于所述的电机位于机座背面中心上侧,二者螺纹相连。 An IC chip die cutting apparatus according to claim 2, wherein said motor is positioned on the center side of the rear surface base connected to both threads.
  4. 4.如权利要求3所述的一种IC芯片模切装置,其特征在于所述的主动轮位于机架顶端内部中心处,其与机座活动相连,与电机螺纹相连。 An IC chip of the die cutting apparatus as claimed in claim 3, wherein said capstan located inside the center of the top of the rack, which is connected to base activity, the motor is connected to the thread.
  5. 5.如权利要求4所述的一种IC芯片模切装置,其特征在于所述的从动轮位于主动轮中心右侧,其与机座活动相连。 5. An IC chip die cutting apparatus according to claim 4, characterized in that the driven wheel on the right side of the center of the driving wheel, which is connected to the base activity.
  6. 6.如权利要求5所述的一种IC芯片模切装置,其特征在于所述的传输皮带位于主动轮和从动轮外端,其与主动轮、从动轮活动相连。 An IC chip 5 die cutting apparatus according to claim 6, characterized in that said conveying belt on the outer end of the driving wheel and the driven wheel, which is coupled to the driving wheel, the driven wheel activities.
  7. 7.如权利要求6所述的一种IC芯片模切装置,其特征在于所述的下剪切模顶部中心右侧还设有导柱,其与上模板活动相连,与下剪切模螺纹相连。 7. An IC chip die cutting apparatus according to claim 6, characterized in that the top center of the right side of the shear modulus of the guide post is also provided, which is connected with the template activity and lower shear modulus thread connected.
  8. 8.如权利要求7所述的一种IC芯片模切装置,其特征在于所述的导柱与上模板连接处还设有导套,其与上模螺纹相连。 8. An IC chip die cutting apparatus according to claim 7, wherein said guide post connected to the upper template is also provided with a guide sleeve, which is connected to the upper die threads.
CN 201510004516 2015-01-06 2015-01-06 IC chip die cutting device CN104723402A (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN106560301A (en) * 2016-08-31 2017-04-12 杭州钱江万胜电器制造有限公司 Rim-material-free production device for paper gasket of compressor and using method thereof

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EP0362019A1 (en) * 1988-09-23 1990-04-04 Lectra Systemes Cutting and punching device for sheet materials
US5253559A (en) * 1990-06-26 1993-10-19 U.S. Philips Corp. Device and system for piercing printed circuits
CN201291477Y (en) * 2008-03-21 2009-08-19 王开来 Card dinking machine
CN103659892A (en) * 2012-09-26 2014-03-26 溧水经济开发区南区开发有限公司 Pneumatic perforating machine
CN203697143U (en) * 2014-01-12 2014-07-09 浙江精锐智能卡有限公司 SIM card punching machine
CN203791447U (en) * 2014-04-15 2014-08-27 江苏凯伦铝业有限公司 Long mould punching equipment for hemming aluminum alloy profile

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0362019A1 (en) * 1988-09-23 1990-04-04 Lectra Systemes Cutting and punching device for sheet materials
US5253559A (en) * 1990-06-26 1993-10-19 U.S. Philips Corp. Device and system for piercing printed circuits
CN201291477Y (en) * 2008-03-21 2009-08-19 王开来 Card dinking machine
CN103659892A (en) * 2012-09-26 2014-03-26 溧水经济开发区南区开发有限公司 Pneumatic perforating machine
CN203697143U (en) * 2014-01-12 2014-07-09 浙江精锐智能卡有限公司 SIM card punching machine
CN203791447U (en) * 2014-04-15 2014-08-27 江苏凯伦铝业有限公司 Long mould punching equipment for hemming aluminum alloy profile

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106560301A (en) * 2016-08-31 2017-04-12 杭州钱江万胜电器制造有限公司 Rim-material-free production device for paper gasket of compressor and using method thereof

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